U.S. patent application number 10/260783 was filed with the patent office on 2004-04-01 for elongated heat sink for use in converter assemblies.
Invention is credited to Kasunich, John M., Pfeifer, David W..
Application Number | 20040060692 10/260783 |
Document ID | / |
Family ID | 32029778 |
Filed Date | 2004-04-01 |
United States Patent
Application |
20040060692 |
Kind Code |
A1 |
Pfeifer, David W. ; et
al. |
April 1, 2004 |
ELONGATED HEAT SINK FOR USE IN CONVERTER ASSEMBLIES
Abstract
An apparatus for sinking heat away from a plurality of power
switching devices where each power switching device includes a heat
dissipating surface having a dissipating width dimension and having
a device length dimension perpendicular to the dissipating width
dimension, the apparatus comprising a heat sink member having a
sink length dimension between inlet and outlet ends, forming an
internal channel that extends substantially along the entire sink
length dimension and also forming inlet and outlet ports that open
into the channel at the inlet and outlet ends, respectively, the
sink including first and second oppositely facing surfaces, the
second surface for receiving the heat dissipating surfaces of the
power switching devices, the second surface having a receiving
width dimension that is substantially perpendicular to the sink
length dimension and that is less than twice the device dissipating
width dimension.
Inventors: |
Pfeifer, David W.; (Pepper
Pike, OH) ; Kasunich, John M.; (Mayfield Heights,
OH) |
Correspondence
Address: |
Susan M. Donahue
Rockwell Automation, Inc.
1202 South Second Street
Milwaukee
WI
53204
US
|
Family ID: |
32029778 |
Appl. No.: |
10/260783 |
Filed: |
September 27, 2002 |
Current U.S.
Class: |
361/704 ;
165/908; 363/141 |
Current CPC
Class: |
H02M 7/003 20130101 |
Class at
Publication: |
165/908 ;
363/141 |
International
Class: |
H02M 001/00 |
Claims
What is claimed is:
1. An apparatus for sinking heat away from a plurality of power
switching devices where each power switching device includes a heat
dissipating surface having a dissipating width dimension and having
a device length dimension perpendicular to the dissipating width
dimension, the apparatus comprising: a heat sink member having a
sink length dimension between inlet and outlet ends, forming an
internal channel that extends substantially along the entire sink
length dimension and also forming inlet and outlet ports that open
into the channel at the inlet and outlet ends, respectively, the
sink including first and second oppositely facing surfaces, the
second surface for receiving the heat dissipating surfaces of the
power switching devices, the second surface having a receiving
width dimension that is substantially perpendicular to the sink
length dimension and that is less than twice the device dissipating
width dimension.
2. The apparatus of claim 1 wherein the receiving width dimension
is substantially similar to the dissipating width dimension.
3. The apparatus of claim 2 wherein the receiving width dimension
is defined by the channel.
4. The apparatus of claim 3 wherein each switching device includes
a device mounting surface, the mounting surface including the
device dissipating surface and forming a device width dimension
that is larger than the dissipating width dimension, the
dissipating surface including the portion of the mounting surface
from which heat is dissipated.
5. The apparatus of claim 4 wherein the sink member forms a sink
width dimension that is substantially parallel to and greater than
the receiving width dimension and wherein the sink width dimension
and the device width dimension are substantially similar.
6. The apparatus of claim 5 wherein the sink length dimension is
substantially similar to the combined lengths of the power
switching devices.
7. The apparatus of claim 6 wherein, when the power switching
devices are aligned end to end to form a device row with first and
last devices at either end of the device row, oppositely facing
edges of the dissipating surfaces of the first and last devices
define a dissipating length and wherein a channel length is
substantially similar to the dissipating length.
8. The apparatus of claim 7 further including at least one divider
member formed in the channel and that extends substantially from
the inlet end to the outlet end thereby dividing the channel into
at least first and second substantially parallel channels.
9. The apparatus of claim 8 further including second and third
divider members juxtaposed on opposite sides of the one divider
member and that further divide the first and second channels into
inner and outer fist channels and inner and outer second channels,
respectively, and, wherein, each of the second and third dividers
form openings between the respective inner and outer channels.
10. The apparatus of claim 9 wherein the openings are substantially
equi-spaced along the lengths of the second and third divider
members.
11. The apparatus of claim 8 wherein the divider member is
substantially perpendicular to the second surface.
12. The apparatus of claim 11 wherein the divider member extends to
the inlet end of the channel and the sink member also forms a
manifold chamber between the inlet and the channel, the manifold
chamber opening into the first and second channels through first
and second nozzles, respectively.
13. The apparatus of claim 12 wherein the divider member is
terminated prior to the outlet end so that the first and second
channels come together at the outlet end.
14. The apparatus of claim 5 wherein each device includes first and
second mounting flanges that form portions of the mounting surface
and that are separated by the dissipating surface, each mounting
flange having a flange width dimension and, wherein, the sink
includes a lateral wall member on either side of the channel having
a wall thicknesses that is substantially similar to the flange
width dimensions.
15. The apparatus of claim 14 wherein each mounting flange forms at
least one flange mounting aperture and wherein the lateral walls
form wall mounting apertures that align with the flange apertures
and wherein the apparatus further includes a separate securing
member for each of the flange/wall apertures pairs.
16. The apparatus of claim 1 wherein the inlet and outlet ports
open through the first surface of the sink.
17. The apparatus of claim 1 wherein the sink member includes a
body member and a cover member, the body member forming the second
sink surface, including a first body member surface facing in a
direction opposite the second surface and forming a cavity in the
first surface, the cover member including at least a first cover
surface, one of the cover member and the body member forming the
inlet and one of the cover member and the body member forming the
outlet, the cover member first surface hermetically sealed to the
body member first surface to enclose the cavity and form the sink
channel.
18. A power brick apparatus comprising: a plurality of power
switching devices, each device including a heat dissipating surface
having a dissipating width dimension and having a device length
dimension perpendicular to the dissipating width dimension: and a
heat sink member having a sink length dimension between inlet and
outlet ends, forming an internal channel that extends substantially
along the entire sink length dimension and also forming inlet and
outlet ports that open into the channel at the inlet and outlet
ends, respectively, the sink including first and second oppositely
facing surfaces, the second surface for receiving the heat
dissipating surfaces of the power switching devices, the second
surface having a receiving width dimension that is substantially
perpendicular to the sink length dimension and that is less than
twice the device dissipating width dimension; wherein, the power
switching devices are mounted end to end so that their combined
length extends along the sink length.
19. The apparatus of claim 18 wherein the receiving width dimension
is substantially similar to the dissipating width dimension and is
defined by the channel.
20. The apparatus of claim 19 wherein each switching device
includes a device mounting surface, the mounting surface including
the device dissipating surface and forming a device width dimension
that is larger than the dissipating width dimension, the
dissipating surface including the portion of the mounting surface
from which heat is dissipated.
21. The apparatus of claim 20 wherein the sink member forms a sink
width dimension that is substantially parallel to and greater than
the receiving width dimension and wherein the sink width dimension
and the device width dimension are substantially similar.
22. The apparatus of claim 21 wherein the sink length dimension is
substantially similar to the combined lengths of the power
switching devices.
23. The apparatus of claim 22 further including at least first,
second and third divider members formed in the channel and that
extends substantially from the inlet end to the outlet end thereby
dividing the channel into at least four separate and substantially
parallel channels, the first divider member juxtaposed between the
second and third divider members, each of the second and third
divider members forming a plurality of openings along the divider
members length, the divider members substantially perpendicular to
the second surface.
24. The apparatus of claim 23 wherein the divider member extends to
the inlet end of the channel and the sink member also forms a
manifold chamber between the inlet and the channel, the manifold
chamber opening into the first and second channels through first
and second nozzles, respectively and, wherein, the divider member
is terminated prior to the outlet end so that the first and second
channels come together at the outlet end.
25. The apparatus of claim 18 wherein each device includes first
and second lateral extensions that are separated by the dissipating
surface width dimension and wherein the channel separates lateral
sink walls and wherein the lateral extensions cooperate with the
lateral walls to secure the devices to the sink member.
26. The apparatus of claim 19 wherein each of the devices includes
connector leads that extend to one side of the device and wherein
the devices are mounted to the sink member with all of the leads
extending to one side of the sink member and in a direction
substantially perpendicular to the sink length dimension.
