U.S. patent application number 09/683802 was filed with the patent office on 2003-04-24 for method of mounting components on a plurality of abutted circuit board.
Invention is credited to Ko, Szu-Hsiung.
Application Number | 20030075589 09/683802 |
Document ID | / |
Family ID | 21679578 |
Filed Date | 2003-04-24 |
United States Patent
Application |
20030075589 |
Kind Code |
A1 |
Ko, Szu-Hsiung |
April 24, 2003 |
METHOD OF MOUNTING COMPONENTS ON A PLURALITY OF ABUTTED CIRCUIT
BOARD
Abstract
A method for mounting components on an abutted circuit board.
The main abutted circuit board has N first circuit boards and N
second circuit boards, where N is a positive integer. Each of the
abutted circuit boards has a front side and a rear side. The front
sides of the first circuit boards abut on the rear sides of the
second circuit boards. The method includes placing the circuit
boards in a component mounter for mounting a plurality of
components on the front sides of the first circuit boards and
mounting a plurality of components on the rear sides of the second
circuit boards. The method also includes placing the circuit boards
in the component mounter for mounting a plurality of components on
rear sides of the first circuit boards and mounting a plurality of
components on front sides of the second circuit boards.
Inventors: |
Ko, Szu-Hsiung; (Taipei
Hsien, TW) |
Correspondence
Address: |
NAIPO (NORTH AMERICA INTERNATIONAL PATENT OFFICE)
P.O. BOX 506
MERRIFIELD
VA
22116
US
|
Family ID: |
21679578 |
Appl. No.: |
09/683802 |
Filed: |
February 19, 2002 |
Current U.S.
Class: |
228/180.1 ;
228/215 |
Current CPC
Class: |
B23K 2101/42 20180801;
H05K 3/3415 20130101; B23K 1/0053 20130101; Y02P 70/613 20151101;
H05K 2203/1572 20130101; H05K 3/0097 20130101; H05K 2203/1563
20130101; Y02P 70/50 20151101 |
Class at
Publication: |
228/180.1 ;
228/215 |
International
Class: |
B23K 031/00; B23K
031/02 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 24, 2001 |
TW |
090126331 |
Claims
What is claimed is:
1. A method for mounting components on a main abutted circuit
board, the main abutted circuit board having N first circuit boards
and N second circuit boards, N being a positive integer, each of
the abutted circuit boards having a front side and a rear side, the
front sides of the first circuit boards abutting on the rear sides
of the second circuit boards, the method comprising: disposing the
main abutted circuit board in a component mounter for mounting a
plurality of components on the front sides of the first circuit
boards and mounting a plurality of components on the rear sides of
the second circuit boards; and disposing the main abutted circuit
board in the component mounter for mounting a plurality of
components on rear sides of the first circuit boards and mounting a
plurality of components on front sides of the second circuit
boards.
2. The method of claim 1 further comprising turning over the main
abutted circuit board.
3. The method of claim 1 further comprising disconnecting the
abutted circuit boards to form 2N separate circuit boards.
4. The method of claim 3 wherein N is 1 or 2.
5. The method of claim 1 further comprising: positioning a steel
plate on the front sides of the first circuit boards and on the
rear sides of the second circuit boards, the steel plate having a
plurality of holes; applying solder onto the steel plate so as to
fill the holes with solder; and removing the steel plate to mount a
plurality of solder pads on the front sides of the first circuit
boards and on the rear sides of the s econ d circuit boards so as
to solder components on the front sides of the first circuit boards
and on the rear sides of the second circuit boards.
6. The method of claim 5 further comprising: positioning the steel
plate on the rear sides of the first circuit boards and on the
front sides of the second circuit boards; applying solder onto the
steel plate when the steel plate is on the rear sides of the first
circuit boards and on the front sides of the second circuit boards
so as to fill the holes with solder; and removing the steel plate
to mount a plurality of solder pads on the rear sides of the first
circuit boards and on the front sides of the second circuit boards
so as to solder components on the rear sides of the first circuit
boards and on the front sides of the second circuit boards.
