U.S. patent application number 10/225829 was filed with the patent office on 2004-02-26 for temporary electronic component-carrying tape with weakened areas and related methods.
Invention is credited to Butler, Michael S..
Application Number | 20040035747 10/225829 |
Document ID | / |
Family ID | 31887085 |
Filed Date | 2004-02-26 |
United States Patent
Application |
20040035747 |
Kind Code |
A1 |
Butler, Michael S. |
February 26, 2004 |
Temporary electronic component-carrying tape with weakened areas
and related methods
Abstract
A flexible temporary component-carrier tape used for storing,
transporting and supplying components includes apertures for
receiving and temporarily storing components, as well as at least
one weakened region between at least two of the apertures. Each
weakened region prevents bowing or kinking of the temporary
component-carrying tape at the apertures thereof. The temporary
component-carrier tape comprises a device-retaining layer including
a top surface, the apertures, and, optionally, a series of
advancement wheel holes adjacent to an edge thereof. Components may
be enclosed in the temporary component-carrier tape aperture by
attaching a cover layer to a surface of the device-retaining layer
and at least partially over the apertures. Methods for making and
using the temporary component-carrying tape are also disclosed.
Inventors: |
Butler, Michael S.;
(Greenleaf, ID) |
Correspondence
Address: |
TRASK BRITT
P.O. BOX 2550
SALT LAKE CITY
UT
84110
US
|
Family ID: |
31887085 |
Appl. No.: |
10/225829 |
Filed: |
August 21, 2002 |
Current U.S.
Class: |
206/714 |
Current CPC
Class: |
H05K 13/0084
20130101 |
Class at
Publication: |
206/714 |
International
Class: |
B65D 085/30 |
Claims
What is claimed is:
1. A temporary component-carrier tape comprising: a
device-retaining layer; a plurality of apertures for receiving and
storing components; a top cover layer securable to a surface of the
device-retaining layer and covering at least a portion of each of
the plurality of apertures; and at least one weakened region
included in at least one of the device-retaining layer and the top
cover layer between an adjacent pair of apertures of the plurality
of apertures.
2. The temporary component-carrier tape of claim 1, wherein the
device-retaining layer has a thickness about equal to or greater
than a component to be disposed within one of the plurality of
apertures.
3. The temporary component-carrier tape of claim 1, wherein the
device-retaining layer comprises a flexible layer of paper,
cardboard, or polymer.
4. The temporary component-carrier tape of claim 1, wherein the
device-retaining layer comprises a thermoplastic polymer foam.
5. The temporary component-carrier tape of claim 1, wherein the
device-retaining layer comprises an electrically conductive
material.
6. The temporary component-carrier tape of claim 1, further
comprising an adhesive for securing the top cover layer to the
surface of the device-retaining layer.
7. The temporary component-carrier tape of claim 6, wherein the
adhesive comprises a pressure-sensitive adhesive.
8. The temporary component-carrier tape of claim I, wherein the
plurality of apertures extends partially through the
device-retaining layer.
9. The temporary component-carrier tape of claim 1, wherein the
plurality of apertures extends completely through the
device-retaining layer.
10. The temporary component-carrier tape of claim 9, further
comprising a bottom cover layer securable to another surface of the
device-retaining layer so as to cover at least a portion of each of
the plurality of apertures.
11. The temporary component-carrier tape of claim 10, wherein the
bottom cover layer includes at least one weakened region
positionable between adjacent apertures of the plurality of
apertures.
12. The temporary component-carrier tape of claim 10, further
comprising an adhesive for securing the bottom cover layer to
another surface of the device-retaining layer.
13. The temporary component-carrier tape of claim 12, wherein the
adhesive comprises a pressure-sensitive adhesive.
14. The temporary component-carrier tape of claim 1, wherein at
least the device-retaining layer includes a plurality of
advancement wheel holes formed therethrough and arranged in at
least one row located substantially along an edge of the
device-retaining layer.
15. The temporary component-carrier tape of claim 1, wherein the at
least one weakened region extends at least partially across the
temporary component-carrying tape in a direction substantially
perpendicular to a length thereof.
16. The temporary component-carrier tape of claim 1, wherein the at
least one weakened region comprises a crease.
17. The temporary component-carrier tape of claim 1, wherein the at
least one weakened region comprises an elongated slot.
18. The temporary component-carrier tape of claim 1, wherein the at
least one weakened region comprises a plurality of perforations
through at least one of the device-retaining layer and the top
cover layer.
19. The temporary component-carrier tape of claim 1, wherein the at
least one weakened region comprises a thinned region of at least
one of the device-retaining layer and the top cover layer.
20. A method of designing a temporary component-carrying tape
comprising: configuring a device-retaining layer; configuring a
plurality of apertures for receiving and storing components;
configuring a top cover layer to be secured to a surface of the
device-retaining layer and to cover at least a portion of each
aperture of the plurality of apertures; and configuring at least
one weakened region in at least one of the device-retaining layer
and the top cover layer to be positioned between an adjacent pair
of apertures of the plurality of apertures.
21. The method of claim 20, wherein configuring the
device-retaining layer comprises configuring a thickness of the
device retaining layer to be equal to or greater than a thickness
of a component to be stored within an aperture of the plurality of
apertures.
22. The method of claim 20, wherein configuring the
device-retaining layer comprises configuring the device-retaining
layer to be flexible.
23. The method of claim 20, wherein configuring the top cover layer
comprises configuring at least one surface of the top cover layer
to be at least partially coated with an adhesive for adhering the
top cover layer to the surface of the device-retaining layer.
24. The method of claim 23, wherein configuring the top cover layer
comprises configuring the at least one surface of the top cover
layer to be at least partially coated with a pressure-sensitive
adhesive.
25. The method of claim 20, wherein configuring the top cover layer
comprises configuring the top cover layer to include a material
that, when heated to an adhering temperature, will adhere the top
cover layer to a surface of the device-retaining layer.
26. The method of claim 20, wherein configuring the plurality of
apertures comprises configuring the plurality of apertures to
extend partially through the device-retaining layer.
27. The method of claim 20, wherein configuring the plurality of
apertures comprises configuring the plurality of apertures to
extend substantially through the device-retaining layer.
28. The method of claim 27, further comprising configuring a bottom
cover layer to be secured to another surface of the
device-retaining layer and to cover at least a portion of each of
the plurality of apertures extending through the device-retaining
layer.