27. A method for sinking heat away from a plurality of power
switching devices where each power switching device includes a heat
dissipating surface having a dissipating width dimension and having
a device length dimension perpendicular to the dissipating width
dimension, the method comprising the steps of: providing a body
member having a sink length dimension between inlet and outlet
ends, having first and second oppositely facing surfaces, the
second surface having a receiving width dimension that is
substantially perpendicular to the sink length dimension and that
is substantially similar to the device dissipating width dimension;
forming a cavity in the first surface of the body member that
extends substantially along the entire sink length dimension;
providing a cover member; forming an inlet in one of the body
member and the cover member; forming an outlet in one of the body
member and the cover member; hermetically sealing the cover member
to the first surface of the body member so that the cover member
and cavity together form a channel and so that the inlet and outlet
open into opposite ends of the channel; and mounting the devices to
the second surface with the dissipating width dimensions
substantially parallel to the receiving width dimension.
28. The method of claim 27 wherein each of the devices includes
connector leads that extend to one side of the device and wherein
the step of mounting includes mounting all of the devices to the
sink member with all of the leads extending to one side of the sink
member and in a direction substantially perpendicular to the sink
length dimension.
29. The method of claim 27 wherein the step of forming the channel
includes forming four substantially parallel channels that are
separated by divider members that are substantially perpendicular
to the second surface the divider members including a first divider
member that is disposed between a second and a third divider member
and providing openings between adjacent channels and through the
second and third divider members.
30. The method of claim 29 step of providing the channels further
includes providing the first divider member so as to extend to the
inlet end of the channel and wherein the method further includes
the step of forming a manifold chamber between the inlet and the
channel, the manifold chamber opening into the first and second
channels through first and second nozzles, respectively.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] Not applicable.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
[0002] Not applicable.
BACKGROUND OF THE INVENTION
[0003] The field of the invention is power converters and more
specifically converter configurations including heat sinks that
reduce the overall space required to accommodate the
configurations.
[0004] It is well known that variable speed drives of the type used
to control industrial electric motors include numerous electronic
components. Among the various electronic components used in typical
variable-speed drives, all generate heat to a varying degree during
operation. Typically, high-power switching devices such as IGBTs,
diodes, SCRs and the like as well as storage devices such as
capacitors are responsible for generating most of the heat in a
variable-speed drive. It is for this reason, therefore, that most
variable-speed drives include a heat sink(s) upon which the power
switching devices are mounted. The heat sink(s) conducts
potentially damaging heat from assembly components.
[0005] Selecting the size and design of a heat sink for a
particular variable speed drive is somewhat of a challenge. First,
a designer must be aware of the overall characteristics of the
motor and drive pair. Second, the designer must understand the
industrial application in which the motor and drive pair will be
used, including the continuous and peak demands that will likely be
placed on the motor and drive by the load. Third, the designer must
accommodate, in the design, certain unexpected conditions that
would deleteriously affect the heat transfer capability of the heat
sink such as unexpectedly high ambient temperatures, physical
damage to the heat sink such as mechanical damage, or a build up of
a debris layer, as examples. Fourth, the heat sink(s) must be
physically dimensioned so as to fit into the space allotted per
customer requirements, cabinet or enclosure size, or the like.
[0006] In the past, air-cooled heat conducting plates were used to
transfer thermal energy from electronic parts to the ambient air.
These were passive heat-transfer devices and were generally formed
of a light-weight aluminum extrusion including a set of fins. As a
general rule, heat transfer effectiveness is based on the
temperature differential between the power devices and the ambient
air temperature. Of course, in order to provide adequate heat
conduction, heat sinks of this type oftentimes are necessarily
large and, therefore, bulky and expensive. If high ambient
conditions exist, the heat sink becomes ineffective or useless as
heat removal cannot be accomplished regardless of the size of the
heat sink. If the variable speed drive was in an enclosed space the
heat removed from the drive would need to be exhausted or
conditioned for recirculation.
[0007] By forcing air over fins defined on the heat-conducting
plate (e.g., an aluminum extrusion), improved cooling efficiency
can be realized. Large blower motors are often used for this
purpose. However, as the fins defined in the aluminum extrusions
become dirty or corroded during use, the heat sinks become less
effective or useless altogether. Blower motors cannot be used in
environments where air cleanliness would clog filtration.
Therefore, air conditioning equipment is often added to internally
circulate and cool the air that is passed over the heat sink
fins.
[0008] Liquid cooled heat sinks or cold plates have also been used
for some applications but with limited success. Generally, a liquid
cooled heat sink includes a series of chambers or channels that are
formed internally within a sink body member that is formed of
material (e.g., copper or aluminum) that readily conducts heat. The
body member includes at least one mounting surface for receiving
heat generating devices. The channels are typically configured so
that at least one channel section is formed adjacent each surface
segment to which a heat generating device is mounted--typical
channel configurations are serpentine. A coolant liquid is pumped
through the channels from one or more inlet ports to one or more
outlet ports to cool the sink member and hence conduct heat away
form the heat generating devices.
[0009] The industry has developed several ways in which to
manufacture liquid cooled heat sinks and, each of the different
ways to manufacture has different costs associated therewith. For
instance, a liquid cooled sink can be constructed by forming a
desired serpentine copper conduit path for liquid flow, placing the
serpentine conduit construct within a sink mold, pouring molten
liquid aluminum into the mold and allowing the molten aluminum to
cool. While this manufacturing process has been used successfully,
liquid molding processes are very difficult to control and the
incidences of imperfect and or non-functioning product have been
relatively high.
[0010] One other sink manufacturing process that has proven useful
includes cutting a at least one channel out of a sink body member,
hermetically sealing (e.g., vacuum brazing) a cover member to the
body member to cover the channel and then forming an inlet and an
outlet that open into opposite ends of the channel. This two part
sealing process is much less expensive than the conduit-molten
process described above.
[0011] When designing any liquid cooled heat sink several factors
have to be considered including heat dissipating effectiveness,
volume required to accommodate a resulting converter, and cost.
With respect to heat dissipation, in the case of a power conversion
assembly, there are typically several different heat generating
devices that are similarly constructed and that operate in a
similar fashion to convert power. For instance, as well known in
the controls arts, an AC to DC rectifier typically includes a
plurality of power switching devices that are arranged to form a
bridge assembly. In the case of a three phase supply and load, the
bridge assembly includes three phases, a separate switching phase
for each of the three supply and load phases. Here, an exemplary
phase may include first and second power switching devices linked
at a common node to an associated supply line where the other
terminals of the first and second switches are linked to positive
and negative DC busses, respectively. A controller is configured to
control all of the three phases of the bridge together to convert
the three phase AC supply voltage to a DC potential across the
positive and negative DC busses.
[0012] In a similar fashion, a three phase inverter assembly
typically includes three separate phases that link positive and
negative DC busses to three load supply lines. In the case of an
inverter, each phase typically includes first and second power
switching devices that are linked in series between the positive
and negative DC busses with the common node between the first and
second inverter switches linked to an associated phase of the load.
Where the supply and load voltages are large, some
rectifier/inverter converter assemblies may include several three
phase bridges linked together thereby reducing the load handling of
each switching device.
[0013] In the case of a rectifier-inverter conversion assembly, a
drive circuit is provided that controls all of the switching
devices together to create desired three phase output voltages to
drive a load linked thereto. In this case, it is imperative that
the switching devices operate in characteristic and substantially
similar ways to simplify what is, by its very nature, an already
complex switching scheme. For this reason, converter designers
typically select switching devices having known operating
characteristics to configure their conversion assemblies.
[0014] Nevertheless, as also well known, most switching devices
have operating characteristics that are, at least in part, affected
by the environments in which the devices operate. Specifically, for
the purposes of the present invention, it should be appreciated
that switching device operating characteristics change as a
function of temperature. For instance, an internal switch
resistance has been known to change as a function of temperature
which in turn affects the voltage drop across the switch. While
each voltage drop change that occurs may seem insignificant,
because rectifier and inverter switches are typically turned on and
off very rapidly, the affect of changing device drop has been shown
to be appreciable.
[0015] The problems associated with voltage drop variance are
compounded where similar switching devices are operated at
different temperatures and is especially acute where control
schemes operate to simultaneously control all three conversion
assembly phases together to generate load voltages. Thus, for
instance, where one switching device is several degrees hotter than
another switching device, the result may be unbalanced phase
voltages and hence imperfect load control (e.g., non-smooth motor
rotation) which increases overall system wear and can cause system
damage over time.
[0016] For this reason, one challenge when designing a heat sink
for use with a converter assembly has been to provide essentially
identical heat dissipating capacity to each converter switching
device so that device temperatures are essentially identical during
system operation. The problem here is that coolant temperature
rises as the coolant absorbs heat along its path through a sink
member so that power switching devices relatively near an inlet
port along a serpentine coolant path are cooled to a greater degree
than switching devices down stream from the inlet port. One
solution that reduces the heat dissipating capacity differential
between similar switching devices has been to provide a heat sink
where the spacing between a cooling liquid inlet and each of the
sink surfaces to which switching devices are mounted is similar.
