U.S. patent application number 09/791641 was filed with the patent office on 2002-08-29 for heat dissipating structure.
Invention is credited to Shen, Ching-Hang.
Application Number | 20020117295 09/791641 |
Document ID | / |
Family ID | 25154332 |
Filed Date | 2002-08-29 |
United States Patent
Application |
20020117295 |
Kind Code |
A1 |
Shen, Ching-Hang |
August 29, 2002 |
Heat dissipating structure
Abstract
A heat dissipating structure includes a heat dissipating element
which has an upper flange and a lower flange formed respectively at
the upper and lower edges thereof, and a convection zone located
between the upper and lower flanges. The upper flange has two ends
each has a fastening section. The lower flange has one fastening
section at the center, two ends extended downwards to form
respectively a fastening foot and form an indented zone with the
lower flange. Two or more heat dissipating elements may be stacked
and engaged through the fastening section to form an assembled
element. Two assembled elements may be juxtaposed and bonded at the
fastening foot to form a housing chamber therebetween to house a
heat dissipating tube thereby to dissipate heat rapidly.
Inventors: |
Shen, Ching-Hang; (Tou Liu
City, TW) |
Correspondence
Address: |
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY
MD
21043
US
|
Family ID: |
25154332 |
Appl. No.: |
09/791641 |
Filed: |
February 26, 2001 |
Current U.S.
Class: |
165/182 ;
165/151; 165/181 |
Current CPC
Class: |
F28F 1/30 20130101; F28F
1/02 20130101; F28F 1/24 20130101 |
Class at
Publication: |
165/182 ;
165/181; 165/151 |
International
Class: |
F28D 001/04; F28F
001/20; F28F 001/30 |
Claims
What is claimed is:
1. A heat dissipating structure, comprising: a plurality of heat
dissipating elements each having an upper flange and a lower flange
formed respectively at an upper and lower edge thereof to form a
convection zone therebetween, the upper flange having two ends each
forming a fastening section, the lower flange having another
fastening section located at the center thereof and two fastening
feet located respectively at two ends thereof, the fastening feet
being extended downwards to form an indented slot with the lower
flange; and a hollow heat dissipating tube; wherein the heat
dissipating elements are stacked one upon another through the
fastening sections of the upper and lower flange to form an
assembled element, two assembled elements being juxtaposed and
bonded at the fastening feet to form a housing chamber therebetween
for housing the heat dissipating tube thereby to increase heat
dissipating area, enhance heat dissipating efficiency and dissipate
heat rapidly.
2. The heat dissipating structure of claim 1, wherein the fastening
section has an insertion tab and a receiving slot, the insertion
tab of one heat dissipating element being engageable with the
receiving slot of an adjacent heat dissipating element so that the
heat dissipating elements are capable of stacking one upon
another.
3. The heat dissipating structure of claim 1, wherein the heat
dissipating tube is shaped in a streamline form.
4. The heat dissipating structure of claim 3, wherein the heat
dissipating tube is selectively shaped in a stretched ellipse,
rectangle or lozenge.
5. The heat dissipating structure of claim 1, wherein the heat
dissipating elements are juxtaposed and boned together by soldering
or hot melt adhesive.
Description
BACKGROUND OF THE INVENTION
[0001] (1) Field of the Invention
[0002] This invention relates to a heat dissipating structure that
has a streamline heat dissipating tube closely attach to heat
dissipating plates to increase heat dissipation area and enhance
heat dissipation effect for effectively increasing heat dissipating
result.
[0003] (2) Description of the Prior Art
[0004] The rapid technology innovation in recent years has resulted
in great progress in computer industry. New and high performance
personal computers and related peripheral devices and elements have
been constantly developed and introduced to the market in a very
shorter time frame. Computer related devices such as hard disk,
interface cards, central process unit and the like have greater
data capacity and can process at faster speed. As a result, a great
amount of heat will be generated inside the computer devices and
integrated circuits. Even the interface cards will produce a lot of
heat during operation. If the generated heat does not dissipate
effectively, the IC chips contained in the computers and related
devices could be overheated, and will result in downgrade of
performance, decreasing durability or even damaged. To install heat
dissipating means at the heat generation source (i.e. IC chips) is
a commonly used method to attack this problem. For instance, Taiwan
New Utility patent publication No. 416545 discloses a heat
dissipating structure equipped with a heat conductive tube. It
mainly includes a hollow tube which has heat dissipating fins
fixedly mounted thereon and two brackets located at two ends
thereof for mounting heat dissipating fans. There is a heat
conductive pipe inserted into the tube through one end thereof for
a selected length.
