U.S. patent application number 09/910393 was filed with the patent office on 2002-08-01 for embossed carrier tape molding and sealing apparatus.
Invention is credited to Nakamura, Yoshio, Umeda, Haruo, Xiao, Li.
Application Number | 20020100257 09/910393 |
Document ID | / |
Family ID | 18720128 |
Filed Date | 2002-08-01 |
United States Patent
Application |
20020100257 |
Kind Code |
A1 |
Nakamura, Yoshio ; et
al. |
August 1, 2002 |
Embossed carrier tape molding and sealing apparatus
Abstract
The invention provides an embossed carrier tape molding and
sealing apparatus which is devised so that the molding of the
embossed carrier tape and the sealing of electronic parts can be
efficiently performed. An embossed carrier tape molding and sealing
apparatus is constructed by installing, on a continuous conveying
path for a thermoplastic resin tape 10, [i] a molding part heating
means 110 which heats and softens the molding parts, [ii] a molding
means 130 which positions the above-mentioned heated parts in a
mold 132, and subjects these parts to embossing-molding, [iii] a
hole working means 150 which forms guide holes at specified
intervals in the side portions of the above-mentioned thermoplastic
resin tape 10, [iv] a product insertion stage 210 which places
products 20 in the recesses 12 formed by the aforementioned
embossing-molding, [v] a covering tape supply means 230 which
supplies a covering tape 30 to the upper surface of the recesses 12
formed by the above-mentioned embossing-molding of the
above-mentioned thermoplastic resin tape 10, and [vi] a tape
thermal-bonding means 250 which thermally bonds the above-mentioned
covering tape 30 to the above-mentioned thermoplastic resin tape 10
at the peripheral edges of the above-mentioned recesses 12.
Inventors: |
Nakamura, Yoshio; (Yokohama,
JP) ; Umeda, Haruo; (Chiba, JP) ; Xiao,
Li; (Tokyo, JP) |
Correspondence
Address: |
Tyco Technology Resources
Suite 450
4550 New Linden Hill Road
Wilmington
DE
19808
US
|
Family ID: |
18720128 |
Appl. No.: |
09/910393 |
Filed: |
July 20, 2001 |
Current U.S.
Class: |
53/559 |
Current CPC
Class: |
B65B 9/045 20130101;
H05K 13/021 20130101; H05K 13/0084 20130101 |
Class at
Publication: |
53/559 |
International
Class: |
B65B 047/02 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 27, 2000 |
JP |
2000-226524 |
Claims
I/We claim:
1. An embossed carrier tape molding and sealing apparatus
comprising: a continuous conveying path for a thermoplastic resin
tape having, a molding part heating means which heats and softens
molding parts, a molding means which positions the heated molding
parts in a mold and subjects these parts to embossing-molding to
form recesses therein, a hole working means which forms guide holes
at specified intervals in side portions of the thermoplastic resin
tape, a product insertion stage which places products in the
recesses formed by the embossing-molding, a covering tape supply
means which supplies a covering tape to an upper surface of the
recesses formed by the embossing-molding, and a tape
thermal-bonding means which thermally bonds the covering tape to
the thermoplastic resin tape at edges of the recesses.
2. The embossed carrier tape molding and sealing apparatus as
recited in claim 1 wherein the molding means has a mold which has
an outer frame block that has a receiving part that is C-shaped, an
inner frame block that is assembled with the outer frame block, and
an insert which is sandwiched between the outer frame block and
inner frame block.
3. The embossed carrier tape molding and sealing apparatus as
recited in claim 2 wherein a pressurized gas delivery means is
provided which presses the heated and softened molding parts of the
thermoplastic resin tape into the mold.
4. The embossed carrier tape molding and sealing apparatus as
recited in claim 1 wherein the conveying path is equipped with
guide rails which are disposed on both sides so that guide grooves
that match the width of the thermoplastic resin tape are formed,
and rotating teeth which engage with the guide holes formed by the
hole working means, whereby the spacing of the guide rails and the
rotating teeth is made variable.
5. The embossed carrier tape molding and sealing apparatus as
recited in claim 4 wherein the above-mentioned hole working means
has a plurality of punches that are lined up at specified intervals
along the sides of the thermoplastic resin tape and pilot pins
which are inserted into already-formed guide holes so that the
pilot pins position the thermoplastic resin tape when hole working
is performed by the punches.
