U.S. patent application number 10/050697 was filed with the patent office on 2002-06-20 for use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization.
This patent application is currently assigned to CHARTERED SEMICONDUCTOR MANUFACTURING LTD.. Invention is credited to Chooi, Simon, Han, Licheng M., Xie, Joseph Zhiefeng, Xu, Yi, Zhou, Mei Sheng.
Application Number | 20020076918 10/050697 |
Document ID | / |
Family ID | 24481655 |
Filed Date | 2002-06-20 |
United States Patent
Application |
20020076918 |
Kind Code |
A1 |
Han, Licheng M. ; et
al. |
June 20, 2002 |
Use of boron carbide as an etch-stop and barrier layer for copper
dual damascene metallization
Abstract
A method of forming a boron carbide layer for use as a barrier
and an etch-stop layer in a copper dual damascene structure, and
the structure itself are disclosed. In addition to providing a good
barrier to copper diffusion, good insulating properties, high etch
selectivity with respect to dielectric insulators, boron carbide
also provides good electrical characteristics because of its low
dielectric constant of less than 5. The amorphous boron carbide is
formed in a PECVD chamber by introducing a boron source gas such as
B.sub.2H.sub.6, B.sub.5H.sub.9+, and carbon source gas such as
CH.sub.4 and C.sub.2H.sub.6 at a deposition temperature of about
400.degree. C. Any one, or any combination of the passivation,
etch-stop, cap layers of the damascene structure can comprise boron
carbide.
Inventors: |
Han, Licheng M.; (Singapore,
SG) ; Xu, Yi; (Singapore, SG) ; Xie, Joseph
Zhiefeng; (Singapore, SG) ; Zhou, Mei Sheng;
(Singapore, SG) ; Chooi, Simon; (Singapore,
SG) |
Correspondence
Address: |
George O. Saile
20 McIntosh Drive
Poughkeepsie
NY
12603
US
|
Assignee: |
CHARTERED SEMICONDUCTOR
MANUFACTURING LTD.
|
Family ID: |
24481655 |
Appl. No.: |
10/050697 |
Filed: |
January 18, 2002 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
10050697 |
Jan 18, 2002 |
|
|
|
09619377 |
Jul 19, 2000 |
|
|
|
Current U.S.
Class: |
438/634 ;
257/E21.579 |
Current CPC
Class: |
H01L 2924/00 20130101;
H01L 2924/0002 20130101; H01L 23/53295 20130101; H01L 2924/0002
20130101; H01L 21/76829 20130101; H01L 21/76834 20130101; H01L
21/76807 20130101; H01L 23/53238 20130101 |
Class at
Publication: |
438/634 |
International
Class: |
H01L 021/4763 |
Claims
What is claimed is:
1. A method of forming boron carbide as an etch-stop and barrier
layer for copper dual damascene metallization comprising the steps
of: providing a semiconductor substrate having a first conductive
layer; forming a boron carbide (BC) passivation layer over said
conductive layer; forming a first dielectric layer over said BC
passivation layer; forming a BC etch-stop layer over said first
dielectric layer; forming a second dielectric layer over said BC
etch-stop layer; forming a BC cap layer over said second dielectric
layer; forming a first photoresist layer over said cap layer and
patterning said photoresist layer with a mask comprising a via hole
pattern; etching through said via pattern in said first photoresist
layer to form said via hole in said BC cap layer and said second
dielectric layer until said BC etch-stop layer is reached; etching
through said via hole pattern to form said via hole in said BC
etch-stop layer; etching further said via hole pattern into said
first dielectric layer until BC passivation layer is reached;
removing said first photoresist layer; forming a second photoresist
layer over said BC cap layer including said via hole in said second
dielectric layer; patterning said second photoresist layer with a
mask comprising a line trench pattern; etching through said line
trench pattern in said second photoresist layer into said BC cap
layer and said second dielectric layer and into said BC etch-stop
layer; etching further through said hole pattern in said BC
etch-stop layer and extending said hole pattern into said BC
passivation layer thus forming a dual damascene structure
comprising a composite hole and line trench pattern in said
substrate; removing said second photoresist layer; forming a
barrier lining on the inside walls of said dual damascene
structure; forming metal over said barrier lining in said dual
damascene structure; and forming a combination barrier and
passivation layer over said substrate including over said dual
damascene structure.
