U.S. patent application number 10/139892 was filed with the patent office on 2003-11-06 for absolute pressure sensor.
Invention is credited to Hillman, David J., McIntire, John, Nelson, Daniel S..
Application Number | 20030205089 10/139892 |
Document ID | / |
Family ID | 29269613 |
Filed Date | 2003-11-06 |
United States Patent
Application |
20030205089 |
Kind Code |
A1 |
Nelson, Daniel S. ; et
al. |
November 6, 2003 |
ABSOLUTE PRESSURE SENSOR
Abstract
A barometric pressure sensor including a base layer, a sensor
layer and a reference layer. The base layer has a passageway
between a pressure inlet and a mounting face. The sensor layer is
bonded by an insulating bond to the mounting face and includes a
conductive diaphragm. The reference layer is mounted on the sensor
layer to form a reference vacuum cavity. The reference layer
includes a conducting surface facing the conductive diaphragm
across the reference vacuum cavity to form a pressure sensing
capacitor.
Inventors: |
Nelson, Daniel S.; (Chaska,
MN) ; Hillman, David J.; (Prescott, WI) ;
McIntire, John; (Chanhassen, MN) |
Correspondence
Address: |
Christopher R. Christenson
WESTMAN CHAMPLIN & KELLY
International Centre - Suite 1600
900 South Second Avenue
Minneapolis
MN
55402-3319
US
|
Family ID: |
29269613 |
Appl. No.: |
10/139892 |
Filed: |
May 6, 2002 |
Current U.S.
Class: |
73/715 |
Current CPC
Class: |
G01L 19/04 20130101;
G01L 9/125 20130101; G01L 9/0073 20130101; G01L 19/02 20130101 |
Class at
Publication: |
73/715 |
International
Class: |
G01L 007/08 |
Claims
What is claimed is:
1. A pressure sensor, comprising: a base layer surrounding a
passageway between an inlet adapted to receive a pressure and a
mounting face on the base layer; a sensor layer having a first face
bonded by an insulating bond to the mounting face, the sensor layer
including a conductive diaphragm aligned with the passageway; and a
reference layer mounted on the sensor layer to form a reference
vacuum cavity that is aligned with the conductive diaphragm, the
reference layer including a conducting surface facing the
conductive diaphragm across the reference vacuum cavity to form a
pressure sensing capacitor.
2. The pressure sensor of claim 1 wherein the insulating bond
comprises a layer of glass frit.
3. The pressure sensor of claim 1 wherein the conductive diaphragm
includes an oxide layer.
4. The pressure sensor of claim 3 wherein the conducting surface
supports the oxide layer under an overpressure condition.
5. The pressure sensor of claim 1 wherein the sensor layer further
includes a first insulating layer on a second face surrounding the
conducting diaphragm, and the reference layer further includes a
second insulating layer bonded to the first insulating layer.
6. The pressure sensor of claim 5 wherein the second insulating
layer is masked to form a masked shape and the reference layer also
includes a third insulating layer opposite the second insulating
layer, the third insulating layer being masked in substantially the
same masked shape as the second insulating layer.
7. The pressure sensor of claim 5 wherein the reference layer and
the sensor layer comprise silicon and the first and second
insulating layers comprise silicon dioxide and are fusion bonded
together.
8. The pressure sensor of claim 1 wherein the reference layer
comprises pyrex glass and is anodically bonded to the sensor
layer.
9. The pressure sensor of claim 1 further comprising a first
electrical bonding pad disposed on the sensor layer and connected
to the pressure sensing capacitor.
10. The pressure sensor of claim 9 further comprising a second
electrical bonding pad connected to the pressure sensing
capacitor.
11. The pressure sensor of claim 10 wherein the first electrical
bonding pad is in electrical contact with the sensor layer, and the
second electrical bonding pad is disposed on a pyrolytic oxide
isolation channel on the sensor layer and is in electrical contact
with the conducting surface.
12. The pressure sensor of claim 1 wherein the sensor layer further
comprises a second passageway extending from the reference vacuum
cavity to the insulating bond.
13. The pressure sensor of claim 12 wherein the second passageway
is a laser drilled hole.
14. The pressure sensor of claim 13 wherein the reference vacuum
cavity is shaped to include a cul-de-sac leading to the laser
drilled hole.
15. The pressure sensor of claim 14 wherein the cul-de-sac includes
a turn of at least 90 degrees.