6. The embossed carrier tape molding and sealing apparatus as
recited in claim 4 wherein a tension roller is provided which is
pressed against the rotating teeth, and which clamps the
thermoplastic resin tape between the roller and the rotating
teeth.
7. The embossed carrier tape molding and sealing apparatus as
recited in claim 6 wherein a means is provided which releases the
pressing contact of the tension roller during the hole working
performed by the punches and pilot pins.
Description
BACKGROUND OF THE INVENTION
[0001] The invention relates to a molding and sealing apparatus
which forms an embossed carrier tape, places and seals electronic
parts, such as connectors, therein and places the tape on a reel to
supply the electronic parts to automated assembly machines,
etc.
DESCRIPTION OF THE PRIOR ART
[0002] Embossed carrier tapes have periodically spaced recesses
that accommodate electronic parts, such as connectors, at specified
intervals along the direction of length of a tape. The tapes also
have guide holes formed in the edge portion of the tape on one or
both sides used to convey the tape as needed. In the case of such
embossed carrier tapes, electronic parts are placed in a sealed
state by inserting the electronic parts into the above-mentioned
recesses, covering the top ends of the recesses with a covering
tape and heat-sealing the covering tape. The tape in which such
electronic parts have thus been sealed is taken up on a reel, and
used to supply the electronic parts to an automated assembly
machine, etc.
[0003] Conventionally, in the molding of such embossed carrier
tapes and the sealing of the electronic parts, a molding apparatus
which manufactures the embossed carrier tape by the
embossing-molding of a thermoplastic resin tape, and a separate
thermal bonding apparatus which inserts electronic parts into the
manufactured embossed carrier tape and thermally bonds a covering
tape, are respectively used. These respective operations are
performed separately.
[0004] However, in the art described above, after the embossed
carrier tape has been molded, it is necessary to take the tape up
on a reel, transport the reel to another location, dereel the tape,
insert electronic parts into the embossed carrier tape, thermally
bond the covering tape, and then again take the embossed carrier
tape up on a reel. Accordingly, a considerable amount of machinery
installation space, operating space and labour is required.
Accordingly, it would be beneficial to provide an embossed carrier
tape molding and sealing apparatus in which the molding of the
embossed carrier tape and the sealing of electronic parts can be
efficiently performed.
SUMMARY OF THE INVENTION
[0005] In order to achieve the above-mentioned object, the present
invention provides an embossed carrier tape molding and sealing
apparatus which has, on a continuous conveying path for a
thermoplastic resin tape, [i] a molding part heating means which
heats and softens the molding parts, [ii] a molding means which
positions the above-mentioned heated parts in a mold and subjects
these parts to embossing-molding, [iii] a hole working means which
forms guide holes at specified intervals in the side portions of
the above-mentioned thermoplastic resin tape, [iv] a product
insertion stage which places products in the recesses formed by the
aforementioned embossing-molding, [v] a covering tape supply means
which supplies a covering tape to the upper surface of the recesses
formed by the above-mentioned embossing-molding of the
above-mentioned thermoplastic resin tape, and [vi] a tape
thermal-bonding means which thermally bonds the above-mentioned
covering tape to the above-mentioned thermoplastic resin tape at
the peripheral edges of the above-mentioned recesses.
[0006] In the present invention, when the thermoplastic resin tape
is moved along the continuous conveying path, the molding parts are
first heated and softened by the molding part heating means. Next,
the heated and softened parts are pressed into the mold by the
molding means, so that embossing-molding is performed. Furthermore,
guide holes are formed by the hole working means at specified
intervals in the side parts of the thermoplastic resin tape. Next,
products are inserted into the embossing-molded recesses by the
product insertion stage and a covering tape is supplied to the
upper surfaces of the recesses by the covering tape supply means.
The covering tape is thermally bonded to the thermoplastic resin
tape by the tape thermal-bonding means, so that the products
inserted into the recesses are sealed inside the recesses. The
embossed carrier tape containing products thus obtained can then be
appropriately taken up on a reel., etc.
