U.S. patent application number 10/114750 was filed with the patent office on 2002-08-08 for method and system for high speed measuring of microscopic targets.
This patent application is currently assigned to General Scanning, Inc.. Invention is credited to Ehrmann, Jonathan S., Kilgus, Donald B. T., Svetkoff, Donald J..
Application Number | 20020105655 10/114750 |
Document ID | / |
Family ID | 21883474 |
Filed Date | 2002-08-08 |
United States Patent
Application |
20020105655 |
Kind Code |
A1 |
Svetkoff, Donald J. ; et
al. |
August 8, 2002 |
METHOD AND SYSTEM FOR HIGH SPEED MEASURING OF MICROSCOPIC
TARGETS
Abstract
A system including confocal and triangulation-based scanners or
subsystems provides data which is both acquired and processed under
the control of a control algorithm to obtain information such as
dimensional information about microscopic targets which may be
"non-cooperative." The "non-cooperative" targets are illuminated
with a scanning beam of electromagnetic radiation such as laser
light incident from a first direction. A confocal detector of the
electromagnetic radiation is placed at a first location for
receiving reflected radiation which is substantially optically
collinear with the incident beam of electromagnetic radiation. The
system includes a spatial filter for attenuating background energy.
The triangulation-based subsystem also includes a detector of
electromagnetic radiation which is placed at a second location
which is non-collinear with respect to the incident beam. This
detector has a position sensitive axis. Digital data is derived
from signals produced by the detectors. In this way, data from at
least one triangulation-based channel is acquired in parallel or
sequentially with at least one slice of confocal image data having
substantially perfect temporal and spatial registration with the
triangulation-based sensor data. This allows for fusion or further
processing of the data for use with a predetermined measurement
algorithm to thereby obtain information about the targets.
Inventors: |
Svetkoff, Donald J.; (Ann
Arbor, MI) ; Kilgus, Donald B. T.; (Brighton, MI)
; Ehrmann, Jonathan S.; (Sudbury, MA) |
Correspondence
Address: |
David R. Syrowik
Brooks & Kushman P.C.
22nd Floor
1000 Town Center
Southfield
MI
48075-1351
US
|
Assignee: |
General Scanning, Inc.
Simi Valley
CA
|
Family ID: |
21883474 |
Appl. No.: |
10/114750 |
Filed: |
April 2, 2002 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10114750 |
Apr 2, 2002 |
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09035564 |
Mar 5, 1998 |
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6366357 |
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Current U.S.
Class: |
356/602 |
Current CPC
Class: |
G01B 11/2518 20130101;
G01N 21/9501 20130101; G02B 21/22 20130101; G01B 11/24 20130101;
G01B 11/026 20130101; G01B 11/2545 20130101 |
Class at
Publication: |
356/602 |
International
Class: |
G01B 011/24 |
Claims
What is claimed is:
1. A method for developing dimensional information about an object
on a specular background utilizing a scanning system having a
sensor, the scanning system scanning an illumination beam of
electromagnetic energy, the method comprising the steps of:
determining reference data based on an illumination beam reflected
from the specular background; positioning the sensor based on the
reference data so that a waist of the illumination beam
substantially coincides with an expected predetermined 3D location
of the object so as to enhance contrast and obtain
three-dimensional sensor data and/or confocal sensor data; and
processing the sensor data to obtain the dimensional
information.
2. The method as claimed in claim 1 wherein the object is a bump
and wherein the dimensional information includes a height estimate
of the bump.
3. The method as claimed in claim 2 wherein the dimensional
information includes information as to whether the bump is
defective or not.
4. The method as claimed in claim 1 wherein the object has a
spherical, mirror-like surface and wherein the object is mounted on
a planar mirror-like surface of the background.
5. The method as claimed in claim 4 wherein the dimensional
information includes a diameter for the spherical mirror-like
surface.
6. The method as claimed in claim 1 wherein the dimensional
information includes 3D information.
7. The method as claimed in claim 1 wherein the object is a
micromechanical device.
8. The method as claimed in claim 1 wherein the object is a
conductive trace.
9. The method as claimed in claim 1 wherein the object is an
interconnect on a semiconductor device.
10. The method as claimed in claim 1 wherein the three-dimensional
sensor data and the confocal sensor data are processed sequentially
or in parallel with a predetermined measurement algorithm.
11. The method as claimed in claim 1 wherein the three-dimensional
sensor data and the confocal sensor data have substantially perfect
temporal and spatial registration before the step of
processing.
12. The method of claim 1 wherein the object has a diameter and
wherein the dimensional information is a measurement of the
diameter.
13. The method of claim 1 wherein the object is a defect of or on a
wafer.
14. The method as claimed in claim 1 wherein the dimensional
information includes height information.
15. The method as claimed in claim 1 wherein the step of processing
the sensor data is performed in combination to produce the
dimensional information.
16. The method as claimed in claim 1 wherein the object has a
diameter and wherein the dimensional information includes diameter
information and wherein the method further comprises the step of
locating a region of the object for further data acquisition based
on the dimensional information.
17. A system for developing dimensional information about an
object, the system comprising: at least one illuminator for
illuminating an object with at least one beam of electromagnetic
energy to obtain at least one reflected beam of electromagnetic
energy; a confocal detector for detecting the at least one
reflected beam of electromagnetic energy and producing at least one
signal; a signal processor for processing the at least one signal
to obtain confocal data; and a data processor having digital data
processing data smoothing and curve fitting algorithms for
processing the confocal data with a priori knowledge about the
object to obtain the dimensional information whereby the accuracy
of the confocal data is improved.
18. The system as claimed in claim 17 further comprising at least
one triangulation-based detector for detecting the at least one
beam of electromagnetic energy and producing at least one
triangulation-based signal and a triangulation-based signal
processor for processing the at least one triangulation-based
signal and producing triangulation-based sensor data.
19. The system as claimed in claim 18 further comprising storage
means for storing the triangulation-based sensor data and the
confocal data in parallel.
20. The system as claimed in claim 18 further comprising a
controller coupled to the data processor for controlling the system
based on either the confocal image data or the triangulation-based
sensor data.
21. The system as claimed in claim 17 wherein the dimensional
information includes height information.
22. The system as claimed in claim 18 wherein the confocal data and
the triangulation-based sensor data are processed by the data
processor in combination to produce the dimensional
information.
23. The system as claimed in claim 17 wherein the dimensional
information includes gray scale information.
24. A method for inspecting bumps on a wafer, the method comprising
the steps of: acquiring reference data based on 3D information
obtained from either a confocal subsystem or a triangulation
subsystem having a triangulation sensor; generating a scan based
upon reference data to obtain 3D data wherein the 3D data is
obtained from the triangulation sensor; and determining height of
the bumps based on the 3D data.
25. A method for developing dimensional information about an array
of objects, each of the objects having a surface, the method
comprising the steps of: obtaining a first set of data representing
maximum specular reflections from the surfaces of the objects;
computing height estimate data for the array of objects utilizing
the first set of data; and analyzing the height estimate data to
obtain an estimate of the height.
26. The method as claimed in claim 25 further comprising the step
of obtaining additional dimensional information about the array of
objects using a confocal sensor based upon the estimate.
27. The method as claimed in claim 25 further comprising the steps
of obtaining a second set of data represented by a region in
proximity to the maximum specular reflection and analyzing the
second set of data by peak location to reduce optical
crosstalk.
28. The method of claim 25 wherein each of the objects has a
diameter and wherein the dimensional information is a diameter of
at least one of the objects.
29. The method of claim 25 wherein each of the surfaces is a shiny
curved surface which is a reflowed, substantially spherical, solder
ball surface.