16. The pressure sensor of claim 1 wherein the reference layer
includes at least one groove facing the sensor layer.
17. The pressure sensor of claim 1 wherein the reference layer
includes a mesa that faces the conductive diaphragm.
18. The pressure sensor of claim 1 wherein the sensor layer
includes a shelf portion that extends beyond the reference layer,
and at least one electrical bonding pad is disposed on the shelf
portion.
19. The pressure sensor of claim 1 wherein the pressure sensor is a
barometric pressure sensor having an operating range of at least
0.9-1.1 atmospheres.
20. A gage pressure transmitter that includes a barometric pressure
sensor, the barometric pressure sensor comprising: a base layer
surrounding a passageway between an inlet adapted to receive a
pressure and a mounting face on the base layer; a sensor layer
having a first face bonded by an insulating bond to the mounting
face, the sensor layer including a conductive diaphragm aligned
with the passageway; and a reference layer mounted on the sensor
layer to form a reference vacuum cavity that is aligned with the
conductive diaphragm, the reference layer including a conducting
surface facing the conductive diaphragm across the reference vacuum
cavity to form a pressure sensing capacitor.
21. The gage pressure transmitter of claim 20 further comprising: a
transmitter housing, the transmitter housing having a barometric
pressure port bonded to the inlet.
22. The gage pressure transmitter of claim 21 further comprising a
porous teflon plug disposed in the barometric pressure port.
23. The gage pressure transmitter of claim 20, further comprising:
a process pressure sensor; and a converter circuit coupled to the
process pressure sensor and the barometric pressure sensor, the
converter circuit calculating a difference between process pressure
and barometric pressure.
24. The gage pressure transmitter of claim 23 wherein the converter
circuit includes a sigma delta analog to digital converter.
25. The gage pressure transmitter of claim 23 wherein the converter
circuit compensates a reading from the process pressure sensor and
compensates a reading from the barometric pressure sensor and
calculates the difference by subtracting the compensated barometric
pressure reading from the process pressure reading.
Description
[0001] This invention relates to barometric pressure sensors. In
particular, this invention relates to barometric pressure sensors
that can be used in industrial gage pressure transmitters.
BACKGROUND OF THE INVENTION
[0002] In industrial transmitter applications, capacitive type
sensors are typically used for sensing pressures. Capacitive
sensors can be made highly accurate and repeatable. In gage
transmitters that electronically calculate a pressure difference
based on two absolute pressure sensor outputs, accuracy and
repeatability of the sensors are particularly important to avoid
introducing errors in the subtraction process. The barometric
pressure range is quite limited, typically 0.9-1.1 atmospheres, and
there is a desire to use a relatively low cost absolute sensor for
sensing barometric pressure. Low cost absolute pressure sensors,
however, often do not have the accuracy and repeatability found in
process fluid sensors. These low cost sensors can introduce
undesired errors into the electronic subtraction process.
[0003] A barometric pressure sensor is needed that can be
manufactured at a low cost and that has high repeatability in the
limited barometric pressure range.
SUMMARY OF THE INVENTION
[0004] Disclosed is a pressure sensor comprising a base layer, a
sensor layer and a reference layer. The base layer surrounds a
passageway between an inlet adapted to receive a pressure and a
mounting face on the base layer.
[0005] The sensor layer has a first face bonded by an insulating
bond to the mounting face. The sensor layer includes a conductive
diaphragm aligned with the passageway.
[0006] The reference layer mounts on the sensor layer to form a
reference vacuum cavity that is aligned with the conductive
diaphragm. The reference layer includes a conducting surface facing
the conductive diaphragm across the reference vacuum cavity to form
a pressure sensing capacitor.
[0007] These and various other features as well as advantages which
characterize the present invention will be apparent upon reading of
the following detailed description and review of the associated
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 illustrates a cross-sectional view of a first
embodiment of a capacitive absolute pressure sensor.
[0009] FIG. 2 illustrates a cross-sectional view of a second
embodiment of a capacitive absolute pressure sensor.
[0010] FIG. 3 illustrates a detailed cross-sectional view of a
first diaphragm of a capacitive absolute pressure sensor.
[0011] FIG. 4 illustrates a detailed cross-sectional view of a
second diaphragm of a capacitive absolute pressure sensor.
[0012] FIG. 5 illustrates a cross-sectional view of a third
embodiment of a capacitive absolute pressure sensor.