[0007] In one embodiment of the present invention, the
above-mentioned molding means is constructed from [a] a mold which
has [i] an outer frame block that has a receiving part that is
C-shaped, [ii] an inner frame block that is assembled with the
outer frame block, and [iii] an insert which is sandwiched between
the outer frame block and inner frame block, and [b] a pressurized
gas delivery means which presses the above-mentioned heated and
softened portions of the above-mentioned thermoplastic resin tape
into the above-mentioned mold. As the mold is constructed from an
outer frame block, an inner frame block and an insert, working or
forming the material is easily accomplished even in the case of
complicated shapes. Furthermore, various shapes can be handled
merely by replacing parts.
[0008] In another embodiment of the present invention, the
conveying path is equipped with guide rails which are disposed on
both sides so that guide grooves that match the width of the
above-mentioned thermoplastic resin tape are formed. Rotating teeth
which engage with the guide holes formed by the hole working means,
and the spacing of the guide rails is made variable. This allows
thermoplastic resin tapes of various widths to be accommodated
merely by altering the spacing of the guide rails and rotating
teeth.
[0009] In another embodiment of the present invention, the hole
working means has a plurality of punches that are lined up at
specified intervals along the sides of the above-mentioned
thermoplastic resin tape, and pilot pins which are inserted into
already-formed guide holes whereby the pilot pins position the
above-mentioned thermoplastic resin tape when hole working is
performed by the above-mentioned punches. A tension roller is
provided which is pressed against the rotating teeth and which
clamps the thermoplastic resin tape between the roller and the
rotating teeth. A means is also provided which releases the
pressing contact of the tension roller during the hole working
performed by the punches and pilot pins. The pressing contact of
the aforementioned tension roller can be released during hole
working by means of the punches and pilot pins. In this state, the
pilot pins can be inserted into guide holes that have already been
formed, so that the thermoplastic resin tape is positioned and
holes can be formed by means of the punches. Specifically, as a
result of the release of the pressing contact of the
above-mentioned tension roller, movement of the thermoplastic resin
tape becomes possible. Positional deviation can be corrected by
inserting the pilot pins into guide holes that have already been
formed, so that the formation of holes by means of the punches can
be performed in accurate positions.
[0010] In the present invention, the embossing-molding of the
thermoplastic resin tape and the sealing of products such as
electronic parts, etc., can be performed continuously, while the
thermoplastic resin tape is caused to move along a continuous
conveying path. As a result, the installation space and working
space required for the apparatus can be reduced, the working
efficiency can be increased, and power can be saved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a schematic structural diagram which illustrates a
first embodiment of the embossed carrier tape molding and sealing
apparatus of the present invention.
[0012] FIG. 2 is an overall front view of the same apparatus.
[0013] FIG. 3 is a partial enlarged front view which shows the
molding apparatus of the same apparatus.
[0014] FIG. 4 is a left-side view of the same molding
apparatus.
[0015] FIG. 5 shows partial enlarged sectional views which
illustrate the molding part heating means and molding means of the
same molding apparatus.
[0016] FIG. 6 is an exploded perspective view which shows one
example of the mold used in the same molding apparatus.
[0017] FIG. 7 is an exploded perspective view which shows another
example of the mold used in the same molding apparatus.
[0018] FIG. 8 is a sectional view which illustrates the operation
of the hole working means in the same molding apparatus.
[0019] FIG. 9 is a sectional view which illustrates the method used
to alter the tape guide in the same molding apparatus.
[0020] FIG. 10 is a process diagram of the embossed carrier tape
molding and sealing apparatus of the present invention.
[0021] FIG. 11 is a partial enlarged explanatory diagram which
illustrates the relationship between the pilot pins and the punches
in the above-mentioned molding apparatus.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0022] As is shown in FIGS. 1 and 2, the embossed carrier tape
molding and sealing apparatus of the present invention has a
continuous conveying path for a thermoplastic resin tape 10 which
is pulled out from a first reel 101. A molding apparatus 100
consisting of a molding part heating means 110, a molding means 130
and a hole working means 150, and a sealing apparatus 200
consisting of a product insertion stage 210, a covering tape supply
means 230 and a tape thermal-bonding means 250, are positioned
along this conveying path.
[0023] Referring to both FIGS. 3 and 4, the molding apparatus 100
has a conveying path 102 for the thermoplastic resin tape 10. The
molding part heating means 110 has heaters 111 and 112 which are
disposed above and below the conveying path 102. The respective
heaters 111 and 112 are caused to perform an opening-and-closing
action by a first air cylinder 113 and a second air cylinder 114 so
that these heaters 111 and 112 clamp the thermoplastic resin tape
10.
