U.S. patent application number 08/746748 was filed with the patent office on 2002-06-20 for chamber liner for high temperature processing chamber.
Invention is credited to FRANKEL, JONATHAN, SIVARAMAKRISHNAN, VISWESWAREN.
Application Number | 20020073922 08/746748 |
Document ID | / |
Family ID | 25002168 |
Filed Date | 2002-06-20 |
United States Patent
Application |
20020073922 |
Kind Code |
A1 |
FRANKEL, JONATHAN ; et
al. |
June 20, 2002 |
CHAMBER LINER FOR HIGH TEMPERATURE PROCESSING CHAMBER
Abstract
The present invention provides systems, methods and apparatus
for high temperature (at least about 500-800.degree. C.) processing
of semiconductor wafers. The systems, methods and apparatus of the
present invention allow multiple process steps to be performed in
situ in the same chamber to reduce total processing time and to
ensure high quality processing for high aspect ratio devices.
Performing multiple process steps in the same chamber also
increases the control of the process parameters and reduces device
damage. In particular, the present invention can provide high
temperature deposition, heating and efficient cleaning for forming
dielectric films having thickness uniformity, good gap fill
capability, high density, low moisture, and other desired
characteristics.
Inventors: |
FRANKEL, JONATHAN; (SAN
JOSE, CA) ; SIVARAMAKRISHNAN, VISWESWAREN;
(CUPERTINO, CA) |
Correspondence
Address: |
PATENT COUNSEL MS/2061
LEGAL AFFAIRS DEPT
APPLIED MATERIALS INC
P O BOX 450A
SANTA CLARA
CA
95052
|
Family ID: |
25002168 |
Appl. No.: |
08/746748 |
Filed: |
November 13, 1996 |
Current U.S.
Class: |
118/715 |
Current CPC
Class: |
H01J 37/32522 20130101;
H01L 21/67109 20130101; C23C 16/401 20130101; C23C 16/402 20130101;
H01L 21/67115 20130101; C23C 16/4411 20130101; C23C 16/52 20130101;
C23C 16/4405 20130101; C23C 16/45572 20130101; C23C 16/45565
20130101 |
Class at
Publication: |
118/715 |
International
Class: |
C23C 016/00 |
Claims
What is claimed is:
1. A chamber liner for a vapor deposition apparatus comprising: an
inner annular portion comprising a material that is substantially
resistant to process gases at temperatures of at least about
400.degree. C.; and an outer annular portion disposed adjacent the
inner annular portion and comprising an insulating material for
decreasing a thermal gradient between the perimeter of the wafer
and the enclosure.
2. The chamber liner of claim 1 wherein the inner and outer
portions are separate from each other.
3. The chamber liner of claim 1 wherein the outer portion has a
thickness substantially greater than a thickness of the inner
portion.
4. The chamber liner of claim 1 wherein the outer portion of the
chamber liner comprises a material that is substantially resistant
to cracking at temperatures above about 400.degree. C.
5. The chamber liner of claim 1 wherein the inner portion of the
chamber liner comprises a material that is substantially resistant
to the process gases at temperatures of at least about 600.degree.
C. without reacting with the process gases.
6. The chamber liner of claim 1 wherein the inner portion of the
chamber liner is substantially resistant to reactions with the
process gases and to deposition by the process gases on the
pedestal.
7. The chamber liner of claim 1 wherein the inner portion of the
chamber liner is substantially resistant to etching by
fluorine-containing compounds at temperatures of at least about
400.degree. C.
8. The chamber liner of claim 1 wherein said inner portion of the
chamber liner comprises a ceramic material.
9. The chamber liner of claim 8 wherein the inner portion of the
chamber liner comprises aluminum oxide.
10. The chamber liner of claim 1 wherein the outer portion of the
chamber liner comprises a material from the group consisting of
aluminum and aluminum alloys.
11. The chamber liner of claim 1 wherein the outer portion of the
chamber liner defines one or more air gaps therein to increase the
thermal insulation provided by the outer portion.
12. The chamber liner of claim 1 wherein the inner portion of the
liner has a thickness of about 0.2-0.3 inch and the outer portion
has a thickness of about 0.8-1.2 inch.
13. The chamber liner of claim 1 further comprising a cover
overlying at least the outer portion of the chamber liner, the
cover comprising a ceramic material.
14. An apparatus for fabricating an integrated circuit device
comprising: an enclosure housing a processing chamber and having a
gas inlet for receiving process gases into the processing chamber
and a gas outlet for discharging the process gases; a pedestal
disposed within the processing chamber for supporting a wafer
thereon; and a chamber liner at least partially surrounding the
pedestal and including inner and outer portions, the inner portion
comprising a material that is substantially resistant to the
process gases at temperatures of at least about 400.degree. C., and
the outer portion comprising an insulating material for decreasing
a thermal gradient between the perimeter of the wafer and the
enclosure.
15. The apparatus of claim 14 wherein the inner and outer portions
of the chamber liner each comprise separate components positioned
adjacent each other in the processing chamber, the outer portion
having a thickness substantially greater than a thickness of the
inner portion.
16. The apparatus of claim 14 wherein the outer portion of the
chamber liner comprises air, the inner portion being spaced away
from the enclosure to define a thermally insulating air gap
therebetween.
17. The apparatus of claim 14 wherein the inner portion of the
chamber liner comprises a material that is substantially resistant
to reactions with the process gases and to deposition thereon at
temperatures of at least about 600.degree. C.
18. The apparatus of claim 14 further comprising a gas inlet for
receiving cleaning gases comprising one or more fluorine-containing
compounds, wherein said inner portion of the chamber liner is
substantially resistant to etching by the fluorine-containing
compounds at temperatures of at least about 400.degree. C.
19. The apparatus of claim 14 wherein said inner portion of the
chamber liner comprises aluminum oxide.
20. The apparatus of claim 14 wherein the process gases are
selected from the group consisting of TEOS, NF.sub.3, nitrogen,
ozone, oxygen, TEPO, and TEB.
21. The apparatus of claim 14 wherein the outer portion of the
chamber liner comprises a material from the group consisting of
aluminum and aluminum alloys.
22. The apparatus of claim 14 wherein the outer portion of the
chamber liner defines one or more air gaps therein to increase the
thermal insulation provided by the outer portion.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is related to concurrently filed and
commonly assigned patent application entitled "HEATER/LIFT ASSEMBLY
FOR HIGH TEMPERATURE PROCESSING CHAMBER," having Jonathan Frankel,
Hari Ponnekanti, Inna Shmurun, and Visweswaren Sivaramakrishnan
listed as co-inventors and to concurrently filed and commonly
assigned patent application entitled "SYSTEMS AND METHODS FOR HIGH
TEMPERATURE PROCESSING OF SEMICONDUCTOR WAFERS," having Visweswaren
Sivaramakrishnan, Ellie Yieh, Jonathan Frankel, Li-Qun Xia, Gary
Fong, Srinivas Nemani, Irwin Silvestre, Inna Shmurun, and Tim
Levine listed as co-inventors; and to concurrently filed and
commonly assigned patent application entitled "SUBSTRATE PROCESSING
APPARATUS WITH BOTTOM-MOUNTED REMOTE PLASMA SYSTEM," having Gary
Fong and Irwin Silvestre listed as co-inventors; and to
concurrently filed and commonly assigned patent application
entitled "LIFT ASSEMBLY FOR HIGH TEMPERATURE PROCESSING CHAMBER,"
having Jonathan Frankel listed as inventor; and to concurrently
filed and commonly assigned patent application entitled "SYSTEMS
AND METHODS FOR DETECTING END OF CHAMBER CLEAN IN A THERMAL
(NON-PLASMA) PROCESS," having Visweswaren Sivaramakrishnan and Gary
Fong listed as co-inventors; and to concurrently filed and commonly
assigned patent application entitled "LID ASSEMBLY FOR HIGH
TEMPERATURE PROCESSING CHAMBER," having Jonathan Frankel, Inna
Shmurun, Visweswaren Sivaramakrishnan, and Eugene Fukshanski listed
as co-inventors; and to concurrently filed and commonly assigned
patent application entitled "METHODS AND APPARATUS FOR CLEANING
SURFACES IN A SUBSTRATE PROCESSING SYSTEM," having Gary Fong,
Li-Qun Xia, Srinivas Nemani, and Ellie Yieh listed as co-inventors;
and to concurrently filed and commonly assigned patent application
entitled "METHODS AND APPARATUS FOR GETTERING FLUORINE FROM CHAMBER
MATERIAL SURFACES," having Li-Qun Xia, Visweswaren
Sivaramakrishnan, Srinivas Nemani, Ellie Yieh, and Gary Fong listed
as co-inventors; and to concurrently filed and commonly assigned
patent application entitled "METHODS AND APPARATUS FOR DEPOSITING
PREMETAL DIELECTRIC LAYER AT SUB-ATMOSPHERIC AND HIGH TEMPERATURE
CONDITIONS," having Li-Qun Xia, Ellie Yieh, and Srinivas Nemani
listed as co-inventors; and to concurrently filed and commonly
assigned patent application entitled "METHODS AND APPARATUS FOR
SHALLOW TRENCH ISOLATION," having Ellie Yieh, Li-Qun Xia, and
Srinivas Nemani listed as co-inventors; and to concurrently filed
and commonly assigned patent application entitled "SYSTEMS AND
METHODS FOR CONTROLLING THE TEMPERATURE OF A VAPOR DEPOSITION
APPARATUS," having Jonathan Frankel listed as inventor; and to
concurrently filed and commonly assigned patent application
entitled "METHODS AND APPARATUS FOR PRE-STABILIZED PLASMA
GENERATION FOR MICROWAVE CLEAN APPLICATIONS," having Gary Fong,
Fong Chang, and Long Nguyen listed as co-inventors; and to
concurrently filed and commonly assigned patent application
entitled "METHOD AND APPARATUS FOR FORMING ULTRA-SHALLOW DOPED
REGIONS USING DOPED SILICON OXIDE FILMS," having Ellie Yieh, Li-Qun
Xia, Paul Gee, and Bang Nguyen listed as co-inventors. Each of the
above referenced applications are assigned to Applied Materials
Inc., the assignee of the present invention, and each of the above
referenced applications are hereby incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] The present invention relates to semiconductor processing.
More specifically, the invention relates to a method and apparatus
for forming dielectric films over high aspect ratio features at
temperatures greater than about 500.degree. C., with the dielectric
films having low moisture content and low shrinkage. Embodiments of
the present invention are particularly useful to deposit doped
dielectric films, such as borophosphosilicate glass (BPSG) films,
borosilicate glass (BSG) films, or phosphosilicate glass (PSG)
films, and to form ultra-shallow doped regions used, for example,
as source/drain junctions or as channel stop diffusions in shallow
trench isolation. In addition, embodiments of the present invention
may also be used to deposit doped dielectric films used as premetal
dielectric (PMD) layers, intermetal dielectric (IMD) layers, or
other dielectric layers. Further embodiments of the present
invention may further be used to deposit undoped dielectric films,
such as undoped silicate glass (USG) films used as shallow trench
isolation filling oxides, insulating layers, capping layers, or
other layers.
[0003] One of the primary steps in fabricating modern semiconductor
devices is forming a dielectric layer on a semiconductor substrate.
As is well known, such a dielectric layer can be deposited by
chemical vapor deposition (CVD). In a conventional thermal CVD
process, reactive gases are supplied to the substrate surface where
heat-induced chemical reactions (homogeneous or heterogeneous) take
place to produce a desired film. In a conventional plasma process,
a controlled plasma is formed to decompose and/or energize reactive
species to produce the desired film. In general, reaction rates in
thermal and plasma processes may be controlled by controlling one
or more of the following: temperature, pressure, and reactant gas
flow rate.
[0004] Semiconductor device geometries have dramatically decreased
in size since such devices were first introduced several decades
ago. Since then, integrated circuits have generally followed the
two-year/half-size rule (often called "Moore's Law") which means
that the number of devices which will fit on a chip doubles every
two years. Today's wafer fabrication plants are routinely producing
0.5 .mu.m and even 0.35 .mu.m feature size devices, and tomorrow's
plants soon will be producing devices having even smaller feature
sizes. As device feature sizes become smaller and integration
density increases, issues not previously considered crucial by the
industry are becoming of greater concern. In particular, devices
with increasingly high integration density have features with high
(for example, greater than about 3:1 or 4:1) aspect ratios. (Aspect
ratio is defined as the height-to-spacing ratio of two adjacent
steps.)
[0005] Increasingly stringent requirements for processes in
fabricating these high integration devices are needed in order to
produce high quality devices, and conventional substrate processing
systems are becoming inadequate to meeting these requirements. One
requirement is that the dielectric films formed in the process of
fabricating such devices need to be uniformly deposited over these
high aspect ratio features without leaving substantial gaps or
voids. Another requirement is that these films need to exhibit low
shrinkage so that subsequent heating and/or wet etching steps do
not cause voids to open up in the deposited film. However,
conventional substrate processing systems that typically deposit
dielectric films at temperatures less than about 450.degree. C. are
unable to produce low moisture films having good gap-filling
capabilities without opening substantial voids in subsequent
heating and/or wet etching steps. As is well known, these gaps or
voids may contribute to device performance unreliability and other
problems. Dielectric films used, for example, as PMD or IMD layers
in such devices need good high aspect ratio gap-fill capability to
avoid problems caused by these gaps or voids. A further requirement
is that metal contamination into the wafer during the processing
steps be minimized to avoid short circuits and other problems in
the devices. As is well known, conventional substrate processing
systems using in situ plasma during processing experience physical
sputtering of ions which attack chamber surfaces, such as aluminum
walls, resulting in metal contamination of the substrate. Use of in
situ plasma is therefore undesirable. An improved substrate
processing system, which does not use in situ plasma, is needed to
provide dielectric films with the desired characteristics of low
moisture, high density, low shrinkage, good high aspect ratio
gap-filling capability.
[0006] In addition to meeting these stringent requirements,
substrate processing systems must be able to meet the higher
demands for forming ultra-shallow doped regions, which are
necessary for high integration devices with shrinking device
geometries. With the advent of smaller device geometries,
ultra-shallow doped regions in semiconductors are needed for
various applications including, for example, source/drain
junctions, channel stop diffusions for shallow trench isolation,
etc. For example, MOS devices with channel lengths of less than 0.8
.mu.m often require source/drain junctions having depths less than
about 250 nanometers (nm) for adequate device performance. For
transistors separated by trench isolation structures of about 0.35
.mu.m depth, ultra-shallow channel stop regions having a depth on
the order of hundreds of nm are usually required. For applications
requiring ultra-shallow doped regions, it is important to provide
uniform dopant distribution in the doped regions and good control
of junction depth.
[0007] Current approaches to forming ultra-shallow doped regions,
such as ion implantation and gaseous diffusion, are inadequate in
some applications. With these current approaches, the ability to
control dopant distribution and junction depth is limited,
especially as the doped regions become shallower. With an approach
like ion implantation, controlling dopant distribution is made
difficult due to the built-up concentration of ions at the surface
of the semiconductor material. Also, ion implantation causes damage
to the semiconductor surface, and methods for repairing this
substrate damage often make it more difficult to control dopant
distribution and junction depth for ultra-shallow doped regions.
For example, ions bombarded at relatively high energy levels have a
tendency to tunnel or channel through the semiconductor material
and cause damage such as point defects. These point defects, which
may lead to irregular and nonuniform junction depths, may be fixed
by annealing the implanted semiconductor material at high
temperatures (greater than about 900.degree. C.). Annealing the
implanted semiconductor material, however, may further increase the
junction depth beyond that desired. With an approach like gaseous
diffusion, controlling dopant distribution and junction depth is
difficult to control in forming ultra-shallow doped regions. As
technology progresses to even smaller geometry devices, an
alternative approach that is able to control the dopant uniformity
and junction depth in ultra-shallow doped regions is needed.
[0008] In forming ultra-shallow doped regions, one alternative
approach to the current approaches of ion implantation and gaseous
diffusion is the use of a doped dielectric film as a dopant
diffusion source. In this alternative approach, a doped dielectric
film is deposited onto a substrate and used as a source of dopants
which are diffused into the substrate to form ultra-shallow doped
regions. For example, doped dielectric films are deposited at
temperatures less than 500.degree. C. in a deposition chamber, and
subsequently heated at temperatures greater than 500.degree. C. in
a different chamber, such as an annealing furnace, to perform the
dopant diffusion to form the doped region. Controlling thickness,
uniformity, and moisture content of the doped dielectric film is
important in efficiently forming ultra-shallow doped junctions in
the semiconductor material. Specifically, controlling the thickness
and uniformity of the deposited doped dielectric film provides some
control over the amount of dopants available for diffusion.
Limiting the thickness of doped dielectric films used as diffusion
sources also helps to increase wafer throughput by saving
deposition (and subsequent etching) time. Moreover, a uniformly
deposited film with even dopant uniformity can provide a more
controlled diffusion of dopants from the film into the substrate.
As is well known, moisture in doped dielectric films reacts with
dopants to bind them in a crystal structure, resulting in fewer
dopants available for diffusion into the substrate to form doped
regions. It is desirable to use doped dielectric films having a low
moisture content, since these films have more dopants available for
use in the diffusion.
[0009] Several problems are encountered with conventional substrate
processing systems when using a doped dielectric film as a dopant
diffusion source. One problem is that it is difficult to obtain a
high degree of control over film thickness and uniformity when
using conventional systems to deposit the doped dielectric film.
Another problem is that it is often difficult to ensure that
adequate amounts of dopants in the doped dielectric film are
available for diffusion into the substrate to form the
ultra-shallow doped regions. A further problem is the existence of
native oxides, which act as a barrier layer preventing dopants from
diffusing into the substrate from the doped dielectric film, on
substrate surfaces where the ultra-shallow doped regions are to be
formed. These problems are discussed in further detail below.
[0010] Despite the advantages of using doped dielectric films as
dopant diffusion sources to form ultra-shallow doped regions, the
problem of being unable to control thickness and uniformity of the
deposited doped dielectric film when using conventional deposition
systems is of particular concern for two primary reasons. First,
the inability to adequately control thickness and uniformity of the
deposited doped dielectric film using conventional methods and
apparatus undesirably results in a diminished ability to control
the dopant uniformity and junction depth of the ultra-shallow doped
region formed. For example, in a conventional sequential CVD
chamber, a substrate rests on a belt and travels through various
portions of the chamber. In each portion of the chamber, a layer
having a certain thickness may be deposited. Thickness of the
deposited film may be controlled by changing the belt speed, which
provides limited control. Further, control over the thickness and
dopant uniformity of the films deposited on different wafers is
difficult when attempting to control film thickness and dopant
concentration using belt speed. That is, the thicknesses of the
deposited films on different wafers may vary and be unpredictable,
leading to wafer-to-wafer unreliability. Second, being able to
control the thickness of the deposited doped dielectric film, even
for very thin films, is desirable for overall efficiency and
increased wafer throughput. However, conventional approaches have
only been capable of forming doped dielectric films with
thicknesses on the order of thousands of Angstroms (A). Also, it
may be difficult to maintain the thickness of the deposited film as
thin as possible using systems relying on belt speed to control
thickness of the deposited film. With thicker films deposited
conventionally, some dopants may take longer to diffuse into the
substrate, since they have greater distances to travel before
reaching the semiconductor material. Also, removal of such a thick
film used as a dopant diffusion source by etching or other
technique often increases the total time to process the wafer. With
growing pressures on manufacturers to improve efficiency, it is
desirable to form the doped dielectric film as thin as possible in
order to decrease the time needed to deposit and then remove the
film. It is desirable to have a method and apparatus that can
easily control the thickness and dopant uniformity of a doped
dielectric film (less than about 500 .ANG. thick at .+-.0.2 weight
percentage dopant variation across the wafer) that is used as a
dopant diffusion source.
[0011] Another problem with using doped dielectric films as dopant
diffusion sources for ultra-shallow doped regions is that adequate
amounts of dopants must be available for diffusion into the
substrate. Films with high dopant concentration are often needed to
provide adequate amounts of dopants for uniform diffusion into the
substrate to form ultra-shallow junctions. However, moisture
absorption and outgassing are two problems relating to adequate
dopant availability. Doped dielectric films, especially those with
high dopant concentrations, tend to absorb moisture shortly after a
wafer is exposed to ambient moisture in a clean room (e.g. when the
wafer is transferred from the deposition chamber after deposition
of the doped dielectric film to a different processing chamber for
the next processing step in a multiple-step process). The absorbed
moisture (H.sub.2O) then reacts with the dopants in the dielectric
film, causing the film to crystallize. Due to the crystal structure
binding the dopants within the film, these dopants become
unavailable for diffusion into the substrate, even after a
subsequent heating of the wafer by rapid thermal processing or
annealing in another chamber. Moisture absorption thus reduces the
amount of dopants for diffusion into the substrate. In addition to
the moisture absorption problem, outgassing of dopants from the
doped dielectric film also may occur in subsequent heating steps.
These dopants diffuse out of the film away from the substrate,
resulting in fewer dopants available to be diffused into the
substrate to form ultra-shallow doped regions.
[0012] Even if adequate dopants are available for diffusion, the
problem of native oxides remains an important consideration when
using doped dielectric films as diffusion sources. Native oxides
existing on the substrate surface where ultra-shallow doped regions
are to be formed prevent effective and uniform dopant diffusion
into the silicon. Therefore, native oxides, which act as a
diffusion barrier layer to the dopants, need to be removed.
Removing native oxides has been done using conventional techniques
such as wet etching using liquid etchants, and dry etching using an
in situ plasma. However, using liquid etchants is often difficult
to control and may result in overetching the substrate. Substrates
that have native oxides cleaned by conventional methods such as wet
etching have shelf lives of less than about one week before native
oxides begin to form again, making it desirable to process the
wafers shortly after the native oxides have been removed. Using dry
etching to remove native oxides with an in situ plasma results in
plasma damage to the surface of the substrate. In addition to
causing surface plasma damage, in situ plasma dry etching may
undesirably result in more metal contamination, as discussed
earlier. Accordingly, it is important to efficiently remove native
oxides without damaging the substrate surface so dopants may
diffuse into the substrate uniformly for ultra-shallow doped
regions.
[0013] In addition to providing dense, low moisture dielectric
films having uniform thickness and high aspect ratio gap-filling
capability with low metal contamination, improved quality and
overall efficiency in fabricating integrated circuit devices is
also important. An important way to improve quality and overall
efficiency in fabricating devices is to clean the chamber
effectively and economically. With growing pressures on
manufacturers to improve processing quality and overall efficiency,
eliminating the total downtime in a multiple-step process without
compromising the quality of the wafers has become increasingly
important for saving both time and money. During CVD processing,
reactive gases released inside the processing chamber form layers
such as silicon oxides or nitrides on the surface of a substrate
being processed. Undesirable oxide deposition occurs elsewhere in
the CVD apparatus, such as in the area between the gas mixing box
and gas distribution manifold. Undesired oxide residues also may be
deposited in or around the exhaust channel and the walls of the
processing chamber during such CVD processes. Over time, failure to
clean the residue from the CVD apparatus often results in degraded,
unreliable processes and defective substrates. Without frequent
cleaning procedures, impurities from the residue built up in the
CVD apparatus can migrate onto the substrate. The problem of
impurities causing damage to the devices on the substrate is of
particular concern with today's increasingly small device
dimensions. Thus, CVD system maintenance is important for the
smooth operation of substrate processing, as well as resulting in
improved device yield and better product performance.
[0014] Frequently, periodic chamber cleanings between processing of
every N wafers is needed to improve CVD system performance in
producing high quality devices. Providing an efficient,
non-damaging clean of the chamber and/or substrate is often able to
enhance performance and quality of the devices produced. In
addition to improving the quality of the above-discussed chamber
cleanings (which are done without breaking the vacuum seal),
preventive maintenance chamber cleanings (where the vacuum seal is
broken by opening the chamber lid to physically wipe down the
chamber) are performed between multiple periodic chamber cleanings.
Often, performing the necessary preventive maintenance chamber
cleanings involves opening the chamber lid and any other chamber
parts that might obstruct the lid, which is a time-consuming
procedure that interferes with normal production processing.
[0015] In light of the above, improved methods, systems and
apparatus are needed for depositing dense, low moisture dielectric
films with uniform thicknesses and high aspect ratio gap-filling
capabilities. Optimally, these improved methods and apparatus will
also provide a chamber clean with low metal contamination. Improved
methods and apparatus are also needed for forming doped dielectric
films as dopant diffusion sources for ultra-shallow junctions.
These methods and apparatus should be capable of efficiently
removing native oxides to ensure effective and uniform dopant
diffusion from the doped dielectric layer without causing
significant surface damage to the silicon wafer. Further, for some
applications it is desirable to provide multiple deposition and
cleaning capabilities in a single chamber with a simplified design
to minimize the time consumed for different types of cleanings.
What is needed, therefore, are systems and methods that are capable
of high quality, efficient, high temperature deposition and
efficient, gentle cleaning. In particular, these systems and
methods should be designed to be compatible with processing
requirements for forming devices with high aspect ratio features,
and for forming ultra-shallow doped regions.
SUMMARY OF THE INVENTION
[0016] The present invention provides systems, methods and
apparatus for high temperature (at least about 500-800.degree. C.)
processing of semiconductor wafers. Embodiments of the present
invention include systems, methods and apparatus which enable
multiple process steps to be performed in situ in the same chamber
to reduce total processing time and to ensure high quality
processing to produce high integration devices having high aspect
ratio features. Performing multiple process steps in the same
chamber also increases the control over process parameters,
substantially reduces moisture content in deposited films, and
minimizes device damage due to metal contamination or process
residue contamination.
[0017] In particular, the present invention provides high
temperature deposition, heating and efficient cleaning for forming
dielectric films having relatively thin film thicknesses.
Embodiments of the present invention are particularly useful to
deposit doped dielectric films, such as borophosphosilicate glass
(BPSG) films, borosilicate glass (BSG) films, or phosphosilicate
glass (PSG) films, and to form an ultra-shallow doped region used,
for example, as source/drain junctions or as channel stop
diffusions in shallow trench isolation. In addition, embodiments of
the present invention may also be used to deposit doped dielectric
films used as premetal dielectric (PMD) layers, intermetal
dielectric (IMD) layers, or other dielectric layers. Further
embodiments of the present invention may further be used to deposit
undoped dielectric films used as shallow trench isolation filling
oxides, insulating layers, capping layers, or other layers.
[0018] Methods according to the present invention include
depositing dielectric films by CVD on a substrate in a vacuum
chamber having a pressure between about 10-760 torr, and heating
the substrate to a temperature greater than about 500.degree. C.
The substrate may be heated for a variety of purposes, such as
performing reflow of deposited dielectric layers for planarization,
or for driving in dopants from a deposited doped dielectric layer.
The process may be carried out in a single step (e.g., depositing
and reflowing the film on the wafer at temperatures greater than
500.degree. C.), or in multiple steps (e.g., depositing the film on
the wafer at temperatures less than 500.degree. C. and then heating
the film on the wafer after the film has been deposited). In either
case, high temperature processing is accomplished without removing
the wafer from the vacuum chamber, which advantageously reduces
moisture absorption in the dielectric film. The high temperature
processing also enables in situ deposition of doped dielectric
films with capping layers to advantageously reduce outgassing of
dopants from the doped film and lower moisture content. In a
specific embodiment, reactive gases are delivered to the substrate
surface, where heat-induced chemical reactions take place to
produce the dielectric film. Additionally or alternatively, a
controlled plasma may be formed to facilitate the decomposition of
the reactive species.
