U.S. patent application number 09/870686 was filed with the patent office on 2002-10-31 for structure and method for constructing circuit module suitable for hand-held electronic equipment.
This patent application is currently assigned to KABUSHIKI KAISHA TOSHIBA. Invention is credited to Tomioka, Kentaro, Ubukata, Hiroshi.
Application Number | 20020159236 09/870686 |
Document ID | / |
Family ID | 18669001 |
Filed Date | 2002-10-31 |
United States Patent
Application |
20020159236 |
Kind Code |
A1 |
Ubukata, Hiroshi ; et
al. |
October 31, 2002 |
STRUCTURE AND METHOD FOR CONSTRUCTING CIRCUIT MODULE SUITABLE FOR
HAND-HELD ELECTRONIC EQUIPMENT
Abstract
A circuit module mounting structure and a method for mounting an
IC chip in the circuit module applicable to electronic equipment
with a slim body. To increase radiation efficiency of the heat
emitted from the IC chip, a heat conducting element including a
plurality of thin plates is provided between a radiation plate of a
heat sink unit and a surface of the IC chip. Further, the plurality
of thin plates of the heat conducting element have sufficient
flexibility to absorb stresses appearing at coupling portions of
the elements due to dimensional tolerances of the elements.
Inventors: |
Ubukata, Hiroshi; (Tokyo,
JP) ; Tomioka, Kentaro; (Saitama-ken, JP) |
Correspondence
Address: |
FINNEGAN, HENDERSON, FARABOW, GARRETT &
DUNNER LLP
1300 I STREET, NW
WASHINGTON
DC
20005
US
|
Assignee: |
KABUSHIKI KAISHA TOSHIBA
|
Family ID: |
18669001 |
Appl. No.: |
09/870686 |
Filed: |
June 1, 2001 |
Current U.S.
Class: |
361/718 ;
257/E23.103 |
Current CPC
Class: |
B21J 5/068 20200801;
H01L 2224/16225 20130101; H01L 23/3672 20130101; H01L 2924/00014
20130101; H01L 2924/00014 20130101; H01L 2224/0401 20130101 |
Class at
Publication: |
361/718 |
International
Class: |
H05K 007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 2, 2000 |
JP |
2000-165540 |
Claims
What is claimed is:
1. A circuit module structure, comprising: a wiring base board
provided with a wiring pattern; an electronic element mounted on
the wiring base board; a heat sink unit fixed on the wiring base
board for radiating heat emitted from the electronic element, the
heat sink unit including a radiation panel facing toward the
electronic element and having a heat conductivity; and a heat
conducting element provided between a surface of the heat sink unit
facing the electronic element and a surface of the electronic
element, the heat conducting element comprising a plurality of thin
plate-like members having a heat conductivity substantially the
same as that of the radiation panel and for transferring the heat
emitted from the surface of the electronic element to the radiation
panel and a predetermined flexibility for absorbing stresses
generated due to dimensional tolerances of the electronic
element.
2. The circuit module structure of claim 1, wherein: the plurality
of thin plate-like members of the heat conducting element are
integrally made from the surface of the radiation panel of the heat
sink unit.
3. The circuit module structure of claim 1, wherein: the plurality
of thin plate-like members of the heat conducting element are made
independently from the radiation panel of the heat sink unit.
4. The circuit module structure of claim 1, wherein: the plurality
of thin plate-like members of the heat conducting element are
commonly connected to a conducting plate for attaching to the
electronic element.
5. The circuit module structure of claim 4, wherein: each of the
plurality of thin plate-like members of the heat conducting element
has a curvature to achieve the predetermined flexibility.
6. The circuit module structure of claim 3, wherein: the plurality
of thin plate-like members of the heat conducting element are
commonly connected between two conducting plates having
substantially the same conductivity as the radiation panel.
7. The circuit module structure of claim 2, wherein: each of the
plurality of thin plate-like members of the heat conducting element
has a curvature to achieve the predetermined flexibility.
8. The circuit module structure of claim 2, wherein: each of the
plurality of thin plate-like members of the heat conducting element
has a bending form to achieve the predetermined flexibility.
9. The circuit module structure of claim 6, wherein: each of the
plurality of thin plate-like members of the heat conducting element
has a bending form to achieve the predetermined flexibility.