2. The method of claim 1, wherein said BC etch-stop layer, said BC
passivation layer, said BC cap layer, said combination barrier and
passivation layer are formed in a CVD chamber by introducing boron
source gas and carbon source gas at a deposition temperature
between about 100 to 450.degree. C.
3. The method of claim 2, wherein said boron source gas comprises
B.sub.2H.sub.6, B.sub.5H.sub.9 and carbon source gas comprises
CH.sub.4, C.sub.2H.sub.6.
4. The method of claim 1, wherein said BC passivation layer,
wherein said BC etch-stop layer, said BC cap layer, or said
combination barrier and passivation layer are formed using physical
vapor deposition (PVD) with a graphite target and boron source
gas.
5. The method of claim 1, wherein said boron source gas comprises
B.sub.2H.sub.6 and B.sub.5H.sub.9.
6. The method of claim 1, wherein said first dielectric layer
comprises undoped silicon dioxide, doped silicon dioxide, organic
polymers and porous combination thereof.
7. The method of claim 1, wherein said first dielectric layer has a
thickness between about 2000 to 10000 .ANG..
8. The method of claim 1, wherein said BC etch-stop layer has a
thickness between about 50 to 5000 .ANG..
9. The method of claim 1, wherein said cap layer has a thickness
between about 50 to 5000 .ANG..
10. The method of claim 1, wherein said second dielectric layer has
a thickness between about 2000 to 10000 .ANG..
11. The method of claim 1, wherein said combination barrier and
passivation layer has a thickness between about 50 to 5000
.ANG..
12. The method of claim 1, wherein said etching to form said via
hole in said second dielectric layer is accomplished using
plasma-assisted dry etching wherein etching chemistry comprises one
or more gas from a group containing fluorocarbon(s),
fluorine-substituted hydrocarbon(s), fluorosulfur, hydrocarbon(s),
fluorine, chlorine, chlorine-substituted hydrocarbon(s), nitrogen,
hydrogen, forming gas, argon, carbon monoxide and oxygen.
13. The method of claim 1, wherein said etching to form said via
hole in said BC etch-stop layer is accomplished using
plasma-assisted dry etching wherein etching chemistry comprises one
or more gases from a group containing nitrogen, hydrogen, forming
gas, fluorine, chlorine, oxygen and argon.
14. The method of claim 1, wherein said etching further said via
hole pattern into said first dielectric layer is accomplished using
plasma-assisted dry etching wherein etching chemistry comprises one
or more gas from a group containing fluorocarbon(s),
fluorine-substituted hydrocarbon(s), fluorosulfur, hydrocarbon(s),
fluorine, chlorine, chlorine-substituted hydrocarbon(s), nitrogen,
hydrogen, forming gas, argon, carbon monoxide and oxygen.
15. The method of claim 1, wherein said etching said line trench
pattern into said second dielectric layer and into said second BC
etch-stop layer is accomplished using plasma-assisted dry etching
wherein etching chemistry comprises one or more gas from a group
containing fluorocarbon(s), fluorine-substituted hydrocarbon(s),
fluorosulfur, hydrocarbon(s), fluorine, chlorine,
chlorine-substituted hydrocarbon(s), nitrogen, hydrogen, forming
gas, argon, carbon monoxide and oxygen.
16. The method of claim 1, wherein said etching further through
said hole pattern in said first dielectric layer into said BC
passivation layer is accomplished using plasma-assisted dry etching
wherein etching chemistry comprises one or more gases from a group
containing nitrogen, hydrogen, forming gas, fluorine, chlorine,
oxygen and argon.
17. The method of claim 1, wherein said barrier lining comprises
tantalum nitride or tantalum.
18. The method of claim 1 wherein said barrier lining has a
thickness between about 50 to 2000 .ANG..
19. The method of claim 1, wherein said metal is copper having a
thickness between about 4000 to 10000 .ANG..
20. The method of claim 1, wherein said combination barrier and
etch-stop layer comprises boron carbide formed in a CVD chamber by
introducing boron source gas and carbon source gas at a deposition
temperature between about 100 to 450.degree. C.