7. The method of claim 1 further comprising providing a bill of
material.
8. The method of claim 1 further comprising providing an
artwork.
9. The method of claim 1 wherein each of the circuit boards is a
circuit board disposed inside a notebook computer.
10. The method of claim 1 wherein each of the circuit boards is a
circuit board disposed inside a compact disc drive.
11. The method of claim 1 wherein each of the circuit boards is a
circuit board disposed inside a personal data assistant (PDA).
12 The method of claim 1 wherein each of the circuit boards is a
circuit board disposed inside a cellular phone.
13. A method for mounting components on a dual circuit board, the
dual circuit board having a first circuit board and a second
circuit board, each of the first and second circuit boards having a
front side and a rear side, the front side of the first circuit
board abutting on the rear side of the second circuit board, the
method comprising: disposing the dual circuit board in a component
mounter for mounting a plurality of components on the front side of
the first circuit board and mounting a plurality of components on
the rear side of the second circuit board; turning over the dual
circuit board; and disposing the dual circuit board in the
component mounter for mounting a plurality of components on a rear
side of the first circuit board and mounting a plurality of
components on a front side of the second circuit board.
14. The method of claim 13 further comprising disconnecting the
first circuit board from the second circuit board.
15. The method of claim 13 further comprising: positioning a steel
plate on the front side of the first circuit board and on the rear
side of the second circuit board, the steel plate having a
plurality of holes; applying solder onto the steel plate so as to
fill the holes with solder; and removing the steel plate to mount a
plurality of solder pads on the front side of the first circuit
board and on the rear side of the second circuit board so as to
solder components on the front side of the first circuit board and
on the rear side of the second circuit board.
16. The method of claim 15 further comprising: positioning the
steel plate on the rear side of the first circuit board and on the
front side of the second circuit board; applying solder onto the
steel plate when the steel plate is on the rear side of the first
circuit board and on the front side of the second circuit board so
as to fill the holes with solder; and removing the steel plate to
mount a plurality of solder pads on the rear side of the first
circuit board and on the front side of the second circuit board so
as to solder components on the rear side of the first circuit board
and on the front side of the second circuit board.
17. The method of claim 13 further comprising providing a bill of
material.
18. The method of claim 13 further comprising providing an
artwork.
19. A method for mounting components on a main abutted circuit
board comprising: providing the main abutted circuit board, a front
side of the main abutted circuit board having front sides of N
first circuit boards and rear sides of N second circuit boards, N
being a positive integer; disposing the main abutted circuit board
in a component mounter to mount a plurality of components on the
front side of each first circuit board and a plurality of
components on the rear side of each second circuit board; turning
over the main abutted circuit board, a rear side of the main
abutted circuit board having rear sides of N first circuit boards
and front sides of N second circuit boards; and disposing the main
abutted circuit board in the component mounter to mount a plurality
of components on the rear side of each first circuit board and a
plurality of components on the front side of each second circuit
board, the number of components mounted on the rear side of each
first circuit board being the same as the number of components
mounted on the rear side of each second circuit board, the number
of components mounted on the front side of each first circuit board
being the same as the number of components mounted on the front
side of each second circuit board.
20. A method for mounting components on a dual circuit board
comprising: providing a dual circuit board, a front side of the
dual circuit board having a front side of a first circuit board and
a rear side of a second circuit board; disposing the dual circuit
board in a component mounter to mount a plurality of components on
the front side of the first circuit board and a plurality of
components on the rear side of the second circuit board; turning
over the dual circuit board, a rear side of the dual circuit board
having a rear side of the first circuit board and a front side of
the second circuit board; and disposing the dual circuit board in
the component mounter to mount a plurality of components on the
rear side of the first circuit board and a plurality of components
on the front side of the second circuit board, the number of
components mounted on the rear side of the first circuit board
being the same as the number of components mounted on the rear side
of the second circuit board, the number of components mounted on
the front side of the first circuit board being the same as the
number of components mounted on the front side of the second
circuit board.
