U.S. patent application number 10/170014 was filed with the patent office on 2003-01-16 for circuit assembly for battery pack or the like, and method of making the same.
This patent application is currently assigned to ROHM CO., LTD.. Invention is credited to Nakamura, Satoshi.
Application Number | 20030013013 10/170014 |
Document ID | / |
Family ID | 19018136 |
Filed Date | 2003-01-16 |
United States Patent
Application |
20030013013 |
Kind Code |
A1 |
Nakamura, Satoshi |
January 16, 2003 |
Circuit assembly for battery pack or the like, and method of making
the same
Abstract
A circuit assembly includes a first substrate formed with a
first wiring pattern, a second substrate formed with a second
wiring pattern, and a joint member for electrically and/or
mechanically connecting the first substrate to the second
substrate. The joint member includes a set of separated leads
extending generally parallel to each other, and a first and a
second retainers transversely connecting the leads to each other.
The first and the second retainers are formed by molding a resin so
that they are integral with the leads by allowing the molding resin
to enter the spaces between the leads.
Inventors: |
Nakamura, Satoshi; (Kyoto,
JP) |
Correspondence
Address: |
MERCHANT & GOULD PC
P.O. BOX 2903
MINNEAPOLIS
MN
55402-0903
US
|
Assignee: |
ROHM CO., LTD.
KYOTO-SHI
JP
|
Family ID: |
19018136 |
Appl. No.: |
10/170014 |
Filed: |
June 11, 2002 |
Current U.S.
Class: |
429/159 ;
29/623.4; 361/784 |
Current CPC
Class: |
H05K 2203/1572 20130101;
H05K 2201/10424 20130101; H01R 12/52 20130101; Y02E 60/10 20130101;
H01R 43/16 20130101; H01M 50/213 20210101; H01R 43/205 20130101;
Y10T 29/49114 20150115; H05K 1/148 20130101 |
Class at
Publication: |
429/159 ;
29/623.4; 361/784 |
International
Class: |
H01M 002/22; H05K
001/11 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 12, 2001 |
JP |
2001-177271 |
Claims
1. A circuit assembly comprising: a first substrate formed with a
first wiring pattern; a second substrate formed with a second
wiring pattern; and a joint member for electrically and/or
mechanically connecting the first and the second substrates;
wherein the joint member includes a set of separated leads
extending generally parallel to each other, and a retainer
transversely connecting the leads to each other; and wherein the
retainer is formed by molding a resin so as to be integral with the
leads, part of the molding resin filling spaces between the
leads.
2. The circuit assembly according to claim 1, wherein the set of
leads are bent at a position avoiding the retainer.
3. A circuit assembly comprising: a first substrate formed with a
first wiring pattern; a second substrate formed with a second
wiring pattern; and a joint member for electrically and/or
mechanically connecting the first and the second substrates;
wherein the joint member includes a set of separated leads
extending generally parallel to each other, and a first and a
second retainers for transversely connecting the leads to each
other; and wherein each of the first and the second retainers is
formed by molding a resin so as to be integral with the leads, the
molding resin filling spaces between the leads.
4. The circuit assembly according to claim 3, wherein the set of
leads are bent between the first retainer and the second
retainer.
5. The circuit assembly according to claim 3, wherein the first
retainer is arranged adjacent to the first substrate, the second
retainer being arranged adjacent to the second substrate.
6. The circuit assembly according to claim 3, wherein the joint
member further includes insulating tapes sandwiching the set of
leads from above and below between the first retainer and the
second retainer.
7. A battery pack comprising: a housing for accommodating a set of
batteries; and a circuit assembly accommodated in the housing at a
corner of the housing, the circuit assembly including a first
substrate formed with a first wiring pattern, a second substrate
formed with a second wiring pattern, and a joint member for
electrically and/or mechanically connecting the first and the
second substrates; wherein the joint member includes a set of
separated leads extending generally parallel to each other, and a
retainer transversely connecting the leads to each other; and
wherein the retainer is formed by molding a resin so as to be
integral with the leads, the molding resin filling spaces between
the leads.
