U.S. patent application number 10/062737 was filed with the patent office on 2003-07-31 for high thermal capability positive heat sink for rectifier assembly.
Invention is credited to Alford, Stephen Alan, Bradfield, Michael Duane.
Application Number | 20030141042 10/062737 |
Document ID | / |
Family ID | 27610343 |
Filed Date | 2003-07-31 |
United States Patent
Application |
20030141042 |
Kind Code |
A1 |
Bradfield, Michael Duane ;
et al. |
July 31, 2003 |
High thermal capability positive heat sink for rectifier
assembly
Abstract
A heat sink structure is provided for a rectifier assembly of an
air-cooled generator. The heat sink structure comprises a
substantially annular base that defines a plane. The base has a
plurality of cooling fins extending from it and which project from
the plane. The base further has a plurality of cooling slots, which
comprise cutouts of the fins. Additionally, the base has diode
mounts, each of which is adapted to retain a respective diode in a
thermally conductive manner, whereby heat from each respective
diode is transferred to the base and to the cooling fins. Also
provided is a method for manufacturing a heat sink structure. The
method comprises the steps of configuring a sheet of thermally
conductive material to include a substantially annular base,
perforating the base to form contiguous fin projections, and
bending the fin projections out of the base whereby fin shaped
slots remain.
Inventors: |
Bradfield, Michael Duane;
(Anderson, IN) ; Alford, Stephen Alan;
(Alexandria, IN) |
Correspondence
Address: |
MARGARET A. DOBROWITSKY
DELPHI TECHNOLOGIES, INC.
4TH FLOOR
1450 WEST LONG LAKE ROAD
TROY
MI
48098
US
|
Family ID: |
27610343 |
Appl. No.: |
10/062737 |
Filed: |
January 31, 2002 |
Current U.S.
Class: |
165/80.3 ;
257/E23.099; 257/E25.026; 29/890.03 |
Current CPC
Class: |
H02K 11/046 20130101;
Y10T 29/4935 20150115; H01L 25/115 20130101; H01L 2924/0002
20130101; H01L 2924/3011 20130101; H01L 23/467 20130101; H01L
2924/00 20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/80.3 ;
29/890.03 |
International
Class: |
F28F 007/00; B21D
053/02 |
Claims
What is claimed is:
1. A heat sink structure for a rectifier assembly of an air-cooled
generator, said heat sink structure comprising: a substantially
annular base, said base defining a plane; a plurality of cooling
fins extending from said base and projecting out from said plane; a
plurality of cooling slots in said base, said slots comprising
cutouts of said fins; and diode mounts, each of which is adapted to
retain a respective diode in a thermally conductive manner, whereby
heat from each respective diode is transferred to said base and to
said cooling fins, to provide a heat sink effect.
2. The heat sink structure of claim 1, wherein said cooling fins
project substantially perpendicular to said plane.
3. The heat sink structure of claim 1, wherein said slots further
comprise angularly spaced radial slots in said base, said slots
having an inner edge proximate to the center of said substantially
annular base, an outer edge distal to the center of said
substantially annular base, and radially extending edges between
said inner and outer edges.
4. The heat sink structure of claim 3, wherein each of said fins is
contiguous with said base.
5. The heat sink structure of claim 4, wherein each of said fins
are contiguous with said outer edge of each of said slots.
6. The heat sink structure of claim 3, wherein said radially
extending edges of each slot taper toward each other at a radial
end of each slot.
7. The heat sink structure of claim 3, wherein each of said diode
mounts is defined by a circumferential wall of a recess or hole in
said base.
8. The heat sink structure of claim 7, wherein said wall is
adjacent said outer edge of said slot.
9. The heat sink structure of claim 1, wherein said base comprises
an aluminum base.
10. A method of manufacturing a heat sink structure for a rectifier
assembly, said method comprising the steps of: configuring a sheet
of thermally conductive material to include a substantially annular
base; perforating said base to form fin projections contiguous with
said base; and bending said fin projections out from said base
whereby fin shaped slots remain in said base.
11. The method of claim 10, wherein the step of configuring said
sheet of thermally conductive material comprises the step of
stamping a substantially annular base from a metal sheet.
12. The method of claim 10, wherein the step of perforating said
base further comprises shear forming fins in said base.
13. The method of claim 12, wherein the step of shear forming
further comprises shear forming substantially radially extending
and angularly spaced slots in said base.
