U.S. patent application number 09/746089 was filed with the patent office on 2002-08-22 for external attached heat sink fold out.
Invention is credited to Cardenas, Marlon.
Application Number | 20020114136 09/746089 |
Document ID | / |
Family ID | 24999433 |
Filed Date | 2002-08-22 |
United States Patent
Application |
20020114136 |
Kind Code |
A1 |
Cardenas, Marlon |
August 22, 2002 |
EXTERNAL ATTACHED HEAT SINK FOLD OUT
Abstract
A heat sink insertable into a computer and attached to the
computer. The heat sink is coupled to a heat pipe. When the heat
sink is inserted into the computer, the heat pipe is disengaged
from a heat source. When the heat sink is removed from the
computer, the heat pipe is engaged with the heat source to transfer
heat generated by the heat source to the heat sink, which is
external to the computer.
Inventors: |
Cardenas, Marlon; (Fremont,
CA) |
Correspondence
Address: |
John P. Ward
BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP
7th Floor
12400 Wilshire Boulevard
Los Angeles
CA
90025-1026
US
|
Family ID: |
24999433 |
Appl. No.: |
09/746089 |
Filed: |
February 20, 2001 |
Current U.S.
Class: |
361/709 ;
257/E23.088 |
Current CPC
Class: |
H01L 23/427 20130101;
H01L 2924/0002 20130101; G06F 1/20 20130101; H01L 2924/0002
20130101; Y10T 29/49353 20150115; H01L 2924/00 20130101 |
Class at
Publication: |
361/709 |
International
Class: |
H05K 007/20 |
Claims
What is claimed is:
1. An apparatus comprising: A heat sink deactivated when inserted
into a computer and activated when removed from the computer; and A
heat pipe coupled to the heat sink, the heat pipe engaged with a
heat source when the heat sink is removed from the computer, and
the heat pipe disengaged from the heat source when the heat sink is
inserted into the computer.
2. The apparatus of claim 1, wherein the heat sink includes a set
of fins, the fins are folded when the heat sink is inserted into
the computer and the fins are unfolded when the heat sink is
removed from the computer.
3. The apparatus of claim 1, wherein the heat sink includes an
active cooling mechanism.
4. The apparatus of claim 1, wherein the heat pipe is a loop heat
pipe conveying a cooling substance throughout the heat pipe.
5. The apparatus of claim 3, wherein the active cooling mechanism
is activated when the heat sink is removed from the computer and
deactivated when the heat sink is inserted in the computer.
6. A computer system comprising: A heat source; A heat sink
deactivated when inserted into a computer and activated when
removed from the computer; and A heat pipe coupled to the heat
sink, the heat pipe engaged with the heat source when the heat sink
is removed from the computer, and the heat pipe disengaged from the
heat source when the heat sink is inserted into the computer.
7. The computer system of claim 6, wherein the heat sink includes a
set of fins, the fins are folded when the heat sink is inserted
into the computer and the fins are unfolded when the heat sink is
removed from the computer.
8. The computer system of claim 6, wherein the heat sink includes
an active cooling mechanism.
9. The apparatus of claim 6, wherein the heat pipe is a loop heat
pipe conveying a cooling substance throughout the heat pipe.
10. The apparatus of claim 8, wherein the active cooling mechanism
is activated when the heat sink is removed from the notebook
computer and deactivated when the heat sink is inserted in the
computer.
11. A method of removing heat from a computer comprising:
Deactivating a heat sink by inserting the heat sink into the
computer; Activating the heat sink by removing the heat sink from
the computer; Placing a heat pipe, coupled to the heat sink, in
contact with a heat source when the heat sink is removed from the
computer; and Removing the heat pipe from contact with the heat
source when the heat sink is inserted into the computer.
12. The method of claim 11, further comprising: a set of fins
coupled to the heat sink unfolding when the heat sink is removed
from the computer; and the set of fins folding when the heat sink
is inserted into the computer.
13. The method of claim 11, wherein the heat sink includes an
active cooling mechanism.
14. The method of claim 11, wherein the heat pipe is a loop heat
pipe conveying a cooling substance throughout the heat pipe.
15. The method of claim 13, further comprising: Activating the
active cooling mechanism when the heat sink is removed from the
computer; and p1 Deactivating the active cooling mechanism when the
heat sink is inserted in the computer.
Description
BACKGROUND OF THE INVENTION
[0001] As technology gets to the limits of cooling notebooks, there
is a need for improved techniques for cooling the notebooks if we
are to keep the form factor unchanged. For example, processors are
getting faster yet notebook users want to have thinner notebooks.
As a result, a problem is presented if notebooks remain cooler and
hot spots (exceeded temperature limits on the external surface of
the notebook) are kept from developing. There is limited space to
work with in notebooks, especially with notebooks becoming
thinner.
[0002] Typically, with a full feature notebook, the base is a
little thicker than the average notebook and a large fan can keep
the notebook cool. But in thinner systems, smaller fans are used
that are not as powerful. Although the voltage can be increased to
make the small fans more powerful, acoustical limits of user
acceptance need to be taken into account. If a small fan is made
too powerful, noise created by the fan may become unacceptable to
notebook users.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] The present invention is illustrated by way of example and
not limitation in the figures of the accompanying drawings, in
which like references indicate similar elements, and in which:
[0004] FIG. 1a illustrates a top view of a computer having the
attached heat sink inserted in the computer system according to one
embodiment.
[0005] FIG. 1b illustrates a top view of a computer having the
attached heat sink removed from the computer system according to
one embodiment.
[0006] FIGS. 2a-b illustrate the heat pipe engaging the heat source
when the attached heat sink is inserted into the computer system
and removed from the computer system, according to one
embodiment.
