U.S. patent application number 10/136460 was filed with the patent office on 2002-11-21 for method for forming a compact sensing apparatus in a dual-piece monolithic substrate.
Invention is credited to Smith, Marshall E. E. JR., Stettler, Richard W., Wolff, Peter U..
Application Number | 20020173065 10/136460 |
Document ID | / |
Family ID | 27574919 |
Filed Date | 2002-11-21 |
United States Patent
Application |
20020173065 |
Kind Code |
A1 |
Smith, Marshall E. E. JR. ;
et al. |
November 21, 2002 |
Method for forming a compact sensing apparatus in a dual-piece
monolithic substrate
Abstract
A sensing apparatus having a sensor formed in a monolithic
semiconductor substrate and oriented orthogonally to a signal
conditioner is provided. The sensor generates a sensing signal in
response to a predetermined physical stimulus. A signal conditioner
electrically connected and responsive to the sensor conditions the
sensing signal. The sensor and signal conditioner are formed on
wafer surfaces of a single semiconductor substrate cut from a
semiconductor wafer. The substrate is separated, one portion having
the sensor formed on therein and the other having formed therein
the signal conditioner. The portions are oriented and rejoined to
form a monolithic semiconductor substrate. The resulting monolithic
substrate has, then, a sensor and signal conditioner formed therein
and angled relative to each other at a predetermined angle.
Inventors: |
Smith, Marshall E. E. JR.;
(Eaton, FL) ; Stettler, Richard W.; (Winter Haven,
FL) ; Wolff, Peter U.; (Winter Haven, FL) |
Correspondence
Address: |
Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
Suite 1401
255 South Orange Avenue
P.O. Box 3791
Orlando
FL
32802-3791
US
|
Family ID: |
27574919 |
Appl. No.: |
10/136460 |
Filed: |
May 1, 2002 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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60288282 |
May 2, 2001 |
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60288312 |
May 2, 2001 |
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60288313 |
May 2, 2001 |
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60287856 |
May 1, 2001 |
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60287763 |
May 1, 2001 |
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60288281 |
May 2, 2001 |
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60288279 |
May 2, 2001 |
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Current U.S.
Class: |
438/48 |
Current CPC
Class: |
G01D 21/02 20130101 |
Class at
Publication: |
438/48 |
International
Class: |
H01L 021/00 |
Claims
That claimed is:
1. A method for forming a compact sensing apparatus, the method
comprising: forming a sensor and a signal conditioner on a
monolithic semiconductor substrate; and orienting the sensor and
the signal conditioner so that the sensor and the signal
conditioner are positioned with respect to each other at a
predetermined angle greater than one hundred eighty (180) degrees,
the predetermined angle being defined by the angle of rotation
between an imaginary initial plane extending substantially parallel
to the signal conditioner and an imaginary terminal place extending
substantially parallel to the sensor.
2. A method for forming a compact sensing apparatus as defined in
claim 1, wherein the monolithic semiconductor substrate is formed
from a semiconductor wafer and comprises two opposing wafer
surfaces, and wherein the step of forming a sensor and a signal
conditioner on the monolithic semiconductor substrate comprises
forming the sensor and the signal conditioner on the same wafer
surface of the monolithic semiconductor substrate.
3. A method for forming a compact sensing apparatus as defined in
claim 1, wherein the monolithic semiconductor substrate is formed
from a semiconductor wafer and comprises two opposing wafer
surfaces, and wherein the step of forming a sensor and a signal
conditioner on the monolithic semiconductor substrate comprises
forming the sensor and the signal conditioner on opposing wafer
surfaces of the monolithic semiconductor substrate.
4. A method for forming a compact sensing apparatus as defined in
claim 1, the method further comprising forming at least one
electrically conductive path between the sensor and the signal
conditioner.
5. A method for forming a compact sensing apparatus, the method
comprising: forming a sensor and a signal conditioner on a single
monolithic semiconductor, the monolithic substrate formed from a
semiconductor wafer and having first and second opposing wafer
surfaces; orienting the sensor and the signal conditioner so that
the sensor and the signal conditioner are positioned with respect
to each other at a predetermined angle greater than one hundred
eighty (180) degrees, the predetermined angle being defined by the
angle of rotation between an imaginary initial plane extending
substantially parallel to the signal conditioner and an imaginary
terminal place extending substantially parallel to the sensor; and
forming an electrically conductive path between the sensor and the
signal conditioner.
6. A method for forming a compact sensing apparatus as defined in
claim 5, wherein the step of forming the sensor and the signal
conditioner on a single monolithic semiconductor comprises forming
the sensor on a first portion of a wafer surface of the monolithic
substrate and forming the signal conditioner on a second portion of
a wafer surface of the same monolithic substrate.
7. A method of forming a compact sensing apparatus as defined in
claim 6, the step of orienting the sensor and the signal
conditioner so that the sensor and the signal conditioner are
positioned with respect to each other at the predetermined angle
comprises separating the monolithic substrate into a sensor
substrate and a signal conditioner substrate, the sensor substrate
having the sensor formed thereon and the signal conditioner
substrate having the signal conditioner formed thereon, and
positioning the sensor substrate and signal substrate relative to
each other to thereby orient the sensor at the predetermined angle
relative to the signal conditioner.
8. A method for forming a compact sensing apparatus as defined in
claim 8, wherein the method further comprises forming at least one
bond pad on the sensor substrate, the bond pad being electrically
connected to the sensor formed on the sensor substrate, and forming
at least one bond pad on the signal conditioner substrate, the bond
pad being electrically connected to the signal conditioner formed
on the signal conditioner substrate.
9. A method as defined in claim 8, wherein step of forming an
electrically conductive path between the sensor and the signal
conditioner comprises electrically connecting at least one
conductor between the sensor and the signal conditioner, the at
least one conductor having a first end connected to an at least one
bond pad formed on the sensor substrate and a second end portion
connected to an at least one bond pad formed on the signal
conditioner substrate.
10. A method as defined in claim 9, wherein the step of forming an
electrically conductive path further comprises forming at least one
bond pad and positioning at least one conductor on a cut plane of
the sensor substrate to thereby form at least a portion of the
electrically conductive path between the sensor formed on a wafer
surface of the sensor substrate and the signal conditioner formed
on a wafer surface of the signal conditioner substrate.