For instance, where a configuration includes twenty four power
switching devices, instead of mounting the switching devices to the
sink in a pattern that tracks a single serpentine cooling conduit
path, the switching devices may be mounted on sink member mounting
surface to form six rows of four switching devices each where each
of the six rows is fed by a separate one of six liquid coolant
inlet ports--here a manifold may serve each of the six inlet ports
(see generally FIG. 23 in U.S. Pat. No. 6,031,751 (hereinafter "the
'751 patent") entitled "Small Volume Heat Sink/Electronic Assembly"
which issued on Feb. 29, 2000 and which is incorporated herein by
reference). Thus, in this case, coolant from each of the six inlet
ports passes by four separate heat generating devices and device
cooling will be relatively more uniform. This solution to reduce
the device temperature differential will be referred to hereinafter
as a matrix spacing solution.
[0017] One other solution that reduces the heat dissipating
capacity differential between switching devices mounted to a sink
member has been to provide a serpentine path that passes by each
heat generating device more than once so that the overall cooling
affect of devices is similar. For instance, assume twelve switching
devices are mounted to a sink member mounting surface to form two
rows of six devices each and that a single serpentine path is
configured to include a first linear run that passes adjacent the
first row of devices, a first 180 degree turn, a second linear run
that passes adjacent the second row of devices, a second 180 degree
turn, a third linear run that again passes adjacent the second row
of devices, a third 180 degree turn and a fourth linear run that
passes a second time by the first row of devices to an outlet.
[0018] Here, in theory, the first linear run should include the
coolest coolant, the second linear run should include the second
coolest coolant and so on so that the coolant temperatures through
the first and fourth linear runs (i.e., adjacent the devices in the
first row) should average and the coolant temperatures though the
second and third linear runs (i.e., adjacent the devices in the
second row) should also average and the two average temperatures
should be similar (see generally FIG. 2 in the '751 patent). This
solution to reduce the device temperature differential will be
referred to hereinafter as an averaging solution.
[0019] While the averaging solution and the matrix spacing solution
work in theory, in reality, each of these solutions have had some
problems regarding temperature differential. With respect to the
matrix spacing solution, in the example above, the fourth device
along each of the six separate coolant paths is warmer than the
first device along the same path as liquid passing by the first
three devices along the path heats up when heat is absorbed along
the path. Thus, while better than sinks that align devices along a
single serpentine cooling conduit path, the matrix solution still
results in a temperature differential.
[0020] With respect to the averaging solution, it has been
determined that, despite multi-pass designs, at least some
temperature differential still exists between devices spaced at
different locations along the coolant conduit path. In addition, in
some cases, cooling capacity may vary over the heat dissipating
surface of each heat generating device. This intra-device
dissipating differential may occur as a multi pass path necessarily
requires that the coolest pass (i.e., the first pass by a device)
be positioned along one side of a dissipating surface so that
another one or more passes that include relatively warmer coolant
can be positioned along the other side of the dissipating
surface.
[0021] With respect to volume (i.e., the second factor above to
consider when designing a heat sink), as with most electronics
designs, all other things being equal, smaller is typically
considered better. Thus, some prior converter configurations have
provided sink members that either facilitate stacking of relatively
short devices adjacent elongated devices (see FIG. 19 in the '751
patent) or, in the alternative, aligning similar dimensions of
different devices (see FIG. 13 in the '751 patent).
[0022] For instance, the '751 patent recognizes that, in addition
to power switching devices, converter configuration capacitors also
often generate excessive heat that should be dissipated to ensure
proper operation. The '751 patent also recognizes that capacitors
typically have a length dimension perpendicular to their heat
dissipating surface that is much longer than the thickness
dimensions of typical switching devices perpendicular to the device
dissipating surfaces and that the switching devices typically have
a length dimension that is similar to the capacitor length
dimension. In this case, in one embodiment, the '751 patent
recognizes that overall converter configuration size can be reduced
by providing an L shaped sink member having two legs that form a
90.degree. angle, mounting the capacitors to an inside surface of
one of the legs and within the space defined by the two leg members
and mounting the switching devices to the outside surface of the
other of the leg members thereby aligning the similar capacitor and
device length dimensions.
[0023] With respect to cost, unfortunately, where an L shaped heat
sink member or, for that matter, where a sink member having
sections that reside along other than a single plane is required to
stack or align capacitors with switching devices, the relatively
inexpensive two part sealing process described above becomes much
more difficult to use. This is because the two part sealing process
generally includes vacuum sealing a flat cover member over a
channel forming body member, When the channel must reside in more
than one plane and requires a more complex cover member, tolerances
required to provide a suitable cover member would be extremely
difficult to meet and the sealing process would be difficult to
perform effectively.
[0024] Thus, where the sink member must reside in two or more
planes to facilitate stacking and/or aligning, the more expensive
molten-conduit process would likely be employed where the conduit
is formed into the desired channel shape and molten aluminum or the
like is poured into a mold there around. For this reason prior
stacking and aligning configurations have proven to be relatively
expensive to manufacture and often are not suitable given cost
constraints.
[0025] Also, with respect to cost, often the last converter design
consideration is how system components will be electrically linked
together to form a converter topology. One particularly
advantageous and robust type of linking assembly is referred to
generally as a laminated bus bar. As its label implies, a laminated
bus bar typically includes a plurality of metallic sheets of
laminate that are layered together with insulators between adjacent
laminate sheets. Vias are formed within the laminated assembly
where links are to be made to capacitor and switching device
terminals. The vias automatically link the devices and capacitors
up in a desired fashion to provide an intended converter topology
(e.g., rectifier, inverter, rectifier-inverter, etc.).
[0026] Laminated bus bar cost is generally a function of the amount
of material required to construct the bus, the number of laminate
layers required to support a configuration and the overall
complexity of the required laminate member where minimal material,
minimal layers and minimal contours (i.e., bends in the laminates)
are all advantageous. Unfortunately, providing a configuration that
uses minimal laminate material, requires minimal layering and
restricts the laminate to a single plane is extremely difficult
given the sink member configurations required to minimize overall
configuration size and provide essentially uniform heat dissipating
capacity to all switching devices mounted to the sink. For example,
where devices are arranged in rows and columns to provide similar
distances between channel inlets and devices down stream therefrom,
typically a large number of laminate layers and a correspondingly
complex labyrinth of vias are required to link components together.
As another instance, where switching device lengths are aligned
with similarly dimensioned capacitor lengths the lamination bus
typically requires one or, more often, several bends to accommodate
connection terminals that reside in disparate planes. In either of
these two cases (i.e., many layers or several laminate bends) the
amount of material required to configure a laminated bus bar can be
excessive and hence unsuitable for certain applications.
[0027] Yet one other cost consideration related to converter
configurations has to do with component versatility or the ability
to use converter components in more than one converter
configuration. Component versatility is particularly important with
respect to the more expensive component types such as, for example,
the heat sink assembly, the laminated bus bar, etc. In this regard,
overall system costs can be reduced by designing sinks and
laminated bus bars that can be used with various device and
capacitor types. For instance, assume that a first converter
configuration includes a first type of switching device, a first
type of capacitor, a first type of sink member and a first type of
laminate bar. Also assume that the sink, devices and a capacitors
are dimensioned such that when the capacitors and devices are
mounted to the sink, the capacitors connection terminals are on the
same plane as the device connection terminals. Here, the first
laminate bus bar type can be planar and hence relatively.
[0028] Next assume that a designer wants to swap out a second
capacitor type for the first type in the configuration where the
second capacitor type has a thickness between its dissipating
surface and its connection terminals that is different than a
similarly measures thickness of the first capacitor type. In this
case, when the capacitors are swapped, the capacitor and device
terminals will no longer reside within the same plane and a
different, perhaps custom designed, laminate will be required to
accommodate the change. In the alternative, the sink design may be
altered to accommodate the change in device and capacitor terminal
planes although this solution would be relatively expensive.
Similar problems occur when different switching devices are swapped
into configurations.
[0029] Thus, it would be advantageous to have a heat sink assembly
that is relatively inexpensive to manufacture and yet provides
substantially similar heat dissipating capacity to all devices
mounted thereto. In addition, it would be advantageous if a sink
assembly of the above kind could be used with a simplified laminate
design and be used to configure relatively compact converter
assemblies. Moreover, it would be advantageous if the sink assembly
could be versatile and hence used with other converter components
that have many different dimensions.
BRIEF SUMMARY OF THE INVENTION
[0030] It has been recognized that relatively compact and
inexpensive converter configurations can be configured by using an
elongated liquid cooled heat sink to cool power switching devices.
