U.S. patent application number 10/609249 was filed with the patent office on 2004-01-08 for microactuator device with a countermeasure for particles on a cut face thereof.
This patent application is currently assigned to NEC TOKIN CERAMICS CORPORATION. Invention is credited to Horiguchi, Tadahiko, Kurano, Masayuki.
Application Number | 20040004414 10/609249 |
Document ID | / |
Family ID | 18727879 |
Filed Date | 2004-01-08 |
United States Patent
Application |
20040004414 |
Kind Code |
A1 |
Kurano, Masayuki ; et
al. |
January 8, 2004 |
Microactuator device with a countermeasure for particles on a cut
face thereof
Abstract
In a microactuator device (2) having a cut face formed by
cutting or splitting, the cut face is subjected to anti-release
treatment for preventing release of particles produced by cutting.
The microactuator device may have a multilayer structure including
a plurality of piezoelectric elements and a plurality of internal
electrodes alternately laminated. In this case, the multilayer
structure has the above-mentioned cut face. It is preferable that
the microactuator device is mounted between a base plate (3) to be
fixed and a support spring (5) for supporting a head (4), and that
the microactuator device and portions of the base plate and the
support spring which are adjacent to the microactuator device are
collectively coated with a coating film.
Inventors: |
Kurano, Masayuki; (Hyogo,
JP) ; Horiguchi, Tadahiko; (Sendai-shi, JP) |
Correspondence
Address: |
FRISHAUF, HOLTZ, GOODMAN & CHICK, PC
767 THIRD AVENUE
25TH FLOOR
NEW YORK
NY
10017-2023
US
|
Assignee: |
NEC TOKIN CERAMICS
CORPORATION
Hyogo
JP
NEC TOKIN CORPORATION
Sendai-shi
JP
|
Family ID: |
18727879 |
Appl. No.: |
10/609249 |
Filed: |
June 26, 2003 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10609249 |
Jun 26, 2003 |
|
|
|
09921319 |
Aug 2, 2001 |
|
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|
6617762 |
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Current U.S.
Class: |
310/328 ;
G9B/5.193 |
Current CPC
Class: |
H01L 41/0533 20130101;
H01L 41/338 20130101; H01L 41/083 20130101; G11B 5/5552
20130101 |
Class at
Publication: |
310/328 |
International
Class: |
H02N 002/00 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 3, 2000 |
JP |
235707/2000 |
Claims
What is claimed is:
1. A microactuator device having a cut face formed by cutting,
wherein said cut face is subjected to anti-release treatment for
preventing release of particles produced by cutting.
2. A microactuator device according to claim 1, wherein said
anti-release treatment is carried out by baking an entire surface
of said microactuator device including said cut face to form a
sintered image after cutting into a final product shape.
3. A microactuator device according to claim 1, wherein said
anti-release treatment is carried out by polishing an entire
surface of said microactuator device including said cut face formed
by cutting after baking.
4. A microactuator device according to claim 1, wherein said
anti-release treatment is carried out by reheating an entire
surface of said microactuator device including said cut face formed
by cutting after baking to thereby refix said particles to said
entire surface.
5. A microactuator device according to claim 1, wherein said
anti-release treatment is carried out by exclusively heating said
cut face formed by cutting after baking to thereby refix said
particles to said cut face.
6. A microactuator device according to claim 2, wherein said
anti-release treatment is followed by washing of an entire surface
of said microactuator device including said cut face to remove said
particles.
7. A microactuator device according to claim 3, wherein said
anti-release treatment is followed by washing of an entire surface
of said microactuator device including said cut face to remove said
particles.
8. A microactuator device according to claim 4, wherein said
anti-release treatment is followed by washing of an entire surface
of said microactuator device including said cut face to remove said
particles.
9. A microactuator device according to claim 5, wherein said
anti-release treatment is followed by washing of an entire surface
of said microactuator device including said cut face to remove said
particles.
10. A microactuator device according to claim 1, wherein said
anti-release treatment is carried out by coating said cut face
formed by cutting after baking with a glass to avoid exposure of
said cut face.
11. A microactuator device according to claim 1, wherein said
anti-release treatment is carried out by coating an entire surface
of said microactuator device including said cut face formed by
cutting after baking with a flexible resin material which hardly
suppresses the displacement of said microactuator device.
12. A microactuator device according to claim 1, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which has said cut
face.