[0024] As is shown in FIGS. 5(a) and 5(b), the heaters 111 and 112
are formed in blocks 115 and 116, and these respective blocks 115
and 116 contain heat-radiating bodies 117 and 118. Furthermore,
thermoplastic resin tape 10 is clamped by leading edge parts 119
and 120 which have a rectangular shape as seen in a plan view, so
that a rectangular region is heated and softened.
[0025] The molding means 130 is constructed from a pressurized gas
delivery means 131 which is disposed above, and a mold 132 which is
disposed below, so that the conveying path 102 of the thermoplastic
resin tape 10 is clamped between these parts. The pressurized gas
delivery means 131 consists of a compressed air supply pipe 133 and
a pressure-applying nozzle 134 to which this supply pipe 133 is
connected. The pressure-applying nozzle 134 has a rectangular
opening part 135. Furthermore, the pressure-applying nozzle 134 is
supported via a screw 137 on a bracket 136 that is connected to the
frame, so that the height of the pressure-applying nozzle 134 can
be adjusted.
[0026] The mold 132 has a mold main body 143 which is held in a
block 139 that can be raised and lowered by means of a third air
cylinder 138. Referring also FIG. 6, the mold main body 143 is
constructed from an outer frame block 140 which has a receiving
part that is C-shaped as seen in a plan view, an inner frame block
141 which is assembled with the outer frame block 140, and an
insert 142 which is clamped between the outer frame block 140 and
inner frame block 141. In this example, a rectangular frame is
formed by the outer frame block 140 and the inner frame block 141.
The upper surface of the insert 142 is disposed in the bottom part
of the rectangular frame, and a cut-out part 144 is formed in the
upper surface of the insert 142.
[0027] Accordingly, when the rectangular region that has been
heated and softened by the molding part heating means 110 is
disposed above the mold 132, the mold 132 is raised by the third
air cylinder 138, so that the mold 132 contacts the undersurface of
the thermoplastic resin tape 10. Meanwhile, the pressure-applying
nozzle 134 is disposed on the upper surface of the thermoplastic
resin tape 10 facing the mold 132. In this state, compressed air is
fed in from the pressure-applying nozzle 134, so that the heated
and softened rectangular region of the thermoplastic resin tape 10
is pressed into the recess of the mold 132, thus causing
embossing-molding to be performed. The recess 12 thus formed
constitutes an accommodating part for electronic parts, etc.,
(described later). Furthermore, in a case where the mold main body
143 shown in FIG. 6 is used, a small recess 13 which is further
recessed in the bottom surface of the recess 12 is formed by the
cut-out part 144 formed in the upper surface of the insert 142.
[0028] Another example of the mold main body is shown in FIG. 7. As
in the above-mentioned example, this mold main body 143a is
constructed from an outer frame block 140a which has a receiving
part that is C-shaped as seen in a plan view, an inner frame block
141a which is assembled with this outer frame block 140a, and an
insert 142a which is clamped between the outer frame block 140a and
inner frame block 141a. A rectangular frame is formed by the outer
frame block 140a and inner frame block 141a. The upper surface of
the insert 142a is disposed in the bottom part of the rectangular
frame, and a projection 145 is formed on the upper surface of the
insert 142a. In a case where this mold main body 143a is used, a
small projection 14 is formed on the bottom surface of the recess
12 of the thermoplastic resin tape 10 by the projection 145 of the
insert 142a.
[0029] As is shown in FIG. 8, a plurality of parallel grooves 104
are formed in a table 103 at specified intervals in the direction
of width. The pair of guide rails 105 that guide the thermoplastic
resin tape 10 are constructed from respective receiving members
106, pressing members 107 and bolts 108 that connect these members.
Furthermore, protruding strips 107a that are inserted into the
above-mentioned grooves 104 are formed on the lower ends of the
pressing members 107, so that the guide rails 105 are positioned by
these protruding strips 107a. Guide grooves 109 through which both
side edges of the thermoplastic resin tape 10 are passed are formed
between the receiving members 106 and the pressing members 107. The
thermoplastic resin tape 10 is conveyed with both side edges being
passed through the above-mentioned guide grooves 109.