14. The method of claim 13, further comprising the step of shear
forming slots each of which having radially extending edges that
taper toward each other at a radial end of each slot.
15. The method of claim 14, wherein the step of bending said fins
comprises the step of bending said shear formed fins in a
substantially axial direction, whereby each of said fins is
contiguous with an edge of said slot.
16. The method of claim 15, wherein the step of bending said fin
further comprises the step of bending each of said fins at an edge
contiguous with an edge of said slot, said edge being radially
distal from the center of said substantially annular base.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat sink structure for a
rectifier assembly for an air-cooled generator, and a method of
producing a heat sink structure for a rectifier assembly.
[0003] 2. Discussion of the Related Art
[0004] It is known that excessive heat accumulation can cause the
rectifier of an automotive generator to malfunction. Efforts
therefore have been directed to cooling such rectifiers. In some
cases, the cooling is provided by air, while in other cases, the
cooling is provided by significantly more expensive and complicated
liquid cooling techniques (e.g., using a water coolant). The prior
art techniques for cooling the rectifier of a generator typically
provide inadequate cooling (e.g., there may be a high thermal
impedance between the heat sink of the rectifier assembly and the
surrounding cooling environment, such as air). In particular,
present production heat sinks are typically stamped aluminum plates
with a variety of holes and opening configurations. These openings
promote airflow through the rectifier and at the same time provide
surface area for convective heat transfer.
[0005] One approach taken in the art involves casting or otherwise
mounting a cooling fin arrangement to a heat sink base or other
component of a rectifier assembly, as seen by reference to U.S.
Pat. No. 3,684,944 issued to Evgrafov et al. Evgrafov et al.
disclose a rectifier assembly with cooling fins that are cast or
otherwise mounted on a base. However, the cooling fin arrangement
of Evgrafov et al. has the disadvantage of higher manufacturing
costs for parts produced by these manufacturing processes versus
stamping.
[0006] Another approach taken in the art involves stamping cooling
fins out of a base, as seen by reference to U.S. Pat. No. 5,640,062
to Yockey. Yockey discloses a stamped base with cooling fins that
project radially out from it. However, because of the limitations
of a flat, stamped heat sink, the amount of surface area that can
be realized by the heat sink disclosed by Yockey is limited.
[0007] There is consequently a need in the art for a rectifier
assembly for an air-cooled generator, a heat sink structure for use
in such a rectifier assembly, and/or a method of producing a heat
sink structure for a rectifier assembly to overcome the above
described limitations.
SUMMARY OF THE INVENTION
[0008] It is a primary object of the present invention to overcome
the foregoing problems and/or to satisfy at least one of the
aforementioned needs. The invention provides a heat sink structure
for use in a rectifier assembly for an air-cooled generator, and/or
a method of manufacturing a heat sink structure for a rectifier
assembly. The invention includes shear formed fins and slots which
maximizes the available surface area of the heat sink. The
invention is further efficiently manufactured by stamping and shear
forming processes, as opposed to more expensive casting or
extrusion methods.
[0009] To achieve this and other objects and advantages, the
present invention provides a heat sink structure for a rectifier
assembly of an air-cooled generator. The heat sink structure
includes a substantially annular base that defines a plane. The
structure includes a plurality of cooling fins that extend from the
base and project out from the plane. The base further includes a
plurality of cooling slots that are cutouts of the fins. The
structure also includes diode mounts, each of which is adapted to
retain a respective diode in a thermally conductive manner, whereby
heat from each respective diode is transferred to the base and to
said cooling fins, to provide a heat sink effect.
[0010] The present invention also provides a method of
manufacturing a heat sink structure for a rectifier assembly. The
method comprises the steps of configuring a sheet of thermally
conductive material to include a substantially annular base,
perforating the base to form fin projections contiguous with the
base, and bending the fin projections out from said base whereby
fin shaped slots remain in the base.
[0011] The expression "substantially annular", as used in this
disclosure, encompasses not only purely annular structures (i.e.,
O-shaped structures), but also C-shaped structures and other
structures that approximate a purely annular shape.
[0012] Still other objects, advantages, and features of the present
invention will become more readily apparent when reference is made
to the accompanying drawings and the associated description
contained herein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG. 1 is a top view of a positive heat sink for a rectifier
assembly according to a preferred embodiment of the present
invention.
[0014] FIG. 2 is a sectional view of a positive heat sink and
rectifier assembly according to a preferred embodiment of the
present invention.