[0019] In an exemplary embodiment, the dielectric film is a thin
doped film used as a dopant diffusion source for an ultra-shallow
junction. The film is deposited at temperatures greater than about
500.degree. C. onto the substrate and heated to higher
temperatures, usually greater than 600.degree. C. and preferably
greater than about 700.degree. C., to diffuse dopants from the
dielectric layer to the underlying substrate. Performing the
deposition and heating steps in the same chamber provides better
control of the thickness, uniformity, and moisture content of the
doped dielectric film. Improving the moisture content of the film
increases the amounts of available dopants in the film, which is
particularly advantageous for forming ultra-shallow junctions in
high integration devices.
[0020] In another aspect of the invention, a remote plasma system
is provided for etching undesired deposits on the inner walls of
the vacuum chamber and components of the apparatus, and for
cleaning native oxides and other residue from the semiconductor
wafer prior to processing. A gentle cleaning technique using a
remote energy source is preferably employed instead of a
conventional in situ plasma process to lower metal contamination.
For example, the remote plasma system provides a remote plasma and
preferably fluorine radicals from the plasma are able to enter the
chamber, which is at high temperatures, and provide a gentle,
thermal cleaning of the chamber. With the remote plasma system,
only chemical reactions are utilized and the problem of physical
sputtering effects are eliminated. In contrast, with the use of an
in situ plasma system, sputtering effects attack aluminum chamber
walls, which may then lead to metal contamination in the processed
wafer. In the thermal cleaning process using the remote plasma
system, the radicals directed into the chamber can effectively
clean unwanted deposits and residues from the surfaces in the
chamber while the plasma remains remote or exterior to the chamber.
Another advantage of the remote plasma system is that native oxides
can be efficiently removed from the wafer to effectively ensure
effective and uniform dopant diffusion from the doped dielectric
layer without causing significant surface damage to the silicon
wafer. A further advantage of the remote plasma system is that the
system may also be configured for use to deposit films by using
different input gases as needed.
[0021] In a preferred embodiment, the remote plasma cleaning system
is a microwave plasma system configured to produce and deliver a
select species (such as fluorine, chlorine or other radicals) to
the processing chamber. The remote plasma system energizes gases by
microwave radiation to create a plasma with etching radicals.
Specifically, microwaves are created by a magnetron or other
suitable energy source and directed through a waveguide system to
an applicator tube, where a plasma is created. Reactive gases are
then fed into the applicator tube and energized by the microwave
energy, which sustains the ionization of the ignited plasma to
produce a flow of radicals into the processing chamber. For
cleaning, the radicals interact with residue formed on the chamber
walls to form reactant gases that are suitably discharged form the
chamber by an exhaust system. The microwave plasma system may also
be adapted to deposit plasma enhanced CVD films by delivering
deposition reactive gases into the processing chamber.
[0022] In another aspect of the invention, the remote plasma system
includes an endpoint detection system for indicating when the
chamber cleaning has concluded. The lack of plasma in the chamber
can make it difficult, using conventional endpoint detection
systems, to pinpoint the time at which the cleaning has been
completed (i.e., when the last process gas residue in the chamber
has reacted with the cleaning etchant so that it can be discharged
from the chamber). This is because conventional endpoint detection
systems typically rely on the use of a plasma within the chamber to
check emissions from the in situ plasma to determine the end of the
cleaning process. In the present invention, an endpoint detection
assembly is coupled to the gas outlet of the processing chamber to
determine the endpoint of the cleaning process by detecting changes
in light intensity that occur due to absorbance of light by the
exhausted clean gas reactants, such as SiF.sub.4.
[0023] In yet another aspect of the present invention, a method
provides gettering of any adsorbed clean gases, such as fluorine,
from the surface of chamber walls. According to the present
invention, a first cleaning gas containing fluorine is introduced
into the processing chamber to clean the processing chamber of
deposition residue. A second cleaning gas is then introduced into
the processing chamber after the residue has been removed with the
first cleaning gas. The second cleaning gas removes cleaning
residue formed by the reaction between the first cleaning gas and
the interior surfaces of the processing chamber. Removing or
gettering the cleaning residue from the chamber provides a number
of advantages. For example, in a preferred embodiment of the
present invention, fluorine radicals are delivered into the
processing chamber to remove residue, such as silicon oxide, by
forming a silicon-fluoride gas product which is pumped away from
chamber. After the fluorine-based chamber cleaning procedure, any
adsorbed fluorine on the surface of the chamber walls which might
otherwise interact with, or be incorporated into, the deposited
film on the next wafer to be processed is gettered. In an
alternative embodiment, the gettering may be performed by seasoning
the chamber using microwave-generated atomic oxygen and a silicon
source to deposit a thin film of oxide onto the chamber to trap any
adsorbed fluorine and prevent contamination of the subsequently
deposited films.
[0024] The present invention also provides various heat-resistant
and process-compatible components for high temperature processing.
The system of the present invention includes a vapor deposition
apparatus having an enclosure assembly housing a processing
chamber. The apparatus includes a heating assembly having a
pedestal/heater for heating the wafer to temperatures up to about
500-800.degree. C. The pedestal preferably comprises a material
that is substantially resistant to reactions with the process gases
and to deposition by the process gases at temperatures of at least
about 400.degree. C., and preferably at temperatures up to about
500-800.degree. C. In addition, the pedestal preferably comprises a
material that is substantially resistant to etching at high
temperatures (i.e., 500-800.degree. C.) by the fluorine radicals
introduced into the chamber during cleaning. In an exemplary
embodiment, the pedestal/heater comprises a resistive heating
element imbedded in a ceramic material, such as aluminum oxide or
preferably aluminum nitride.
[0025] The heating assembly of the present invention further
includes a support shaft for supporting the pedestal/heater within
the chamber and for housing the necessary electrical connections
thereto. The support shaft preferably comprises a ceramic material
that is diffusion-bonded to the pedestal/heater to provide a vacuum
seal within the shaft. This vacuum seal allows the hollow interior
of the shaft to be maintained at ambient temperature and pressure
during high temperature processing, which protects the electrodes
and other electrical connections from corrosion from the process
and clean gases within the chamber. In addition, providing ambient
pressure within the shaft minimizes arcing from the power source
through the hollow core of the shaft to power leads or the outer
walls of the shaft.
[0026] In still another aspect of the invention, a chamber liner is
provided around the pedestal/heater to insulate the chamber walls
from the heater. Preferably, the chamber liner includes an inner
portion comprised of a material such as ceramic that is resistant
to high temperatures and to deposition/clean reactions, and an
outer portion comprised of a material resistant to cracking. The
inner portion of the liner insulates the chamber walls to reduce
the wafer edge cooling effects which might otherwise adversely
affect deposited film uniformity. The outer portion of the chamber
liner is substantially thicker than the inner portion to bridge the
gap between the wafer and the walls, while minimizing cracking
which might otherwise occur with a single, relatively thick ceramic
liner. In an exemplary embodiment, the outer portion of the liner
includes air gaps to increase the insulation provided by the
liner.
[0027] In still a further aspect of the invention, a lid assembly
is provided for the enclosure assembly. The lid assembly includes a
gas mixing block (or box) coupled to one or more clean gas passages
and one or more process gas passages for receiving process and
clean gases and for delivering these gases into the chamber. One or
more valves are provided on either the clean gas passages or the
process gas passages to selectively allow gas to flow through to
the gas mixing block. This embodiment facilitates the in situ
cleaning method of the present invention by allowing the apparatus
to quickly and efficiently switch between processing and cleaning,
which increases the throughput of the system.
[0028] In an exemplary embodiment, the lid assembly further
includes a base plate having a gas inlet for receiving one or more
gases and a gas distribution plate including a plurality of holes
for dispersing the gases into the processing chamber. The lid
assembly includes one or more bypass passages in the base plate
that offer less resistance to fluid flow than the gas distribution
holes. During cleaning, for example, at least a portion of the
cleaning gases will pass through the bypass passages directly into
the chamber to increase the speed of the cleaning process, thereby
decreasing the down time of the chamber. The apparatus preferably
includes a control system, such as a valve and a controller, for
partially or completely closing the bypass passages to control the
gas flow through the gas distribution holes.
[0029] These and other embodiments of the present invention, as
well as its advantages and features, are described in more detail
in conjunction with the text below and attached figures.
BRIEF DESCRIPTION OF THE DRAWINGS
[0030] FIG. 1A is a vertical, cross-sectional view of a CVD
apparatus according to the present invention;
[0031] FIG. 1B is a simplified diagram of the system monitor and
CVD apparatus 10 in a multichamber system;
[0032] FIG. 1C illustrates a general overview of CVD apparatus 10
in relation to a gas supply panel 80 located in a clean room;
[0033] FIG. 1D is an illustrative block diagram of the hierarchical
control structure of the system control software, computer program
150, according to a specific embodiment;
[0034] FIG. 1E is a block diagram of an exemplary heater control
subroutine;
[0035] FIG. 2 is an exploded view of a preferred embodiment of CVD
apparatus 10 according to the present invention;
[0036] FIG. 3 is a vertical cross-section, partly in schematic,
taken along line 3-3 in FIG. 2;
[0037] FIG. 4 is an enlarged cross-section of a semiconductor
processing chamber of the apparatus of FIG. 2;
[0038] FIG. 5 is an exploded view of a gas distribution system for
the apparatus of FIG. 2;
[0039] FIG. 6A is a top, partially cut-away view of a lid assembly
of CVD apparatus 10, illustrating portions of the gas distribution
systems;
[0040] FIGS. 6B and 6C illustrate a front cross-section and a top
view, respectively, of an alternative lid assembly for CVD
apparatus 10, incorporating a bypass conduit for cleaning
gases;
[0041] FIGS. 7A and 7B are side cross-sectional views and bottom
views, respectively, of a chamber liner, in accordance with an
embodiment of the invention;
[0042] FIG. 8 is a partially schematic, cross-sectional view of
FIG. 3 taken along lines 8-8, illustrating the pumping channel and
the gas flow pattern in the exhaust system of the CVD apparatus 10
of FIG. 2;
[0043] FIG. 9 is a vertical cross-sectional view, partially
schematic, of a heater/lift assembly, according to an embodiment of
the invention;
[0044] FIG. 10 is an enlarged cross-sectional view of a bottom
portion of the heater/lift assembly of FIG. 9;
[0045] FIG. 11 is a side cross-sectional view of a pedestal/heater
of the assembly of FIG. 9, according to an embodiment of the
invention;
[0046] FIG. 12 is a bottom view of the pedestal/heater,
illustrating a heater coil;
[0047] FIG. 13 is an exploded view of the heater/lift assembly of
FIG. 9;
[0048] FIG. 14 is an enlarged view of one of the electrical
connections within the pedestal/heater of FIG. 10;
[0049] FIGS. 15A and 15B illustrate a hole within the
pedestal/heater for receiving a thermocouple and the thermocouple,
respectively;
[0050] FIG. 16 is a simplified diagram of a remote microwave plasma
system for cleaning the wafer and/or the process chamber, in
accordance with an embodiment of the present invention;
[0051] FIGS. 17A-17D are schematic diagrams of a cleaning endpoint
detection system in accordance with an embodiment of the present
invention;
[0052] FIG. 18 is a simplified cross-sectional view of a
semiconductor device manufactured according to an embodiment of the
present invention;
[0053] FIGS. 19A-19E are simplified cross-sectional views of an
exemplary application of the method and apparatus of the present
invention for an ultra-shallow source/drain junction;
[0054] FIGS. 20A-20G are simplified cross-sectional views of
another exemplary application of the method and apparatus of the
present invention for ultra-shallow trench isolation;
[0055] FIG. 21 illustrates the relationship between NF.sub.3 flow
and microwave saturation power that gives optimal cleaning rates
provided with remote microwave plasma system 55 in accordance with
a specific embodiment of the present invention;
[0056] FIGS. 22A-22C are graphs illustrating experimental results
showing the dopant profile of the ultra-shallow junctions formed
using capped BSG films produced according to an embodiment of the
present invention;
[0057] FIGS. 23A-23F are graphs illustrating further experimental
results showing the dopant profile and sheet resistivity of the
ultra-shallow junctions formed using different capped BSG films
according to another embodiment of the present invention;
[0058] FIG. 24A is a photomicrograph demonstrating the as-deposited
gap fill capabilities of PSG films deposited at 600.degree. C. in
accordance with a specific embodiment of the present invention;
[0059] FIG. 24B is a simplified diagram of a section of the
structure shown in FIG. 24A;
[0060] FIG. 25 illustrates the FTIR spectra of a PSG film deposited
at about 600.degree. C. under exemplary process conditions,
according to a specific embodiment;
[0061] FIGS. 26A and 26B are photomicrographs demonstrating the
relative gap fill capabilities of TEOS/O.sub.3 USG films deposited
at about 400.degree. C. and about 550.degree. C., respectively,
after heating at about 1050.degree. C. and a subsequent wet etch
processing, in accordance with a specific embodiment of the present
invention;
[0062] FIG. 27 is a photomicrograph demonstrating the gap fill
capability of a USG film deposited at about 550.degree. C. after
heating at about 1000.degree. C. and a subsequent wet etch
processing, in accordance with a specific embodiment of the present
invention; and
[0063] FIG. 28 illustrates the FTIR spectra of a USG film deposited
at about 550.degree. C. under exemplary process conditions,
according to a specific embodiment.
DETAILED DESCRIPTION OF THE SPECIFIC EMBODIMENTS
[0064] I. CVD Reactor System
[0065] A. Overview of CVD Reactor
[0066] Embodiments of the present invention are systems, methods
and apparatus used for depositing dielectric films at temperatures
greater than about 500.degree. C. In particular, such systems,
methods and apparatus may be used to deposit undoped dielectric
films and doped dielectric films. Such films may be used to form
ultra-shallow doped regions, premetal dielectric layers, intermetal
dielectric layers, capping layers, oxide filling layers, or other
layers. FIG. 1A is a vertical, cross-sectional view of one
embodiment of a CVD apparatus 10 according to a specific
embodiment. In addition to being capable of depositing dielectric
layers, the apparatus according to the present invention has high
temperature heating capabilities useful for performing reflow of
deposited dielectric layers for planarization, or for driving in
dopants from a deposited doped dielectric layer when forming
ultra-shallow doped regions. Further, the apparatus can provide
efficient cleaning of various CVD chamber components and cleaning
of wafer surfaces. CVD apparatus 10 provides these multiple
capabilities in situ in a single vacuum chamber 15. Accordingly,
multiple process steps may be performed in a single chamber without
having the wafer transferred out of that chamber into other
external chambers. This results in a lower moisture content on the
wafers by eliminating opportunities to absorb moisture from the
ambient air and, advantageously increases the dopant retention in
the deposited dielectric layer. In addition, performing multiple
process steps in a single chamber saves time, which increases the
overall throughput of the process.
[0067] Referring to FIG. 1A, CVD apparatus 10 includes an enclosure
assembly 200 housing a vacuum chamber 15 with a gas reaction area
16. A gas distribution plate 20 is provided above the gas reaction
area 16 for dispersing reactive gases through perforated holes in
plate 20 to a wafer (not shown) that rests on a vertically movable
heater 25 (also referred to as a wafer support pedestal or
susceptor). CVD apparatus 10 further includes a heater/lift
assembly 30 for heating the wafer supported on heater 25.
Heater/lift assembly 30 also can be controllably moved between a
lower loading/off-loading position and an upper processing position
indicated by dotted line 13 which is closely adjacent to plate 20,
as shown in FIG. 1A. A center board (not shown) includes sensors
for providing information on the position of the wafer. As
discussed in detail below, heater 25 includes resistively-heated
components enclosed in a ceramic, preferably aluminum nitride. In
an exemplary embodiment, all surfaces of heater 25 exposed to
vacuum chamber 15 are made of a ceramic material, such as aluminum
oxide (Al.sub.2O.sub.3 or alumina) or aluminum nitride. When heater
25 and the wafer are in processing position 13, they are surrounded
by a chamber liner 35 along the inside walls 17 of apparatus 10 and
by an annular pumping channel 40, formed by chamber liner 35 and a
top portion of chamber 15. As discussed in detail below, the
surface of chamber liner 35 preferably comprises a ceramic
material, such as alumina or aluminum nitride, which serves to
lower the temperature gradient between resistively-heated heater 25
(high temperature) and chamber walls 17, which are at a much lower
temperature relative to heater 25.
[0068] Reactive and carrier gases are supplied through supply line
43 into a gas mixing box (or gas mixing block) 273 (FIG. 5), where
they are preferably mixed together and delivered to plate 20. Gas
mixing box 273 is preferably a dual input mixing block coupled to a
process gas supply line 43 and to a cleaning gas conduit 47. As
will be discussed in detail below, a processor 50 preferably
controllably operates a gate valve 280 (FIG. 5) to choose which of
these two alternate sources of gases are sent to plate 20 for
dispersing into chamber 15. Conduit 47 receives gases from an
integral remote microwave plasma system 55, which has an inlet 57
for receiving input gases. During deposition processing, gas
supplied to plate 20 is vented toward the wafer surface (as
indicated by arrows 21), where it may be uniformly distributed
radially across the wafer surface, typically in a laminar flow.
Purging gas may be delivered into chamber 15 from an inlet port or
tube (not shown) through the bottom wall of enclosure assembly 200.
The purging gas flows upward past heater 25 and to an annular
pumping channel 40. An exhaust system then exhausts the gas (as
indicated by arrows 22) into the annular pumping channel 40 and
through an exhaust line 60 by a vacuum pump system (not shown).
Exhaust gases and residues are preferably released from annular
pumping channel 40 through exhaust line 60 at a rate controlled by
a throttle valve system 63.
[0069] In the representative embodiment, the chemical vapor
deposition process performed in CVD apparatus 10 is a thermal,
sub-atmospheric pressure process, often referred to as
sub-atmospheric CVD (SACVD). As discussed earlier, thermal CVD
processes supply reactive gases to the substrate surface where
heat-induced chemical reactions (homogeneous or heterogeneous) take
place to produce a desired film. In CVD apparatus 10, heat is
distributed by resistively-heated heater 25, as discussed in detail
below, that is capable of reaching temperatures as high as about
400-800.degree. C. Such heat distribution provides uniform, rapid
thermal heating of the wafer for effecting deposition, reflow
and/or drive-in, cleaning, and/or seasoning/gettering steps in a
multiple-step process in situ in chamber 15. Alternatively, a
controlled plasma may be formed adjacent to the wafer by RF energy
applied to gas distribution plate 20 from an RF power supply (not
shown). In embodiments additionally having a lower RF electrode,
the RF power supply can supply either single frequency RF power to
plate 20 or mixed frequency RF power to plate 20 and the lower RF
electrode to enhance the decomposition of reactive species
introduced into process chamber 15. In a plasma process, some of
the components of vapor deposition apparatus 10 would have to be
modified to accommodate the RF energy, as discussed below.
[0070] Remote microwave plasma system 55 integrally provided in CVD
apparatus 10 is preferably adapted for performing periodic cleaning
of undesired deposition residue from various components of chamber
15, including walls 17 as well as other components. Further, remote
microwave plasma system 55 can also perform cleaning or etching of
native oxides or residues from the surface of the wafer, depending
on the desired application. Although gases input via line 57 into
plasma system 55 are reactive cleaning gases for creating a plasma
to provide fluorine, chlorine, or other radicals, remote microwave
plasma system 55 also may be adapted to deposit plasma enhanced CVD
films by inputting deposition reactive gases into system 55 via
input line 57. Generally, remote microwave plasma system 55
receives gases via input line 57, which are energized by microwave
radiation to create a plasma with etching radicals which are then
sent via conduit 47 for dispersion through plate 20 to chamber 15.
Specific details of plasma system 55 will be discussed further
below. Some embodiments of apparatus 10 may also include a radio
frequency (RF) plasma system to provide in situ plasma
capability.
[0071] Motors and optical sensors (not shown) are used to move and
determine the position of movable mechanical assemblies such as
throttle valve system 63 and heater 25. The heater/lift assembly
30, motors, gate valve 280, throttle valve system 63, remote
microwave plasma system 55, and other system components are
controlled by processor 50 over control lines 65, of which only
some are shown.
[0072] Processor 50 controls all of the activities of the CVD
machine. Acting as the system controller, processor 50 executes
system control software, which is a computer program stored in a
memory 70 coupled to processor 50. Preferably, memory 70 may be a
hard disk drive, but of course memory 70 may be other kinds of
memory. In addition to a hard disk drive (e.g., memory 70), CVD
apparatus 10 in a preferred embodiment includes a floppy disk drive
and a card rack. Processor 50 operates under the control of the
system control software, which includes sets of instructions that
dictate the timing, mixture of gases, chamber pressure, chamber
temperature, microwave power levels, susceptor position, and other
parameters of a particular process. Other computer programs such as
those stored on other memory including, for example, a floppy disk
or other computer program product inserted in a disk drive or other
appropriate drive, may also be used to operate processor 50. System
control software will be discussed in detail below. The card rack
contains a single-board computer, analog and digital input/output
boards, interface boards and stepper motor controller boards.
Various parts of CVD apparatus 10 conform to the Versa Modular
European (VME) standard which defines board, card cage, and
connector dimensions and types. The VME standard also defines the
bus structure having a 16-bit data bus and 24-bit address bus.
[0073] The interface between a user and processor 50 is via a CRT
monitor 73a and light pen 73b, shown in FIG. 1B which is a
simplified diagram of the system monitor and CVD apparatus 10,
illustrated as one of the chambers in a multichamber system. CVD
apparatus 10 is preferably attached to a mainframe unit 75 which
contains and provides electrical, plumbing and other support
functions for the apparatus 10. Exemplary mainframe units
compatible with the illustrative embodiment of CVD apparatus 10 are
currently commercially available as the Precision 5000.TM. and the
Centura 5200.TM. systems from Applied Materials, Inc. of Santa
Clara, Calif. The multichamber system has the capability to
transfer a wafer between its chambers without breaking the vacuum
and without having to expose the wafer to moisture or other
contaminants outside the multichamber system. An advantage of the
multichamber system is that different chambers in the multichamber
system may be used for different purposes in the entire process.
For example, one chamber may be used for deposition of oxides,
another may be used for rapid thermal processing, and yet another
may be used for oxide cleaning. The process may proceed
uninterrupted within the multichamber system, thereby preventing
contamination of wafers that often occurs when transferring wafers
between various separate individual chambers (not in a multichamber
system) for different parts of a process.
[0074] In the preferred embodiment two monitors 73a are used, one
mounted in the clean room wall for the operators and the other
behind the wall for the service technicians. Both monitors 73a
simultaneously display the same information, but only one light pen
73b is enabled. The light pen 73b detects light emitted by CRT
display with a light sensor in the tip of the pen. To select a
particular screen or function, the operator touches a designated
area of the display screen and pushes the button on the pen 73b.
The touched area changes its highlighted color, or a new menu or
screen is displayed, confirming communication between the light pen
and the display screen. Of course, other devices, such as a
keyboard, mouse, or other pointing or communication device, may be
used instead of or in addition to light pen 73b to allow the user
to communicate with processor 50.
[0075] FIG. 1C illustrates a general overview of CVD apparatus 10
in relation to a gas supply panel 80 located in a clean room. As
discussed above, CVD apparatus 10 includes chamber 15 with heater
25, gas mixing box 273 with inputs from supply line 43 and conduit
47, and remote microwave plasma system 55 with input line 57. As
mentioned above, gas mixing box 273 is for mixing and injecting
deposition gas(es) and clean gas(es) or other gas(es) through inlet
tube 43 to the processing chamber 15. As seen in FIG. 1C, remote
microwave plasma system 55 is integrally located and mounted below
chamber 15 with conduit 47 coming up alongside chamber 15 to gate
valve 280 and gas mixing box 273, located above chamber 15.
Similarly, gas supply line 43, which comes up alongside chamber 15
to gas mixing box 273, is provided with reactive gases via lines 83
and 85 from gas supply panel 80. Gas supply panel 80 includes lines
to gas or liquid supply sources 90, containing gases or liquids
that may vary depending on the desired processes used for a
particular application. Gas supply panel 80 has a mixing system 93
which receives the deposition process and carrier gases (or
vaporized liquids) from sources 90 for mixing and sending to gas
mixing box 273 via line 85 to supply line 43. Generally, supply
lines for each of the process gases include (i) shut-off valves 95
that can be used to automatically or manually shut off the flow of
process gas into line 85 or line 57, and (ii) mass flow controllers
100 that measure the flow of gas or liquid through the supply
lines. When toxic gases (for example, ozone and the clean gas) are
used in the process, the several shut-off valves 95 may be
positioned on each gas supply line in conventional configurations.
The rate at which the deposition and carrier gases including, for
example, tetraethylorthosilane (TEOS), helium (He), and nitrogen
(N.sub.2), and optionally triethylphosphate (TEPO), triethylborate
(TEB), and/or other dopant sources, are supplied to gas mixing
system 93 is also controlled by liquid or gas mass flow controllers
(MFCs) (not shown) and/or by valves (not shown). In some
embodiments, gas mixing system 93 includes a liquid injection
system for vaporizing reactant liquids such as TEOS and TEPO.
According to these embodiments, a mixture including TEPO as the
phosphorus source, TEOS as the silicon source, and one or more
gaseous oxygen sources, such as oxygen (O.sub.2) or ozone
(O.sub.3), may be formed with gas mixing system 93. The TEPO and
TEOS are all liquid sources that also may be vaporized by
conventional boiler-type or bubblertype hot boxes in other
embodiments. A liquid injection system is preferred as it provides
greater control of the volume of reactant liquid introduced into
the gas mixing system. The vaporized gases are then mixed in the
gas mixing system with a carrier gas, such as helium, before being
delivered to heated line 85. Of course, it is recognized that other
sources of dopants, silicon, and oxygen also may be used.
[0076] Additionally, gas supply panel 80 includes switching valve
95, which under the control of processor 50, can selectively send
the clean gas with N.sub.2 along process gas line 83 to gas supply
line 43 or along clean gas line 57 to remote microwave plasma
system 55. When processor 50 causes switching valve 95 to send the
clean gas with N.sub.2 via input line 57 to plasma system 55, a
plasma remote from chamber 15 is formed due to application of
microwave energy and cleaning radicals are produced for transfer to
gas conduit 47. Processor 50 can also cause another valve 96 to
send ozone through line 83 to gas supply line 43 and to send the
deposition and carrier gases from gas mixing system 93 through
heated line 85 to gas supply line 43. In alternative embodiments,
valve 95 is connected at its output only to line 97 and selectively
allows clean gas and N.sub.2 to pass through line 97 to a switching
valve 105 (not shown). Located at a point close to inlet 57 and
remote system 55, switching valve 105 in these embodiments would be
connected to inlet 57 to remote microwave system 55 and also to
line 83 leading to inlet 43. In specific embodiments, gate valve
280 may be controlled by processor 50, with instructions from the
system software computer program, to select either the clean gases
or the deposition gases to flow into chamber 15.