10. The circuit module structure of claim 1, wherein: the
electronic element is an IC chip; the circuit module further
including: a BGA type semiconductor package mounted between the IC
chip and the wiring base board, the BGA type semiconductor package
being connected to the wiring base board through a plurality of
ball solders; and the plurality of thin plate-like members of the
heat conducting element having a flexibility to absorb stresses
generated due to dimensional tolerances of the BGA type
semiconductor package.
11. The circuit module structure of claim 3, wherein: the radiation
panel of the heat sink unit has a notching portion for determining
a mounting position of the heat coupling member.
12. An electronic equipment, comprising: a main body for housing a
circuit module, the circuit module having a plurality of circuits
for working the electronic equipment, the circuit module including:
a base board provided with a wiring pattern; an IC chip mounted on
the base board; and a heat sink unit fixed on the base board, the
heat sink unit including a radiation panel facing toward the IC
chip and a heat conducting element provided between the IC chip and
the radiation panel of the heat sink unit, the heat conducting
element including a plurality of thin plates each having a heat
conductivity for transferring heat emitted from the IC chip to the
heat sink unit and a predetermined flexibility for preventing
stress from being applied to the IC chip.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to structure and method for
constructing a circuit module suitable for hand-held electronic
equipment with a slim body, e.g., a personal computer that is
required to mount electronic elements in a high density in the
body. In particular, the present invention relates to structure and
method for constructing a circuit module having a novel radiating
mechanism that can achieve sufficient radiating efficiency while
maintaining reliability of the circuit module during long-term
usage.
[0003] 2. Discussion of the Related Art
[0004] Typically, handheld electronic equipment with a slim body,
such as a note-book type or a mobile type personal computer (PC),
are required to install electronic elements including heating
source elements, such as IC chips, in a high density in the slim
body. With the widespread use and diversification in the handheld
electronic equipment, in particular, in personal computers, there
is a strong demand for increasing applications to enhance functions
and raise performance of the personal computer.
[0005] To enhance functions and raise performance of a personal
computer with a slim and small body, there is a need to increase
packaging density of electronic elements including heating source
elements, such as IC chips, in the slim body. It is also required
to increase the number of the electronic elements packaged in order
to enhance the functions and to achieve higher performance of the
computer.
[0006] To enhance the functions of the personal computer, it is
substantially required to increase the packaged number of heating
source electronic elements, i.e., semiconductor chips, such as IC
chips. Consequently, the total amount of the heat generated from
the heating source electronic elements rapidly increases in the
slim body. To avoid the generated heat adversely affecting other
electronic elements installed in the body, the heat in the body
need to be sufficiently radiated.
[0007] Conventionally, a heat sink unit is commonly used as a
radiating mechanism for the generated heat from IC chips in the
body of the personal computer. Usually, the heat sink unit is made
of a high heat conductivity material, such as aluminum. The heat
sink unit includes a radiation panel and a plurality of radiating
projections. The radiation panel of the heat sink unit is connected
to the heating source element, e.g., an IC chip, in order to
transfer and radiate the heat generated from the IC chip into the
air through the radiation projections. To increase efficiency of
the radiation, it has been considered to increase the radiating
surfaces of the heat sink unit as large as possible.
[0008] Typically, the circuit module installed in the personal
computer includes various components mounted on a printed wire
board. Thus, the circuit module is constructed by mounting, for
example, a heat sourcing IC, a semiconductor package and a heat
sink unit on a printed wire board. However, when the various
components are constructed as the circuit module, generally various
dimensional tolerances are generated due to the design errors among
these components.
[0009] Recently, to enhance the packaging density and to achieve
multi-connecting pins of the semiconductor package, a Ball Grid
Array (BGA) package is widely used as a semiconductor package for
installing components in the circuit module. The BGA package is
usually connected to a base plate of the printed circuit board
through a plurality of ball type solders. However, in the circuit
module using the BGA package, there may appear dimensional
tolerances during the construction of the circuit module due to
deformations of the plurality of ball solders.
[0010] If the dimensional tolerance exceeds a permissible positive
absolute amount during the construction of the circuit module, a
spacing gap is produced in the connecting surfaces between the IC
chip and the radiating panel of the heat sink unit. Such a spacing
gap deteriorates the efficiency of the radiation through the heat
sink unit.