Description
BACKGROUND OF INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a method of mounting
components on a plurality of abutted circuit boards, and more
particularly, to a method of mounting components on a plurality of
abutted circuit boards that requires less steel plates, components
mounters, and bills of material (BOM), and artworks.
[0003] 2. Description of the Prior Art
[0004] Electronic products have proven to be indispensable tools in
modern life and become popular with consumers, particularly gadgets
that are made extra compact and mobile such as notebooks, personal
digital assistants (PDA), cellular phones, and compact disc (CD)
walkmans. As a result of the reduced volume of electronic products,
circuit boards used in the electronic product must also have their
volume reduced. In order to reduce the volume and encompass the
same components on the circuit boards, manufacturers of circuit
boards mount components on a front side and a rear side of a
plurality of abutted circuit boards with two component mounters.
Please refer to FIG. 1a and FIG. 1b. FIG. 1a and FIG. 1b are
diagrams of a prior art method for mounting components on a dual
circuit board 102. The dual circuit board 102 has a first circuit
board 104 and a second circuit board 106. The first circuit board
104 and the second circuit board 106 are abutted along a separating
line L. Each of the circuit boards 102, 104, 106 has a front side
102a, 104a, 106a and a rear side 102b, 104b, 106b.
[0005] The front side 104a of the first circuit board 104 abuts on
the front side 106a of the second circuit board 106. The first step
of the method is to dispose the dual circuit board 102 in a
component mounter 108a for mounting a plurality of components 110a
on the front side 104a of the first circuit board 104 and mounting
a plurality of components 110b on the front side 106a of the second
circuit board 106.
[0006] For example, 300 components 110a are mounted on the front
side 104a of the first circuit board 104, and 300 components 110b
are mounted on the front side 106a of the second circuit board 106.
Therefore, the front side 102a of the dual circuit board 102 has a
total of 600 components. Before the dual circuit board 102 is
disposed in the component mounter 108a, a first steel plate is
positioned on the front side 104a of the first circuit board 104
and on the front side 106a of the second circuit board 106.
[0007] The first steel plate has a plurality of holes. Then, solder
is applied onto the first steel plate so as to fill the holes with
solder. After that, the first steel plate is removed so that a
plurality of solder pads is mounted on the front side 104a of the
first circuit board 104 and on the front side 106a of the second
circuit board 106. Then, the dual circuit board 102 is placed in
the component mounter 108a and infrared rays of high temperature is
used to melt the solder pads such that the components 110a on the
front side 104a of the first circuit board 104 and the components
10b on the front side 106a of the second circuit board 106 are
soldered.
[0008] After finishing mounting components on the front side 102a
of the dual circuit board 102, the dual circuit board 102 is turned
over and then placed in another component mounter 108b for mounting
a plurality of components 112a on the rear side 104b of the first
circuit board 104 and mounting a plurality of components 112b on
the rear side 106b of the second circuit board 106. For example, 40
components 112a are mounted on the rear side 104b of the first
circuit board 104, and 40 components 112b are mounted on the rear
side 106b of the second circuit board 106. Therefore, a rear side
102b of the dual circuit board 102 has a total of 80 components.
Two separate circuit boards are formed after the separating dual
circuit board 102 along the separating line L.
[0009] Before the dual circuit board 102 is placed in the component
mounter 108b, a second steel plate is positioned on the rear side
104b of the first circuit board 104 and on the rear side 106b of
the second circuit board 106. The second steel plate has a
plurality of holes. Then, solder is applied onto the second steel
plate so as to fill the holes with solder. The second steel plate
is removed so that a plurality of solder pads is mounted on the
rear side 104b of the first circuit board 104 and on the rear side
106b of the second circuit board 106. The dual circuit board 102 is
placed in the component mounter 108b and the high temperature of
infrared rays is used to melt down the solder pads so as to solder
the components 112a on the rear side 104b of the first circuit
board 104 and solder the components 112b on the rear side 106b of
the second circuit board 106.