11. A method for forming a compact sensing apparatus, the method
comprising: forming a sensor and a signal conditioner on a single
monolithic semiconductor substrate; separating the semiconductor
substrate into a sensor substrate the sensor formed thereon and a
signal conditioner substrate having the signal conditioner formed
thereon; fixedly positioning the sensor substrate and the signal
conditioner substrate relative to each other so that the sensor and
the signal conditioner are oriented with respect to each other at a
predetermined angle greater than one hundred eighty (180) degrees,
the predetermined angle being defined by the angle of rotation
between an imaginary initial plane extending substantially parallel
to the signal conditioner and an imaginary terminal place extending
substantially parallel to the sensor; and forming an electrically
conductive path between the sensor and the signal conditioner.
12. A method for forming a compact sensing apparatus as defined in
claim 11, the method further comprising forming at least one
recessed channel in the sensor substrate and forming at least one
recessed channel in the signal conditioner substrate, the at least
one recessed channels being positioned to align with each other
when the sensor substrate and the signal conditioner substrate are
positioned relative to each other so that the sensor and the signal
conditioner are oriented with respect to each other at the
predetermined angle, the aligned recessed channels providing a
connected path between the sensor substrate and the signal
conditioner substrate within which can be diffused a conductive
thermosetting material to form the electrically conductive path
between the sensor and the signal conditioner.
13. A method for forming a compact sensing apparatus as defined in
claim 12, wherein the at least one recessed channel formed in the
sensor substrate and the at least one recessed channel formed in
the signal conditioner substrate are both formed by forming a
corresponding single recessed channel in the single monolithic
substrate prior to the separation of the single monolithic
substrate, the single monolithic substrate being separated along a
cut path that intersects single recessed channel such that after
separation of the single monolithic substrate a portion of the
single recessed channel forms the recessed channel formed in the
sensor substrate and another portion of the single recessed channel
forms the recessed channel formed in the signal conditioner
substrate to thereby permit the channels to be aligned to from the
connected path between the sensor substrate and the signal
conditioner substrate.
14. A method for forming a compact sensing apparatus, the method
comprising: forming a sensor and a signal conditioner on a single
monolithic semiconductor substrate; separating the semiconductor
substrate into a sensor substrate the sensor formed thereon and a
signal conditioner substrate having the signal conditioner formed
thereon; flexibly positioning the sensor substrate and the signal
conditioner substrate relative to each other so that the sensor and
the signal conditioner are oriented with respect to each other at a
predetermined angle greater than one hundred eighty (180) degrees,
the predetermined angle being defined by the angle of rotation
between an imaginary initial plane extending substantially parallel
to the signal conditioner and an imaginary terminal place extending
substantially parallel to the sensor; and forming an electrically
conductive path between the sensor and the signal conditioner.
15. A method for forming a compact sensing apparatus as defined in
claim 14, wherein the step of flexibly positioning the sensor
substrate and the signal conditioner substrate comprises
positioning the sensor substrate and the signal conditioner
substrate on a mounting base having sufficient pliability to permit
the sensor and the signal conditioner to shift positions relative
to each other within a predetermined range of movements.
15. A method for forming a compact sensing apparatus as defined in
claim 14, wherein the mounting base is a flexible ribbon cable.
16. A method for forming a compact sensing apparatus as defined in
claim 13, further comprising etching the surface of the
semiconductor substrate prior to separating the semiconductor
substrate, the step of etching forming an etched portion of the
substrate that is angled relative to the remaining surface portion
of the substrate.
17. A method for forming a compact sensing apparatus as defined in
claim 16, further comprising metallizating at least a portion of
the monolithic substrate including the etched portion of the
substrate to form wire bond pads along the etched portion of the
substrate.
18. A method for forming a compact sensing apparatus, the method
comprising: forming a sensor and a signal conditioner on a
monolithic semiconductor substrate; separating the semiconductor
substrate into a sensor substrate on which the sensor is formed and
a signal conditioner substrate on which the signal conditioner is
formed; positioning the sensor substrate and the signal conditioner
substrate on a flexible conducting cable; bending the flexible
conducting cable so that the sensor and the signal conditioner are
oriented with respect to each other at a predetermined angle
greater than one hundred eighty (180) degrees, the predetermined
angle being defined by the angle of rotation between an imaginary
initial plane extending substantially parallel to the signal
conditioner and an imaginary terminal place extending substantially
parallel to the sensor; and forming an electrically conductive path
positioned between the sensor and the signal conditioner, the path
being connected to the sensor and the signal conditioner to
electrically connect the sensor and the signal conditioner.
19. A method for forming a compact sensing apparatus as defined in
claim 18, wherein the step of positioning the sensor substrate and
the signal conditioner substrate on the flexible conducting cable
comprises fixedly joining the sensor substrate and the signal
conditioner substrate to the cable with an electrically conductive
thermosetting material.
Description
RELATED APPLICATIONS
[0001] This application claims priority to Provisional Application
Serial No. 60/288,282, filed May 2, 2001, and incorporates by
reference the disclosures of Provisional Application Serial No.
60/288,312 filed May 2, 2001, Provisional Application Serial No.
60/288,313 filed May 2, 2001, Provisional Application Serial No.
60/287,856 filed May 1, 2001, Provisional Application Serial No.
60/287,763 filed May 1, 2001, Provisional Application Serial No.
60/288,281 filed May 2, 2001, and Provisional Application Serial
No. 60/288,279 filed May 2, 2001.
FIELD OF THE INVENTION
[0002] The present invention relates to the field of sensing
apparatuses and, more particularly, to the field of sensing
apparatuses having a sensing element formed in a monolithic
semiconductor substrate.
BACKGROUND OF THE INVENTION
[0003] Many different types of electrical and mechanical systems
incorporate a sensing apparatus for detecting and measuring
physical or chemical stimuli. Such sensing devices can be made to
sense the presence and intensity of electrical or magnetic fields.
Similarly, sensing apparatuses can be made to detect mechanical
forces, measuring the temperature or flow of a liquid or gas, or
register the acceleration of a solid body.
[0004] Over the years various types of sensing devices have been
developed to accomplish these disparate tasks. The sensing
apparatuses developed rely on a transducer or other sensing element
having a specific preferred orientation in relation to the
electrical or magnetic field or the a mechanical force to be
sensed. Examples of electrical or magnetic field sensing elements
are position and proximity sensors such as a Hall-effect cell, a
magnetoresistor, a capacitive sensing element, and inductive
sensing elements. An example of a mechanical force sensing element
is a stress gauge that measures mechanical stress or weight of an
object. Another example of a mechanical force sensing element is
the accelerometer, which measures the acceleration of an
object.