[0011] Further, if the dimensional tolerance exceeds a permissible
negative absolute amount during the construction of the circuit
module, overload stresses appear at the connecting portions with
each of the elements since each element presses against others. The
stresses at the connecting portions deteriorate reliability of the
circuit module for long-term usage.
[0012] To avoid the influences of stress, it has conventionally
been proposed to interpose a heat connecting material, such as a
cool sheet or a grease, between the IC chip and the heat sink unit
in order to absorb the dimensional tolerances of elements. Further,
it has been proposed to provide a spring mechanism between the
printed wire board and the heat sink unit.
[0013] However, each of the conventional proposals has serious
defects for applying to the circuit module for installing in the
personal computer.
[0014] Thus, if a cool sheet is interposed between a IC chip and a
heat sink unit, the efficiency of the radiation of the generated
heat in the circuit module deteriorates depending upon the
thickness of the cool sheet since the heat resistance of the cool
sheet increases depending upon its thickness. Moreover, when the
dimensional tolerances among the elements approaches the maximum
amount, it is impossible for the disposed cool sheet to absorb the
squeezing power generated between the elements. Consequently,
stresses due to the squeezing power concentrate at the connecting
portions of the elements. As explained above, this causes
deterioration of the reliability of the circuit module.
[0015] By providing grease between an IC chip and a heat sink unit,
it is possible to reduce the stresses at the connecting portions of
the elements. However, the grease leaks around the IC chip
deteriorating the efficiency of the radiation.
[0016] To absorb the stresses generated at the connecting portions
of the module elements, it has been proposed to dispose a spring at
the attaching portion between the printed wire board and the heat
sink unit. However, such a conventional coupling between the
printed wire board and the heat sink unit through the spring
requires a very complicated structure for mounting the circuit
module.
[0017] Furthermore, it has conventionally been proposed to provide
metal wires between a heating source element and a radiation unit
for transferring the generated heat to the radiation unit. Each of
the metal wires has a thermal conductivity and flexibility. It is
possible to absorb the dimensional tolerance by using the metal
wires. However, the metal wires have a serious defect for obtaining
a sufficiency of the radiation effect since the metal wires have
small contacting surfaces to the heating element and the
radiator.
[0018] As explained above, it is essential for a circuit module
applicable to a personal computer with a high density to solve both
of the reduction of the stresses due to the dimensional tolerances
among the circuit elements and the efficient transfer of the heat
emitted from the exothermic electronic element, e.g., the IC chip,
to the radiation unit. However, there is no teaching of the circuit
module that can achieve both the absorption of the dimensional
tolerances and the high efficiency of the heat transferring effect
of the heat emitted from the IC chip.
SUMMARY OF THE INVENTION
[0019] Accordingly, the present inventions is directed to apparatus
and method that substantially obviates one or more of the problems
due to limitations and disadvantages of the related art.
[0020] Additional features and advantages of the invention will be
set forth in the description which follows, and in part will be
apparent from the description, or may be learned by practice of the
invention. The objectives and other advantages of the invention
will be realized and attained by the apparatus and method
particularly pointed out in the written description and claims
hereof as well as the appended drawings.
[0021] In accordance with the present invention, there is provided
a circuit module structure comprising a wiring base board provided
with a wiring pattern, an electronic element mounted on the wiring
base board, and a heat sink unit fixed on the wiring board for
radiating heat emitted from the electronic element. The heat sink
unit includes a radiation panel facing toward the electronic
element and having a heat conductivity. Also provided is a heat
conducting element between a surface of the heat sink unit facing
the electronic element. The heat conducting element comprises a
plurality of thin plate-like members having a heat conductivity
substantially the same as that of the radiation panel and for
transferring the heat emitted from the surface of the electronic
element to the radiation panel and a predetermined flexibility for
absorbing stresses generated due to dimensional tolerances of the
electronic element.