More specifically, it has been recognized that, where switching
devices are mounted in a single row to a sink member mounting
surface, the sink can be used to configure minimal volume converter
configurations. In at least one embodiment of the invention, the
sink mounting surface has a width dimension that is substantially
similar to a width dimension of switching devices to be mounted
thereto with the device width dimensions aligned with the mounting
surface width dimension. This single row limitation has several
configuration advantages described below.
[0031] It has also been recognized that, with certain types of
refrigerant, the cooling capacity differential along a cooling
channel appears to be exacerbated along the channel length. For
instance, the cooling capacity differential appears to be
relatively pronounced in the case of two phase refrigerants such as
R-134a and R-123. As the label implies, two phase refrigerants
change from a liquid to a gas when heat is absorbed and hence,
generally, absorb a greater amount of heat, due to the endothermic
nature of the phase change, than conventional single-phase liquid
refrigerants such as water hence two phase refrigerants are
generally preferred in high efficiency heat sinks.
[0032] Moreover, it has been recognized that, unfortunately, as
two-phase refrigerants absorb heat and change phase from liquid to
gas, vapor bubbles are formed within the liquid that accumulate on
the internal surfaces of the heat sink and form gas pockets. The
gas pockets on the surface of the channel block refrigerant from
contacting the channel surface and hinder device heat absorption by
the refrigerant. Thus, the channel surfaces on which gas pockets
form end up becoming hot spots on the channel surfaces and the
temperatures of devices attached adjacent thereto rise.
[0033] Because the vapor bubbles are formed by heat absorption and
because coolant relatively further down stream from an inlet is
warmer than coolant more proximate the inlet, relatively more vapor
bubbles are formed down stream from the inlet than proximate the
inlet thereby causing more gas pockets to form down stream which
increases the temperature differential along the channel length.
Thus, it has been determined that, while coolant temperature
accounts for some of the temperature differential along a coolant
channel length, much of the temperature differential is actually
due to different amounts of gas accumulating along different
sections of the channel--the gas having an insulating effect
between the channel surfaces and the coolant passing thereby. Based
on these realizations it should be appreciated that the temperature
differential problem is exacerbated where sink channels are
extended.
[0034] According to several embodiments of the invention,
protuberances of a character, quantity and size that increase
turbulence within sink channels to a point where the turbulence
either prohibits gas pockets from forming on the channel surfaces
or dislodges or breaks up gas pockets that form on the channel
surfaces, are provided on at least one of the channel surfaces. It
has been found that when such protuberances are provided within a
channel, the channel can have an extended length without causing
excessive temperature differentials there along. More specifically,
it has been determined that the channel length can, in at least one
embodiment, extend substantially along an entire sink length where
the sink, as indicated above, has a length to accommodate a single
row of switching devices. For instance, where a converter
configuration includes twenty four switching devices, the twenty
four devices can be arranged in a single row along the sink member
mounting surface where the channel extends along substantially the
entire sink length from an inlet to an outlet.
[0035] It has also been determine that, in at least some
embodiments of the invention, the sink member can be juxtaposed so
that the channel inlet is below the channel outlet and, more
specifically, so that the channel inlet is directly vertically
below the channel outlet. Here, dislodged or broken up gas pockets,
being lighter than the refrigerant, are aided by buoyancy in their
movement toward the outlet at the top of the sink channel.
[0036] By providing an elongated sink-device assembly including
devices mounted in a single row to an elongated sink member,
overall converter cost can be reduced. In this regard, the single
channel sink member can be manufactured using the two piece sealing
method described above where the channel is bore out of a body
member, a cover member is hermetically sealed over the channel and
inlet and outlet ports that open into the channel are formed.
[0037] In addition, cost is reduced with the inventive elongated
sink-device assembly as a simplified laminated bus bar can be used
with the sink-device assembly. In this regard, where capacitors are
juxtaposed to one side of the switching devices and with capacitor
terminals and device terminals positioned within a common
connection plane, the distances between capacitor terminals and the
device terminals that the capacitor terminals are to be linked to
are reduced appreciably so that less material is required to make
terminal connections. Moreover, because capacitor terminals and the
device terminals to which the capacitor terminals are to be linked
may be positioned proximate each other, none of the laminates have
to pass over other devices disposed intermediate the connecting
terminals and therefore simpler laminate and associated via designs
can be employed that include relatively small numbers (e.g., 3) of
laminate layers.
[0038] Consistent with the above, at least some embodiments of the
invention include an apparatus for sinking heat away from a
plurality of power switching devices where each power switching
device includes a heat dissipating surface having a dissipating
width dimension and having a device length dimension perpendicular
to the dissipating width dimension, the apparatus comprising a heat
sink member having a sink length dimension between inlet and outlet
ends, forming an internal channel that extends substantially along
the entire sink length dimension and also forming inlet and outlet
ports that open into the channel at the inlet and outlet ends,
respectively, the sink including first and second oppositely facing
surfaces, the second surface for receiving the heat dissipating
surfaces of the power switching devices, the second surface having
a receiving width dimension that is substantially perpendicular to
the sink length dimension and that is less than twice the device
dissipating width dimension.
[0039] In some embodiments the receiving width dimension is
substantially similar to the dissipating width dimension. In some
embodiments the receiving width dimension is defined by the
channel. Each switching device includes a device mounting surface.
The mounting surface may include the device dissipating surface and
may form a device width dimension that is larger than the
dissipating width dimension, the dissipating surface may include
the portion of the mounting surface from which heat is
dissipated.
[0040] More specifically, the sink member may form a sink width
dimension that is substantially parallel to and greater than the
receiving width dimension and wherein the sink width dimension and
the device width dimension are substantially similar. The sink
length dimension may be substantially similar to the combined
lengths of the power switching devices.
[0041] When the power switching devices are aligned end to end to
form a device row with first and last devices at either end of the
device row, oppositely facing edges of the dissipating surfaces of
the first and last devices may define a dissipating length and
channel length may be substantially similar to the dissipating
length. Some embodiments may further include at least one divider
member formed in the channel and that extends substantially from
the inlet end to the outlet end thereby dividing the channel into
at least first and second substantially parallel channels.
[0042] At least some embodiments further include second and third
divider members juxtaposed on opposite sides of the one divider
member and that further divide the first and second channels into
inner and outer fist channels and inner and outer second channels,
respectively, each of the second and third dividers forming
openings between the respective inner and outer channels. Here, the
openings may be substantially equi-spaced along the lengths of the
second and third divider members. In addition, the divider member
may be substantially perpendicular to the second surface.
[0043] In some embodiments the divider member extends to the inlet
end of the channel and the sink member also forms a manifold
chamber between the inlet and the channel, the manifold chamber
opening into the first and second channels through first and second
nozzles, respectively. The divider member may terminated prior to
the outlet end so that the first and second channels come together
at the outlet end.
[0044] Each device includes first and second mounting flanges that
form portions of the mounting surface and that are separated by the
dissipating surface, each mounting flange having a flange width
dimension. Here, the sink may include a lateral wall member on
either side of the channel having a wall thicknesses that is
substantially similar to the flange width dimensions. Also, here
each mounting flange may form at least one flange mounting aperture
and wherein the lateral walls form wall mounting apertures that
align with the flange apertures and the apparatus may further
include a separate securing member for each of the flange/wall
aperture pairs.
[0045] In some embodiments the sink member includes a body member
and a cover member, the body member forming the second sink
surface, including a first body member surface facing in a
direction opposite the second surface and forming a cavity in the
first surface, the cover member including at least a first cover
surface, one of the cover member and the body member forming the
inlet and one of the cover member and the body member forming the
outlet, the cover member first surface hermetically sealed to the
body member first surface to enclose the cavity and form the sink
channel.
[0046] Some inventive embodiments include a power brick apparatus
comprising a plurality of power switching devices, each device
including a heat dissipating surface having a dissipating width
dimension and having a device length dimension perpendicular to the
dissipating width dimension and a heat sink member having a sink
length dimension between inlet and outlet ends, forming an internal
channel that extends substantially along the entire sink length
dimension and also forming inlet and outlet ports that open into
the channel at the inlet and outlet ends, respectively, the sink
including first and second oppositely facing surfaces, the second
surface for receiving the heat dissipating surfaces of the power
switching devices, the second surface having a receiving width
dimension that is substantially perpendicular to the sink length
dimension and that is less than twice the device dissipating width
dimension, wherein, the power switching devices are mounted end to
end so that their combined length extends along the sink
length.