[0010] Please notice that the prior art method of mounting
components on a dual circuit board 102 requires two bills of
material (BOM) and two artworks corresponding to the component
mounters 108a and 108b respectively. One bill of material is
required when the component mounter 108a mounting the components
110a on the front side 104a of the first circuit board 104 and
mounting the components 110b on the front side 106a of the second
circuit board 106. The other bill of material is required when the
component mounter 108b mounting the components 112a on the rear
side 104b of the first circuit board 104 and mounting the
components 112b on the rear side 106b of the second circuit board
106.
[0011] Similarly, one artwork is provided to operators for quality
checking whether the components 110a on the front side 104a of the
first circuit board 104 and the components 110b on the front side
106a of the second circuit board 106 are mounted in accordance with
the artwork. The other artwork is provided to operators for
checking whether the components 112a on the rear side 104b of the
first circuit board 104 and the components 112b on the rear side
106b of the second circuit board 106 are mounted in accordance with
the artwork.
[0012] However, the use of two sets of each production part
increases the manufacturing cost considerably. The design of two
component mounters, two steel plates, two bills of material, and
two artworks increases the preparation required and also lengthens
the production line.
[0013] Assume that the component mounters 108a and 108b can mount a
component in one second. If the component mounters 108a and 108b
work 86400 seconds each day, an expected number of products that
the component mounters 108a and 108b within two days is:(1) The
front side 102a of the dual circuit board 102 has a total of 600
components, so the component mounter 108a can finish 86400/600=144
semi-finished products per day.
[0014] (2) The rear side 102b of the dual circuit board 102 has a
total of 80 components, so the component mounter 108b can finish
86400/80=1080 semi-finished products per day.
[0015] (3) Combined the counts from item (1) and (2), it indicates
that 144*2=288 circuit boards can be finished within two days.
[0016] As mentioned above, during same given interval, the
component mounting counts are significantly different between the
front side and the rear side of the dual circuit board. In other
words, the production rate of one side will always lag behind the
other side of the dual circuit board. As a result, the prior art
method has a limited maximum throughput of the circuit boards.
Additionally, if there are four circuit boards, the difference
between the front side and the rear side of the dual circuit board
will become more significant.
SUMMARY OF INVENTION
[0017] It is therefore a primary objective of the claimed invention
to provide a method for mounting components on a plurality of
abutted circuit boards. The method requires less steel plates,
components mounters, and bills of material (BOM), and artworks.
[0018] The numbers of components on the front side of the main
abutted circuit board are the same as the number on the rear side
of the main abutted circuit board. This allows the output levels of
the two semi-finished products to match, increasing the output of
the circuit boards. Therefore, the claimed invention can reduce the
production work and cost, shorten the production line, solve the
problem of unequal throughputs of the two semi-finished products,
and increase the throughput of the circuit boards.
[0019] The claimed invention, briefly summarized, discloses a
method for mounting components on a main abutted circuit board. The
main abutted circuit board has N first circuit boards and N second
circuit boards, where N is a positive integer. Each of the circuit
boards has a front side and a rear side. The front sides of the
first circuit boards abut on the rear sides of the second circuit
boards.
[0020] The method comprises placing the main abutted circuit board
in a component mounter for mounting a plurality of components on
the front sides of the first circuit boards and mounting a
plurality of components on the rear sides of the second circuit
boards. The method further includes placing the main abutted
circuit board in the component mounter for mounting a plurality of
components on rear sides of the first circuit boards and mounting a
plurality of components on front sides of the second circuit
boards.
[0021] These and other objectives of the present invention will be
apparent to those of ordinary skill in the art after reading the
following detailed description of the preferred embodiment, which
is illustrated in the various figures and drawings.
BRIEF DESCRIPTION OF DRAWINGS
[0022] FIG. 1a and FIG. 1b are diagrams of a prior art method for
mounting components on a dual circuit board.
[0023] FIG. 2a and FIG. 2b are diagrams of a method for mounting
components on a dual circuit board according to the present
invention.