[0022] Also in accordance with the present invention, there is
provided handheld electronic equipment comprising a slim main body
for attaching a data inputting device on one surface of the body
and a circuit module provided under the data inputting device in
the main body. The circuit module includes a base board provided
with a wiring pattern, an IC chip mounted on the base board, and a
heat sink unit fixed on the base board. The heat sink unit includes
a radiation panel facing toward the IC chip and a heat conducting
element provided between the IC chip and the radiation panel of the
heat sink unit. The heat conducting element includes a plurality of
thin plates each having a heat conductivity for transferring heat
emitted from the IC chip to the heat sink unit and a predetermined
flexibility for preventing stress from being applied to the IC
chip.
[0023] Further, in accordance with the present invention, there is
provided electronic equipment, comprising: a main body for housing
a circuit module, the circuit module having a plurality of circuits
for working the electronic equipment, the circuit module including:
a base board provided with a wiring pattern; an IC chip mounted on
the base board; and a heat sink unit fixed on the base board, the
heat sink unit including a radiation panel facing toward the IC
chip and a heat conducting element provided between the IC chip and
the radiation panel of the heat sink unit, the heat conducting
element including a plurality of thin plates each having a heat
conductivity for transferring heat emitted from the IC chip to the
heat sink unit and a predetermined flexibility for preventing
stress from being applied to the IC chip.
[0024] It is to be understood that both the foregoing general
description and the following detailed description are exemplary
and explanatory and are intended to provide further explanation of
the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0025] A more complete appreciation of the present invention and
its many of attendant advantages thereof will be readily obtained
as the same becomes better understood by reference to the following
detailed description when considered in connection with the
accompanying drawings, wherein:
[0026] FIG. 1 is a cross-sectional view of a circuit module of a
first embodiment of the present invention.
[0027] FIG. 2 is an enlarged cross-sectional view of a thermal
connecting element shown in FIG. 1.
[0028] FIG. 3 is a cross-sectional view obtained by partially
cutting off a main body of a personal computer for mounting the
circuit module shown in FIG. 1.
[0029] FIG. 4 is an enlarged cross-sectional view showing another
embodiment of the thermal connecting element.
[0030] FIG. 5 is an enlarged cross-sectional view showing a further
embodiment of the thermal connecting element.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0031] Reference will now be made in detail to the preferred
embodiments of the present invention, examples of which are
illustrated in accompanying drawings. Wherever, possible, the same
reference numbers will be used throughout the drawings to refer to
the same or like parts.
[0032] Embodiments consistent with the present invention provide a
novel structure and method for constructing a circuit module
structure that achieves both of a high radiation efficiency of the
heat emitted from heating source element and effective reduction of
stresses among the electronic element due to the dimensional
tolerances.
[0033] Embodiments consistent with the present invention provide a
novel and simplified structure and method for constructing a
circuit module suitable for installing in handheld electronic
equipment with a slim body in a high density.
[0034] FIG. 1 illustrates one embodiment of a circuit module 10
according to the present invention. The circuit module 10 includes
an IC chip 1 that is a heat source mounted on a BGA package 2.
Under the surface of the BGA package 2, ball solder electrodes 3
are arranged in an array for constructing inputting and outputting
pads. By melting the ball solder electrodes 3, the semiconductor
package 2 is coupled to a printed wiring base board 4.
[0035] To diffuse the heat emitted from the IC chip 1, a heat sink
unit 5 is fixed on the printed wiring base board 4 through fixing
members, such as screws 6.sub.1, 6.sub.2. The heat sink unit 5
includes a radiation panel 51 facing towards the IC chip 1 and a
plurality of projections 52.sub.1, - - - , 52.sub.n. provided on
the radiation panel 51 for securing a sufficient heat sink effect.
The heat sink unit 5 is comprised of a high heat conductivity
material, such as aluminum.
[0036] Consistent with the invention, a plurality of thermal
coupling members 7 are provided between the IC chip 1 and the
radiation panel 51 of the heat sink unit 5. Each of the plurality
of thermal coupling members 7 has a sufficient heat conductivity
and a predetermined flexibility. It is also applicable to construct
the thermal coupling member 7 using, for example, copper,
magnesium, tungsten, molybdenum and so on.
[0037] FIG. 2 illustrates one embodiment for forming the plurality
of thermal coupling members. A plurality of the curved thin plates
7a, - - - , 7n of the heat coupling member 7 are formed by
cutting-out and raising-up from the undersurface of the radiation
plate 51 so that each of the thin plates has a predetermined
curvature for keeping a predetermined flexibility.