13. A microactuator device according to claim 2, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which has said cut
face.
14. A microactuator device according to claim 3, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which has said cut
face.
15. A microactuator device according to claim 4, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which has said cut
face.
16. A microactuator device according to claim 5, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which has said cut
face.
17. A microactuator device according to claim 7, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which has said cut
face.
18. A microactuator device according to claim 8, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which has said cut
face.
19. A microactuator device according to claim 6, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which includes said
cut face.
20. A microactuator device according to claim 7, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which includes said
cut face.
21. A microactuator device according to claim 8, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which includes said
cut face.
22. A microactuator device according to claim 9, wherein said
microactuator device comprises a multilayer structure which
includes a plurality of piezoelectric elements and a plurality of
internal electrodes alternately laminated and which includes said
cut face.
Description
[0001] This is a Division of application Ser. No. 09/921,319, filed
Aug. 2, 2001.
BACKGROUND OF THE INVENTION
[0002] This invention relates to a microactuator device comprising
a multilayer structure including a plurality of piezoelectric
elements and a plurality of internal electrodes alternately
laminated and to a technique utilizing the microactuator
device.
[0003] In various active apparatuses known in the art, use has been
made of a microactuator device comprising a multilayer structure
including a plurality of thin planar piezoelectric elements and a
plurality of thin planar internal electrodes alternately
laminated.
[0004] In the above-mentioned microactuator device, the internal
electrodes are alternately exposed on opposite side surfaces of the
multilayer structure to be connected to a pair of external
electrodes formed on the opposite side surfaces, respectively.
Typically, the internal electrodes and the external electrodes are
formed by sputtering. After the external electrodes are formed on
the multilayer structure, sintering or baking is carried out.
[0005] In the case where the microactuator device is desired to
have a small size, a large-sized structure is preliminarily
prepared, baked, and then cut along a plane perpendicular to the
external electrodes to obtain the microactuator device having a
predetermined size. Taking into account the improvement in masking
efficiency upon sputtering and the reduction in working cost also,
it is advantageous to cut the large-sized structure into the
predetermined size after baking.
[0006] Therefore, the microactuator device of the type is often
used in a cut or split state. In this event, the microactuator
device inevitably has a cut face in a split-faced condition.
Herein, the term "split-faced" means that the cut face is left as
it is without being treated by a particular manner.
[0007] In the microactuator device mentioned above, small cracks or
chips may possibly be caused during cutting. In this event, it is
inevitable that free particles or potential free particles
comprising a piezoelectric material or an electrode material are
adhered to and exposed on the cut face in the split-faced
condition. Therefore, when the microactuator device is attached to
the active apparatus, those particles may be detached and dropped
off from the cut face due to vibration or extension/contraction of
the active apparatus. The particles detached and dropped off may
inhibit a predetermined operation of the active apparatus or damage
an article or object used in the active apparatus.
SUMMARY OF THE INVENTION
[0008] It is therefore an object of this invention to provide a
microactuator device with a countermeasure for particles on a cut
face formed by cutting or splitting.
[0009] It is another object of this invention to provide a head
supporting device capable of preventing release of particles from
the microactuator device.
[0010] It is still another object of this invention to provide a
disk recording apparatus using the above-mentioned microactuator
device.
[0011] Other objects of the present invention will become clear as
the description proceeds.
[0012] According to the present invention, there is provided a
microactuator device having a cut face formed by cutting, wherein
the cut face is subjected to anti-release treatment for preventing
release of particles produced by cutting.
[0013] According to the present inv ntion, there is provided a h ad
supporting arrangement which comprises a bas plate to be fixed, a
support spring for supporting a head, and a microactuator d vice
connected to the base plate and the support spring, the
microactuator device being coated with a coating film collectively
with portions of the base plate and the support spring which are
adjacent to the microactuator device.
[0014] According to the present invention, there is provided a head
supporting arrangement which comprises a base plate to be fixed, a
support spring for supporting a head, and a plurality of
microactuator devices connected between the base plate and the
support spring, the microactuator devices being collectively
covered with a coating film.