21. A dual damascene structure with boron carbide etch-stop and
barrier layers comprising: providing a semiconductor substrate
having a substructure comprising devices formed in said substrate
and a conductive layer formed thereon; a boron carbide (BC)
passivation layer over said conductive layer; a first dielectric
layer over said first BC passivation layer; a BC etch-stop layer
over said first dielectric layer; a second dielectric layer over
said BC etch-stop layer; a BC cap layer over said second dielectric
layer; a dual damascene structure having a top portion and inside
walls formed within first and second dielectric layers; said dual
damascene structure having a barrier layer lining said inside
walls; and said dual damascene structure having a combination
barrier and etch stop layer over said top portion.
22. The dual damascene structure of claim 21, wherein said BC
passivation layer, said BC cap layer, said BC etch-stop layer are
formed in a CVD chamber by introducing boron source gas and carbon
source gas at a deposition temperature between about 100 to
450.degree. C.
23. The dual damascene structure of claim 22, wherein said boron
source gas comprises B.sub.2H.sub.6, B.sub.5H.sub.9 and carbon
source gas comprises CH.sub.4, C.sub.2H.sub.6.
24. The dual damascene structure of claim 22, wherein said BC
passivation layer, said BC etch-stop layer and said BC cap layer
are formed using physical vapor deposition (PVD) with a graphite
target and a boron source gas.
25. The dual damascene structure of claim 21, wherein said BC
passivation layer has a thickness between about 50 to 5000
.ANG..
26. The dual damascene structure of claim 21, wherein said first
dielectric layer comprises undoped silicon dioxide, doped silicon
dioxide, organic polymers and porous combination thereof.
27. The dual damascene structure of claim 21, wherein said first
dielectric layer has a thickness between about 2000 to 10000
.ANG..
28. The dual damascene structure of claim 21, wherein said BC
etch-stop layer has a thickness between about 50 to 5000 .ANG..
29. The dual damascene structure of claim 21, wherein said second
dielectric layer has a thickness between about 2000 to 10000
.ANG..
30. The dual damascene structure of claim 21, wherein said barrier
lining comprises tantalum nitride or tantalum.
31. The dual damascene structure of claim 21, wherein said barrier
lining has a thickness between about 50 to 2000 .ANG..
32. The dual damascene structure of claim 21, wherein said metal is
copper having a thickness between about 4000 to 10000 .ANG..
33. The dual damascene structure of claim 21, wherein said
combination barrier and etch-stop layer comprises boron carbide
formed in a PECVD chamber by introducing boron source gas and
carbon source gas at a deposition temperature between about 100 to
450.degree. C.
34. A damascene structure with boron carbide layers comprising: a
semiconductor substrate having a conductive layer formed thereon; a
passivation layer formed over said conductive layer; a dielectric
layer formed over said passivation layer; an etch-stop layer formed
over said first dielectric layer; a second dielectric layer formed
over said etch-stop layer; a damascene cavity formed within said
first and second dielectric layers, including therethrough
intervening said etch-stop layer; said damascene cavity having a
top edge portion and inside walls; a barrier layer lining said
inside walls; a combination barrier and passivation layers over
said top edge portion; and wherein one or more of said passivation,
etch-stop, cap layer or combination barrier and passivation layer
is formed of boron carbide.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to the manufacture of ultra
large scale integrated (ULSI) circuit chips in general, and in
particular, to the use of and a method of using PECVD boron carbide
as an etch-stop and barrier layer for copper dual damascene
metallization.
[0003] 2. Description of the Related Art
[0004] Copper dual damascene process is a well-known technique for
forming interconnections in semiconductor devices. It is especially
well suited for Ultra Large Scale Integrated (ULSI) circuit
technology where more and more devices are being packed into the
same or smaller areas in a semiconductor substrate. As the feature
sizes get smaller, the smaller geometries result in higher
electrical resistances, which in turn degrade circuit performance.
As will be described more fully later, damascene process provides a
more exact dimensional control over small geometries, while copper,
as the metallization material, provides better electrical
characteristics. It is disclosed in the present invention the use
of, and a method of using, PECVD boron carbide as an etch-stop and
barrier layer in a copper dual damascene structure in order to
improve the performance of integrated circuit (IC) device.