29. The method of claim 28, wherein configuring the bottom cover
layer comprises configuring a surface of the bottom cover layer to
be at least partially coated with an adhesive for adhering the
bottom cover layer to the device-retaining layer.
30. The method of claim 29, wherein configuring the bottom cover
layer includes configuring the surface of the bottom cover layer to
be at least partially coated with a pressure-sensitive
adhesive.
31. The method of claim 28, wherein configuring the bottom cover
layer comprises configuring the bottom cover layer to include a
material that, when heated to an adhering temperature, will adhere
the bottom cover layer to the device-retainer layer.
32. The method of claim 20, wherein configuring the
device-retaining layer comprises configuring at least one series of
advancement wheel holes arranged adjacent to an edge of the
device-retaining layer.
33. The method of claim 20, wherein configuring the at least one
weakened region comprises configuring the at least one weakened
region to extend at least partially across and substantially
perpendicular to a length of the temporary component-carrier
tape.
34. The method of claim 28, wherein configuring the at least one
weakened region comprises configuring the bottom cover layer to
include at least one weakened region.
35. The method of claim 20, wherein configuring the at least one
weakened region comprises configuring a crease.
36. The method of claim 20, wherein configuring the at least one
weakened region comprises configuring a thinned area.
37. The method of claim 20, wherein configuring the at least one
weakened region comprises configuring an elongated slot.
38. The method of claim 20, wherein configuring the at least one
weakened region comprises configuring a plurality of
perforations.
39. A method for making a temporary component-carrying tape
comprising: forming a device-retaining layer; forming a plurality
of apertures in the device-retaining layer; securing a top cover
layer to a surface of the device-retaining layer so as to cover at
least a portion of each of the plurality of apertures; and forming
at least one weakened region in at least one of the
device-retaining layer and the top cover layer between adjacent
apertures of the plurality of apertures.
40. The method of claim 39, wherein forming the device-retaining
layer comprises forming the device-retaining layer from paper,
cardboard, or a thermoplastic polymer.
41. The method of claim 39, wherein forming the device-retaining
layer comprises forming the device-retaining layer from a
thermoplastic polymer foam.
42. The method of claim 39, wherein forming the device-retaining
layer comprises extruding a polymeric material through a die.
43. The method of claim 39, wherein forming the device-retaining
layer comprises forming at least one series of advancement wheel
holes adjacent to an edge of the device-retaining layer.
44. The method of claim 43, wherein forming the plurality of
apertures comprises punching the plurality of apertures into the
device-retaining layer.
45. The method of claim 39, wherein securing the top cover layer to
the surface of the device-retaining layer comprises using a
pressure-sensitive adhesive therebetween.
46. The method of claim 39, wherein securing the top cover layer to
the surface of the device-retaining layer further comprises
applying heat to at least one of the top cover layer and the
device-retaining layer.
47. The method of claim 39, further comprising securing a bottom
cover layer to another surface of the device-retaining layer so as
to cover at least a portion of each of the plurality of
apertures.
48. The method of claim 47, wherein securing the bottom cover layer
to the another surface of the device-retaining layer is effected
with a pressure-sensitive adhesive.
49. The method of claim 47, wherein securing the bottom cover layer
to the another surface of the device-retaining layer comprises
applying heat to at least one of the bottom cover layer and the
device-retaining layer.
50. The method of claim 39, wherein forming the at least one
weakened region comprises at least one of punching, cutting,
etching, and creasing.
51. The method of claim 47, further comprising forming at least one
weakened region in at least the bottom cover layer.
52. The method of claim 51, wherein forming the at least one
weakened region in at least the bottom cover layer comprises at
least one of punching, cutting, etching, and creasing.
53. The method of claim 39, wherein forming the at least one
weakened region comprises forming the at least one weakened region
substantially simultaneously with forming the plurality of
apertures.
54. The method of claim 51, wherein forming the at least one
weakened region in the bottom cover layer is effected before
securing the bottom cover layer to the another surface of the
device-retaining layer.
55. The method of claim 51, wherein forming the at least one
weakened region in the bottom cover layer is effected after
securing the bottom cover layer to the another surface of the
device-retaining layer.
56. The method of claim 39, wherein forming the at least one
weakened region is effected prior to securing the top cover layer
to the device-retaining layer.
57. The method of claim 39, wherein forming the at least one
weakened region is effected after securing the top cover layer to
the device-retaining layer.
58. A method for using a temporary component-carrying tape
comprising: subjecting the temporary component-carrying tape to a
stress; absorbing the stress at a weakened region of at least one
layer of the temporary component-carrying tape to maintain a shape
of an aperture of a device-retaining layer of the temporary
component-carrying tape; and removing a cover layer of the
temporary component-carrying tape to provide access to at least one
component temporarily stored within the aperture; removing the at
least one component from the aperture.
59. The method of claim 58, further comprising unwinding the
temporary component-carrying tape from a roll.
60. The method of claim 59, wherein unwinding the temporary
component-carrier tape comprises engaging advancement wheel holes
of the temporary component-carrier tape with a sprocketed
advancement wheel.
61. The method of claim 60, wherein engaging the advancement wheel
holes comprises moving the temporary component-carrier tape toward
a pick-and-place head.
62. The method of claim 58, wherein removing the cover layer is
effected with a stripper assembly that peels the cover layer away
from a top surface of the device-retaining layer.
63. The method of claim 58, wherein removing the at least one
component from the aperture comprises applying a vacuum from a
pick-and-place head.
64. An electronic device component-carrying tape, comprising: a
device-retaining layer; a plurality of apertures or receptacles in
the device-retaining layer; at least one electronic device in each
of the plurality of apertures or receptacles; a cover layer
securable to a surface of the device-retaining layer and covering
at least a portion of each of the plurality of apertures or
receptacles; and at least one weakened region included in at least
one of the device-retaining layer and the cover layer between an
adjacent pair of apertures or receptacles of the plurality of
apertures or receptacles.
65. The electronic device component-carrying tape of claim 64,
further comprising at least one of a hub and a reel upon which the
electronic device component-carrying tape is wound.
66. The electronic device component-carrying tape of claim 64 in a
rolled configuration.
67. The electronic device component-carrying tape of claim 64,
wherein the device-retaining layer has a thickness about equal to
or greater than the at least one electronic device within one of
the plurality of apertures or receptacles.
68. The electronic device component-carrying tape of claim 64,
wherein the device-retaining layer comprises a flexible layer of
paper, cardboard, or polymer.
69. The electronic device component-carrying tape of claim 64,
wherein the device-retaining layer comprises a thermoplastic
polymer foam.