[0015] FIG. 3 is a cross-sectional view of an exemplary generator
in which the rectifier assembly of FIGS. 1 and 2 has been
mounted.
[0016] FIG. 4 is a graph demonstrating the high thermal capability
of the present invention.
DESCRIPTION OF PREFERRED EMBODIMENTS
[0017] FIG. 1 illustrates, among other things, a heat sink
structure 10 according to the preferred embodiment of the present
invention. As will be described hereinafter, the heat sink
structure 10 is particularly well suited for use as part of a
rectifier assembly 12 (best shown in FIG. 2) of an air-cooled
generator 100 (best shown in FIG. 3). The heat sink structure 10,
however, can be used in other applications where similar benefits
can be realized.
[0018] The exemplary heat sink structure 10 includes a
substantially annular base 14, a cooling fin arrangement 16, a
cooling slot arrangement 18, and a plurality of diode mounts 20.
Base 14 is disposed about an axis 22, and generally lies in and
defines a plane 24. Axis 22 intersects plane 24 at a center point
26 of base 14. Base 14 may be made out of any thermally conductive
material, including 1100 aluminum.
[0019] Cooling fin arrangement 16 comprises a plurality of fins 28
that extend from the surface of the base 14. Cooling fin
arrangement 16 consists of a plurality of fins 28 that are shear
formed and bent up from the surface of base 14, projecting out of
plane 24, extending substantially parallel to axis 22. In a
preferred embodiment, cooling fins 28 are angularly spaced around
base 14.
[0020] Cooling slot arrangement 18 consists of a plurality of slots
30 within base 14. Slots 30 are cutouts of fins 28. That is, slots
30 result from the shear forming and bending of fins 28. Like
cooling fins 28, in the preferred embodiment slots 30 are angularly
spaced around base 14. In such a configuration, slots 30 have a
radially innermost edge, or end, 32 proximate to center point 26, a
radially outermost edge, or end, 34 distal to center point 26, and
radially extending edges 36 between inner and outer edges 32, 34.
Cooling slot arrangement 18 is provided to allow convective heat
transfer between base 14 and the atmosphere, or forced air currents
38 shown in FIG. 2.
[0021] As shown in FIG. 1, the radial extending edges 36 of each
slot 30 are tapered toward each other at radial inner end 32. The
angular spacing of slots 30, along with the radial extension of
slots 30 and the tapered radially extending edges 36 allow for
stamping die clearance during the shear forming of fins 28.
[0022] As shown in FIG. 2, each cooling fin 28 has a contiguous
edge 40 with each corresponding slot 30. In the embodiment depicted
in FIG. 2, edge 40 is contiguous with outer edge 34. However, it
will be appreciated by those skilled in the art that edge 40 may be
contiguous with inner edge 32 or radial edge 36.
[0023] Cooling fin and slot arrangements 16, 18 represent an
improvement over prior art heat sink structures and methods of
manufacturing the same. Many conventional heat sink structures are
typically stamped out of thermally conductive material, and
removing away a portion of the same so that a base with fin
projections remains. Under the present invention disclosed herein,
cooling fins 28 are shear formed so that little, if any, of base 14
is removed (i.e., there is little or no "waste" material). This
maximizes the available surface area of base 14, while providing
cooling fins 28 and slots 30, all of which enhance the desired heat
sink, or cooling effect.
[0024] Each of the diode mounts 20 is adapted to retain a
respective diode 42 in a thermally conductive manner. Heat from
each respective diode 42 is transferred to the base 14 and to the
cooling fin arrangement 16 to provide the desired heat sink effect.
Preferably, press-fit diodes 42 are used. Such diodes 42 are
generally known. Typically, they have a conductive housing 44 with
a closed end (not shown) and an open end 46. The closed end, during
installation of the diode 42, is press-fit into a correspondingly
sized recess 20. The correspondingly sized recesses 20, in this
regard, constitute the diode mounts 20. The diode material is
contained within the conductive housing 44. The conductive housing
44 serves as either the anode or the cathode of the diode 42.
Projecting out from the diode 42, through the open end 46 of the
conductive housing 44, is an electrical diode terminal 48 that
defines the opposite terminal to the conductive housing 44. This
electrical diode terminal 48 defines the cathode if the conductive
housing 44 serves as the anode, or defines the anode if the
conductive housing 44 serves as the cathode. The diode terminal 48
that projects out from the open end 46 of the conductive housing 44
does not make electrical contact with the conductive housing
44.
