U.S. patent application number 10/379372 was filed with the patent office on 2003-11-27 for thermal heating board.
Invention is credited to Muir, Morgan.
Application Number | 20030218075 10/379372 |
Document ID | / |
Family ID | 26808309 |
Filed Date | 2003-11-27 |
United States Patent
Application |
20030218075 |
Kind Code |
A1 |
Muir, Morgan |
November 27, 2003 |
Thermal heating board
Abstract
An improved hydronic radiant heating system comprising a
nonstructural board having a recess formed in one surface of said
board, a pipe located within said recess, and, if desired, a film
of metal covering said surface of said board and having a thickness
proportional to the thermal properties of said board to provide
desired overall thermal characteristics for said heating
system.
Inventors: |
Muir, Morgan; (Berkley,
CA) |
Correspondence
Address: |
GRAYBEAL, JACKSON, HALEY LLP
155 - 108TH AVENUE NE
SUITE 350
BELLEVUE
WA
98004-5901
US
|
Family ID: |
26808309 |
Appl. No.: |
10/379372 |
Filed: |
March 3, 2003 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10379372 |
Mar 3, 2003 |
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09451324 |
Nov 30, 1999 |
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60110693 |
Dec 3, 1998 |
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Current U.S.
Class: |
237/69 |
Current CPC
Class: |
F24D 3/148 20130101;
Y02B 30/24 20130101; F24D 3/14 20130101; Y02B 30/00 20130101 |
Class at
Publication: |
237/69 |
International
Class: |
F24D 005/10; F24H
009/06; F24D 019/02 |
Claims
What is claimed is:
1. A hydronic radiant heating system comprising: a nonstructural
supporting board mountable on a subfloor having at least one
undercut recess formed in one surface of said supporting board, and
a pipe releasably retained [located] within said recess.
2. The heating system of claim 1 wherein: said supporting board is
formed of thermally conductive material.
3. The heating system of claim 1 wherein: said supporting board is
formed of a wood.
4. The heating system of claim 1 wherein: said supporting board is
formed of plywood.
5. The heating system of claim 1 wherein: said supporting board is
formed of fiberboard.
6. The heating system of claim 1 wherein: said supporting board is
formed of metal.
7. The heating system of claim 1 wherein: said supporting board is
formed of recycled material.
8 The heating system of claim 1 wherein: said recess is formed in
the upper surface of said supporting board.
9. The heating system of claim 1 further comprising: a coat of
thermally conductive material applied to said surface of said
supporting board.
10 The heating system of claim 8 wherein: said thermally conductive
coat is formed by spraying molten metal onto said surface.
11. The heating system of claim 1 wherein: said
thermally-conductive coat is formed by applying at least one ply of
metal foil to said surface.
12. The heating system of claim 1 wherein: said member is applied
of a subfloor.
13. The heating system of claim 1 wherein: said member is applied
to an existing floor.
14. The heating system of claim 1 wherein: said member is applied
to a wall.
15. The heating system of claim 1 wherein: said member is applied
to a ceiling.
16. The heating system of claim 1 wherein: the thickness of said
thermally-conductive coat is varied in pro-portion to the thermal
properties of said supporting board.
16. The heating system of claim 1 wherein: a pair of supporting
members are provided, an upper one formed with a recess and the
other having no recess.
17. The heating system of claim 16 further comprising: a layer of
thermally conductive material interposed between said board.
18. The heating system of claim 1 further comprising: a layer of
metal applied to overlie said recess, said metal layer being
subsequently slit loingitudinally of said recess and having the
adjacent portions of said metal layer pressed into said recess.
19. The heating system of claim 1 further comprising: said recess
extending completely through said board, a second board underlying
said recessed board, and a layer of metal foil interposed between
said boards.
20. A hydronic radiant heating system comprising: a nonstructural
supporting board mountable on a subfloor having at least one recess
formed in one surface of said supporting board, and a pipe
frictionally retained within said recess.
21. The heating system of claim 20 wherein: said supporting board
is formed of thermally conductive material.
22. The heating system of claim 20 wherein: said supporting board
is formed of a wood.
23. The heating system of claim 20 wherein: said supporting board
is formed of plywood.
24. The heating system of claim 20 wherein: said supporting board
is formed of fiberboard.
25. The heating system of claim 20 wherein: said supporting board
is formed of recycled material.
26 The heating system of claim 20 wherein: said recess is formed in
the upper surface of said supporting board.
27. The heating system of claim 20 further comprising: a coat of
thermally conductive material applied to said surface of said
supporting board.
28. The heating system of claim 27 wherein: said thermally
conductive coat is formed by spraying molten metal onto said
surface.
29. The heating system of claim 20 wherein: said
thermally-conductive coat is formed by applying at least one ply of
metal foil to said surface.
30. The heating system of claim 1 wherein: said member is applied
of a subfloor.
31. The heating system of claim 20 wherein: said member is applied
to an existing floor.