[0005] These sensing devices, then, typically have a preferred
orientation for the sensing element relative to the electrical or
magnetic field or to the physical force that is being sensed. The
device thus must be oriented so that the sensing element has the
preferred orientation if the sensor's sensitivity is to be
optimized. There also may be extraneous electrical or magnetic
fields or mechanical forces in the system with which the sensing
device must accommodate, preferably by orienting the sensor
relative to these extraneous fields or forces in a specific
direction so as to reduce the sensor's sensitivity to the
extraneous fields or forces. Such orientation can reduce sensing
errors or noise caused by the movement of other objects or caused
by the presence of other fields or forces within the vicinity of
the sensing device.
[0006] Sensing apparatuses typically also rely on signal
conditioning circuitry to amplify or otherwise condition the
sensing signal that typically has too low a magnitude to overcome
extraneous noise effects. The signal conditioning circuitry is also
employed to condition a sensing signal that contains a large offset
or other error signal that can overdrive sensitive monitoring
equipment. Indeed, the signal conditioning circuitry can condition
a sensing signal not otherwise conducive to transmission over an
extended distance to a remotely located electrical device such a
sensor monitoring circuit.
[0007] Thus, regardless of the specific nature of the stimulus to
be sensed by a sensing apparatus, the device typically must include
signal conditioning circuitry connected to a sensing element, which
in turn, is positioned in a preferred orientation so as to maximize
its sensing sensitivity.
[0008] Prior art sensing apparatuses typically are manufactured
with the sensing element and the signal conditioning circuitry on a
common-plane wafer, both which are interconnected via conductors
(e.g., using metal or other conductive traces) formed on the same
plane. These prior art devices typically are then installed in an
electrical or a mechanical system with the sensing element oriented
in a specific direction relative to the field being sensed. For a
sensing apparatus having the sensing element and signal conditioner
formed on a common-plane, then, the orientation also determines the
orientation of the signal conditioner.
[0009] The amount of area occupied by the sensing element is
ordinarily much smaller than the area required for the signal
conditioning circuitry. Common-plane orientation of both the
sensing element and the signal conditioning circuitry, therefore,
generally produces a sensing apparatus having a larger cross
section than could otherwise be achieved were the sensing element
and the signal conditioner separately oriented in directions. This
is an increasingly important consideration because sensing
apparatuses are employed in electrical and mechanical systems that
are increasingly smaller and thus require evermore compact sensing
devices. In addition, the sensing apparatuses are increasingly
tasked with ever more complicated functions, necessitating
accordingly more complex circuitry. There is thus a need to reduce
the size of sensing apparatuses by, for example, separately
orienting the sensing element and the signal conditioning
circuitry.
[0010] At the same time, though, the reduced size can not come at
the expense of the structural integrity of the sensing apparatus
because sensing devices typically are used in electrical and
mechanical systems that are subject to harsh conditions such as
extreme vibrations and accelerations, extreme temperature
variations, exposure to harsh chemicals. Thus, while there is an
ever greater need to reduce the overall size of the sensing
apparatus, there is a corresponding need to maintain or enhance the
structural integrity of the device.
SUMMARY OF THE INVENTION
[0011] With the foregoing in mind, the present invention
advantageously provides a sensing apparatus reduced in size by
orienting of the sensor and signal conditioner in separate planes
while maintaining the overall structural integrity of the device.
The sensor generates a sensing signal in response to a
predetermined physical stimulus. The signal conditioner senses the
sensing signal generated by the sensor in response to the
predetermined physical stimulus. The physical stimulus can be an
electric field, a magnetic field, or a mechanical force.
[0012] According to the method aspects of the present invention,
the compact sensing apparatus is formed by positioning a sensor on
a wafer surface of a semiconductor substrate. Signal conditioning
circuitry defining a signal conditioner also is formed on a wafer
surface of the same semiconductor substrate. The substrate is
separated and rejoined so as to form a monolithic semiconductor
substrate. On the monolithic substrate, the sensor and signal
conditioner are oriented relative to each other at a predetermined
angle. With the sensor and the signal conditioner so oriented, the
overall size of the sensing apparatus is advantageously
reduced.
[0013] More specifically, the method comprises forming both a
sensor and conditioning circuitry defining a signal conditioner on
the single monolithic substrate. The substrate preferably is
composed of a semiconductor material such as silicon or other
semiconductor material. The monolithic substrate is formed by
cutting it from a wafer that itself has been sliced from an ingot
composed of silicon or other semiconductor material. If the
monolithic substrate is cut from a semiconductor wafer, the wafer
preferably is cut so as to provide a monolithic substrate having
two opposing surfaces corresponding to the opposing surfaces of the
wafer from which the monolithic substrate is cut. These opposing
surfaces of the monolithic semiconductor substrate, then, define
wafer surfaces of the substrate.
[0014] According to a first method, the sensor and the signal
conditioner are formed on the same wafer surface of the monolithic
substrate. A plurality of bonding pads and conductors for forming a
conductive path between the sensor and the signal conditioner are
also formed on the substrate. At least one conductor and bonding
pad is formed on the wafer surface, while at least one conductor
and bonding pad is formed on a cut plane oriented at predetermined
angle relative to the wafer surface of the substrate. Accordingly,
the substrate on which the sensor and signal conditioner have been
formed is separated. The sensor and signal conditioner are then
oriented relative to each other at the predetermined angle and the
corresponding conductors and bonding pads formed on the wafer
surface and cut plane are aligned relative to each other. In a
final step, the aligned pieces on which the sensor and signal
conditioner are formed are rejoined to thereby form a compact
sensing apparatus comprising a monolithic substrate having a sensor
and signal conditioner oriented at the predetermined angle.
[0015] Thus, the method comprises reorienting the sensor and the
signal conditioner so that the sensor and the signal conditioner
are positioned with respect to each other at a predetermined angle
on a monolithic substrate. The predetermined angle is defined by
the angle of rotation between an imaginary initial plane extending
substantially parallel to the signal conditioner and an imaginary
terminal place extending substantially parallel to the sensor. The
predetermined angle is greater than predetermined angle is greater
than one hundred eighty (180) degrees. Preferably, the
predetermined angle is two hundred seventy (270) degrees so that
the sensor and the signal conditioner are oriented orthogonally
relative to each other.
