U.S. patent application number 09/972710 was filed with the patent office on 2003-04-10 for structure of a ball grid array ic scoket connection with solder ball.
Invention is credited to Ju, Ted.
Application Number | 20030068916 09/972710 |
Document ID | / |
Family ID | 25520035 |
Filed Date | 2003-04-10 |
United States Patent
Application |
20030068916 |
Kind Code |
A1 |
Ju, Ted |
April 10, 2003 |
STRUCTURE OF A BALL GRID ARRAY IC SCOKET CONNECTION WITH SOLDER
BALL
Abstract
An improved structure of a ball grid array IC socket connection
with solder ball is disclosed. The improved structure of a Ball
Grid Array IC socket connection solder ball having a plurality of
conductive plates corresponding to IC pins is characterized in that
the conductive plates are flexible bent plate bodies for insertion
and clipping with the IC pins, and the other end of the plate body
for insertion into the IC pins is formed into a branching opening
for elastic alloy clipping of the solder ball so that the solder
ball is securely clipped and the other end of the plate body is
formed into a bending wall for insertion into the IC pin.
Inventors: |
Ju, Ted; (Keelung City,
TW) |
Correspondence
Address: |
Ted Ju
PO Box 82-144
Taipei
TW
|
Family ID: |
25520035 |
Appl. No.: |
09/972710 |
Filed: |
October 9, 2001 |
Current U.S.
Class: |
439/342 |
Current CPC
Class: |
Y02P 70/50 20151101;
H05K 3/3426 20130101; Y02P 70/613 20151101; H01R 12/57 20130101;
H05K 7/1084 20130101 |
Class at
Publication: |
439/342 |
International
Class: |
H01R 004/50 |
Claims
I claim:
1. An improved structure of a Ball Grid Array IC socket connection
solder ball having a plurality of conductive plates corresponding
to IC pins, characterized in that the conductive plates are
flexible bent plate bodies for insertion and clipping with the IC
pins, and the other end of the plate body for insertion into the IC
pins is formed into a branching opening for elastically clipping of
the solder ball so that the solder ball is securely clipped and the
other end of the plate body is formed into a bending wall for
insertion into the IC pin.
2. The improved structure of a Ball Grid Array IC socket connection
solder ball of claim 1, wherein a wall block is provided to an IC
socket and a straight through slot is provided to the wall block
and the plate body is exactly secured by the through slot,
preventing the plate body from dislocation from the through hole of
the wall block.
3. The improved structure of a Ball Grid Array IC socket connection
solder ball of claim 1, wherein an arch-shaped blocking plate is
formed on the plate body at a height higher than half of that of
the solder ball having one end being connected with the plate body,
forming a branching opening to sit and hold onto the top portion of
the solder ball.
4. The improved structure of a Ball Grid Array IC socket connection
solder ball of claim 1, wherein two parallel slits are formed on
the remote end of the plate body of IC socket insertion and a
blocking plate is formed with one end joined to the plate body, the
blocking plate is capable of clipping and sitting onto the top
portion of the solder ball.
Description
BACKGROUND OF THE INVENTION
[0001] (a) Field of the Invention
[0002] The present invention relates to an improved structure of a
ball grid array IC socket connection with solder ball, and in
particular, an IC socket having a plurality of conductive clipping
plates with clipping solder ball structure so as to eliminate the
requirement of pre-soldering of solder ball onto the conductive
clipping plates.
[0003] (b) Description of the Prior Art
[0004] Ball Grid Array IC socket is a new IC socket structure with
solder balls to replace the insertion pins protruded from the
bottom of the socket, and surface mounting technology is employed
to mount the corresponding soldering position of the solder balls
over the surface of the circuit board. FIG. 1 is a perspective view
of Ball Grid Array CPU socket. FIG. 2A is a bottom view of the
socket shown in FIG. 1 and FIG. 2B is an enlarged view of a portin
of FIG. 2A. The number of mounting pins of the corresponding IC
pins of the socket is changed to a socket with semi-engaging solder
balls 11, 12, 13 such that the bottom surface of the CPU socket 10
is protruded half the height of that of the solder balls 11, 12,
13.