[0015] According to the present invention, there is provided a disk
recording apparatus which comprises the head supporting arrangement
according to any one of the above-mentioned head supporting
arrangements, and a head supported by the support spring of the
head supporting arrangement to access to a rotary disk, the
microactuator device of the head supporting arrangement carrying
out fine adjustment of a positional relationship of the head with
respect to the disk,
BRIEF DESCRIPTION OF THE DRAWING
[0016] FIG. 1 is a plan view showing a characteristic part of a
head supporting arrangement for use in a disk recording apparatus
according to one embodiment of this invention;
[0017] FIG. 2 is a perspective view showing a basic structure of a
microactuator device of the head supporting arrangement illustrated
in FIG. 1;
[0018] FIG. 3 is a photomicrograph of a cut face of the
microactuator device which is not subjected to anti-release
treatment;
[0019] FIG. 4 is an enlarged photomicrograph of a part of the cut
face shown in FIG. 3;
[0020] FIG. 5 is an enlarged photomicrograph of a piezoelectric
ceramics portion of the cut face shown in FIG. 3;
[0021] FIG. 6 is a photomicrograph of the cut face shown in FIG. 3
after the microactuator device is used or operated;
[0022] FIG. 7 is a photomicrograph of the cut face of the
microactuator device after subjected to an example of the
anti-release treatment;
[0023] FIG. 8 is a photomicrograph of the cut face of the
microactuator device after subjected to another example of the
anti-release treatment;
[0024] FIG. 9 is a perspective view of a characteristic part of a
head supporting arrangement for use in a disk recording apparatus
according to another embodiment;
[0025] FIG. 10 is an enlarged sectional view of a characteristic
part of the head supporting arrangement in FIG. 9;
[0026] FIG. 11 is a plan view for describing a fixing structure of
the microactuator device in the head supporting arrangement
illustrated in FIG. 9;
[0027] FIG. 12 is a sectional view taken along a line XII-XII in
FIG. 11; and
[0028] FIG. 13 is a plan view for describing another fixing
structure of the microactuator device in the head supporting
arrangement illustrated in FIG. 9.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0029] Now, several embodiments of this invention will be described
in d tail with reference to the drawing.
[0030] Referring to FIG. 1, a head supporting arrangement according
to on embodiment of this invention is for use in a disk recording
apparatus. The head supporting arrangement comprises a base plate 3
to be fixed via a fixing hole 3a, a support spring 5 as a component
separate from the base plate 3, and two microactuator devices 2
connecting the support spring 5 to the base plate 3. Each of the
microactuator devices 2 is placed on the base plate 3 and the
support spring 5 in a bridged condition and fixed to the base plate
3 and the support spring 5 by the us of an adhesive or th like. As
a cons quence, a combination of the base plate 3, the support
spring 5, and the microactuator devices 2 defines a through hole 6
b tween the microactuator devices 2. At an end of the support
spring 5, a head 4 is mounted by bonding or the like. The head 4
serves to access to a recording medium such as a hard disk to carry
out reading and writing operations.
[0031] Following a predetermined operation of at least one of the
microactuator devices 2, the magnetic head 4 is finely displaced in
a plane parallel to the sheet of the drawing. It is also possible
to finely displace the magnetic head 4 in a direction perpendicular
to the recording medium or to the sheet of the drawing. Thus, the
magnetic head 4 can be finely adjusted in position.
[0032] Referring to FIG. 2, each of the microactuator device 2
comprises a multilayer structure including a plurality of thin
planar piezoelectric elements 7 of a piezoelectric ceramics
material and a plurality of thin planar internal electrodes 8
alternately stacked so that the internal electrodes 8 alternately
extend to opposite side surfaces of the multilayer structure. On
the opposit side surfaces of the multilayer structure, a pair of
external electrodes 9 are respectively arranged to be connected to
end portions of the internal electrod s 8 exposed as parallel
lines. Each of the external electrodes 9 partially extends to
opposite surfaces, namely, upper and lower surfaces of the
multilayer structure in a layering direction. The microactuator
device 2 is cut into a predetermined size (corresponding to a final
product shape in the following description) and used in a cut or
split state. When the external electrodes 9 are applied with a
controlled voltage, the microactuator device 2 carries out a
predetermined operation in accordance with a well-known
principle.
[0033] In the microactuator device 2, a cut face formed by cutting
is subjected to anti-release treatment for preventing adhesion and
exposure of free particl s of a piezoelectric material and an
electrode mat rial produced during cutting and for preventing
release of potential free particles.