[0077] Located remote from the clean room where chamber 15 of
apparatus 10 is located are a microwave power supply 110 and
ozonator 115. Power supply 110 provides power to the magnetron in
remote plasma system 55. Ozonator 115, applies power to oxygen
(O.sub.2) which is used as input to provide ozone (O.sub.3) as
output for use as at least one of the sources 90. In other
embodiments, power supply 110 and ozonator 115 may be located in
the clean room rather than being remotely located. Further, in
multichamber systems requiring multiple ozone sources and/or
multiple remote microwave plasma systems 55, multiple ozonators 115
and multiple power supplies 110 may be provided.
[0078] The processes for depositing the film, performing a clean,
and performing reflow or drive-in steps can be implemented using a
computer program product that is executed by processor 50. The
computer program code can be written in any conventional computer
readable programming language such as, for example, 68000 assembly
language, C, C++, Pascal, Fortran, or other language. Suitable
program code is entered into a single file, or multiple files,
using a conventional text editor and is stored or embodied in a
computer-usable medium, such as a memory system of the computer. If
the entered code text is in a high-level language, the code is
compiled, and the resultant compiler code is then linked with an
object code of precompiled Windows library routines. To execute the
linked compiled object code, the system user invokes the object
code, causing the computer system to load the code in memory, from
which the CPU reads and executes the code to perform the tasks
identified in the program.
[0079] FIG. 1D is an illustrative block diagram of the hierarchical
control structure of the system control software, computer program
150, according to a specific embodiment. Using a light pen
interface, a user enters a process set number and process chamber
number into a process selector subroutine 153 in response to menus
or screens displayed on the CRT monitor. The process sets, which
are predetermined sets of process parameters necessary to carry out
specified processes, are identified by predefined set numbers.
Process selector subroutine 153 identifies (i) the desired process
chamber, and (ii) the desired set of process parameters needed to
operate the process chamber for performing the desired process. The
process parameters for performing a specific process relate to
process conditions such as, for example, process gas composition
and flow rates, temperature, pressure, plasma conditions such as
magnetron power levels (and alternatively to or in addition to
high- and low-frequency RF power levels and the low-frequency RF
frequency, for embodiments equipped with RF plasma systems),
cooling gas pressure, and chamber wall temperature. Process
selector subroutine 153 controls what type of process (deposition,
wafer cleaning, chamber cleaning, chamber gettering, reflowing) is
performed at a certain time in chamber 15. In some embodiments,
there may be more than one process selector subroutine. The process
parameters are provided to the user in the form of a recipe and may
be entered utilizing the light pen/CRT monitor interface.
[0080] The signals for monitoring the process are provided by the
analog input board and digital input board of the system
controller, and the signals for controlling the process are output
on the analog output board and digital output board of CVD system
10.
[0081] A process sequencer subroutine 155 comprises program code
for accepting the identified process chamber and set of process
parameters from process selector subroutine 153, and for
controlling operation of the various process chambers. Multiple
users can enter process set numbers and process chamber numbers, or
a single user can enter multiple process set numbers and process
chamber numbers, so sequencer subroutine 155 operates to schedule
the selected processes in the desired sequence. Preferably,
sequencer subroutine 155 includes program code to perform the steps
of (i) monitoring the operation of the process chambers to
determine if the chambers are being used, (ii) determining what
processes are being carried out in the chambers being used, and
(iii) executing the desired process based on availability of a
process chamber and the type of process to be carried out.
Conventional methods of monitoring the process chambers can be
used, such as polling. When scheduling which process is to be
executed, sequencer subroutine 155 can be designed to take into
consideration the present condition of the process chamber being
used in comparison with the desired process conditions for a
selected process, or the "age" of each particular user-entered
request, or any other relevant factor a system programmer desires
to include for determining scheduling priorities.
[0082] Once sequencer subroutine 155 determines which process
chamber and process set combination is going to be executed next,
the sequencer subroutine 155 initiates execution of the process set
by passing the particular process set parameters to a chamber
manager subroutine 157a-c which controls multiple processing tasks
in a process chamber 15 according to the process set determined by
sequencer subroutine 155. For example, the chamber manager
subroutine 157a comprises program code for controlling CVD and
cleaning process operations in process chamber 15. Chamber manager
subroutine 157 also controls execution of various chamber component
subroutines which control operation of the chamber components
necessary to carry out the selected process set. Examples of
chamber component subroutines are substrate positioning subroutine
160, process gas control subroutine 163, pressure control
subroutine 165, heater control subroutine 167, plasma control
subroutine 170, endpoint detect control subroutine 159, and
gettering control subroutine 169. Depending on the specific
configuration of the CVD chamber, some embodiments include all of
the above subroutines, while other embodiments may include only
some of the subroutines. Those having ordinary skill in the art
would readily recognize that other chamber control subroutines can
be included depending on what processes are to be performed in
process chamber 15. In operation, chamber manager subroutine 157a
selectively schedules or calls the process component subroutines in
accordance with the particular process set being executed. Chamber
manager subroutine 157a schedules the process component subroutines
much like sequencer subroutine 155 schedules which process chamber
15 and process set are to be executed next. Typically, chamber
manager subroutine 157a includes steps of monitoring the various
chamber components, determining which components need to be
operated based on the process parameters for the process set to be
executed, and initiating execution of a chamber component
subroutine responsive to the monitoring and determining steps.
[0083] Operation of particular chamber component subroutines will
now be described with reference to FIG. 1D. Substrate positioning
subroutine 160 comprises program code for controlling chamber
components that are used to load the substrate onto heater 25 and,
optionally, to lift the substrate to a desired height in chamber 15
to control the spacing between the substrate and gas distribution
manifold 20. When a substrate is loaded into process chamber 15,
heater 25 is lowered to receive the substrate and then heater 25 is
raised to the desired height. In operation, substrate positioning
subroutine 160 controls movement of heater 25 in response to
process set parameters related to the support height that are
transferred from chamber manager subroutine 157a.
[0084] Process gas control subroutine 163 has program code for
controlling process gas composition and flow rates. Process gas
control subroutine 163 controls the open/close position of the
safety shut-off valves, and also ramps up/down the mass flow
controllers to obtain the desired gas flow rate. Process gas
control subroutine 163 is invoked by the chamber manager subroutine
157a, as are all chamber component subroutines, and receives
subroutine process parameters related to the desired gas flow rates
from the chamber manager. Typically, process gas control subroutine
163 operates by opening the gas supply lines and repeatedly (i)
reading the necessary mass flow controllers, (ii) comparing the
readings to the desired flow rates received from chamber manager
subroutine 157a, and (iii) adjusting the flow rates of the gas
supply lines as necessary. Furthermore, process gas control
subroutine 163 includes steps for monitoring the gas flow rates for
unsafe rates, and activating the safety shut-off valves when an
unsafe condition is detected. Process gas control subroutine 163
also controls the gas composition and flow rates for clean gases as
well as for deposition gases, depending on the desired process
(clean or deposition or other) that is selected. Alternative
embodiments could have more than one process gas control subroutine
613, each subroutine 613 controlling a specific type of process or
specific sets of gas lines.
[0085] In some processes, an inert gas such as nitrogen or argon is
flowed into chamber 15 to stabilize the pressure in the chamber
before reactive process gases are introduced. For these processes,
process gas control subroutine 163 is programmed to include steps
for flowing the inert gas into chamber 15 for an amount of time
necessary to stabilize the pressure in the chamber, and then the
steps described above would be carried out. Additionally, when a
process gas is to be vaporized from a liquid precursor, for example
TEOS, process gas control subroutine 163 would be written to
include steps for bubbling a delivery gas such as helium through
the liquid precursor in a bubbler assembly, or introducing a
carrier gas such as helium to a liquid injection system. When a
bubbler is used for this type of process, process gas control
subroutine 163 regulates the flow of the delivery gas, the pressure
in the bubbler, and the bubbler temperature in order to obtain the
desired process gas flow rates. As discussed above, the desired
process gas flow rates are transferred to process gas control
subroutine 163 as process parameters. Furthermore, process gas
control subroutine 163 includes steps for obtaining the necessary
delivery gas flow rate, bubbler pressure, and bubbler temperature
for the desired process gas flow rate by accessing a stored table
containing the necessary values for a given process gas flow rate.
Once the necessary values are obtained, the delivery gas flow rate,
bubbler pressure and bubbler temperature are monitored, compared to
the necessary values and adjusted accordingly.
[0086] The pressure control subroutine 165 comprises program code
for controlling the pressure in the chamber 15 by regulating the
aperture size of the throttle valve in the exhaust system of the
chamber. The aperture size of the throttle valve is set to control
the chamber pressure at a desired level in relation to the total
process gas flow, the size of the process chamber, and the pumping
set-point pressure for the exhaust system. When pressure control
subroutine 165 is invoked, the desired or target pressure level is
received as a parameter from chamber manager subroutine 157a. The
pressure control subroutine 165 measures the pressure in chamber 15
by reading one or more conventional pressure nanometers connected
to the chamber, compares the measure value(s) to the target
pressure, obtains PID (proportional, integral, and differential)
values corresponding to the target pressure from a stored pressure
table, and adjusts the throttle valve according to the PID values
obtained from the pressure table. Alternatively, pressure control
subroutine 165 can be written to open or close the throttle valve
to a particular aperture size to regulate the pressure in chamber
15 to the desired level.
[0087] Heater control subroutine 167 comprises program code for
controlling the temperature of a heater element 473 used to
resistively heat heater 25 (and any substrate thereon). Referring
to FIG. 1E, heater control subroutine 167, which is also invoked by
chamber manager subroutine 157a, receives a desired
target/set-point temperature parameter, T.sub.des, as an input
(step 580). In step 582, heater control subroutine 167 measures the
current temperature of heater 25 by measuring voltage output of a
thermocouple located in heater 25. The current temperature is
denoted T(k), where k is the current time step of heater control
subroutine 167. The controller obtains the temperature T(k) from
the thermocouple voltage by looking up the corresponding
temperature in a stored conversion table or by calculating the
temperature using a fourth-order polynomial. In an exemplary
embodiment, heater control subroutine 167 in step 584 calculates
the temperature error. The temperature error, denoted Err.sub.temp,
is determined by the equation Err.sub.temp(k)=T.sub.des-T(k).
[0088] In step 584, heater control subroutine 167 will select one
of two control algorithms based on the absolute value of
Err.sub.temp(k). If the absolute value of the temperature error is
smaller than a predetermined boundary error, the heater control
subroutine will select a temperature regulator algorithm (steps 586
and 588). This algorithm precisely controls the temperature at the
desired temperature, T.sub.des. If the absolute value of the
temperature error is greater than the boundary error, heater
control subroutine 167 will select a temperature ramp control
algorithm (step 590). This algorithm controls the rate at which the
heater temperature will approach the desired temperature,
T.sub.des, i.e., it controls the rate at which the temperature
changes.
[0089] The temperature regulator algorithm (steps 586 and 588) uses
feedback and feedforward control to update the power delivered to
the heating element embedded in heater 25 so as to maintain the
current temperature, T(k), as close to T.sub.des as possible. The
feedforward control in this algorithm estimates the amount of power
necessary to maintain the desired temperature given the amount and
type of gas flow and RF power supplied to the chamber. The feedback
control uses standard Proportional-Integral-Derivative (PID)
control terms to adjust the estimated feedforward power based on
the dynamic behavior of the temperature error, Err.sub.temp(k). PID
control is the type of algorithm used in conventional heater
control systems without regard to the value of the temperature
error. If these routines seek to control the temperature ramp rate,
they will define a time-varying T.sub.des(k) and then employ the
PID controller described above to track this desired temperature
trajectory.
[0090] In the present invention, heater control subroutine 167
preferably employs the temperature ramp control algorithm (steps
590) to control power to heater 25 when the absolute value of
temperature error is greater than the boundary error. This
algorithm controls T'(k), which is the rate of change of the
temperature, T(k), at time step k. The rate of change of
temperature should be controlled because the heater 25 can be made
of a ceramic material, which may fracture from thermal shock if the
temperature changes too quickly. The ramp control algorithm uses
feedforward and Proportional feedback control to control T'(k) to a
predetermined desired ramp rate function, T'.sub.des(T). The
desired ramp rate is mainly a function of the temperature of the
heater and is based on the thermal shock resistance of the heater
25 at various temperatures. Thus, the desired ramp rate may
continuously change based on the current measured temperature of
the heater, or it may be set at a constant based on a minimum rate
that is low enough to avoid thermal shock within the range of
temperatures of a particular process. The control algorithm also
employs a saturation function on the rate of change of power
supplied to the heater to damp the system response, which reduces
oscillations in ramp rate.
[0091] Controllers that attempt to regulate ramp rate by tracking a
timed temperature trajectory at best can only guarantee that a
desired temperature, T.sub.des(K), will be achieved at some time K
in the future. The average ramp rate over the time interval of
length K will be T'.sub.des. However, the instantaneous rate of
change of temperature T'(k) may vary widely during that interval.
Consider the case in which a disturbance causes the temperature to
remain stable for some interval of time less than K. The controller
will then attempt to as quickly as possible "catch up" to the
desired trajectory T.sub.des(k). The ramp rate for the time
interval during which the controller is catching up will be greater
than T'.sub.des. That scenario could result in thermal shock
fracture. By controlling the ramp rate directly, the current
invention avoids this potential scenario.
[0092] Referring to FIG. 1E, an exemplary ramp control algorithm
will now be described. After the desired temperature, T.sub.des is
input (step 580), the current temperature T(k) is measured (step
582), and the temperature error is determined (step 584), the ramp
control algorithm calculates the actual ramp rate T'(k) using a
numerical differentiation technique. It also determines the desired
ramp rate, T'.sub.des(T(k)), based on the current value of T(k),
and the error in ramp rate, Err.sub.rrate=T'.sub.des(T(k))-T'(k)
(steps 592 and 594). The actual ramp rate T'(k) is calculated from
measured temperature T(k) over a range of temperature measurement
samples. In general, T'.sub.des(T(k)) may be any continuous
function of temperature in various embodiments. In the specific
embodiment, T'.sub.des(T(k)) is set to be a predetermined constant
value. The calculated ramp rate T'(k) is determined by sampling
(i.e., measuring) the temperature at a predetermined sample rate
(e.g., 10 times in a power update period, 1 second, in the specific
embodiment). Then, an average of the 10 samples is calculated and
compared to the average of the previous 10 samples. The difference
between the averages of the first 10 measured temperatures and the
previous 10 measured temperatures is then divided by the power
update period to obtain an average measured temperature. The
derivative of the average measured temperature is then calculated
to arrive at the calculated ramp rate T'(k). The ramp rate error
Err.sub.RRate may then determined by taking the difference between
the constant-valued T'.sub.des(T(k)) and the calculated ramp rate
T'(k) in the specific embodiment (step 594). The above embodiment
is an example of one numerical differentiation technique that may
be used, but other techniques that may be more sophisticated also
can be used in other embodiments. In other embodiments, other
sample rates also may be used.
[0093] To elaborate on step 596, an exemplary control function used
in the specific embodiment is given by the following equation:
P(k+1)=P.sub.model[T(k),T'.sub.des(T(k))]+K.sub.p*[T'.sub.des(T(k))-T'(k)]
[0094] where k is the current time step and k+1 is the next time
step. P(k+1) is the power that will be supplied to the heater at
the next time step. P.sub.model[T(k), T'.sub.des(T(k))], which is a
function of the desired ramp rate and measured temperature, is some
modeled approximation of the necessary power to give a ramp rate of
T'.sub.des(T(k)) at a temperature T(k). K.sub.p is a control gain
constant (in Watts/(.degree. C./second)) that is user-defined and
multiplied with the ramp rate error Err.sub.RRate. In the specific
embodiment, P.sub.model[T(k),T'.sub.des(T(- k))] can be
approximated as P(k). This approximation is particularly true for
slow systems such as the resistive heater with large thermal mass
of the present invention. The control function is then approximated
by the following equations:
P(k+1)=P(k)+K.sub.p*[T'.sub.des(T(k))-T'(k)]
P(k+1)-P(k)=K.sub.p*[T'.sub.des(T(k)-T'(k)].
[0095] Because the response of the heater is slow, there is a lag
between the time power is adjusted and the time when the adjustment
produces the desired result. For example, if the temperature of the
heater is stable and the desired ramp rate is positive, the control
will increase power to the heater. The temperature will not,
however, immediately rise according to the desired ramp rate. The
control will then at the next time step further increase power. It
will continue to increase power until the desired ramp rate is met.
By that time, however, the supplied power could be much greater
than that needed to maintain the desired ramp rate. The ramp rate
will continue to increase beyond its desired value. This is called
overshoot. The controller will react by reducing power, and slowly
the ramp rate will decrease. Once again, the controller can act
faster than the heater, so it will reduce power too much and the
ramp rate will decrease beyond its desired value. This is
oscillation. Over time, the magnitude of the oscillations will
decrease and the ramp rate will reach a constant, steady-state
value. Because all real systems undergo small disturbances, there
will also be a small steady-state error.
[0096] The value of K.sub.p determines the size of the overshoot
and the steady-state error. If K.sub.p is large, the system will be
more oscillatory, but steady-state error will be small. If K.sub.p
is small, the opposite is true. Typically, K.sub.p can be large
because Derivative control can be used to damp the system's
response, i.e. reduce overshoot and oscillation. Steady-state error
can be reduced by using Integral control, but this tends to
increase overshoot and oscillation and is preferably avoided in
this control algorithm. In this case, derivative control is not
available. It would require numerically calculating the second
derivative of the temperature. Because the signal-to-noise ratio of
the thermocouple signal is low, its second derivative can not be
calculated reliably. Therefore, the present invention uses a large
K.sub.p to reduce steady-state error and a saturation function
(step 598) instead of derivative control to dampen the system
response. The saturation function effectively schedules the gain
K.sub.p such that K.sub.p is inversely proportional to the ramp
rate error, Err.sub.RRate. During the transient portion of the
system response, when errors are larger and overshoot can occur,
the effective gain is small. In steady-state, errors are small, so
the effective K.sub.p is large.
[0097] The exemplary saturation function used to dampen system
response is given by the following equations (step 598). For these
equations, P(k+1) refers to the power defined by the control
equation given above. P.sub.1(k+1) is the actual power supplied to
the heater. P'.sub.max is the predetermined maximum allowable
change in supplied power from one time step to the next. The
exemplary saturation function is as follows:
[0098] if .vertline.P(k+1)-P(k).vertline.>P'.sub.max,
[0099] then P.sub.1(k+1)=P(k)-P'.sub.max for P(k+1)>P(k)
[0100] and P.sub.1(k+1)=P(k)-P'.sub.max for P(k+1)<P(k)
[0101] else P.sub.1(k+1)=P(k+1)
[0102] A new term K.sub.peff(k) can now be defined as the effective
gain of the controller at time step k. Clearly, if
P.sub.1(k+1)=P(k+1) the effective gain at time k equals the gain
K.sub.p. But if the saturation function is applied, K.sub.peff(k)
is defined by substituting P(k+1) for P.sub.1(k+1) in the equations
above and combining them with the equation:
P(k+1)=P.sub.model[T(k),T'.sub.des(T(k))]+K.sub.p*[T'.sub.des(T(k))-T'(k)-
]. The term K.sub.peff(k) is as follows:
P'.sub.max=K.sub.peff(k)*Err.sub.RRate(k);
K.sub.peff(k)=P'.sub.max/Err.sub.RRate(k).
[0103] By making the effective gain small when the ramp rate error
is large, overshoot and oscillation in the response are minimized
by this saturation function. This reduces the likelihood of damage
to the heater from poor ramp rate control. Accordingly, the ramp
control algorithm of heater control subroutine 167 dampens the
system's response when large ramp rate errors occur, thereby
resulting in more efficient temperature control.
[0104] A plasma control subroutine 170 comprises program code for
setting the magnetron power levels and mode (CW or pulsed). In
alternative embodiments having RF plasma systems, plasma control
subroutine 170 also could include program code for setting low- and
high-frequency RF power levels applied to the process electrodes in
chamber 15, and for setting the low-frequency RF frequency
employed. Of course, some embodiments may have one plasma control
subroutine 170 used for microwave power levels and another plasma
control subroutine 170 used for RF power levels. Like the
previously described chamber component subroutines, plasma control
subroutine 170 is invoked by chamber manager subroutine 157a.
[0105] A plasma control subroutine 170 comprises program code for
setting and adjusting the magnetron power levels and mode (CW or
pulsed). In alternative embodiments having RF plasma systems,
plasma control subroutine 170 also could include program code for
setting low- and high-frequency RF power levels applied to the
process electrodes in chamber 15, and for setting the low-frequency
RF frequency employed. Of course, some embodiments may have one
plasma control subroutine 170 used for microwave power levels and
another plasma control subroutine 170 used for RF power levels.
Like the previously described chamber component subroutines, plasma
control subroutine 170 is invoked by chamber manager subroutine
157a. In embodiments having gate valve 280, plasma control
subroutine 170 also includes program code for opening and closing
of gate valve 280 to coordinate with the setting/adjusting of
microwave power levels. Alternatively, the system software may have
a separate gate valve control subroutine in embodiments having gate
valve 280.
[0106] An endpoint detect control subroutine 159 includes program
code for managing endpoint detection by controlling a light source
and a light detector, receiving data from the light detector for
use in comparing light intensity changes from absorbance, and
optionally stopping the cleaning process upon detecting a
predetermined light intensity level or raising a flag indicating
the endpoint of the cleaning process. Endpoint detect control
subroutine 159 also may be invoked by chamber manager subroutine
157a. Endpoint detect control subroutine 159 is included for those
embodiments using the endpoint detection system described below. It
is recognized that embodiments not having an endpoint detection
system would not need to use or have endpoint detect control
subroutine 159.
[0107] Optionally, a gettering control subroutine 169 may be
included that can be invoked by chamber manager subroutine 157a.
Gettering control subroutine 169 includes program code for
controlling gettering processes that may be used for chamber
seasoning, post-clean fluorine gettering, etc. In some embodiments,
gettering control subroutine 169 can invoke specified software
built into the clean recipe to facilitate gettering control in
combination with the clean recipe used.
[0108] The CVD system description presented above is mainly for
general illustrative purposes and should not be considered as
limiting the scope of the present invention. The exemplary CVD
system 10 is a single-wafer vacuum chamber system. However, other
CVD systems that are multiple-wafer chamber systems may be used in
other embodiments of the invention. It should be understood,
however, that although certain features of the invention are shown
and described as part of a CVD chamber in a multichamber processing
system, the invention is not necessarily intended to be limited in
this manner. That is, the invention can be used in a variety of
processing chambers, such as etch chambers, diffusion chambers or
the like. Variations of the above described system such as
variations in design, heater design, location of RF power
connections, software operation and structure, specific algorithms
used in some software subroutines, configuration of gas inlet lines
and valves, and other modifications are possible. Additionally,
other plasma CVD equipment such as electron cyclotron resonance
(ECR) plasma CVD devices, induction coupled RF high density plasma
CVD devices, or the like may be employed. The dielectric layers and
methods for forming such layers for use in the present invention
should not necessarily be limited to any specific apparatus or to
any specific plasma excitation method.
[0109] As shown in FIGS. 2 and 3, CVD apparatus 10 generally
includes an enclosure assembly 200 having vertically movable heater
(wafer support pedestal or susceptor) 25 for supporting a
semiconductor wafer within a vacuum chamber 15. Process gas(es) are
delivered into chamber 15 to perform various deposition and etching
steps on the wafer. A gas distribution system 205 (FIGS. 2-6)
distributes process gases from gas sources 90 (FIG. 1C) onto the
wafer, and an exhaust system 210 (FIGS. 2-4) discharges the process
gases and other residue from chamber 15. CVD apparatus 10 further
includes a heater/lift assembly 30 (FIGS. 1A, 9-15) that includes
heater 25 for heating the wafer and for lifting the wafer upwards
into a processing position within chamber 15. An integral remote
microwave plasma system 55 (FIGS. 1A and 16) is also provided in
CVD apparatus 10 for periodic chamber cleaning, wafer cleaning, or
depositing steps.
[0110] As shown in FIG. 2, CVD apparatus 10 further includes a
liquid cooling system 215 for delivering coolant to various
components of the chamber 15 to cool these components during the
high temperature processing. Liquid cooling system 215 acts to
decrease the temperature of these chamber components to minimize
undesired deposition onto these components due to the high
temperature processes. Liquid cooling system 215 includes a pair of
water connections 217, 219 that supply cooling water through the
heater/lift assembly 30 and a coolant manifold (not shown) for
delivering coolant to the gas distribution system 205 (discussed
below). A waterflow detector 220 detects the waterflow from a heat
exchanger (not shown) to enclosure assembly 200. Preferred
embodiments of the individual systems of apparatus 10 will be
described in further detail below.
[0111] A. Enclosure Assembly
[0112] Referring to FIGS. 2 and 6, enclosure assembly 200 is
preferably an integral housing made from a process-compatible
material, such as aluminum or anodized aluminum. Enclosure assembly
200 includes an outer lid assembly 225 for delivering process and
clean gases through an inlet tube 43 to an inner lid assembly 230
within assembly 200. Inner lid assembly 230 functions to disperse
the gases throughout chamber 15 onto a wafer (not shown) supported
on heater 25. As shown in FIG. 2, a lid cover 233 provides access
to the components on the top of enclosure assembly 200 (i.e., outer
lid assembly 32), and shields the operator from exposure to high
temperatures during system operation. For SACVD processes, lid
cover 233 preferably includes a cutout 235 to allow clearance for
lid clamps 237 that ensure gas integrity of the chamber 16. Lid
cover 233 generally remains closed during most process steps unless
the chamber is opened, for example, to perform a preventive
maintenance chamber cleaning, thereby breaking the vacuum and
bringing the chamber to atmospheric pressure. A lid hinge 239
includes a locking ratchet mechanism 241 to prevent the lid cover
233 from falling closed.
[0113] As shown in FIG. 2, enclosure assembly 200 defines a vacuum
lock door (not shown) and a slit valve opening 243 through which a
wafer loading assembly (not shown) transports a wafer W into
process chamber 16 and loads wafer W onto heater 25. The wafer
loading assembly is preferably a conventional robotic mechanism
disposed within a transfer chamber (not shown) of the multichamber
processing system. A suitable robotic transfer assembly is
described in commonly assigned U.S. Pat. No. 4,951,601 to Maydan,
the complete disclosure of which is incorporated herein by
reference.
[0114] Referring to FIGS. 3, 4, 7A and 7B, the inside wall 245 of
enclosure assembly 200 around chamber 15 is covered with a chamber
liner 250, which rests on a shelf 252 of enclosure assembly 200.
Chamber liner 250 serves to inhibit process gases from flowing to
the back side of the wafer. In addition, since heater 25 has a
smaller diameter than enclosure assembly 200, liner 250 inhibits
the flow of process gases below heater 25 to the lower portion of
chamber 15. Accordingly, undesired deposition onto the bottom of
heater 25 and the lower portion of chamber 15 is minimized.