[0013] FIG. 6 illustrates a mask for a top surface of the sensor
layer shown in FIG. 5.
[0014] FIG. 7 illustrates a mask for a bottom surface of the sensor
layer shown in FIG. 5.
[0015] FIG. 8 illustrates a mask for a top surface of the reference
layer shown in FIG. 5.
[0016] FIG. 9 illustrates a mask for a bottom surface of the
reference layer shown in FIG. 5.
[0017] FIG. 10 illustrates a partially broken away view of a gage
pressure transmitter.
[0018] FIG. 11 illustrates a block diagram of a gage pressure
transmitter.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] Gage pressure transmitters are often used to measure a
quantity of liquid stored in a tank. The gage pressure transmitter
includes an electronic circuit that provides a transmitter output
indicating gage pressure, or in other words, a difference between a
sensed liquid pressure and a sensed barometric pressure. The gage
pressure transmitter has a process pressure inlet that connects to
an opening near the bottom of the tank. The gage pressure
transmitter also has an atmospheric inlet or vent that is open to
the atmosphere. The fluid level in the tank can be calculated from
the transmitter's gage pressure output using well known
formulae.
[0020] Gage pressure transmitters can be constructed using one
differential pressure sensor that couples to both the process
pressure and atmospheric pressure. Alternatively, two absolute
pressure sensors can be used, with one absolute pressure sensor
sensing the liquid pressure and the other absolute pressure sensor
sensing the atmospheric pressure. When two absolute pressure
sensors are used, a circuit in the transmitter calculates the
pressure difference (gage pressure) electronically based on the two
sensor outputs.
[0021] In industrial transmitter applications, capacitive type
sensors are typically used for sensing pressures. Capacitive
sensors can be made highly accurate and repeatable. In gage
transmitters that electronically calculate a pressure difference
based on two absolute pressure sensor outputs, repeatability of the
sensors is particularly important to avoid introducing errors in
the subtraction process. The barometric pressure range is quite
limited, typically 0.9-1.1 atmospheres, and there is a desire to
use a relatively low cost absolute sensor for sensing barometric
pressure. Low cost absolute pressure sensors, however, often do not
have the repeatability found in process fluid sensors. These low
cost sensors can introduce undesired errors into the electronic
subtraction process.
[0022] As illustrated below in FIGS. 1-11, barometric pressure
sensors are provided that can be manufactured at a low cost and
that have high repeatability in the limited barometric pressure
range. The barometric pressure sensors can be conveniently batch
fabricated with selected known processes of microstructure
fabrication (also called microsystem technology (MST)) such as
masking, doping, etching, thin film deposition and the like. These
known processes include many adapted from the manufacture of
integrated circuits.
[0023] FIG. 1 illustrates a pressure sensor 100 that is formed of
multiple layers and that can be conveniently batch fabricated. The
pressure sensor 100 includes a base layer 102 that surrounds a
passageway 104 between an inlet 106 and a mounting face 108 on the
base layer. Inlet 106 is adapted to bond to a gage transmitter
housing internal surface surrounding a hole (as illustrated in FIG.
10) providing an atmospheric pressure P from outside a gage
transmitter housing.
[0024] The pressure sensor 100 also includes a sensor layer 110
having a first face 112 bonded by an insulating bond 114 to the
mounting face 108. The sensor layer 110 includes a conductive
diaphragm 116 that is aligned with the passageway 104 to receive
pressure P.
[0025] The pressure sensor 100 includes a reference layer 120 that
is mounted on the sensor layer 110 to form a reference vacuum
cavity 122 that is aligned with the conductive diaphragm 116. The
reference layer 120 includes a conducting surface 124 facing the
conductive diaphragm 116 across the reference vacuum cavity 122 to
form a pressure sensing capacitor. Reference layer 120 is
sufficiently thick so that that reference layer 120 does not bend
or deflect substantially with changes in atmospheric pressure
around the sensor 100. The reference layer 120 preferably includes
a mesa 121 that protrudes slightly and that faces the conductive
diaphragm 116. The mesa 121 has a height that is selected to
provide the desired spacing between capacitor plates in the vacuum
cavity 122. The height of mesa 121 can be selected to correct for
the thickness of bonding layers 126, 130. In addition to the mesa
121, or as an alternative to the mesa 121, a second mesa 123 can be
provided on the sensor layer 110 to provide capacitor spacing
control.