30. A method of measuring at least one dimension of an interconnect
on a specular wafer, the method comprising the steps of: measuring
the wafer at three or more non-colinear locations to obtain
reference data; forming a reference surface from the reference
data; scanning the wafer to obtain scan data based on the reference
surface; and determining the at least one dimension of the
interconnect based on the scan data.
31. The method of claim 30 wherein the scan data is confocal
data.
32. The method of claim 30 wherein the scan data is triangulation
data.
33. The method of claim 30 wherein the scan data is confocal and
triangulation data.
34. The method of claim 30 wherein the interconnect has a curved
specular surface.
35. The method of claim 30 wherein the interconnect is a solder
ball.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is related to U.S. patent application
entitled "Versatile Method and System for High Speed, 3D Imaging of
Microscopic Targets" filed on the same day as this application.
TECHNICAL FIELD
[0002] This invention relates to methods and systems for high speed
measuring of targets and, in particular, to methods and systems for
high speed measuring of microscopic targets which may be
"non-cooperative."
BACKGROUND ART
[0003] Recognition of Need
[0004] A class of three-dimensional imaging and measurement
applications now requires unprecedented demonstration of capability
to support new microelectronic and micromechanical fabrication
technologies. For example, emerging semiconductor fabrication
technologies are directed toward establishing a high density of
interconnection between the chip and package. The "bumped wafer"
and miniature ball grid array (".mu.-BGA") markets are emerging,
and large scale growth is predicted. For instance, NEMI (National
Electronics Manufacturing Initiative) has clearly indicated that
the miniature array technologies are to replace traditional wire
bonding interconnects. Manufacturers are experimenting with new
processes. Measurement tools to support their efforts will require
versatility.
[0005] For example, "dummy wafers" are used for many experiments,
which have a specular and featureless surface onto which
interconnects are placed. The appearance is much different than
patterned wafers seen in typical production environments. This
imaging phenomena is of little concern to the process engineer. In
fact, the most difficult imaging problems may coincide with the
best choice of process. Industry process development engineers
indicate that reflowed spherical solder bumps with a smooth surface
finish, sometimes a nearly perfect mirror, may be the preferred
technology for the chip interconnects. The surface reflectance will
vary because of process engineers' choices of relative content of
lead and tin. Such targets are often "uncooperative."
[0006] The chips onto which the balls are placed are subsequently
attached to printed circuit boards where both flattened and
spherical mating interconnects can be expected, with either a dull
or smooth surface finish. All combinations are expected. Other
geometric shapes (wire with flat top, cones) can be expected in the
future which will pose measurement challenges, particularly when
the surface is specular with spherical or cylindrical geometry,
including concavities.
[0007] Such "non-cooperative" targets, (i.e. those which present
challenges for measurement systems as a result of light reflection,
scattering, and geometry), are and will continue to be growing in
occurrence for semiconductor, micromachining, and mass storage
imaging applications. A specific growing need is recognized for an
imaging system capable of improving dimensional measurement of
.mu.-BGAs and bumped wafers (i.e. "spherical mirrors" on variable
wafer backgrounds) and other such targets, which are
"non-cooperative" with respect to traditional imaging systems. As
inspection and measurement requirements for industries requiring
microscopic measurement capabilities, for instance semiconductor
and mass storage, become more demanding, extraordinary versatility
will be needed for handling wide variation in scale, target
geometry, and reflectivity. Similarly, inspection and measurement
of circuit boards and the dielectric and conductive materials
requires a versatile imaging system, particularly for fine
geometries and densely populated component boards.
[0008] As mentioned previously, imaging requirements for the
semiconductor packaging industry include defect detection as part
of Package Visual Inspection (PVI), measurement of .mu.-BGA height,
coplanarity, diameter, and wafer defects. High resolution and image
clarity obtained from reduction of image artifacts are both
required for adequate process characterization. Problems similar to
those in the semiconductor area are also present when measuring
other miniature parts like micromachined
(micromechanical)-assemblies, like miniature gears and machines,
and components utilized in the mass storage industry, including
substrates, disk heads, and flexures.
[0009] For example, as illustrated in FIGS. 1 and 7, inspection of
a very fine solder bump or ball 20 with a "pin" or tip 22 necking
down to about 1-3 .mu.m in dimension mounted on a solder pad 24,
poses a measurement problem. Manufacturers often examine the tip 22
with an electron microscope for initial evaluation, but such a tool
is much too slow for detailed process characterization or real time
control.
[0010] Also, detection of small "hairline" burrs on IC leads is
often successful using gray or 3D data using only triangulation,
but false alarms are common because background noise and reflection
from a container, such as a tray wall 26, can appear similar to the
defect such as a burr 27, as illustrated in FIG. 2. Conversely, IC
leads 28 of an IC chip 30 may be indistinguishable from the
background noise 32. These false alarms are unacceptable and lower
yields, thereby decreasing the value of inspection equipment.
[0011] .mu.-BGA inspection can be roughly equivalent to measuring a
tiny "spherical mirror" (solder ball) mounted on a plane "mirror"
(wafer) background; yet, in other cases, where the wafer is
patterned and the ball has a lower tin content, is a completely
different imaging problem. Solutions to such measurement problems
will require versatility for handling the geometric shape and
reflectance variation.
[0012] Hence, with wafer scale and other sub-micron measurement
tasks, the challenges with material properties will grow, not
diminish. There is a need to measure substrates, conductors, and
thickness of films, or the geometry of micromechanical assemblies
such as miniature gears having deep, narrow dimensions and varying
optical properties, including partially transparent layers.
[0013] Prior Art Technology
[0014] Early work on defect detection of features having specular
components using camera-based inspection is described in U.S. Pat.
No. 5,058,178 and the references cited therein. The method is
primarily directed toward lighting and image processing methods for
defect detection of bumped wafers. The lighting system included
combinations of bright and dark field illumination. Measurement of
the diameter can be done with a camera system and appropriate
illumination, but accuracy is often limited by light scattering and
limited depth of focus when high magnification is required.
However, in addition to defect detection and bump presence, there
is a need to measure the three dimensional geometry of the bumps
for process characterization. The bumps must be coplanar to provide
a proper connection, and the diameter within tolerance for a good
connection with the bonding pads.
[0015] Triangulation is the most commonly used 3D imaging method
and offers a good figure of merit for resolution and speed. U.S.
Pat. Nos. 5,024,529 and 5,546,189 describe the use of
triangulation-based systems for inspection of many industrial
parts, including shiny surfaces like pins of a grid array. U.S.
Pat. No. 5,617,209 shows an efficient scanning method for grid
arrays which has additional benefits for improving accuracy. The
method of using an angled beam of radiant energy can be used for
triangulation, confocal or general line scan systems.
Unfortunately, triangulation systems are not immune to fundamental
limitations like occlusion and sensitivity to background
reflection. Furthermore, at high magnification, the depth of focus
can limit performance of systems, particularly edge location
accuracy, when the object has substantial relief and a wide dynamic
range (i.e. variation in surface reflectance). In some cases,
camera-based systems have been combined with triangulation systems
to enhance measurement capability as disclosed in the publication
entitled "Automatic Inspection of Component Boards Using 3D and
Grey Scale Vision" by D. Svetkoff et al., PROCEEDINGS INTERNATIONAL
SYMPOSIUM ON MICROELECTRONICS, 1986.
[0016] Confocal imaging, as originally disclosed by Minsky in U.S.
Pat. No. 3,013,467, and publications: (1) "Dynamic Focusing in the
Confocal Scanning Microscope" by T. Wilson et al.; (2) "Digital
Image Processing of Confocal Images" by I. J. Cox and C. J. R.