[0030] As is shown in FIGS. 2 and 3, the hole working means 150 has
a block 152 which is raised and lowered by a fourth air cylinder
151. A plurality of punches 153 are installed on this block 152 in
two rows that are separated by a specified spacing, with these
punches 153 extending downward at specified intervals along the
conveying direction. The tip ends of the punches 153 are directed
so that they overlap the portions of the guide rails 105 in which
the above-mentioned guide grooves 109 are formed, and through-holes
154 are formed in these portions.
[0031] When the block 152 is lowered by the fourth air cylinder
151, as shown in FIGS. 8(a) and 8(b), the punches 153 supported on
the block 152 are lowered, and these punches 153 are inserted into
the through-holes 154 of the guide rails 105, so that guide holes
11 with a fixed spacing are formed in both side edges of the
thermoplastic resin tape 10 passing through the guide grooves 109
of the guide rails 105. Furthermore, it would also be possible to
form these guide holes 11 in only one side edge of the tape 10.
[0032] As is shown in FIG. 11, pilot pins 158 are disposed adjacent
to the punches 153 that are positioned at the leading end in the
direction of advance of the thermoplastic resin tape 10. The pilot
pins 158 protrude further downward than the punches 153. When the
block 152 is lowered, the pilot pins 158 are inserted into guide
holes that have already been formed in the thermoplastic resin tape
10 before further holes are opened by the above-mentioned punches
153, so that the thermoplastic resin tape 10 is positioned. As a
result, the spacing of the guide holes 11 can be accurately
set.
[0033] As is shown in FIGS. 9(a) and 9(b), changes in the width of
the thermoplastic resin tape 10 can be handled merely by altering
the spacing of the guide rails 105. Specifically, the spacing of
the pair of guide rails 105 can be altered by changing the grooves
104 into which the projecting strips 107 on the lower ends of the
pressing members 107 are inserted. As a result, the spacing of the
guide grooves 109 can be altered to match the width of the
thermoplastic resin tape 10. In this case, the spacing of the
punches 153 of the hole working means 150 is also altered to match
the through-holes 154 of the guide rails 105.
[0034] Referring again to FIGS. 1 and 2, the product insertion
stage 210 is located in a position that allows electronic parts 20
such as connectors, etc., to be manually inserted into the recesses
12 of the thermoplastic resin tape 10 one at a time. However, the
insertion of these electronic parts 20 could also be accomplished
by means of a universally known automated supply device.
[0035] The covering tape supply means 230 is constructed from a
second reel 231 on which a covering tape 30 is wound, and a roller
231 which causes the covering tape 30 pulled out from this second
reel 231 to cover the upper surface of the thermoplastic resin tape
10, so that the electronic parts 20 inserted into the recesses 12
are sealed inside these recesses 12.
[0036] A tape thermal-bonding means 250, which has a pair of
heaters 251 (on the left and right) that are raised and lowered by
a driving mechanism not shown in the figures, is disposed beyond
the above-mentioned covering tape supply means 230. Receiving pads
252 (see FIG. 2) are disposed beneath the heater 251 on both sides
of the conveying path. Both side edges of the thermoplastic resin
tape 10 and covering tape 30 are clamped between the heaters 251
and receiving pads 252, so that these tapes are thermally
bonded.
[0037] As is shown in FIGS. 1 and 2, a pair of wheels with rotating
teeth 155 that engage with the guide holes 11 are disposed beneath
the conveying path beyond the tape thermal-bonding means 250. A
tension roller 156 that is pressed against the rotating teeth 155
is disposed above the conveying path. The tension roller 156 is
pivot-supported on the tip end of an arm 159 that is supported by a
supporting shaft 157. The tension roller 156 is constantly pressed
against the rotating teeth 155 by a spring (not shown in the
figures) that drives the arm 159 downward.
[0038] Accordingly, the embossed carrier tape 40 containing
electronic parts sealed therein, is intermittently fed out at a
specified speed as a result of the pair of wheels with rotating
teeth 155 that engage with the guide holes 11.