Further, liner 250 provides thermal insulation between the aluminum
walls of enclosure assembly 200 and the edge of the wafer on heater
25, in order to prevent wafer edge cooling during high temperature
processing. During high temperature processing, liner 250 prevents
excessive heat loss from the hotter edges of the wafer on heater 25
(e.g., about 550-600.degree. C.) to the cooler surrounding chamber
walls (e.g., about 60.degree. C.). Without liner 250, the heat
effects at the edge of the wafer may adversely affect temperature
uniformity across the wafer and lead to non-uniform deposition.
Liner 250 preferably comprises an inner portion 253 formed of a
process-compatible material that is well suited for high
temperature processes (e.g., greater than about 500.degree. C.).
Preferably, inner portion 253 of liner 250 comprises a ceramic
material, such as aluminum nitride, alumina, or the like, with
alumina being the preferred material. Inner portion 253 will
usually have a thickness of about 0.1 to 1 inch and preferably
about 0.2 to 0.3 inch.
[0115] Liner 250 preferably comprises an outer portion 255 that
comprises a material that is less susceptible to cracking than
ceramic, such as aluminum. Outer portion 255 rests on shelf 252 of
enclosure assembly, and includes an annular lip 254 for supporting
inner portion 253 of liner 250. In a particularly preferred
embodiment, outer portion 255 includes a plurality of
circumferentially spaced vertical struts 257 that define inner air
gaps 259 therebetween, as shown in FIGS. 7A and 7B. Air gaps 259
facilitate insulation of the inner portion 253 of liner 250 from
the outer chamber walls to increase wafer temperature uniformity
(otherwise the outer edge of the wafer could cool down due to the
surrounding chamber wall temperature, which is cool relative to the
heater and wafer temperature). In addition, air gaps 259 provide
thickness to liner 250 so that it can bridge the gap between the
outer chamber walls and heater 25 while minimizing the cracking or
other thermal damage that may occur with a thicker liner 250. Outer
portion 255 of liner 250 usually has a thickness of about 0.5 to 2
inches with an air gap 259 thickness of about 0.2 to 1.5 inches,,
and preferably about 0.9 to 1. 1 inch with an air gap 259 thickness
of about 0.6 to 0.9 inch. An annular cover 261 is positioned on the
upper surface of outer liner 255 to form the lower wall of a
pumping channel 40 (discussed below). Annular cover 262 preferably
comprises a ceramic material, such as aluminum oxide or aluminum
nitride, to shield the aluminum outer portion 255 of liner 250 from
process gases and the heat within pumping channel 40.
[0116] In an alternative embodiment (not shown), liner 250 only
comprises inner ceramic portion 255 resting on shelf 252 of
enclosure assembly and annular cover 261 forming the bottom of
pumping channel 40. In this embodiment, outer portion 255 is
replaced with an air gap (not shown) between ceramic portion 255
and the inside wall of enclosure assembly. The air gap insulates
the high temperature wafer from the cooler walls of the enclosure
assembly, and it provides thickness to liner 250 to bridge the gap
between the chamber walls and heater 25.
[0117] B. Gas Distribution System
[0118] Referring to FIGS. 2 and 6, outer lid assembly 225 generally
includes a lid or base plate 265, a coolant manifold (not shown), a
clean gas manifold 270 that includes conduit 47, gas mixing box 273
for mixing and injecting process gas(es) and cleaning gas(es)
through inlet tube 43 to the processing chamber 15, and a gate
valve 280 for selectively distributing cleaning and/or process
gases to gas mixing box 273. Of course, it should be clearly
understood that gate valve 280 is optional, and that outer lid
assembly 225 can be modified to selectively distribute cleaning
and/or process gases to box 273 without a gate valve. As shown in
FIG. 4, gas mixing box 273, clean gas manifold 277 and gate valve
280 are preferably fastened, e.g., bolted, to the top surface of
base plate 265. First and second gas passages 83, 85 are mounted to
the exterior of plate 265, and extend into gas mixing box 273. Gas
passages 83, 85 each have inlets suitably coupled to sources 90 of
gas (see FIG. 1C), such as ozone, TEOS, TEPO, helium, nitrogen,
clean gas, or the like, and outlets (not shown) in communication
with a mixing area 93 within box 273 for mixing the gases prior to
delivering them through inlet tube 43 into the inner lid assembly
230.
[0119] It should be noted that for plasma processes, CVD apparatus
10 will further include a gas feed-through box (not shown) housing
gas passages 83, 85 to enable the application of high voltage RF
power to the gas box without gas breakdown, and without gas
deposition in the gas distribution system. A description of an
exemplary gas feed-through box can be found in U.S. Pat. No.
4,872,947 to Wang, the complete disclosure of which is incorporated
herein by reference.
[0120] As shown in FIG. 6A, clean gas manifold 70 includes conduit
47 for receiving gas(es) from inlet 290, and directing these
gas(es) through a fluid passage 293 into gas mixing box 273. Gate
valve 280 includes a valve plug (not shown) seated within passage
293 for selectively allowing or preventing the gases from passing
through conduit 47 into gas mixing box 273. Gate valve 280 may be
manually operated by actuating handle 281, or gate valve 280 may be
controlled by processor 50. During cleaning (discussed below), gate
valve 280 is configured to allow the clean gases from plasma system
55 to pass into box 273, where they are directed through inlet tube
43 into chamber 15 to etch the wafer or the inner chamber walls and
the other components of apparatus 10.
[0121] As shown in FIG. 3, clean gas manifold 270 is constructed
integral to the top part of enclosure assembly 200 of apparatus 10,
with conduit 47 having an appropriate bend or curve from the top
toward the side of chamber 15. Conduit 47 of manifold 270 has an
opening into a passage integrally formed within a side wall of
enclosure assembly 200 of apparatus 10, which may become heated due
to the high temperatures at which heater 25 operates. This passage
is equipped with an internal liner 291 that serves to protect the
inner surfaces of the passage in enclosure assembly 200 from
corrosion and etching from the clean gas radicals entering from an
applicator tube 292. Liner 291 also prevents recombination of
radicals in the clean gas. Clean gases are introduced into
applicator tube 292 from an inlet 57. Radicals are created from
clean gases in applicator tube 292 by microwave energy radiated
from a magnetron in plasma system 55, which is advantageously
located toward the bottom of chamber 15 in enclosure assembly 200.
The location of system 55 at the bottom of apparatus 10 facilitates
servicing of chamber 15 for preventive maintenance cleanings,
repairs, etc. In particular, opening the lid of apparatus 10 in
order to perform preventive maintenance cleanings is easily done,
since the bottom-mounted remote microwave plasma system 55 is not
located on top of the lid of apparatus 10. Microwave plasma system
55 is discussed in further detail below. As shown in FIGS. 3 and 4,
inlet tube 43 preferably includes an inner passage 295 for
delivering process gases into chamber 15, and an outer, annular
passage 297 in communication with passage 293 for directing
cleaning gases into the chamber.
[0122] The coolant manifold, which may be fastened to the top or
side surface of base plate 265, receives coolant fluid, such as
water or a glycol.backslash.water mixture, from the heat exchanger.
The coolant is distributed from the coolant manifold through an
annular coolant channel 93 (FIGS. 4 and 5) in base plate 265 to
convectively and conductively remove heat from plate 265 and the
components of inner lid assembly 230 during processing (discussed
in further detail below).
[0123] As shown in FIGS. 2 and 5, inner lid assembly 230 generally
includes base plate 265, a blocker or gas dispersion plate 301 and
a showerhead or gas distribution plate 20 for dispersing process
and clean gases into chamber 15. Plates 301, 20 are preferably
formed from a process-compatible material that is capable of
withstanding high temperature processes. For example, plates 301,
20 may comprise a ceramic material such as aluminum oxide or
aluminum nitride (AlN), or a metal, such as aluminum or anodized
aluminum. Preferably, the plates 301, 20 comprise a metal, such as
aluminum or anodized aluminum, to minimize gas deposition on the
surfaces of plates 301, 20. In a particularly preferred embodiment,
gas dispersion plate 301 comprises anodized aluminum and gas
distribution plate 20 comprises aluminum. Gas distribution and gas
dispersion plates 301, 20 are each directly fastened to a lower
surface of base plate 265. Preferably, gas distribution and
dispersion plates 20, 301 are affixed to lower surface of base
plate 265 with a plurality of threaded mounting screws 303, 305,
respectively. Mounting screws 303, 305 provide a relatively tight,
surface-to-surface contact between contact surfaces of gas
distribution and dispersion plates 20, 301, respectively, and lower
surface of base plate 265 to facilitate conductive heat exchange
therebetween (discussed in greater detail below). The mounting
screws 303, 305 comprise a process-compatible material, such an
nickel, Hasteloy.TM., Haynes.TM. or the like.
[0124] Referring to FIGS. 4 and 5, gas distribution plate 20 is a
substantially flat plate 311 having an outer flange 313 with a
plurality of holes 315 for receiving mounting screws 305 to provide
engagement of the contact surface of plate 20 with lower surface of
base plate 265. Base plate 265 includes an outer annular stand-off
316 that spaces gas distribution plate 20 from the bottom surface
of 265 and forms a chamber 317 (see FIG. 4) between these two
plates for dispersing the process gas uniformly through a plurality
of gas distribution holes 315 onto a semiconductor wafer.
Alternatively, gas distribution plate 20 may comprise a dish-shaped
device (not shown) having a centrally disposed cavity defined by a
side wall and a base wall.
[0125] The size and arrangement of gas distribution holes 315 will
vary depending on the process characteristics. For example, the
holes 315 may be uniformly spaced to provide a uniform distribution
of gases onto the wafer. On the other hand, holes 315 may be
non-uniformly spaced and arranged, if desired. Holes 315 will
usually have a diameter in the range of about 5-100 mil and
preferably in the range of about 10-50 mil. Preferably, gas
distribution holes 315 are designed to promote uniformity of
deposition on the semiconductor wafer. The holes (as well as the
manifold temperature, discussed above) are also designed to avoid
the formation of deposits on the manifold outer (bottom) surface
and, in particular, to prevent the deposition of soft deposits on
that surface which could flake off and drop onto the wafer during
and after processing. In an exemplary embodiment, the hole array is
one of generally concentric rings of holes 315. The distances
between adjacent rings (ring-to-ring spacings) are approximately
equal, and the hole-to-hole spacing within each ring is
approximately equal. A more complete description of a suitable
arrangement for the gas distribution holes is described in commonly
assigned U.S. Pat. No. 4,872,947 to Wang, the complete disclosure
of which has previously been incorporated by reference.
[0126] Gas dispersion plate 301 is a generally circular disk 321
including a plurality of gas dispersion holes 325 for dispersing
the gas therethrough into the chamber 317 formed between outer
stand-off 316 and gas distribution plate 20. Base plate 265
preferably includes a second, inner stand-off 318 for spacing
dispersion plate 301 from base plate 265 and for allowing gas
passing through base plate 265 to disperse into a chamber 320 (see
FIG. 4) formed between stand-off 318 and plate 301. Alternatively,
gas dispersion plate 301 may define a recess (not shown) for
forming chamber 320 rather than stand-off 318. Dispersion holes 325
will usually have a diameter of about 0.02-0.04 mm. Of course, it
will be recognized by those skilled in the art that dispersion
plate 301 may be included in preferred embodiments of the
invention. However, the process gases may be passed directly from
base plate 265 into chamber 317 of gas distribution plate 20, in
other embodiments.
[0127] As shown in FIGS. 4 and 5, base plate 265 is an integral,
single-piece element that functions to deliver process gas(es) to
gas dispersion plate 301 and to mount the entire inner lid assembly
230 to the mainframe unit of the processing chamber. In RF plasma
processes, inner lid assembly 230 will also include an isolator
(not shown) that electrically insulates the chamber lid from ground
and isolates the chamber body from the RF gas box (not shown). An
exemplary lid assembly for use with RF plasma processes is
described in U.S. Pat. No. 4,872,947 to Wang, the disclosure of
which has previously been incorporated by reference.
[0128] As shown in FIG. 8, base plate 265 has a lower surface 321
that defines an annular pumping channel 40 for exhausting the
deposition gases (discussed in detail below). As shown in FIGS. 4
and 5, base plate 265 defines a central hole 327 in communication
with inlet tube 43 for receiving the mixed process gases from gas
mixing box 273. Hole 327 is also in communication with recess 311
of gas dispersion plate 301 for dispersing the gas across plate 301
to holes 315. Base plate 265 further defines a coolant passage 93
having an inlet 331 and an outlet 333 coupled to the cooling system
215 for directing coolant fluid through portions of plate 215 to
convectively cool these portions of plate 265. Preferably, coolant
passage 93 is formed within portions of base plate 265 that are
relatively close to mounting screws 303, 305. This facilitates
conductive cooling through contact surfaces of dispersion and
distribution plates 301, 20 and lower surface 326 of base plate
265. A more complete description of exemplary designs for coolant
passage 93 can be found in commonly assigned, co-pending
application Ser. No. 08/631,902, filed Apr. 16, 1996 (Attorney
Docket No. 1034), the complete disclosure of which is incorporated
herein by reference, and in commonly assigned U.S. Pat. No.
4,872,947 to Wang, the complete disclosure of which has previously
been incorporated by reference.
[0129] Referring to FIG. 5, base plate 265 further defines an
annular recess 343 surrounding central hole 327 and an annular cap
345 disposed within recess 343 fastened to base plate 265 above
coolant passage 93. Preferably, annular cap 345 is welded to upper
surface of base plate 265 to provide a tight seal over passage 93,
thereby effectively preventing coolant leakage from passage 93.
With this configuration, passage 93 is formed relatively close to
gas distribution and dispersion plates 20, 301. In addition,
passage 93 is fabricated by forming a groove in the upper surface
of base plate 265, thereby decreasing the cost and complexity of
manufacturing plate.
[0130] Referring now to FIGS. 6B and 6C, an alternative embodiment
of inner lid assembly 230' will now be described. Similar to the
previous embodiment, lid assembly 230' includes a base plate 265, a
gas dispersion plate 301 and a gas distribution plate 20 for
dispersing process and clean gases into chamber 15. In addition,
base plate 265 includes an annular coolant channel 500 for
receiving a coolant liquid, such as water, to cool base plate 265
and the other components of lid assembly 230'. In this embodiment,
base plate 265 further includes an additional annular fluid channel
502 extending around central hole 295 above gas dispersion plate
301 for exchanging heat with the portion of base plate 265
immediately above gas dispersion and gas distribution holes 325,
315.
[0131] Inner lid assembly 230' includes a plurality of bypass
passages 510 extending from chamber 320 between base plate 265 and
gas dispersion plate 301 to vacuum chamber 15. Bypass passages 510
offer a lower resistance to fluid flow than gas dispersion and gas
distribution holes 325, 315. Accordingly, a large portion of the
gas flowing into chamber 320 will pass through bypass passages 520
directly into the vacuum chamber 15. In an exemplary embodiment,,
bypass passages 510 are preferably spaced circumferentially around
base plate 265 to uniformly deliver gases into the chamber 15 (see
FIG. 6E). In a preferred use of this embodiment, cleaning gases,
such as NF.sub.3, pass into chamber 320 and through gas dispersion
and gas distribution holes 325, 315, respectively. In addition, a
portion of the cleaning gases pass through bypass passages 510
directly into chamber 15 to facilitate the delivery of the cleaning
gases into chamber 15.
[0132] In this embodiment, vapor deposition apparatus 10 will
preferably include a control system, such as a valve coupled to a
controller (not shown) for preventing (or at least inhibiting)
gases from passing through bypass passages 510. For example, during
processing, it is typically desired that the process gases pass
through gas distribution and dispersion holes 325, 315 to uniformly
disperse onto the wafer. Thus, the valve will be closed to prevent
the process gases from passing through bypass passages 510. When
the chamber is cleaned, the valve will be opened to quickly deliver
at least a portion of the cleaning gases into the chamber. This
increases the speed and efficiency of the cleaning process, which
reduces the down time of apparatus 10. Of course, it will be
recognized that process gases may also be delivered through bypass
passages 510, if desired.
[0133] C. The Exhaust System
[0134] Referring to FIGS. 2-4, a pump (not shown) disposed exterior
to CVD apparatus 10 provides vacuum pressure to draw both the
process and purge gases, as well as residues, out of chamber 15 and
through annular pumping channel 40, where they are discharged from
apparatus 10 along a discharge conduit 60. As shown in FIG. 8, the
deposition and clean gases are exhausted radially outward over the
wafer W (shown by arrows 351) through an annular slot-shaped
orifice 355 surrounding the chamber 15 and into pumping channel 40.
The annular slot-shaped orifice 355 and channel 40 are preferably
defined by the gap between the top of the chamber's cylindrical
side wall 17 (including inner portion 253 of the chamber liner 250,
see FIGS. 3 and 4) and the bottom of base plate 265. From the
pumping channel 40, the gases flow circumferentially around channel
40 (shown by arrows 357) and through a downwardly extending gas
passage 361, past a vacuum shut off valve 363 (whose body is
preferably integrated with the lower chamber body), and into
discharge conduit 60 which connects to an external vacuum pump (not
shown).
[0135] Alternatively, CVD apparatus 10 may include a separate
pumping plate (not shown) having a plurality of gas holes that
directly communicate process chamber 15 with pumping channel 40. In
this embodiment, the gas holes are circumferentially spaced around
the central opening of the chamber to facilitate the uniform
discharge of process gas through the holes. To accommodate the
relative positions of inlets and outlets, gas holes may extend in a
radially outward direction from inlets to outlets relative to
central opening. This radial orientation of holes also contributes
to a substantially uniform discharge of the process and purge gases
and exhausted residues from the processing chamber 15. A more
complete description of this type of pumping plate can be found in
commonly assigned co-pending application Ser. No. 08/606,880, filed
Feb. 26, 1996 (Attorney Docket No. 978), the complete disclosure of
which is incorporated herein by reference.
[0136] Referring to FIGS. 2 and 3, a valve assembly (throttle valve
system) 369 includes an isolation valve 371 and a throttle valve
373 disposed along discharge line 60 for controlling the flow rate
of the gases through pumping channel 40. The pressure within
processing chamber 15 is monitored with capacitance manometers 381,
383 (see FIG. 2) and controlled by varying the flow cross-sectional
area of conduit 60 with throttle valve 373. Preferably, processor
50 receives from manometers 381, 383 signals that indicate the
chamber pressure. Processor 50 compares the measured pressure value
with set-point pressure values entered by operators (not shown),
and determines the necessary adjustment of throttle valve 333 that
is required to maintain the desired pressure within chamber 15.
Processor 50 relays an adjustment signal through a controller 385
to a drive motor (not shown), which adjusts throttle valve 373 to a
proper setting corresponding to the set-point pressure value.
Suitable throttle valves for use with the present invention are
described in commonly assigned, co-pending application Ser. No.
08/672,891 entitled "Improved Apparatus and Methods for Controlling
Process Chamber Pressure" (Attorney Docket Nos. 891/DCVD-II/MBE),
filed Jun. 28, 1996, the complete disclosure of which is
incorporated herein by reference.
[0137] Isolation valve 371 may be used to isolate process chamber
15 from the vacuum pump to minimize the reduction of chamber
pressure due to the pumping action of the pump. Isolation valve
371, together with throttle valve 373, may also be used to
calibrate the mass flow controllers (not shown) of CVD apparatus
10. In some processes, liquid dopants are vaporized, and then
delivered into process chamber 15 along with a carrier gas. The
mass flow controllers are used to monitor the flow rate of the gas
or liquid dopants into the chamber 15. During calibration of the
MFCs, isolation valve 371 restricts or limits the gas flow to
throttle valve 373 to maximize the pressure increase in chamber 15,
which facilitates MFC calibration.
[0138] D. Heater/Lift Assembly
[0139] Referring to FIGS. 9-15, heater/lift assembly 30 will now be
described in detail. The heater/lift assembly 30 functions to lift
the wafer into the processing position within vacuum chamber 15 and
to heat the wafer during processing. At the outset, it should be
noted that heater/lift assembly 30 may be modified for use, or
directly placed into, a variety of processing chambers other than
the exemplary SACVD chamber described and shown herein. For
example, heater/lift assembly 40 may be used in a similar CVD
chamber that generates plasma with RF or microwave power, a metal
CVD (MCVD) chamber, or other conventional or non-conventional
semiconductor processing chambers.
[0140] Referring to FIGS. 9 and 13, heater/lift assembly 30
generally includes a resistively-heated wafer support pedestal or
heater 25 attached to upper and lower support shafts 391, 393, a
lift tube 395 circumscribing support shafts 391, 393 underneath
heater 25 and a drive assembly 400 for vertically moving the heater
25, shafts 200, 201 and lift tube 202 within chamber 15. As
discussed in detail below, heater 25 (and the wafer supported
thereon) can be controllably moved between a lower
loading/unloading position where they are substantially aligned
with slot 243 in enclosure assembly 200 and an upper processing
position beneath gas distribution plate 20 (FIGS. 3 and 4). As
shown in FIG. 7, heater 25 includes an upper wafer support surface
403 surrounded by an annular raised perimeter flange 405 so that
the wafer is accurately located during processing. Wafer support
surface 403 has a diameter approximately equal to the diameter of
wafer W at the deposition temperature, e.g., at a temperature
ranging from about 200-800.degree. C. This diameter will typically
be about 6-8 inches (about 150-200 mm) for large size wafers and
about 3-5 inches (about 75-130 mm) for small size wafers. Of
course, other wafer sizes such as those with about 12 inch (about
300 mm) diameters would be within the scope of the invention with
appropriate modification of the chamber, the chamber lining 250,
and support heater 25.
[0141] Support heater 25 preferably comprises a disk made from a
process-compatible material that is capable of withstanding
relatively high processing temperatures, i.e., up to
600-800.degree. C. or higher. The material should also be resistant
to deposition from the reactive chemistries associated with the
high temperature deposition, as well as resistant to etching by the
radicals in the clean gas. Suitable materials for heater 25 are
ceramics, such as aluminum nitride, aluminum oxide or the like.
Aluminum nitride ceramic is the preferred material for the heater
25 because it has high thermal conductivity, excellent corrosion
resistance, and excellent tolerance of thermal shock. Thus, in a
particularly preferred embodiment, the entire outer surface of
heater 25 comprises aluminum nitride. Aluminum nitride has high
temperature capabilities and high resistance to fluorine and ozone
chemistries used in chamber 15. Use of aluminum nitride, as
compared to stainless steel or aluminum materials, for heater 25
also has less backside metal contamination in the processed wafer,
resulting in more reliable devices. In addition, aluminum tends to
react with the fluorine containing compounds typically used in
cleaning gases to form a layer of an aluminum fluoride compound
that may eventually build-up and flake off into the chamber or onto
the wafer, resulting in contamination (discussed in further detail
below). Constructing the heater 25 of aluminum nitride effectively
eliminates this problematic reaction during cleaning.
[0142] Referring again to FIG. 7, drive assembly 400 may include a
variety of driving mechanisms, including a pneumatic cylinder,
controllable motor or the like. Preferably, a stepper motor 407
coupled to the heater via a suitable gear drive 409 operates to
vertically drive heater 25, shafts 391, 393 and lift tube 395 in
controlled increments between the loading/unloading and processing
positions. Drive assembly 400 also includes upper and lower bellows
411, 413 attached between the end of shaft 391 and the bottom of
the processing chamber to allow for substantially free vertical
movement of heater 25. In addition, bellows 411, 413 allow some
angular movement to ensure that the gas distribution faceplate 20
and the heater 25 are substantially parallel during processing.
[0143] Referring to FIGS. 4, 9 and 13, lift tube 395 surrounds the
lower portion of upper shaft 391 and assists in insulating upper
bellows 411 from thermal energy radiating from shaft 391, heater 25
and the inside of processing chamber 15. Lift tube 395 usually
comprises an aluminum shaft 418, an annular strike plate 420
resting on the upper surface of shaft 418 and an annular flange 422
that mounts plate 420 to shaft 418. Flange 422 and strike plate 420
are preferably formed from a material capable of withstanding high
temperatures, such as aluminum nitride or aluminum oxide
(Al.sub.2O.sub.3 in its ceramic or alumina form). Flange 422 and
strike plate 420 insulate the aluminum shaft 418 from the heater to
minimize warping or fusing of shaft 418 to heater shaft 391 or to
the process chamber. In an exemplary embodiment, lift tube 395
includes a spring (not shown), such as a wave spring, loaded
between flange 422 and strike plate 420 to prevent or at least
inhibit rattling of the strike plate 420.
[0144] As shown in FIGS. 4 and 13, a plurality of
wafer-support/lift fingers 430, usually at least two and preferably
four, are slidably mounted within guide studs 432 spaced about the
periphery of heater 25. Fingers 430 extend downward below heater 25
so that strike plate 420 may engage fingers 430 and lift them above
the upper surface of heater 25 for loading and unloading wafers.
Lift fingers 430 are preferably made of a ceramic material, such as
aluminum oxide, and generally have a double truncated cone shaped
head (not shown) The four lift finger guide studs 432 are
preferably not uniformly distributed about the heater 25, but
instead form a rectangle having at least one side that is wider
than the width of the robot blade, which is typically a thin, flat
bar (not shown), around which the lift fingers 430 must lift the
wafer. The bottom end of the lift fingers 430 are rounded. The
fingers 430 have a relatively thick diameter of about 100-200 mil,
preferably about 150 mil, and a relatively short length of about
1-3 inches, preferably 2 inches, to minimize finger binding to the
heater during processing.
[0145] In use, the robot blade (not shown) transfers the wafer to
the chamber 15 when the heater 25 is in position opposite slit 243
(or actually just below slit 243). The wafer is supported initially
by lift fingers 430, which are lifted above heater 25 with strike
plate 420. As lift fingers 430 rise along with heater 25, they
encounter a stop (not shown). As heater 25 continues to rise to the
processing position opposite gas distribution faceplate 20, lift
fingers 430 sink into guide studs 432 within heater 25 and the
wafer is deposited onto wafer support surface 403 within annular
flange 405. To remove the wafer from chamber 15, the above steps
are performed in reverse.
[0146] Referring again to FIG. 9, a resistive heater coil assembly
440 is housed within heater 25 for transferring heat to the wafer
during processing. Upper and lower support shafts 391, 393 support
the heater 25 and house the necessary electrical connections to the
heater coil assembly 440 within a hollow core 445 (discussed
below). Upper support shaft 391 is made of a ceramic material
capable of withstanding relatively high processing temperatures.
Preferably, shaft 391 will be fabricated from diffusion-bonded
aluminum nitride, which prevents deposition onto, as well as attack
by chemistries used in chamber 15 of, the electrodes and electrical
connections within shaft 391 that might otherwise occur if the
aluminum nitride were not present. Shaft 391 is preferably
diffusion-bonded to heater 25 to provide a gas-tight seal between
heater 25 and shaft 391 such that the hollow core 445 of shaft 391
is at ambient temperature and pressure (preferably atmospheric
pressure, i.e., 760 torr or 1 atm). In other embodiments, hollow
core 445 may be at a pressure of about 0.8-1.2 atm and a
temperature of about 10-200.degree. C., while chamber 15 may be at
temperatures of at least about 400.degree. C. and pressures of
about 20 mtorr to about 600 torr. This configuration helps to
protect the electrodes and other electrical connections from
corrosion from the process and clean gases within chamber 15. In
addition, maintaining the hollow core 445 of shaft 391 at ambient
pressure minimizes arcing from the RF power source through hollow
core 445 to power leads or the aluminum shaft. This arcing that
might otherwise occur in a vacuum is thus avoided.