Sheppard; (3) "Three-Dimensional Surface Measurement Using the
Confocal Sensing Microscope" by D. K. Hamilton and T. Wilson; (4)
"Scanning Optical Microscope Incorporating a Digital Framestore and
Microcomputer" by I. J. Cox and C. J. R. Sheppard; and (5) "Depth
of Field in the Scanning Microscope" by C. J. R. Sheppard and T.
Wilson, is similar to computerized tomography where slices in depth
are sequentially acquired and the data is used to "reconstruct" a
light scattering volume. In principle, an image is always formed of
an object at a focal plane as taught in elementary physics, but
over a region of depth there are an infinite number of planes which
are out of focus yet return energy. That is to say that the lens
equation for image formation is based on an idealization of an
"object plane" and "image plane".
[0017] In the case of conventional confocal imaging, the slices are
determined from the in-focus plane, and out-of-focus light (in
front and back of the focal plane) is strongly attenuated with a
pinhole or slit. Typical confocal systems use fine increments for
axial positioning for best discrimination between adjacent layers
in depth, for example, semi-transparent biological samples.
However, the method need not be restricted to the traditional
transparent or translucent objects, but can be applied both as a
depth measurement tool and image enhancement method using reflected
light for contrast improvement through stray light rejection. As
with any method, there are advantages and disadvantages.
[0018] Application of confocal imaging to semiconductor measurement
is disclosed in U.S. Pat. Nos. 4,689,491, 5,479,252 and 5,248,876.
Operation of several confocal systems is described in U.S. Pat.
Nos. 4,827,125; 4,863,226; 4,893,008; 5,153,428; 5,381,236;
5,510,894; 5,594,235; and 5,483,055 and H 1,530. Much of the recent
work is directed toward improvements, resulting in reduction of the
image memory storage requirements (store maximum, not volume),
improving the efficiency and fine positioning capability of
autofocus systems (coarse/fine search), exposure control for
improved dynamic range, and some image enhancement methods.
[0019] Similarly, variations in confocal acquisition methods are
taught in the art to solve specific problems or optimize designs
for specific applications as taught in U.S. Pat. Nos. 5,239,178 and
4,873,653. However, present confocal systems are constrained by
sequential slicing of the volume, whereas triangulation systems
detect the top surface of the volume (profile) directly resulting
in much higher speed.
[0020] In U.S. Pat. No. 5,448,359 such speed limitations are
partially circumvented by utilizing a plurality of detectors and
spatial filters in the confocal receiver optical path. A circuit to
locate the detector producing maximum intensity is disclosed.
[0021] Similarly, USSR patent document No. 868,341 discloses a
plurality of detectors with apertures (confocal) and electronic
circuitry to obtain focus (3D) information about objects. The
intensity of each detector is compared and used to adjust the
position of the imaging system along the optical axis so as to
clear the mismatch. In each case, a tradeoff is determined between
depth sensitivity, complexity, and measurement speed.
[0022] Other approaches to imaging of "non-cooperative" targets,
many directed toward solder joint inspection, have been proposed to
measure depth or fillet shape. These are described in the Chen et
al. U.S. Pat. No. 5,118,192 and a Nagoya solder joint inspection
system described in "NLB Laser Inspector--NLB-7700M Specifications"
by Nagoya Electric Works Co., Ltd. 1994. The system uses specularly
reflected light to examine the shape of solder fillets, and to
determine presence/absence of solder. Figure E in Section 6 thereof
shows a missing fillet and the signals received from a plurality of
detectors. A detector 6 corresponds to an "on-axis" detector, and
the information is useful for estimating the diameter of the solder
bump. For instance, the detector 6 receives a large signal near the
top of the ball, a weak signal from the curved edge, and typically
a strong signal from the area adjacent to the bump. However, narrow
angle multiple reflections from the edge of the ball can corrupt
the measurement and result in ambiguous edge locations.
Furthermore, the sensitivity of the system may not be adequate to
determine the height of regions which do not have a substantial
specular reflection component.
[0023] Similarly, a recent version of the IPK solder joint
inspection system manufactured by Panasert includes a coaxial
detector with a triangulation-based sensing system as illustrated
in their brochure entitled "IPK-V" believed to be published in
1997. The .mu.-BGA, bumped die, and numerous other problems range
from scenarios where prior art technology is adequate, but in many
cases unacceptable, and even inoperable conditions exist.
[0024] Wafer measurement and defect detection systems have utilized
multiple detectors advantageously. U.S. Pat. No. 5,416,594
describes a system which uses both reflected and scattered light
for detection of defects and thin film measurements. The reflected
beam is received at an angle of reflection which is non-collinear
with the transmitted beam and the scattered light is collected over
a relatively large angle which excludes the reflected beam energy.
The scattered light beam, representative of surface defects, may be
collected at an angle which is widely separated (more than 30 deg.)
from the incident beam. The off-axis illumination and the
corresponding reflected beam are utilized for film thickness
measurements, sometimes with multiple laser wavelengths. The
scattered light signal is analyzed in conjunction with that
representing the reflected light. Although the imaging geometry is
well matched to the specific cited inspection requirements, there
are several potential disadvantages encountered when attempting to
simultaneously provide information about surface defects and say,
the peak height of interconnects like solder bumps (which have
substantial height) and the corresponding diameter and shape.
[0025] Commercial success has not been widespread, although many
approaches have been proposed. Hence, there is a need for a system
and method for three-dimensional imaging capable of performing with
both "cooperative" and "non-cooperative" targets. To be useful, the
method and system must be accurate, robust, and have high
measurement speed, the latter being a traditional limit to the use
of widespread confocal imaging.
SUMMARY OF THE INVENTION
[0026] A method of the present invention overcomes the limitations
of the prior art imaging of non-cooperative targets by illuminating
a surface with a scanning beam, acquiring data from at least one
triangulation-based channel, and acquiring in parallel or
sequentially at least one slice of confocal image data having
substantially perfect temporal and spatial registration with the
triangulation-based sensor data, allowing for fusion or processing
of the data for use with a predetermined measurement algorithm.
[0027] The objects of a system of the present invention are met by
utilizing a combination of confocal and triangulation-based data
acquisition, with a control algorithm guiding the cooperative data
acquisition and subsequent processing.
[0028] The invention is a method and system for developing
three-dimensional information about an object by illuminating an
object with a focused beam of electromagnetic radiation incident
from a first direction. A detector of electromagnetic radiation is
placed at a first location for receiving reflected radiation which
is substantially optically collinear with the incident beam of
electromagnetic radiation, and the detection system includes a
spatial filter for attenuating background energy. Another detector
of electromagnetic radiation is placed at a second location which
is non-collinear with respect to the incident beam. The detector
has a position sensitive axis. Digital data is derived from signals
produced by said first and second detectors. The digital data is
then processed to generate information about the object.
[0029] Specific objects of the invention include:
[0030] An object of the invention is to provide an integrated
method and system for high speed measuring to obtain measurements
for conductor traces (height.about.1-3 .mu.m) and/or interconnects
(i.e. 10-300 .mu.m bumps) on semiconductor devices.
[0031] An object of the invention is to provide a method and system
for high speed measuring which has diverse measurement and defect
detection capability with a combination of a confocal sensor and
triangulation allowing for measurement of miniature, complex
geometry present in the microelectronics, micromechanical, and disk
storage industries.
[0032] An object of the invention is to provide a method and system
for high speed measuring to obtain information from either of two
channels used to guide subsequent data acquisition operations in
either or both channels. For example, sparse data may be acquired
with a triangulation-based system at high speed, and the
information used to guide the high speed selection of confocal
slices, perhaps in windowed regions. FIG. 3 illustrates imaging
geometry of a solder ball 29 (i.e. spherical mirror) of radius R
(i.e. R<150 .mu.m typically) formed on a pad 31.