[0016] The sensor and signal conditioner can be formed on a common
wafer surface of the monolithic substrate, or alternatively, on
opposing wafer surfaces prior to separation of the substrate to
form the two separate pieces. The method further comprises forming
a path between the sensor and the signal conditioner with a
plurality of bonding pads and electrical conductors. Preferably,
the conductive path will be formed after the monolithic substrate
on which the sensor and signal conditioner are formed has been
separated into two pieces defining, respectively, the sensor and
the signal conditioner, and having the sensor formed on the sensor
substrate and the signal conditioner being formed on the signal
conditioner substrate.
[0017] In order to facilitate forming the conductive path between
the sensor and the signal conditioner, at least one electrical
conductor is preferably formed on a cut plane of the sensor
substrate for providing the electrically conductive path between
the sensor and the signal conditioner. Forming the electrical
conductor on the cut plane permits the sensor to be positioned at
any angle, including orthogonally, relative to the signal
conditioner and the surface on which the signal conditioner is
formed.
[0018] A further method aspect of the present invention provides
for efficiently forming a plurality of compact sensing apparatuses.
A plurality of signal conditioners with bonding pads and conductors
are formed on a single semiconductor wafer. The plurality of signal
conditioners are formed spaced apart from one another and arranged
substantially in a row along the semiconductor wafer on which each
is formed. A plurality of sensors also are formed. Each of the
sensors formed also are spaced apart and arranged in row-like
fashion, each corresponding to one of the signal conditions formed
on the same semiconductor wafer. Multiple rows of sensors and
corresponding signal conditioners can be formed on the same wafer,
either on the same wafer surface or opposing wafer surfaces.
[0019] The semiconductor wafer is sliced into strips, each having a
row-arranged set of sensors and corresponding signal conditioners.
The strips are then arranged on edge and, on a cut plane of each
strip, a plurality of bonding pads and conductors are formed. The
bonding pads and conductors formed on the cut plane will be part of
the conductive paths that ultimately will be formed to electrically
connect each sensor and corresponding signal conditioner. Each
strip is then separated into a plurality of single monolithic
semiconductor substrates, each strip having formed thereon on a
sensor, signal conditioner, conductors, and bonding pads. Each
monolithic substrate can then be formed into a compact sensing
apparatus having a sensor and signal conditioner angled at a
predetermined angle according to the methods described above.
[0020] Accordingly, each sensing apparatus formed according to the
method aspects of the present invention comprises a monolithic
substrate created by rejoining separate pieces of the same
substrate. According to one method the monolithic substrate can be
formed by rejoining the separate pieces of the substrates,
connecting them for example with a thin film of nonconductive epoxy
positioned between two surface portions of the dual pieces.
[0021] The sensor and signal conditioner are electrically connected
via conductors that extend between the wire bond pads and the
sensor and the signal conditioner, respectively. More specifically,
according to additional method aspects of the present invention,
recessed channels are formed in the sensor substrate and
subsequently filled with a conductive epoxy to form a conductive
path between the sensor and the signal conditioner. Specifically,
at least one recessed channel is formed in the wafer surface of the
signal conditioner substrate on which the signal conditioner is
formed. The sensor substrate having the sensor formed also on a
wafer surface is oriented so that at least one recessed channel can
be formed in a cut plane of the senor substrate.
[0022] The sensor substrate and the signal conditioner substrate
are then are oriented so that the at least one recessed channels on
each substrate align with one another. Electrical conductors
extending between the recessed channel on the sensor substrate and
the sensor, as well as between the recessed channel on the signal
conditioner substrate and the signal conditioner can now be formed
on the respective substrates, or alternatively, are already formed
thereon. Therefore, when the recessed channels are aligned, they
can be filled with a conductive epoxy or other conductive
thermosetting material thereby completing a conductive path between
the sensor and the signal conditioner.
[0023] It is important to note that the order in which the steps
are carried out can be varied. The recessed channels can be formed
prior to separation of the single monolithic substrate into a
sensor substrate and signal conditioner substrate. Indeed, the
recessed channels can be formed on the substrate prior to formation
of the sensor and the signal conditioner. Alternatively, as
described above, the recessed channels can be formed after the
single monolithic substrate is separated into a sensor substrate
and signal conditioner substrate but prior to joining the
substrates to reform a monolithic substrate having the sensor and
signal conditioner oriented at a predetermined angle. As alluded to
above, the electrical conductors can be formed at various points in
the process as well.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Some of the features, advantages, and benefits of the
present invention having been stated, others will become apparent
as the description proceeds when taken in conjunction with the
accompanying drawings in which:
[0025] FIG. 1A is a perspective view of a sensing apparatus formed
from dual pieces of a semiconductor substrate according to the
present invention;
[0026] FIG. 1B is a perspective view of a sensing apparatus formed
from dual pieces of a semiconductor substrate according to the
present invention;
[0027] FIG. 1C is a perspective view of a sensing apparatus formed
from dual pieces of a semiconductor substrate according to the
present invention;
[0028] FIG. 2A is a perspective view of a sensing apparatus formed
from dual pieces of a semiconductor substrate according to the
present invention;
[0029] FIG. 2B is a perspective view of a sensing apparatus formed
from dual pieces of a semiconductor substrate according to the
present invention;
[0030] FIG. 2C is a perspective view of a sensing apparatus formed
from dual pieces of a semiconductor substrate according to the
present invention;
[0031] FIG. 3 is a side elevational view of a sensing apparatus
according to the present invention;
[0032] FIG. 4 is a side elevational view of a sensing apparatus
according to the present invention;
[0033] FIG. 5 is cross sectional view of the interface between a
base portion and encapsulation of the sensing apparatus according
to the present invention;
[0034] FIG. 6 is a perspective view of a sensing apparatus
according to the present invention;
[0035] FIG. 7 is flow diagram of a method of forming a sensing
apparatus according to the present invention;
[0036] FIG. 8 is flow diagram of a method of forming a sensing
apparatus according to the present invention; and
[0037] FIG. 9 is flow diagram of a method of forming a sensing
apparatus according to the present invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0038] The present invention will now be described more fully
hereinafter with reference to the accompanying drawings which
illustrate preferred embodiments of the invention. This invention
may, however, be embodied in many different forms and should not be
construed as limited to the embodiments set forth herein. Rather,
these embodiments are provided so that this disclosure will be
thorough and complete, and will fully convey the scope of the
invention to those skilled in the art. Like numbers refer to like
elements throughout, the prime notation, if used, indicates similar
elements in alternative embodiments.
