U.S. patent application number 10/050817 was filed with the patent office on 2003-07-24 for heat sink for heat-susceptible electronic devices.
Invention is credited to Lin, Pei-Ching, Lin, Yu-Sen, Shih, Chun-Ming.
Application Number | 20030136545 10/050817 |
Document ID | / |
Family ID | 21967618 |
Filed Date | 2003-07-24 |
United States Patent
Application |
20030136545 |
Kind Code |
A1 |
Lin, Yu-Sen ; et
al. |
July 24, 2003 |
Heat sink for heat-susceptible electronic devices
Abstract
A heat-sink for heat-liable electronic devices provides
multiples of lateral holes in each vertical fin to separately
create a lateral passage in relation with longitudinal troughs to
guide air currents flowing in various directions to boost the air
conduction thus to improve heat dissipation effects.
Inventors: |
Lin, Yu-Sen; (Taipei,
TW) ; Lin, Pei-Ching; (Taipei, TW) ; Shih,
Chun-Ming; (Taipei, TW) |
Correspondence
Address: |
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY
MD
21043
US
|
Family ID: |
21967618 |
Appl. No.: |
10/050817 |
Filed: |
January 18, 2002 |
Current U.S.
Class: |
165/80.3 ;
257/E23.099; 257/E23.103 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 2924/0002 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101; F28F 3/06 20130101; H01L 23/3672 20130101; F28F 2215/08
20130101 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 007/00 |
Claims
I claim,
1. A heat sink for heat-liable electronic devices comprising
multiples of vertical fins separating from one another for a
certain spacing being provided on a body of the heat sink
characterized by that: multiples of holes being laterally provided
in each of said fins provided on the body of the heat sink to
separately define a lateral passage in related to longitudinally
troughs formed between abutted fins for guiding air currents
flowing in various directions.
2. A heat sink for heat-liable electronic devices as claimed in
claim 1, wherein, a flange is formed by punching on one side of
each of said lateral holes provided in each of said fins.
3. A heat sink for heat-liable electronic devices as claimed in
claim 1, wherein, each said lateral hole is formed an opening at an
upper end of each of said fins.
Description
BACKGROUND OF THE INVENTION
[0001] (a) Field of the Invention
[0002] The present invention relates to a heat sink for heat-liable
electronic devices, and more particularly, to one having provided
multiples of lateral holes in each vertical fin to guide air
currents for better heat dissipation effects.
[0003] (b) Description of the Prior Art
[0004] More compact CPU and faster operation rate have led to
significantly reduced operation rate time required to yield better
application efficiency of the computer thanks to advanced
development of IC process. However, as a result of faster operation
rate, more heat is generated due to upgraded time clock, and faster
heat dissipation for the CPU is required. Accordingly, the
performance of the adapted heat sink becomes more important as the
CPU chip is smaller and the process rate is faster, or the computer
is vulnerable to break down since the CPU may become unreliable if
the heat fails to be dissipated in time. In such case, the faster
process rate of the CPU means nothing at all. Generally, a heat
sink is provided to the CPU chip to guide and to dissipate the heat
generated by the CPU. Therefore, better heat sinking capability
becomes crucial to cope with the much higher temperature rise
resulted from upgraded time clock of the CPU to help secure a
reliable operation of the CPU.
[0005] The prior art of a heat sink as illustrated in FIG. 7 is
essentially composed of a base (B) made of aluminum with excellent
heat conduction performance that holds flush with the top surface
of a chip (A), multiples of fins (B1) vertically provided with a
certain spacing on and integrated with the base (B), and a mini fan
(C) provided over the fins (B1) to force the heat transferred by
the base (B) from the chip (A) and preliminarily dissipated by the
large area of the fins (B1) that contacts the air.
[0006] However, heat transfer and air current guidance structures
are two critical elements that determine the efficiency of the heat
sink. The fins (B) in the prior art are arranged in one direction
and there is the absence of mutually communicated longitudinal
troughs. Therefore, the air current is guided only in one
direction. In general, such heat sink is not an ideal design as it
provides only one-way air current guidance thus to restrict
improvement of heat dissipation efficiency.