[0033] An object of the invention is to provide a high speed method
and system for measuring which can obtain reasonable height
estimates of the bumps or "spherical mirrors" in a "pre-screening"
operation and locate defective bumps or wafers at high speed. The
results would define the range for additional slices (i.e. if
needed) for precise verification of the geometry of regions passing
the "pre-screening" test. Therefore, maintaining wafer inspection
times will remain as minutes, not hours. For "sparse" patterns,
"windowing" could increase the speed of measurement for localized
regions. FIGS. 4a and 4b are top schematic images of specular
solder balls 34 (indicated by phantom lines in FIG. 4a) using
triangulation and confocal imaging, respectively, in accordance
with the present invention. The balls 34 of FIG. 4b have specular
ball tips 35 formed on pads 36 which, in turn, are located on a
shiny "dummy" wafer 38. The 3D image of FIG. 4a (i.e. including
specular reflections from regions 35' of the ball 34 adjacent the
ball tips) is formed by a triangulation-based system having dual
detectors to provide Z measurement, bump presence and defect
information. The confocal slice image of FIG. 4b provides diameter,
Z measurement and defect information. In both FIGS. 4a and 4b, a
flat bump having diffuse reflection is indicated at 40, an empty
pad (i.e. missing bump) is indicated at 42, and a smashed bump
(i.e. defect) is indicated at 44.
[0034] Referring specifically to FIG. 5, an object of the invention
is to provide a high speed method and system for measuring a
miniature spherical mirror like a solder ball 46 or wafer, mounted
on a plane mirror or pad 48 formed on a substrate 50 and producing
a very high contrast bump-background image allowing for accurate
measurement of diameter, devoid of occlusion and with minimal
reflection noise for many pad backgrounds. FIG. 5 shows a spatial
filter 52 through which an incident ray 54 passes and bounces off
the ball surface to form reflected rays 56, multiple reflections
58, and specular reflection 60. The spatial filter 52 (i.e.
confocal slit) provides the indicated filtering action.
[0035] An object of the invention is to provide a high speed method
and system for measuring which have significant advantages over
conventional camera and lighting systems, even with relatively few
slices of spatially filtered data.
[0036] An object of the invention is to provide a high speed method
and system for measuring to, in turn, provide gray scale contrast
improvement of the image of FIG. 2 for possible detection of
defects and reduction of false "accepts" and "rejects" (i.e.
"error" region 33) in any number of applications through stray
light rejection. One such classification of burrs 27 and similar
defects, like those specified for electronic Package Visual
Inspection (PVI), may be satisfied with this method and system and
would otherwise be difficult. FIG. 6 is a confocal slice of the IC
chip 30 of FIG. 2 located in the tray 26 of FIG. 2. FIG. 6
illustrates the effect of spatial filtering with best focus near
the nominal pad and burr locations. With the present invention, the
data of FIG. 6 is combined with 3D triangulation data for improved
classification. Also, visualization and measurement of small bumps
and pits could be improved. Furthermore, discrimination of edges
which is difficult in the presence of multiple reflection is
provided herein.
[0037] An object of the invention is to provide a high speed method
and system for measuring to, in turn, overcome limits of
triangulation-based imaging for "mirrored" wafer backgrounds, where
triangulation often requires photon limited detection or nearly so,
and to provide a focus-based depth measurement method and system
which operates at high speed.
[0038] An object of the invention is to provide a method and system
for measuring at high speed for measurement of ball bumps, and
rigid wire interconnects within the semiconductor industry.
[0039] Referring again to FIGS. 1 and 7, an object of the invention
is to provide a method and system for high speed measuring of
objects having complex geometry, for instance "ball bumps" 20 and
rigid wires 22, with the speed advantages of a
triangulation/confocal combination while overcoming "enclosed
energy" limitations and resulting corruption of the "signal" by
optical noise from reflection of the sidelobe energy to the
background (as illustrated in FIG. 7), producing false readings in
triangulation-based systems. In this case, a confocal channel
produces a higher optical signal-to-noise and background rejection,
while a triangulation-based system rapidly measures the other
features, albeit at least two passes might be required because of
the pin height relative to the necessarily restricted depth of
focus.
[0040] An object of the invention is to provide an integrated
method and system for high speed measuring having substantially
perfect temporal and spatial registration between two sensors or
subsystems of the system which allows "fusion" of the data, with
selection of the best sensor data based upon reflectance and
contrast, perhaps on a pixel-by-pixel basis.
[0041] An object of the invention is to provide a versatile method
and system for high speed measuring of targets on the wafer scale
for inspection and measurement. At such higher magnification,
material properties vary greatly, from translucent to opaque, and
"mirrorlike" to matte.
[0042] An object of the invention is to provide a method and system
for high speed measuring to provide improved discrimination of
metallic surfaces from the translucent backgrounds, and to measure
materials such as conductive epoxy used for interconnects. Some
applications in the optical storage industry may be best solved
with this type of technology (flexure measurement) and at higher
magnification (high contrast, disk head measurement).
[0043] An object of the invention is to provide a method and system
for high speed measuring which introduces a feature of increased
gray scale contrast and fidelity from the region of the beam waist,
through at least rudimentary "depth-through-focus detection"
capability. At very high magnification, a confocal channel either
"competes" or "cooperates" with dual-detector triangulation for the
best imaging mode.
[0044] An object of the invention is to provide an integrated
method and system for high speed measuring which can include both
high N.A. (numerical aperture) optics and lower N.A. for use with
either confocal or triangulation channels realized with wavelength,
time or spatial multiplexing methods, as illustrated in FIG. 8.
[0045] An object of the invention is to provide a method and system
for high speed measuring which provides selectable lateral and
depth resolution for confocal and triangulation-based imaging
through the use of multiplexing and programmable or selectable
height resolution.
[0046] An object of the invention is to provide a method and system
for high speed measuring including high grey scale resolution and
dynamic range (sufficient to avoid automatic gain or light control
requirements) and processing with smoothing algorithms. The
smoothing algorithms may be adapted to include known information
regarding the physical characteristics of the object.
[0047] An object of the present invention is to provide a method
and system for high speed measuring by obtaining confocal and/or
triangulation data rapidly. Objects which are reflective such as
solder joints, substrates and wafers are substantially opaque in a
homogeneous medium such as air, unlike several objects
traditionally "sliced" with the confocal technique. As such, an
object of the invention is to estimate the depth of reflective
objects using estimation techniques and relatively few slices
compared to traditional "peak detection" systems utilized for
confocal imaging. The smoothing and estimation techniques could be
utilized with a single confocal detector when data is acquired with
axial translation, with multiple detectors involving no translation
or a combination of the two.
[0048] A further object of the present invention is to provide a
method and system for high speed measuring by adapting smoothing
and/or estimation algorithms based upon a priori information
regarding the physical characteristics of objects within a region
of interest, thereby avoiding corruption of the measurements
associated with peak search methods.
[0049] A further object of the invention is to provide measurement
capability of both "featureless" and textured surfaces using an
appropriate selection of information.
[0050] An object of the invention is to provide an improved method
of measuring using confocal imaging, used alone or in combination
with triangulation, where acquisition times are reduced with the
use of a solid state beam deflector having retrace times on the
order of 1-10 microseconds, whereby pixel rates well in excess of
video rates are achievable.
[0051] A further object of the invention is to provide an improved
method of measuring using confocal imaging where mechanical motion
requirements for axial translation of the position of focus of the
illumination beam is reduced or eliminated.