8. A battery pack comprising: a housing for accommodating a set of
batteries; and a circuit assembly accommodated in the housing at a
corner thereof, the circuit assembly including a first substrate
formed with a first wiring pattern, a second substrate formed with
a second wiring pattern, and a joint member for electrically and/or
mechanically connecting the first and the second substrates;
wherein the joint member includes a set of separated leads
extending generally parallel to each other, and a first and a
second retainers transversely connecting the leads to each other;
and wherein each of the first and the second retainers is formed by
molding a resin so as to be integral with the leads, the molding
resin filling spaces between the leads.
9. The circuit assembly according to claim 8, wherein the set of
leads are bent between the first retainer and the second
retainer.
10. The circuit assembly according to claim 8, wherein the first
retainer is arranged adjacent to the first substrate, the second
retainer being arranged adjacent to the second substrate.
11. The circuit assembly according to claim 8, wherein the joint
member further includes insulating tapes sandwiching the set of
leads from above and below between the first retainer and the
second retainer.
12. The circuit assembly according to claim 11, wherein said corner
of the housing has an inner surface formed with fixing grooves for
fixing the first retainer and the second retainer of the joint
member.
13. A method of making a circuit assembly comprising the steps of:
making a bendable joint member; and electrically and/or
mechanically connecting a first substrate to a second substrate
with the joint member; wherein in the joint member making step a
resin material is injected into a mold in which an elongated
conductor frame including plural sets of leads is inserted, so that
a retainer is formed to be integral with the leads and extends
longitudinally of the conductor frame across the plural sets of
leads; and wherein each set of the leads is cut from the conductor
frame after the resin material hardens, the retainer being also cut
from the conductor frame for the respective sets of leads.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a circuit assembly
advantageously used in e.g. a battery pack of a notebook computer,
mobile phone, etc. The present invention also relates to a battery
pack provided with such a circuit assembly. Further, the present
invention relates to a method of making such a circuit
assembly.
[0003] 2. Description of the Related Art
[0004] Conventionally, various types of battery packs are used for
portable electronic devices such as notebook computers and cellular
phones. These battery packs are removable and incorporate a lithium
battery, for example.
[0005] FIG. 14 is a partial cut-away view showing the inside of a
typical battery pack provided with a circuit assembly 10 the plan
view of which is shown in FIG. 15. The circuit assembly 10,
together with a number of batteries 2, is accommodated in the
box-like, rectangular housing 1 of the battery pack P. A connector
C and several electronic components E are mounted on the circuit
assembly 10. The batteries 2 are connected to the circuit assembly
10. The circuit assembly 10 regulates the charging or discharging
of the batteries 2 and controls the passage of electric signals to
or from an external circuit.
[0006] When the battery pack P is used for a notebook computer for
example, there is an upper limit to the size of the housing 1 due
to the restricted accommodation space of the computer. Accordingly,
the housing 1 may not provide a large internal space for the parts
other than the batteries 2.
[0007] In light of this, as shown in FIG. 15, the circuit assembly
10 includes first and second substrates 11, 12 to be suitably
accommodated in the housing 1. The two substrates 11 and 12 are
electrically and mechanically connected to each other via a joint
member 41 which is bendable. This allows the circuit assembly 10,
when accommodated in the housing 1, to be bent at right angles, as
seen from FIG. 14, with the first substrate 11 being arranged along
a shorter side wall of the housing 1 and the second substrate 12
being arranged along a longer side wall of the housing 1.
[0008] The first substrate 11 and the second substrate 12 are
formed with a wiring pattern 42 on one or both surfaces of the
respective substrates. Being connected to the wiring pattern 42,
the connector C and the electronic components E are mounted on the
substrates 11 and 12, respectively. Each substrate 11, 12 has an
end portion provided with a number of terminals 43 to which the
wiring pattern 42 is connected. The leads (to be mentioned below)
of the joint member 41 are also connected to the terminals 43.
[0009] FIG. 16 is a perspective view showing the joint member 41.
The joint member 41 includes a plurality of leads 44 arranged in
parallel to each other, and insulating films 45 sandwiching the
leads 44 from above and below. The leads 44 are configured to have
a plateau in their middle portions. The ends of each lead 44 are
connected to the terminals 43 formed on the substrates 11 and 12,
whereby the substrates 11 and 12 are electrically and mechanically
connected to each other.