[0005] The term `damascene` is derived from a form of inlaid metal
jewelry first seen in the city of Damascus. In the context of
integrated circuits it implies a patterned layer imbedded on and in
another layer such that the top surfaces of the two layers are
coplanar. Thus, in semiconductor manufacturing, grooves and holes
in appropriate locations in the grooves are formed in an insulating
material by etching, which are then filled with metal. Metal in
grooves form the horizontal metal line interconnects while the
metal in the underlying holes form the vertical connections to the
layers of metal interconnects formed in the previous damascene
structure.
[0006] Thus, in a single damascene semiconductor manufacturing
process, incisions, or grooves, are formed in an insulating layer
and filled with metal to form conductive lines. Dual damascene
takes the process one step further in that, in addition to forming
the grooves of a single damascene, hole openings are also formed at
appropriate places in the groove further into the insulating layer.
The resulting composite structure of grooves and holes are filled
with metal. The process is repeated as many times as required to
form the multi-level interconnections between metal lines and the
holes formed therebetween.
[0007] In one approach for a dual damascene process shown in FIG.
1a, two insulating layers (120) and (130) are formed on a substrate
(100) with an intervening etch-stop layer (125). A desired trench
or groove pattern (150) is first etched into the upper insulating
material (130) using conventional photolithographic methods and
photoresist (140). The etching stops on etch-stop layer (125).
Next, a second photoresist layer (160) is formed over the
substrate, thus filling the groove opening (150), and patterned
with hole opening (170), as shown in FIG. 1b. The hole pattern is
then etched into the lower insulating layer (120) as shown in FIG.
1c and photoresist removed, thus forming the dual damascene
structure shown in FIG. 1f.
[0008] Or, the order in which the groove and the hole are formed
can be reversed. Thus, the upper insulating layer (130) is first
etched, or patterned, with hole (170), as shown in FIG. 1d. The
hole pattern is also formed into etch-stop layer (125). Then, the
upper layer is etched to form groove (150) while at the same time
the etching transfers the hole pattern in the etch-stop layer into
lower insulation layer (120), as shown in FIG. 1e. It will be noted
that the etch-stop layer stops the etching of the groove into the
lower insulation layer. After the completion of the thusly formed
dual damascene structure, both the hole opening and groove opening
are filled with metal (180), and any excess material on the surface
of the substrate is removed by chemical mechanical polishing, as
seen in FIG. 1f.
[0009] The metal that is commonly used as the damascene
interconnect is aluminum because of its refined properties for
etchability, as will be known to those skilled in the art. However,
since copper has better electromigration property and lower
resistivity than aluminum, it is a more preferred material for
wiring than aluminum. By the same token, copper unfortunately
suffers from high diffusivity in common insulating materials such
as silicon oxide and oxygen-containing polymers. For instance,
copper tends to diffuse into polyimide during high temperature
processing of the polyimide. This causes severe corrosion of the
copper and the polyimide due to the copper combining with oxygen in
the polyimide. The corrosion may result in loss of adhesion,
delamination, voids, and ultimately a catastrophic failure of the
component. A copper diffusion barrier is therefore often required.
It is disclosed later in the embodiments of the present invention
that PECVD boron carbide or tantalum nitride is a preferred
diffusion barrier layer.
[0010] It is also disclosed in the present invention that boron
carbide is preferred as an etch-stop layer for its lower dielectric
constant. Conventionally, silicon nitride (SiN) is used as a
etch-stop layer. However, PECVD silicon nitride tends to be
nonstoichiometric, while LPCVD nitride exhibits high tensile
stresses, causing cracks for films greater that about 2000 .ANG..
Silicon nitride also exhibits outgassing which result in voids and,
therefore, reliability problems. Furthermore, etch rates for
silicon nitride are relatively fast so that for relatively low
selectivity of silicon nitride to oxides in general, nitride layers
must be thick. This results in cracks. More importantly, silicon
nitride has a dielectric constant of about 7. It is desirable to
use materials with lower dielectric constants as etch-stop layers,
because they become a composite part of the interconnect, and hence
affect the effective dielectric constant of the total composite
structure, which affects the electrical characteristics of the
device.
[0011] In prior art, a method for forming interconnections for
semiconductor fabrication and semiconductor devices are described.
