U.S. patent application number 10/123281 was filed with the patent office on 2003-10-23 for heatsink device.
This patent application is currently assigned to Sunonwealth Electric Machine Industry Co., Ltd. Invention is credited to Hong, Ching-Sheng, Hong, Ying-Rong, Horng, Alex.
Application Number | 20030196779 10/123281 |
Document ID | / |
Family ID | 29214470 |
Filed Date | 2003-10-23 |
United States Patent
Application |
20030196779 |
Kind Code |
A1 |
Horng, Alex ; et
al. |
October 23, 2003 |
Heatsink device
Abstract
A heatsink device includes a base board provided with multiple
fins and multiple channels formed between any two adjacent fins.
Each of the channels has a first end formed with an air inlet and a
second end formed with an air outlet. The base board is provided
with a mounting portion. An impeller is combined on the mounting
portion of the base board, and a cover plate is combined on a top
of the base board. The impeller includes a power member to drive a
blast type vane to rotate. The vane is aligned with the channels
formed between the multiple fins, to drive an air flow from the air
inlet at one side of the base board to the air outlet at the other
side of the base board.
Inventors: |
Horng, Alex; (Kaohsiung
City, TW) ; Hong, Ching-Sheng; (Kaohsiung City,
TW) ; Hong, Ying-Rong; (Kaohsiung City, TW) |
Correspondence
Address: |
Bacon & Thomas
625 Slaters Lane - 4th Floor
Alexandria
VA
22314
US
|
Assignee: |
Sunonwealth Electric Machine
Industry Co., Ltd
Kaohsiung
TW
|
Family ID: |
29214470 |
Appl. No.: |
10/123281 |
Filed: |
April 17, 2002 |
Current U.S.
Class: |
165/80.3 ;
165/122; 165/185; 257/E23.099 |
Current CPC
Class: |
H01L 2924/00 20130101;
H01L 2924/0002 20130101; H01L 2924/0002 20130101; H01L 23/467
20130101 |
Class at
Publication: |
165/80.3 ;
165/185; 165/122 |
International
Class: |
F28F 007/00; F24H
003/06; F28F 013/12 |
Claims
What is claimed is:
1. A heatsink device, comprising: a base board, provided with
multiple fins, and multiple channels formed between any two
adjacent fins, each of the channels having a first end formed with
an air inlet and a second end formed with an air outlet, the base
board being provided with at least one mounting portion; an
impeller, combined on the mounting portion of the base board, the
impeller including a power member to drive a blast type vane to
rotate, the vane being aligned with the channels formed between the
multiple fins, to drive an air flow from the air inlet at one side
of the base board to the air outlet at the other side of the base
board; and a cover plate, combined on a top of the base board.
2. The heatsink device as claimed in claim 1, wherein the channels
are arranged in a linear manner.
3. The heatsink device as claimed in claim 1, wherein the channels
are arranged in an arcuate manner.
4. The heatsink device as claimed in claim 1, wherein the channels
are partially arranged in a linear manner and partially arranged in
an arcuate manner, so that the air outlet of the channel is located
at two sides of the base board.
5. The heatsink device as claimed in claim 1, wherein the mounting
portion is located at a position of the air inlet of the base
board.
6. The heatsink device as claimed in claim 1, wherein the mounting
portion is located between the air inlet and the air outlet of the
base board.
7. The heatsink device as claimed in claim 1, wherein the base
board is provided with multiple positioning holes for passage of
positioning members which may be screwed into screw bores formed in
the impeller, thereby fixing the impeller.
8. The heatsink device as claimed in claim 1, wherein the base
board is provided with at least one positioning portion, and the
cover plate is provided with at least one positioning member which
may be combined on the at least one positioning portion.
9. The heatsink device as claimed in claim 1, wherein the vane of
the impeller has a length substantially equal to a total width of
the multiple fins.
10. The heatsink device as claimed in claim 1, wherein the cover
plate is provided with an air inlet aligning with the vane of the
impeller.
11. The heatsink device as claimed in claim 1, wherein the base
board is provided with a receiving chamber to receive a circuit
board.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heatsink device, and more
particularly to a heatsink device that may drive a larger amount of
air flow, and the heatsink air flow may be sucked from one side of
the base board and may be carried outward from the other side of
the base board.
[0003] 2. Description of the Related Art
[0004] A conventional super thin type fan structure in accordance
with the prior art shown in FIG. 7 comprises a base 91 provided
with a helical receiving space 92 which is provided with a shaft
seat 93 on which a coil seat 94 is mounted. An impeller 95 has a
rotation shaft rotatably mounted on the coil seat 94. A cover plate
96 is mounted on the base 91, and has an air inlet 97. The base 91
is provided with an air outlet 98. The impeller 95 may be rotated
to suck the air flow through the air inlet 97, and the air flow may
be blown from the air outlet 98 toward a place needing a heat
dissipation. Thus, the impeller 95 may be rotated to suck the air
flow through the air inlet 97 of the cover plate 96, and the air
flow may be blown outward from the air outlet 98 at one side of the
base 91. However, the air flow has to turn through 90 degrees from
the air inlet 97 to the air outlet 98, so that the air flow turning
through 90 degrees will produce a turbulence. In addition, if the
air inlet side above the air inlet 97 does not have an enough
space, the air flow rate will be reduced, thereby decreasing the
heatsink effect.
