U.S. patent application number 10/138481 was filed with the patent office on 2003-07-17 for structure of a pin platform for integrated circuit.
Invention is credited to Chou, Shu-Min, Liang, Shu-Fen, Shieh, Wen-Lo, Tsai, Chen-Fa, Yang, Chia-Ming.
Application Number | 20030132515 10/138481 |
Document ID | / |
Family ID | 21688387 |
Filed Date | 2003-07-17 |
United States Patent
Application |
20030132515 |
Kind Code |
A1 |
Shieh, Wen-Lo ; et
al. |
July 17, 2003 |
STRUCTURE OF A PIN PLATFORM FOR INTEGRATED CIRCUIT
Abstract
An improved structure of a pin platform of an integrated circuit
having a pin platform body including a chip seat and a plurality of
leading plates having their end portions being concentrated on the
chip seat and the chip seat being connected to the pin platform
body via the connection plate, characterized in that the
surrounding of the chip seat is provided with a framing side, and
the framing side is connected to a connection plate, and the
surface of the chip seat is smaller than the connection surface of
the IC to be installed, and the size of the framing side is larger
than the size of the connection face of the IC. Therefore, a high
performance greenery package is obtained and the ground wire of the
IC can be soldered to the framing side, which provides a smooth
connection and a communication.
Inventors: |
Shieh, Wen-Lo; (Taipei,
TW) ; Yang, Chia-Ming; (Taipei, TW) ; Tsai,
Chen-Fa; (Taipei, TW) ; Liang, Shu-Fen;
(Taipei, TW) ; Chou, Shu-Min; (Taipei,
TW) |
Correspondence
Address: |
Wen-Lo Shieh
P.O. Box 82-144
Taipei
TW
|
Family ID: |
21688387 |
Appl. No.: |
10/138481 |
Filed: |
May 6, 2002 |
Current U.S.
Class: |
257/684 ;
257/E23.037; 257/E23.043 |
Current CPC
Class: |
H01L 2224/05599
20130101; H01L 24/28 20130101; H01L 24/49 20130101; H01L 2924/14
20130101; H01L 23/49541 20130101; H01L 2224/29007 20130101; H01L
2924/00014 20130101; H01L 2224/32245 20130101; H01L 2924/00014
20130101; H01L 2224/48257 20130101; H01L 2924/00014 20130101; H01L
2924/00014 20130101; H01L 2224/45015 20130101; H01L 2924/00012
20130101; H01L 2224/48247 20130101; H01L 2924/00 20130101; H01L
2924/207 20130101; H01L 2224/32245 20130101; H01L 2224/45099
20130101; H01L 2224/48247 20130101; H01L 2224/32014 20130101; H01L
2224/48257 20130101; H01L 2224/48091 20130101; H01L 2924/0103
20130101; H01L 2224/49109 20130101; H01L 2224/49171 20130101; H01L
2224/49171 20130101; H01L 2924/00 20130101; H01L 2924/00014
20130101; H01L 2924/0105 20130101; H01L 2924/01082 20130101; H01L
2924/181 20130101; H01L 2224/32245 20130101; H01L 24/48 20130101;
H01L 2924/181 20130101; H01L 2924/00014 20130101; H01L 2224/45099
20130101; H01L 2224/48247 20130101; H01L 24/32 20130101; H01L
2924/01033 20130101; H01L 2224/05554 20130101; H01L 2924/01004
20130101; H01L 2224/05599 20130101; H01L 2924/10161 20130101; H01L
2224/48091 20130101; H01L 2224/85399 20130101; H01L 2924/01005
20130101; H01L 23/49503 20130101; H01L 2224/85399 20130101; H01L
2924/01029 20130101; H01L 2924/01047 20130101; H01L 2224/73265
20130101; H01L 2224/73265 20130101; H01L 2224/73265 20130101; H01L
2924/01006 20130101; H01L 2924/078 20130101 |
Class at
Publication: |
257/684 |
International
Class: |
H01L 023/06 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 16, 2002 |
TW |
091200463 |
Claims
I claim:
1. A structure of a pin platform of an integrated circuit having a
pin platform body including a chip seat and a plurality of leading
plates having their end portions being concentrated on the chip
seat and the chip seat being connected to the pin platform body via
the connection plate, characterized in that the surrounding of the
chip seat is provided with a framing side, and the framing side is
connected to a connection plate, and the surface of the chip seat
is smaller than the connection surface of the IC to be installed,
and the size of the framing side is larger than the size of the
connection face of the IC, thereby the ground wire of the IC is
connected to the framing side.
Description
BACKGROUND OF THE INVENTION
[0001] (a) Technical Field of the Invention
[0002] The present invention relates to an improved structure of a
pin platform for integrated circuit (.degree. C.), and in
particular, a pin platform which can achieve high performance
greenery package and at the same time, proceed to manufacture of
ground wires.
[0003] (b) Description of the Prior Art
[0004] Referring to FIG. 1, there is shown an integrated circuit 10
which is adhered onto the chip seat 12 of the pin platform 11, and
after the fabrication of the wires, a packaging is provided to form
into a protective housing 13. In the process of wire forming, one
or more than one ground wires 14 are soldered onto the chip seat
12. Conventional material is for packaging IC contains lead, and
halides which are toxic material. As a result of these toxic
materials, zinc, silver and copper alloy are used to replace lead.