[0038] Thus, each of the curved thin plates of the heat coupling
member 7 is designed to have a predetermined flexibility to absorb
the dimensional tolerances appearing among the elements of the
circuit module. Since the plurality of the thin plates 7a, - - - ,
7n, consistent with the invention, are integrally formed from the
radiation plate 51, it becomes possible to obtain a sufficient
radiation efficiency through the whole body of the heat coupling
member 7 and the heat sink unit 5. Thus, it becomes possible to
improve the radiation efficiency through the heat sink unit 5.
[0039] The optimum number of the plurality of curved thin plates
7a, - - - 7n is determined by trading off the heat resistance of
the thin plate and the load between the IC chip 1 and the heat
coupling member 7. For example, in case the upper limit for working
of the IC chip 1 is 90 C, the heat resistance of the heat coupling
member 7 is 6 C/W, the width of the thin plate is 10 mm, the
thickness of the thin plate is 0.2 mm, the length of the thin plate
is 9 mm, the deflection of the thin plate is 0.5 mm, the
flexibility coefficient of the thin plate (in a perpendicular
direction in FIG. 2) is 7,000, the flexural rigidity of the thin
plate is 47 and the heat conductivity of the thin plate is 2 10
W/m-K, the load on each of the thin plates is 0.1 Kgf and the heat
resistance of each of the thin plates is 43 CAV, the necessary
number of the thin plates is 15.
[0040] By providing the heat coupling member 7 with a plurality of
the curved thin plates, the circuit module 10 can reduce the load
pressed on the IC chip 1 by as much as one sixth of the pressing
load on the IC chip 1 when the conventional cool sheet is used as
the heat coupling member of the circuit module, since each of the
plurality of the thin plates of the circuit module 7, consistent
with the invention, has its deflection of 0.5 mm for absorbing the
dimensional tolerances.
[0041] The heat resistance of the curved thin plate of the heat
coupling member, with consistent to the invention, has
substantially the same value as the heat resistance of the cool
sheet. Consequently, if the condition of the dimensional tolerance
is the same, it becomes possible for the heat coupling member of
the curved thin plates to largely reduce the load on the IC chip in
comparison to the conventional cool sheet. Thus, it can reduce the
stresses to the circuit elements of the module.
[0042] As illustrated in FIG. 2, each of the edges of the cut-out
of the plurality of thin plates 7a, - - - 7n are commonly brazed to
an aluminum plate 8. Further, the aluminum plate 8 is fixed to the
IC chip 1 through a grease member 9 for increasing the efficiency
of the heat conductivity. Of course, it is possible to delete or
add the aluminum plate 8 and the grease member 9, depending upon
need.
[0043] By integrally forming the curved thin plates of the heat
coupling member to the radiation plate of the heat sink unit, the
heat emitted from the IC chip can be efficiently diffused through
the whole body of the heat coupling member and the heat sink unit.
Moreover, the stresses due to the dimensional tolerances among the
elements can be reduced by absorbing the stresses in the curved
thin plates of the heat coupling member.
[0044] FIG. 3 illustrates a hand-held personal computer 20 with a
slim body comprising a main body 15 and a rotatable display unit 17
that is attached to the main body so as to cover the main body 15
when the computer is closed. Along one elongate edge of the main
body 15, a mount portion is provided for attaching the rotatable
display unit 17. The display unit 17 includes a display screen,
e.g., a liquid crystal display. The main body 15 has an opening for
attaching a keyboard unit 16 for inputting data. The keyboard 16 is
electrically coupled to the liquid crystal display 17.
[0045] In the main body 15, the circuit module 10 consistent with
the invention, is mounted under the keyboard unit 16 for processing
data in the IC chip 1 mounted in the circuit module 10. At one
surface of the main body 15 of the personal computer 20, a fan 18
is provided for introducing cooling air in the main body 15. The
heat emitted from the IC chip 1 in the circuit module 10 is removed
by the cooling air passing though the heat sink unit 5.