70. The electronic device component-carrying tape of claim 64,
wherein the device-retaining layer comprises an electrically
conductive material.
71. The electronic device component-carrying tape of claim 64,
further comprising an adhesive for securing the cover layer to the
surface of the device-retaining layer.
72. The electronic device component-carrying tape of claim 71,
wherein the adhesive comprises a pressure-sensitive adhesive.
73. The electronic device component-carrying tape of claim 64,
wherein the plurality of apertures or receptacles extends partially
through the device-retaining layer.
74. The electronic device component-carrying tape of claim 64,
wherein the plurality of apertures or receptacles extends
completely through the device-retaining layer.
75. The electronic device component-carrying tape of claim 74,
further comprising another cover layer securable to another surface
of the device-retaining layer so as to cover at least a portion of
each of the plurality of apertures or receptacles.
76. The electronic device component-carrying tape of claim 75,
wherein the another cover layer includes at least one weakened
region positionable between adjacent apertures or receptacles of
the plurality of apertures or receptacles.
77. The electronic device component-carrying tape of claim 75,
further comprising an adhesive for securing the another cover layer
to the another surface of the device-retaining layer.
78. The electronic device component-carrying tape of claim 77,
wherein the adhesive comprises a pressure-sensitive adhesive.
79. The electronic device component-carrying tape of claim 64,
wherein at least the device-retaining layer includes a plurality of
advancement wheel or indexing holes formed therethrough and
arranged in at least one row located substantially along an edge of
the device-retaining layer.
80. The electronic device component-carrying tape of claim 64,
wherein the at least one weakened region extends at least partially
across the electronic device component-carrying tape in a direction
substantially perpendicular to a length thereof.
81. The electronic device component-carrying tape of claim 64,
wherein the at least one weakened region comprises a crease.
82. The electronic device component-carrying tape of claim 64,
wherein the at least one weakened region comprises an elongated
slot.
83. The electronic device component-carrying tape of claim 64,
wherein the at least one weakened region comprises a plurality of
perforations through at least one of the device-retaining layer and
the cover layer.
84. The electronic device component-carrying tape of claim 64,
wherein the at least one weakened region comprises a thinned region
of at least one of the device-retaining layer and the cover layer.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to tapes for temporarily
carrying electronic components for storage or transportation, as
well as to methods for designing, forming, and introducing
electronic components into pockets and removal of electronic
components from the pockets of such tapes. More specifically, the
present invention relates to temporary component-carrier tapes that
include weakened areas between locations for receiving electronic
components and associated methods.
[0003] 2. State of the Art
[0004] Virtually every type of electronic device now incorporates
one or more semiconductor devices. Typically, the semiconductor
devices are mounted and electrically connected to some sort of
carrier substrate, such as a circuit board, to electrically connect
the same to input and output devices or exterior components to be
monitored and/or controlled by the semiconductor devices. In
addition to the semiconductor devices, ancillary electronic
components, such as resistors, resistor systems, and capacitors,
are typically mounted upon and electrically connected to such
carrier substrates.
[0005] Semiconductor devices and the other, ancillary electronic
components that are used in electronic devices are often
manufactured at different locations. Thus, it is often necessary to
transport at least some of these components from one location to
another for assembly. As the ancillary electronic components are
typically smaller, more robust and less expensive than the
semiconductor devices with which they are to be used, it is usually
the ancillary electronic components that are transported to the
location where the semiconductor devices are fabricated and
packaged for assembly therewith in an electronic system.
[0006] Typically, such ancillary electronic components are
temporarily packaged in pockets of a tape comprising a
plastic-paper-plastic laminate, with the pockets being formed in
the center, paper layer of the tape and the plastic layers of the
tape holding the ancillary electronic components within their
respective pockets. The ancillary electronic components are
typically packaged within the pockets of the tape by providing a
tape which includes a paper layer with a single plastic layer
secured to a bottom surface thereof. Once the ancillary electronic
components are introduced into the pockets, such as by
pick-and-place equipment, the other, upper plastic layer is secured
to the paper layer to completely encase each ancillary electronic
component within its respective pocket. One or both of the plastic
layers of the tape are secured to the paper layer thereof with an
adhesive material that facilitates peeling of the plastic layer or
layers from the paper layer and, thus, opens the pockets so that an
ancillary electronic component may be removed therefrom. The
component-bearing tape is typically rolled and may be stored on a
reel until use of the temporarily packaged ancillary electronic
components is desired.
[0007] Components may be removed from the tape by introducing the
tape into appropriate equipment, which typically includes a
conveyor element that is configured to engage indexing holes formed
in an edge of the tape, a separation element which is positioned so
as to retain the assembled relation of the upper plastic layer with
the paper layer until removal of an ancillary electronic component
from its corresponding pocket is desired, a first take-up reel
located somewhat above or behind the separation element for
receiving regions of the upper plastic layer which have been peeled
away from the remainder (i.e., paper layer and lower plastic layer)
of the tape, and a second take-up reel positioned in front of
(i.e., upstream from) the separation element for receiving the
remainder of the tape. In addition, such equipment includes a
pick-and-place element that removes an ancillary electronic
component from its corresponding pocket of the tape and for placing
the ancillary electronic component at a desired location, such as
upon a carrier substrate.
[0008] When such a component-bearing tape is handled, such as by
introducing the tape into equipment for removing the ancillary
electronic components therefrom and placing the same on a carrier
substrate, the tape may be subjected to stresses which could cause
kinking thereof. Typically, such kinking occurs at the weakest
regions of the tape, typically those areas at which the pockets are
located. When a component-bearing tape becomes kinked at such a
location, one or both of the plastic layers at that location may be
creased or bowed, which may increase the depth of at least a
portion of the pocket and form a "barrel"-shaped pocket.
[0009] Once the pocket has been opened, a pick-and-place element
including, for example, a vacuum quill, is used to remove the
ancillary electronic component therefrom and to place the same at
an appropriate location on a carrier substrate. If the height of
the pocket has been increased by kinking or bowing of the tape, the
ancillary electronic component may be located at a distance which
precludes removal thereof from the pocket by the quill or other
retrieval device, resulting in advancement of the component-bearing
tape to the location of the next ancillary electronic component
and, thus, waste of the ancillary electronic component that could
not be picked from the tape.