SUMMARY OF THE INVENTION
[0005] The primary objective of the present invention is to provide
a heatsink device that may drive a larger amount of air flow,
wherein the heatsink air flow may be sucked from one side of the
base board and may be carried outward from the other side of the
base board, and the heatsink air flow may be conveyed toward larger
angles and ranges, so that the heat emitting source combined on the
base board 1 may have the optimum heatsink effect.
[0006] A secondary objective of the present invention is to provide
a heatsink device that may drive a larger amount of air flow,
without being limited by the top space of the heatsink device, and
the driven air flow needs not to turn, so that the heatsink device
of the present invention may have a better heatsink effect.
[0007] In accordance with the present invention, there is provided
a heatsink device, comprising a base board provided with multiple
fins and multiple channels formed between any two adjacent fins.
Each of the channels has a first end formed with an air inlet and a
second end formed with an air outlet. The base board is provided
with a mounting portion. An impeller is combined on the mounting
portion of the base board, and a cover plate is combined on a top
of the base board. The impeller includes a power member to drive a
blast type vane to rotate. The vane is aligned with the channels
formed between the multiple fins, to drive an air flow from the air
inlet at one side of the base board to the air outlet at the other
side of the base board.
[0008] Further benefits and advantages of the present invention
will become apparent after a careful reading of the detailed
description with appropriate reference to the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is an exploded perspective view of a heatsiink device
in accordance with a first embodiment of the present invention;
[0010] FIG. 2 is a top plan assembly view of the heatsink device as
shown in FIG. 1, with the cover plate being removed;
[0011] FIG. 3 is a plan cross-sectional view of the heatsink device
taken along line 3-3 as shown in FIG. 2;
[0012] FIG. 4 is an exploded perspective view of a heatsink device
in accordance with a second embodiment of the present
invention;
[0013] FIG. 5 is a top plan assembly view of the heatsink device in
accordance with a third embodiment of the present invention, with
the cover plate being removed;
[0014] FIG. 6 is a top plan assembly view of the heatsink device in
accordance with a fourth embodiment of the present invention, with
the cover plate being removed; and
[0015] FIG. 7 is an exploded perspective cross-sectional assembly
view of a conventional super thin type fan structure in accordance
with the prior art.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0016] Referring to the drawings and initially to FIG. 1, a
heatsink device in accordance with a first embodiment of the
present invention comprises a base board 1, an impeller 2, and a
cover plate 3.
[0017] The base board 1 is made of a metallic material having a
better heat conduction feature. The base board 1 has a bottom plate
provided with multiple fins 11, and multiple channels 12 formed
between any two adjacent fins 11. Each of the channels 12 has a
first end formed with an air inlet 15 and a second end formed with
an air outlet 16. The base board 1 is provided with a mounting
portion 13 for mounting and fixing the impeller 2. The mounting
portion 13 may be located at the air inlet 15 of the base board 1.
In addition, the base board 1 is provided with multiple positioning
portions 14, so that the cover plate 3 may be combined on the base
board 1 easily. The positioning portion 14 may be a positioning
hole or a groove as shown in the figure, so that the positioning
member 31 of the cover plate 3 may be snapped on the positioning
portion 14 of the base board 1. Further, the base board 1 may be
provided with a receiving chamber 17 which aligns with the position
of the power member 21 of the impeller 2, without disturbing the
air flow. In addition, the receiving chamber 17 may be used to
receive a circuit board 18 that is used to control operation of the
power member 21 of the impeller 2.
[0018] The impeller 2 includes a power member 21, such as a motor,
to drive a vane 22 to rotate. The vane 22 is a blast type vane that
has elongated blades. The impeller 2 may be combined on the
mounting portion 13 of the base board 1 in a conventional fixing
manner as shown in the figure. The base board 1 is provided with
multiple positioning holes 19 for passage of positioning members
23, such as bolts, which may be screwed into screw bores 24 formed
in the power member 21 of the impeller 2, thereby fixing the
impeller 2. The length of the vane 22 of the impeller 2 is
substantially equal to the total width of the multiple fins 11
provided at the air inlet 15 of the base board 1. Thus, when the
vane 22 is driven to rotate, a large quantity of air flow may be
sucked into the air inlet 15 of the base board 1. The air flow may
be driven to pass through each of the channels 12 of the base board
1, and may be carried outward from the air outlet 16 of the base
board 1, so as to provide a heatsink effect to the base board 1 or
the heat emitting member located at the air outlet 16 of the base
board 1.