[0147] Referring to FIGS. 9 and 10, upper support shaft 391 extends
through an opening 453 in the lower surface of enclosure assembly
200, and is coupled to a base 455 that provides a gas seal between
shaft 391 and chamber 15. Upper support shaft 391 is fastened,
e.g., bolted, to lower support shaft 393, which comprises a
suitable process-compatible material, such as aluminum or an
aluminum alloy. Lower support shaft 393 is preferably a
water-cooled aluminum shaft. However, lower support shaft 393 may
also comprise a ceramic material, such as aluminum oxide or
aluminum nitride. One or more sealing members 457, e.g., O-rings,
are positioned between shafts 391, 393 to maintain the gas seal
between core 445 and chamber 15. As shown in FIG. 9, lower support
shaft 393 is mounted to a vertically movable support 461 on drive
assembly 400 for moving the shafts 391, 393 and heater 25 between
the loading and processing positions. Shaft 393 defines an inner
coolant channel 463 passing around the electrical connections to
further insulate these connections from the high temperature of the
shaft. Coolant channel 463 has an inlet 464 and an outlet 466
coupled to water connections 217, 219, respectively, of liquid
cooling system 215. Coolant channel 463 serves to maintain a
relatively low temperature in the lower chamber area to protect
sealing member(s) 457. In an alternative embodiment, heater
assembly 30 comprises a single shaft (not shown) that supports
heater 25 and extends through the lower opening 453 in enclosure
assembly 200. In this alternative embodiment, sealing members 457
would not be used.
[0148] Heater coil assembly 440 is configured to provide a
temperature of at least about 200-800.degree. C. in chamber 15 at a
rate of about 20.degree. C./min. Referring to FIGS. 11 and 12,
heater coil assembly 440 includes a heater coil 471 embedded into
the ceramic heater 25. The routing of the heater coil 471 embedded
in the heater base 25 preferably provides a single coil 471 that
begins at one electrical contact 472 near the center of heater 25,
runs back and forth along one side of heater 25 towards its
perimeter, extends to the other side of heater 25, and then runs
back and forth toward the center of heater 25 to a second
electrical contact 474. This loop pattern provides heating to
maintain a generally uniform temperature across the width of the
plate while allowing for heat losses. Preferably, heater coil 471
will provide a uniform temperature distribution of at least about
+/-2.degree. C. at 400.degree. C. and at least about +/-8.degree.
C. at 600.degree. C. across wafer support surface 403 of heater 25.
In an exemplary embodiment, heater coil 471 will have a greater
power density near the center of heater 25 to reduce the thermal
gradient from heater shaft 391.
[0149] As shown in FIG. 14, heater coil assembly 440 preferably
includes an embedded RF mesh ground plane electrode 473 connected
to a plurality of conductor lead wires 475 which extend through
shaft 341 to a suitable electrical energy source. Mesh ground plane
element 473 is a molybdenum mesh electrode which provides the
ground path and plasma resistance in embodiments where plasma
processes are used. Lead wires 475 preferably comprise a conductive
material that can withstand relatively high process temperatures,
such as nickel, copper or the like. In an exemplary configuration,
lead wires 475 are each nickel wires coupled to electrode 473 by a
metal insert 477 that is co-sintered into electrode 473 to avoid
brazing between ceramic and metal. Inserts 477 preferably comprise
a material with a relatively close thermal expansion match to
aluminum nitride, such as molybdenum. As shown, the molybdenum
inserts 477 are each fastened, e.g., brazed, to a molybdenum plug
481, which is then brazed to lead wire 475. All of the wires of the
heater coil, whether primarily resistive or primarily conductive,
are sheathed in the continuous insulating coating (such as
described above) which tolerate high temperatures so as to
withstand casting of the aluminum nitride heater body.
[0150] Referring to FIGS. 9, 15A and 15B, heater/lift assembly 30
includes at least one thermocouple 491 for determining the
temperature of heating coil 471. Thermocouple 491 includes an
elongate tube 493 having a sensor 495 (FIG. 9) inserted and held in
contact with the underside of heater 25 at a distance of about 0.25
inch from the bottom of the wafer. To that end, heater 25 includes
a thermocouple guide 501 (FIG. 15A) brazed to heater element 473
for connecting sensor 495 of thermocouple 491 to element 473. The
thermocouple 491 is held in place by a slight spring force from a
compression spring 503 (FIG. 15B), and provides a control signal
for the temperature controller (not shown). Sensor 495 is
preferably disposed in a well 505 which is at atmospheric pressure,
which enhances the heat transfer between the heating element 473
and the thermocouple 491 to provide a more accurate reading. The
temperature controller is a recipe-driven proportional integral
differential (PID) controller which anticipates the recipe steps
which are about to occur and alters the response characteristic of
the heater to maintain a uniform temperature profile. A vacuum seal
and ground connection for the lower support shaft 393 is made along
the side surface of shaft 393 (not shown) and connections to heater
wire ends 511 and the thermocouple tube end 513 are made at
atmospheric conditions.
[0151] When the present invention is in use, a robot blade (not
shown) transfers the wafer to the chamber 15 when the heater 25 is
in position opposite slit 243 (or actually just below slit 243).
The heater 25 and wafer are lifted into the processing position by
drive assembly 400 and lift fingers 430 sink into guide studs 432
within heater 25 so that the wafer is deposited onto wafer support
surface 430 within annular flange 405 of heater 25 (FIGS. 4, 9 and
10). Process gases, such as TEOS and O.sub.3, are directed through
gas passages 83, 85 and mixed together in mixing area 93 of gas
mixing box 273 (see FIGS. 3 and 6). The mixed gas is then delivered
through inner passage 295 of inlet tube 43 and through central hole
327 of base plate 265 into chamber 320 above gas dispersion plate
301, where it disperses outward and flows through holes 325 into
chamber 317 above gas distribution plate 20 (see FIGS. 4 and 5).
Preferably, the gas is uniformly distributed through gas
distribution holes 315 onto the semiconductor wafer (not
shown).
[0152] The temperature of the wafer on heater 25 is typically held
above a minimum deposition temperature by heater coil assembly 440
so that the process gases will react together at the wafer surface
and deposit a layer thereon. Specifically, an electric current is
directed through conductor wires 457 to resistive coil 473 to heat
the wafer to a temperature of about 200-800.degree. C., according
to specific embodiments. In the preferred embodiment, the
temperature is controlled by a feedback control system (described
above for heater control subroutine 167) that maintains the ramp
rate based on the current temperature in the chamber. During this
process, inner lid assembly 230 receives heat from various sources
including the gases passing therethrough, the heated semiconductor
wafer, and the wafer heating source. To maintain the components of
lid assembly 230 below the minimum deposition temperature and
thereby avoid gas reactions and deposition on these components, a
coolant liquid is introduced into coolant channel 93 to remove heat
from base plate 265 and gas distribution and dispersion plates 20,
301.
[0153] During the deposition process, the vacuum pump is activated
to generate vacuum pressure within pumping channel 40, thereby
drawing the process gases and plasma residue out of processing
chamber 15 through channel 40 and exhaust port 361 (FIGS. 4 and 8).
In addition, purge gas may be directed generally upward into
processing chamber 15 through the gap between susceptor 25 and
inner portion 253 of liner 250. The purge gas minimizes leakage of
process gas into the lower portion of apparatus 10 and facilitates
the removal of the process gas through port 361.
[0154] E. Integral Remote Microwave Plasma System
[0155] FIG. 16 is a simplified diagram of a remote microwave plasma
system 55 for cleaning the wafer and/or the process chamber, in
accordance with an embodiment of the present invention. Microwave
plasma system 55 produces a plasma remote from processing chamber
15 for use in efficiently etching or cleaning a wafer in chamber 15
and/or components of chamber 15, and possibly for use in
depositions. Microwave plasma system 55 includes applicator tube
292; a plasma ignition system (described below); a microwave
waveguide system (described below); optimizing elements including
an impedance matching system 701 which may include an optional
phase detector 703 for embodiments requiring feedback for automatic
impedance matching, and a circulator 705 with a load 707; and a
magnetron 711.
[0156] Magnetron 711 is a typical magnetron source capable of
operating between about 500-2500 Watts for continuous wave (CW) or
pulsed output of microwaves of about 2.45 Gigahertz (GHz)
frequency. Magnetron 711 is powered by power supply 110 (shown in
FIG. 1C) which may be remotely located from magnetron 711. Of
course, other magnetrons may be utilized as well. Microwaves from
magnetron 711 are transmitted to the microwave waveguide system,
which includes various lengths of straight and curved waveguide
sections 715, 717 which may be connected together at joints 719.
Interspersed within the waveguide system are optimizing elements
that work to provide low loss, maximum microwave transmission with
minimized reflection losses and to protect the magnetron from
damage due to reflected power. The description below follows the
desired direction of microwaves from magnetron 711 toward
applicator tube 292.
[0157] In a specific embodiment, microwave plasma system 55 has
magnetron 711 connected to circulator 705 with load 707, as shown
in FIG. 16. Circulator 705 allows only forward microwave
transmission from magnetron 711 toward applicator tube 292. Load
707 absorbs any power that might be reflected back from the
waveguide system toward magnetron 711. Circulator 705 and load 707
thereby direct microwaves in the forward direction and protect
magnetron 711 from damage from reflected power. Circulator 705
connects to waveguide section 715 that is connected to phase
detector 703 connected to another waveguide section 715. Phase
detector 703, if utilized, is coupled via curved waveguide section
717 to another waveguide section 715 having attached tuning or
matching system 701. Tuning system 701, which may use stub tuners
or other tuning elements, provides plasma microwave system 55 with
the ability to match the load at waveguide section 721 to 50
.OMEGA., the characteristic impedance of the waveguides. Tuning
system 701 may provide fixed tuning, manual tuning, or automated
tuning, according to specific embodiments. For embodiments using
automated tuning, phase detector 703 is a 3-diode array which
detects the phase of microwaves transmitted for feedback to
matching system 701, which intelligently and dynamically matches
the load appropriately. In the specific embodiment, waveguide
sections have rectangular cross-sections, but other types of
waveguide also may be used.
[0158] As seen in FIG. 16, microwaves directed through the
optimized waveguide system are transmitted from output waveguide
section 721 to applicator tube 292, where a plasma is created.
Applicator tube 292 has an input feed line 57 that receives
reactive gases that are energized by microwaves from magnetron 711
via the waveguide system and other optimizing elements. Applicator
tube 292 is a circular (or other cross-section) tube made of a
composite or ceramic material, preferably alumina, or other
material resistant to etching by radicals in the plasma, according
to a specific embodiment. In the specific embodiment, applicator
tube 292 has a length of about 18-24 inches and a cross-sectional
diameter of about 3-4 inches. Applicator tube 292 is disposed
through waveguide section 721, which is open at one end for
transmitting microwaves and is terminated at the other end with a
metal wall. Microwaves are then able to be transmitted through the
open end of waveguide section 721 to reactive gases inside
applicator tube 292, which is transparent to microwaves. Of course,
other materials such as sapphire also may be used for the interior
of applicator tube 292. In other embodiments, applicator tube 292
may have a metal exterior and an interior made of a composite or
ceramic material and microwaves in waveguide section 721 enter a
window through the exterior of applicator tube 292 to the exposed
interior of tube 292 to energize the reactive gases.
[0159] In the specific embodiment, a plasma may be ignited by
plasma ignition system which includes an ultraviolet (UV) lamp 731
and a UV power supply 733, which may optionally be mounted on the
metal wall of waveguide section 721. Of course, UV power supply 733
may be mounted in various other locations besides on the metal
wall. Powered by UV power supply 733, UV lamp 731 provides the
initial ionization of the plasma within applicator tube 292.
Microwave energy then sustains the ionization of the ignited plasma
to produce the flow of radicals that enter inlet 290 leading to
chamber 15 via gate valve 280. Due to changes in load within
applicator tube 292 from the introduction and ionization of
reactive gases within tube 292, use of matching system 701
optimizes the microwave energy coupling for efficiency. In
preferred embodiments, matching system 701 includes at least one
stub tuner under the control of processor 50 or a controller unit
for automated tuning. As mentioned above, other conventional tuning
elements also may be used in matching system 701.
[0160] As discussed above, applicator tube 292 is mounted from and
connected to the bottom of the body of chamber 15 such that
applicator tube 292 outputs plasma radicals into inlet 290 of
enclosure assembly 200, as seen in FIG. 3. Radicals are input
through inlet 290 into the passage in enclosure assembly 200 which
is equipped with liner 291, preferably made of
polytetraflouroethylene (PTFE). PTFE, which is commercially
available, for example, as Teflon.TM. PTFE is resistant to etching
or deposition from the reactive chemistry input at inlet 290. Liner
291 prevents fluorine radical recombination in the passage during
clean processes. In addition to PTFE, liner 291 also may be made of
any fluorinated material including fluorinated polymers such as PFA
(which is a polymer combining the carbon-fluorine backbone of
polytetrafluouroethylene resins with a perfluoroalkoxy side chain),
fluorinated ethylene-propylene (TFE), or the like. The passage is
preferably circular in cross-section or other type of cross-section
to match the cross-section of inlet 290 and applicator tube 292.
From this lined passage in enclosure assembly 200, plasma radicals
flow into conduit 47 in clean gas manifold 270 to gate valve 280.
Clean gas manifold 270 is also constructed of PTFE. PTFE is
preferred for cleaning applications where fluorine radicals are
produced in the plasma, since PTFE is resistant to etching by
fluorine radicals. Of course, both clean gas manifold 270 and liner
291 may be made of other materials (such as those mentioned above
for liner 291) which are resistant to the particular chemistry
depending on the reactive gases used.
[0161] In some embodiments, gate valve 280 isolates the clean
processes from the deposition processes, as discussed above. Gate
valve 280 normally remains closed while chamber 15 is being used
for deposition, reflow, or drive-in steps. In the closed position,
gate valve 280 prevents particles in conduit 47 used for clean
processes from contaminating the wafer during deposition processes,
as well as reducing the "dead" volume of conduit 47 and passage
during deposition. If deposition at pressures of between about
200-760 torr occurs with gate valve 280 open, deposition may be
caused in applicator tube 292, leading to contamination of the
cleaning processes. Gate valve 280 is preferably made of PTFE (or
similar materials such as those discussed above for liner 291 and
manifold 270) to minimize damage to or deposition onto the closed
valve 280 due to the reactive chemistries from conduit 47. In a
preferred embodiment, gate valve 280 is a particle-grade gate
valve. In embodiments using gate valve 280, only when chamber 15 is
used for a wafer cleaning step or when a chamber cleaning is
performed does gate valve 280 open, allowing plasma radicals to
flow into fluid passage 293 of gas mixing box 273, as seen in FIG.
3. As mentioned above, in some embodiments gate valve 280 is not
used at all. The plasma radicals then may flow through annular
passage 295 and into chamber 15 via gas distribution plate 20.
Distribution plate 20 as well as various parts of chamber 15 are
thus cleaned. Residues and used cleaning gases are then exhausted
from chamber 15 with the exhaust system discussed above. The
cleaning process of chamber 15 and the cleaning of wafer surfaces
are discussed in detail below.
[0162] F. Endpoint Detection System
[0163] FIGS. 17A-17D illustrate a cleaning endpoint detection
system 800 for microwave plasma system 55 according to another
aspect of the present invention. As discussed above, apparatus 10
preferably employs a thermal cleaning technique using remote
microwave technology, instead of a conventional in situ plasma
process, to lower metal contamination. In the present invention,
the gentle cleaning technique using remote microwave plasma system
55 utilizes only chemical reactions, in contrast to using in situ
plasma processes where physical sputtering effects may react with
the aluminum in the chamber walls and lead to aluminum metal
contamination in the processed wafer.
[0164] In the cleaning process using remote plasma system 55, the
plasma is produced remotely from chamber 15 such that the etchant
gas, preferably mostly of fluorine radicals, is directed into the
chamber where the gentle thermal clean occurs, but the plasma
remains exterior to the chamber (i.e., within applicator tube 292,
see FIG. 16). While this process has a number of advantages for
cleaning a wafer in chamber 15 and/or components of chamber 15
(discussed above), the lack of plasma in the chamber can make it
difficult, using conventional endpoint detection systems, to
pinpoint the time at which the cleaning has been completed, i.e.,
when the last process gas residue in the chamber has reacted with
the cleaning etchant so that it can be discharged from the chamber.
Conventional endpoint detection systems typically rely on the use
of a plasma within the chamber and check emissions from the in situ
plasma to determine the end of a cleaning process.
[0165] The endpoint detection system of the present invention,
however, may be used with either an in situ plasma or a remote
plasma, such as provided by microwave plasma system 55. For
example, in one exemplary process, fluorine-based gas is used to
react with SiO.sub.2 powder residue in the chamber to form a
SiF.sub.4 gas, which is drawn out of chamber 15 with the vacuum
pump. When substantially all of the SiO.sub.2 in the chamber has
been consumed, the fluorine-based gas cannot react with the
SiO.sub.2 to form SiF.sub.4. Instead, the fluorine-based gas may
begin to contaminate the chamber 15 or to react with, for example,
the aluminum walls of the chamber to form an aluminum fluoride
compound. Consequently, it is important to determine the
approximate endpoint or the point at which the last SiO.sub.2
residue has reacted with the fluorine gas so that gate valve 280
can be closed to prevent further fluorine radicals from entering
chamber 15. As discussed further below, endpoint detection system
800 of the present invention determines the endpoint of a cleaning
process by detecting changes in light intensity that occur due to
absorbance of light by the exhausted clean gas reactants such as
SiF.sub.4.
[0166] As shown in FIG. 17A, cleaning endpoint detection system 800
includes a gas detector 802 positioned along discharge conduit 60
between isolation valve 371 and throttle valve 373. Of course, gas
detector 802 may be positioned in other locations within the
exhaust system of apparatus 10. For example, detector 802 may be
positioned downstream of throttle valve 373, as shown in FIG. 17B.
In another embodiment, detector 802 is positioned along a bypass
line 804 that receives a sample stream of gas from conduit 60, as
shown in FIG. 17C. In this embodiment, bypass line 804 may include
a control valve 806 to vary the amount of flow passing through line
804, or to completely cease gas flow along bypass line 804, for
example, during gas processing of a wafer within the chamber.
[0167] Referring to FIG. 17D, a preferred embodiment of gas
detector 802 will now be described. As shown, detector 802 includes
a housing 804 defining a through-hole 806 in communication with
conduit 60 for allowing the gases and other residue from chamber 15
to pass therethrough. A pair of flanges 808, 810 preferably attach
housing 804 to conduit 60. The side walls of housing 804 include a
pair of infrared (IR) windows 812, 813 that are configured to allow
far-IR light to pass through. Far-IR light has wavelength starting
at about 10 .mu.m. IR windows 812, 813 are spaced by a length L and
preferably comprise a material substantially transparent to far-IR
light such that zero or substantially little of the light is
absorbed by windows 812, 813. In addition, the IR window 812, 813
material should be process-compatible, inert with respect to the
process and clean gas chemistry, and the material should not
contaminate the film. In embodiments where fluorine radicals are
used for the cleaning process, windows 812 and 813 are resistant to
fluorine. Preferred materials for IR windows 812, 813 include
germanium, calcium fluoride, or the like.
[0168] As schematically shown in FIG. 17D, detector 802 further
includes a far-IR lamp 814 suitably coupled to housing 804 for
generating far-IR light and transmitting this light through windows
812, 813 so that the light passes through-hole 806. An IR detector
816 is coupled to housing 804 in position to receive and detect the
far-IR light passing through window 813. Preferably, far-IR lamp
814 may be a tungsten lamp source with an optical notch filter.
[0169] When the present invention is in use, the clean gas
reactants (e.g., SiF.sub.4) are directed along conduit 60 and
through-hole 806 of detector 802. Far-IR lamp 814 transmits far-IR
light through window 812, through-hole 806 and window 813, where it
is received by detector 816. As the light passes through the clean
gas SiF.sub.4 reactants, these reactants (i.e., the silicon) absorb
a portion of the far-IR light, which reduces the light intensity
received by detector 816. The fluorine does not absorb the far-IR
light. Therefore, when the far-IR light intensity detected
increases up to a reference value, detector 816 sends a signal to a
controller (not shown) indicating that the concentration of
SiF.sub.4 passing through conduit 60 has substantially diminished
or completely stopped, which indicates that the cleaning endpoint
has arrived. At this point, the controller sends an appropriate
signal to processor 50 to close gate valve 280 and to prevent
further etchant gas from entering chamber. In the above exemplary
clean process, endpoint detection system 880 utilizes source 814 to
provide, and detector 816 to detect, far-IR wavelengths that can be
absorbed by clean gas reactants SiF.sub.4, which absorb light with
a wavelength of about 10 .mu.m, and fluorine, which absorbs light
with a wavelength of about 5-6 .mu.m. In other embodiments, source
814 and detector 816 can provide light at different wavelengths,
depending on the light absorbance characteristics of the specific
clean gas reactants utilized in the clean gas process.
[0170] By way of example, I.sub.o is the intensity of the far-IR
light when no SiF.sub.4 is flowing through conduit 60 and the
detector 816 receives the full intensity from lamp 814. As
SiF.sub.4 flows through through-hole 806 during cleaning, the
far-IR light is absorbed and the intensity received by detector 816
(I) is reduced, given by the expression:
I/I.sub.o=exp(-X*L*C)
[0171] where X is the extinction coefficient of IR windows 812, 813
or a filter (not shown), L is the length between windows 812, 813
(see FIG. 17D) and C is the concentration of SiF.sub.4 passing
through detector 802. As I/I.sub.o approaches the value 1, the
SiF.sub.4 concentration is diminishing, which means that the
cleaning endpoint is approaching. The controller continuously
monitors I/I.sub.o until this value approaches 1, which indicates
that the cleaning endpoint has arrived.
[0172] While the description above is in terms of a CVD chamber for
a multichamber processing system, it would be possible to implement
certain features of the present invention with other plasma etching
chambers, physical deposition chambers or the like. Therefore, the
above description and illustrations should not be taken as limiting
the scope of the present invention as defined by the appended
claims. It should be noted that the invention is not limited to a
single wafer chamber as described above and shown in the enclosed
drawings. For example, the throttle valve of the present invention
could be installed into a batch chamber that simultaneously
processes a plurality of wafers. In addition, the invention would
be suitable for use in a multiple wafer chamber that sequentially
performs individual processing steps on each of the wafers.
[0173] II. High Temperature Multiple-Step Processes Using the CVD
Reactor System
[0174] A. Exemplary Structures and Applications
[0175] FIG. 18 illustrates a simplified cross-sectional view of an
integrated circuit 900 according to the present invention. As
shown, integrated circuit 900 includes NMOS and PMOS transistors
903 and 906, which are separated and electrically isolated from
each other by a field oxide region 920 formed by local oxidation of
silicon (LOCOS), or other technique. Alternatively, transistors 903
and 906 may be separated and electrically isolated from each other
by a shallow trench isolation (not shown) when transistors 903 and
906 are both NMOS or both PMOS. Each transistor 903 and 906
comprises a source region 912, a drain region 915 and a gate region
918.
[0176] A premetal dielectric (PMD) layer 921 separates transistors
903 and 906 from metal layer 940 with connections between metal
layer 940 and the transistors made by contacts 924. Metal layer 940
is one of four metal layers 940, 942, 944, and 946, included in
integrated circuit 900. Each metal layer 940, 942, 944, and 946 is
separated from adjacent metal layers by respective inter-metal
dielectric layers 927, 928, and 929. Adjacent metal layers are
connected at selected openings by vias 926. Deposited over metal
layer 946 are planarized passivation layers 930. CVD apparatus 10
may be used to deposit films used, for example, as PMD layer 921,
IMD layers 927, 928 and 929, or passivation layer 930. CVD
apparatus 10 also may be used to deposit oxide filling layers for
shallow trench isolation structures used in place of LOCOS field
oxide region 920.
[0177] Another example of a use of CVD apparatus 10 described above
is forming ultra-shallow source and drain regions 912 and 915 shown
in exemplary integrated circuit 900 of FIG. 18. Application of the
present method for forming ultra-shallow doped junctions in forming
the source/drain regions for a MOS transistor is discussed, as an
example, with FIGS. 19A-19E.
[0178] FIG. 19A is a simplified cross-sectional view of a partially
completed MOS transistor. Merely as an example, the MOS transistor
1000 is a PMOS transistor. Of course, NMOS transistors also may be
formed. For PMOS transistor 1000, a doped dielectric layer 1008
used may be a BSG film as the P type dopant source. As seen in FIG.
19A, a gate electrode 1002 overlying gate oxide 1003 has already
been formed on material 1004. In the present example, material 1004
may be an N type substrate or an N well formed in a substrate.
Field oxide regions 1006 also have been formed by a method such as
local oxidation of silicon (LOCOS). The regions where ultra-shallow
doped junctions are desired may be defined using a mask. In the
present example, the regions are source/drain regions 1010 and
1012, but of course the regions may be defined to form lightly
doped drain (LDD) regions. Using the CVD reactor system described
above with process recipes discussed in detail below, a doped
dielectric layer 1008 is formed over source/drain regions 1010 and
1012 on a wafer resting on resistively-heated heater 25.
[0179] Prior to forming doped dielectric layer 1008 over
source/drain regions 1010 and 1012, the surface of source/drain
regions 1010 and 1012 may be cleaned of any gate oxide or native
oxide that may exist either by using a plasma formed by reactive
gases such as NF.sub.3 from remote microwave plasma system 55
described above or by using a thermal NF.sub.3 vapor. During the
cleaning procedure, gate valve 280 would be opened to allow
fluorine radicals from the NF.sub.3 plasma to enter chamber 15 to
clean the oxides that may exist on the surface of source/drain
regions 1010 and 1012. Cleaning these oxides allows a more
consistent drive-in of dopants from doped dielectric layer 1008
that is formed over source/drain regions 1010 and 1012. The
fluorine radicals from the remote plasma may be used to clean
native oxides from the wafer in chamber 15. In the cleaning
procedure, heater 25 may be adjusted to a position where the
fluorine radicals are optimally able to clean the oxides without
damaging the device on the wafer. Preferably, this native oxide
removal/cleaning step and the deposition of doped dielectric layer
1008 are performed in the same chamber in an in situ manner. Use of
the above described CVD apparatus 10 avoids moisture absorption by
the wafer, since the vacuum of chamber 15 is not broken and the
wafer is not exposed to the environment. Alternatively, undesired
oxides may be cleaned from the wafer by thermally breaking down
NF.sub.3 vapor in situ. With this alternative, fluorine radicals
are produced in situ in chamber 15 by introducing NF.sub.3 between
about 200-1500 standard cubic centimeters per minute (sccm),
preferably about 500 sccm, and optionally O.sub.2 at about 0-1000
sccm into chamber 15. At the same time, chamber 15 is heated to
between about 500-650.degree. C., preferably 600.degree. C., and
maintained at a pressure of between about 60-760 torr, preferably
400 torr, while heater 25 is spaced between about 150-900 mil,
preferably about 600 mil, from plate 20. Thus, the surfaces of
source/drain regions 1010 and 1012 can be cleaned of any native
oxide barrier.