[0010] Bowing or kinking of the plastic bottom of the pocket
resulting in "barreling" of the pocket may also result in inversion
of the ancillary electronic component, which inversion will
typically not be recognized by the pick-and-place element. Although
state-of-the-art pick-and-place elements may be equipped with
machine vision systems that recognize shapes and dimensions, they
cannot recognize right-side up or upside-down orientations or color
(i.e., the color difference between the labeled top side of an
ancillary electronic component and the bottom side of the
electronic component). As a result of such inversion, ancillary
electronic components may be secured to carrier substrates in
improper orientations, which leads to failure of not only the
ancillary electronic components, but also of the carrier substrate
and any other components that have already been secured
thereto.
[0011] The inventor is not aware of a temporary component-carrier
tape that is configured to resist kinking or bowing at the
component-carrying pockets thereof.
BRIEF SUMMARY OF THE INVENTION
[0012] The present invention includes a temporary component-carrier
tape with component-carrying locations along the length thereof and
a weakened region located between each adjacent pair of
component-carrying locations. In addition, methods for designing,
forming, and introducing electronic components into and removing
electronic components from the temporary component-carrier tape of
the present invention are within the scope of the present
invention.
[0013] An exemplary embodiment of a temporary component-carrier
tape according to the present invention includes a bottom layer and
a device-retaining layer that are secured to one another. The
device-retaining layer may include a series of apertures, or
"pockets," at device-retaining areas along the length thereof. The
device-retaining layer has a thickness or depth that is about equal
to or greater than the electronic devices that are to be received
within the apertures thereof. The bottom layer forms a bottom of
each of the apertures. In addition, the temporary component-carrier
tape may include an upper layer, which is securable to an opposite
surface of the device-retaining layer from that to which the bottom
layer is secured. At least one of the top and bottom layers of the
temporary component-carrier tape is readily removable, by peeling
thereof, from the device-retaining layer so as to facilitate
removal of electronic components from their corresponding
apertures.
[0014] A temporary component-carrier tape that incorporates
teachings of the present invention may also include a weakened
region between each pair of adjacent device-retaining areas. Each
weakened region may extend at least partially across the temporary
component-carrier tape in a direction substantially perpendicular
to a length thereof. The weakened regions may be located in one or
more of the bottom layer, device-retaining layer, and top layer of
the temporary component-carrier tape. Each weakened region is
configured to absorb stress (e.g., compressional stress, bending
stress, torsional stress, elongation stress, etc.) exerted on the
temporary component-carrier tape, at least partially removing such
stress from an adjacent device-retaining area of the tape. By way
of example only, each weakened region may comprise a creased area
or an elongate slot or series of linearly arranged perforations
formed through one or more of the layers of the temporary
component-carrier tape. Alternatively, a weakened region may
comprise a discontinuity in one or two, but fewer than all, of the
layers of the temporary component-carrier tape.
[0015] A method for designing a temporary component-carrier tape
that incorporates teachings of the present invention includes
configuring a plurality of device-retaining areas along the length
of an elongate element and at least one weakened region between
each adjacent pair of device-retaining areas. By way of example
only, the device-retaining areas may be configured by configuring a
device-retaining layer to have a thickness that is substantially
equal to or greater than a height of an electronic device to be
carried by the temporary component-carrier tape and to include a
plurality of apertures, each of which has dimensions that
facilitate the positioning of an electronic component therein. In
addition, top and bottom layers of the device-retaining layer may
be configured in such a way as to facilitate securing of the top
and bottom layers to opposite surfaces of the device-retaining
layer. Each weakened region of the temporary component-carrier tape
may be configured to absorb stress (e.g., compressional stress,
bending stress, torsional stress, tensile stress, etc.) exerted
along the tape, at least partially removing such stress from an
adjacent device-retaining area of the tape. Each weakened region
may be configured so as to extend at least partially across the
tape, in a direction substantially perpendicular to a length
thereof. By way of example only, each weakened region may be
configured as one or more thinned areas of the tape or one or more
apertures through the tape. Alternatively, a weakened region may be
configured as a crease extending across at least a portion of the
tape.
[0016] A temporary component-carrier tape incorporating teachings
of the present invention may be formed by providing at least one
device-retaining layer and at least one cover layer. As described,
an exemplary temporary component-carrier tape of the present
invention includes a device-retaining layer sandwiched between two
outer, cover layers, which hold electronic components within
apertures of the device-retaining layer. Prior to assembly of the
layers, weakened regions may be formed in one or more of the
layers, such as by cutting (e.g., die cutting, slicing with a knife
or blade, etc.), etching, creasing, or the like, or, alternatively,
weakened regions may be formed after the layers are assembled.
Next, at least one outer layer of tape, which includes spaced-apart
device-retaining areas thereon, may be provided. Apertures of a
device-retaining layer of the tape may be aligned with
corresponding device-retaining areas of the outer layer. The
device-retaining and outer layers of the tape may then be secured
to one another. Electronic components are positioned at
device-retaining areas such that, when the device-retaining and
outer layers of the tape are secured to one another, the apertures
of the device-retaining layer and the device-retaining areas of the
outer layer form receptacles, each of which is configured to
substantially enclose an electronic component. The device-retaining
layer of the tape may be secured to the outer layer either before
or after electronic components are positioned at device-retaining
areas of the outer layer. Once a receptacle has an electronic
component therein, another outer layer may be secured to the
opposite surface of the device-retaining layer so as to
substantially enclose the electronic component within its
corresponding receptacle. The layers may be secured to one another
by way of an adhesive material, such as a pressure-sensitive
adhesive, placed therebetween or by application of heat.
[0017] Another exemplary embodiment of the temporary
component-carrier tape may comprise a device-retaining layer and an
outer cover layer. Receptacles are formed in the device-retaining
layer, such as by molding the device-retaining layer, at
device-retaining areas thereof so as to not extend completely
through the device-retaining layer, thereby obviating the need for
a second outer layer. Weakened regions may be formed in either or
both layers and the receptacles of the device-retaining layer may
be aligned with device-retaining areas of the outer layer.
Electronic components are placed in the apertures of the
device-retaining layer and enclosed in a receptacle formed by
securing the outer layer to the device-retaining layer. The two
layers may be secured by application of a pressure-sensitive or
other adhesive placed therebetween, by application of heat, or
otherwise, as known in the art.