[0010] In the above-described joint member 41, the regularly spaced
leads 44 are held in place rather unstably by the pressing force of
the two films 45. This arrangement, however, may permit the leads
44 to shift in position between the films 45 and even come into
contact with each other when the joint member 14 is bent or
vibrated for example. Unfavorably, when the leads 44 are
short-circuited, the proper function of the circuit assembly 10
will fail.
DISCLOSURE OF THE INVENTION
[0011] An object of the present invention is to provide a circuit
assembly which is capable of properly transmitting electric signals
by preventing short-circuiting between the leads of a joint member
that connects a plurality of substrates.
[0012] Another object of the present invention is to provide a
battery pack provided with such a circuit assembly.
[0013] Another object of the present invention is to provide a
method of making such a circuit assembly.
[0014] According to a first aspect of the present invention, there
is provided a circuit assembly comprising: a first substrate formed
with a first wiring pattern; a second substrate formed with a
second wiring pattern; and a joint member for electrically and/or
mechanically connecting the first and the second substrates. The
joint member includes a set of separated leads extending generally
parallel to each other, and a retainer transversely connecting the
leads to each other. The retainer is formed by molding a resin so
as to be integral with the leads, part of the molding resin filling
spaces between the leads.
[0015] Preferably, the set of leads are bent at a position avoiding
the retainer.
[0016] According to a second aspect of the present invention, there
is provided a circuit assembly comprising: a first substrate formed
with a first wiring pattern; a second substrate formed with a
second wiring pattern; and a joint member for electrically and/or
mechanically connecting the first and the second substrates. The
joint member includes a set of separated leads extending generally
parallel to each other, and a first and a second retainers for
transversely connecting the leads to each other. Each of the first
and the second retainers is formed by molding a resin so as to be
integral with the leads, the molding resin filling spaces between
the leads.
[0017] Preferably, the set of leads are bent between the first
retainer and the second retainer.
[0018] Preferably, the first retainer is arranged adjacent to the
first substrate, while the second retainer is arranged adjacent to
the second substrate.
[0019] Preferably, the joint member further includes insulating
tapes sandwiching the set of leads from above and below between the
first retainer and the second retainer.
[0020] According to a third aspect of the present invention, there
is provided a battery pack comprising: a housing for accommodating
a set of batteries; and a circuit assembly accommodated in the
housing at a corner of the housing, the circuit assembly including
a first substrate formed with a first wiring pattern, a second
substrate formed with a second wiring pattern, and a joint member
for electrically and/or mechanically connecting the first and the
second substrates. The joint member includes a set of separated
leads extending generally parallel to each other, and a retainer
transversely connecting the leads to each other. The retainer is
formed by molding a resin so as to be integral with the leads, the
molding resin filling spaces between the leads.
[0021] According to a fourth aspect of the present invention, there
is provided a battery pack comprising: a housing for accommodating
a set of batteries; and a circuit assembly accommodated in the
housing at a corner thereof, the circuit assembly including a first
substrate formed with a first wiring pattern, a second substrate
formed with a second wiring pattern, and a joint member for
electrically and/or mechanically connecting the first and the
second substrates. The joint member includes a set of separated
leads extending generally parallel to each other, and a first and a
second retainers transversely connecting the leads to each other.
Each of the first and the second retainers is formed by molding a
resin so as to be integral with the leads, the molding resin
filling spaces between the leads.
[0022] Preferably, at a corner of the housing, fixing grooves are
formed in an inner surface of the housing for fixing the first
retainer and the second retainer of the joint member.
[0023] According to a fifth aspect of the present invention, there
is provided a method of making a circuit assembly comprising the
steps of: making a bendable joint member; and electrically and/or
mechanically connecting a first substrate to a second substrate
with the joint member. In the joint member making step, a resin
material is injected into a mold in which an elongated conductor
frame including plural sets of leads is inserted, so that a
retainer is formed to be integral with the leads and extends
longitudinally of the conductor frame across the plural sets of
leads. Then, each set of the leads is cut from the conductor frame
after the resin material hardens. The retainer is also cut from the
conductor frame for the respective sets of leads.
[0024] Other features and advantages of the present invention will
become clearer from the description of the preferred embodiment
given below with reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0025] FIG. 1 is a perspective view illustrating apart of a circuit
assembly according to an embodiment of the present invention;
[0026] FIG. 2 is a side view of the circuit assembly shown in FIG.