[0026] The conductive diaphragm 116 serves as a first capacitor
electrode or plate. The conducting surface 124 serves as a second
capacitor electrode or plate. The vacuum cavity 122 provides a
spacing between the generally parallel capacitor plates. The
spacing between the capacitor plates varies as the diaphragm 116 is
deflected by pressure P. The insulating bond 114 provides
electrical insulation from the base layer 102 and preferably
comprises a layer of glass frit.
[0027] The sensor layer 110 further includes a first insulating
layer 126 surrounding the conducting diaphragm 116 on a second face
128. The reference layer 120 includes a second insulating layer 130
bonded to the first insulating layer 126. In one preferred
arrangement, the reference layer 120 and the sensor layer 110
comprise silicon and the first and second insulating layers 126,
130 comprise grown silicon dioxide and are fusion bonded together.
The silicon in layers 110, 120 is doped and electrically
conductive. The insulating layers 126, 130 insulate the conductive
portions of the sensor layer 110 from the reference layer 120 so
that the pressure sensing capacitor is not shorted out.
[0028] A first electrical bonding pad 132 is disposed on the sensor
layer 110. Bonding pad 132 is electrically in contact with and
connected to the sensor layer 110 and thus provides one connection
to a plate or electrode of the a pressure sensing capacitor. A
second electrical bonding pad 134 is electrically in contact with
and connected to the conducting surface 124 on the reference layer
120 and thus provides a connection to the other plate or electrode
of the pressure sensing capacitor.
[0029] In a preferred arrangement, the sensor layer 110 includes a
shelf portion 111 on one side that extends beyond the reference
layer 120, and at least one electrical bonding pad 132 is disposed
on the shelf portion. The arrangement of this shelf portion 111
provides easy access for connecting a bond wire 133 and allows the
bond pad 132 to be spaced away from the conductive diaphragm 116 so
that stress transmission from the bond wire 133 to the conductive
diaphragm 116 is reduced.
[0030] In a preferred arrangement, the sensor layer 110 further
comprises a second passageway 136 extending from the reference
vacuum cavity 122 to the insulating bond 114. After the reference
layer 120 and sensor layer 110 are bonded together, then the base
layer 102 is bonded to the sensor layer 110 in a vacuum. The
insulating bond or frit 114 seals the second passageway 136 to
provide a permanent vacuum in reference vacuum cavity 122. The
second passageway 136 is preferably a laser drilled hole.
[0031] The pressure sensor 100 can be economically manufactured for
use as a barometric pressure sensor having an operating range of
about 0.9-1.1 standard atmospheres.
[0032] FIG. 2 illustrates a pressure sensor 150 that is similar to
the pressure sensor 100 shown in FIG. 1, however, the pressure
sensor 150 includes a reference layer 170 that is an insulating
glass anodically bonded to a sensor layer 160 by way of an anodic
bond 180.
[0033] In FIG. 2, a base layer 152 surrounds a passageway 154
between an inlet 156 that receives a pressure P and a mounting face
158 on the base layer 152.
[0034] The sensor layer 160 has a first face 162 that is bonded by
an insulating bond 164 to the mounting face 158. The sensor layer
160 includes a conductive diaphragm 166 aligned with the passageway
154. The insulating bond 164 preferably comprises a layer of glass
frit.
[0035] The reference layer 170 is mounted on the sensor layer 160
to form a reference vacuum cavity 172 that is aligned with the
conductive diaphragm 166. The reference layer 170 includes a
conducting surface 174 facing the conductive diaphragm 166 across
the reference vacuum cavity 172 to form a pressure sensing
capacitor. The bulk of the reference layer 170 preferably comprises
pyrex glass, and the conducting surface 174 preferably comprises a
deposition of nichrome. Reference layer 170 is anodically bonded to
sensor layer 160 using the well known anodic bonding technique for
bonding pyrex to silicon. After the anodic bond 180 is complete,
then the sensor is heated in a vacuum to seal the reference vacuum
cavity 172 with a small quantity of glass frit 183. Glass frit 183
fills a small channel that is cut through the reference layer to
allow an electrical feedthrough to a first electrical bonding pad
184 from the conducting surface 174.