[0034] For example, the above-m ntioned anti-releas treatment is
carried out by baking an entire surface of the microactuator device
2 including the cut face to form a sintered surface after cutting
into the final product shape. Alternatively, the entire surface
including the cut face formed by cutting after baking may be
polished. Alternatively, the entire surface including the cut face
formed by cutting after baking may be reheated to thereby refix the
free particles and the potential free particles to the entire
surface. Alternatively, the cut face formed by cutting after baking
may be exclusively heated to thereby refix the free particles and
the potential free particles to the cut face. For example, only the
cut face formed by cutting after baking is heated by las r
irradiation to thereby refix material particles to the cut face. In
any event, the above-mentioned anti-release treatment is preferably
followed by washing of the entire surface including the cut face in
order to remove the free particles. Whether or not the anti-release
treatment has been performed can easily be discriminated by visual
observation through a microscope.
[0035] As another anti-release treatment, the cut face formed by
cutting after baking is coated with a glass to prevent the cut face
from being exposed. Alternatively, the entire surface including the
cut face formed by cutting after baking is coated with a flexible
resin material which hardly suppresses th displacement of the
microactuator device 2.
[0036] By the anti-release treatment, the free particles are not
adhered to or exposed on the cut face or the cut face is completely
coated. Therefore, ven if the microactuator device is used for
driving the head supporting arrangement, the free particles and the
potential free particles are not released and a finished condition
of the surface of a product or the microactuator device upon
manufacture is improved.
[0037] When the microactuator devices 2 for driving are attached to
the support spring 5 to form the head supporting arrangem nt,
anti-rel ase strengthening treatment may be carried out.
Specifically, an entire area of the head supporting arrangement
from the base plate 3 to the end of the support spring 5 where the
head 4 is bonded is coated with a coating film made of a resin
material or the like. With this structure, it is possible to
completely prevent the free particles and the potential free
particles from being released from the cut face. Thus, those
problems causing a damage of the surface of the recording medium
can be eliminated more reliably.
[0038] The microactuator device 2 illustrated in FIG. 2 may be
produced in the following manner. A piezoelectric ceramics green
sheet is prepared. By the use of a paste containing 70% Ag and 30%
Pd, an internal electrode pattern is printed on the piezoelectric
ceramics green sheet by screen printing. On the piezoelectric
ceramics green sheet with the internal electrode pattern, another
piezoelectric ceramics green sheet is placed and a similar pattern
is printed thereon. Subsequently, the similar operation is repeated
to obtain the multilayer structure. On the multilayer structure,
the electrode material such as gold is deposited by sputtering to
form the external electrodes. Thereafter, the multilayer structure
is cut into a predetermined shape and a predetermined size.
[0039] Referring to FIG. 3, the microactuator device without the
anti-release treatment is observed by a scanning electron
microscope (SEM) in an observing direction M illustrated in FIG. 2.
The microactuator device is obtained by breaking the multilayer
structure after baking. As seen from FIG. 3, the free particles and
the potential free particles are exposed on the broken face of the
microactuator device 2 at the piezoelectric element 7 and the
internal electrode 8. Thus, on the broken face obtained by breaking
the multilayer structure after baking, not a small amount of the
free particles and the potential free particles are present. This
means that a finished condition of the surfac of th microactuator
device is not exc llent.
[0040] Referring to FIG. 4, a part of th cut face of the
microactuator devic 2 illustrated in FIG. 3 is enlarged. As seen
from FIG. 4, it is confirmed that the free particles depicted by 11
are locally present on the microactuator device. Such free
particles 11 may be detached from the microactuator device as
released particles.
[0041] Referring to FIG. 5, only a part of the cut face of the
microactuator device 2 illustrated in FIG. 3 at the piezoelectric
ceramics element 7 is enlarged. As seen from FIG. 5, it is
confirmed that the potential free particles 12 are present on the
piezoelectric ceramics element of the microactuator device. During
the operation of the microactuator device 2, the potential free
particles 12 may be gradually detached as the released particles
with the lapse of time.
[0042] Referring to FIG. 6, the head supporting arrangement
comprising the microactuator device 2 illustrated in FIG. 3 is
driven (used) for a predetermined time period and then the broken
face of the microactuator device 2 is observed by the scanning
electron microscope in the observing direction M shown in FIG. 2.