1;
[0027] FIGS. 3-6 illustrate a method of manufacturing a joint
member of the circuit assembly shown in FIG. 1;
[0028] FIG. 7 illustrates another method of manufacturing a joint
member;
[0029] FIG. 8 is a perspective view illustrating a part of the
battery pack with the circuit assembly to be fixed;
[0030] FIG. 9 is a plan view illustrating a part of the battery
pack;
[0031] FIG. 10 is a perspective view illustrating a joint member
according to another embodiment of the present invention;
[0032] FIG. 11 is a side view of the joint member shown in FIG.
10;
[0033] FIG. 12 is a perspective view illustrating a joint member
according to another embodiment of the present invention;
[0034] FIG. 13 illustrates a step for making the joint member shown
in FIG. 12;
[0035] FIG. 14 is a perspective view, which is partially cut away,
illustrating a battery pack including a prior-art circuit
assembly;
[0036] FIG. 15 is a plan view of the circuit assembly shown in FIG.
14; and
[0037] FIG. 16 is a perspective view illustrating a part of the
prior art circuit assembly.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0038] Preferred embodiments of the present invention will be
described below with reference to the accompanying drawings.
[0039] FIG. 1 is a perspective view showing a portion of a circuit
assembly according to a first embodiment of the present invention.
FIG. 2 is a side view of a joint member included in the circuit
assembly shown in FIG. 1. Where appropriate, in the following
description, reference will be made to FIGS. 14 and 15 illustrating
the prior art apparatus.
[0040] As shown in FIGS. 1 and 2, the circuit assembly 10 includes
a first substrate 11, a second substrate 12, and a bendable joint
member 13 for mechanically and/or electrically connecting the two
substrates to each other. As in the case shown in FIG. 14, the
circuit assembly 10 may typically be arranged in a housing 1 of a
battery pack P used for a portable device such as a notebook
computer. The housing 1 may have a rectangular box-like
configuration, and the battery pack P contains a prescribed number
of batteries 2.
[0041] In consideration of the accommodation space for the circuit
assembly 10 in the battery pack P, the first substrate 11 is so
disposed as to be perpendicular to the second substrate 12.
Specifically, the joint member 13 is bent (not shown in FIG. 14) in
a manner such that the first substrate 11 extends along a shorter
side wall of the housing 1, with a connector C exposed to the
outside, and that the second substrate 12 extends along a longer
side wall of the housing 1. The batteries 2 are connected to the
substrates 11, 12 via non-illustrated lead wires for example.
Control signals or power supply signals are transmitted between the
first substrate 11 and the second substrate 12 via the joint member
13. With this structure, the two substrates 11 and 12 connected by
the joint member 13, provide a single integral electric circuit for
regulating the battery power, control signals, etc., between the
batteries 2 and the external circuit.
[0042] The first and the second substrates 11 and 12, which are
rigid and have a rectangular configuration, provide a printed
circuit board upon which a wiring pattern 15 or 16 is formed for
passing the control signals or power signals. The connector C and
electronic components E (see FIG. 15), mounted on the substrate 11
or 12, are connected to the wiring pattern 15 or 16. The wiring
patterns 15 and 16 are provided with a number of terminals 17 and
18, respectively.
[0043] The joint member 13 includes a plurality of parallel leads
20, a first retainer 21 connecting the leads 20 transversely, and a
second retainer 22 also connecting the leads 20 transversely. Each
of the leads 20 has ends 20a, 20b connected to the terminals 17,
18, respectively, of the substrates 11, 12.
[0044] The leads 20 are resilient, thin conductive wires which may
be made of nickel or copper. The leads 20, arranged in parallel,
are spaced from each other by a predetermined distance in the
transverse direction.
[0045] The first and the second retainers 21, 22 are formed by
resin-molding so that they transverse the leads 20 and are integral
with the leads 20 for maintaining the distance between them. It
should be noted that the resin material of the retainers 21, 22
fills the spaces between the leads 20, so that the distance between
the leads 20 is stabled. The first and second retainers 21, 22 of
the present invention may be formed by insert molding from an epoxy
resin or silicone resin.