Sensing Apparatus Formed From Two Pieces of a Single Monolithic
Substrate
[0039] FIGS. 1A-1C illustrate a compact sensing apparatus 20 having
a sensor 22 and signal conditioner 24, the sensor 22 and the signal
conditioner 24 being formed from the same monolithic semiconductor
substrate 26 and angled relative to one another at a predetermined
angle, .alpha.. The predetermined angle, .alpha., is defined as the
angle of rotation between an imaginary initial plane extending
substantially parallel to the signal conditioner and an imaginary
terminal plane extending substantially parallel to the sensor. The
predetermined angle can be any value greater than zero and up to
three hundred sixty (360), but is preferably greater than one
hundred (180) degrees. The sensor 22 serves to generate a sensing
signal in response to a predetermined stimulus. The signal
conditioner 24 is electrically connected to the signal conditioner
and conditions the signal generated by the sensor 22. The
predetermined angle dictates the orientation of the sensor 22
relative to the stimulus it is to sense, while also determining the
overall size of the sensing apparatus 20.
[0040] The single monolithic substrate 26 on which the sensor 22
and the signal conditioner 24 are formed can, itself, be formed
from a semiconductor wafer. As will be readily understood by those
familiar with the art, the semiconductor wafer will typically have
been sliced from an ingot of semiconductor material. Each such
slice of the semiconductor ingot forms a circular wafer having two
opposing wafer surfaces parallel to the planes through which the
ingot has been sliced and an annular edge connecting the opposing
surfaces thereby forming the solid wafer.
[0041] According to the present invention, the monolithic substrate
26 preferably will have been formed by through the opposing
surfaces of a semiconductor wafer, the cutting being along
preselected dimensions dictated by the size of the sensor 22 and
the signal conditioner 24 which are to be formed on the resulting
substrate. So formed, the monolithic substrate 26 has two surfaces
(portions of the opposing surfaces of the wafer from which the
wafer has been cut), defining opposing wafer surfaces of the
substrate. The sensor 22 and the signal conditioner 24 will be
formed on a wafer surface of the monolithic substrate 26. According
to the present invention, the sensor 22 and signal conditioner 24
are formed either on the same wafer surface of the substrate or on
opposing wafer surfaces of the same substrate.
[0042] As illustrated in FIGS. 1A-1C, in order to orient the sensor
22 and the signal conditioner 24, the monolithic substrate is
separated along the plane 21 between the portion of the substrate
on which the sensor 22 is formed and the portion on which the
signal conditioner 24 is formed, both the sensor 22 and the signal
conditioner having been formed on the same wafer surface of the
monolithic substrate 26. The then-separated portions of the
substrate are oriented with respect to each other at the
predetermined angle and rejoined to thereby form a monolithic
substrate having formed thereon a sensor 22 and signal conditioner
24 positioned relative to each other at substantially the
predetermined angle .alpha..
[0043] Thus, in a first embodiment of the compact sensing
apparatus, the sensor is formed on a first portion of a wafer
surface of a single monolithic semiconductor substrate 20, and the
signal conditioner 24 is formed on a second portion of the same
wafer surface of the substrate 20. The first and second portions of
the wafer surface are then oriented with respect to each other at
the predetermined angle to thereby substantially orient the sensor
22 and the signal conditioner 24 relative to each other at the
predetermined angle. FIGS. 1A-1C illustrates the sensor 22 and the
signal conditioner 24 being oriented orthogonally to each other.
Other predetermined angles, however, are possible and will be
preferred if balancing the benefits of enhanced sensor 22
sensitivity (dictated by the sensor's orientation to the physical
stimulus to be sensed) and reduced sensing apparatus 20 size
(determined by the orientation of the sensor 22 and the signal
conditioner 24) dictates a preferred angle other than two hundred
seventy (270) degrees.
[0044] FIGS. 2A-2C illustrate a second embodiment of a sensing
apparatus 40 in which the sensor 42 and the signal conditioner 44
are each formed on opposing wafer surfaces of the same monolithic
semiconductor substrate. Specifically, the sensor 42 is formed on a
portion of a wafer surface of a single monolithic semiconductor
substrate and the signal conditioner 44 is formed on a portion of
the opposing wafer surface of the same substrate. Then, again, the
monolithic semiconductor substrate is separated and the wafer
surfaces are oriented with respect to each other to thereby
substantially orient the sensor 42 and the signal conditioner 44
relative to each other at the predetermined angle. As with respect
to the first embodiment, the predetermined angle can be any angle
and preferably is one that maximizes the overall efficiency of the
sensing apparatus 40 by optimally balancing the benefit of angling
the sensor 42 to achieve a specific sensing sensitivity against the
benefit of angling the senor 22 relative to the signal conditioner
24 to limit the overall size of the sensing apparatus 20.
[0045] FIGS. 1A-1C and 2A-2C also illustrate means for electrically
connecting the sensor 22, 42 to the signal conditioner 24, 44 using
bonding pads 23, 25 and 43, 45. In the first embodiment of the
present invention, a first plurality of bonding pads 23 is
positioned on the wafer surface 27 of the monolithic substrate 26
and a second plurality of bonding pads 25 is formed on an
orthogonal, cut plane 29 of the monolithic substrate 26, the cut
plane formed as a result of cutting the substrate 26 from a
semiconductor wafer. As will be readily understood by those
familiar with the art, the bonding pads 23 formed on the wafer
surface 27 will be electrically connected via conductors (e.g.,
metal traces) to the signal conditioner 24.
[0046] Similarly, the bonding pads 25 formed on the cut plane 29
will be electrically connected to the sensor 22. (Efficient methods
for forming the bonding pads and electrical conductors are
described explicitly, below, in the context of the method aspects
of the present invention.) As illustrated in FIGS. 1A-1C, the wafer
surface 27 and the cut plane 29 are oriented to face each other,
and the wire bonds pads 23, 25 are aligned together to thereby
provide a conductive path between the sensor 22 and the signal
conditioner 24. The corresponding bonding pads 23, 25 preferably
are connected by a conductive epoxy or other thermosetting
material.