[0180] After the cleaning step, gate valve 280 in some embodiments
would be closed to shut out any reactive gases used in the doped
dielectric layer deposition process from entering and depositing
onto surfaces in conduit 47. Heater 25 also would be moved into the
appropriate processing position and heated to the specified
temperature in the vacuum of chamber 15, according to the desired
process recipe. Doped dielectric layer 1008 is then formed at high
temperatures (about 500-600.degree. C.) in the CVD apparatus 10, as
described below. Without an native oxide barrier, dopants from the
doped dielectric layer 1008 formed on the wafer may more easily and
uniformly be driven into the substrate to form ultra-shallow
source/drain regions 1010 and 1012.
[0181] After deposition of doped dielectric layer 1008, the wafer
remains in chamber 15. The resistively-heated heater 25 and wafer
thereon are then heated to a higher temperature (about 800.degree.
C.) for a specified time. The heating step drives dopants from
doped dielectric layer into N type material 1004. Doped dielectric
layer 1008 is used as a P type dopant diffusion source for the
resulting ultra-shallow junctions 1020, as shown in FIG. 19B. Of
course, gate valve 280 remains closed during this drive-in step. As
an alternative to being heated in situ, the wafer may be
transferred to an annealing furnace or a rapid thermal process
reactor (preferably within the multichamber system) to drive-in
dopants from doped dielectric layer 1008, which acts as a dopant
diffusion source. Diffusion is performed by annealing or a rapid
thermal process. Preferably, the diffusion is performed using a
rapid thermal process (due to better throughput) at a temperature
between about 950-1100.degree. C. for between about 1-3 minutes,
and preferably about 1000.degree. C. for about 1 minute, in these
other embodiments.
[0182] After diffusion, doped dielectric layer 1008 is removed by
dry or wet etching techniques or other removal technique from N
type material 1004. CVD apparatus 10 may also be used to remove
doped dielectric layer 1008 by using remote microwave plasma system
55 with the appropriate etching chemistry. For this dielectric
removal step, gate valve 280 would be opened to allow the remote
plasma to etch the layer 1008 until removal is completed, whereupon
gate valve 280 is closed. The removal step may be performed in situ
without transferring the wafer from heater 25 in chamber 15.
Alternatively, the removal step may be performed in another
chamber, dedicated to dielectric removal, within the same
multichamber system as CVD apparatus 10, which also avoids exposure
of the wafer to the environment outside the vacuum of the
multichamber system. FIG. 19C illustrates the partially completed
PMOS transistor 1000 after removal of doped dielectric layer 1008.
PMOS transistor 1000 includes gate electrode 1002 and adjacent
source/drain regions 1020 which are ultra-shallow P type doped
junctions. Thereafter, remaining process steps for the completion
of the device may be performed on the wafer.
[0183] After every wafer (or several wafers) have been processed in
chamber 15 of CVD apparatus 10, a chamber clean may be performed.
After processing of the wafer is completed within chamber 15, the
wafer is transferred through slot 243 which is then vacuum locked.
Gate valve 280 may then be opened to allow the chamber clean
process to be performed using remove microwave plasma system 55
until the chamber is cleaned to specifications, as indicated by the
endpoint detector system.
[0184] In an alternative embodiment, steps shown in FIGS. 19D-19E
are performed after steps described for FIG. 19A. After doped
dielectric layer 1008 is formed over source/drain regions 1010 and
1012 and gate electrode 1002 as seen in FIG. 19A, a capping layer
1030 such as USG is formed overlying doped dielectric layer 1008,
preferably in an in situ process within chamber 15. During the
deposition of layer 1008, gate valve 280 would remain closed. Then
the substrate between devices. Application of the present method
for forming an ultra-shallow channel-stop region is discussed with
reference to FIGS. 20A-20G.
[0185] FIG. 20A is a simplified cross-sectional view of a partially
completed shallow trench isolation structure formed in
semiconductor material 1100. As seen in FIG. 20A, a trench 1102 is
formed in semiconductor material 1100 using anisotropic etching
techniques including reactive ion etching, plasma etching, or other
techniques. In the present example, the semiconductor material 1100
may be a P type substrate or a P well formed in a substrate. A mask
1104 may be used to define the channel stop region in the shallow
trench isolation. Using process recipes discussed in detail below,
a doped dielectric layer 1106 is formed over trench 1102 using mask
1104. Doped dielectric layer 1106 provides a source of dopant atoms
to diffuse and form a channel-stop doping region used to prevent a
conducting path from forming between devices in semiconductor
material 1100. For P type material 1100, doped dielectric layer
1106 may be a BSG film as the P type dopant source.
[0186] Prior to forming doped dielectric layer 1106 over trench
1102, the surface of trench 1102 may be cleaned of any gate oxide
or native oxide that may exist by using remote microwave plasma
system 55 to provide a fluorine radicals in a remote plasma formed
using reactive gases such as NF.sub.3, as discussed below. During
the cleaning step, gate valve 280 is open to allow fluorine
radicals to flow from conduit 47 through outer annular passage 297
and into chamber 15 via distribution plate 20. Heater 25 with the
wafer thereon is lowered into a position for the cleaning so that
the fluorine radicals can clear the wafer of the unwanted oxides
that may exist on the surface of trench 1102 without damaging the
substrate. Cleaning these oxides allows a more consistent drive-in
of dopants from doped dielectric layer 1106 that is formed over
trench 1102. The cleaning step and the deposition of doped
dielectric layer 1106 are performed in chamber 15 in an in situ
process. In alternative embodiments, the cleaning step may be done
by thermally breaking down NF.sub.3 in situ as discussed above. The
fluorine radicals from the NF.sub.3 plasma or vapor then clear the
oxides that may exist on the surface of trench 1102. In further
alternative embodiments, a separate chamber of the multichamber
system described above may be used for this cleaning step. Since
moisture absorption by the wafer is avoided by not breaking the
vacuum of chamber 15 (or alternatively of the multichamber system),
the surface of trench 1102 is free of native oxide barriers. After
the cleaning step is performed, gate valve 280 is closed. Without
the native oxide barrier, dopants from doped dielectric layer 1106
may more easily and uniformly be driven into the substrate to form
ultra-shallow junctions used as a channel-stop region to provide
shallow trench isolation. Heater 25 with the wafer thereon is moved
into the processing position and heated to high temperatures (about
500-700.degree. C.) for deposition of layer 1106.
[0187] After deposition of doped dielectric layer 1106, the wafer
remains in chamber 15 for the drive-in step. Gate valve 280 remains
closed, and heater 25 is heated to a higher temperature (about
800.degree. C.). The heating occurs for a specified time that
depends on the desired junction depth needed for the diffusion.
Alternatively, the wafer may then be transferred to an annealing
furnace or a rapid thermal process reactor (preferably within the
multichamber system) to drive dopants from doped dielectric layer
into P type material 1100. Doped dielectric layer 1106 is used as a
P type dopant diffusion source for the resulting ultra-shallow
channel-stop region 1108, as shown in FIG. 20B. Ultra-shallow
channel-stop region 1108 is a P+ type region formed in P type
material 1100.
[0188] After diffusion, doped dielectric layer 1106 is removed by
wet etching techniques or other removal technique from P type
material 1100. Preferably, the wafer remains in chamber 15 so that
gate valve 280 may be opened and radicals from remote microwave
plasma system 55 may etch away layer 1106. Of course, reactive
gases input to plasma system 55 depend on the type of doped
dielectric layer 1106. FIG. 20C illustrates the partially completed
shallow trench isolation structure after removal of doped
dielectric layer 1106. As seen in FIG. 20D, trench 1102 is then
filled with an oxide 1110 to form the shallow trench isolation
structure. In a preferred embodiment, a high quality USG film
deposited at high temperature may be used as oxide 1110 to fill
high aspect ratio trenches. Oxide 1110 also may be formed using
other deposition techniques.
[0189] After completing shallow trench isolation structure having
ultra-shallow channel-stop region 1108, devices 1112 and 1114
separated by shallow trench isolation structure may be formed, as
seen in FIG. 20E. Devices 1112 and 1114 each include a gate
electrode 1116 and adjacent source/drain regions 1118 and 1120.
Thereafter, remaining process steps for the completion of the
device may be performed by transferring the wafer to another
chamber, preferably in multichamber system. After the wafer is
transferred from chamber 15, a chamber clean may be performed using
remote microwave plasma system 55 with resistively-heated heater 25
adjusted to a cleaning position and gate valve 280 being open, as
already described above in connection with FIGS. 19A-E.
[0190] In an alternative embodiment, steps shown in FIGS. 20F-20G
are performed after steps shown in FIG. 20A. After doped dielectric
layer 1106 is formed over trench 1102 and mask 1104 as seen in FIG.
20A, a capping layer 1110 such as USG is formed overlying doped
dielectric layer 1106 in chamber 15 in an in situ process. During
the deposition of capping layer 1110, gate valve 280 is closed.
Then the substrate is heated in situ in chamber 15 for dopant
drive-in for diffusion of dopants from capped, doped dielectric
layer 1106 into semiconductor material 1100 as discussed above for
FIG. 20B. Alternatively, the wafer may be removed from chamber 15
for transfer to an annealing furnace or rapid thermal process
reactor (preferably within the multichamber system) for diffusion
of dopants from capped, doped dielectric layer 1106 into
semiconductor material 1100 as discussed above for FIG. 20B. As
seen in FIG. 20G, dopants from the doped dielectric layer 1106 with
overlying cap layer 1110 have diffused into semiconductor material
1100 to form ultra-shallow channel-stop region 1108. Cap layer 1110
minimizes the outgassing of dopants upward from doped dielectric
layer 1106, thereby resulting in more dopants diffusing down into
the substrate material 1100. After the diffusion step is performed,
gate valve 280 is opened and both the cap layer 1110 and doped
dielectric layer 1106 may then etched away using remote microwave
plasma system 55 with appropriate etchant chemistry to provide
partially completed shallow trench isolation as shown in FIG. 20C,
ready for the remaining processing steps of FIGS. 20D-20E. When the
wafer is transferred out of chamber 15, gate valve 280 is in the
closed position. A chamber clean of chamber 15 can then be
performed by operating the plasma system 55 with gate valve 280
opened.
[0191] For shallow trench isolation between NMOS transistors in a P
type substrate, the doped dielectric film 1106 may be a BSG film.
For shallow trench isolation between PMOS transistors in an N type
substrate (or in N wells of CMOS circuits), the doped dielectric
film 1106 may be a PSG film or an arsenic-doped silicate glass
film. For smaller device geometries such as less than 0.35 .mu.m
having a trench 1102 with a depth of about 0.5 .mu.m, channel stop
region 1108 of about 0.1 .mu.m junction depth may be formed using a
BSG film 1106 about 200 .ANG. thick and a USG capping about 200
.ANG. thick, according to preferred embodiments of the present
invention.
[0192] It should be understood that simplified integrated circuit
900 is for illustrative purposes only. One of ordinary skill in the
art could implement the present method for fabrication of other
integrated circuits such as microprocessors, application specific
integrated circuits (ASICS), memory devices, and the like. Further,
the present invention may be applied to PMOS, NMOS, CMOS, bipolar,
or BiCMOS devices. Although ultra-shallow source/drain junctions
and ultra-shallow trench isolation applications are discussed
above, the present invention also may be used in other applications
where an ultra-shallow doped region is desired. The present
invention also may be used for forming undoped oxides as well as
doped oxides for use as various layers in integrated circuit
devices, including PMD, IMD, passivation, and damascene layers.
[0193] Exemplary wafer cleaning, deposition, and chamber cleaning
processes for in situ or individual operation within chamber 15 are
further described below, in accordance to various embodiments of
the present invention.
[0194] B. Cleaning Native Oxides Prior to Deposition
[0195] In accordance with a specific embodiment of the present
invention, native oxides that may exist on the silicon substrate or
region where an ultra-shallow doped junction is desired may be
cleaned prior to deposition of the doped dielectric layer that may
be used, for example, as a dopant diffusion source or as a PMD
layer. In these embodiments, the native oxides can be cleaned by
using fluorine radicals from a plasma formed with reactive clean
gases like NF.sub.3 by remote microwave plasma system 55. Use of in
situ processes in one chamber or alternately in chambers of the
same multichamber system permit enhanced quality in the
ultra-shallow junctions formed in accordance with these specific
embodiments, as well as providing for dielectric layers having low
moisture content and low shrinkage.
[0196] In a specific embodiment, chamber 15 is maintained at the
deposition temperature, a temperature ranging between about
300-650.degree. C., and preferably at about 550-600.degree. C., for
the entire cleaning process. Chamber 15 is maintained at a pressure
ranging between about 1-2 torr, preferably at about 1.5 torr, while
maintaining the temperature. Heater 25 is moved to a position about
600 mil from gas distribution plate 20, while gate valve 280 is
opened and the clean gas NF.sub.3 is introduced into applicator
tube 292 at a rate of about 600 sccm. The clean gas is introduced
into applicator tube 292 and the pressure is permitted to stabilize
for about 3 seconds before microwave energy is applied to the
NF.sub.3 in applicator tube 292. Microwave power of between about
500-2500 Watts, preferably between about 1000-1500 Watts, from
magnetron 711 operating in CW mode is then applied for about 5-10
seconds. The microwaves are transmitted from magnetron 711 through
the waveguide and optimizing system to enter applicator tube 292
through the window, as discussed above. UV lamp 731 ignites the
reactive gases in applicator tube 292 to form a plasma, with
ionization sustained by the microwave energy entering applicator
tube 292 at the window. The radicals from the upstream plasma
formed in applicator tube 292 are output to flow into inlet 290.
The radicals flow through the lined passage in enclosure assembly
200 to conduit 47 of clean manifold 270 through the opened gate
valve 280 and into outer annular passage 297 to enter chamber 15
and clean native oxides off the wafer. Used clean gas reactants and
oxide residues are then exhausted out of chamber 15 via the opened
throttle valve. The present description is for chamber 15 which has
a total volume of about 6 liters. It is recognized that flow values
may differ depending on the size and type of chamber used in other
embodiments.
[0197] In a specific embodiment, with chamber 15 maintained at
pressures lower than about 1-2 torr, rapid removal of fluorine
species occurred, resulting in poor cleaning results. At chamber
pressures higher than about 1-2 torr, recombination may occur due
to collision losses, as well as causing overheating and damage to
applicator tube 292. Chamber 15 should be maintained at pressure
levels where fluorine species are not rapidly removed,
recombination does not occur, and applicator tube 292 does not
break. In some embodiments, the chamber pressure may be limited by
the physical dimensions and material of applicator tube 292, when
microwave power is being applied. In a specific embodiment, the
pressure in applicator tube 292, when microwave power is applied,
may be about 3 times as much as the optimal chamber pressure. When
different applicator tubes are used with different flow rates, the
optimal chamber pressure will vary. Of course, any pressure may be
used when applicator tube 292 is used without microwaves being
applied.
[0198] Since the plasma is formed upstream of the wafer, only the
reactive fluorine radicals in the plasma are able to reach the
wafer to clean the native oxides from the wafer. As mentioned
above, the cleaning step preferably is done for about 5-10 seconds
for a typical native oxide of thickness of about 90 .ANG.. The
above cleaning step etches native oxides at a rate of about 2
.mu.m/minute. Of course, the total time of the cleaning step
depends on the thickness of the particular oxide to be cleared off
the wafer. With remote microwave plasma system 55 of present
invention, native oxides or other oxides may be etched and plasma
damage to the wafer is avoided.
[0199] Although the above wafer cleaning process conditions are
exemplary for the present embodiment, other conditions may also be
used. The above description discusses NF.sub.3, merely as an
example, in a Giga Fill.TM. Centura system available from Applied
Materials fitted for 200-mm wafers, as do the various deposition
descriptions below. However, other fluorine-containing or
chlorine-containing gases, such as NF.sub.3 and N.sub.2, NF.sub.3
and argon, NF.sub.3 and O.sub.2, a dilute F.sub.2, CF.sub.4,
C.sub.2F.sub.6, C.sub.3F.sub.8, SF.sub.6 or Cl.sub.2, etc., may be
used as well.
[0200] C. Exemplary Silicate Glass Depositions
[0201] According to the process of the present invention,
dielectric layers used as the dopant source, PMD layer, IMD layer,
oxide filling layer, capping layer, or other layers may be formed
using any of several different processes. The process recipes of a
BSG film, a PSG films, a BPSG film, and a USG film are set forth
below as examples of doped and undoped dielectric layers used in
the present invention. Of course, during the below described
deposition of various dielectric films, gate valve 280 remains
closed (unless remote plasma system 55 is being used for
deposition, in accordance with an alternative embodiment). The
exemplary processes may be performed in CVD apparatus 10, which is
a closed, single-wafer, SACVD system in preferred embodiments.
[0202] CVD apparatus 10 also may be adapted with different and/or
additional input gas supply sources to deposit BPSG, arsenic doped
silicate glass (AsSG), or other dielectric layers as well. Of
course, those of ordinary skill in the art will understand that
other process recipes and other reaction systems like plasma
enhanced CVD (PECVD) may also be used to deposit the dielectric
films. Examples of boron sources include TEB, trimethylborate
(TMB), diborane (B.sub.2H.sub.6), and other similar compounds.
Examples of phosphorus sources include triethylphosphate (TEPO),
triethylphosphite (TEP.sub.i), trimethylphosphate (TMOP),
trimethylphosphite (TMP.sub.i), and other similar compounds. In
addition to BSG or PSG films, arsenic doped oxides or arsenic
silicate glass (AsSG) also may be deposited using, for example, a
liquid source with an arsenic compound or an arsenic gas diluted in
argon, as examples. Examples of silicon sources include silane
(SiH.sub.4), TEOS, or a similar silicon source, and oxygen sources
include O.sub.2, O.sub.3, microwave-generated atomic oxygen (O), or
the like. In the descriptions below, flow rates for liquid sources
are provided in milligrams per minute (mgm) while gas flow rates
are provided in standard cubic centimeters per minute (sccm). In
these descriptions, liquid sources are vaporized using a Precision
Liquid Injection System, and liquid flow rates in mgm may be
converted to gas flow rates in sccm by multiplying liquid flow
rates by a factor of about 1.923 so that flow ratios may be
calculated accordingly. Preferably, stable doped dielectric films
may be formed using the TEOS/O.sub.3 chemistry in a SACVD process
to form damage-free, uniformly doped ultra-shallow junctions in
some embodiments. In other embodiments, a low moisture doped
dielectric film may be formed using TEOS/O.sub.3 chemistry with a
SACVD process conducted in CVD apparatus 10 to provide a planarized
insulating layer with high aspect ratio gap-fill, low shrinkage,
low metal contamination, and low fluorine incorporation.
[0203] 1. Exemplary BSG Film Deposition
[0204] As merely an example, the BSG film deposition recipe
described below is capable of forming a BSG film that may be useful
as a doped dielectric layer used as a dopant diffusion source. Of
course, the recipe may be varied depending on the particular use
for and desired qualities of the BSG layer. A PSG layer formed as a
doped dielectric layer used as a dopant diffusion source could
similarly be formed using the recipe below and appropriately
substituting the dopant source gas employed.
[0205] The exemplary BSG bulk film is deposited by heating the
wafer and heater 25 to a temperature of between about
200-650.degree. C., preferably to a temperature within the range of
about 400-650.degree. C. and most preferably to about 500.degree.
C., and maintaining this temperature range throughout the
deposition. With gate valve 280 closed, chamber 15 is maintained at
a pressure within a range of about 10-760 torr. Preferably, the
pressure is maintained within the range of about 400-600 torr, and
most preferably it is maintained at about 600 torr. Heater 25 is
positioned about 150-300 mil from gas distribution plate 20 and is
preferably positioned about 250 mil from plate 20.
[0206] A process gas including TEB as the source of boron, TEOS as
the source of silicon, and O.sub.3 as a gaseous source of oxygen is
formed. Being liquids, the TEB and TEOS sources are vaporized and
then combined with an inert carrier gas such as helium. The liquids
are vaporized either by liquid injection system in gas mixing
system 93, which provides greater control of the volume of reactant
liquid introduced. The flow rate of TEB is between about 50-550 mgm
depending on the desired dopant concentrations, while the TEOS flow
rate is between about 300-1000 mgm and preferably about 500 mgm.
The vaporized TEOS and TEB gases then are mixed with a helium
carrier gas flowing at a rate of between 3000-6000 sccm, preferably
at a rate of about 4000 sccm. Oxygen in the form of O.sub.3 is
introduced at a flow rate of between about 3000-6000 sccm and is
preferably introduced at a flow rate of about 5000 sccm. The ozone
mixture contains between about 5-16 weight percentage (wt %)
oxygen. The gas mixture is introduced into chamber 15 from the
distribution plate 20 to supply reactive gases to the substrate
surface where heat-induced chemical reactions take place to produce
the desired film.
[0207] The above conditions can result in a BSG film deposited at a
rate of between 500-1000 .ANG./minute. By controlling the
deposition time, BSG films having a thickness between about 50-500
.ANG. and preferably between about 100-300 .ANG. may be formed at
the process conditions described above in about 10-60 seconds. The
thickness of the BSG film deposited may thus be easily controlled.
Preferably, the wt % of boron in the resulting BSG film ranges
between about 2-8 wt % and preferably is about 6 wt %.
[0208] 2. Exemplary PSG Film Deposition
[0209] As merely an example, the PSG film deposition recipe
described below is capable of forming a PSG film that may be useful
as a PMD layer. Of course, the recipe may be varied depending on
the particular use for and desired qualities of the PSG layer.
Other doped dielectric layers besides PSG films may be used as PMD
layers by using similar recipes to the recipe below and
appropriately substituting the dopant(s) source gas(es)
employed.
[0210] The exemplary PSG bulk film is deposited by heating the
wafer and heater 25 to a temperature of between about
200-650.degree. C., preferably to a temperature within the range of
about 400-650.degree. C. and most preferably to about 600.degree.
C., and maintaining this temperature range throughout the
deposition. With gate valve 280 closed, chamber 15 is maintained at
a pressure within a range of about 10-760 torr. Preferably, the
pressure is maintained within the range of about 400-600 torr, and
most preferably it is maintained at about 450 torr. Heater 15 is
positioned about 250-350 mil from gas distribution plate 20 and is
preferably positioned about 330 mil from plate 20.
[0211] A process gas including TEPO as the source of phosphorus,
TEOS as the source of silicon, and O.sub.3 as a gaseous source of
oxygen is formed. Being liquids, the TEPO and TEOS sources are
vaporized by the liquid injection system and then combined with an
inert carrier gas such as helium. The flow rate of TEPO is between
about 10-100 mgm, preferably between about 5-30 mgm, most
preferably about 24 mgm, depending on the desired dopant
concentration, while the TEOS flow rate is between about 500-1500
mgm, preferably about 1000 mgm. The vaporized TEOS and TEPO gases
then are mixed with a helium carrier gas flowing at a rate of
between 2000-6000 sccm, preferably at a rate of about 4000 sccm.
Oxygen in the form of O.sub.3 (having between about 5-16 wt %
oxygen) is introduced at a flow rate of between about 2500-6000
sccm and is preferably introduced at a flow rate of about 4000
sccm. The gas mixture is introduced into chamber 15 from gas
distribution plate 20 to supply reactive gases to the substrate
surface where heat-induced chemical reactions take place to produce
the desired film.
[0212] The above conditions result in a PSG film deposited at a
rate of about 1780 .ANG./minute. By controlling the deposition
time, the thickness of the PSG film deposited may thus be easily
controlled. Preferably, the wt % of phosphorus in the resulting PSG
film ranges between about 2-8 wt % and preferably is about 4 wt
%.
[0213] 3. Exemplary BPSG Film Deposition
[0214] As merely an example, the BPSG film deposition recipe
described below is capable of forming a BPSG film that may be
useful as a PMD layer. Of course, the recipe may be varied
depending on the particular use for and desired qualities of the
BPSG layer.
[0215] The exemplary BPSG bulk film is deposited by heating the
wafer and heater 25 to a temperature of between about
100-800.degree. C., preferably to a temperature within the range of
about 400-650.degree. C. and most preferably to about 480.degree.
C., and maintaining this temperature range throughout the
deposition. With gate valve 280 closed, chamber 15 is maintained at
a pressure within a range of about 10-760 torr. Preferably, the
pressure is maintained within the range of about 150-600 torr, and
most preferably it is maintained at about 200 torr. Heater 15 is
positioned about 150-400 mil from gas distribution plate 20 and is
preferably positioned about 300 mil from plate 20.
[0216] A process gas including TEB as the source of boron, TEPO as
the source of phosphorus, TEOS as the source of silicon, and
O.sub.3 as a gaseous source of oxygen is formed. Being liquids, the
TEB, TEPO and TEOS sources are vaporized by the liquid injection
system and then combined with an inert carrier gas such as helium.
Of course, it is recognized that other sources of boron,
phosphorus, silicon, and oxygen also may be used. The flow rate of
TEB is preferably between about 150-200 mgm. The flow rate of TEPO
is between about 10-100 mgm, preferably between about 35-75 mgm,
most preferably about 24 mgm, depending on the desired dopant
concentration, while the TEOS flow rate is between about 300-700
mgm. The vaporized TEOS, TEB, and TEPO gases then are mixed with a
helium carrier gas flowing at a rate of between 2000-8000 sccm,
preferably at a rate of about 6000 sccm. Oxygen in the form of
O.sub.3 is introduced at a flow rate of between about 2000-5000
sccm and is preferably introduced at a flow rate of about 4000
sccm. The ozone mixture contains between about 5-16 wt % oxygen.
The gas mixture is introduced into chamber 15 from gas distribution
plate 20 to supply reactive gases to the substrate surface where
heat-induced chemical reactions take place to produce the desired
film.
[0217] The above conditions result in a BPSG film deposited at a
rate of between 3500-5500 .ANG./minute. By controlling the
deposition time, the thickness of the BPSG film deposited may thus
be easily controlled. The resulting BPSG film has a boron
concentration level of between 2-6 wt % and a phosphorus
concentration level of between 2-9 wt %.
[0218] The parameters in the above BSG, PSG, BPSG processes and in
the below USG processes should not be considered limiting to the
claims. For example, the present invention is also applicable to
silicon oxide films doped with other dopants including, for
example, arsenic. As another example, the flow values discussed
above apply for a chamber outfitted for 200-mm wafers, but may
differ depending on the type or size of the chamber used. One of
ordinary skill in the art can also use other chemicals, chamber
parameters, and conditions to produce similar films.
[0219] It is believed that film stability may be a factor in the
availability of dopant atoms in the doped dielectric films for
diffusion into the semiconductor material. Several methods to
improve film stability and improve the ability to control dopant
diffusion from these doped dielectric films into the semiconductor
material were investigated. Each method described may be performed
on a doped dielectric layer, after the layer is deposited using a
recipe such as one of the exemplary deposition recipes described
above. Furthermore, although methods described below are with
respect to treatment of a BSG (or PSG) film, the methods are
equally applicable to any doped silicon oxide film.