32. The heating system of claim 20 wherein: said member is applied
to a wall.
33. The heating system of claim 20 wherein: said member is applied
to a ceiling.
34. The heating system of claim 20 wherein: the thickness of said
thermally-conductive coat is varied in pro-portion to the thermal
properties of said supporting board.
34. The heating system of claim 20 wherein: a pair of supporting
members are provided, an upper one formed with a recess and the
other having no recess.
35. The heating system of claim 34 further comprising: a layer of
thermally conductive material interposed between said board.
36. The heating system of claim 20 further comprising: a layer of
metal applied to overlie said recess, said metal layer being
subsequently slit loingitudinally of said recess and having the
adjacent portions of said metal layer pressed into said recess.
37. The heating system of claim 20 further comprising: said recess
extending completely through said board, a second board underlying
said recessed board, and a layer of metal foil interposed between
said boards.
Description
RELATED CASES
[0001] This invention is descnbed in my copending Provisional
Patent Application Ser. 60/110,693, filed Dec. 3, 1998 and now
expired and Utility Patent Application, Ser. No. 09/451,324, filed
Nov. 30, 1999 and now.
FIELD OF INVENTION
[0002] This invention relates to construction material and is
particularly directed to improved thermal heating modules for
application of hydronic radiant heating in new and existing
construction.
PRIOR ART
[0003] The concept of heating an area by heating the floor surface
has been known since Roman times. In more recent times, such
systems were formed by metal or plastic pipes embedded in concrete
slabs or attached under a subfloor or sandwiched in between layers
of flooring thereto by various means and by laying flooring or
subflooring on top of these. More recently it has been proposed to
have combinations of boards and pipes in various configurations
installed either above or below a subfloor as well as integrated
structural subfloor svstems with an integral metal plate However,
these systems have been found to be relatively inefficient in
transferring heat to desired area or have been too expensive to
install or have been dimensionally too thick to be usefull in
retrofit applications or have had sound transmission problems due
to thermal contraction 1 and expansion of poorly connected
component parts, or use uncommon building practices and sequencing
of installation and have been somewhat useful to new construction.
Also, inserting the pipe into the grooves of the prior art boards
has been unsatisfactory. Frequently, the pipe would come loose and
pop out of place, causing problems with laying overflooring and the
like. Thus, none of the prior art thermal heating boards have been
entirely satisfactory.
BRIEF SUMMARY AND OBJECTS OF INVENTION
[0004] These disadvantages of the prior art are overcome with the
present invention and an improved hydronic radiant heating system
is provided which is simple and inexpensive to install and which
can be applied equally well to new or existing construction and to
floors, walls or ceilings, while providing efficient heating to the
desired area and ensuring that the pipes are retained within the
system.
[0005] These advantages of the present invention are preferably
attained by providing an improved hydronic radiant heating system
comprising a non-structural board formed of thermally conductive
material and having at least one undercut recess formed in the
upper surface of said board, a pipe releasably ratained [located]
within said undercut recess, and a film of metal covering the upper
surface of said board.
[0006] Accordingly, it is an object of the present invention to
provide an improved hydronic radiant heating system.
[0007] Another object of the present invention is to provide an
improved hydronic radiant heating system which is simple and
inexpensive to install.
[0008] An additional object of the present invention is to provide
an improved hydronic radiant heating system which can be applied
equally well to new or existing construction, while providing
efficient heating to the desired area.
[0009] A further object of the present invention is to provide an
improved hydronic radiant heating system comprising a simple board
rather than a complex assembly of parts.
[0010] An additional object of the present invention is to provide
an improved hydronic radiant heating system which can be applied to
floors, walls and ceilings.
[0011] Another object of the present invention is to provide an
improved hydronic radiant heating system comprising a board that
lends itself to modules which can easily be laid out and
installed.
[0012] An additional object of the present invention is to provide
an improved hydronic radiant heatiing system that lends itself to
mass production with associated cost savings.
[0013] A further object of the present invention is to provide an
improved hydronic radiant heating system comprising a board having
a thermally conductive coating whose thickness can be varied to
compensate for the condutcivity of the board to achieve a desired
overall thermal performance.
[0014] An additional object of the present invention is to provide
an improved hydronic radiant heating system comprising a board
having a groove with undercut grooves for releasably retaining a
pipe within said groove.
[0015] A specific object of the present invention is to provide an
improved hydronic radiant heating system comprising a nonstructural
board formed of thermally conductive material having an undercut
recess formed in one surface of said board and having a pipe
releasably retained [located] within said recess.
[0016] Another specific object of the present invention is to
provide an improved hydronic radiant heating system comprising a
nonstructural board having an undercut recess formed in one surface
of said board, a pipe releasably retained [located] within said
recess, and a coat of thermally conductive material applied to said
surface of said board having a thickness sufficient to compensate
for the thermal characteristics of said board to provide desired
overall thermal performance for said system.