[0047] FIGS. 2A-2C illustrate using a plurality of bonding pads 43,
45 as part of the second embodiment of a compact sensing apparatus
40. The sensor 42 is positioned on a sensor substrate, which as
illustrated can be formed by separating the monolithic substrate 46
on which the sensor 42 is formed. The signal conditioner is
positioned on a signal conditioner substrate, which also as
illustrated, can be formed as a result of the separation of the
monolithic substrate 46 between the sensor 42 and the signal
conditioner 44. As illustrated, a first plurality of bonding pads
43 is formed on the wafer surface 47 of the monolithic
semiconductor substrate 46. A recessed channel can be formed in the
substrate 46 extending through the wafer surface 47 for forming a
second plurality of bonding pads 45 therein on a cut plane that
will result when the monolithic semiconductor substrate 46 is
separated in order to orient the sensor 42 and the signal
conditioner 44, each formed on opposing wafer surfaces of the
monolithic semiconductor substrate 46. (Again, efficient methods
for forming the bonding pads and electrical conductors are
described, below, in the context of the method aspects of the
present invention.)
[0048] The sensor 42, also again, is oriented orthogonally to the
signal conditioner 44. As illustrated in FIGS. 2A-2C, the cut plane
on which the second plurality of bonding pads 45 is formed is
parallel to the wafer surface 47 of the monolithic semiconductor
substrate 46 so that the corresponding bonding pads 43, 45 lie in
the same plane. The bonding pads 43, 45 preferably are connected
with wire bonds as will be understood by those familiar with the
art.
[0049] Thus, with respect to both the first and second embodiments,
the compact sensing apparatus 20, 40 preferably includes at least
one cut plane on which is formed at least one bonding pad and at
least one electrical conductor for forming a conductive path
between the sensor and the signal conditioner to thereby
electrically connect the sensor and the signal conditioner.
[0050] Both FIGS. 1A-1C and 2A-2C illustrate embodiments of the
present invention in which the sensor 22, 42 and signal conditioner
24, 44 are formed on the same wafer surface or opposing wafer
surfaces of the same monolithic substrate, and then oriented with
respect to each other. More generally, a compact sensing apparatus
according to the present invention comprises a monolithic substrate
from which is formed a sensor substrate and a signal conditioner
substrate, each having first and second surface portions and
oriented at a preferred predetermined angle. Such a monolithic
substrate having a sensor formed on the substrate and oriented
orthogonally to a signal conditioner also formed on the substrate
is illustrated in U.S. Pat. No. 5,670,886 to applicants and titled
Method and apparatus for Sensing Proximity or Position of an Object
Using Near-Field Effects as well as in Applicant's co-pending
application titled Compact sensing Apparatus Having An Orthogonal
Sensor and Methods For Forming Same, the disclosures of which are
incorporated herein in their entirety.
[0051] More generally, then, a sensor 22, 42 can be formed on a
first surface portion of the sensor substrate, and a signal
conditioner 24, 44 formed on a second surface portion of the signal
conditioner substrate. The first surface portions of the respective
substrates are abuttingly connected to form a monolithic substrate
having a sensor 22, 42 and a signal conditioner 42, 44 electrically
connected to each other. More specifically, the first surface
portion of the sensor substrate abuttingly connects to the first
surface portion of the signal conditioner substrate such that the
second surface portion of the sensor substrate and the second
surface portion of the signal conditioner substrate are oriented
with respect to each other at a predetermined angle greater than
one hundred eighty (180) degrees. Preferably, the predetermined
angle is two hundred seventy (270) so as to thereby enhance
compactness of the sensing apparatus. Again, the predetermined
angle is here defined as the angle of rotation between an imaginary
initial plane extending substantially parallel to the second
surface portion of the signal conditioner substrate and an
imaginary terminal plane extending substantially parallel to the
second surface portion of the sensor substrate.
Epoxy Bound Sensor and Signal Conditioner
[0052] As illustrated in FIGS. 1A-1C and described above, the
sensor 22 and the signal conditioner 24 are electrically connected
via bonding pads 23, 25 fixedly connected with an epoxy or other
conductive thermosetting material. More specifically, the bonding
pads 23 can comprise at least one recessed channel formed in a
surface of a substrate on which the signal conditioner 24 is
formed, the substrate defining a signal conditioner substrate 33.
Corresponding bonding pads 25 can comprise at least one recessed
channel formed on an orthogonal plane or other edge portion of the
substrate on which the sensor 22 is formed, the substrate defining
a sensor substrate 55. The bonding pads 23, 24 can be aligned when
the separate portions of the substrate are rejoined to form a
monolithic substrate on which the sensor 22 and signal conditioner
24 are formed and the epoxy or other thermosetting material can be
diffused into the corresponding at least one recessed channel
formed in the surface of the sensor substrate and into at the least
one recessed channel formed in the surface of the signal
conditioner substrate to thereby form an adhesive layer mutually
joining the respective substrates. The at least one channels of the
sensor substrate and the signal conditioner substrate, being
adequately aligned, thereby provide a common channel electrically
bridging the sensor substrate 33 and the signal conditioner
substrate 35 to thereby provide a conductive path between the
sensor 22 and the signal conditioner 24. In addition, the sensor
substrate 35 and the signal conditioner substrate 33 can be
abuttingly connected by mutual adhesion. The adhesion being
effected, preferably, by a nonconductive thermosetting material
positioned between the mutually abutting surface portions of the
sensor substrate 35 and the signal conditioner substrate 33 to
thereby form an adhesive layer mutually joined to the respective
substrates.
Wire Bound Sensor and Signal Conditioner
[0053] As illustrated in FIGS. 2A-2C and described above, the
sensor 42 and the signal conditioner 44 can alternatively be
electrically connected via wire bonds. More specifically, the
bonding pads 43, 45 can comprise wirebond pads. At least one wire
bond pad 43 is positioned on a surface of the substrate on which
the signal conditioner 44 is formed, the substrate defining a
signal conditioner substrate 53. At least one wirebond pad 45 is
positioned on an orthogonal plane or other edge portion of the
substrate on which the sensor 42 is formed, the substrate defining
a sensor substrate 55. Each at least one bonding pad 43, 45 can be
aligned when the sensor substrate 55 and signal conditioner
substrate 53 are abuttingly joined to form a monolithic substrate
on which the sensor 42 and signal conditioner 44 are formed. At
least one wire conductor is then connected between the wirebond
pads 43, 45 to thereby provide a conductive path between the sensor
42 and the signal conditioner 44. In addition, the sensor substrate
55 and the signal conditioner substrate 53 are abuttingly connected
by mutual adhesion, the adhesion preferably being effected by a
nonconductive thermosetting material positioned between the
mutually abutting surface portions of the sensor substrate 55 and
the signal conditioner substrate 55.