[0025] One type of press-fit diode 50 allows current to flow into
the a conductive housing 52, through the diode 50, and out through
a diode terminal 54 that extends through an open end 56 of the
conductive housing 52. Current, however, cannot pass in the reverse
direction. Another type of press-fit diode 42 allows the current to
flow into the diode terminal 48 that projects out from the open end
46 of the conductive housing 44, through the diode 42, and out from
the conductive housing 44. Electrical current cannot flow in the
reverse direction.
[0026] For the exemplary arrangement shown in FIGS. 1 and 2, the
heat sink structure 10 is provided on the positive side rather than
the electrical ground side of the rectifier assembly 12.
Accordingly, it carries the positive-type of diodes 42.
[0027] As the flow of electrical current heats the press-fit diodes
42, 50, the press-fit diodes 42, 50 transfer this heat to their
surroundings. Preferably, the diode mounts 20 of the heat sink
structure 10 are defined by a circumferential wall of a recess 20
or hole in the base 14 of the heat sink structure 10. The heat from
each diode 42 therefore is transferred to the heat sink structure
10. This heat, in turn, is readily transferred to air flowing about
the heat sink structure 10. The increased surface area provided by
the cooling fin arrangement 16 and cooling slot arrangement 18
enhances this transfer of heat.
[0028] The heat sink structure 10 can be manufactured in a
relatively uncomplicated and inexpensive manner from a sheet of
electrically and thermally conductive material. The sheet may be
made of aluminum that is about 4 to 5 millimeters thick. A
preferred method of manufacturing the heat sink structure 10 for a
rectifier assembly 12, includes the steps of configuring the sheet
of thermally conductive material to include a base 14 and
perforating the base to form fin projections 28 that are contiguous
with the base 14. The configuration of the sheet into base 14 may
be done by conventional stamping techniques. As stated above, the
perforation of fins 28 out of base 14 may be done by shear forming
fins 28. The shear forming further forms substantially radially
extending and angularly spaced slots 30 in the base 14.
[0029] Fins 28 are bent in a substantially axial direction, whereby
each of the fins 28 is contiguous with an edge of slot 30. In a
preferred embodiment shown in FIGS. 1 and 2, fins 28 are bent at an
edge 40 contiguous with an outer edge 34 of slots 30. Under
conventional methods, it is difficult to shear form fins with
parallel sides, such as in a row. Under the method disclosed
herein, the tapered edges 36 of each slot 30 permit each fin 28 to
naturally clear the stamping die as the fin 28 is shear formed
up.
[0030] While stamping is the preferred way of configuring the
sheet, it is understood that alternative techniques, such as
cutting, can be used. An advantage of the stamping process is that,
in a single stamping operation, the base 14 can be provided with
diode mounts 20 (e.g., in the form of recesses or holes) and/or
additional holes and features (to be described hereinafter) that
are used to accommodate other features of the heat sink structure
10 or of the rectifier assembly 12 in which the heat sink structure
10 is used.
[0031] The ability to use a stamping process in the manner
described above greatly simplifies the overall manufacturing
process and represents a significant savings in cost over other
ways of providing heat sink structures. It also represents
significant savings in the time required to manufacture each heat
sink structure 10.
[0032] The diode mounts 20 and other features, of course, can be
provided using alternative techniques (e.g., drilling, cutting, and
the like). In this regard, they need not be made using the
aforementioned stamping technique.
[0033] As illustrated in FIGS. 1 and 2, the present invention also
provides the rectifier assembly 12 that includes the aforementioned
heat sink structure 10. The exemplary rectifier assembly 12 is
adapted for use in an air-cooled generator. An exemplary generator
100 is shown in FIG. 3 and will be described hereinafter. It is
understood, however, that the exemplary rectifier assembly 12 can
be applied to other uses.
[0034] The exemplary rectifier assembly 12 may be used with a dual
three-phase winding generator. It therefore is adapted to hold two
sets of three (i.e., six) negative-side diodes 50 and two sets of
three (i.e., six) positive-side diodes 42. Each stator phase of the
generator 100 is associated with one of the positive-side diodes 42
and one of the negative-side diodes 50. More specifically, each
negative-side diode 50 is electrically connected between the
generator's electrical ground (e.g., its housing) and a respective
stator phase winding so that electrical current can flow from the
electrical ground into the respective stator phase winding, but not
in the reverse direction. Each positive-side diode 42, by contrast,
is connected between the rectifier's output terminal 58 (i.e., the
terminal that typically is connected to a positive terminal of the
battery or other device to be charged) and a respective stator
phase winding so that electrical current can flow from the
respective stator phase winding to the rectifier's output terminal,
but not in the reverse direction. In FIG. 1, the bolt 58 defines
the rectifier's output terminal.