As seen from FIG. 6, it is confirmed that a large number of the
free particles 11 and a large number of potential free particles 12
are confirmed on the microactuator device 2 at the piezoelectric
ceramics elements 7 and the internal electrodes 8 after the
microactuator device 2 is used. From this, it is understood that,
if the microactuator device 2 is produced by breaking the
multilayer structure after baking and if the microactuator device 2
is used without any treatment, a large number of the free particles
11 and a large number of the potential free particles 12 are
present on the broken face and may damage the surface of the
recording medium as the released particles.
[0043] Referring to FIG. 7, the microactuator device 2 subjected to
a first example of the anti-release treatment is observed by the
scanning electron microscope in the observing direction M shown in
FIG. 2. The microactuator device 2 is obtained by partially
breaking the multilayer structure after baking, cutting the
multilayer structure into the predetermined shape and the
predetermined size, and carrying out the anti-release treatment of
the entire surface including the cut face by polishing. As seen
from FIG. 7, the free particles and the potential free particles
are not exposed on the cut face of the microactuator device 2 at
the piezoelectric ceramics elements 7 and the internal electrodes
8. Thus, in case where the microactuator device 2 is formed by
partially breaking the multilayer structure after baking, cutting
the multilayer structure, and then polishing the multilayer
structure, no substantial amount of the free particles and the
potential free particles are present on the cut face and the
finished condition on the surface of the microactuator device 2 is
excell nt. The finished condition on the surface of the
microactuator device 2 can be improved, for example, by polishing
the entire surface of the device by the use of a barrel.
[0044] Referring to FIG. 8, the microactuator device 2 subjected to
a second example of the anti-release treatment is observed by the
scanning electron microscope in the observing direction M shown in
FIG. 2. The microactuator device 2 is obtained by partially
breaking the multilayer structure, cutting the multilayer structure
into the predetermined shape and the predetermined size, and
carrying out the anti-release treatment by baking the entire
surface including the cut face to form a sintered surface. In FIG.
8, only a part of the cut face of the microactuator device 2 at the
piezoelectric ceramics element 7 is enlarged. As seen from FIG. 8,
it is understood that, 1f the entire surface of th microactuator
device 2 is baked as the sintered surface after the multilayer
structure is cut into the final product shape and if cutting is no
longer carried out after the microactuator device 2 Is finished by
baking, the free particles and the potential free particles are not
exposed. This is because, as generally known, ceramics particles on
the sintered surface of the piezoelectric elements 7 of a ceramics
material react with on another by sintering to be brought into a
stabl condition. Comparison between the cut face at the
piezoelectric ceramics element 7 in FIG. 5 and the sintered surface
in FIG. 8 clearly shows the difference in ceramics surface. Thus,
it is easily discriminated whether or not the anti-release
treatment by baking the entire surface of the device as the
sintered surface is applied.
[0045] Referring to FIG. 9, description will be made of a head
supporting arrangement for use in a disk recording apparatus
according to another embodiment of this invention. Similar parts
are designated by like reference numerals and will not be described
any longer.
[0046] As illustrated in FIG. 9, the head supporting arrangement
has a two-stage positioning mechanism which will presently be
described in detail. The head supporting arrangement comprises a
suspension having one end as a fixed or supported end and the other
end as a free end where a head 4 is mounted. At a first stage, the
suspension is moved to position the head 4. At a second stage, the
relationship in horizontal position between a recording medium (not
shown) such as a rotary disk and the head 4 is finely adjusted by
two microactuator devices 2. In the suspension, a support spring 5
is elastically connected to a base plate 3 through a narrow connect
spring 13. The base plate 3, the support spring 5, and the connect
spring 13 can be formed integral with one another. The head 4 is
mounted at an end of the support spring 5.
[0047] On both sides of the connect spring 13, the microactuator
devices 2 described in conjunction with FIG. 2 are arranged. A
combination of the bas plate 3, the support spring 5, the connect
spring 13, and the microactuator devices 2 forms the
above-mentioned suspension.
[0048] Referring to FIG. 10, each of the microactuator devices 2 is
located n the base plat 3 and the support spring 5 in a bridging
condition and is bond d to each of the base plate 3 and the support
spring 5 by the use of an adhesive 14. Preferably, th adhesive 14
exactly transmits the displacement of the microactuator devices 2
to the base plate 3 and the support spring 5 without attenuation.