[0054] FIGS. 3 and 4 illustrate third and fourth embodiments of the
present invention in which the compact sensing apparatus further
comprises a base, an encapsulation, and an electrical conducting
means for connecting the sensing apparatus to a preselected
external electrical device such as a remote sensing monitor. In
FIG. 3, a sensing apparatus 60 is mounted on a base 77. The base 77
supports a sensor 62 and signal conditioner 64 formed,
respectively, on a sensor substrate 75 and a signal conditioner
substrate 73. The substrates are abuttingly joined to form a
monolithic substrate 66. The sensor 62 and the signal conditioner
64 are electrically connected by bonding pads positioned on the
sensor substrate 75 and the signal conditioner substrate 73, the
bonding pads being connected by a conductive epoxy or other
thermosetting material as already described.
[0055] The sensing apparatus 60, moreover, is at least partially
encased by an encapsulation. As illustrated in FIG. 3, the
encapsulation 79 encapsulates the base 77 and the monolithic
substrate 66 formed from the joinder of the sensor substrate 75 and
the signal conditioner substrate 73 on which are formed,
respectively, the sensor 62 and the signal conditioner 64.
Conducting means extending outwardly through the encapsulation 79
connect the sensing apparatus 60 to the remote electrical device.
Preferably, the conducting means comprises at least one bonding pad
70 positioned on the signal conditioner substrate 73 and connected
to at least one conductor 71 to thereby provide a conductive path
between the signal conditioner 64 and the remote electrical
device.
[0056] FIG. 4 illustrates a sensing apparatus 80 mounted on a base.
The base 97 supports a sensor 82 and signal conditioner 84 formed,
respectively, on a sensor substrate 95 and a signal conditioner
substrate 93, the substrates abuttingly joined to form a monolithic
substrate 66. The sensor 82 and the signal conditioner 84 are
connected electrically by wire bonds connected to a plurality of
wirebond pads formed on each of the sensor substrate 95 and the
signal conditioner substrate 93. The sensing apparatus 80 is at
least partially encased by an encapsulation 99. As illustrated in
FIG. 4, the encapsulation 99 encapsulates the base 97 and the
monolithic substrate 86 formed from the joinder of the sensor
substrate 95 and the signal conditioner substrate 93 on which are
formed, respectively, the sensor 62 and the signal conditioner 64.
The sensing apparatus 80 is connected to a remote electrical device
by conducting means extending outwardly through the encapsulation
99. The conducting means preferably comprises at least one bonding
pad 90 positioned on the signal conditioner substrate 93 and
connected to at least one conductor 91, providing therewith a
conductive path between the signal conditioner 84 and a sensing
monitor or other remote electrical device. An example of such
conductor is a flexible ribbon cable encasing a plurality wire
conductors.
[0057] Yet a further embodiment of a sensing apparatus 100 is
illustrated in FIG. 5 in which the base 117 further comprises a
roughened surface portion 118 which contacts a portion of the
encapsulation 119 to increase friction at points of contact between
the base 117 and the encapsulation 119 to thereby reduce the
probability that the base 117 and the encapsulation 119 will
separate from each other when the sensing apparatus 100 is subject
to unequal forces. For example, the roughened surface portion 118
of the base 117 contacting a portion of the encapsulation 119 can
be an edge portion of the base 117 that, as illustrated, is
serrated Moreover, as illustrated in FIG. 6, in a sixth embodiment
of a sensing apparatus 120, the sensing apparatus 120 preferably
comprises at least one recessed well 122 preferably formed within a
bottom surface portion 123 of the base 137 to increase the extent
of contact between the base 137 and the encapsulation 139 to
thereby reduce the probability that the base 137 and the
encapsulation 139 will separate from each other.
Forming A Monolithic Sensing Apparatus From Two Pieces Of The Same
Semiconductor Substrate
[0058] FIGS. 1A-1C and 2A-2C also illustrate the method aspects of
the present invention for forming a monolithic sensing apparatus
formed from two pieces of the same monolithic semiconductor
substrate. The method comprises forming both a sensor and
conditioning circuitry defining a signal conditioner on the single
monolithic substrate. The substrate preferably is composed of a
semiconductor material such as silicon or other semiconductor
material familiar to those skilled in the art. The monolithic
substrate is formed by cutting a semiconductor wafer been sliced
from an ingot composed of silicon or other semiconductor material.
If the monolithic substrate is cut from a semiconductor wafer, the
wafer preferably is cut so as to provide a monolithic substrate
having two opposing surfaces corresponding to the opposing surfaces
of the wafer from which the monolithic substrate is cut. These
opposing surfaces of the monolithic semiconductor substrate, then,
define wafer surfaces of the substrate.
[0059] FIG. 7 more explicitly illustrates the method aspects of the
present invention for forming a compact sensing apparatus.
According to a first method 200, the sensor and the signal
conditioner are formed on the monolithic substrate (Block 201).
More specifically, as illustrated in FIGS. 1A-1C, the sensor 22 and
the signal conditioner 24 can be formed on the same wafer surface
of the substrate 26. Alternatively, as perhaps best illustrated in
FIGS. 2A-2C, the sensor 42 can be formed on an opposing wafer
surface of the substrate 46 from the wafer surface 47 on which the
signal conditioner 44 is formed. As further illustrated in FIG. 7,
the method 200 also includes forming a plurality of bonding pads
and conductors for forming a conductive path electrically
connecting the sensor and the signal conditioner (Block 202). At
least one conductor and bonding pad is formed on the wafer surface,
while at least one conductor and bonding pad is formed on a cut
plane formed orthogonally or at another predetermined angle
relative to the wafer surface of the substrate. According this
first method 200, then, the substrate on which the sensor and
signal conditioner have been formed is separated (Block 203). The
sensor and signal conditioner are then oriented relative to each
other at the predetermined angle and the corresponding conductors
and bonding pads formed on the wafer surface and cut plane are
aligned (Block 204). In a final step of the method 200, the
separate pieces on which the sensor and signal conditioner are
formed are rejoined to thereby form a compact sensing apparatus
comprising a monolithic substrate having a sensor and signal
conditioner oriented at the predetermined angle (Block 205).