[0035] The exemplary rectifier assembly 12 includes a substantially
annular support 60 adapted to hold negative-side diodes 50 in such
a way that (1) a ground terminal of each negative-side diode 50,
(i.e., the conductive housing 52 thereof) is electrically connected
to the support 60; (2) a phase terminal (i.e., terminal 54) of each
negative-side diode 50 remains electrically connectable to a
respective one of several stator output phases from the generator
100; and (3) the negative-side diodes 50 are thermally connected to
the support 60 so that heat from the negative-side diodes 50 is
transferred to the support 60, to provide a heat sink effect.
[0036] The annular support 60 preferably includes six negative-side
recesses 62 on the support 60. Each of the negative-side recesses
62 is adapted to receive a press-fit version of the negative-side
diodes 50 in such a way that walls of the negative-side recesses 62
press-fittingly retain the negative-side diodes 50. The annular
support 60 is further provided with cooling slots 64, positioned in
line with cooling slots 30, to allow air currents 38 to flow
through and cool the rectifier assembly 12.
[0037] The substantially annular heat sink structure 10 is
similarly thermally and electrically conductive. The heat sink
structure 10 is adapted to hold positive-side diodes 42 in such a
way that (1) a positive terminal (i.e., the conductive housing 44)
of each positive-side diode 42 is electrically connected to the
heat sink structure 10; (2) a phase terminal (i.e., terminal 48) of
each positive-side diode 42 remains connectable to a respective
phase output from a respective one of the stator output phases from
the generator 100; and (3) the positive-side diodes 42 are
thermally connected to the heat sink structure 10 so that heat from
the positive-side diodes 42 is transferred to the heat sink
structure 10, to provide a heat sink effect.
[0038] The heat sink structure 10, as indicated above, preferably
includes a plurality of positive-side recesses 20 on the heat sink
structure 10. Each positive-side recess 20 is adapted to receive a
press-fit version of the positive-side diodes 42 in such a way that
walls of the positive-side recesses 20 press-fittingly retain the
positive-side diodes 42.
[0039] The heat sink structure 10 is spaced apart from the annular
support 60. The heat sink structure 10 is further provided with
passage holes 68. Passage holes 68 are positioned above negative
side diodes 50 and are provided to provide access to each diode
terminal 54 that extends through an open end 56 of the conductive
housing 52.
[0040] The rectifier assembly 12 is farther provided with a
terminal assembly 70 for electrically connecting phase leads (not
shown) from the stator to the diodes 42, 50. Terminal assembly 70
may be mounted to the periphery of heat sink structure 10, as shown
in FIG. 1. Terminal assembly 70 comprises a cover 72 made of an
electrically insulating material, such as plastic. Embedded in the
plastic cover are six insert molded metallic terminal strips 74.
Strips 74 are electrically isolated from each other. Strips 74
correspond to the two sets of three phase windings from the stator.
Strips 74 are made of an electrically conductive metal, preferably
copper.
[0041] Each terminal strip 74 is electrically connected to a
crimping wing 76. Crimping wings 76 serve as terminals for the ends
of phase leads (not shown). Each terminal strip 74 is further
electrically connected to a pair of diode terminals, consisting of
a diode terminal 48 from a positive diode 42 and a diode terminal
54 from a negative diode 50. In the embodiment shown in FIGS. 1 and
2, each terminal strip 74 is connected to a first copper strap 76
which is soldered to a diode terminal 48 from a positive diode and
a second copper strap 80 that is soldered to a diode terminal 54
that extends through its passage hole 68 from negative diode
52.
[0042] As shown in FIG. 2 (but absent in FIG. 1), a slotted cover
82 can be provided over the rectifier assembly 12 to protect the
rectifier assembly 12, while allowing air to flow through the
rectifier assembly 12. The slotted cover 82, for example, can be
made of plastic using conventional injection molding techniques.
The cover 82 preferably is substantially annular.
[0043] A positive output terminal (e.g., bolt 58) of the generator
100 is electrically connected to the heat sink structure 10. The
connection to the battery or other device to be charged by the
generator 100 can be made via this positive output terminal (e.g.,
bolt 58). Heat sink structure 10 can further be configured to a
voltage rectifier 84 for the rectifier assembly 12.