[0046] The first retainer 21 is arranged between the substrates 11
and 12 to be close to the first substrate 11. The second retainer
22 is also arranged between the substrates 11 and 12 but to be
close to the second substrate 12. In this manner, the first and the
second retainers 21, 22 hold the leads 20 together at two different
locations.
[0047] As described above, each of the retainers 21, 22 fills the
spaces between the leads 20 to prevent the initial positional
relationship of the leads from varying in the transverse direction.
Therefore, upon vibration or bending of the joint member, the
parallel leads 20 disposed at the predetermined pitch can remain
unmoved, and this considerably reduces the possibility the
short-circuiting of the adjacent leads 20. As a result, the circuit
assembly 10 functions with high reliability. Further, since the two
retainers 21, 22 are spaced from each other in the longitudinal
direction of the leads 20, the joint member 13 can be easily bent
between the two retainers 21 and 22. Use may be made of only one
retainer, but two retainers prevents the short-circuiting more
reliably.
[0048] As noted above, the first and the second retainers 21, 22
are arranged close to the first and the second substrates 11, 12,
respectively. Therefore, each lead 20 can be precisely positioned
to the corresponding one of the terminals 17, 18 of the substrates
11, 12 when the joint member 13 is fixed to the substrates 11, 12,.
This is advantageous to performing precise soldering of the ends
20a, 20b of the lead 20 to the terminals 17, 18 of the substrates
11, 12.
[0049] As shown in FIGS. 1 and 2, the first embodiment utilizes two
retainers 21, 22. However, use may be made of three or more
retainers.
[0050] Referring now to FIGS. 3-6, a method for making the circuit
assembly 10 will be described below.
[0051] For the first and the second substrates 11, 12 of the
circuit assembly 10, use may be made of a rigid printed wiring
board provided with a wiring pattern formed on one or both surfaces
of the board. A connector C and electronic components E (See FIG.
15) are mounted on the substrates 11, 12.
[0052] An elongated conductor frame 24 as shown in FIG. 3 is
prepared to form the joint member 13. The conductor frame 24 may be
made of nickel for example, and its obverse surface may be
tin-plated so that a solder material is easily adhered thereto. The
conductor frame 24 includes a pair of side bands 27 extending
longitudinally of the frame in parallel to each other. Each of the
side bands 27 is formed with a plurality of feed perforations 28
for transferring the conductor frame 24. The two side bands 27 are
connected to each other via leads 20 arranged in groups. The
adjacent groups of leads 20 are separated by division slots 26.
Each group of leads 20 will provide the leads of one joint member
10 (FIG. 1).
[0053] Then, as shown in FIG. 4, a first and a second retainers 21,
22 are formed to extend longitudinally of the conductor frame 24,
traversing the respective groups of leads 2. To form the retainers
21, 22, as shown in FIG. 5, the conductor frame 24 is put between a
pair of mold members 31, 32 that define cavities 30 corresponding
in position to the retainers 21, 22. Then a resin material is
injected. After the injected resin is hardened, the mold members
31, 32 are opened. Thus, a conductor frame 24 including leads 20
integrally formed with the first and the second retainers 21, 22 is
obtained.
[0054] Then, the conductor frame 24 together with the first and the
second retainers 21, 22 is cut along the chain lines L1 of FIG. 4
extending through the division slots 26 (i.e. transversely of the
conductor frame 24). Thus, as divided pieces of the conductor frame
24, a number of joint members 13, which are still connected to the
side bands 27, are obtained, as shown in FIG. 6.
[0055] Thereafter, each divided piece of the conductor frame 24 is
further cut along the chain lines L2 of FIG. 6 (i.e.
perpendicularly to the leads 20). As a result, the unnecessary side
bands 27 are removed, to produce a plurality of completed joint
members 13.
[0056] The use of a conductor frame 24 makes it possible to produce
a prescribed number of joint members 13 collectively, which is
advantageous to improving the production efficiency. The cutting of
the conductor frame 24 may be performed in various ways. For
instance, the conductor frame 24 may first be cut longitudinally
and then transversely of the frame. Alternatively, as indicated by
phantom lines L3 in FIG. 7, the conductor frame 24 may be cut
rectangularly.