[0018] In use, the temporary component-carrier tape includes
electronic components that are substantially contained within the
apertures thereof and may be stored, transported, and supplied in a
rolled configuration (e.g., upon a hub, reel, or the like). When
removal of one or more electronic components from the temporary
component-carrier tape is desired, an end of the temporary
component-carrier tape may be introduced into appropriate assembly
equipment, as known in the art. At least an outer layer (i.e., the
top layer or bottom layer) of the temporary component-carrier tape
is removed from the device-retaining layer of the tape at a
particular device-retaining area of the tape to provide access to
an electronic component carried at that device-retaining area. If
any stress is applied along the length of or otherwise to the
temporary component-carrier tape, weakened regions thereof absorb
such stress, preventing kinking or bowing of any of the layers of
the tape at a device-retaining area thereof.
[0019] Other features and advantages of the present invention will
be apparent to those of skill in the art through consideration of
the ensuing description, the accompanying drawings, and the
appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In the drawings, which depict various aspects of exemplary
embodiments of the present invention:
[0021] FIG. 1 is a perspective view of an exemplary embodiment of a
temporary component-carrier tape, which includes a device-retaining
layer, a bottom cover layer, a top cover layer, and a weakened
region, with an end portion of the tape separated to show details
thereof.
[0022] FIG. 2 is a perspective view of another exemplary embodiment
of a temporary component-carrier tape, which includes a
device-retaining layer, a top cover layer, and a weakened region,
with the layers at an end portion of the tape separated to show
details thereof.
[0023] FIG. 3A is a perspective view of the temporary
component-carrier tape in FIG. 1 that includes a weakened area
comprising an elongated slot between two apertures.
[0024] FIG. 3B is a cross-sectional view of the elongated slot
depicted in FIG. 3A, taken along line III-B--IIIB of FIG. 3A.
[0025] FIG. 3C is a perspective view of the temporary
component-carrier tape in FIG. 2 that includes a weakened area
comprising an elongated slot between two receptacles.
[0026] FIG. 3D is a cross-sectional view of the elongated slot
depicted in FIG. 3C, taken along line IIID--IIID of FIG. 3C.
[0027] FIG. 4A is a perspective view of the temporary
component-carrier tape in FIG. 1 that includes a weakened area
comprising a perforation between two apertures.
[0028] FIG. 4B is a cross-sectional view of the perforation
depicted in FIG. 4A, taken along line IVB--IVB of FIG. 4A.
[0029] FIG. 4C is a perspective view of the temporary
component-carrier tape in FIG. 2 that includes a weakened area
comprising a perforation between two receptacles.
[0030] FIG. 4D is a cross-sectional view of the perforation
depicted in FIG. 4C, taken along line IVD--IVD of FIG. 4C.
[0031] FIG. 5A is a perspective view of the temporary
component-carrier tape in FIG. 1 that includes a weakened area
comprising a crease between two apertures.
[0032] FIG. 5B is a cross-sectional view of the crease depicted in
FIG. 5A, taken along line VB--VB of FIG. 5A.
[0033] FIG. 5C is a perspective view of the temporary
component-carrier tape in FIG. 2 that includes a weakened area
comprising a crease between two receptacles.
[0034] FIG. 5D is a cross-sectional view of the crease depicted in
FIG. 5C, taken along line VD--VD of FIG. 5C.
[0035] FIG. 6A is a perspective view of the temporary
component-carrier tape in FIG. 1 that includes a weakened area
comprising a thinned area between two apertures.
[0036] FIG. 6B is a cross-sectional view of the thinned area
depicted in FIG. 6A, taken along line VIB--VIB of FIG. 6A.
[0037] FIG. 6C is a perspective view of the temporary
component-carrier tape in FIG. 2 that includes a weakened area
comprising a thinned area between two receptacles.
[0038] FIG. 6D is a cross-sectional view of the thinned area
depicted in FIG. 6C, taken along line VID--VID of FIG. 6C.
[0039] FIG. 7 is a schematic representation of an exemplary system
and method for making the device-retaining layer of a temporary
component-carrier tape according to the present invention.
[0040] FIG. 8 is a schematic representation of exemplary systems
and methods for making temporary component-carrier tapes according
to the present invention.
[0041] FIG. 9 is a schematic representation of an exemplary system
and method of removing components from a temporary
component-carrier tape according to the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0042] Turning to the drawing figures, the temporary
component-carrier tapes 100 and 100 , illustrated in FIGS. I and 2,
respectively, are useful for storing and transporting components
(e.g., electronic components) from a component manufacturer to a
different location where the components will be removed from the
temporary component-carrier tape 100 or 100 and assembled with
other elements (e.g., circuit boards, semiconductor devices, etc.).
An exemplary tape width may be about 8 mm.
[0043] As shown in FIG. 1, the temporary component-carrier tape 100
has three layers, a device-retaining layer 102, a top cover layer
116 and a bottom cover layer 118, where the top cover layer 116 and
the bottom cover layer 118 are depicted as partially removed from
the device-retaining layer 102 to expose features of the
device-retaining layer 102. A row of apertures 112 that may extend
through the device-retaining layer 102 open to both the top surface
104 and the bottom surface 106 of the device-retaining layer 102.
The thickness of the device-retaining layer 102 is substantially
equal to or greater than the height of the component 114 to be
laterally surrounded by the device-retaining layer 102. Also shown
are sides 108 and 110 of the device-retainer layer 102 and a row of
advancement wheel or indexing holes 120 spanning the thickness of
at least the device-retaining layer 102 and located along at least
one edge 122 of the device-retaining layer 102. The row of
advancement wheel or indexing holes 120 is not limited to a single
row along one edge of the device-retaining layer 102, as shown in
FIG. 1. A second row of advancement wheel holes may optionally be
included substantially along the edge opposite edge 122 of the
device-retaining layer 102.
[0044] The temporary component-carrier tape 100 shown in FIG. 2
represents a variation of the device-retaining layer 102, which
includes receptacles 112 that do not open to the bottom surface 106
of the device-retaining layer 102 . The depths of the receptacles
112 are substantially equal to or greater than the height of
component 114 enclosed therein. The temporary component-carrier
tape 100 differs from the temporary component-carrier tape 100
depicted in FIG. 1 by obviating the need to include a bottom cover
layer 118.