[0047] In addition, several embodiments of the invention include a
method for sinking heat away from a plurality of power switching
devices where each power switching device includes a heat
dissipating surface having a dissipating width dimension and having
a device length dimension perpendicular to the dissipating width
dimension, the method comprising the steps of providing a body
member having a sink length dimension between inlet and outlet
ends, having first and second oppositely facing surfaces, the
second surface having a receiving width dimension that is
substantially perpendicular to the sink length dimension and that
is substantially similar to the device dissipating width dimension,
forming a cavity in the first surface of the body member that
extends substantially along the entire sink length dimension,
providing a cover member, forming an inlet in one of the body
member and the cover member, forming an outlet in one of the body
member and the cover member, hermetically sealing the cover member
to the first surface of the body member so that the cover member
and cavity together form a channel and so that the inlet and outlet
open into opposite ends of the channel and mounting the devices to
the second surface with the dissipating width dimensions
substantially parallel to the receiving width dimension.
[0048] Here, each of the devices may include connector leads that
extend to one side of the device and the step of mounting may
include mounting all of the devices to the sink member with all of
the leads extending to one side of the sink member and in a
direction substantially perpendicular to the sink length dimension.
In addition, in some embodiments, the step of forming the channel
includes forming four substantially parallel channels that are
separated by divider members that are substantially perpendicular
to the second surface the divider members including a first divider
member that is disposed between a second and a third divider member
and providing openings between adjacent channels and through the
second and third divider members.
[0049] In some embodiments the step of providing the channels
further includes providing the first divider member so as to extend
to the inlet end of the channel and wherein the method further
includes the step of forming a manifold chamber between the inlet
and the channel, the manifold chamber opening into the first and
second channels through first and second nozzles, respectively.
[0050] These and other objects, advantages and aspects of the
invention will become apparent from the following description. In
the description, reference is made to the accompanying drawings
which form a part hereof, and in which there is shown a preferred
embodiment of the invention. Such embodiment does not necessarily
represent the full scope of the invention and reference is made
therefore, to the claims herein for interpreting the scope of the
invention.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0051] FIG. 1a is a schematic diagram of a rectifier configuration
and corresponding controller while FIG. 1b is a schematic diagram
of an inverter configuration;
[0052] FIG. 2 is an exploded perspective view of a converter
assembly according to one embodiment of the present invention;
[0053] FIG. 3 is an exploded perspective view of the heat sink
member and switch packages of FIG. 2;
[0054] FIG. 4 is a side plan view of an assembled configuration
consistent with FIG. 2;
[0055] FIG. 5 is a bottom plan view of the conversion configuration
of FIG. 4;
[0056] FIG. 6 is a plan view of the body member of the heat sink
member of FIG. 3 and, in particular, showing the surface of the
body member in which a coolant channel is formed;
[0057] FIG. 7 is similar to FIG. 6, albeit illustrating a second
embodiment of the body member;
[0058] FIG. 8 is similar to FIG. 6, albeit illustrating yet one
other embodiment of the body member; and
[0059] FIG. 9 is a flow chart according to one aspect of the
present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0060] Referring now to the drawings where in like numerals
correspond to similar elements throughout the several views and,
more specifically, referring to FIGS. 1a and 1b, the present
invention will be described in the context of exemplary motor
control system 10 including a rectifier assembly generally
illustrated in FIG. 1a which feeds an inverter assembly generally
illustrated in FIG. 1b where each of the rectifier and inverter are
controlled by a controller 22. As known in the controls industry,
rectifier (FIG. 1a) receives three-phase AC voltage on input lines
12, 14 and 16 and converts that three-phase voltage to a DC
potential across positive and negative DC buses 18 and 20,
respectively. The DC buses 18 and 20 generally feed the inverter
configuration (see again FIG. 1b ) which converts the DC potential
to three-phase AC voltage waveforms that are provided to a
three-phase load via first, second and third inverter output lines
24, 26 and 28, respectively.
[0061] The rectifier assembly includes twelve separate switching
devices identified by numerals 30-41. The switching devices 30-41
are arranged between the positive and negative DC buses 18 and 20,
respectively, to provide six separate rectifier legs. Each
rectifier leg includes two series connected switching devices that
traverses the distance between the positive and negative DC buses
18 and 20, respectively. For example, a first rectifier leg
includes switches 30 and 36 that are in series between positive bus
18 and negative bus 20, a second rectifier leg includes switches 31
and 37 that are series connected between buses 18 and 20, a third
rectifier leg includes switches 32 and 38 that are series connected
between buses 18 and 20, and so on. The nodes between switches in
each rectifier leg are referred to as common nodes. One common node
between switches 32 and 38 is identified by numeral 46.
[0062] Each of input lines 12, 14 and 16 is separately linked to
two different common nodes. For example, as illustrated, line 14 is
linked to common node 46 between switches 32 and 38 and is also
linked to the common node (not numbered) between switches 33 and
39. In a similar fashion, input line 12 is linked to the common
node between switches 34 and 40 and also to the common node between
switches 35 and 41 while line 16 is linked to the common node
between switches 30 and 36 and to the common node between switches
31 and 37. In FIG. 1a (and also FIG. 1b described below) switch
emitters, collectors and gates are identified via E, C and G
labels, respectively, with the collectors and emitters of switches
30 and 36 qualified by "1" and "2" sub-labels (e.g., E1, E2, C1,
C2), to distinguish those emitters and collectors for additional
explanation below.
[0063] A control bus 48 which represents a plurality of different
control lines links controller 22 separately to each one of the
rectifier switches 30-41 for independent control. Controller 22
controls when each of the switches 30-41 turns on and when each of
the switches 30-41 turns off. Control schemes that may be used by
controller 22 to convert the three-phase voltages on lines 12, 14
and 16 to a DC potential across DC buses 18 and 20 are well known
in the conversion art and therefore will not be described herein
detail. Rectifier legs that have their common nodes (e.g., 46)
linked to the same input line are controlled in an identical
fashion by controller 22. For example, referring still to FIG. 1a ,
each of switches 32 and 33 would be turned on and turned off at the
same time by controller 22 and each of switches 38 and 39 would be
turned on and turned off at the same times by controller 22 as the
corresponding rectifier legs have the same common node 46 linked to
line 14.
[0064] In addition to the components described above, the rectifier
configuration illustrated in FIG. 1a also includes capacitors
between DC buses 18 and 20 which are collectively identified by
numeral 50. Although only two capacitors are illustrated, it should
be appreciated that a larger number of capacitors would typically
be employed in any type of rectifier configuration. Capacitors 50
reduce the ripple in the potential between lines 18 and 20 as well
known in the art.
[0065] Referring now to FIG. 1b , the inverter configuration
illustrated, like the rectifier configuration of FIG. 1a, includes
twelve separate switching devices identified by numerals 61-72. The
switching devices 61-72 are arranged to form six separate inverter
legs. Each inverter leg includes a pair of the switching devices
61-72 that is series arranged between the positive DC bus 18 and
the negative DC bus 20. For example, a first inverter leg includes
switches 61 and 67 series arranged between buses 18 and 20, a
second inverter leg includes switches 62 and 68 series arranged
between buses 18 and 20, a third leg includes switches 63 and 69
series arranged between buses 18 and 20, and so on.
[0066] Common nodes between inverter leg switch pairs are referred
to hereinafter as common nodes. In FIG. 1b , an exemplary common
node between switches 61 and 67 is identified by numeral 80. In the
illustrated embodiment, each output line 24, 26 and 28 is linked to
two separate inverter leg common nodes (e.g., 80). For example,
output line 28 is linked to common node 80 between switches 61 and
67 and is also linked to the common node (not illustrated) between
switches 62 and 68. Similarly, output line 26 is linked to the
common node between switches 63 and 69 and also to the common node
between switches 64 and 70 while output line 24 is linked to the
common node between switches 65 and 71 and is also linked to the
common node between switches 66 and 72.
[0067] The control bus 48 linked to controller 22 is also linked
separate to each of the inverter switches 61-72 to independently
control the turn on and turn off times of those switches. As in the
case of the rectifier switches of FIG. 1a , controller 22 controls
the switches of the inverter legs that have common nodes linked to
the same output line in an identical fashion. To this end,
referring still to FIG. 1b, because the common nodes (e.g., 80)
corresponding to the first inverter leg including switches 61 and
67 and the second inverter leg including switches 62 and 68 are
both connected to output line 28, the first and second inverter
legs are controlled in a similar fashion so that each of switches
61 and 62 is turned on and turned off at the same times and each of
switches 67 and 68 are turned on and off at the same times.
[0068] Referring to FIGS. 1a and 1b , the rectifier-inverter
configuration includes commonly controlled switches so that the
configuration can handle relatively high currents that may
otherwise destroy the types of devices employed to configure the
converters. In this manner relatively less expensive switches can
be used to construct the converter assembly. The switches 30-41
used to configure the rectifier are typically identical and the
switches 61-72 used to configure the inverter are typically
identical. Depending on the configuration design, switches 30-41
may or may not be identical to switches 61-72.