[0039] An air cylinder 160 is disposed beneath the arm 159, and is
positioned so that the operating rod 161 of this air cylinder 160
contacts the arm 159. When the block 152 of the hole working means
150 is lowered, the air cylinder 160 is actuated so that the rod
161 is extended, thus pushing the arm 159 upward so that the
tension roller 156 is removed from the rotating teeth 155. As a
result, the embossed carrier tape 40 is allowed to move slightly in
the forward-rearward direction within the range of the spacing of
the rotating teeth 155 and the guide holes 11, so that positional
correction by the pilot pins 158 is not hindered. In cases where
the width of the thermoplastic resin tape 10 is changed, it is also
necessary to change the spacing of the rotating teeth 155 so that
the teeth will engage with the guide holes 11 of the thermoplastic
resin tape 10.
[0040] A third reel 270 on which the embossed carrier tape 40 that
has been sealed by the covering tape 30 is taken up is disposed
beyond the rotating teeth 155 and tension roller 156. This third
reel 270 is caused to rotate in accordance with the conveying speed
of the embossed carrier tape 40 by a driving mechanism not shown in
the figures.
[0041] Tapes consisting of thermoplastic resin tape materials such
as polystyrenes, polyesters, polyvinyl chlorides or acrylonitrile,
etc., are used as the thermoplastic resin tape 10 and covering tape
30. Moreover, resin tapes containing carbon may be used as an
anti-static measure.
[0042] Next, the operation of this embossed carrier tape molding
and sealing apparatus will be described with reference also being
made to the flow chart for the same apparatus shown in FIG. 10.
First, the thermoplastic resin tape 10 is pulled out from the first
reel 101, and is passed through the guide grooves 109 of the guide
rails 105. Guide holes 11 are formed beforehand in a portion of the
tape 10 with a specified length located at the tip end of the tape
10 by operating the guide hole working means 150, and the rotating
teeth 155 are engaged with these guide holes 11 formed in the tip
end portions. When the apparatus is operated in this state, the
rotating teeth 155 rotate intermittently, so that the tape 10 is
conveyed. Then, the tape 10 is first clamped between the upper and
lower heaters 111 and 112 of the molding part heating means 110, so
that a rectangular region that is to be subjected to embossing is
heated and softened.
[0043] Next, when the above-mentioned heated and softened region
moves into the molding means 130, the mold 132 rises and contacts
the undersurface of the tape, and compressed air is fed in the
direction of the mold 132 from the pressure-applying nozzle 134 of
the pressurized gas delivery means 131. As a result, the heated and
softened region of the tape 10 is pushed into the interior of the
mold 132, so that a recess 12 is formed.
[0044] The tape 10 thus subjected to embossing-molding is then fed
into the guide hole working means 150. The punches 153 are lowered
as a unit with the block 152 by the fourth air cylinder 151, and
these punches 153 are inserted into the through-holes 154 of the
guide rails 105, so that guide holes 11 with a fixed spacing are
formed in both side edges of the thermoplastic resin tape 10
passing through the guide grooves 109. Prior to this hole opening
work, the pilot pins 158 are inserted into guide holes 11 that have
already been formed, so that the thermoplastic resin tape 10 is
positioned. These guide holes 11 engage with the rotating teeth 155
that are disposed beyond the tape thermal-bonding means 250, and
provide a driving force that pulls out the tape 10.
[0045] The tape 10 that has thus been embossing-molded is fed "as
is" into the sealing apparatus 200. In the sealing apparatus 200,
electronic parts 20 are first inserted one at a time into the
recesses 12 in the product insertion stage 210. Next, the
above-mentioned recesses 12 are covered from above with the
covering tape 30 by the covering tape supply device 230. As a
result, the electronic parts 20 are disposed inside the recesses
12, and the upper surfaces of these electronic parts are covered by
the covering tape 30.
[0046] Then, in the tape thermal-bonding means 250, the heaters 251
are pressed against both side edges of the thermoplastic resin tape
10 and covering tape 30, so that both side edges of the
thermoplastic resin tape 10 and covering tape 30 are thermally
bonded to each other. As a result, the electronic parts 20 are
disposed inside the recesses 12 of the tape 10, and sealed by the
covering tape 30. The embossed carrier tape 40 containing
electronic parts 20 that has thus been manufactured is taken up on
the third reel 270.
[0047] Accordingly, in the present apparatus, the molding of the
thermoplastic resin tape 10 and the sealing of the electronic parts
20 can be performed continuously, so that the working efficiency is
extremely good. Furthermore, compared to a case in which the
above-mentioned operations are performed separately, the overall
apparatus is compact, so that the amount of installation space and
working space required for the apparatus can be reduced.
* * * * *