[0045] The apertures 112 and receptacles 1 12 are not limited to
the size or shape depicted in the figures. Although specifically
illustrated, the apertures 112 and receptacles 112 may be designed
to accommodate components of various sizes. Also, the apertures 112
and receptacles 112 may be circular, elliptical, triangular,
pentagonal, or any of a number of other shapes. In addition, the
apertures 112 and receptacles 112 may include ribs, ledges and
other similar structures to better accommodate and support
particular component features. In general, apertures 112 and
receptacles 112 open to the top surface 104 of the device-retaining
layer 102, 102 and may extend either partially or completely
therethrough. For components 114 enclosed in closed apertures 112
and receptacles 112 extending completely through the
device-retaining layer 102, as shown in FIG. 1, the top cover layer
116 and the bottom cover layer 118 are respectively secured to the
top surface 104 and the bottom surface 106 thereof. Where the
receptacles 112 do extend proximate to the bottom surface 106 , as
shown in FIG. 2, components 114 are enclosed in the temporary
component-carrier tape 100 when the top cover layer 116 is secured
to the top surface 104 of the device-retaining layer 102 .
[0046] Since material has been removed from the device-retaining
layer 102, 102 to form apertures 112 and receptacles 112, the
apertures 112 and receptacles 112 are vulnerable to bowing or
kinking as a result of stresses applied to the temporary
component-carrier tape 100 or 100 , such as stresses caused by
forces communicated to the temporary component-carrier tape 100 or
100 , such as along the length thereof or transverse to the length
thereof, when the temporary component carrier-tape 100 or 100 is
being fed into component removal equipment or when the components
are removed from the temporary component-carrier tape 100 or 100.
Stresses may likewise be applied to a temporary component-carrier
tape 100 or 100 as it is wound around a hub or hub of a reel.
Weakened regions 124 that are located between two adjacent
apertures 112 or receptacles 112, as shown in FIGS. 1 through 6,
are more susceptible to deformation under stress than are apertures
112 and receptacles 112 and, thus, may more readily absorb stresses
that are applied to the temporary component-carrier tapes 100 and
100 than the apertures 112 and receptacles 112 thereof. Weakened
regions 124 may be formed by eliminating material from one or more
of the device-retaining layer 102, apertures 112 or receptacles 112
, the top cover layer 116, and the bottom cover layer 118 or by
placing a crease in one or more of these layers between adjacent
apertures 112 or receptacles 112 of the temporary component-carrier
tapes 100 and 100 respectively.
[0047] FIGS. 3A through 3D depict a first exemplary type of
weakened region of temporary component-carrier tapes 100 and 100
according to the present invention. Illustrated in FIG. 3A is a
perspective view of the weakened region 128 of temporary
component-carrier tape 100. FIG. 3B is a cross-sectional view of
the weakened region 128 shown in FIG. 3A along section line
IIIB-IIIB. The weakened region 128, shown in FIGS. 3A and 3B, is an
elongated slot 130 positioned between two closed apertures 112 and
extending substantially through the top cover layer 116, the
device-retaining layer 102 and the bottom cover layer 118. The
two-layer temporary component-carrier tape 100 illustrated in the
perspective view of FIG. 3C also includes weakened regions 128
between each adjacent pair of closed receptacles 112 . FIG. 3D is
the cross-sectional view along section lines IIID-IIID shown in
FIG. 3C. The weakened region 128 shown in FIGS. 3C and 3D includes
an elongated slot 130 extending substantially through the top cover
layer 116 and the device-retaining layer 102 . In general, the
present invention is not limited to the rectangularly shaped slot
illustrated. It may include nonsquare (e.g., rounded) ends or have
another shape, such as elliptical, circular, square, or any shape
that provides an open space between two apertures 112 or
receptacles 112 . Also, an elongated slot may be much thinner than
illustrated.
[0048] FIGS. 4A through 4D illustrate a second exemplary type of
weakened region of temporary component-carrier tapes 100 and 100 of
the present invention. FIG. 4A is a perspective view of the
weakened region 136 located between closed apertures 112 in the
three-layer temporary component-carrier tape 100. FIG. 4B is a
cross-sectional view of the weakened region 136 along the section
lines IVB-IVB shown in FIG. 4A. The weakened region 136 shown in
FIGS. 4A and 4B includes a substantially linearly arranged series
of perforation holes 138 extending substantially through the top
cover layer 116, the device-retaining layer 102, and the bottom
cover layer 118, where each perforation hole 138 is laterally
separated from adjacent perforation holes 138 by walls 140 located
therebetween. Illustrated in FIG. 4C is a perspective view of the
two-layer temporary component-carrier tape 100 with the weakened
region 136 located between two closed receptacles 112 . Shown in
FIG. 4D is a cross-sectional view of weakened region 136 along
section lines IVD-IVD depicted in FIG. 4C. Both figures illustrate
the weakened region 136 as a series of substantially linear
perforation holes 138 extending substantially through top cover
layer 116 and device-retaining layer 102 and separated by walls
140. The perforation holes 138 are not limited to a rectangular
configuration, as illustrated. The perforation holes 138
illustrated in FIGS. 4A through 4D may alternatively be elliptical,
circular, triangular, square, diamond shaped or any shape that
provides a hole extending through one or more of the top cover
layer 116, the device-retaining layer 102, 102 and the bottom cover
layer 118. In addition, the number of perforation holes 138 is not
limited to the number or relative size shown in FIGS. 4A through
4D.
[0049] A third exemplary type of weakened region of temporary
component-carrier tapes 100 and 100 according to the present
invention is illustrated in FIGS. 5A through 5D. A perspective view
of temporary component-carrier tape 100 depicts the weakened region
142, in this case a crease 144, positioned between two closed
apertures 112, as shown in FIG. 5A. FIG. 5B shows a cross-sectional
view of the weakened region 142 along section lines VB-VB in FIG.
5A. The crease 144 in FIGS. 5A and 5B is depicted as a concave-up
impression in the top cover layer 116, the device-retaining layer
102 and the bottom cover layer 118 substantially perpendicular to
the length of the temporary component-carrier tape 100. FIG. 5C is
a perspective view of the weakened region 142 located between two
closed receptacles 112 in the two-layer temporary component-carrier
tape 100 . A cross-sectional view of the weakened region 142 along
section lines VD-VD in FIG. 5C is shown in FIG. 5D. The weakened
region 142 is a crease 144 illustrated as a concave-up impression
substantially including the top cover layer 116 and the
device-retaining layer 102 and substantially perpendicular to the
length of the temporary component-carrier tape 100 . In general,
the crease 144 is not restricted to the embodiment shown in FIGS.
5A through 5D. The crease 144 may be concave-down and may be
located in one or more of the top cover layer 1 16, the
device-retaining layer 102, 102 and the bottom cover layer 118.