[0069] Referring still to FIGS. 1a and 1b , switch manufacturers
often provide power switching devices in prepackaged modules
suitable to construct inverters and rectifiers. To this end, often,
a complete 6-switch bridge will be provided as a separate and
unique switching power package. Hereinafter it will be assumed that
the 24 switches that comprise the rectifier and inverter in FIGS.
1a and 1b are provided in four separate 6-switch bridge packets
where the first switching package includes switches 30, 31, 32, 36,
37 and 38, the second switch package includes switches 33, 34, 35,
39, 40 and 41, the third switch package includes switches 61, 62,
63, 67, 68 and 69 and the fourth switch package includes switches
64, 65, 66, 70, 71 and 72. Unless indicated otherwise, hereinafter,
the first, second, third and fourth switch packages will be
identified by numerals 90, 92, 94 and 96, respectively. Exemplary
switch packets 90, 92, 94 and 96 are illustrated in FIG. 2 and are
described in greater detail below.
[0070] Referring now to FIG. 2, an exploded perspective view of an
exemplary rectifier/inverter converter assembly 100 is illustrated.
Configuration 100 includes a heat sink member 102, the
four-switching modules 90, 92, 94 and 96 briefly described above, a
bracket member 104, a plurality of capacitors collectively
identified by numeral 50, a laminated bus bar 106 and a plurality
of input and output bus bars identified by numerals 12', 14', 16',
28', 26', and 24'.
[0071] Each of switch packages 90, 92, 94 and 96 is similarly
constructed and therefore, in the interest of simplifying this
explanation, unless indicated otherwise, only switch package 90
will be described here in detail. Referring also to FIGS. 3 and 5,
package 90 has a generally rectilinear shape having a length
dimension L3, a width dimension W1 and a thickness dimension (not
separately labeled). Although not illustrated in any of the
drawings, device package 90 is characterized by a device thickness
dimension that will be referred to herein by label T1 that is
formed between the mounting or dissipating surface 122 (see FIG. 3)
of the device and a connection plane defined by the top surfaces of
the emitter and capacitor connection terminals that extend from the
package housing. Package 90 has a first device or first linking
edge 130 and a second device or second linking edge 132 that face
in opposite directions and are separated by device width W1 as
illustrated.
[0072] Referring still to FIG. 1a and also to FIG. 2, package 90
includes switching devices 30, 31, 32, 36, 37 and 38 that are
arranged in a single row relationship where the emitters and
collectors for each one of the switching devices extend from
opposite side of package 90 and are generally separated by the
device width W1. For example, the emitter E1 and collector C1
extend from opposite sides of package 90 while emitter E2 and
collector C2 for switch 36 extend in opposite directions. Adjacent
switches within package 90 have their emitters and collectors
extending in different directions. For example, referring to FIG.
1a and FIG. 2, switch 36 in FIG. 1a has its emitter E2 and its
collector C2 extending in directions opposite those of emitter E1
and collector C1 of the first switch 30 adjacent thereto in the
package 90. Referring still to FIG. 3, package 90 is designed so
that all of the emitter and collector terminals extend from the
package housing within a single connection plane.
[0073] Hereinafter, unless indicated otherwise, switching device
connection terminals that are linked to any of bus bars 12', 14',
16', 24', 26' or 28' will be referred to as inter-converter
terminals because those terminals are connected through their
respective bus bars to components outside the converter
configuration. Similarly, any device package terminals that are
linked to laminated bus bar 106 will be referred to hereinafter
generally as intra-converter terminals as those terminals are
linked to other components within the converter assembly.
[0074] As illustrated and described hereinafter, all of the
inter-converter terminals extend from one side of package 90 while
all of the intra-converter terminals extend from the opposite side
of package 90 after the configuration in FIGS. 2 and 4 is
assembled. In addition, after assembly, all of the intra-converter
terminals for all of packages 90, 92, 94 and 96 extend in the same
direction and form a connection line while all of the
inter-converter terminals for packages 90, 902, 904 and 96 extend
in the opposite direction and form a second connection line (see
alignment generally in FIG. 2). The first and second connection
lines form linking edges of the devices in the packages.
[0075] Control ports are provided on a top surface of package 90 to
facilitate linking of control bus 48 to the devices provided within
package 90. An exemplary control port in FIG. 2 is identified by
numeral 120.
[0076] Package 90 has an undersurface 122 that is in thermal
contact with the components inside the package housing that
generate heat. Package 90 is designed so that surface 122 is
substantially flat and can make substantially full contact with a
heat sink surface when mounted thereto. It should be appreciated
that, typically, only a portion of surface 122 may generate a
relatively large percentage of the total amount of heat generated
by the package and that the primary heat generating surface will
likely be the central portion of surface 122. A heat generating
segment 124 or dissipating surface of package 92 is illustrated and
includes a space that is framed by an outer space 126 that
surrounds the heat generating space 124. Space 124 generally
corresponds to a space that is in direct contact with the package
90 components that conduct current and hence generate heat. Space
124 has a dissipating surface width dimension W2 associated
therewith.
[0077] As best in seen in FIGS. 2 and 3, each package 90 includes a
plurality of small apertures, two of which are identified by number
128, provided through the outer space 126 that frames the heat
generating segment 124 (e.g., see device 92) as illustrated.
Apertures 128 are provided to facilitate mounting packages 90, 92,
94 and 96 to sink member 102.
[0078] Referring still to FIG. 2, bus bars 12', 14', 16,' 28!, 26'
and 24' are to be linked to input lines 12, 14, 16 and output lines
28, 26 and 24 in FIGS. 1a and 1b , respectively. The linking
relationship between bus bars and associated lines is highlighted
by the bus bars being labeled with numbers that are identical to
the line numbers to which they connect followed by a "'"
indicator.
[0079] Each of input and output bus bars 12', 14', 16', 24', 26'
and 28' are simply steel bars that either have an "L" shape or a
"T" shape. Each bar 12', 14', 16', 24', 26' and 28' is designed to
link input or output lines to a subset of four of the
inter-converter terminals. For example, referring to FIGS. 1a and
2, L-shaped bus bar 16' is constructed and dimensioned so as to
link together each of the emitter E1 for switch 30, the collector
C2 for switch 36, the emitter for switch 31 and the collector for
switch 37 and, to this end, includes four separate apertures for
receiving some type of mechanical securing component (e.g., a
bolt), a separate aperture corresponding to each one the emitters
and collectors to be connect by bar 16'. Each of the other bus bars
12', 14', 24', 26' and 28' has a construction similar to bus bar
16' and therefore, in the interest of simplifying this explanation,
the other bars will not be described here in detail. It should
suffice to say that the bus bars link emitters and collectors among
the switch packages 90, 92, 94 and 96 in a manner that is
consistent with the schematics illustrated in FIGS. 1a and 1b.
[0080] Referring once again to FIG. 3 and also to FIG. 4, heat sink
member 102 is an elongated and, in the illustrated embodiment,
substantially rectilinear metallic (e.g., aluminum, copper, etc.)
member that extends from a first end 144 to a second end 146, has
first and second lateral surfaces 148 and 150, respectively, that
face in opposite directions and extend along the entire length
between ends 144 and 146 and also includes a first or first
mounting surface 140 and a second oppositely facing mounting
surface 142. As best illustrated in FIG. 2 (and also illustrated in
FIG. 6), mounting surface 140 has a width dimension W3 that
separates the lateral surfaces 148 and 150, respectively and has a
length dimension L5. Mounting surface 140 and lateral surfaces 148
and 150 form first and second lateral edges 149 and 151,
respectively. In at least one embodiment of the present invention,
sink width W3 is substantially similar to the device package width
W1 so that, as illustrated in FIG. 2, device packages 90, 92, 94
and 96 are mounted in a side-by-side single row fashion to be
accommodated on mounting surface 140.
[0081] As best seen in FIG. 3, in at least one embodiment, sink
member 102 includes two separate components that are secured
together. The two components including a body member 160 and a
cover member 162. Referring also to FIG. 5, body member 160 has
thickness dimension T2 which is generally greater than the
thickness dimension (not separately identified) of member 162.
Together, body member 160 and cover member 162 have a thickness
dimension T3.
[0082] As illustrated in FIGS. 3 and 6, body member 160 includes a
second surface 164 opposite mounting surface 140 and forms a cavity
166 therein which extends substantially along the length of body
member 160 from the first end 144 of the sink member to the second
end 146. Cavity 166 has a cavity or channel depth Dc and forms a
cavity or channel surface 69. In the illustrated embodiment, cavity
166 stops short of each of the ends 140 and 146, has a cavity
length dimension L4 and has a cavity width or receiving dimension
W4. Channel walls are provided on opposite sides of cavity 166 that
have a thickness that is similar to the width dimension of the
framing (i.e., the mounting flange) portion 126 of device surface
122 (see FIG. 3). The cavity width dimension W4, in at least some
embodiments, is similar to the width dimension W2 of the primary
heat generating portion or segment 124 of the package dissipating
surface 122.