[0005] FIG. 3 is a perspective view of a conventional Ball Grid
Array CPU socket connected with solder ball. Within the socket 10,
corresponding to IC pins, a plurality of straight slots 20, 21, 22
are formed. Each straight slot 20, 21, 22 is squeezed with a
bending, U-shaped conductive clipping plate 30 which is an elastic
thin strap. The bottom end of the conductive clipping plate 30 does
not protrude from the bottom of the socket 10, and a solder ball 40
is mounted to the bending section of the plate 30 such that the
upper half portion of the solder ball 40 is engaged at the straight
slot 20 and is mounted to the conductive clipping plate 30, and the
lower half portion of the solder ball 40 is used for future
mounting to a circuit board 50 at the soldering point. At an
appropriate position on the two side walls of the conductive
clipping plate 30, at least a pair of clipping walls 31, 32 is
provided for clipping with the IC pins 61, 62 of a top transverse
board 60 mounted onto the socket 10. This conductive plate 30
together with the ball solder 40 has the following drawbacks:
[0006] (1) A soldering process is required to pre-mount the solder
ball onto a conductive clipping plate and after that when the CPU
socket is be adhered to the circuit board, the solder ball has to
be heated again, and accordingly, repeating of soldering processes
is troublesome and the fabrication processes cannot be expedite;
and
[0007] (2) Due to numerous soldering points, chances of pollution
due to air pollutant are increased and therefore the quality of
conductivity at the soldered point is lowered, and further, the
connection structure of the solder ball is inappropriate.
[0008] Accordingly, it is an object of the present invention to
provide an improved structure of a Ball Grid Array IC socket
connection with solder ball which mitigates the above
drawbacks.
SUMMARY OF THE INVENTION
[0009] Accordingly, it is an object of the present invention to
provide an improved structure of a Ball Grid Array IC socket
connection with solder ball, wherein the Ball Grid Array IC socket
connecting solder ball having a plurality of conductive plates
corresponding to IC pins is characterized in that the conductive
plates are flexible bent plate bodies for insertion and clipping
with the IC pins, and the other end of the plate body for insertion
into the IC pins is formed into a branching opening for elastically
clipping of the solder ball so that the solder ball is securely
clipped and the other end of the plate body is formed into a
bending wall for insertion into the IC pin.
[0010] Yet another object of the present invention is to provide an
improved structure of a ball grid array IC socket connection with
solder ball, wherein a wall block is provided to an IC socket and a
straight through slot is provided to the wall block and the plate
body is exactly secured by the through slot, preventing the plate
body being dislocated from the through hole of the wall block.
[0011] Other object and advantages of the present invention will
become more apparent from the following description taken in
conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a perspective view of a Ball Grid Array CPU
socket.
[0013] FIG. 2A is a perspective view, viewing from the bottom of
the socket of FIG. 1.
[0014] FIG. 2B is an enlarged view of a portion of FIG. 2A.
[0015] FIG. 3 is a perspective view of a conventional Ball Grid
Array CPU socket connected with solder ball structure.
[0016] FIG. 4 is a perspective view showing the connection of the
conductive clipping plate of the solder ball with the Ball Grid
Array IC socket in accordance with the present invention.
[0017] FIG. 5 is a perspective exploded view showing the connection
of the conductive clipping plate of the solder ball with the Ball
Grid Array IC socket in accordance with the present invention.
[0018] FIG. 6 is a sectional view along line VI-VI of FIG. 4 of the
resent invention.
[0019] FIG. 7 is a sectional view along line VII-VII of FIG. 4 of
the present invention.
[0020] FIG. 8 is a perspective view showing the connection of the
solder ball with the Ball Grid Array IC socket of the present
invention.
[0021] FIG. 9 is a perspective view showing the connection of
another type of conductive clipping plate of the solder ball with
the Ball Grid Array IC socket in accordance with the present
invention.
[0022] FIG. 10 is a perspective exploded view showing the
connection of another type of conductive clipping plate of the
solder ball with the Ball Grid Array IC socket in accordance with
the present invention.
[0023] FIG. 11 is a sectional view along line XI-XI of FIG. 9 of
the present invention.