In U.S. Pat. No. 5,817,572, Chiang, et al., a first patterned
dielectric layer is formed over a semiconductor substrate and has a
first opening filled with conductive material. Another patterned
dielectric layer is formed over the first dielectric layer and has
a second opening over at least a portion of the conductive material
The first patterned dielectric layer serves as an etch-stop in
patterning the other patterned dielectric layer. Also, a dielectric
etch-stop layer is formed over the first patterned dielectric layer
and over the conductive material before the other patterned
dielectric layer has been formed. This dielectric etch-stop layer
serves as an etch-stop in patterning the other patterned dielectric
layer. The second opening exposes a portion of die dielectric
etch-stop layer. The exposed portion of the dielectric etch-stop
layer is removed. The second opening is filled with conductive
material.
[0012] In another U.S. Pat. No. 5,658,834, Dowben describes active
semiconductor devices including heterojunction diodes and thin film
transistors, which are formed by PECVD deposition of a boron
carbide thin film on an N-type substrata. The boron to carbon ratio
of the deposited material is controlled so that the film has a
suitable band gap energy. The stoichiometry of the film can be
selected by varying the partial pressure of precursor gases, such
as nido pentaborane and methane.
[0013] Summerfelt, in U.S. Pat. No. 5,851,896, on the other hand,
shows a conductive exotic-nitride barrier layer for
high-dielectric-constant material electrodes. An embodiment of this
invention comprises an oxidizable layer (e.g. TiN), a conductive
exotic-nitride barrier layer (e.g. Ti--Al--N) overlying the
oxidizable layer, an oxygen stable layer (e.g. platinum) overlying
the exotic-nitride layer, and a high-dielectric-constant material
layer (e.g. barium strontium titanate) overlying the oxygen stable
layer. The exotic-nitride barrier layer substantially inhibits
diffusion of oxygen to the oxidizable layer, thus minimizing
deleterious oxidation of the oxidizable layer.
[0014] In still another US Patent, Gnade, et al., disclose a
different method of forming electrical connections to high
dielectric constant materials. An embodiment of this invention
comprises an oxidizable layer (e.g. tantalum), an oxygen gettering
layer (e.g. platinum/tantalum mixture) overlaying the oxidizable
layer, a noble metal layer (e.g. platinum) overlaying the oxygen
gettering layer, and a high-dielectric-constant material layer
(e.g. barium strontium titanate) overlaying the noble metal layer.
The structures presented provide electrical connection to
high-dielectric-constant. The oxygen gettering layer controls
oxygen diffusion, minimizing the formation of a resistive layer
either in the lower electrode or at the lower electrode/substrate
interface. The oxygen gettering layer acts as a gettering site for
oxygen, where the oxygen oxidizes the reactive metal portion of the
layer, leaving the noble metal portion of the layer intact. The
invention provides a stable and electrically conductive electrode
for high-dielectric-constant materials while using standard
integrated circuit materials to facilitate and economize the
manufacturing process.
[0015] In the present invention, a method of forming a boron
carbide layer for use as a barrier and an etch-stop layer in a
copper dual damascene structure, and the structure itself are
disclosed.
SUMMARY OF THE INVENTION
[0016] It is therefore an object of this invention to provide a
method of forming a copper dual damascene structure having a boron
carbide etch-stop layer with a low dielectric constant.
[0017] It is another object of this invention to provide a method
of forming a copper dual damascene structure having a boron carbide
layer as a barrier to copper diffusion.
[0018] It is still another object of the present invention to
provide a copper dual damascene structure having boron carbide
layers with effective low dielectric constant, good copper
diffusion barrier, good insulating properties and high etching
selectivity with respect to insulating layers.
[0019] It is an over-all object of the present invention to provide
a damascene structure wherein one or more of the passivation,
etch-stop, and cap layer, or combination barrier and passivation
layer are formed of boron carbide.