[0019] The cover plate 3 is combined on the top of the channels 12
of the base board 1 by the multiple positioning members 31, thereby
ensuring that the air flow may enter the base board I from the air
inlet 15 of the base board 1, and may be carried outward from the
air outlet 16 of the base board 1. The cover plate 3 may be
combined with the base board 1 by a conventional combination
method, such as by screwing of bolts, or as shown in the figure,
the cover plate 3 is provided with multiple positioning members 31
each provided with a barb, so that the barb of each of the multiple
positioning members 31 may be snapped on each of the multiple
positioning portions 14 of the base board 1. In addition, for
increasing the air inlet rate when the cover plate 3 is combined
with the base board 1, the cover plate 3 may be provided with an
air inlet 32 aligning with the vane 22 of the impeller 2, thereby
increasing the driving rate of the air flow when the vane 22 of the
impeller 2 is rotated.
[0020] Referring to FIGS. 2 and 3, the heatsink device in
accordance with a first embodiment of the present invention is
assembled. The impeller 2 is combined on the mounting portion 13 of
the base board 1, and the cover plate 3 is combined on the top of
the channels 12 of the base board 1. In addition, the vane 22 of
the impeller 2 is aligned with the air inlet 15 of the base board 1
and aligned with the air inlet 32 of the cover plate 3. Thus, when
the power member 21 of the impeller 2 drives the vane 22 to rotate,
the vane 22 may drive a larger amount of air flow that may flow in
the channels 12 between the fins 11, and may be carried outward
from the air outlet 16 of the base board 1. In addition, the length
of the vane 22 of the impeller 2 is substantially equal to the
total width of the multiple fins 11 provided at the air inlet 15 of
the base board 1. Thus, the heatsink device in accordance with the
present invention may obtain the maximum amount of driven air flow,
and may have the optimum heatsink effect.
[0021] Referring to FIG. 4, a heatsink device in accordance with a
second embodiment of the present invention is shown. The mounting
portion 13 may be provided at the mediate position of each of the
channels 12 located between the air inlet 15 and the air outlet 16.
Thus, when the vane 22 of the impeller 2 is rotated, the air flow
may be introduced into the base board 1 from the air inlet 15 of
the base board 1, and may be carried outward from the air outlet 16
of the base board 1. Thus, the heatsink device in accordance with
the present invention may obtain the maximum amount of driven air
flow, and the heat emitting source located under the base board 1
may have the optimum heatsink effect.
[0022] Referring to FIG. 5, a heatsink device in accordance with a
third embodiment of the present invention comprises a base board 4,
an impeller 2, and a cover plate 3.
[0023] In third embodiment of the present invention, the base board
4 is also provided with multiple fins 41, and multiple channels 42
formed between any two adjacent fins 41. Each of the fins 41 has an
arcuate shape. The impeller 2 is provided at one end of each of the
channels 42, and is provided at the side of the air inlet 45. The
other end of each of the channels 42 is the air outlet 46 which may
be located at one side of the base board 1. The base board 4 is
also provided with a mounting portion 43 for mounting the impeller
2. The mounting portion 43 may be located between the air inlet 45
and the air outlet 46, or located at the air inlet 45. In addition,
the base board 4 is also provided with multiple positioning
portions 44, so that the cover plate 3 may be combined on the base
board 4 easily. Further, the base board 4 may also be provided with
a receiving chamber 47 to receive the circuit board 18.
[0024] Referring to FIG. 6, a heatsink device in accordance with a
fourth embodiment of the present invention is shown. In third
embodiment of the present invention, the base board 4 is also
provided with multiple fins 41 respectively formed with different
arcuate shapes, or formed with locally arcuate shapes and locally
oblique plates. The base board 4 is also provided with multiple
channels 42 formed between any two adjacent fins 41. One end of
each of the channels 42 is provided with a mounting portion 43 for
mounting the impeller 2 which is provided at the side of the air
inlet 45. The other end of each of the channels 42 is the air
outlet 46 which may be located at two sides of the base board 1.
The base board 4 is also provided with a mounting portion 43 for
mounting the impeller 2. The mounting portion 43 may be located
between the air inlet 45 and the air outlet 46, or located at the
air inlet 45. In addition, the base board 4 is also provided with
multiple positioning portions 44, so that the cover plate 3 may be
combined on the base board 4 easily. Further, the base board 4 may
also be provided with a receiving chamber 47 to receive the circuit
board 18. Thus, the larger amount of air flow driven by the
heatsink device in accordance with the present invention may be
conveyed toward larger angles and ranges, so that the heat emitting
source combined on the base board 1 may have the optimum heatsink
effect.
[0025] Accordingly, in the heatsink device in accordance with the
present invention, the vane of the blast type impeller is aligned
with the multiple channels of the base board, and the length of the
vane of the impeller is substantially equal to the total width of
the multiple fins provided at the air inlet of the base board.
Thus, when the vane is driven to rotate, the vane may drive a
larger quantity of air flow which may carry the heat source from
the air inlet at one side of the base board to the air outlet at
the other side of the base board and the heat source may be carried
outward from the air outlet of the base board, so that the heatsink
device may have the optimum heatsink effect.
[0026] Although the invention has been explained in relation to its
preferred embodiment as mentioned above, it is to be understood
that many other possible modifications and variations can be made
without departing from the scope of the present invention. It is,
therefore, contemplated that the appended claim or claims will
cover such modifications and variations that fall within the true
scope of the invention.
* * * * *