DETAILED DESCRIPTION
[0024] The present invention provides a method for mounting
components on a main abutted circuit board. The main abutted
circuit board has N first circuit boards and N second circuit
boards, where N is a positive integer. Each of the circuit boards
has a front side and a rear side. The front side of the main
abutted circuit board is composed of the front sides of the first
circuit boards abutting on the rear sides of the second circuit
boards.
[0025] The first step of the method is to place the main abutted
circuit board in a component mounter for mounting a plurality of
components on the front sides of the first circuit boards and
mounting a plurality of components on the rear sides of the second
circuit boards. The next step is to turn over the main abutted
circuit board and place the main abutted circuit board in the
component mounter for mounting a plurality of components on rear
sides of the first circuit boards and mounting a plurality of
components on the front sides of the second circuit boards.
[0026] Compared with the prior art, the present invention requires
less steel plates, components mounters, and bills of material
(BOM), and artworks. Therefore, the present invention can reduce
the production work and cost and also shorten the production line.
The number of components on the front side of the main abutted
circuit board is the same as the number on the rear side of the
main abutted circuit board, allowing the output levels of the two
semi-finished products to be equal. Therefore, the present
invention can increase the throughput of the circuit boards. The
following gives an example of present invention for mounting
components on a dual circuit board.
[0027] Please refer to FIG. 2a and FIG. 2b. FIG. 2a and FIG. 2b are
diagrams of a method for mounting components on a dual circuit
board 202 according to the present invention. The dual circuit
board 202 has a first circuit board 204 and a second circuit board
206. The first circuit board 204 and the second circuit board 206
are abutted along a separating line M. Each of the circuit boards
202, 204, 206 have a front side 202a, 204a, 206a and a rear side
202b, 204b, 206b. The front side 204a of the first circuit board
204 abut on the rear side 206b of the second circuit board 206.
[0028] The first step of the method is to place the dual circuit
board 202 in a component mounter 208 for mounting a plurality of
components 210a on the front side 204a of the first circuit board
204 and mounting a plurality of components 212a on the rear side
206b of the second circuit board 206. For example, 300 components
210a are mounted on the front side 204a of the first circuit board
204, and 40 components 212a are mounted on the rear side 206b of
the second circuit board 206. Therefore, the front side 202a of the
dual circuit board 202 has a total of 340 components.
[0029] Before the dual circuit board 202 is placed in the component
mounter 208, a steel plate is positioned on the front side 204a of
the first circuit board 204 and on the rear side 206b of the second
circuit board 206. The steel plate has a plurality of holes. Then,
solder is applied onto the steel plate so as to fill the holes with
solder. The steel plate is removed so that a plurality of solder
pads is mounted on the front side 204a of the first circuit board
204 and on the rear side 206b of the second circuit board 206.
[0030] The dual circuit board 202 is placed in the component
mounter 208 and infrared rays of high temperature is used to melt
the solder pads such that the components 210a on the front side
204a of the first circuit board 204 and the components 212a on the
rear side 206b of the second circuit board 206 are soldered.
[0031] The second step of the method starts with turning over the
dual circuit board 202. The rear side 202b of the dual circuit
board 202 comprises the rear side 204b of the first circuit board
204 and the front side 206a of the second circuit board 206. After
that, the dual circuit board 202 is placed in the component mounter
208 for mounting a plurality of components 212b on the rear side
204b of the first circuit board 204 and mounting a plurality of
components 210b on the front side 206a of the second circuit board
206.
[0032] For example, 40 components 212b are mounted on the rear side
204b of the first circuit board 204, and 300 components 210b are
mounted on the front side 206a of the second circuit board 206.
Therefore, a rear side 202b of the dual circuit board 202 has a
total of 340 components. The rear side 202b of the dual circuit
board 202 has the same number of components as the front side 202a
of the dual circuit board 202. Two separate circuit boards are
formed after separating the dual circuit board 202 along the
separating line M.
[0033] Before the dual circuit board 202 is placed in the component
mounter 208, the steel plate is positioned on the rear side 204b of
the first circuit board 204 and on the front side 206a of the
second circuit board 206. The steel plate has a plurality of holes.