[0036] The first electrical bonding pad 184 is deposited on
electrical conductor layer 189 that connects to the conducting
surface 174 which forms a second plate or electrode of the pressure
sensing capacitor. The first electrical bonding pad 184 and
electrical conductor layer 189 are disposed on an isolation channel
185 on the sensor layer 160. The electrical conductor layer 189 is
in electrical contact with the conducting surface 174 by way of a
metal bridge 187.
[0037] A second electrical bonding pad 182 is disposed on the
sensor layer 160 and thus connects to the conducting diaphragm 166
which forms one plate or electrode of the pressure sensing
capacitor. The second electrical bonding pad 182 is in electrical
contact with the sensor layer 160.
[0038] The bonding pads 182, 184 are preferably formed of aluminum.
The isolation channel 185 is preferably formed of pyrolytic oxide.
The metal bridge 187, the electrical conductor layer 189 and the
conducting surface 174 are all preferably formed of nichrome. The
sensor layer 160 includes a shelf portion 161 that extends beyond
the reference layer 170 and the electrical bonding pads 182, 184
are disposed on the shelf portion.
[0039] The pressure sensor 150 is preferably a barometric pressure
sensor having an operating range of about 0.9-1.1 atmospheres.
[0040] FIGS. 3-4 illustrate detailed cross-sectional views of two
different embodiments of conductive diaphragms 116 of a capacitive
absolute pressure sensor such as pressure sensor 100 illustrated in
FIG. 1. FIGS. 3-4 are not drawn to scale, but have an expanded
vertical scale to better illustrate certain features. Also, FIGS.
3-4 are illustrations of the conductive diaphragms 116 during
overpressure conditions. An overpressure condition is a condition
where the pressure P exceeds the nominal measurement range of the
pressure sensor. Under overpressure conditions the conductive
diaphragm 116 deflects away from its nominal flat shape
(illustrated by dashed lines 194, 196) and rests against and is
supported by the conducting surface 124 of reference layer 120. In
FIGS. 3-4, an oxide layer 190 is formed on the diaphragm surface.
In addition, in FIG. 4 an additional oxide layer 192 is formed on
the conducting surface 124. The oxide layers 190, 192 prevent the
conducting surface 124 from shorting out to the conductive
diaphragm 116 during overpressure conditions. The conductive
diaphragm 116 is supported during overpressure conditions so that
is does not break, and the oxide layers 190, 192 prevent a short
circuit during the overpressure condition.
[0041] FIGS. 5-9 illustrate a pressure sensor 200 that is similar
to the pressure sensor 100 illustrated in FIG. 1, however the
pressure sensor 200 includes some additional features. In
particular, grooves 201, which can be used to reduce rest
capacitance, are included. An additional masked insulating layer
203 can be included to provide enhanced performance over
temperature extremes. A cul-de-sac shaped passageway (FIG. 6) can
be added in reference layer 120 between the reference vacuum cavity
122 and the second passageway 136 to reduce movement of debris from
laser drilling.
[0042] FIG. 5 illustrates a pressure sensor 200 that is formed of
multiple layers and that can be conveniently batch fabricated using
known processes of microstructure fabrication (also called
microsystem technology (MST)) such as masking, doping, etching,
thin film deposition and the like. The pressure sensor 200
illustrated in FIG. 5 is similar to the pressure sensor 100
illustrated in FIG. 1. The reference numerals used in FIG. 5 that
are the same as reference numerals used in FIG. 1 identify the same
or similar features.
[0043] In FIG. 5, the pressure sensor 200 includes multiple grooves
201 (also illustrated in FIG. 9 at 372, 374, 376, 378.
[0044] In a preferred embodiment, the second insulating layer 130
is masked to form a masked shape and the reference layer 120 also
includes a third insulating layer 203 opposite the second
insulating layer 130. The third insulating layer 203 is masked in
substantially the same masked shape as the second insulating layer
130. The third insulating layer 203 is aligned with the second
insulating layer 130. As temperature changes, the first and second
insulating layers 203, 130 expand at a different rate than the
expansion of the bulk material of reference layer 120. The
difference in rates of expansion produces stress in reference layer
120, however, the stresses from the two substantially identical
layers 203, 130 tend to cancel out. This feature of masking with
substantially the same masked shape is described in more detail
below in connection with FIGS. 8-9.
[0045] In another preferred embodiment, a thin oxide layer 217 is
provided on sensor layer 110. Oxide layer 217 is similar to oxide
layer 190 illustrated in FIGS. 3-4 and prevents shorting out during
overpressure conditions.