[0007] FIG. 3a illustrates fins coupled to the heat sink in a
folded state when the heat sink is inserted in the computer
system.
[0008] FIG. 3b illustrates fins coupled to the heat sink in an
unfolded state when the attached heat sink is removed from the
computer system.
[0009] FIGS. 4a-b illustrate an active cooling mechanism attached
to the heat sink according to one embodiment.
[0010] FIGS. 5a-b illustrate a loop heat pipe attached to the heat
sink according to one embodiment.
DETAILED DESCRIPTION
[0011] A method and apparatus for providing an external heat sink
fold out that is attached to a computer system, is disclosed. In
the following description, for purposes of explanation, specific
details are set forth to provide a thorough understanding of the
present invention. However, it will be apparent to one skilled in
the art that these specific details are not required in order to
practice the present invention.
[0012] As illustrated in FIG. 1a, in one embodiment, a heat sink
102 is insertable into a bay of a computer 104. The heat sink 102
is coupled to a heat pipe 106. In one embodiment, the heat pipe 106
includes a wick to transfer heat from a heat source 108 (e.g., a
processor) in contact with the heat pipe 106 at one end to the heat
sink 102 in contact with the heat pipe 106 at an opposite end. In
alternative embodiments, other types of heat pipes could be used
(e.g., a loop heat pipe as described in more detail below), without
departing from the scope of the invention.
[0013] As shown in FIG. 1a, when the heat sink 102 is inserted into
the bay of the computer 104, the heat pipe 106 is disengaged from
the heat source 108 (i.e., deactivated). As shown in FIG. 1b, when
the heat sink 102 is removed from the computer notebook 104, the
heat pipe 106 is engaged with the heat source 108 to transfer heat
generated by the heat source 108 to the heat sink 102 (i.e.,
activated), which is external to the computer 104.
[0014] Shown in greater detail in FIGS. 2a-b, a first mating device
210 coupled to the heat source 208, may have a receiving end 212 to
receive an end 214 of the heat pipe 206 when the heat sink is
external to the computer system. FIG. 2a illustrates when the heat
sink is inserted in to the computer system and the heat pipe is not
in contact with the heat source. FIG. 2b illustrates when the heat
sink is external to the computer system and the heat pipe is
accordingly in contact with the receiving end of the mating device
attached to the heating source. In alternative embodiments,
alternative configurations may used to interconnect the heat pipe
206 and the heat source. Moreover, a grease, phase change material
or other type of thermal interface material may be used to assist
in the merging of the end 214 of the heat pipe 206 and the
receiving end 212 of the first mating device 210.
[0015] In one embodiment, as illustrated in FIGS. 3a-b, the heat
sink 302 includes a set of fins 316. When the heat sink 302 is
inserted into the computer notebook, the fins 316 are folded (as
illustrated in FIG. 3a, to allow the heat sink to consume less
space when inserted in the computer. When the heat sink 302 is
removed from the notebook, the fins 316 of the heat sink unfold (as
illustrated in FIG. 3b) to assist in dissipating the heat generated
by the heat source. The size of the fins can vary based upon
implementation design, with larger fins presumably providing
greater heat dissipation.
[0016] In one embodiment shown in FIGS. 4a-b, the heat sink 402
includes an active cooling mechanism 418 (e.g., a powered fan). The
active cooling mechanism 418 can be used to further assist the fins
416 in dissipating heat, in the embodiment that includes fins 416
attached to the heat sink 402. For example, as illustrated in FIG.
4a, when the heat sink 402 is removed from the computer system, a
powered fan may be used to blow continuous air on the fins of the
heat sink. Furthermore, in an embodiment implementing a powered fan
as the active cooling mechanism, a duct 424 may be attached to the
fan (as illustrated in FIGS. 4a-b) to focus the flow of air onto
the heat sink to further assist in cooling the heat sink. In
alternative embodiments, other types of active cooling mechanisms
may be used without departing from the scope of the invention.
[0017] As further illustrated in FIG. 4a, electrical contacts 420
(e.g., electrical wires) to provide voltage to the active cooling
mechanism 418 are engaged with a power source contacts 422 when the
heat sink is removed into the bay of the computer system, to
provide power to the active cooling mechanism 418. When the heat
sink is inserted into the computer system (as illustrated in FIG.
4b), the electrical contacts 420 disengage the power source
contacts 422 to stop providing power to the active cooling
mechanism 418. In alternative embodiment, other configurations may
be implemented to provide power to the active cooling mechanism,
without departing from the scope of the invention.
[0018] In one embodiment, as illustrated in FIGS. 5a-b, the heat
pipe 506 attached to the heat sink 502 is a loop heat pipe routed
through the computer system 504, which allows for the passage of a
cooling substance to be passed throughout the heat pipe 506 to
further assist in cooling of the computer system.
[0019] As illustrated in FIG. 5a, when the heat sink is inserted
into the computer system, a first 526 and/or second end 528 of the
loop heat pipe are disengaged to prevent the cooling substance from
passing throughout the loop heat pipe 506. However, when the heat
sink is removed from the computer system (as shown in FIG. 5b), the
first 526 and/or second 528 ends of the loop heat pipe is
re-engaged to allow the cooling substance to flow throughout the
loop heat pipe and further assist in cooling the computer
system.
[0020] In the foregoing specification the invention has been
described with reference to specific exemplary embodiments thereof.
It will, however, be evident that various modifications and changes
may be made thereto without departing from the broader spirit and
scope of the invention. The specification and drawings are,
accordingly, to be regarded in an illustrative rather than
restrictive sense.
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