[0052] In carrying out the above objects and other objects of the
present invention, a method is provided for developing dimensional
information about an object on a specular background utilizing a
scanning system having a sensor. The scanning system scans an
illumination beam of electromagnetic energy. The method includes
the step of determining reference data based on an illumination
beam reflected from the specular background. The method further
includes the step of positioning the sensor based on the reference
data so that a waist of the illumination beam substantially
coincides with an expected predetermined 3D location of the object
so as to enhance contrast and obtain three-dimensional sensor data
and/or confocal sensor data. The method finally includes the step
of processing the sensor data to obtain the dimensional
information.
[0053] Still further in carrying out the above objects and other
objects of the present invention, a system is provided for
developing dimensional information about an object. The confocal
system includes at least one illuminator for illuminating the
object with at least one beam of electromagnetic energy to obtain
at least one reflected beam of electromagnetic energy, a confocal
detector for detecting the at least one reflected beam of
electromagnetic energy and producing at least one signal, a signal
processor for processing the at least one signal to obtain confocal
data and a data processor having digital data processing data
smoothing and curve fitting algorithms for processing the confocal
data with a priori knowledge about the object to obtain the
dimensional information whereby the accuracy of the confocal data
is improved (i.e., particularly with the use of fewer slices
acquired at relatively coarse increments with respect to the
attainable height resolution).
[0054] Further in carrying out the above objects and other objects
of the present invention, a method is provided for inspecting bumps
on a wafer. The method includes the steps of acquiring reference
data based on 3D information obtained from either a confocal
subsystem or a triangulation subsystem having a triangulation
sensor. The method further includes the step of generating a scan
based upon the reference data to obtain 3D data wherein the 3D data
is obtained from the triangulation sensor. The method finally
includes the step of determining height of the bumps based on the
3D data.
[0055] Yet still further in carrying out the above objects and
other objects of the present invention, a method is provided for
developing dimensional information about an array of objects, each
of the objects including a surface. The method includes the steps
of obtaining a first set of data representing maximum specular
reflections from the surfaces of the objects, computing height
estimate data for the array of objects utilizing the first set of
data and analyzing the height estimate data to obtain an estimate
of the height.
[0056] In further carrying out the above objects and other objects
of the present invention, a method is provided for measuring at
least one dimension of an interconnect on a specular wafer. The
method includes the step of measuring the wafer at three or more
non-colinear locations to obtain reference data. The method
includes further includes forming a reference plane from the
reference data. The method also includes the step of scanning the
wafer to obtain scan data based on the reference plane. The method
finally includes the step of determining the at least one dimension
of the interconnect based on the scan data.
[0057] The above objects and other objects, features, and
advantages of the present invention are readily apparent from the
following detailed description of the best mode for carrying out
the invention when taken in connection with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0058] FIG. 1 is a schematic side view of a ball bump with an
interconnecting wire;
[0059] FIG. 2 is a top schematic view of a 3D image of leads and
defects in a tray using only triangulation and illustrating an
error caused by tray wall reflection;
[0060] FIG. 3 is a side schematic view of a specular solder ball on
a wafer and illustrating the ball's imaging geometry;
[0061] FIG. 4a is a top schematic triangulation-based image of a
number of solder balls on a shiny "dummy" wafer utilizing
triangulation for obtaining Z measurement, bump presence
information and defect information;
[0062] FIG. 4b is a top schematic confocal slice image, similar to
FIG. 4a, utilizing a confocal channel to obtain diameter
information, Z measurement and defect information;
[0063] FIG. 5 is a side schematic view of a solder ball on a pad
mounted on a substrate and illustrating the filtering action of a
spatial filter such as a confocal slit;
[0064] FIG. 6 is a top schematic view similar to that of FIG. 2
after spatial filtering with best focus near the nominal lead and
burr locations using the confocal channel;
[0065] FIG. 7 is a side view of a ball bump on a pad illuminated
from the top by laser light and illustrating side lobes outside the
point of interest;
[0066] FIG. 8 is a schematic view of a confocal subsystem
constructed in accordance with the present invention including
control logic to control low and high N.A. laser beams;
[0067] FIG. 9 is a schematic view of a simplified combined
triangulation and confocal system constructed in accordance with
the present invention without optical elements;
[0068] FIG. 10 is a schematic view of a combined triangulation and
confocal system constructed in accordance with the present
invention;
[0069] FIG. 11 is a top schematic view of a semiconductor die
enlarged from FIG. 12 with spherical mirror balls mounted
thereon;
[0070] FIG. 12 is a top schematic view of a wafer having a
plurality of dies to be inspected;
[0071] FIG. 13 is a schematic side view, partially broken away, of
a spherical mirror (i.e. solder ball) formed on a solder pad and
its corresponding confocal slice as viewed from the top of the
mirror;
[0072] FIG. 14 is a block diagram flow chart illustrating an
exemplary method for measuring microscopic targets;
[0073] FIG. 15 is a side schematic view of a solder ball on a wafer
with a waist of a laser beam at the approximate midway point of the
ball;
[0074] FIG. 16a is a top view of an image of a solder ball obtained
through triangulation and processed to obtain peak information to
avoid crosstalk;
[0075] FIG. 16b is a top view of an image of the solder ball
obtained through the confocal channel and processed to obtain
diameter (i.e. edge) information;
[0076] FIG. 17 is a side view of a solder ball on a board
illustrating expected tip and center locations as well as confocal
slice locations; and
[0077] FIG. 18 are graphs of normalized detector power versus
height (i.e. beam waist at Z=0) with Gaussian propagation off
spherical and flat mirrors with the innermost solid-line graph
being of a diffuse surface and wherein the graphs are not
necessarily symmetric about the origin and may have varying shapes
resulting from the different physical properties of the
surface.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0078] FIG. 9 is a simplified schematic view, without optical
elements, of an integrated triangulation-confocal system, generally
indicated at 10, constructed in accordance with the present
invention. The system 10 includes a laser 11 (i.e. L1), a beam
deflector 12 and a beam splitter assembly 13. The system 10 also
includes a pair of spatial filters in the form of slits 14 and 15.
The system 10 further includes first and second position sensitive
detectors 16 and 17, respectively, and a photodiode detector 18.
The detectors 16 and 17 provide triangulation analog signals to a
triangulation signal processor 19 for triangulation signal
processing and the detector 18 provides confocal analog signals to
a confocal signal processor 21 for confocal signal processing. The
resulting digital Z (i.e. height) and grey scale data from the
processor 19 is combined with digital confocal slice data
(.gtoreq.12 bits typical) from the processor 21 by a data processor
23 which provides multi-sensor data processing under the control of
a computer controller 25 to obtain defect and dimensional data for
the object being inspected by the system 10.
[0079] FIG. 10 shows a schematic representation, together with
optical elements, of an integrated triangulation-confocal system,
generally indicated at 110, constructed in accordance with the
present invention. The system 110 generally includes a
triangulation-based laser scanner 112. The triangulation-based
laser scanner 112 has optical elements (i.e. pre-optics), a beam
deflector, and a laser transmitter. The operation of
triangulation-based laser scanners is taught in the art. For
example, U.S. Pat. No. 5,024,529 shows a preferred method for high
speed, triangulation-based imaging.
[0080] The system 110 also includes a transmitter beam expansion
subsystem 114 and a transmitter focusing subsystem 115. The system
110 further includes a pair of receivers, each of which includes an
optical subsystem 116 and a position sensitive detector 118 which
are positioned at angles with respect to a laser beam incident on
an object 120 which may have a spherical surface. Each optical
subsystem 116 preferably includes an anamorphic optical assembly to
delivery energy to its small area detector 118 whereby speed, field
of view, and signal-to-noise ratio are maximized.