[0050] Shown in FIGS. 6A through 6D is a fourth exemplary type of
weakened region of temporary component-carrier tapes 100 and 100 of
the present invention. FIG. 6A shows a perspective view of the
weakened region 146, which comprises a thinned region 148 located
in at least one layer of the three-layer temporary
component-carrier tape 100. As shown in FIG. 6A, the thinned region
148 is located in the device-retaining layer 102 between two closed
apertures 112 and substantially perpendicular to the length of the
component-carrier tape 100. FIG. 6B is a cross-sectional view of
the illustration in FIG. 6A along section lines VIB-VIB showing the
thinned region 148 positioned in the device-retaining layer 102. A
perspective of a weakened region 146 comprising a thinned region
148 in the two-layer temporary component-carrier tape 100 is
provided in FIG. 6C. FIG. 6D is an illustration of the
cross-section of the weakened region 146 in FIG. 6C along section
lines VID-VID. The thinned region 148 is located between two closed
receptacles 112 and substantially perpendicular to the length of
the temporary component-carrier tape 100 as illustrated in FIG. 6C.
FIG. 6D shows the thinned region 148 as a thin layer along the
bottom of the device-retaining layer 102 . The thinned region 148
is not limited to the rectangular cross-section illustrated. The
cross-section may alternatively be concave-up at the sides,
elliptical, circular, square, triangular or any shape. The thinned
region 148 may include openings or thinning in one or more of the
top cover layer 116 and the bottom cover layer 118. Moreover, the
thinned region 148 could be nonlinear or any other suitable
configuration that is substantially perpendicular to the length of
temporary component-carrier tapes 100 and 110 . Also, the thinned
region 148 is not limited to the location illustrated and may be
placed anywhere between the top surface 104 and the bottom surface
106, 106 of the device-retaining layer 102, 102 .
[0051] The device-retaining layers 102, 102 of the present
invention may comprise a layer of paper, cardboard, polymer (e.g.,
thermoplastic polymeric foam) or the like that is sufficiently
flexible to allow the temporary component-carrier tapes 100 and 100
to be wound around a hub or the hub of a reel and flexible enough
to deform in the weakened regions. It may also be sufficiently
strong enough to carry and provide, along the top and bottom cover
layers 116 and 118, some structural support for components 114 that
are temporarily carried by temporary component-carrier tapes 100
and 100 . Thermoplastic polymeric foams, which may be used as
device-retaining layer 102, 102 do not create dust particles or
loose fibers during the slitting and punching process, may be used
as device-retaining layer 102, 102 . If the device-retaining layer
102, 102 is formed from a thermoplastic polymer foam, the
thermoplastic polymer foam material should not tear during punching
and should have a low elongation to minimize stretching. The
polymeric materials that may be used to produce thermoplastic
polymeric foam includes, without limitation, polyethelene
terephthalate and ethylene glycol-modified polyethelene
terephthalate, polyolefins, polystyrene, polycarbonate, nylon,
acrylics, acrylonitrile-butadiene-styrene, and copolymers. In
addition to its physical properties, it is also desirable that the
thermoplastic polymer foam material be electrically dissipative.
This may be accomplished by including an electrically conductive
material, such as carbon black, which is coated on the surface or
interspersed within the material during manufacturing. The
electrically conductive material allows an electric charge to be
dissipated throughout the material, thereby preventing damage to
the components. The thermoplastic polymeric foam may also include
other materials to vary the properties of the foamed sheet.
[0052] The device-retaining layer may be formed by known processes,
such as those that are used to form paper and wax- or
plastic-coated paper tapes.
[0053] Another exemplary method for making the device-retaining
layer 102 according to the present invention is depicted in FIG. 7.
In general, the process of foaming polymeric materials is familiar
to those of ordinary skill in the art and is described in various
references such as Handbook of Polymeric Foams and Foam Technology
(Daniel Klemper and Kurt C. Frisch eds., Hanser Publishers 1991).
Many of the methods described in this reference may be used to
manufacture polymeric materials. The device-retaining layer 102 may
be manufactured using a known extrusion process. Basically, the
polymeric materials are placed in an extruder 150 where they are
melted, mixed, and forced through a die 152 under pressure to form
film product. FIG. 7 shows a film 154 formed by extruding the
polymeric materials through a die 152. The film 154 then passes
over a cooling cylinder 156 and is reheated as it passes between a
pair of temperature-controlled cylindrical rollers 158 to form and
further shape the film 154. A cutter 160 is employed to cut the
width of the film 154 before it is wound around a hub 162 or hub
162 of a reel to produce a supply roll 164. As illustrated in FIG.
7, the apertures 112 and the advancement wheel holes 120 may be
punched into film 154 by a punch press 166 to form device-retaining
layer 102 prior to winding the film 154 into supply roll 164.
[0054] A method of making the temporary component-carrier tape 100,
100 according to the present invention is depicted in FIGS. 1 and
8. The film 154 is unwound from the supply roll 164 and fed through
a punch press 166. The punch press 166 may be employed at this
point if the apertures 112 and the advancement wheel holes 120 have
not already been punched into the film 154 prior to rolling the
film 154 onto the supply roll 164 as illustrated in FIG. 7. As the
film 154 passes through the punch press 166, the device-retaining
layer 102 emerges having apertures 112 and the advancement wheel
holes 120 therein. The device-retaining layer 102 then passes
between platens 168, where the bottom cover layer 118, supplied by
the supply roll 170, is connected to the bottom surface 106 of
device-retaining layer 102. The platens 168 may be heated to cause
the bottom cover layer 118 and the bottom surface 106 to adhere to
one another. Alternatively, a pressure-sensitive adhesive may be
applied to either the bottom cover layer 118 or the bottom surface
106 of the device-retaining layer 102 and the platens 168 may be
replaced by laminator rollers (not shown) to apply sufficient
pressure to secure the bottom cover layer 118 to the bottom surface
106. One end of each of the apertures 112 is closed as the bottom
cover layer 118 is connected to the bottom surface 106 of the
device-retaining layer 102. Components 114 may be placed in the
open apertures 112 as they pass under the component loader 174.
Next, the device-retaining layer 102, with the attached bottom
cover layer 118, passes through a second set of platens 176 where
the top cover layer 116, supplied by supply roll 178, is connected
to the top surface 104. Like the platens 168 used to connect the
bottom cover layer 118 to the bottom surface 106, platens 176 may
be heated to allow the top cover layer 116 to adhere to the top
surface 104. Alternatively, laminated rollers may be used to apply
pressure where a pressure-sensitive adhesive is applied between the
top cover layer 116 and the top surface 104. Emerging from the
platens 176 is the temporary component-carrier tape 100, with the
apertures 1 12 being closed by the top cover layer 116, thereby
providing an enclosure for components 114. Advancement of the
temporary component-carrier tape 100 may be controlled by a
sprocketed advancement wheel 180 which engages the advancement
wheel or indexing holes 120 in the device-retaining layer 102. The
temporary component-carrier tape 100 is ready to be stored and
transported after it is wound around a hub 182 or hub 182 of a reel
183 to produce the loaded roll 184.