[0005] The prior art sets forth above uses fans to generate air
flow across the fins and tube to increase air convection for
accelerating heat exchange. It adapts a conventional round tube
which will cause a dead angle area at the down stream side of the
tube (shown in FIG. 1, about one quarter of the tube surface area).
As a result, heat cannot be dissipated efficiently. Furthermore,
the tube also drags air low and reduces the convection effect and
heat dissipating area. There is still room for improvement.
SUMMARY OF THE INVENTION
[0006] It is therefore an object of this invention to provide a
heat dissipating structure that has a streamline heat dissipating
tube for increasing heat dissipating efficiency to ensure proper
operation of the device elements.
[0007] Another object of this invention is to enhance air
convection between the heat dissipating plates for achieving
optimal heat dissipating effect.
[0008] A further object of this invention is to use the stackable
property of this invention to closely engage the heat dissipating
tube for increasing effective heat dissipating area and preventing
air from trapping in the dead angle area thereby to smooth air flow
and accelerate heat dissipation.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The invention, as well as its many advantages, may be
further understood by the following detailed description and
drawings, in which:
[0010] FIG. 1 is a schematic view of air flow in a conventional
heat dissipating structure.
[0011] FIG. 2 is a perspective view of the present invention;
[0012] FIG. 3 is a schematic view of the present invention, at a
stacking assembled state;
[0013] FIG. 4 is a schematic of the present invention, at a
juxtaposing assembled state;
[0014] FIG. 5 is a perspective view of an embodiment of the present
invention; and
[0015] FIG. 6 is a schematic view of another embodiment of the
present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0016] Referring to FIG. 2, the heat dissipating structure
according to this invention includes a plurality of heat
dissipating elements 1 and a corresponding heat dissipating tube 7
(will be described later). Each heat dissipating element 1 has an
upper and a lower edge bent to form respectively an upper flange 11
and a lower flange 12, and a convection zone 13 located
therebetween. The upper flange 11 has two ends each forms a
fastening section 2 which includes an insertion tab 21 and a
receiving slot 22 which may be engaged with the insertion tab 21 of
an adjacent heat dissipating element 1.
[0017] The lower flange 12 also has a fastening section 2 located
at the center and two fastening feet 3 and 4 located at two ends
thereof which extend downwards to form an indented zone 5 with the
lower flange 12. The heat dissipating element 1 thus formed may be
engaged and stacked one upon another.
[0018] FIGS. 3 and 4 show respectively this invention being
assembled in a stacked and juxtaposed fashion. The heat dissipating
elements 1 may use the fastening section 2 to stack and engage with
one another through engaging the insertion tab 21 to a receiving
slot 22 of an adjacent heat dissipating element 1 thereby to form a
multiple layer assembled element.
[0019] One assembled element 1 then may be turned 180 degree to
juxtapose with another assembled element 1' in an up and down
manner with the fastening feet 3 and 4 contacting one another. The
fastening feet 3 and 4 then may be bonded by hot melt adhesive (or
soldering). The two indented slot 5 and 5' will be coupled together
to form a housing chamber 6.
[0020] Referring to FIGS. 5 and 6, when the heat dissipating
elements are stacked and assembled, a mating heat dissipating tube
7 may be disposed in the housing chamber 6. The heat dissipating
tube 7 may be shaped in a streamline form (such as a stretched
ellipse, rectangle, lozenge, or the like) to engage with the
housing chamber 6 closely and contact tightly with the assembled
heat dissipating elements 1 and 1' by means of hot melt adhesive
(not shown in the drawings). The structure thus formed will
increase relative heat dissipation area of the heat dissipating
tube thereby to enhance effective heat dissipation power. Moreover,
the streamline nature of the heat dissipating tube 7 will prevent
the air from trapping in the dead angle and enable the air to flow
more smoothly to disperse heat rapidly. Furthermore, after stacking
of the heat dissipating elements, air still may flow through the
convection zone 13 and be discharged at the outlet thereof This
will enhance the air convection and achieve the optimal heat
dissipating effect.
[0021] It may thus be seen that the objects of the invention set
forth herein, as well as those made apparent from the foregoing
description, are efficiently attained. While the preferred
embodiment of the invention has been set forth for purpose of
disclosure, it would be obvious to those skilled in the art that
various other changes and modifications can be made without
departing from the spirit and scope of the invention.
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