[0081] The multiple detectors 118 are preferably used to improve
the accuracy of triangulation-based measurements by transforming
height and intensity data based on confidence measures as taught in
U.S. Pat. No. 5,546,189. Based upon specifications for inspection
and knowledge of the object structure, either data channel can be
used, or a knowledge-based algorithm can be used on a data
processor 121 under control of a computer controller 123 to merge
the resulting z and grey scale level data. Efficient scanning
methods to exploit regular or repetitive patterns such as balls or
bumps 200 formed on a die 202 as illustrated in FIG. 11 are known
and taught in the art. For example, the symmetry of row/column
arrangements can be exploited as taught in U.S. Pat. No. 5,617,209.
Such regular arrangements are found in the semiconductor industry
and others. Each ball 200 is typically 10-300 .mu.m in diameter.
The die 200 is an enlarged part of a wafer 204 shown in FIG. 12.
The wafer 204 is typically 6 inches in diameter.
[0082] Referring again to FIG. 10, a basic confocal subsystem is
integrated with the above-described triangulation-based scanning
subsystem to offer combined triangulation and confocal capability.
A confocal channel is added with the addition of a beam splitter
assembly 122, a collection and delivery optical subsystem 124, a
photodiode detector/amplifier 126, and preferably an "on-board"
high resolution analog-to-digital converter 128 (i.e., 12-16
bits).
[0083] A spatial filter having a relatively wide slit 130 reduces
laser and optical system spatial noise and provides the dual
function of a confocal slit to filter back-scattered light
displaced from the plane of best focus and secondary reflections
from outside the narrow instantaneous field of view. Preferably, a
second spatial filter having a relatively narrow slit 132 is
located between the subsystem 124 and the detector/amplifier 126.
This allows for improvements or adjustments in sensitivity without
the risk of introducing diffraction effects into the transmitted
beam (i.e. the incident beam). The separate path is optionally
provided by the narrow slit 132 if increased sensitivity is
required. In addition, the use of additional slits and detectors
(or multiple laser beams) provides an option for variable
sensitivity to reduce possible tradeoffs in measurement time.
[0084] From a practical standpoint, it is desirable that the
dimensions of the slits 14 (i.e. FIG. 9) and 130 be about 3-5 times
a diffraction-limited spot diameter. Finer discrimination is
possible with the addition of a tracking mechanism, perhaps with
use of a piezoelectric controller to compensate for any drift with
time or temperature. The use of a single slit is an option, but is
not an essential element of the invention.
[0085] A narrow slit width is not always a crucial feature of the
invention because a defocus function can often be sampled at
coarser intervals of depth and interpolation or curve fitting
methods used to estimate the height at the point of interest. If
spatial filtering of the incident beam is not warranted and hence
is not implemented, a single confocal slit 15 and 132 may be used
in the separate beam path. In any case, if a very narrow slit is
used, active stabilization may be needed to avoid an increase in
intensity noise induced by drift, microphonics, or other external
influences. The above embodiment allows for high definition
confocal imaging without disturbing the triangulation image with
undesirable diffraction effects.
[0086] The assembly 122 preferably includes a cube beam splitter
which serves the dual purpose of providing optical isolation to
prevent feedback light from entering the laser cavity, and a relay
system to deliver light to the high speed detector 126. The best
delivery system will be designed to uniformly fill the detector 126
so as to avoid errors associated with intensity variations along
the detector surface.
[0087] Neutral density filters or LCDs can be used for static or
dynamic exposure control. If an acousto-optic beam deflector is
used, optical attenuation can be controlled with RF drive power.
Fast modulation methods may also be implemented with either
acousto-optic modulators or electro-optic modulators. The latter is
preferably implemented in a waveguide structure for maximum speed,
compactness, and minimal power dissipation. However, advancements
in A-D converter technology have resulted in 14-16 bit converters
which operate at video speeds or greater. These devices, along with
advancements in memory speed and density, may often eliminate the
requirement of exposure control. Such technology, along with wide
dynamic range detectors, is preferred. However, the directional
reflectance of many industrial objects spans about 4 decades, so
exposure control may be required in some cases for sufficient noise
margin.
[0088] Subsequent to A-D conversion by the converter 128, an
interface is needed to acquire the multiple channels of data. For
instance, a confocal PCI-based image acquisition scan buffer or
commercially available frame grabber or a confocal image memory 134
is provided. The memory 134 is connected to the data processor 121
for processing its output with the Z and grey outputs of a signal
processor 135 which processes the output of the detectors 118 as
described below.
[0089] Continued advancements in high speed digital data
transmission methods can be used to minimize the number of
components. For example, commercially available A-D boards
providing 12 bits at 30 MHz data rates are available presently,
like the Compuscope Series from Gage Applied Sciences. Such
advancements are advantageous because the triangulation (with
single or dual detectors) data and the confocal image can be
readily acquired and stored in parallel, resulting in perfect
temporal and spatial registration for "fusion" operations in the
processor 121. Other alternative methods are known to those skilled
in the art including "firewire" technology for digital transmission
to PC memory.
[0090] In any case, it is clear that future revisions of hardware
will not be a stumbling block because memory is cheaper and will
require less space, and processors will be able to handle multiple
imaging modes. Indeed, it is possible to store several slices of
confocal data for subsequent pointwise or volumetric filtering
operations, increasing robustness and rejecting noise associated
with peak detection (i.e. sorting) methods. Memory savings can
result, for instance, by providing confocal data from regions of
interest which may be a small fraction of the total image. For
example, a ball grid array measurement system may use confocal
imaging for localized peak detection over a region of 16
pixels.times.16 pixels.
[0091] As illustrated in FIGS. 3, 4a, 4b, and 10, in a preferred
embodiment where the numerical aperture (N.A.) of the triangulation
and confocal subsystems are substantially matched, a single source
of illumination is projected and scanned, preferably with a single
high speed, solid state deflector, onto the object 120, which may
be a solder ball 140 formed on a solder pad 142 which, in turn, is
formed on a polished semiconductor wafer 144 as illustrated in FIG.
13. The resulting reflected light is then sampled by the detector
system at the separate detectors 118 synchronously. Often, the
incident beam will be substantially normal to the object's surface
as illustrated in FIGS. 9 and 10.
[0092] Alternatively, separate imaging units may be used with
sequential data acquisition and the data registered via software
within the processor 121 with the disadvantage of extra processing
time and additional calibration to compensate for temporal or
spatial misregistration. This additional embodiment is not
necessarily preferred, but may be acceptable if the system figure
of merit is improved. In any case, a solid state deflector has an
advantage of random access and high speed windowing and is
recognized herein to be advantageous for the high speed
confocal-based focusing system described herein.
[0093] Certain advantages may be achieved with the use of
acousto-optic deflectors, particularly if the access time is fast,
corresponding to tens of microseconds maximum. Alternatively, the
use of electro-optic deflection technology, preferably in the form
of a sequence of electrically activated gratings embedded in a thin
film structure, offers potentially exceptional performance, with
access times of a few nanoseconds and resolution of several hundred
spots. The low delay of these deflectors will provide substantial
improvements for inspection of objects in a predetermined or
regular arrangement. An example of such a deflector is described in
U.S. Pat. No. 4,902,088 (assigned to APA Optics). Micromirror
technology may also be employed, provided that access times are
fast enough to meet inspection requirements.
[0094] Alternatively, acousto-optic deflectors can be advantageous
in certain applications with an appropriate compromise between
resolution (time-bandwidth product), acoustic velocity (delay), and
scan angle. Line rates well beyond video are achievable. For
example, TeO.sub.2 (Tellurium Dioxide) deflectors operated in
longitudinal mode may provide access time on the order of 1
microsecond or less, with 32 or more spots (resolution). The line
rates achievable with such a device are extraordinary when applied
to localized region-of-interest data acquisition. In certain line
scan systems, the limit could become the motion of the translation
mechanism used for the part or imaging unit. In some cases,
two-dimensional deflection may be preferred to avoid bottlenecks,
perhaps with a second acousto-optic device or low inertia mirror.