[0044] The substantially annular shape of the exemplary rectifier
assembly 12 advantageously corresponds with the typical shape of a
generator housing. It also advantageously provides an internal
opening to accommodate the rotor shaft 121 of a typical generator
100.
[0045] With reference to FIG. 3, it can be seen how conveniently
the rectifier assembly 12 fits within a generator housing 100 and
around the rotor shaft 121 of the generator 100. A conventional
alternator 100 is illustrated in FIG. 3 sometimes referred to
herein as a generator. Alternator 100 has a rotor assembly
generally designated by the reference numeral 120 and stator
assembly generally designated by the reference numeral 115. The
rotor assembly 120 includes a shaft 121 supporting all rotating
magnetic circuit structures thereof including conventional
pole-members 116A and 116B, rotor core 117 and field coil 118 wound
upon bobbin 112. Additionally, all other non-magnetic circuit
rotating structures are carried thereby, including air circulation
fans 119 and 127 located at axially opposite sides of the
pole-members. Fan 127 is formed from sheet metal stock and spot
welded to pole-member 116B while fan 119 is formed from an
appropriate thermoplastic material and heat staked to tower
extensions (not shown) from the field coil bobbin 112. The shaft
121 in turn is rotatably supported within a housing 126 by a pair
of bearings 123 and 122.
[0046] The support 60 and generator housing 126 preferably are
formed integrally as an aluminum die cast. The heat sink structure
10 preferably is a stamped and formed aluminum plate that is
provided using the manufacturing method described above. Other
materials and manufacturing techniques, of course, can be used in
lieu of, or in addition to, the foregoing exemplary materials and
techniques.
[0047] Since the rectifier assembly 12 and the heat sink structure
10 thereof occupy a significant amount of the usable space around
the rotor shaft 121, and since they fill that space with a large
surface area, the heat from the diodes 42, 50 is dissipated in a
very efficient manner. To further enhance this efficiency, fans 119
and 127 propel air through the spaces separating the rectifier
assembly 12. In particular, fans 119 and 127 propel air through the
fins 28 and slots 30. An efficient and compact heat sink structure
therefore is provided.
[0048] The foregoing exemplary rectifier assembly 12 advantageously
uses relatively inexpensive and uncomplicated parts, is provided
using relatively inexpensive and uncomplicated manufacturing and
assembling techniques, and despite these expedients, provides a
very effective cooling action in conjunction with air flowing over
and through the rectifier assembly 12.
[0049] FIG. 4 presents a graph 200 demonstrating the high thermal
capability of the present invention. First, graph 200 plots
generator speed 202 (x-axis) against diode temperature 204 (left
y-axis) for generators operating at an ambient temperature of 125
degrees Celsius, and generating an output voltage of 13V. Graph 200
shows the diode temperatures for positive diodes 206 and negative
diodes 208 operating on current production rectifier assemblies.
Diodes 206, 208 reach temperatures as high as about 222 degrees
Celsius and 212 degrees Celsius, respectively. In contrast, graph
200 shows the diode temperatures for positive diodes 210 and
negative diodes 212 operating on a rectifier assembly with a heat
sink according to the invention disclosed herein. Under the
improved heat sink structure, diodes 210, 212 only reach
temperatures of about 185 and 195 degrees Celsius,
respectively.
[0050] Graph 200 also plots generator speed 202 (x-axis) against
generator output in amps (right y-axis) for generators operating
under the above operating conditions. Graph 200 shows that
production output for rectifier assemblies under the present
invention 218 is nearly equal to output for conventional generators
216.
[0051] While the exemplary rectifier assembly 12 is adapted to hold
six negative-side diodes 50 and six positive-side diodes 42 so that
it can be readily used with two (2) independent three-phase
rectifier circuits (e.g., generator 100), it is understood that the
invention is not limited to such an arrangement. The rectifier
assembly 12 can be modified to hold more or fewer negative-side
diodes 50 and/or positive-side diodes 42, depending upon the
intended application of the rectifier assembly 12.
[0052] While the present invention has been described with
reference to certain preferred embodiments and implementations, it
is understood that various modifications and variations will no
doubt occur to those skilled in the art to which this invention
pertains. These and all other such variations which basically rely
of the teachings through which this disclosure has advanced the art
are properly considered within the scope of this invention.
* * * * *