SUMMARY OF THE INVENTION
[0007] The primary purpose of the present invention is to provide a
heat sink with improved heat dissipation efficiency for heat-liable
electronic devices. To achieve the purpose, lateral holes are
provided in each fin vertically disposed on the heat sink to
separately form a lateral passage in relation with longitudinal
troughs to guide air currents in various directions.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 is a perspective view showing a structure of the
present invention;
[0009] FIG. 2 is a view showing an appearance of the present
invention in use;
[0010] FIG. 3 is a sectional view and air current flowing direction
of the present invention;
[0011] FIG. 4 is a schematic view showing a preferred embodiment
derived from the holes provided in heat sink fins of the present
invention;
[0012] FIG. 5 is a schematic view showing another preferred
embodiment varied from the holes provided in heat sink fins of the
present invention;
[0013] FIG. 6 is a view of another preferred embodiment of the
present invention; and
[0014] FIG. 7 is a perspective view showing a prior art.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0015] Referring to FIG. 1, a heat sink of the present invention
comprises multiples of vertical heat sink fins (2) separating from
one another for a certain spacing on a body (1) of the heat sink.
The fins (2) are fixed to the body (1) of the heat sink by having a
dovetail (21) provided to the lower end of each fin (2) inserted
into a dovetail groove (11) on the body (1) of the heat sink.
[0016] Multiples of holes (22) are provided laterally in each of
the fins (2) disposed on the body (1) of the heat sink to
separately form a lateral passage in relation with a longitudinal
trough defined by abutted fins to guide air currents flowing in
various directions.
[0017] To dissipate the heat generated from a CPU chip (3) as
illustrated in FIGS. 2 and 3, a mini fan (4) is provided at the top
of the fins (2) of the heat sink. Bolts (5) used to fasten the mini
fan (4) penetrate into where between two abutted fins (2) for the
bolts (5) to bite the fins to hold the mini fan (4) in position.
Once the mini fan (4) operates, air current flows upward due to the
forced heat dissipating wind velocity. The heat is carried away
through longitudinal troughs defined by the longitudinally disposed
fins (2). Furthermore, the lateral passages formed by the lateral
holes (22) provided in each of the fins (2) in relation to the
longitudinal troughs also guide air currents in various directions
to expand the range of heat dissipation, thus to improve the heat
dissipation efficiency of the heat sink.
[0018] In another feasible pattern derived from the present
invention as illustrated in FIG. 4, a flange (23) by punching is
formed on one side of each of the lateral holes (22) in each fin
(2) so to increase the area of the fin (2) to contact the air for
further improvement of the heating dissipation effects.
[0019] Furthermore, in another preferred embodiment as illustrated
in FIG. 5, multiples of lateral holes (22A) are made with opening
upper ends (22A) at the top of each fin (2) and each lateral hole
(22A) is punched to form a flange (23A) at its one side.
[0020] Now referring to FIG. 6, an abutting end (24) horizontally
extends from the lower end of each of the fins (2) is provided to
hold against the side surface at the top of the body (1) of the
heat sink. Then the abutting end (24) is welded to the top of the
body (1) of the heat sink so to fix the fins (2) to the body (1) of
the heat sink. Provided, however, that the abutting end (24) is not
necessarily provided since the lower end of each of the fins (2)
can be forthwith welded to the body (1) of the heat sink.
[0021] It is to be noted that the lateral holes (22) and (22A)
disclosed in the foresaid preferred embodiments shall not restrict
the feasible shape of the lateral holes within the teaching of the
present invention. A lateral hole with any other geometric form can
be used in the preferred embodiment of the present invention.
[0022] As disclosed above, the present invention by providing an
additional passage defined by multiples of lateral holes provided
in each fin of a heat sink and longitudinally disposed fins to
allow expanded conduction of air currents in various directions for
increasing heat dissipation effects, thus for improved heat
dissipation efficiency in general of the heat sink compared with
the prior art, relates to a progressive, practical and innovative
structure of the heat sink.
* * * * *