In some cases, it may be advantageous to provide the fast scanning
action with a second deflector and laser source confined to the
confocal subsystem.
[0095] It is instructive to illustrate one of the many novel
exemplary operational modes of the multi-sensor system 110 of the
present invention. As illustrated in FIG. 11, a mirrored
semiconductor die 202 with "spherical" mirror balls 200 mounted
thereon, is scanned. In a first pass, for example, the
triangulation-based system will acquire data from the wafer 202 and
the balls 200 which partially represents the surface profile. The
data is sufficient to rapidly identify defective regions, including
missing or defective bumps (i.e. at 42 and 44, respectively, in
FIG. 4a), or certain surface defects. For surfaces with diffuse
reflection (as illustrated at 40 in FIG. 4a), the triangulation
data may be sufficient for height and diameter measurement.
[0096] As shown in FIG. 3, the displacement of points corresponding
to specular reflection on a perfect mirrored spherical surface
measurable with triangulation from the peak of the ball 29
corresponds to only about a 1 .mu.m height offset for a typical
ball with 150 .mu.m diameter with a triangulation angle 2A of
30.degree.. If, for example, the initial height of the scanning
device is chosen such that the surface intersects with the waist of
the illumination beam, there is a possibility of rapid merging of
the data for peak height and diameter measurement.
[0097] Referring to FIG. 4b, simultaneously, data acquired along
the confocal channel, can be used to obtain a high contrast image
of a ball 34, from which the diameter is estimated. This estimation
is superior to that of the triangulation system and camera-based
systems; the data is devoid of background noise due to the
arrangement illustrated in schematic form in FIG. 5. Often the ball
34 will be specular providing large signals for the confocal
channel at the peak location. Furthermore, the high contrast image
can be used to locate surface defects which may not be visible in
the triangulation data because of occlusion or low signals limited
by the diffuse reflection coefficient.
[0098] If, for instance, the imaging system 112 is positioned so
that the beam waist is at the approximate 50% height level of the
ball (nominally), edge definition is maximized, and the contrast
will remain high. This favorable condition occurs because of the
extreme range of object directional reflectance, spanning several
decades. The wafer "mirror-like" return, although reduced well
below a maximum, provides for good contrast. The simplified sketch
of FIGS. 4b and 13 shows the type of image which is expected from a
"spherical mirror" on a flat specular background using a single
slice from the confocal channel, near best focus.
[0099] As previously mentioned, FIG. 1 shows a solder ball 20
formed on a solder pad 24. A tip 22 of the ball 20 necks down.
Specific tradeoffs between depth of focus, object height and
background reflectance will influence the contrast.
[0100] Similarly, FIGS. 2 and 6 show the resulting images from a
single pass with leads near best focus. Likewise, defects on a
wafer which correspond to defects in traces, extra material and
missing material can be detected.
[0101] It has been determined that the standard deviation and
absolute accuracy of triangulation-based height measurements is
larger than desirable on curved, specular surfaces because of
optical crosstalk inherent in triangulation systems necessarily
having limited data, as illustrated in FIGS. 3, 7 and 16a. Optical
crosstalk will be manifested in the triangulation channel by a
localized "contrast reversal" (FIGS. 3, 7 and 16a). In the regions
near the peaks shown in FIG. 16a, higher portions of the solder
ball will appear lower and vice versa. Hence, the peak detection
shown in FIG. 16a is important to the triangulation measurement on
such surfaces.
[0102] Accuracy can be enhanced and further verification of the
correct geometry can be done using the triangulation-based height
estimate (the position sensitive measurement corresponding to FIG.
16a), diameter estimate (i.e. FIG. 16b), and lateral location of
the intensity maximum to specify the subsequent confocal slices,
perhaps in conjunction with high speed "windowing" or region of
interest scanning for substantial improvements in speed. These
slices may be obtained, for example, with rapid translation of
optical elements in the scanner over a narrow range, allowing for
high speed.
[0103] Referring now to FIG. 14, there is illustrated in block
diagram, flow chart form an exemplary data collection and
processing method of the present invention.
[0104] At block 300, reference data is acquired from a wafer 301 of
FIG. 15 or a wafer 38 of FIGS. 4a and 4b. Typically, the confocal
channel is used to generate this data if the wafer 301 or 38 is
specular or unpatterned.
[0105] At block 302, the sensor is positioned at a nominal
predetermined location, for example, so that the waist of a laser
beam 303 is at the nominal expected center 305 of a solder ball 307
which is a spherical mirror.
[0106] At block 304, triangulation 3D data is acquired as well as a
confocal slice in a first pass. Such image data is illustrated in
FIGS. 4a and 4b for triangulation data and confocal data,
respectively, for both specular spheres and for cylinders having
diffuse reflection.
[0107] At block 306, the data is analyzed with the processor 121.
For a specular object, the 3D triangulation height data is analyzed
by isolating the peak information to avoid crosstalk, as
illustrated in FIG. 16a. A height estimate is obtained. The
confocal diameter and peak position is obtained by analyzing the
data from the confocal slice as illustrated in FIG. 16b.
[0108] At block 308, both the height estimate and the diameter are
compared with expected results and/or specifications including
expected consistency between confocal and triangulation data as
illustrated in FIG. 17 as well as sphericity (i.e. expected
conformation to a sphere).
[0109] At block 310, additional data, such as confocal slices
and/or triangulation data, is acquired for selected regions of
interest of the object as also illustrated in FIG. 17.
[0110] It is instructive to compare and contrast conventional
confocal microscopy with the preferred method utilized herein.
Conventional methods use a narrow slit or pinhole, low f/# (high
numerical aperture) optics, and small increments for z axis
positioning of the object or sensor. Although these principles can
be advantageous in carrying out the invention described herein, the
requirements for measurement of many microscopic objects can be met
with fewer slices at coarse increments. For example, when the
system is utilized to measure the depth of reflective objects
including solder balls, wafers, traces, conductive epoxy and
copper, measured intensity changes continuously with depth, but the
optical medium is homogeneous (i.e., air).
[0111] The data processing algorithms of the present invention may
be implemented in special purpose hardware or in software within
the processor 121 and can be applied to either "featureless"
surfaces (i.e., a mirror) or rough objects. The slices may be
acquired by translating the part or imaging head (conventional) or,
alternatively, a plurality of detectors could be used each with a
diaphragm (slit or pinhole) as shown in the above-noted USSR patent
document and U.S. Pat. No. 5,448,359.
[0112] Experimental confocal data and simulations indicate that the
variation in sensitivity (change in intensity per unit change in
depth) is strongly dependent upon the object structure and
reflectance characteristics. Profiles of curved specular objects
having different radii, plane mirrors, diffuse opaque surfaces, and
translucent objects show significant variation. The peak intensity,
half width, and asymmetry are variable (see FIG. 18). The curved
specular surfaces have focusing power dependent upon the curvature,
and produce measurable changes in intensity for relatively small
lateral displacements of the spot position on the surface.
[0113] The beam propagation characteristics, directional
sensitivity, and increased intensity noise produce adverse
conditions for measurement. This is in contrast to imaging a
diffuse reflector which is "well behaved". The typical assumption
of a least squares quadratic fit as taught in the prior art may
often be oversimplified, and inadequate for a description of all
types of signatures (profiles representing intensity changes with
depth). As a result, generalized curve fitting or prediction
methods may include "weights" or other adjustments based upon
information about the surface.