However, the melting points of zinc, silver and copper alloy are
higher than that of lead alloy and the area of the chip seat 12 is
larger than the IC 10. As a result, in the entire process, the
packaging material of the greenery device will be stripped as a
result of temperature effect and the defect of the product causes
the product cannot be utilized. As shown in FIG. 2, in order to
improve the above stripping phenomenon, the area of the chip seat
22 of the pin platform 21 is reduced into an area smaller than that
of the IC 20, where the smaller contact area to effectively lower
the stripping phenomenon of the chip seat 22 and the protective
housing 23 to achieve high performance greenery device. However,
the ground wire of the IC 20 lacks the soldering wire region as a
result of chip seat 22 being smaller than the area of IC, the
manufacturing of soldering wires for grounding wire cannot be
achieved. Therefore, the pin platform 21 will reduce the range of
application and does not possess practicability.
SUMMARY OF THE INVENTION
[0005] Accordingly, it is an object of the present invention to
provide an improved structure of a pin platform for integrated
circuit, wherein the manufacturing process of the soldering line
for floor wire can be improved and at the same time a high
performance greenery package can be obtained.
[0006] Yet another object of the present invention is to provide an
improved structure of a pin platform of an integrated circuit
having a pin platform body including a chip seat and a plurality of
leading plates having their end portions being concentrated on the
chip seat and the chip seat being connected to the pin platform
body via the connection plate, characterized in that the
surrounding of the chip seat is provided with a framing side, and
the framing side is connected to a connection plate, and the
surface of the chip seat is smaller than the connection surface of
the IC to be installed, and the size of the framing side is larger
than the size of the connection face of the IC, thereby the ground
wire of the IC is connected to the framing side.
[0007] The foregoing object and suns provide only a brief
introduction to the present invention. To fully appreciate these
and other objects of the present invention as well as the invention
itself, all of which will become apparent to those skilled in the
art, the following detailed description of the invention and the
claims should be read in conjunction with the accompanying
drawings. Throughout the specification and drawings identical
reference numerals refer to identical or similar parts.
[0008] Many other advantages and features of the present invention
will become manifest to those versed in the art upon making
reference to the detailed description and the accompanying sheets
of drawings in which a preferred structural embodiment
incorporating the principles of the present invention is shown by
way of illustrative example.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is a sectional view of a conventional IC package.
[0010] FIG. 2 is a sectional view of another conventional IC
package.
[0011] FIG. 3 is a top view of the structure of a pin platform for
an IC in accordance with the present invention.
[0012] FIG. 4 is a top view, schematically showing the mounting of
IC in accordance with the present invention.
[0013] FIG. 5 is a sectional view of the present structure after
packaging.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0014] The following descriptions are of exemplary embodiments
only, and are not intended to limit the scope, applicability or
configuration of the invention in any way. Rather, the following
description provides a convenient illustration for implementing
exemplary embodiments of the invention. Various changes to the
described embodiments may be made in the function and arrangement
of the elements described without departing from the scope of the
invention as set forth in the appended claims.
[0015] Referring to FIG. 3, there is shown the pin platform body 30
comprising a chip seat 31 and a plurality of leading plates 32
having their end portions being concentrated at the chip seat 31,
and the chip seat 31 is connected to the pin platform body 30 via a
connection plate 33, and the surrounding of the chip seat 31, a
framing side 34 is provided. The framing side 34 is connected to
the connection area of the connection plate 33, and the size of the
framing side 34 must be larger than the size of connection of the
IC 40.
[0016] Referring to FIGS. 4 and 5, the IC 40 is adhered onto the
chip seat 31 of the pin platform 30 with an adhesive 41, and via
wire-forming process, a plurality of signal connection points
formed on the surface of IC 40 are connected to a plurality of
leading plates 32 by leading wires 42, in particular, the ground
wire 43 of the IC 40 is soldered at the framing side 34 such that
the ground wire 43 can be smoothly connected and in
communication.
[0017] Finally, packaging process is performed to form a protective
housing 44. In accordance with the present invention, the
advantages of the pin platform are as follows:
[0018] (1) The area of the chip seat 31 of the pin platform body 30
is smaller than that of the IC 40, therefore, smaller contact area
will effectively reduce the stripping phenomenon of the chip seat
31 and the protective housing 44. Thus, high performance greenery
package can be obtained.
[0019] (2) The surrounding of the chip seat 31 is provided with a
framing side 34, and the size of the framing side 34 is larger than
that of the IC 40 such that the ground wire 43 of the IC 40 can be
soldered to the framing side 34 and the ground wire 43 can be
smoothly connected and is in communication.
[0020] It will be understood that each of the elements described
above, or two or more together may also find a useful application
in other types of methods differing from the type described
above.
[0021] While certain novel features of this invention have been
shown and described and are pointed out in the annexed claim, it is
not intended to be limited to the details above, since it will be
understood that various omissions, modifications, substitutions and
changes in the forms and details of the device illustrated and in
its operation can be made by those skilled in the art without
departing in any way from the spirit of the present invention.
* * * * *