[0020] These objects are accomplished by providing a semiconductor
substrate having a first conductive layer; forming a boron carbide
(BC) passivation layer over said conductive layer; forming a first
dielectric layer over said BC passivation layer; forming a BC
etch-stop layer over said first dielectric layer; forming a second
dielectric layer over said BC etch-stop layer; forming a BC cap
layer over said second dielectric layer; forming a first
photoresist layer over said cap layer and patterning said
photoresist layer with a mask comprising a via hole pattern;
etching through said via pattern in said first photoresist layer to
form said via hole in said BC cap layer and said second dielectric
layer until said BC etch-stop layer is reached; etching through
said via hole pattern to form said via hole in said BC etch-stop
layer; etching further said via hole pattern into said first
dielectric layer until BC passivation layer is reached; removing
said first photoresist layer; forming a second photoresist layer
over said BC cap layer including said via hole in said second
dielectric layer; patterning said second photoresist layer with a
mask comprising a line trench pattern; etching through said line
trench pattern in said second photoresist layer into said BC cap
layer and said second dielectric layer and into said BC etch-stop
layer; etching further through said hole pattern in said BC
etch-stop layer and extending said hole pattern into said BC
passivation layer thus forming a dual damascene structure
comprising a composite hole and line trench pattern in said
substrate; removing said second photoresist layer; forming a
barrier lining on the inside walls of said dual damascene
structure; forming metal over said barrier lining in said dual
damascene structure; and forming a combination barrier and
passivation layer over said substrate including over said dual
damascene structure.
[0021] These objects are accomplished in a second embodiment
providing a semiconductor substrate having a substructure
comprising devices formed in said substrate and a conductive layer
formed thereon; a boron carbide (BC) passivation layer over said
conductive layer; a first dielectric layer over said first BC
passivation layer; a BC etch-stop layer over said first dielectric
layer; a second dielectric layer over said BC etch-stop layer; a BC
cap layer over said second dielectric layer; a dual damascene
structure having a top portion and inside walls formed within first
and second dielectric layers; said dual damascene structure having
a barrier layer lining said inside walls; and said dual damascene
structure having a combination barrier and etch stop layer over
said top portion.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] FIGS. 1a-1c show the forming of a dual damascene structure
where a line trench or groove is etched first into an upper second
dielectric layer until an etch-stop layer is reached, and then the
hole pattern etched into the lower first dielectric layer,
according to prior art.
[0023] FIGS. 1d-1e show the forming of a dual damascene structure
where a hole pattern is etched first into an upper second
dielectric layer until an etch-stop layer is reached, and then the
line pattern etched into the top layer while at the same time the
hole pattern is transferred into the lower first dielectric layer,
according to prior art.
[0024] FIG. 1f shows a dual damascene structure formed by either
one of the methods shown in FIGS. 1a-1c or FIGS. 1d-1e, according
to prior art.
[0025] FIG. 2a is a partial cross-sectional view of a substrate
showing the forming of a first and a second dielectric layer
separated from each other by an intervening second etch-stop layer
while being separated from the substrate by a first etch-stop
layer, according to the present invention.
[0026] FIG. 2b is a partial cross-sectional view of a substrate
showing the patterning of a photoresist layer with a hole pattern
over the substrate of FIG. 2a, according to the present
invention.
[0027] FIG. 2c is a partial cross-sectional view of a substrate
showing the etching of the hole pattern of FIG. 2b into the second
and first dielectric layers, according to the present
invention.
[0028] FIG. 2d is a partial cross-sectional view of a substrate
showing the patterning of a photoresist layer with a line pattern
over the substrate of FIG. 2c, according to the present
invention.
[0029] FIG. 2e is a partial cross-sectional view of a substrate
showing the etching of the line pattern in the second dielectric
layer into the second etch-stop layer of FIG. 2d, while at the same
time etching the hole pattern in the first dielectric layer into
the first etch-stop layer, according to the present invention.
[0030] FIG. 2f is a partial cross-sectional view of a substrate
showing the forming of a barrier lining in the composite line and
hole structure of FIG. 2e, and the completion of the dual damascene
structure of this invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0031] Referring now the drawings, in particular to FIGS. 2a-2f,
there is shown a copper dual damascene process utilizing boron
carbide as an etch-stop layer.
[0032] Specifically, FIG. 2a shows a semiconductor substrate (200)
having a conductive layer (210) thereover. Semiconductor substrate
should be understood to include a substrate or wafer composed of a
semiconductor material such as silicon, or silicon-on-sapphire
(SOS) or silicon-on-insulator (SOI) as is known in the art.