[0083] Cavity length dimension L4, in some embodiments, is
substantially similar to a dimension formed by the oppositely
facing edges of the dissipating surfaces of the device packages at
the ends of the device row attached to the sink member. This
dimension will be slightly smaller than the combined lengths (e.g.,
L3) of the device packages 90, 92, 94 and 96 in most cases. When
cavity 160 is so dimensioned, a relatively small sink assembly is
constructed which still provides effective cooling to devices
attached thereto.
[0084] Referring still to FIGS. 3 and 6, within cavity 166, body
member 160 includes three separate cavity dividing members
including a central or first dividing member 180 and second and
third lateral dividing members collectively identified by numeral
182. As its label implies, central dividing member 180 is
positioned centrally within cavity 166 and generally divides the
cavity into two separate channels. Central dividing member 180, in
the illustrated embodiment, extends such that its distal end is
flush with surface 164 of body member 160. In addition, central
dividing member 180 extends all the way to a first end 184 of
cavity 166 but stops short of a second end 186 of the cavity, the
second end 186 being opposite first end 184.
[0085] Each of the second and third dividing members 182 is
positioned on a different side of central member 180 and each stops
short of both the first cavity end 184 and the second cavity end
186. In addition, each of dividing members 182 forms a plurality of
openings so that liquid flowing on either side of the member can
pass to the opposite side of the member. Exemplary openings are
identified by numeral 190 in FIG. 3. Like central member 180, in
the illustrated embodiment, each of the second and third lateral
members 182 extends such that its distal end is flush with surface
164 of body member 160.
[0086] With openings 190 formed in each of dividing members 182,
what remains of members 182 includes protuberances 290 that
essentially break up the flow of coolant through the two channels
formed within the cavity 166 as described in greater detail below.
In the illustrated embodiment the protuberances 290 are essentially
equi-spaced along the channel lengths.
[0087] At the first end 144 of the sink member, in the illustrated
embodiment, body member 160 forms an inlet or receiving chamber 192
and first and second nozzle passageways 194 and 196, respectively.
Inlet chamber 192 is formed between end 144 and cavity 166 and is
connected to cavity 166 on one side of central member 180 by first
nozzle passageway 194 and is connected to cavity 166 on the other
side of central dividing member 180 by second nozzle passageway
196. Inlet chamber 192 has a relatively large cross-sectional area
when compared to either of nozzle passageways 194 and 196 so that
inlet chamber 192 can act as a reservoir for providing liquid under
pressure to cavity 166 through the nozzle passageways 194 and 196.
In the illustrated embodiment, each of the second and third lateral
dividing members 182 is positioned such that the protuberance 290
closest to the inlet nozzle passageway 194 or 196 is aligned
therewith. At second end 146 of body member 160, body member 160
forms a channel extension 210 having a width dimension that is less
than the cavity width W4.
[0088] Body member 160 can be formed in any manner known in the
art. One method for providing member 160 includes providing the
member without cavity 166 and scraping metal out of surface 164 to
provide a suitable cavity. Another method may be to form body
member 160 in a mold. Other manufacturing processes are
contemplated.
[0089] Cover member 162 is a substantially planar and rigid
rectilinear member having a shape which mirrors the shape of
surface 164. Member 162 forms an inlet opening 200 at a first end
204 and an outlet opening 202 at a second 206. The inlet 200 and
outlet 202 are formed such that, when cover member 162 is secured
to surface 164, inlet 200 opens into inlet channel 192 and outlet
202 opens into extension 210.
[0090] To secure cover member 162 in a hermetically sealed manner
to surface 164, any method known in the industry can be employed.
One method which has been shown to be particularly useful in
providing a hermetic seal between cover member 162 and body member
160 has been to use a vacuum brazing technique where a bead of
brazing material is provided along surface 164 of body member 160,
cover member 162 is provided on surface 164 with the brazing bead
sandwiched between members 162 and 160 and then the component
assembly is subjected to extremely high heat thereby causing a
brazing function to occur. Other securing methods are
contemplated.
[0091] As illustrated, each of body member 160 and cover member 162
form a plurality of apertures (not separately numbered) for
receiving mechanical components such as screws, bolts, etc., for
mounting device packages 90, 92, 94 and 96 and, perhaps, other
electronic devices, to the sink member 102. In addition, body
member 160 and/or cover member 162 may include other apertures for
mounting other converter components (e.g., the bracket described
below) to sink member 102 and/or to mount the sink member 102
within a converter housing for support.
[0092] Referring once again to FIG. 2 and also to FIG. 5,
capacitors 50 are standard types of capacitors and, to that end,
generally include a cylindrical body member having a first end 220
and a second end 222 opposite the first end 220 where terminals 224
and 226 extend from each first end 220 and a heat conducting
extension 228 (see FIG. 5) extends centrally from each second end
222. The heat conducting extensions 228, as the label implies,
conducts most of the heat from the central core of the capacitor.
Each capacitor 50 has a length dimension L1 which separates the
first and second ends 220 and 222.
[0093] Referring now to FIGS. 2, 4 and 5, bracket member 104 is, in
at least one embodiment, formed of a heat conducting, rigid
material such as aluminum or copper. Bracket member 104 includes a
proximal member 230, an intermediate member 232 and a distal member
234. Proximal member 230 includes a flat elongated member which has
a length substantially equal to the length of sink member 102.
Proximal member 230 forms a plurality of mounting apertures along
its length which align with similar apertures (not illustrated) in
the surface 142 formed by cover member 162 (see again FIG. 3).
[0094] Intermediate member 232 forms a 90.degree. angle with
proximal member 230 and extends from one of the long edges of
member 230. Similarly, distal member 234 extends from the long edge
of intermediate member 232 opposite the edge linked to proximal
member 230 and forms a 90.degree. angle with intermediate member
232. The 90.degree. angle formed between intermediate member 232
and distal member 234 is in the direction opposite the angle formed
between proximal member 230 and intermediate member 232 so that
distal member 234 extends, generally, in a direction opposite the
direction in which proximal member 230 extends. Although not
illustrated, distal member 234 forms a plurality of apertures
through which the heat dissipating capacitor extension members 228
extend for mounting the capacitors 50 thereto. In the illustrated
embodiment, distal member 234 forms two rows of substantially
equi-spaced apertures for receiving the capacitors 50 and arranging
the capacitors 50 in two separate rows.
[0095] Referring again to FIGS. 2, 4 and 5, laminated bus bar 106
includes a substantially planar member having a general shape
similar to the shape of distal member 134. Although not
illustrated, it should be appreciated by one of ordinary skill in
the art that laminated bus bar 106 includes several metallic
conducting layers where adjacent layers are separated by insulating
layers and wherein different ones of a conducting layers are linked
to connecting terminals along one edge of the bus bar. Exemplary
connecting terminals are identified by numeral 240 in FIGS. 2 and
4.
[0096] In addition, although not illustrated, separate vias are
provided in an underside of bus bar 106 which facilitate connection
of particular points and particular conducting laminations within
bar 106 to the capacitors juxtaposed thereunder when the converter
assembly is configured. More specifically, referring to FIGS. 1a
and 1b once again, bus bar 106 links various emitters and
collectors of the switching devices 30-41 and 61-72 to the positive
and negative DC buses separated by the capacitors 50 as
illustrated. Thus, for example, bus bar 106 links the collector of
switch 30 to the positive DC bus 18, the emitter of switch 36 to
the negative DC bus, the collector of switch 31 to the positive DC
bus 18, the emitter of switch 37 to the negative DC bus 20, and so
on.
[0097] It should be appreciated that bus bar 106 can have an
extremely simple and hence minimally expensive construction when
used with a sink and switching device configuration that aligns all
intra-converter connection terminals in a single line and in a
single connection plane. Here only a minimal number of laminate
layers are required and no vias are required to link to the
switching devices as connection terminals 240 are within the same
plane as the device terminals.
[0098] With the converter components configured as described above,
a particularly advantageous converter assembly can be assembled as
follows. First, after the cover member 62 has been hermetically
sealed to body member 160, device packages 90, 92, 94 and 96 are
mounted to mounting surface 140 of sink member 102 so as to form a
single device row as illustrated best in FIG. 4. Next, bracket
member 104 is secured to surface 142 of cover member 102 so that
intermediate member 232 generally extends away from sink member 102
and so that distal member 234 also extends generally away from sink
member 102. Capacitors 50 are next mounted to distal member 234
with their extending heat dissipating extensions 228 passing
through apertures in member 234 and so that the capacitors 50 form
two capacitive rows as illustrated in FIGS. 2 and 5.