[0055] Referring again to FIGS. 2 and 7, a method for fabricating
temporary component-carrier tape 100 may include the film 154
passing between the temperature-controlled cylinder rollers 158,
where the top roller may include at least one protrusion that
presses receptacles 112 not completely through the softened film
154. Next, if the film 154 is not extruded to the desired width,
the film 154 may proceed to the cutter 160, where the film 154 is
cut to a predetermined width. The advancement wheel holes 120 may
be punched into the film 154 by punch press 166, producing the
device-retaining layer 102 which may then be rolled onto supply
roll 164. Alternatively, the advancement wheel holes 120 may not be
punched prior to winding onto the supply roll 164 as shown in FIG.
8. Instead, the advancement wheel holes 120 may be punched as the
film 154 is unwound from supply roll 164, as illustrated in FIG. 7.
Since the receptacles 112 do not penetrate far enough into the
device-retaining layer 102 to include openings in the bottom
surface 106 , the device-retaining layer 102 may proceed to the
component loader 174 where components 114 are placed in the
receptacles 1 12 , thereby omitting the first set of platens 168,
the bottom cover layer 118 and supply roll 170. After the
components 114 have been loaded, the device-retaining layer 102
passes between platens 176 where the top cover layer 116, supplied
by supply roll 178, is secured to the top surface 104 of the
device-retaining layer 102 , thereby encasing components 114 within
receptacles 112 . The platens 176 may be heated to allow the top
cover layer 116 to adhere to the top surface 104, or,
alternatively, the platens may be replaced with laminated rollers
which may be used to apply pressure to adhere the top cover layer
116 to the top surface 104 where pressure-sensitive adhesive has
been applied therebetween. Advancement of the temporary
component-carrier tape 100 may be controlled by a sprocketed
advancement wheel 180 which engages the advancement wheel holes 120
in the device-retaining layer 102. The temporary component-carrier
tape 100 may then be wound around a hub 182 or hub 182 of a reel
183 to produce loaded roll 184.
[0056] The weakened regions 124, 128, 136, 142, 146 (FIGS. 1-6),
located between adjacent pairs of apertures 112 and receptacles
112, may be formed at a number of places in the process of making
temporary component-carrier tapes 100 and 100 . The weakened
regions 124, 128, 136, 142, 146 may be formed by cutting (e.g.,
with a saw or blade), etching, punching, or creasing one or more of
the top cover layer 116, the device-retaining layer 102, 102 and
the bottom cover layer 118. Location A in FIGS. 7 and 8 illustrates
that a weakened region 124 may be punched in the device-retaining
layer 102, 102 at the point where the punch press 166 punches
apertures 112 and the advancement wheel holes 120. Other ways to
form the weakened region 124 at location A include cutting or
creasing. Location B in FIG. 8 illustrates that the weakened
regions 124 may be formed in the device-retaining layer 102, 102
just after the device-retaining layer 102, 102 emerges from the
punch press 166. A variety of techniques may be used to form the
weakened region 124 at location B, including punching, cutting,
creasing and other suitable techniques. Since the weakened region
124 may also be formed in the bottom cover layer 118, location C
indicates a point where a weakened region 124 may be generated in
the bottom cover layer 118 before it is connected to the bottom
surface 106 and may be aligned with the weakened region in the
device-retaining layer 102, 102 . A weakened region 124 that
includes both the device-retaining layer 102, 102 and the bottom
cover layer 118 may also be generated just after the bottom cover
layer 118 has been attached to the bottom surface 106 at location
D. Location E, like location C for the bottom cover layer 118,
illustrates that the weakened region 124 may be formed in the top
cover layer 116 prior to attaching this layer to the top surface
104 of the device-retaining layer 102, 102 . Again, any suitable
process may be used at locations C, D, and E to form weakened
region 124. Weakened regions 124 may be formed in either the top
cover layer 116 or the bottom cover layer 118 at the time of
assembly or subsequent thereto, prior to winding of the temporary
component-carrier tapes 100 and 100 onto the hub 182 or reel 183.
For both the top cover layer 116 and the bottom cover layer 118,
weakened regions in both of these layers may be formed at the time
of manufacturing or elsewhere prior to being wound around the
supply rolls 178 and 170, respectively. They may then be included
in the process depicted in FIG. 8 by aligning the weakened regions
in the layers so that they overlap when the surfaces are connected.
Location F shows that the weakened region 124 may be formed in
completed temporary component-carrier tapes 100 and 100 prior to
winding them onto loaded roll 184.
[0057] Extracting components from the temporary component-carrier
tapes 100 and 100 may include transporting the loaded roll 184 to a
location where the components 114 may be removed by automated
assembly equipment having a sprocketed advancement mechanism that
engages the advancement wheel or indexing holes 120 of a temporary
component-carrier tape 100, 100 and advances it for manual removal
or automated removal, such as by pick-and-place robotic equipment,
of the components. FIG. 9 illustrates that loaded roll 184 may be
placed in position I or II to remove either the top cover layer 116
or the bottom cover layer 118 of the temporary component-carrier
tapes 100. The temporary component-carrier tape 100, 100 is unwound
from the loaded roll 184 by engaging the advancement wheel holes
120 of the device-retainer tape 102, 102 with a sprocketed
advancement wheel 188 of an advancement mechanism. The temporary
component-carrier tape 100, 100 may then be advanced to the
stripper assembly 190 where the cover layer 116 or 118 is removed
from the device-retaining layer 102, opening the closed apertures
112 or receptacles 112 , and the cover layer 116 or 118 is wound
around the hub of a take-up reel 192. The open apertures 112 or
receptacles 112 approach the pick-and-place robotic equipment where
a vacuum pick-up quill 194 removes the components from the open
apertures 112 or receptacles 112 and places them at a particular
place on a carrier substrate or other electronic device
component.
[0058] It will be evident to those in the art that various changes
and modifications may be made in the apparatus, methods, design and
use as disclosed herein without departing from the spirit and scope
of the invention as defined in the following claims.
* * * * *