[0220] 4. Exemplary USG Film Depositions
[0221] a. Oxide Filling Material or Insulating Layer
[0222] According to one embodiment of the present invention, an
undoped silicate glass (USG) layer can be deposited in CVD
apparatus 10 for use, for example, as an oxide filling material for
filling a shallow trench used for shallow trench isolation. Of
course, the USG film also may be used as an IMD layer, an
insulating layer, or other layer. The exemplary USG recipe
discussed below provides a very dense and uniform film which can
survive annealing at temperatures of greater than 800.degree. C.
with minimal shrinkage. The USG film, which provides excellent gap
fill capability for high aspect ratio step coverage, can also
endure several etch processes at very uniform etch rate without
opening up any voids in the USG. The USG film, also can endure
chemical mechanical polishing (CMP) planarization without opening
up any voids or creases in the USG.
[0223] The wafer and heater 25 are heated to a temperature within
the range of about 200-650.degree. C., but preferably between about
550-650.degree. C., and then maintained at this temperature
throughout the deposition. Heater 25 is positioned about 250-400
mil away from gas distribution plate 20 and preferably at about 350
mil. With gate valve 280 closed, the pressure in chamber 15 is
maintained at a level of between about 10-760 torr, preferably
about 600 torr.
[0224] A process gas comprising oxygen and silicon sources is
introduced into the deposition chamber. In a preferred embodiment,
the silicon source is TEOS and the oxygen source is O.sub.3, but
those skilled in the art will recognize that additional silicon
sources such as SiH.sub.4, TMCT or similar sources, and other
oxygen sources such as O.sub.2, H.sub.2O, N.sub.2O,
microwave-generated atomic oxygen, and similar sources and mixtures
of the same also can be employed. When TEOS is used as a silicon
source, a carrier gas such as helium or nitrogen is employed. The
ratio of O.sub.3 to TEOS may range from about 2-17:1, but is
preferably between about 2-6:1.
[0225] The optimal total flow of the gaseous reactants will vary
according to the geometry and design of the deposition chamber. The
gas flow also can be varied to control the deposition rate.
Typically, TEOS is introduced at a flow rate of between about
500-2500 mgm and is preferably introduced at a flow rate of about
2000 mgm. O.sub.3 (between about 5-16 wt % oxygen) is introduced at
a flow rate of between about 2000-10000 sccm, preferably about 5000
sccm. Helium or nitrogen may be used as a carrier gas that is
introduced at a flow rate of between 2000-10000 sccm and preferably
about 7000 sccm. Usually, the total flow of gases into the
deposition chamber will vary between about 5000-20000 sccm,
preferably about 15000 sccm. Under the above conditions, deposition
rates of about 1450 .ANG./minute or greater are attainable. The
flow values above are for a 200-mm wafer chamber and will vary
depending on size of chamber used and size of wafer.
[0226] b. Capping Layer
[0227] According to another embodiment of the present invention,
the deposited BSG (or PSG) layer may be capped with a thin,
separate USG layer. The USG capping layer is a stable film that
does not readily absorb moisture. Thus, the USG capping layer
provides a hydrophobic surface on top of the BSG (or PSG) layer
that prevents moisture present in the ambient from being absorbed
into the BSG (or PSG) film. Furthermore, the USG capping layer is a
relatively dense film that impedes boron (or phosphorus) evolution.
The USG capping layer thereby facilitates controlled diffusion of
more dopant atoms in the doped dielectric layer downward into the
semiconductor material. Without the USG capping layer, some of the
dopant atoms may diffuse upward away from the semiconductor
material during the subsequent anneal or rapid thermal process.
Thus, the use of a capping layer contributes to controlling the
diffusion and the junction depth. The USG layer can be deposited in
a separate processing chamber from the BSG (or PSG) layer, but
preferably is done as an in situ process in chamber 15 where
deposition of the BSG (or PSG) layer also occurred. Of course, many
processes for forming a capping layer are possible.
[0228] The following process for forming a USG layer is described
as an example. An undoped silicate glass layer may also be used not
only as a capping layer, as described below, but as an insulating
dielectric layer without use of an underlying doped dielectric
layer.
[0229] The wafer and heater 25 are heated to a temperature within
the range of about 200-600.degree. C., but preferably about
500.degree. C., and then maintained at this temperature throughout
the deposition. Heater 25 is positioned about 250-350 mil away from
gas distribution plate 20 and preferably at about 300 mil. With
gate valve 280 closed, the pressure in chamber 15 is maintained at
a level of between about 50-760 torr, and is preferably at a
pressure of between about 200-600 torr, most preferably about 400
torr.
[0230] A process gas comprising oxygen and silicon sources is
introduced into the deposition chamber. In a preferred embodiment,
the silicon source is TEOS and the oxygen source is O.sub.3, but
those skilled in the art will recognize that additional silicon
sources such as silane, TMCT or similar sources, and other oxygen
sources such as O.sub.2, H.sub.2O, N.sub.2O and similar sources and
mixtures of the same also can be employed. When TEOS is used as a
silicon source, a carrier gas such as helium or nitrogen is
employed. The ratio of O.sub.3 to TEOS may range from about 2-17:1,
but is preferably between about 2-6:1.
[0231] The optimal total flow of the gaseous reactants will vary
according to the geometry and design of the deposition chamber. The
gas flow also can be varied to control the deposition rate.
Typically, TEOS is introduced at a flow rate of between about
500-1500 mgm and is preferably introduced at a flow rate of between
about 1000-1250 mgm. O.sub.3 (between about 5-16 wt % oxygen) is
introduced at a flow rate of between about 2000-10000 sccm,
preferably about 7000 sccm. Helium or nitrogen may be used as a
carrier gas that is introduced at a flow rate of between 2000-6000
sccm and preferably about 4000 sccm. Usually, the total flow of
gases into the deposition chamber will vary between about
5000-20000 sccm, preferably about 15000 sccm. Under the above
conditions, deposition rates of between about 500 and 1500
.ANG./minute are attainable. At such deposition rates, a USG layer
of about 100-200 .ANG. can be deposited in approximately 20
seconds. The flow values above are for a 200-mm wafer chamber and
will vary depending on size of chamber used and size of wafer.
[0232] The following processes for forming a USG capping layer are
described as examples. Preferred applications will have USG cap
layers of between about 50-500 .ANG., and preferably between about
100 and 300 .ANG.. A person of ordinary skill in the art, however,
will realize that capping layers of different thickness can be
employed depending on the specific application and device geometry
size. Depending on the application and gap sizes in which the
deposited film is used, it may be preferable, although not
essential, that the capping and doped dielectric layers be
relatively thin. For thin layers, the time to deposit and the time
to etch away are reduced compared to thicker layers. The USG
capping layer is deposited, and both the USG layer and the doped
dielectric layer are etched back. It is also recognized that
different capping layers such as other similar stable oxide films
may be utilized to cap the doped dielectric layer. Further, the USG
cap layer may be formed over doped dielectric films deposited by
APCVD, PECVD, or LPCVD, in place of SACVD. As discussed above, use
of chamber 15 for in situ performance of multiple process steps is
most preferred, with use of a multichamber system in which vacuum
is not broken during transfer of substrates between various
chambers in the multichamber system is also preferred.
[0233] According to another embodiment of the present invention, an
in situ USG or similar cap layer is formed on a doped dielectric
film by turning off the boron source or the phosphorus source just
before completion of deposition of the doped layer. In this
embodiment, the initial doped dielectric layer such as BSG (or PSG)
is formed as described above. Flow of the dopant source into
chamber 15 then is stopped while the thermal reaction continues for
an additional period of between 1-30 seconds. Preferably, the
thermal reaction continues for about 3-10 seconds. In this
embodiment, the dopant source is stopped by closing a valve on the
source's supply line so that the thermal reaction is maintained
without a dopant for at least 5 seconds.
[0234] Of course, stopping the dopant gas source must be
coordinated with the time it takes the gas to travel from the point
of the valve to the gas mixing system 93 and then through the
faceplate of plate 20. In most CVD machines several seconds is
required for gas to flow from the injection valve to the deposition
chamber, so the valve should be closed sufficiently in advance to
allow for these delays. Thus, if TEB is the boron source, closing
the valve on the TEB supply line several seconds before completion
of deposition of the BSG layer results in a thin USG cap which
prevents occurrence of the previously described moisture absorption
and outgassing phenomenon.
[0235] The in situ deposition of the USG cap formed on the doped
dielectric layer results in improved stability and immunity to
moisture absorption, and contributes to improved control of the
diffusion that forms ultra-shallow doped regions.
[0236] Instead of or in addition to the use of a USG capping layer,
a plasma treatment of the doped dielectric layer also may be used
to reduce moisture absorption and improve stability in the doped
dielectric layer. In those embodiments equipped with a RF plasma
system, this plasma densification treatment may be used where
plasma damage to the device is not a significant concern. In some
embodiments, the deposition at temperatures greater than about
500.degree. C. may be sufficient to provide a dense dielectric
film. The improved stability of the plasma-treated doped dielectric
layer contributes to improved control of the diffusion that forms
the ultra-shallow doped regions. Chamber 15 is maintained at
between about 1-5 torr during the plasma densification treatment.
With gate valve 280 closed, a plasma formed using a reactive gas
such as, for example, nitrogen (N.sub.2), ammonia (NH.sub.3), or
argon, is introduced into chamber 15. As merely one example of the
plasma treatment that may be used, a reactive gas such as N.sub.2
is introduced in gas mixing system 93 at a rate of about 1000 sccm
mixed with helium at 1000 sccm. RF plasma system is operated, for
example, at a power level of about 450 Watts at a RF frequency of
about 350 Megahertz (MHz) to create a plasma in chamber 15. The
plasma serves to passivate the surface of the doped dielectric
layer, which may have some nitridation on its surface. The plasma
treatment thus densifies the doped dielectric film. More dopants in
the densified doped dielectric film, which is resistant to moisture
absorption, are available for forming the ultra-shallow
junctions.
[0237] D. Heating Processes for in situ Deposition and/or for
Reflow
[0238] CVD apparatus 10 has high temperature capabilities allowing
an in situ heating step following a deposition process on the same
wafer for a two-step deposition/reflow process, or an in situ
heating step concurrent to a deposition process on the same wafer
for a one-step deposition/reflow process. For use as a PMD layer
formed over high aspect ratio transistors or isolation trenches an
undoped or doped dielectric film, such as PSG, often requires
planarization which is important in forming integrated circuit
devices. Planarization of a doped dielectric layer may be performed
by reflowing the layer at high temperatures. Performing reflow also
contributes to improving gap-fill of the deposited film, especially
for high aspect ratio features on the wafer. Of course, heating
steps for other purposes and applications also may be performed in
CVD apparatus 10. The following heating procedure discussed below
serves merely as an exemplary heating step which may be used for
reflow, but other heating steps for dopant drive-in in some
applications or for other purposes also can be done.
[0239] According to a specific embodiment, two-step
deposition/reflow process is described below. With gate valve 280
closed, chamber 15 may be maintained at a pressure of about 200-760
torr. With the wafer and heater 25 in the processing position
between about 200-400 mil, preferably between about 330-350 mil,
from distribution plate 20, the wafer and heater 25 are heated to a
high temperature of between about 500-800.degree. C., preferably
between about 550-650.degree. C., in chamber 15, for deposition
processing. Stopping reactive gas flows, the wafer may then be
heated at between about 750-950.degree. C., preferably between
about 750-850.degree. C. for about 5-30 minutes, preferably about
15-20 minutes, in order to reflow the dielectric layer, according
to a specific embodiment. The reflow temperature may be the same as
or higher than the deposition temperature in the two-step process.
Further, for a multiple-step deposition/reflow process, the
temperature may be ramped from the deposition temperature to an
intermediate temperature (or intermediate temperatures) before
being ramped to the reflow temperature. Of course, the time and
temperature for the heating steps may differ depending on the
particular application being performed and on the particular layer
being formed.
[0240] According to another specific embodiment, a one-step
deposition/reflow process is described. With gate valve 280 closed,
chamber 15 may be maintained at a pressure of about 200-760 torr.
With the wafer and heater 25 in the processing position between
about 200-400 mil, preferably between about 330-350 mil, from
distribution plate 20, the wafer and heater 25 are heated to a high
enough temperature of between about 750-950.degree. C., preferably
between about 750-850.degree. C., in chamber 15, for simultaneous
deposition and reflow processing to occur. Of course, the time and
temperature for the deposition/reflow step may differ depending on
the particular layer being formed.
[0241] As discussed above, keeping the wafer within the same
chamber 15 for multiple in situ processes prevents exposure of the
wafer to the environment, where moisture may be absorbed, and
contamination by impurities. Further, deposition of dielectric
films at temperatures greater than about 550.degree. C. can provide
dense and high quality films which do not form voids when heated.
Deposition of the deposited films at these temperatures also
reduces shrinkage.
[0242] E. Chamber Cleaning/Seasoning/Gettering Processes
[0243] After the processing step or multiple processing steps, such
as the exemplary steps discussed above, have been performed on the
wafer in chamber 15, the wafer is transferred out of chamber 15 for
subsequent process steps as needed. When the vacuum lock door is
closed, sealing chamber 15 without a wafer on heater 25, chamber 15
may undergo a chamber cleaning process to eliminate deposition
process residues such as undesired oxides and/or nitrides from
portions of chamber 15, including the unlined chamber walls in the
lower portion of chamber 15, the bottom of heater 25, as well as
other chamber components. To ensure reliable wafer-to-wafer
repeatability, the chamber clean removes any residues built up
during the deposition processes. These residues can be cleaned from
chamber components by using fluorine radicals, for example, from a
plasma formed with reactive clean gases by remote microwave plasma
system 55. Due to its high reactivity with F atoms, residue silicon
oxide can be removed by the formation of a SiF.sub.4 gas product
which may be pumped away out of chamber 15. The chamber cleaning
procedure discussed below may be performed after processing of
every wafer or every several wafers.
[0244] In a preferred embodiment of the present invention, NF.sub.3
is used as the clean gas to provide the fluorine radicals. The
present invention preferably uses remote microwave plasma system 55
to decompose NF.sub.3 gas and generate a flow of F atoms into
chamber 15. Using a fluorine chemistry with remote microwave plasma
system 55 of the present invention advantageously has low kinetic
energy and does not have physical sputtering effects or formation
of charging species in the subsequently deposited film, compared to
in situ plasma processes. Furthermore, consistent with
environmental requirements to reduce global warming effects, the
use of NF.sub.3 does not generate any long-lived perflouro-carbon
(PFC) products.
[0245] To ensure the best clean efficiency, the F flux as well as
its cleaning uniformity should be optimized. At a certain NF.sub.3
gas flow, there is a threshold microwave power setting, above which
the generation of F atoms are compensated by their recombination.
FIG. 21 shows the relationship between NF.sub.3 flow and microwave
saturation power that gives the highest clean rate without any
excessive hardware costs, in accordance with a specific embodiment
of the present invention. As shown in FIG. 21, the microwave
saturation power ranges from between about 1300-2100 Watts for
corresponding NF.sub.3 flows of between about 500-950 sccm,
according to the specific embodiment. For a preferred embodiment
discussed below, the microwave saturation power is about 2100 Watts
for a NF.sub.3 flow of about 950 sccm. The clean uniformity can be
controlled by chamber pressure as well as heater spacing, both of
which can adjust the mean free path of the gas species and pumping
profile. As discussed earlier, since the highest pressure that can
be tolerated by the above-discussed embodiment of applicator tube
292 is about 2 torr, spacing was used to optimize clean uniformity.
In other embodiments using different embodiments of applicator tube
292, both pressure and spacing may be used in the clean uniformity
optimization.
[0246] In an exemplary chamber cleaning process, chamber 15 is
maintained at a temperature ranging between about 300-650.degree.
C., more preferably at about 550-600.degree. C. throughout the
cleaning procedure, in preferred embodiments. Most preferably,
chamber 15 is maintained at the same temperature at which the
particular process is being run in chamber 15. For example, chamber
clean processes would be run at 600.degree. C. in those chambers
used, as an example discussed above, for depositing PSG films at
600.degree. C. With the throttle valve opened and gate valve 280
closed, heater 25 is positioned about 100-250 mil, preferably about
150 mil, from gas distribution plate 20 so that gas distribution
plate 20 is heated up. Heating up gas distribution plate 20 allows
a faster clean to occur. This heating step may be done for between
about 3-10 seconds, preferably about 5 seconds.
[0247] Then, pressure and clean gas flow are optimally stabilized
before the clean is performed. During the pre-clean stabilization
step, chamber 15 optimally should be maintained at pressure levels,
which are also used during the clean step, where fluorine species
are not rapidly removed and recombination does not occur. In the
pre-clean stabilization step, chamber 15 is brought to a pressure
between about 1-2 torr, preferably about 1.5 torr, with gate valve
280 is open. With chamber 15 maintained at pressures lower than
about 1-2 torr, rapid removal of fluorine species occurred,
resulting in poor chamber cleaning results. At chamber pressures
higher than about 1-2 torr, recombination may occur due to
collision losses, as well as causing overheating and damage to
applicator tube 292. Heater 25 is moved away from gas distribution
plate 20 to a distance of between about 450-700 mil, preferably
about 600 mil. The clean gas, NF.sub.3, is also introduced at a
rate of between about 600-1100 sccm, preferably about 950 sccm,
into applicator tube 292. This pre-clean stabilization step lasts
between about 2-6 seconds, preferably about 3 seconds before
microwave power is applied during the chamber clean step.
[0248] In the chamber clean step, the pre-clean stabilization
conditions in chamber 15 are maintained at a pressure ranging
between about 1-2 torr, preferably at about 2 torr. When the
cleaning procedure is performed, microwave power of between about
500-2500 Watts is applied to applicator tube 292. Preferably,
magnetron 711 provides about 2.45 GHz microwaves and is operated in
CW mode at about 2100 Watts for the preferred clean gas flow of
about 950 sccm. The microwaves are transmitted from magnetron 711
through the waveguide and optimizing system to enter applicator
tube 292 through the window, as discussed above. UV lamp 731
ignites the reactive gases in applicator tube 292 to form a plasma,
with ionization sustained by the microwave energy entering
applicator tube 292 at the window.
[0249] During the chamber clean step, fluorine radicals from the
plasma formed in applicator tube 292 to which microwaves are
applied may then flow through opened gate valve 280 and into
chamber 15 to clean surfaces of undesired oxide residues. Since the
plasma is formed upstream of chamber 15, only the reactive fluorine
radicals in the plasma are able to reach and remove the residue
built-up portions of chamber 15. Therefore, various portions of
chamber 15 are cleaned of deposition process residues while
minimizing direct plasma damage to the chamber 15. The chamber
clean lasts between about 30 seconds to about 10 minutes,
preferably between about 60-200 seconds, and most preferably for
about 160 seconds. Of course, the chamber clean time may vary
depending on the thickness and type of oxide residue in chamber 15.
As mentioned above, it is recognized that flow values may differ
depending on the size and type of the chamber, as well as the
dimensions and material of the applicator tube, used in other
embodiments. The above-described clean process also reduces
backside undesired residue deposition behind both the blocker and
gas distribution plates.
[0250] After the chamber clean, additional post-clean steps may be
performed. During the post-clean steps, chamber 15 is preferably
maintained at the above temperatures discussed for the above
deposition and clean processes. At the end of the chamber clean
step, clean gas flow is stopped and microwave power is no longer
supplied. Chamber 15 is pumped to remove most of the F residue
atoms. During this post-clean pumping step, heater 25 is moved to a
position of between about 1500-2200, preferably about 2000 mil,
from gas distribution plate 20 while the throttle valve is opened
and gate valve 280 remains open. The pumping step lasts between
about 5-20 seconds, preferably about 10 seconds, depending on the
amount of clean gas reactants and residue exhausted out of chamber
15. Clean endpoint detection system also may be utilized to assist
in determining the stop time for the post-clean pumping until
substantially all deposition process residues are removed from
chamber 15.
[0251] After the fluorine-based chamber cleaning procedure, there
may be some adsorption of active fluorine species on the surface of
the chamber walls, close to where the wafer would be located when
the next deposition process occurs. In the next deposition process,
the fluorine might then interact or be incorporated into the
deposited film, causing film sensitivity at the surface. This film
sensitivity manifests itself as a rough surface, which may be
problematic with the tolerances required by high integration
devices, resulting in device malfunctions. The present invention
provides the ability to getter any adsorbed fluorine from the
surface of chamber walls by several methods discussed below.
[0252] After the post-clean pumping step, a seasoning may be
performed to recombine all free F species by either chemical
reaction or trapping the F to the chamber walls through silicon
oxide (SiO.sub.2) deposition. The post-clean pumping and seasoning
steps are performed for reducing both particle formation and F
content inside subsequently deposited films.
[0253] Optimally, between the post-clean pumping step and seasoning
step is another stabilization step to stabilize chamber pressure
and gas flow and to move heater 25 into position for the seasoning
step. In this stabilization step, gate valve 280 is closed and
chamber 15 is maintained at a pressure of between about 20-70 torr,
preferably 50 torr. Heater 25 is also moved to a position of
between about 300-550 mil, preferably about 500 mil, from gas
distribution plate 20. In a specific embodiment, the seasoning step
presently described uses ozone and TEOS with helium as the carrier
gas to season chamber 15 for subsequent silicon oxide deposition.
Of course, other gases may be used in the seasoning and
pre-seasoning stabilization steps, depending on the type of silicon
oxide deposition desired. In the pre-seasoning stabilization step,
liquid TEOS at a flow rate of between about 200-400 mgm, preferably
about 300 mgm, is vaporized and transported with a helium carrier
gas flowing at a rate of between about 4000-8000 sccm, preferably
at about 6000 sccm, into chamber 15. Gas flows may be introduced
into chamber 15 via the normal inlets used for deposition or via
applicator tube 292 without application of microwaves. This
stabilization step lasts between about 5-25 seconds, preferably
about 15 seconds, before the seasoning step begins with the
introduction of the oxygen source to begin deposition of the
seasoning oxide onto chamber 15. In the thermal seasoning step,
ozone is introduced at the flow rate used for the particular
deposition process used (e.g., about 5000 sccm for the experimental
USG deposition process at 550.degree. C. discussed above, or about
4000 sccm for the experimental PSG deposition process at
600.degree. C. discussed above) for between about 10-20 seconds,
preferably about 15 seconds, to deposit a thin layer of silicon
oxide (e.g., the experimental USG deposition process having about
12.5 wt % oxygen, or the experimental PSG deposition process having
about 8 wt % oxygen) onto surfaces in chamber 15. During the
seasoning step, the ozone flow is optimally consistent with the
deposition process to minimize any fluctuation in ozone flow and
concentration. Seasoning chamber 15 thereby can trap fluorine atoms
that may have been adsorbed onto the surfaces of chamber 15.
[0254] Following the thermal seasoning step discussed above, final
stabilization and pumping steps may be performed. Optimally, these
final steps are also performed at the deposition temperatures
discussed above. In the final stabilization step, the throttle
valve is opened periodically to allow the chamber pressure to
adjust to atmosphere, while gate valve 280 remains closed. Heater
25 is moved to a position of between about 800-1000 mil, preferably
about 999 mil, from gas distribution plate 20. TEOS flow is
stopped, while helium and ozone flows remain the same as in the
seasoning step. The final stabilization step is performed for a
time period of between about 5-20 seconds, preferably about 10
seconds, before the final pumping step begins. In the final pumping
step, gate valve 280 remains closed and heater 25 is not moved. All
gas flows are stopped and the throttle valve is opened. The final
pumping step lasts between about 5-20 seconds, preferably about 10
seconds, before another wafer is introduced into chamber 15, which
is now ready for the next deposition process, heating, or wafer
cleaning step. It is recognized that final stabilization and
pumping steps also may be modified and similarly used with the
particular seasoning step or alternative gettering step (examples
discussed below) selected.
[0255] In embodiments alternative to those discussed above, the
pre-clean stabilization step discussed above may further include a
ramping of the microwave power from a low microwave power to the
final clean operating level of microwave power, allowing pre-clean
stabilization of pressure and microwave plasma generation. In a
preferred alternative embodiment, the pre-clean stabilization step
discussed above may be substituted with the following pre-clean
stabilization.
[0256] Allowing for simultaneous stabilization of pressure and
microwave power, the step of ramping up the microwave power to
generate a N.sub.2 (or other inert gas, depending on the clean gas
used) plasma provides a lower pressure shock profile on applicator
tube 292 upon NF.sub.3 plasma generation, in accordance with a
specific embodiment. Microwave power levels applied to magnetron
711 from microwave power supply 110 may be adjusted under the
control of processor 50. For example, the microwave power may be
ramped from zero to a level of about 300 Watts (or some other power
level between 0 and the final clean operating power level) during
the stabilization step, and then to 2100 Watts in the clean step,
to provide a more gradual, optimal stabilization process.
Specifically, after the heating step, heater 25 is moved to a
position about 600 mil from gas distribution plate 20 and N.sub.2
is introduced at a flow of between about 100-400 sccm, preferably
about 300 sccm, into applicator tube 292, while the throttle valve
remains open and gate valve 280 remains closed. After about 5
seconds, the throttle valve is closed and gate valve 280 is opened,
allowing pressure to stabilize for the next 5 seconds as chamber 15
is brought to the clean process pressure, about 1.5 torr in a
specific embodiment. Then, an intermediate level of microwave power
between about 200-400 Watts, preferably about 300 Watts, is applied
to applicator tube 292 to form a N.sub.2 plasma during the next 5
seconds. For the next 5 seconds, NF.sub.3 is also introduced into
applicator tube 292 while the microwave power level is ramped to
the clean level. Specifically, NF.sub.3 may be introduced at a rate
between about 600-1100 sccm, preferably about 950 sccm, into
applicator tube 292, while the microwave power level is ramped up
to the final microwave power clean operating level of about 2100
Watts. Then, N.sub.2 flow is stopped and plasma is generated using
only NF.sub.3, allowing for stabilization of the NF.sub.3 plasma
generation stabilization for about 5 seconds. From this point, the
clean may proceed, as discussed above. In the above discussed
alternative embodiment, both pressure and plasma generation are
stabilized prior to performing the cleaning step with the NF.sub.3
cleaning plasma. This alternative pre-clean pressure/plasma
stabilization may last for a total time period preferably between
about 20-30 seconds with each power level ramp-up allotted an
appropriate slice of time from the time period. Accordingly,
pressure shocks from an immediate, one-step application of high
microwave power (for example, from 0 to 2100 Watts) on applicator
tube 292 are thus minimized, resulting in an enhanced lifespan for
applicator tube 292.
[0257] Although the above described embodiment is a two-step power
level ramp-up, other embodiments may have multiple-step ramp-ups
(for example, from 0 to 300 to 1200 to 2100 Watts). Further, a
microwave power ramp-down step optionally may be performed between
the above described clean step and the post-clean pumping step.
Two-step or multiple-step ramp-downs also are possible for other
embodiments. Of course, the ramping may be continuous, a series of
discrete steps, or a combination thereof. For CVD systems which
have a RF plasma system, ramp-up and/or ramp-down of RF power
levels may be performed for pre-clean stabilization steps where an
in situ plasma chamber clean is used, in accordance with further
embodiments. Although specific times are discussed above for each
part of the stabilization, in other embodiments, the specific times
may be varied and parts of the stabilization may be combined or
eliminated to reduce time.