[0017] These and other objects and features of the present
invention will be apparent from the following detailed description,
taken with reference to the figures of the accompanying
drawing.
BRIEF DESCRIPTION OF THE DRAWING
[0018] FIG. 1a is a vertical section through a floor heating system
embodying the present invention;
[0019] FIG. 1b is a view, similar to that of FIG. 1a, showing a
pipe inserted into the recess of the heating system of FIG. 1;
[0020] FIG. 2a is a view, similar to that of FIG. 1a, showing an
alternative form of the floor heating system of FIG. 1;
[0021] FIG. 2b is a view, similar to that of FIG. 2a, showing a
pipe inserted into the heating system of FIG. 2a;
[0022] FIG. 3a is a view, similar to that of FIG. 1a, showing a
layer of metal foil attached to the surface of a board similar to
that of FIG. 1a;
[0023] FIG. 3b is a view, similar to that of FIG. 3a, showing the
metal foil having been slit;
[0024] FIG. 3c is a view, similar to that of FIG. 3a, showing the
metal foil pressed into the recess of the board of FIG. 3a;
[0025] FIG. 4a is a view, similar to that of FIG. 1, showing an
alternative form of the heating system of FIG. 1; and
[0026] FIG. 4b is a view, similar to that of FIG. 4a, showing a
pipe installed in the heating system of FIG. 4a.
DETAILED DESCRIPTION OF THE INVENTION
[0027] In the form of the present invention chosen for purposes of
illustration in the drawing, FIG. 1a shows a hydronic radiant
heating system, indicated generally at 10, comprising a supporting
board 12 having a recess 14 formed in the upper surface 16 of the
board 12 and having a pipe 18 located within the recess 14, with a
coat 20 of thermally conductive material, such as metal spray,
metal foil or the like deposited on the upper surface 16 of the
board 12. As seen in FIG. 1b, the recess 14 is undercut, providing
an opening 15 with flanges 17 which overlie the pipe 18 after the
pipe 18 has been inserted into the recess 14. The pipe 18
sufficiently resilient to allow the pipe 18 to be inserted through
the opening 15 and to snap back to overlie the pipe 18, as seen in
FIG. 1b. This serves to releasably retain the pipe 18 and ensures
that the pipe 18 cannot become dislodged or otherwise displaced.
The supporting board 12 may be a wooden board or, if desired, may
be plywood, fiberboard, recycled material or other suitable
supporting material.
[0028] In use, the hydronic radiant heatng system 10 is applied
over a suitable subfloor. over wall framing, under ceiling framing
or over a concrete slab or over an existing floor, then the pipe 18
is forced into recess 14 so that flanges 17 overlie and releasably
retain the pipe 18 and the finished floor, wall or ceiling goods
are installed over the hydronic radiant heating system 10. (In the
case of its use for radiant hydronic ceiling heat the finished
goods are installed below the board 12) Heated water or the like is
circulated through the pipe 18 and transfers heat by conductivity
and radiation through the new floor to the desired area. The
thermally conductive coat 20 can be varied to compensate for the
varying conductive qualities of the supporting board 12. Thus, the
thickness of the thermally conductive coat 20 could vary
proportionally to the thermal properties of the supporting boaard
12. (More conductive board would have a thinner coating, while less
conductive bboard would have a thicker coating.) The thermally
conductive coat 20 may be applied to the upper surface 16 of the
supporting board 12 by spraying or by applying one or more layers
of metal foil or the like. Thus, the thickness of the coat 20 can
be extremely thin, yet serves to effectively and efficiently
transfer heat from the pipe 18 to the coat 20 and, hence, to the
desired area.
[0029] FIGS. 2a and 2b show an alternative form of the heating
system of FIG. 1a wherein two supporting boards 12 and 12' are
provided and the conductive coating 20 is applied between the
boards 12 and 12'. This would allow the components to be
manufactured separately and, subsequently, to be laminated together
at a convenient time and location.
[0030] FIG. 3a shows the board 12 having a layer of metal foil 20
attached to the board 12 by suitable means, such as adhesive 21,
and overlying the recess 14. Obviously, if desired, the metal layer
20 could be applied by plating or other well known means. After the
metal layer 20 has been attached to the board 12, the metal layer
is slit, as seen at 22 in FIG. 3b, and the portions of thematel
layer 20 are then pressed into the recess 14, as seen at 23 in FIG.
3c. This provides a very simple and inexpensive means of
manufacturing the board of FIG. 1a.
[0031] FIG. 4a shows an alternative form of the board 12 having the
surface 13 of the recess 14 serrated or otherwise prepared to
frictionally retain the pipe 18 when the pipe 18 is forcefully
inserted into the recess 14.
[0032] Obviously, numerous variations and modifications can be made
without departing from the spirit of the present invention.
Therefore, it should be clearly understood that the form of the
present invention described above and shown in the accompanying
drawing is illustrative only and is not intended to limit the scope
of the present invention.
* * * * *