[0046] FIGS. 6-9 illustrate various masks that are used in
manufacture of the sensor 200 illustrated in FIG. 5. References L
(left) and R (right) are included in FIG. 5 to identify left and
right sides of the sensor 200. Corresponding references L and R are
included in FIGS. 6-9 to indicate the orientation of the various
masks relative to sensor 200 in FIG. 5. The masks illustrated in
FIGS. 6-9 provide additional details on the shapes of various
features shown in FIG. 5. The masks in FIGS. 6-9 are illustrative
for manufacture of one sensor. It will be understood by those
skilled in the art that a sensor can be batch fabricated with many
other sensors on wafers and then diced. In the case of batch
fabrication, the individual masks illustrated in FIGS. 6-9 are
typically repeated in regular arrays on masks large enough to
complete entire wafers.
[0047] FIG. 6 illustrates a mask 300 for a second face 128 (top
surface) of the sensor layer 110 shown in FIG. 5. Mask 300 includes
a generally rectangular region 302 that provides for a
correspondingly shaped surface of bare (unoxidized) silicon. The
first electrical bonding pad 132 is later deposited on this bare
silicon region 302. Mask 300 also includes a region 304 that
overlies the conductive diaphragm 116 and also defines a cul-de-sac
region 306 that is contiguous with the region 304. The cul-de-sac
region 306 provides an open path between the second passageway 136
and the reference vacuum cavity 122. Mask 300 includes an irregular
shaped region 308 that defines the first insulating layer 126 which
surrounds the conductive diaphragm region 304 and the cul-de-sac
region 306.
[0048] FIG. 7 illustrates a mask 320 for a bottom surface of the
sensor layer 110 shown in FIG. 5. Mask 320 includes a region 322
that defines a region to be anisotropically etched on a (100)
oriented crystal face of silicon to form the diaphragm 116. Mask
320 also includes a region 324 which is left oxidized and a region
326 which defines a location for the second passageway 136,
typically a laser drilled hole.
[0049] FIG. 8 illustrates a mask 340 for a top surface of the
reference layer 120 shown in FIG. 5. Mask 340 includes a region 342
that defines a masked insulating layer 203. Mask 340 also includes
a region 344 that circumscribes a region 346 that defines the
second electrical bonding pad 134.
[0050] FIG. 9 illustrates a mask 360 for a bottom surface of the
reference layer 120 shown in FIG. 5. Mask 360 includes regions 362,
364, 366 that define anisotropically etched grooves. These
anisotropically etched grooves provide a line 368 for stress
concentration so that a batch fabricated sensor 200 can be
conveniently diced free from a wafer of multiple sensors. In FIG.
5, the broken-away portions of reference layer 120 are illustrated
in dashed lines.
[0051] Mask 360 also includes regions 372, 374, 376, 378, 380, 382
that define anisotropically etched grooves such as grooves 201
illustrated in FIG. 5. These grooves provide increased separation
between surfaces of the sensor layer 110 and the reference layer
120. The reference layer 120 includes these grooves that face the
sensor layer 110. The increased separation reduces "rest
capacitance" of the capacitive pressure sensor. The rest
capacitance of a capacitive pressure sensor is that value of the
sensor's capacitance when the sensor is at rest, or in other words,
undeflected. The rest capacitance is unresponsive to pressure
changes, and as such tends to undesirably reduce the percentage by
which the capacitance changes over the nominal measuring range.
Reducing the rest capacitance with grooves simplifies the design of
electronic circuitry used with the pressure sensor 200.
[0052] Mask 360 also includes a region 384 which defines an etch
stop layer forming mesa 121. Mask 360 further includes a region 386
that defines second insulating layer 130. It can be seen that
region 342 in FIG. 8 defines masked insulating layer 203, and that
region 386 in FIG. 9 defines second insulating layer 130 to have
substantially the same shapes that are aligned with each other to
provide mechanical stress isolation during temperature
variations.
[0053] The mask 360 also includes a cul-de-sac region 387 that
aligns with the cul-de-sac region 306 in FIG. 6. The reference
vacuum cavity 122 is thus shaped to include a cul-de-sac leading to
the second passageway 136, which is typically a laser drilled
hole.
[0054] In one preferred embodiment, the cul-de-sac region 387
includes a turn 388 of at least 90 degrees as illustrated.
[0055] FIG. 10 illustrates a partially broken away view of a gage
pressure transmitter 400 that includes a barometric sensor 402.