[0099] At this point, it should be appreciated that, when bracket
member 104 is suitably dimensioned, the connection terminals 224
and 226 that extend from the first ends 220 of the capacitors 50
should be within the same connection plane as the intra-converter
connection terminals extending toward the capacitors 50 from each
of device packages 90, 92, 94 and 96. To this end, the bracket
member 232 should be chosen such that the length dimension L2 of
intermediate member 232, when added to the sink member thickness T3
and the device thickness T1 (not illustrated), essentially equals
the capacitor length L1. When any of the sink member 102, the
capacitors 50 or the device packages (e.g., 90) are replaced by
other components having different dimensions, the differently
dimensioned components can be accommodated and the capacitor and
device package connecting terminals can be kept within the same
plane by selecting a bracket member 104 having a different
intermediate member 232 length dimension L2. Thus, the bracket-sink
member assembly renders the sink member extremely versatile when
compared to previous sink configurations that required multi-plane
serpentine coolant paths.
[0100] With the capacitor connecting terminals and the
intra-converter terminals extending from the device packages within
the same connection plane, planar and relatively simple bus bar 106
is attached to the capacitor and intra-converter terminals thereby
linking the various terminals to the positive and negative buses 18
and 20 in the fashion illustrated in FIGS. 1a and 1b above.
[0101] Continuing, the input and output bus bars 12', 14', 16',
24', 26' and 28' are next linked to the inter-converter connection
terminals as illustrated in FIG. 4 and to link the emitters and
capacitors of the switching devices 30-41 and 61-72 at the common
nodes (e.g., 46, 80, etc.) as illustrated in FIGS. 1a and 1b.
[0102] Referring now to FIG. 5, when all of the components
described above are secured together in the manner taught, an
extremely compact converter assembly that requires a relatively
small volume is configured. In fact, as illustrated, a space 280 is
formed adjacent surface 142 of cover member 162 and adjacent
intermediate member 232 where additional components such as the
components required to configure controller 22 can be mounted. In
some embodiments, at least some of the components of controller 22
will be mounted within cooling space 280 to a second mounting
surface formed by surface 142 of cover member 162 so that the
mounted components dissipate heat into sink member 102.
[0103] Referring again to FIGS. 3 and 6, with cover member 162
secured to surface 164, when liquid is pumped through inlet 200 and
into inlet chamber 192, after chamber 192 fills with liquid, the
liquid is forced through each of restricted nozzle inlets 194 and
196 into opposite sides of cavity 166 (i.e., into different halves
of cavity 166 where the halves are separated by central dividing
member 180). Because the nozzle passageways 194 and 196 are
restricted, the coolant is forced therethrough under pressure which
should overcome any pressure differential that exists within the
opposite sides of cavity 166. As the liquid passes through cavity
166 on its way to and out outlet 202, the liquid heats up between
first channel end 184 and second channel end 186 and a phase change
occurs wherein at least a portion of the liquid, as heat is
absorbed, changes from the liquid state the state gas thereby
forming bubbles within cavity 166.
[0104] Protuberances 290 cause excessive amounts of turbulence
within cavity 166 as the protuberances 290 redirect liquid along
random trajectories within the channels. The excessive turbulence
within cavity 166 is such that essentially no gas pockets form on
the internal surfaces of the cavity 166 or the portion of cover
member 162 enclosing cavity 166. In embodiments where sink member
102 is vertically aligned, bubbles that form within the cavity
float upward under the force of liquid flow and the force of their
own buoyancy. The bubbles proceed out the outlet 202 and are
thereafter condensed by the cooling system attached thereto as the
refrigerant is cooled.
[0105] In FIG. 6, as indicated above, cavity 166 has a width
dimension W4 that is, at least in one embodiment, similar to the
width dimension W2 of the heat generating portion of device or
package surface 122 (see also FIG. 3). Where dimension W2 is
smaller, it is contemplated that the dual channel aspect of cavity
166 may not be required. For example, assume dimension W2 is half
the dimension illustrated in the figures. In this case, the cavity
166 may be made approximately half the illustrated dimension and
hence central member 180 may not be needed.
[0106] Experiments have shown that if width dimension W4 is too
large and no dividers 180 are provided along the cavity length L4,
the turbulence generated by the protuberances 290 is substantially
reduced. Thus, for instance, assume member 180 were removed from
cavity 166. In this case much of the coolant pumped into cavity 166
through passageways 194 and 196 would pass relatively calmly
through to the outlet end 186 of cavity 166. The maximum width of
each channel formed within cavity 166 is going to be a function of
various factors including cavity depth, coolant employed, coolant
pressure, the quantum of heat generated by device packages mounted
to the sink, etc.
[0107] It should be appreciated that the protuberances 290 and
divider 180 within cavity 166 are specifically provided to increase
channel turbulence to a level that eliminates gas pockets on
channel surfaces. Without gas pockets on the channel surfaces,
refrigerant/coolant is in substantially full contact with all
channel surfaces and the temperature differential between the first
and second channel ends 184 and 186 is substantially reduced. The
smaller channel temperature differential means that devices mounted
to sink member 102 have more similar operating characteristics as
desired.
[0108] Referring now to FIG. 9 a method 300 according to one aspect
of the present invention is illustrated. Here, at block 302, a body
member 160 (see again FIG. 3) having a limited width dimension W3
and a length L5 is provided where the limited width dimension is
substantially similar to or identical to the width dimension W1 of
the devices to be attached thereto. At block 304, a cavity is
formed in a first surface of the body member 160 that extends
substantially along the entire length dimension L5. The cavity is
illustrated as 166 in FIG. 3. At block 306, a cover member 162 is
provided that is consistent with the teachings above. At block 308
an inlet is formed in one of the body member and the cover member.
At block 310 an outlet is formed in one of the body member and the
cover member. As above, the inlet and outlet formed should open
into opposite ends of the cavity or channel 166. At block 312, the
cover member 162 is hermetically sealed in any manner known in the
art to the body member 160 thereby providing an enclosed channel
having only a single inlet and a single outlet at opposite ends.
Continuing, at block 314, power switching devices for packages 90,
92, 94 and 96 are mounted to the second or mounting surface with
their dissipating width dimensions substantially parallel to the
receiving width dimension W3 of the heat sink.
[0109] It should be understood that the methods and apparatuses
described above are only exemplary and do not limit the scope of
the invention, and that various modifications could be made by
those skilled in the art that would fall under the scope of the
invention. For example, while the sink member 102 is described as
being formed of two components other configurations are
contemplated. In addition, the protuberances 290 may take other
forms that cause a suitable amount of turbulence within the
channel. For instance, in FIG. 7 another embodiment of the body
member is illustrated. In FIG. 7 components similar to the
components of FIG. 6 are identified by identical numbers followed
by an "a" qualifier. In FIG. 7, instead of providing substantially
rectilinear protuberances as in FIG. 6, triangular protuberances
290a are provided on either side of member 280. Moreover, the
protuberances may be formed by any channel surface although forming
the protuberances on the surface opposite the heat generating
devices (i.e., opposite the mounting surface) increases the total
surface area proximate the heat generating device that is in
contact with the coolant. Furthermore, both the cover and the body
member may form protuberances and, in some embodiments, the cover
member may form part or all of the cavity 166.
[0110] In addition, while the protuberances 290 are illustrated as
being equi-spaced, equi-spacing is not required and, in fact, it
may be advantageous to provide protuberances that cause a greater
amount of turbulence at the outlet end of the channel than at the
inlet end as the coolant at the outlet end could be slightly warmer
and hence could generate more problematic vapor bubbles.
[0111] Moreover, more than one divider may be provided in a cavity.
In this regard, referring to FIG. 8, another inventive embodiment
160b of the body member is illustrated. In FIG. 8 components
similar to components described above are identified by the same
number followed by a "b" qualifier. In FIG. 8 cavity 166b is twice
as wide as the cavity 166 in FIG. 6. Here, to ensure sufficient
turbulence to eliminate stagnant gas pockets from the cavity
surface, three separate divider members 271, 273 and 275 are
provided that equally divide cavity 166b along its width. In
addition, separate inlet passageways 251, 253, 255 and 257 are
provided that open from inlet chamber 192c into each separate
channel within cavity 166b and separate lines of protuberances 261,
263, 265 and 267 are formed within the separate channels. Thus, the
protuberance concept has application in wider sink assemblies also
although it is particularly advantageous in long sink assemblies
for the reasons described above.
[0112] To apprise the public of the scope of this invention, the
following claims are made:
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