[0057] Each of the joint members 13 manufactured in this way is
connected to substrates 11, 12. Specifically, as shown in FIG. 1,
the leads 20 of the joint member 13 are soldered to the terminals
17, 18 of the respective substrates 11, 12. Preferably, a solder
paste may be applied to the terminals 17, 18 or the ends 20a, 20b
of the leads 20 in advance. Then, the solder paste is melted
(heated in a reflow oven), with the ends 20a, 20b of each lead 20
positioned precisely onto the relevant terminals 17, 18 of the
substrates 11, 12. In this manner, the two substrates 11, 12 are
connected to each other by the joint member 13, and a circuit
assembly 10 is obtained.
[0058] The circuit assembly 10 is accommodated in the housing 1 of
a battery pack P in a manner shown in FIGS. 8 and 9 (See also FIG.
15). Specifically, the circuit assembly 10 is positioned at a
corner of the battery pack P with the joint member 13 being bent.
In its inner surfaces, the housing 1 of the battery pack P is
provided with fixing grooves 33 into which the retainers 21, 22 of
the joint member 13 are fitted. Also, the corner of the housing 1
is formed with a bend-accommodating portion 34 to provide room for
possible protrusion of the leads 20 bent in the middle. With these
arrangements, the circuit assembly 10 can be readily attached to
the housing 1, and remain to be secured to the housing 1. The inner
surfaces of the housing 1 may be provided with an insulating film
for preventing the short-circuiting between the leads 20 and the
housing 1.
[0059] As described above, the joint member 13 is advantageous to
ensuring the prevention of the short-circuiting between the leads
20, as well as to allowing the circuit assembly 10 to be
accommodated compactly in the battery pack P due to the flexibility
of the joint member.
[0060] The configuration and size of the joint member 13 may be
modified as desired, and may be so adjusted as to correspond to the
configuration of the battery pack P. For instance, when the corner
of the housing 1 is curved, the joint member 13 may be formed into
an arc for enabling proper accommodation in the housing 1.
[0061] FIGS. 10 and 11 show a second embodiment of the present
invention, where two joint members 13 are used for connecting the
first and the second substrates 11, 12. Specifically, one of the
joint members 13 is connected to wiring patterns 15, 16 formed on
the obverse surfaces of the first and the second substrates 11, 12,
whereas the other one of the joint members 13 is connected to
wiring patterns 35, 36 formed on the reverse surfaces of the first
and the second substrates 11, 12. With this structure, a larger
amount of signals can be transmitted between the first substrate 11
and the second substrate 12, which increases the density of the
circuits in the circuit assembly 10.
[0062] FIG. 12 illustrates a third embodiment of the present
invention. In this embodiment, the joint member 13 is provided with
two insulating tapes 37 sandwiching the leads 20 from above and
below between the first and the second retainers 21, 22. The
insulating tapes 37 may be formed of polyimide resin for
example.
[0063] The joint member 13 with the insulating tapes 37 may be
formed as follows. In the step shown in FIG. 4, the first and the
second retainers 21, 22 are formed. Then, two elongated pieces of
insulating tapes 37, extending longitudinally of the conductor
frame 24, are attached to the conductor frame 24 between the
retainers 21, 22 from the obverse and the reverse sides by
thermocompression.
[0064] The insulating tapes 37 attached to the leads 20 prevent the
leads 20 from coming into direct contact with other parts or the
housing 1 of the battery pack P. Further, due to the insulating
tapes 37, the joint member 13 roughly resembles a flat package-type
semiconductor device. Thus, as shown in FIG. 13, the joint member
13 can reliably be sucked with a suction collet 38 to be
transferred. Thus, the ends 20a, 20b of each lead 20 can be readily
mounted on the terminals 17, 18 of the substrates 11, 12. The
automation using the suction collet 38 shortens the working time
and enhances the reliability of the work.
[0065] The present invention is not limited to the embodiments
described above, and the circuit assembly 10 of the present
invention may be utilized for applications other than the battery
pack of a mobile electronic device such as a camera or
videocassette recorder.
[0066] In the above-described embodiments, a two-substrate
arrangement is described. However, it is possible to connect three
or more substrates by a plurality of joint members. The material,
size, configuration, etc. of the retainers, insulating tapes, leads
are not limited by the above-described embodiments. The number of
leads in a joint member is not limited by the embodiments.
* * * * *