[0114] Curve fitting and peak estimation methods based upon prior
information are preferred to estimate the peak location for
improved noise immunity. A preferred method of data processing
utilizes non-linear and linear filtering for spike removal and
smoothing, respectively. This approach, known from the art of image
processing, tends to maximize the fidelity of the profile without
excessive smoothing. Such a linear filtering algorithm may be
implemented with a linear convolution kernel, but preferably will
be an adaptive smoothing method. Such algorithms are now
commonplace in data processing packages like MathCad 6.0.
[0115] Yet another alternative for data acquisition is to use a
combination of a predetermined range of translation with a known
spacing of a plurality of sensors. The number of detectors and
their spacing along the optical axis can be traded off with
mechanical height adjustment for a specific measurement speed
requirement. For example, a piezoelectric actuator could be used to
provide rapid translation over a narrow axial range, or the
relationship of optical elements in the transmitter system,
including the slit(s) or pinhole(s) changed so as to vary the
effective optical path length.
[0116] Those versed in the art of confocal imaging will recognize
that tradeoffs between measurement speed, optical power, accuracy,
cost, and sensor compactness can be analyzed to select an
appropriate balance between a plurality of detectors and axial
motion with position feedback. Because objects to be imaged with
this invention typically produce wide dynamic range requirements,
the preference is to maintain high optical efficiency with losses,
which result from beam-splitting, minimized. For example, the peak
of a solder ball can then be isolated and measured as previously
described.
[0117] The method and system of the present invention preferably
includes a confocal arrangement, but does not exclude the addition
of an additional detector in the optically collinear path, which
receives collinear light to produce an intensity image without an
associated spatial filter. This second detector, which is not
spatially filtered, may be used for gray scale measurements and for
comparison of the relative intensity of attenuated light with the
maximum return from the object 120. This information could be
useful for gray scale based measurements, guiding the search
process or normalizing the confocal image relative to an intensity
maximum if curve fitting is done. This coaxial energy could be
collected in any number of ways.
[0118] In another mode of operation, absolute height measurements
of one of the solder balls 200 of FIG. 11, relative to the bare or
patterned die 202 of the wafer 204 can be done using focusing
methods taught in the art. When properly fixtured, the dies 202 do
not exhibit much warpage. Measuring the die 202 at a few locations
(i.e. as indicated by the "X"s in the four corner locations of FIG.
11) using planar surface prediction should be adequate. The four
corner locations can be measured using such local fiducials if
available, or the bare wafer surface can be measured using the
confocal channel. Once again, the imaging head may be positioned
along the Z axis to find the general location, and the integrated
optical system translated rapidly.
[0119] If the scanner 112 includes an acousto-optic deflector or
other solid state deflector, for example, an acquisition speed for
a region can be minimized by limiting the scan FOV and, for
instance, restricting the scan to the X axis only (no Y axis motion
for focus measurements mode), quickly moving the Z axis, and
recording the intensity. Alternatively, a "ramp" can be generated
if the wafer 202 is assumed to be flat over a FOV. In either case,
the Z axis location should be recorded as a function of time for
best measurement capability.
[0120] Fully utilizing the high speed scanner windowing capability
available with a beam deflector (say 64 pixels), and the use of a
plurality of points for fitting the defocus function would improve
reliability while maximizing speed. Speed is the limiting factor
for most measurement systems and the method described here would
minimize impact for measurement of "featureless" surfaces.
[0121] The axial motion may be divided into large range for coarse
location of objects, and high speed narrow range operation for
measurement. In the former case, the imaging head or part is
translated. In the latter case, optical elements or groups may be
translated using any of the methods known in the art provided that
the proper relationships between the scene, objective lens, and
confocal spatial filter are maintained. For example, inspection of
microelectronic assemblies might require about 0.25" for coarse
location, but an active measurement range of only 0.004" for a low
f/# (high numerical aperture) transmitter beam, for instance in the
range of f/2 to f/6. The latter motion could be induced with, for
example, a piezoelectric translation stage or similar actuator.
Fast motion could mandate an increase in the required deflection
speed of the scanner 112, leading to an overall advancement for
confocal imaging in general. If a deflector with nanosecond
response time is available, then the speed will be limited by the
axial motion mechanism.
[0122] Similarly, of great advantage would be a subsystem to
translate the focus position along the optical axis which does not
utilize moving parts, or at least only requires miniature, high
speed dynamic assemblies. Acousto-optic deflectors, for instance,
can change their effective focal length in the scan direction by
applying a non-linear, variable frequency waveform. This
electrical/acoustical effect is known as the cylindrical lens
effect. The device also introduces deflection which, for instance,
could be compensated with a high speed, small amplitude deflector,
perhaps a micro-mirror. Future advancements in the micro-mechanical
technology and integrated optics may lead to development of high
speed focus translation methodologies.
[0123] Many additional modes of operation can be derived and will
be understood by those skilled in the art. For instance, it may
sometimes be desirable for the N.A. of the triangulation subsystem
be relatively low, providing for good edge contrast over a large
depth of field. On the other hand, the highest confocal resolution
may be desired. The issue can be addressed by using time, spatial,
or wavelength multiplexing and a pair of collinear beams of
different wavelength or diameter (f/h). As illustrated in FIG. 8,
such a pair of beams introduces dual lateral resolution operation
for both confocal and triangulation subsystems.
[0124] As illustrated in FIG. 8, a confocal subsystem of an
integrated triangulation confocal system is generally indicated at
210. The system 210 includes control logic 212 which controls, by
multiplexing, a pair of laser sources 214 and 216. Expanders 218
and 220 expand the laser beams emitted by the laser sources 214 and
216, respectively. A mirror 222 reflects the expanded beams from
the expander 218 to obtain a central ray which is combined at beam
combiner 224 with the expanded beam from the expander 220.
[0125] The system 210 also includes a beam deflector 226 which
deflects the combined low N.A. beam and the high N.A. beam to a
beam splitter 228, a lens 230 and to an object 230. The resulting
beams reflected from the object 230 then are passed through the
lens 230, reflected by the beam splitter 228, spatially filtered by
a single or multiple slit 234, focused by a lens 236 and detected
by a detector 238. Alternatively, the laser sources 214 and 216
could have different wavelengths.
[0126] In yet another embodiment of the present invention, multiple
slits with varying dimension could be used to provide variable
sensitivity and depth of field. This option requires additional
optical elements (including detectors) and can be readily
implemented by those skilled in the art.
[0127] If a solid state deflector is used, either acousto-optics or
electro-optics diffraction gratings, with wavelength multiplexing,
then additional optics will be needed to expand the scan width
according to the wavelength ratio. With wavelength multiplexing,
spectral filters can be used to provide discrimination and
eliminate crosstalk.
[0128] Time multiplexing would preferably be implemented with two
lasers which are pulsed in sequence. Then, either the confocal or
triangulation channels or both are read. The advantage is dual
lateral resolution operation for both the confocal and
triangulation modes.
[0129] Those skilled in the art will recognize the versatility of
the invention, and extensions and operational principles which are
within the spirit of the invention. The feature of multiple beams
or slits in a multiplexed system, either beam being available for
use in the triangulation and confocal channels, provides a choice
of expanded or narrow depth of field, which can be advantageous for
measurement of objects with an extended depth range. For example,
the high N.A. channel may be used to locate defects in thin
conductive, dielectric layers, or provide contrast improvement for
surface inspection, while the wider range is useful for examining
interconnects.
[0130] This foregoing description shows illustrative embodiments
and principle of operation but should not be regarded as
restrictive. The versatility of measurement methods and systems is
a direct benefit of the invention which is limited only by the
following claims.
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