As the adhesive 14, use may be made of EpiFine 4616 Series
manufactured by Fine Polymers Corporation. Thus, following a
predetermined operation of at least one of the microactuator
devices 2, the magnetic head 4 is finely displaced in a direction
depicted by a double-headed arrow 15 in FIG. 9 typically in a plane
parallel to the recording medium. It is also possible to finely
displace the magnetic head 4 in a direction perpendicular to the
recording medium. Thus, the position of the magnetic head 4 can be
finely adjusted.
[0049] Furthermore, the microactuator devices 2 are coated with a
coating film 16 collectively with portions of the base plate 3 and
the support spring 5 which are adjacent to the microactuator
devices 2. For example, the coating film 16 can be obtained by
vapor deposition of a coating material "diX (Registered Trademark)"
manufactured by Daisan Kasei, Ltd. Thus, a thin and compact coating
film of about 10 .mu.m thick can be formed even if the
microactuator devices 2, the base plate 3, and the support spring 5
have uneven surfaces.
[0050] The coating film 16 serves to prevent fall of the released
particles from the microactuator devices 2. Therefore, the
recording medium used in the disk recording apparatus is prevented
from being damaged by the released particles.
[0051] The coating film 16 also serves to prevent short-circuiting
between internal electrodes due to dew formation or the like. This
reduces the possibility of suppressing inherent functions of the
microactuator devices 2.
[0052] Referring to FIGS. 11 and 12. In addition to FIG. 9,
description will be made of a specific example of a fixing
structure of the microactuator devices 2. In FIG. 11, one of the
microactuator devices 12 is shown by solid lines and the other is
shown by broken lines.
[0053] In order to connect th microactuator devices 2 between the
base plate 3 and th support spring 5, a flexible substrate 17
having an H shape in plan view is used. The flexible substrate 17
is provided with a plurality of circuit patterns 18. Each of the
circuit patterns 18 has a device terminal 21 to b connected to the
microactuator device 2 and a circuit terminal 22 to be connected to
a drive circuit (not shown). The circuit terminals 22 are
concentrated and therefore easily connected to the drive
circuit.
[0054] The microactuator devices 2 are mounted on the flexible
substrate 17 with their external electrodes 9 electrically
connected to the device terminals 21 by the use of a conductive
adhesive 23. In this state, the two microactuator devices 2 and the
flexible substrate 17 are coated with a coating film. For example,
the coating film can be obtained by vapor deposition of the coating
material diX (Registered Trademark) manufactured by Daisan Kasei,
Ltd.
[0055] The coating film serves to prevent fall of the released
particles from the microactuator devices 2. Therefore, the
recording medium used in the disk recording apparatus is prevented
from being damaged by the released particles. The coating film also
serves to prevent short-circuiting between the internal electrodes
due to the dew formation or the like. This reduces the possibility
of suppressing the inherent functions of the microactuator devices
2.
[0056] Referring to FIG. 13, description will be made of another
specific example of the fixing structure of the microactuator
devices 2. In this example, the two microactuator devices 2 are
connected at portions where a resin coating agent is hardened or
cured without using the flexible substrate.
[0057] At first, the two microactuator devices 2 are arranged in
parallel. A resin coating agent of an ultraviolet-setting type is
applied throughout the entirety. Thereafter, ultraviolet rays are
irradiated along the microactuator devices 2. At this time, the
ultraviolet rays are not irradiated to those portions corresponding
to the external electrodes 9. Subsequently, an uncured portion of
the resin coating agent is washed off to form a r sin coating
portion 24. In this manner, the microactuator devices 2 can be
coated with a coating film. The two microactuator devices 2 are
connected by a bridging portion 25 formed by the resin coating
agent applied and cured.
[0058] The resin coating portion 24 may be formed in the following
manner. The microactuator devices 2 has nodal points as vibration
nodes of piezoelectric vibration. The nodal points are bonded and
fixed by an elastic bar. A part of each external electrode 9 is
exposed and a remaining part is masked. Thereafter, picking and
holding the elastic bar, the microactuator device is dipped in a
resin bath to apply the resin to the microactuator devices 2.
Thereafter, the resin is cured. In this manner also, the
microactuator devices 2 are coated with the coating film.
[0059] The disk recording apparatus may be a magnetic disk
apparatus for recording and reproducing data into and from a
magnetic disk. In this event, the head is a magnetic head.
[0060] As described above, according to this invention, the
microactuator device with the countermeasure for the particles on
the cut face formed by cutting (or splitting), the head supporting
arrangement using the microactuator device, and the disk recording
apparatus using the microactuator device can b provided.
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