Barometric sensor 402 can be constructed generally as described
above in connection with FIGS. 1-9. The gage pressure transmitter
400 includes a housing 404 that encloses the barometric sensor 402
that is connected by leads 406 to a printed circuit board 408 that
includes a converter circuit. The converter circuit on printed
circuit board 408 is explained in more detail below in connection
with FIG. 11.
[0056] The gage pressure transmitter 400 also includes a process
pressure sensor 410 that is connected by leads 412 to the converter
circuit on printed circuit board 408. Process pressure sensor 410
is an absolute pressure sensor that senses process pressure at a
process pressure inlet 434.
[0057] The converter circuit on printed circuit board 408 generates
an electrical output that represents gage pressure on leads 414.
Leads 414 connect to a terminal block 415 that also serves as
sealed feedthrough. Housing 404 is a dual compartment housing with
a barrier wall 416 separating an electronics compartment 418 from a
field wiring compartment 420. Each of compartments 418, 420 is
sealed by a corresponding threaded cover 430, 432. A cable 422
connects the terminal block 415 to a process control system (not
illustrated) at a remote location. The electrical output is
configured for long distance transmission, also called telemetry,
and typically the output at terminal block 415 is in a standard
format such as a 4-20 mA industrial process control loop that
provides all of the energization for the gage transmitter 400. The
4-20 mA industrial process control loop may include superimposed
signals in a standard industry format such as the Hart protocol.
Alternatively, the output at terminal block 415 can be in an
industry standard fieldbus format such as Foundation Fieldbus,
Profibus and the like.
[0058] The transmitter housing 404 includes a barometric pressure
port 424 that is open to the atmosphere surrounding the housing
404. an inlet of barometric pressure sensor 402 is bonded to the
inside of the transmitter over the barometric pressure port. The
barometric pressure port 424 preferably includes a porous teflon
plug 426 disposed in the barometric pressure port 424. The porous
teflon plug 426 help prevent the entry of water in barometric
pressure port 424. The barometric pressure sensor 402 is preferably
bonded to the housing 404 using a trimetal bond 428 such as
Titanium-nickel-gold or Chromium-Nickel-Gold. Trimetal bonds are
known for example from U.S. Pat. No. 5,695,590 Willcox et al.
[0059] FIG. 11 illustrates an exemplary block diagram of the gage
pressure transmitter 400 in FIG. 10. The process pressure sensor
410 is coupled along leads 412 to a sigma delta circuit 450 in a
converter circuit 452. The barometric pressure sensor 402 is
coupled along leads 406 to the sigma delta circuit 450 in the
converter circuit 452.
[0060] The sigma delta circuit 450 provides a digital signal
representative of uncompensated process pressure along line 454 to
a process pressure compensation circuit 456. The sigma delta
circuit 450 provides a digital signal representative of
uncompensated barometric pressure along line 458 to a barometric
pressure compensation circuit 460. The process pressure
compensation circuit 456 provides an output representing
compensated process pressure on line 466 to a difference
calculating circuit 468. The barometric pressure compensation
circuit 460 provides an output representing compensated barometric
pressure on line 470 to the difference calculating circuit 468. The
difference calculating circuit 468 calculates a difference between
compensated process pressure and compensated barometric pressure,
which is an accurate indication of gage pressure 414. The
compensation performed by circuits 456, 460 includes gain and
linearity corrections.
[0061] In a preferred embodiment, the converter circuit also
includes a temperature sensor 475 coupled to the sigma delta
circuit 450. In this preferred embodiment, the sigma delta circuit
450 provides an output representing temperature to both
compensation circuits 456, 460. The compensations circuits 456, 460
then additionally compensate for temperature changes.
[0062] In a preferred arrangement, the compensation circuits 456,
460 and the difference calculating circuit 468 are realized as part
of an embedded microprocessor system in the gage pressure
transmitter 400.
[0063] Sigma delta circuit 450 is preferably a sigma delta type
analog to digital converter circuit. The converter circuit 452
compensates a reading from the process pressure sensor and
compensates a reading from the barometric pressure sensor and
calculates the difference by subtracting the compensated barometric
pressure reading from the process pressure reading.
[0064] Although the present invention has been described with
reference to preferred embodiments, workers skilled in the art will
recognize that changes may be made in form and detail without
departing from the spirit and scope of the invention.
* * * * *