[0024] FIG. 12 is a sectional view along line XII-XII of FIG. 9 of
the present invention.
DETAILED DESCRIPTION OF THE PRESENT INVENTION
[0025] FIGS. 1 and 2A respectively show a perspective view and the
bottom perspective view of a Ball Grid Array IC socket, and FIG. 3
is a perspective view of a conventional Ball Grid Array CPU socket
connected with solder ball structure.
[0026] Referring to FIGS. 4 and 5, there is shown a perspective
view and a perspective exploded view of the connection of the
conductive clipping plate of the solder ball with the Ball Grid
Array IC socket in accordance with the present invention. As shown
in the figures, there is a plate body 100 which is a conductive
clipping plate and is flexible, for insertion and clipping of IC
pins. The plate body 100 for inserted into the other end of the IC
pins is formed into a branching opening 103 with two sides to clip
a solder ball 11 for secured mounting with the solder ball 11. When
the plate body 100 clips onto the solder ball 11, the branching
opening 103 is located at a height higher than half the height of
the solder ball 11. In view of the stricture of the plate body 100,
a slit 101 is formed with one side being connected to the plate
body 100 to form a substantial arc-shaped blocking plate 102. The
arc-shaped blocking plate 102 sits onto the top of the solder ball
11. The other end of the plate body 100 for connection with the IC
pins is formed into a bent wall 104 for the insertion and clipping
of IC pins. The external of the plate body 100 can be inserted into
a straight through slot wall block 200 and is fastened thereto.
[0027] In accordance with the present invention, FIG. 5 shows a
perspective exploded view of the Ball Grid Array IC socket having
the wall block 200 and the plate body 100. The wall block 200 has a
through slot 201 which can exactly hold the plate body 100 and the
plate body 100 is prevented from dislocation from the wall block
200. In accordance with the present invention, the wall block 200
is made from plastic material, facilitating the formation of
various shapes of the slot 201.
[0028] FIGS. 6 and 7 are sectional views of the Ball Grid Array IC
socket. As shown in the figures, the blocking plate 102 can hold
and clip the top portion of the solder ball 11, and the surrounding
of the solder ball 11 is held and clipped by the plate body 100 and
the corresponding wall of the slot 201. As shown in FIG. 8, the
external of the plate body 100 has the size of the through slots
20, 21, 22 of the CPU socket 10 and is entire inserted therein.
About half the height of the solder ball 11 is protruded above the
socket 10. When the entire structure with the solder ball 11 is
placed onto a circuit board 40, the board ball 11 will be adhered
onto the circuit board 40 by heating. The clipping surface of the
solder ball 11 will be melted and adhered to the inner wall of the
plate body 100 and the bottom face of the blocking plate 102. Thus,
a good conductivity circuit board is obtained.
[0029] Referring to FIGS. 9 and 10, a branching opening 106 is
formed by slits 107, 108 formed on a plate body 120 with a blocking
plate 105 being an arch-shaped joined to the plate body 120 at an
appropriate height. The two slits 107, 108 are parallel on the
plate body 120, the cut end of the blocking plate 105 is extended
outward and the blocking plate 105 can sit onto the top portion of
the solder ball 11, and the blocking plate 105 forms a branching
opening 106, allowing the clipping of the solder ball 11 with the
plate body 120. The plate body 120 can be placed within a through
slot 203 provided on a wall block 202. The wall block 202 can hold
the plate body 120, and the plate body 120 is prevented from
dislocation from the wall block 202. In accordance with the present
invention, the wall block 202 is made from plastic material,
facilitating the formation of various shapes of the slot 203. As
shown in FIGS. 11 and 12, there is shown the sectional view of the
Ball Grid Array CPU socket of the present invention. In accordance
with the present invention, the solder ball 11 can be secured to
the circuit board.
[0030] While the invention has been described with respect to
preferred embodiment, it will be clear to those skilled in the art
that modifications and improvements may be made to the invention
without departing from the spirit and scope of the invention.
Therefore, the invention is not to be limited by the specific
illustrative embodiment, but only by the scope of the appended
claims.
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