[0046] FIG. 4 illustrates another embodiment of the heat coupling
member for constructing the circuit module, consistent with the
invention. A characteristic feature of this embodiment is the
formation of a heat coupling member 27 independent from the heat
sink unit. In order to simplify the explanation, the same numerals
are provided for the same elements in the embodiment of the circuit
module illustrated in FIG. 1.
[0047] In this embodiment, the heat coupling member 27 is
constructed by holding a plurality of curved thin plates 27a-27n
between upper and lower aluminum plates 28.sub.1, 28.sub.2. Thus,
although each of the plurality of the curved thin plates 27a, - - -
, 27n are formed independently of a radiation plate 51 of the heat
sink unit, each of the thin plates has substantially the same
flexibility as the curved thin plates illustrated in FIG. 1.
[0048] In this embodiment, the plurality of the thin plates 27a, -
- - , 27n are made by cutting-off and raising up one surface of the
aluminum plate 28.sub.1, that is disposed facing against the
radiation plate 51 of the heat sink unit, or one surface of the
aluminum plate 28.sub.2, that is disposed facing against the IC
chip 1. The opposite edges made of cutting-off from one aluminum
plate are commonly brazed to the other aluminum plate having the
same conductivity.
[0049] In the under surface of the radiation plate 51 facing toward
the IC chip 1, a notching portion 511 is provided for determining a
mounting position of the heat coupling member 27. Thus, during the
construction of the circuit module, the notching portion 511
provided on the radiation plate 51 controls the movement range of
the heat coupling member 27 so as to correctly dispose the position
of the IC chip 1. Consequently, the heat coupling member 27 is
easily positioned to accurately cover the surface of the heating
source IC chip 1.
[0050] Between the aluminum plate 28.sub.1 and the radiation panel
51, a grease 9.sub.1 is provided for increasing the heat
conductivity. Further, a grease 9.sub.2 is provided between the
aluminum plate 28.sub.2 and the IC chip 1 for increasing the heat
conductivity. Of course, it is possible to eliminate these greases,
depending upon need.
[0051] By forming the heat coupling member 27 independently from
the radiation panel 51, it becomes possible to selectively place
the heat coupling member 27 so as to adjust a gap appearing between
the IC chip 1 and the heat sink unit due to dimensional tolerance
depending upon each of the circuit modules. Thus, it becomes
possible to widely use the structure for a variety of the circuit
modules.
[0052] It is also possible to construct the heat coupling member 27
by previously forming a plurality of curved thin plates 27a-27n and
by arranging the curved thin plates 27a-27n to be held between the
upper and lower aluminum plates 28.sub.1, 28.sub.2.
[0053] FIG. 5 illustrates still another embodiment of the heat
coupling member. A heat coupling member 37 is constructed from a
plurality of thin plates having a shape other than a curved shape.
In this embodiment, each of a plurality of a thin plates 37a-37n is
bent at a predetermined position of the thin plates, the plates
being formed by cutting off and raising up from the radiation panel
51.
[0054] The bent shaped thin plates 37a-37n are commonly brazed to
an aluminum plate 8. It is, of course, possible to independently
form the plurality of bent shaped thin plates 37a-37n from the
radiation plate 51, as explained in the second embodiment.
[0055] In FIG. 5, when the bent shaped heat coupling member 37 is
fixed on the IC chip 1, a grease 9 is disposed between the heat
coupling member 37 and the aluminum plate 8 in order to reduce the
contacting heat resistance.
[0056] It is possible to form the thin plates in any other shape in
so far as the thin plate can have a predetermined flexibility for
absorbing the dimensional tolerance when the elements are mounted
as the circuit module:
[0057] As explained above, the structure and method for
constructing the circuit module can efficiently radiate heat
emitted from an electronic element and also can effectively reduce
the stresses among the elements by absorbing dimensional tolerances
by providing a heat coupling member of a plurality of thin plates
having a predetermined flexibility.
[0058] Other embodiments of the present invention will be apparent
to those skilled in the art from consideration of the specification
and practice of the invention disclosed herein. In particular, the
invention is applicable to any types of electronic equipment that
need to efficiently radiate heat emitted from an electronic element
and also to reduce stresses pressing the connecting portions
between the elements for forming the circuit module.
[0059] It is intended that the specification and examples be
considered as exemplary only, with a true scope and sprit of the
invention being indicated by the following claims.
* * * * *