[0060] Thus, the method 200 for forming the sensing apparatus
further comprises reorienting the sensor and the signal conditioner
so that the sensor and the signal conditioner are positioned with
respect to each other at a predetermined angle. If the
predetermined angle is defined by the angle of rotation between an
imaginary initial plane extending substantially parallel to the
signal conditioner and an imaginary terminal place extending
substantially parallel to the sensor, then the preferred
predetermined angle is greater than predetermined angle is greater
than one hundred eighty (180) degrees. Preferably, the
predetermined angle is two hundred seventy (270) degrees so that
the sensor and the signal conditioner.
[0061] According to method 200 illustrated by the steps shown in
FIG. 7, in order to reorient the sensor and the signal conditioner
to the predetermined angle, the monolithic substrate on which the
sensor and the signal conditioner are formed is separated into two
pieces, one on which the sensor is formed, defining a sensor
substrate, and the other on which the signal conditioner is formed,
defining a signal conditioner substrate. As described above and
illustrated in FIGS. 1A-1C, the sensor 22 and signal conditioner 24
can be formed on a common wafer surface of the monolithic
substrate. Alternatively, as described above and illustrated in
FIGS. 2A-2C, the sensor 42 and signal conditioner 44 can be formed
on opposing wafer surfaces prior to forming the two pieces. The
method 200, as also described above, further comprises forming a
path between the sensor and the signal conditioner with a plurality
of bonding pads and electrical conductors (Block 202). Preferably,
the conductive path will be formed after the monolithic substrate
on which the sensor and signal conditioner are formed has been
separated into two pieces defining, respectively, the sensor and
the signal conditioner, and having the sensor formed on the sensor
substrate and the signal conditioner being formed on the signal
conditioner substrate.
[0062] In order to facilitate forming the conductive path between
the sensor and the signal conditioner, at least one electrical
conductor is preferably formed on a cut plane of the sensor
substrate for providing the electrically conductive path between
the sensor and the signal conditioner. Forming the electrical
conductor on the cut plane permits the sensor to be positioned at
any angle, including orthogonally, relative to the signal
conditioner and the surface on which the signal conditioner is
formed.
[0063] FIG. 8 illustrates the method steps 300 for efficiently
forming a plurality of compact sensing apparatuses. In this second
method, a plurality of signal conditioners with bonding pads and
conductors are formed on a single semiconductor wafer (Block 301).
The plurality of signal conditioners are formed spaced apart from
one another and are arranged substantially in a row along the
semiconductor wafer on which each is formed. A plurality of sensors
also are formed (Block 302), according to the method 300. Each of
the sensors formed also are spaced apart and arrange in row-like
fashion, each corresponding to one of the signal conditions formed
on the same semiconductor wafer. Multiple rows of sensors and
corresponding signal conditioners can be formed on the same wafer
according to the method 300.
[0064] The semiconductor wafer is sliced into strips, each having a
row-arranged set of sensors and corresponding signal conditioners
(Block 303). The strips are then arranged on edge and, on a cut
plane of each strip, a plurality of bonding pads and conductors are
formed (Block 304). The bonding pads and conductors formed on the
cut plane will be part of the conductive paths that ultimately will
be formed to electrically connect each sensor and corresponding
signal conditioner as earlier described. Each strip is then
separated into a plurality of single monolithic semiconductor
substrates, each strip having formed thereon on a sensor, signal
conditioner, conductors, and bonding pads (Block 305). Each
monolithic substrate can then be formed into a compact sensing
apparatus having a sensor and signal conditioner angled at a
predetermined angle according to the methods described above.
Bonding Methods Using A Thermosetting Material
[0065] FIGS. 1A-6, as described in detail above, illustrate method
aspects of the present invention for forming a compact sensing
apparatus in which a sensor and corresponding signal conditioner
are formed on a single monolithic semiconductor substrate and
angled relative to each other at a predetermined angle. As
described, the method essentially entails forming the sensor and
signal conditioner on the substrate and then separating the
substrate such that the is formed on a sensor substrate and the
corresponding signal conditioner is formed on a signal conditioner
substrate. The sensor substrate and the signal conditioner
substrate are oriented to position the sensor and the signal
conditioner relative to each other at the predetermined angle. A
monolithic substrate can then be reformed by structurally
connecting the substrates. The sensor and signal conditioner are
electrically connected via a conductive epoxy or similar
thermosetting material.
[0066] A third method embodiment of the present invention for
accomplishing this result, again, entails forming the sensor and
signal conditioner on the same wafer surface of a substrate, as
illustrated in FIGS. 1A-1C and 2A-2C. The single substrate is
separated so as to from a sensor substrate and a signal conditioner
substrate with the sensor formed on the sensor substrate and the
signal conditioner formed on the signal conditioner substrate.
Recessed channels are formed in the sensor substrate and the signal
conditioner, which subsequently can be filled with a conductive
epoxy to form a conductive path between the sensor and the signal
conditioner. Specifically, at least one recessed channel is formed
in the wafer surface of the signal conditioner substrate on which
the signal conditioner is formed. The sensor substrate having the
sensor formed also on a wafer surface is oriented so that at least
one recessed channel can be formed in a cut plane of the senor
substrate.
[0067] The sensor substrate and the signal conditioner substrate
are then are oriented so that the at least one recessed channels on
each substrate align with one another. Electrical conductors
extending between the recessed channel on the sensor substrate and
the sensor, as well as between the recessed channel on the signal
conditioner substrate and the signal conditioner can now be formed
on the respective substrates, or alternatively, are already formed
thereon. Therefore, when the recessed channels are aligned, they
can be filled with a conductive epoxy or other conductive
thermosetting material thereby completing a conductive path between
the sensor and the signal conditioner.
[0068] It is important to note that the order in which the steps
are carried out can be varied. The recessed channels can be formed
prior to separation of the single monolithic substrate into a
sensor substrate and signal conditioner substrate. Indeed, the
recessed channels can be formed on the substrate prior to formation
of the sensor and the signal conditioner. Alternatively, as
described above, the recessed channels can be formed after the
single monolithic substrate is separated into a sensor substrate
and signal conditioner substrate but prior to joining the
substrates to reform a monolithic substrate having the sensor and
signal conditioner oriented at a predetermined angle. As alluded to
above, the electrical conductors can be formed at various points in
the process as well.
[0069] In the drawings and specification, there have been disclosed
a typical preferred embodiment of the invention, and although
specific terms are employed, the terms are used in a descriptive
sense only and not for purposes of limitation. The invention has
been described in considerable detail with specific reference to
these illustrated embodiments. It will be apparent, however, that
various modifications and changes can be made within the spirit and
scope of the invention as described in the foregoing specification
and as defined in the appended claims.
* * * * *