Semiconductor substrate should be understood to possibly further
include one or more layers of insulating material and/or conductive
material an one or more active and/or passive devices and/or
multilayer interconnection structure over the active and/or passive
devices, formed in or over the substrate or the like. The
conductive layer (210) can comprise one or more conductors from a
group coating copper, tungsten, aluminum, titanium, titanium
nitride, tantalum, tantalum nitride. Typically, the conductive
layer is an interconnect pattern or line. In the present invention,
the conductor is preferred to comprise copper and barrier metal and
may be in the form of a dual or single damascene structure or a
blanket film. Boron carbide (BC) is grown over the conductor layer
or substrate using the technique of plasma enhanced chemical vapor
deposition or physical vapor deposition (PVD). This BC is a main
feature and key aspect of the present invention because, unlike the
conventional etch-stop layers such as PECVD silicon nitride, for
example, it has a low dielectric constant, is a good barrier to
copper diffusion, has good insulating properties, and high etch
selectivity with respect to dielectric materials which are used as
insulating layers. Furthermore, through careful control of the
growth conditions, amorphous BC can be grown having specific
mechanical and electrical properties suited for specific
applications.
[0033] Thus, a passivation layer of BC, in FIG. 2a, is formed over
the underlying conductive layer (210) by introducing boron source
gas and carbon source gas in a CVD chamber at a deposition
temperature between about 100 to 450.degree. C. yielding a
dielectric constant between about 3 to 6. Preferably, the source
gases for boron and carbon includes but not restricted to
B.sub.2H.sub.6, B.sub.5H.sub.9 and CH.sub.4, C.sub.2H.sub.6,
respectively. The ratio of the flow rates of the boron source gas
to the carbon source gas is between 1:1000 and 1000:1. One or more
carrier gases from a group containing nitrogen, argon and helium
can also be used in addition to the boron source gas and the carbon
source gas. The pressure for the deposition is between 10 mTorr and
10 Torr. In the case that RF is applied (that is, in a PECVD
chamber), the frequency used is about 13.56 MHz and the RF power
that is capacitively coupled to the plasma is between about 110 to
250 watts. And the preferred thickness of the BC is between about
50 to 5000 .ANG.. Alternatively, boron carbide can be deposited by
physical vapor deposition on a magnetron sputtering equipment using
a graphite target and a boron source gas (including but not
restricted to B.sub.2H.sub.6, B.sub.5H.sub.6, B.sub.5H.sub.9). Main
sputtering parameters are: power between about 1 kW and 10 kW,
magnetic field between about 50 Gauss to 300 Gauss, temperature
between about 20.degree. C. to 500.degree. C., pressure between
about 0.1 mTorr to 1000 mTorr.
[0034] Next, first dielectric layer (220) is formed over the BC
passivation layer. As is well known in the art, blanket dielectric
layers may be formed from materials including but not limited to
undoped and doped silicon oxide materials, organic polymers and
porous and non-porous entities of the aforementioned materials
formed within integrated circuits through methods including but not
limited to CVD, PVD sputtering, and spincoating methods. For the
preferred embodiment of the present invention, the blanket first
dielectric layer has a thickness between about 2000 to 10000
.ANG..
[0035] A second boron carbide layer is next formed over the first
dielectric layer as an etch-stop layer, as shown in the same FIG.
2a. Preferably, second BC layer (225) is formed using the method
described above to a thickness between about 50 to 5000 .ANG., and
it is important that it has the same dielectric constant as the
first BC layer.
[0036] The next layer of dielectric, (230), shown in FIG. 2a is a
second dielectric layer that is formed above layer (225). The
second dielectric layer preferably has a thickness between about
2000 to 10000 .ANG., and is preferably the same as the first
dielectric layer (220). Finally, a cap layer (235) comprising
typically of silicon nitride is deposited over the second
dielectric layer to a thickness between about 500 to 5000 .ANG..
The cap layer can also be comprised of boron carbide, which has the
same dielectric constant as the first BC layer. The cap layer
functions as an effective stop layer for CMP, and has a thickness
between about 50 to 5000 .ANG..