Then, solder is applied onto the steel plate so as to fill the
holes with solder. The steel plate is removed so that a plurality
of solder pads is mounted on the rear side 204b of the first
circuit board 204 and on the front side 206a of the second circuit
board 206.
[0034] The dual circuit board 202 is placed in the component
mounter 208 and infrared rays of high temperature is used to melt
the solder pads such that the components 212b on the rear side 204b
of the first circuit board 204 and the components 210b on the front
side 206a of the second circuit board 206 are soldered.
[0035] Please notice that, the present invention only requires one
bill of material (BOM) and one artwork corresponding to the
component mounter 208. The bill of material is required when the
component mounter 208 mounting the components 210a on the front
side 204a of the first circuit board 204 and mounting the
components 212a on the rear side 206b of the second circuit board
206. In addition, it is also can be required when the component
mounter 208 mounting the components 212b on the rear side 204b of
the first circuit board 204 and mounting the components 210b on the
front side 206a of the second circuit board 206.
[0036] Similarly, the artwork can not only be provided to operators
for quality checking whether the components 210a on the front side
204a of the first circuit board 204 and the components 212a on the
rear side 206b of the second circuit board 206 are mounted in
accordance with the artwork, but also can be provided to operators
for quality checking whether the components 212b on the rear side
204b of the first circuit board 204 and the components 210b on the
front side 206a of the second circuit board 206 are mounted in
accordance with the artwork.
[0037] Therefore, the present invention only requires a steel
plate, a bill of material, and an artwork corresponding to the
component mounter 208. Compared with the prior art method, the
present invention requires less steel plates, components mounters,
and bills of material (BOM), and artworks. Therefore, the present
invention can reduce production work and cost and also shorten the
production line. In the production process, the number of
components on the front side 202a of the dual circuit board 202 is
same as the number on the rear side 202b of the dual circuit board
202, so the output levels of the two semi-finished products can be
equal. Therefore the present invention can increase the throughput
of the circuit boards.
[0038] For example, assume that the component mounter 208 according
to the present invention can mount a component in one second. If
the component mounter 208 works 86400 seconds each day, an expected
number of products that two component mounters 208 within two days
is:(1) The front side 202a of the dual circuit board 202 has a
total of 340 components; as a result the component mounter 208 can
finish 86400/340=254 semi-finished products per day.
[0039] (2) The rear side 202b of the dual circuit board 202 has a
total of 340 components; as a result the other component mounter
208 can finish 86400/340=254 semi-finished products per day.
[0040] (3) Combined the counts from item (1) and (2), it indicates
that 254*2=508 circuit boards can be finished within two days.
[0041] However, assume that the component mounters 108a and 108b of
the prior art method can also mount a component in one second. If
the component mounters 108a and 108b work 86400 seconds each day,
an expected number of products that the component mounter 108a and
108b within two days is:(1) The front side 102a of the dual circuit
board 102 has a total of 600 components; as a result the component
mounter 108a can finish 86400/600=144 semi-finished products per
day.
[0042] (2) The rear side 102b of the dual circuit board 102 has a
total of 80 components; as a result the component mounter 108b can
finish 86400/80=1080 semi-finished products per day.
[0043] (3) Combined the count from item (1) and (2), it indicates
that 144*2=288 circuit boards can be finished in two days.
[0044] Consequently, the present invention can produce 508 circuit
boards in two days by using two component mounters 208, but the
prior art method can only produce 288 circuit boards in two days by
using the component mounters 108a and 108b. Therefore, the present
invention can produce (508-288)/288=76% more circuit boards than
the prior art method, producing far superior results.
[0045] Furthermore, the circuit board that is produced by use the
present invention can not only be installed in small and portable
electronic devices such as notebooks, personal digital assistants
(PDA), cellular phones, and compact disk walkmans, but can also be
installed in CD-ROM or DVD-ROM devices.
[0046] Those skilled in the art will readily observe that numerous
modifications and alterations of the device may be made while
retaining the teachings of the invention. Accordingly, the above
disclosure should be construed as limited only by the metes and
bounds of the appended claims.
* * * * *