[0037] Using conventional techniques, first photoresist layer (240)
is next formed over the second dielectric layer and then patterned
with the image of a via or a contact hole. Using photoresist layer
(240) as a mask, hole pattern (250) is then etched into the cap
second and first dielectric layers, in that order, including the
intervening BC layer (225) as shown in FIG. 2c. The etching of the
dielectric layers is accomplished using plasma-assisted dry etching
wherein etching chemistry comprises one or more gas from a group
containing fluorocarbon(s), fluorine-substituted hydrocarbon(s),
fluorosulfur, hydrocarbon(s), fluorine, chlorine,
chlorine-substituted hydrocarbon(s), nitrogen, hydrogen, forming
gas, argon, carbon monoxide and oxygen, while the etching of the BC
cap layer and etch stop layer is accomplished using plasma-assisted
dry etching wherein etching chemistry comprises one or more gases
from a group containing nitrogen, hydrogen, forming gas, fluorine,
chlorine, oxygen and argon.
[0038] Next, the first photoresist layer is removed, preferably by
wet stripping or oxygen plasma ashing, although the first
photoresist layer may also be removed during the etching if oxygen
is used as one of the etching gases. A second photoresist layer
(260) formed over the substrate, including the opening formed in
the previous step, and patterned with the image of a line trench to
form groove (270) as shown in FIG. 2d. The line pattern is next
transferred from the second photoresist layer into the second
dielectric layer by using plasma-assisted dry etching wherein
etching chemistry comprises one or more gases from a group
containing fluorocarbon(s), fluorine-substituted hydrocarbon(s),
fluorosulfur, hydrocarbon(s), nitrogen, hydrogen, forming gas,
argon, carbon monoxide and oxygen, first stopping on etch-stop
layer (225) as shown by phantom lines (275). After removal of the
second photoresist layer, the hole pattern in the first dielectric
layer is transferred into the passivation layer (215), as shown in
FIG. 2e. This is accomplished with plasma-assisted dry etching
wherein etching chemistry comprises one or more gas from a group
containing nitrogen, hydrogen, forming gas, fluorine, chlorine,
O.sub.2 and Ar having high etching selectivity with respect to
exposed copper or silicon.
[0039] As another important step in the present invention, the
composite line/hole structure shown in FIG. 2e is lined with a
material which forms a good barrier to copper diffusion. It is
preferred that barrier lining (280) comprises tantalum or tantalum
nitride formed by PVD or CVD, and having a thickness between about
50 to 2000 .ANG.. Next, the composite structure is filled,
preferably, with copper (290) or other conductor such as aluminum
deposited to a thickness between about 4000 to 10000 .ANG. and the
excess metal is removed by chemical mechanical polishing, which is
commonly used for planarizing surfaces. Finally, the copper
damascene structure of the invention is completed by forming still
another layer (300) of boron carbide having a thickness between
about 50 to 5000 .ANG. over the substrate to serve as a top barrier
lid or passivation layer for the copper interconnect, or as an
etch-stop layer for the next level of metallization as shown in
FIG. 2f.
[0040] It will be apparent to those skilled in the art that, the
passivation layer, the etch-stop layer, and the cap layer, namely
the disclosed BC layers become integrated into the disclosed copper
damascene interconnect, and hence contribute to an over-all smaller
effective dielectric constant than would otherwise be. In addition
to having a lower dielectric constant than, for example, the
commonly used silicon nitride, boron carbide also has good
qualities as a barrier to copper diffusion. Thus, BC can also be
used as barrier layer (280) for the copper damascene interconnect
shown in FIG. 2f. Though numerous details of the disclosed method
are set forth here, such as these processes and process parameters,
to provide an understanding of the present invention, it will be
obvious, however, to those skilled in the art that these specific
details need not be employed to practice the present invention. At
the same time, it will be evident that the same methods may be
employed in other similar process steps that are too many to cite,
such as the forming of passivation layer, etch-stop and cap layer
as well as barrier layers comprising the disclosed BC, and also,
the forming of not only dual or multi-damascene structures, but to
single damascene structures as well. Furthermore, the dual
damascene structure which is constructed in the present invention
using the "trench-first" approach can also be constructed using the
"via-first" approach or other known approaches, as it will be
understood by those skilled in the art.
[0041] While the invention has been particularly shown and
described with reference to the preferred embodiments thereof, it
will be understood by those skilled in the art that various changes
in form and details may be made without departing from the spirit
and scope of the invention.
* * * * *