[0258] As an alternative to the thermal chamber seasoning discussed
above, chamber seasoning may be employed which uses TEOS and
O.sub.2. Vaporized TEOS may be introduced into chamber 15 via inlet
43 and gas mixing box 273 or using the bypass passage in the lid.
The O.sub.2 is sent through applicator tube 292 for radiation (for
example, between about 500-2100 Watts, preferably 2100 Watts) by
microwaves from magnetron 711 of microwave plasma system 55, to
produce atomic oxygen. O.sub.2 may be introduced into applicator
tube 292 at a flow rate of between about 50-200 sccm, preferably
about 100 sccm, while gate valve 280 is opened and chamber 15 is
maintained at a pressure of between about 1-2 torr, preferably
about 1.5 torr, and a temperature of between about 300-650.degree.
C., preferably between about 550-600.degree. C. The atomic oxygen
is able to react with the TEOS in chamber 15 to provide a
microwave-enhanced chamber seasoning. Alternatively, for
embodiments having a RF plasma system able to provide an in situ
plasma, vaporized TEOS may be introduced into chamber 15 where the
RF plasma system can create a plasma with which the atomic oxygen
may react for a RF-enhanced chamber seasoning.
[0259] As another alternative to chamber seasoning to provide
gettering of fluorine atoms from chamber surfaces, SiH.sub.4 may be
flowed at a rate of between about 50-200 sccm, preferably about 100
sccm, into chamber 15 to purge chamber 15. Silane may flow into
chamber 15 via line 85 into chamber 15 from one of the other supply
sources 90 (FIG. 1C) to gas mixing system 93 with closed gate valve
280, via other purge inlets to chamber 15 with closed gate valve
280, or via applicator tube 292 with or without application of
microwaves and with opened gate valve 280. During the silane purge
procedure, chamber 15 is maintained at a pressure of about 1-5 torr
and a temperature of between about 300-650.degree. C., preferably
between about 550-600.degree. C., with gate valve 280 closed.
Purging chamber 15 absorbs the F atoms and results in the formation
of SiF.sub.4 gas, which is then pumped out of chamber 15 via the
exhaust system. The endpoint detection system, as described above
in detail, then allows the system to determine when the chamber
cleaning process is completely done.
[0260] As a further alternative to seasoning or to purging chamber
15 with silane, as described above, gettering may be achieved by
providing active hydrogen into chamber 15. Hydrogen (e.g. H.sub.2
or other hydrogen source) would be used as the "clean gas" supply
source at a flow rate of between about 50-200 sccm, preferably
about 100 sccm, and sent via switching valve 105 into applicator
tube 292 via inlet 57 (FIG. 1C). Magnetron 711 is operated at CW
mode at a power level of between about 500-2500 Watts, preferably
about 1000 Watts, to provide microwave energy to applicator tube
292, thereby producing a plasma therein. The active hydrogen from
the plasma in applicator 292 would then flow through the lined
passage in enclosure assembly 200 and into conduit 47 for use in
chamber 15. Of course, for systems which also include RF plasma
systems, hydrogen may be introduced into chamber 15 and RF energy
applied in chamber 15 to provide the active hydrogen. During the
gettering procedure, chamber 15 is maintained at a pressure of
about 1-2 torr and, optimally, at the deposition temperature of
about 300-650.degree. C., preferably between about 550-600.degree.
C. with gate valve 280 open. The active hydrogen reacts with the
adsorbed fluorine to produce hydrogen fluoride (HF) vapor which may
then be pumped out of chamber 15. An endpoint detection system,
operating on similar principles as the endpoint system described
above but to detect changes in light intensity due to absorbance by
HF, may also be used.
[0261] Yet another alternative to seasoning, purging chamber 15
with silane, or using active hydrogen, is to provide ammonia into
chamber 15. Ammonia (NH.sub.3) would be used as the "clean gas"
supply source in gas panel 80 at a flow rate of between about
50-200 sccm, preferably about 100 sccm, and sent via switching
valve 105 into applicator tube 292 via inlet 57 (FIG. 1C).
Magnetron 711 is operated at CW mode at a power level of between
about 500-2500 Watts, preferably about 1000 Watts to provide
microwave energy to applicator tube 292, thereby producing a plasma
therein. The ammonia from the plasma in applicator 292 would then
flow through the lined passage in enclosure assembly 200 and into
conduit 47 for use in chamber 15. During the gettering procedure,
chamber 15 is maintained at a pressure of about 1-2 torr and,
optimally, at the deposition temperature of between about
300-650.degree. C., preferably between about 550-600.degree. C.
with gate valve 280 open. The ammonia reacts with the adsorbed
fluorine to produce an ammonium fluoride compound and HF vapor
which may then be pumped out of chamber 15. Of course, for systems
which also include RF plasma systems, ammonia may be introduced
into chamber 15 and RF energy applied in chamber 15 to provide the
ammonium fluoride compound and HF. An endpoint detection system,
operating on similar principles as the endpoint system described
above but detecting light intensity changes due to absorbance by
ammonium fluoride and HF, may also be used.
[0262] Although the cleaning process conditions described above are
exemplary for the present embodiment, other conditions may also be
used. The above description discusses NF.sub.3, merely as an
example, in a Giga Fill.TM. Centura chamber available from Applied
Materials fitted for 200-mm wafers and having 6 liters total
volume, as do the various deposition descriptions below. However,
other fluorine-containing or chlorine-containing gases, such as
NF.sub.3 and argon, NF.sub.3 and N.sub.2, NF.sub.3 and O.sub.2,
NF.sub.3 and atomic oxygen generated by microwave plasma system 55,
dilute F.sub.2, CF.sub.4, C.sub.3F.sub.8, SF.sub.6, C.sub.2F.sub.6,
Cl.sub.2, etc., may be used as well. Other gases besides those
described above also may be used for the gettering procedure. Also,
pre-seasoning stabilization steps would vary depending on the
particular type of seasoning/gettering process selected from the
various alternatives to the above discussed thermal seasoning. The
above descriptions for cleaning, gettering, and seasoning are
stated to occur at preferred temperatures (for example, about
550-600.degree. C.), but it is noted that, most preferably, chamber
15 is maintained at the same temperature at which the particular
process is being run in chamber 15. Of course, different
temperatures also may be used in other embodiments. Further, some
embodiments may combine, add, or eliminate some portions of the
cleaning, gettering, and seasoning steps described above.
[0263] III. Test Results And Measurements
[0264] A. Ultra-Shallow Doped Junctions
[0265] To demonstrate the operation of the apparatus and method
according to embodiments of the present invention, experiments were
performed measuring the sheet resistivity and junction depths of
ultra-shallow junctions formed using as examples BSG films
manufactured without a USG capping layer and formed using BSG films
with a USG capping layer. The uncapped BSG films were about 150
.ANG. thick, while the capped BSG films were about 150 .ANG. thick
with about a 200 .ANG. USG cap. Both capped and uncapped BSG films
were deposited on a low-resistivity N-type silicon wafer. Sheet
resistivity and junction depths of ultra-shallow junctions formed
using the uncapped and capped BSG films were measured. For films
deposited in chamber 15 of CVD apparatus 10, described in detail
above, gate valve 280 is closed during the film deposition steps
according to a specific embodiment. Actual process conditions used
in the experiments are as follows. Specifically, the BSG films were
deposited at a temperature of about 500.degree. C. and at a
pressure of about 600 torr. Spacing between the susceptor and
manifold was about 300 mil. Gas flows in the experiments included
introducing TEB into the chamber at a rate of about 200 mgm,
introducing TEOS at a rate of about 500 mgm, introducing oxygen
(O.sub.3) at a rate of about 5000 sccm, and introducing the helium
carrier gas at a rate of about 8000 sccm.
[0266] The above conditions resulted in BSG film deposited at a
rate of 700 .ANG./minute. The deposited BSG film had a thickness of
about 150 .ANG. for a process time of about 15 seconds.
[0267] In experiments where a USG cap was used, the USG capping
layer was formed in an in situ process immediately after the bulk
BSG layer was deposited. The preferred embodiments use a chamber
that is a closed system which minimizes moisture available to react
with the BSG film before deposition of the USG capping film. The
susceptor was heated to a temperature of about 500.degree. C., the
chamber was maintained at a pressure of about 600 torr, and the
susceptor was positioned about 300 mil from the gas distribution
manifold. TEOS, ozone and helium were introduced into the
deposition chamber at flow rates of about 500 mgm, 5000 and 5000
sccm, respectively. The above conditions resulted in a USG film
deposited at a rate of about 700 .ANG./minute. A USG film had a
thickness of about 200 .ANG. for a process time of about 15
seconds.
[0268] Diffusion of dopants from the uncapped and capped BSG films
is achieved by heating the film using annealing or a rapid thermal
process. For example, a rapid thermal process for 60 seconds in a
nitrogen (N.sub.2) ambient may result in a junction depth of about
500-1000 .ANG. depending on the temperature, time and dopant
concentration.
[0269] The parameters used in the experiments using BSG films
should not be limiting to the claims as described herein. One of
ordinary skill in the art can also use other chemicals, chamber
parameters, dopants, and conditions to produce BSG films or other
films such as PSG, AsSG, and others.
[0270] Experiments were conducted using uncapped BSG films of about
200 .ANG. thickness having about 6 wt % of boron. These experiments
illustrate the ability to form ultra-shallow junctions using BSG
films as the dopant source for a subsequent diffusion step.
[0271] At boron concentrations exceeding 6 wt % boron, uncapped BSG
films deposited at temperatures less than about 500.degree. C.
tended to become unstable and to crystallize within hours. As
mentioned above, crystallization reduces the amount of boron atoms
available for diffusion into the silicon substrate. Deposition of
BSG at temperatures greater than about 550.degree. C. are believed
to provide stable uncapped BSG films with boron concentration of
more than 6 wt %. For applications where boron concentrations
greater than 6 wt % boron are needed, BSG films may be optimally
capped with a USG film to prevent crystallization. By preventing
outgassing, the USG cap also provides the ability to control the
direction of the diffusion of dopant atoms into the silicon
substrate. The USG cap therefore prevents more boron atoms from
being lost so that more boron atoms are available for diffusion
that may be directed more easily into the silicon substrate.
[0272] To demonstrate the further advantages of using a capping
layer over the doped dielectric layer for some applications,
further experiments were conducted using BSG films having about a
150 .ANG. thickness and a 6.131 wt % boron, with about a 200 .ANG.
USG cap deposited over the BSG film. These further experiments
illustrate the ability to form ultra-shallow junctions using capped
BSG films as the dopant source for a subsequent diffusion step.
Sheet resistivity and junction depth of the ultra-shallow junctions
formed using uncapped and capped BSG films were measured. These
experiments show that subjecting the BSG film to a 1 minute rapid
thermal process at about 1050.degree. C. provides the capability to
control the sheet resistivity and junction depth of ultra-shallow
junctions formed with either the BSG film alone or with the BSG
film with USG cap.
[0273] FIGS. 22A-22C provide information about the effect of the
USG cap on the junction depth and dopant uniformity of the diffused
regions. Measurements for FIGS. 22A and 22C were performed using
solid state measurement equipment for the spreading resistance
profiles, as is well known to those skilled in the art. Carrier
concentration is shown as a function of depth. A "p" represents the
measured concentration of boron at a depth measured from the
silicon substrate surface, and an "N" represents the measured
concentration of the N type silicon substrate at a depth measured
from the silicon substrate surface. The junction depth is defined
as the position where the dopant concentration equals the substrate
concentration. In the present experiments, the silicon substrate
used had a substrate concentration of about 1.6.times.10.sup.14
carriers/cm.sup.3. Sheet resistivity of the diffused regions shown
in FIGS. 22A and 22C was measured using four-point probe (4pp)
techniques, as are well known to those skilled in the art. FIG. 22B
illustrates the total impurity profile of the wafer of FIG. 22A as
measured by the more elaborate method of
secondary-ion-mass-spectroscopy (SIMS) which is useful for
providing precision profile measurements in high-concentration or
shallow-junction diffusions, as is well known to those skilled in
the art.
[0274] Specifically, FIG. 22A is a graph showing the dopant profile
of an ultra-shallow junction formed after a heating step using a
6.131 wt % BSG layer having a USG capping layer. The BSG film was
about 150 .ANG. thick and the USG capping layer deposited on top of
the BSG film was about 200 .ANG. thick. The heating step was
performed by a rapid thermal process for about 60 seconds at about
1050.degree. C. The BSG and USG films were then stripped by
etching. As seen in FIG. 22A, the resulting junction has a depth of
about 0.06 .mu.m in the silicon substrate, and the dopant profile
appears fairly uniform. The maximum concentration of boron is about
6.times.10.sup.19 carriers/cm.sup.3. The sheet resistance of the
resulting junction was measured to be about 685 .OMEGA./cm.sup.2.
The 4pp sheet resistance was measured to be about 222
.OMEGA./cm.sup.2, with the summation of dose ions in the P type
layer measured (Ep) being 1.6.times.10.sup.14
carriers/cm.sup.2.
[0275] FIG. 22B illustrates the dopant depth profile as measured by
SIMS for an ultra-shallow junction described in FIG. 22A. From the
surface of the silicon substrate to a depth of about 100 .ANG. from
the surface, the concentration of boron ranges between about
2.times.10.sup.18 carriers/cm.sup.3 to about 1.times.10.sup.21
carriers/cm.sup.3. Between about 100 .ANG. to about 300 .ANG. from
the surface of the silicon substrate, the concentration of boron
ranges between about 1.times.10.sup.21 carriers/cm.sup.3 to about
3.times.10.sup.21 carriers/cm.sup.3. Below about 300 .ANG. from the
surface of the silicon substrate, the concentration of boron,
silicon, and oxygen diminishes rapidly indicating the bulk
substrate. The steep shallow junction shown in FIG. 22B
demonstrates the dopant incorporation possible according to an
embodiment of the present invention.
[0276] FIG. 22C is a graph showing the dopant profile of an
ultra-shallow junction formed without the heating step using a
6.131 wt % BSG layer having a USG capping layer. The BSG film was
about 150 .ANG. thick and the USG capping layer deposited on top of
the BSG film was about 200 .ANG. thick. No heating step was
performed. The BSG and USG films were stripped by an etching
technique. As seen in FIG. 22C, it appears a junction with a depth
of about 0.025 .mu.m has formed despite the lack of a heating step.
Apparently, the junction has formed due to the high dopant
concentration of boron in the BSG film diffusing into the silicon
substrate even without a heating drive-in step. The maximum
concentration of boron is about 7.times.10.sup.17
carriers/cm.sup.3. The sheet resistance of the resulting junction
was measured to be about 55 .OMEGA./cm.sup.2, with the summation of
dose ions in the P type layer (.SIGMA.p) being 4.9.times.10.sup.11
carriers/cm.sup.2.
[0277] FIG. 23A is a graph showing the dopant profile of the
junction formed with a heating step using an 8.084 wt % BSG layer
having a USG capping layer. FIG. 23B is a graph comparing the
dopant profiles of the junctions formed with the same heating step
using a 6.131 wt % BSG layer having a USG capping layer and an
8.084 wt % BSG layer having a USG capping layer, in order to
illustrate the effect of dopant concentration on junction depth.
FIGS. 23C and 23D show the effect of the temperature of the heating
step on junction depth and on sheet resistivity, respectively.
FIGS. 23E and 23F show the effect of the time of the heating step
on junction depth and sheet resistivity, respectively. The
spreading resistance profiles and sheet resistivity measurements of
FIGS. 23A-23F were performed using solid state equipment and
four-point probe measurements.
[0278] FIG. 23A is a graph showing the dopant profile of the
junction formed with a heating step using an 8.084 wt % BSG layer
having a USG capping layer. The BSG film was about 150 .ANG. thick
and the USG capping layer deposited on top of the BSG film was
about 200 .ANG. thick. A heating step was performed using a rapid
thermal process for about 60 seconds at about 1000.degree. C. The
BSG and USG films were stripped by an etching technique. As seen in
FIG. 23A, an ultra-shallow junction having a depth of about 0.12
.mu.m was formed with good dopant uniformity. The maximum
concentration of boron is about 1.times.20.sup.30
carriers/cm.sup.3. The sheet resistance of the resulting junction
was measured to be about 145 .OMEGA./cm.sup.2, with the summation
of dose ions (.SIGMA.p) being 7.9.times.10.sup.14
carriers/cm.sup.2. The 4pp sheet resistance was measured to be
about 96 .OMEGA./cm.sup.2.
[0279] FIG. 23B shows the dopant profiles of the junctions formed
with a heating step using different boron wt % BSG layers (in
particular 6.131 wt % and 8.084 wt %) having USG capping layers.
The BSG films were each about 150 .ANG. thick and the USG capping
layers deposited on top of the BSG films were each about 200 .ANG.
thick. The heating step performed was a rapid thermal process for
about 60 seconds at about 1000.degree. C. As seen in FIG. 23B, the
resulting junction depth for the 8.084 wt % BSG film is almost
twice as much as the resulting junction depth for the 6.131 wt %
BSG film.
[0280] FIGS. 23C and 23D are graphs showing the effect of heating
step temperature on dopant profiles and sheet resistivity,
respectively, for 6.131 wt % BSG films having USG capping layers.
The BSG films were about 150 .ANG. thick and the USG capping layers
deposited on top of the BSG films were about 200 .ANG. thick. The
heating steps were performed using a rapid thermal process for
about 60 seconds at temperatures of about 900.degree. C.,
950.degree. C., 975.degree. C., and 1000.degree. C. As shown in
FIG. 23C, the junction formed after the heating step at
1000.degree. C. is about 0.1 .mu.m, compared to the about 0.06
.mu.m junction formed after the heating step at the lower
temperature 975.degree. C. The sheet resistivity of the 6.131 wt %
BSG film was about 180 .OMEGA./cm.sup.2 for the heating step at
1000.degree. C., and about 600 .OMEGA./cm.sup.2 for the heating
step at 975.degree. C., as seen in FIG. 23D. A higher temperature
heating step (beyond 950.degree. C.) results in a deeper diffusion
depth for the shallow junction formed.
[0281] FIGS. 23E and 23F are graphs showing the effect of heating
step time on dopant profiles and sheet resistivity, respectively,
for 6.131 wt % BSG film having USG capping layers. The BSG films
were about 150 .ANG. thick and the USG capping layers deposited on
top of the BSG films were about 200 .ANG. thick. The heating step
was performed using a rapid thermal process at about 1000.degree.
C. for about 40 seconds and for about 60 seconds. As shown in FIG.
23E, the junction formed after about a 40-second heating step is
about 0.06 .mu.m, while the junction formed after a 60-second
heating step is abut 0.1 .mu.m. The sheet resistivity of the 6.131
wt % BSG films was about 230 .OMEGA./cm.sup.2 after the 40 second
heating step and about 150 .OMEGA./cm.sup.2 after the 60 second
heating step. Accordingly, it is seen that the length of time of
the heating step may determine the diffusion depth in forming
ultra-shallow junctions.
[0282] The above experiments of BSG used for ultra-shallow doped
junction formation are presented merely as examples to illustrate
aspects of the present invention and should not be considered as
limiting the scope of the present invention.
[0283] B. PSG For PMD Layer
[0284] To demonstrate the operation of the apparatus and method
according to embodiments of the present invention, experiments were
performed to deposit a PSG film, for example, as a PMD layer. Prior
to the deposition of PSG film as the PMD layer, the wafer has
typically been subjected to multiple processing steps to form, for
example, gate electrodes, oxide sidewalls, isolation trenches, etc.
In the experiments, the PSG films were deposited in a
resistively-heated Giga Fill.TM. Centura chamber (a closed system
having a total volume of about 6 liters and outfitted for 200-mm
wafers) manufactured by Applied Materials, Inc.
[0285] In the experiments, pre-deposition steps were performed to
bring chamber 15 to the desired deposition pressure and to
stabilize the gas/liquid flows before depositing the PSG film as a
PMD layer on a wafer. Of course, it is recognized that
pre-deposition steps may be varied from the below description
(which is merely an exemplary specific embodiment), as is optimal
for different deposition recipes. The pre-deposition steps reduce
unnecessary deposition on chamber walls and also contribute to
yielding uniform depth profiles for the deposited films. Before any
pre-deposition steps occur, a wafer is loaded in vacuum chamber 15
onto heater 25 through the vacuum-lock door, which is then closed.
Heater 25 is heated up to the processing temperature of about
600.degree. C., which is maintained throughout the pre-deposition
steps, the deposition step and the post-deposition steps.
[0286] In a first pre-deposition step, heater 25 is at a position
about 600 mil from gas distribution plate 20. With the throttle
valve open for about 5 seconds, helium at a flow rate of about 4000
sccm, and O.sub.2 at a flow rate of about 2900 sccm are introduced
into chamber 15. The neutral gases, helium and O.sub.2, are
introduced first into chamber 15 for their flow rates to stabilize.
These flow rates of helium and O.sub.2 are maintained throughout
the pre-deposition steps.
[0287] In the second pre-deposition step, the throttle valve is
closed and the pressure in chamber 15 is increased to the
deposition pressure. The second pre-deposition step lasts about 30
seconds and allows the pressure, which may initially fluctuate
somewhat around the desired deposition pressure, to stabilize in
chamber 15. Heater 25 is moved to the processing position of about
330 mil from gas distribution plate 20 in second pre-deposition
step.
[0288] In the third pre-deposition step, when the pressure in
chamber 15 has stabilized to the deposition pressure of about 450
torr, liquid TEOS is introduced to allow stabilization of TEOS and
helium flow. With the TEOS flow rate at about 1000 mgm, the
vaporized TEOS gas mixes with the helium carrier gas for about 3
seconds during the third pre-deposition step, before the deposition
step.
[0289] Having stabilized the chamber pressure, temperature, and
TEOS/helium gas flows, and adjusted the position of heater 25,
deposition processing can begin. At the onset of the deposition
step, O.sub.2 flow is terminated. Liquid TEPO is introduced at a
rate of about 24 mgm, and O.sub.3 (about 8 wt % oxygen) is
introduced at a rate of about 4000 sccm. Being liquids, the TEPO
and TEOS sources are vaporized by the liquid injection system and
then combined with the inert carrier gas helium. This mixture is
introduced into chamber 15 from gas distribution plate 20 to supply
reactive gases to the wafer surface where heat-induced chemical
reactions take place to produce the desired PSG film. The above
conditions result in a PSG film deposited at a rate of about 1780
.ANG./minute. By controlling the deposition time, a PSG film having
a thickness of about 5300 521 is formed at the process conditions
described above in about 404 seconds. The wt % of phosphorus in the
resulting PSG film is about 4 wt %.
[0290] After deposition, a termination step is performed that is
optimizes the stability of the deposited PSG film to provide
moisture and crystallization resistance. In the termination step,
which lasts for about 3 seconds, the deposition conditions are
maintained while TEPO flow is terminated. The termination step
therefore deposits a USG capping layer in an in situ manner in
chamber 15, by the gas termination method discussed above. The USG
layer is very thin compared to the thickness of the bulk PSG
film.
[0291] After the PSG deposition and USG deposition steps,
post-deposition steps are utilized to control the ramping down of
chamber pressure and to control gas shut-off. By adjusting the
pressure and gas shut-off, the post-deposition steps help reduce
particle formation which otherwise can cause wafer contamination
and damage.
[0292] In a specific embodiment, three post-deposition steps were
used. In the first post-deposition step immediately following the
above termination step, TEOS flow is terminated while heater 25 is
moved into a position about 600 mil from gas distribution plate 20.
Also, the throttle valve is opened periodically to allow chamber
pressure to gradually ramp down during the first post-deposition
step, which lasts about 15 seconds. In the second post-deposition
step, the throttle valve is opened periodically to ramp down
chamber pressure for the third post-deposition step (the pumping
step), as helium flow into chamber 15 is terminated by pumping it
through a bypass valve. Heater 25 is also moved lower to a position
about 999 mil from plate 20 during the second post-deposition step,
which lasts about 15 seconds. In the third post-deposition step,
which lasts about 3 seconds, the throttle valve is opened and
O.sub.3 flow into chamber 15 is terminated by pumping it through a
final valve.
[0293] The above experimental conditions for the deposition of PSG
suitable for being used as a PMD layer are optimal to provide the
best film quality with high throughput. By enhancing surface
diffusion at increased surface temperature, the thermal PSG film
deposited using the TEOS/O.sub.3 chemistry at temperatures of about
600.degree. C. exhibited excellent step coverage, more cross-linked
structure, and more stable oxidization structure for P and Si,
which yielded excellent film quality. The deposited PSG film was
high quality in terms of flow-like step coverage, high moisture
resistance, high breakdown voltage, smooth surface, no surface
damage (i.e., plasma damage), and no fixed charge. The deposited
PSG film exhibited good film thickness uniformity. Specifically,
film thickness uniformity (49 pt., 1.sigma.) at about 1.2 .mu.m
thickness of the deposited PSG film was measured to be less than
about 1.5.
[0294] FIG. 24A is a photomicrograph demonstrating the as-deposited
gap fill capabilities of PSG films deposited at 600.degree. C. in
accordance with a specific embodiment of the present invention. In
particular, the PSG film deposited at 600.degree. C. was shown to
be capable of filling high aspect ratio gaps having a height (h)
and a spacing (w) without the formation of voids, as seen in FIG.
24A. FIG. 24B is a simplified diagram (not shown to scale) of a
section of the integrated circuit structure shown in FIG. 24A. As
seen in FIG. 24B, substrate 1200 has stacked gate structures,
specifically electrodes 1220 with tungsten silicide (WSi) caps
1240, formed thereon. An oxide layer 1260 is deposited onto stacked
gate structures to form high aspect ratio gaps with h of about 0.35
.mu.m and w of about 0.08 .mu.m shown by dotted lines, as seen in
FIGS. 24A-24B. FIG. 24A therefore demonstrates an exemplary
structure with high aspect ratio (about 4.3:1) gaps that are filled
by PSG film 1280, which is used as a PMD layer. Deposited at about
600.degree. C. using the preferred recipe discussed above, PSG film
1280 exhibits excellent high aspect ratio gap fill capability
without the need for a reflow typically done at about
750-800.degree. C., which is often inconsistent with increasingly
tight thermal budgets.
[0295] In addition to having excellent gap fill capability for high
aspect ratios, PSG films deposited at about 600.degree. C.
advantageously are dense films that exhibit high resistance to
moisture absorption. Moisture absorption of the deposited PSG film
deposited was measured using conventional Fourier Transform
Infrared spectroscopy (FTIR) techniques, as are well known to one
of ordinary skill in the art. FIG. 25 illustrates the FTIR spectra
of a PSG film deposited at about 600.degree. C. under the following
exemplary process conditions. According to a specific embodiment,
the exemplary process conditions include TEOS flow of about 1000
mgm, TEPO flow of about 24 mgm, helium flow of about 6000 sccm, and
ozone (about 12 wt % oxygen) flow of about 4000 sccm, at a pressure
of about 400 torr and spacing of about 330 mil between heater 25
and gas distribution plate 20. The PSG deposition time was about
600 seconds. As seen in FIG. 25, the FTIR spectra of the PSG film
deposited at about 600.degree. C. demonstrated no water spikes
indicating moisture absorption, and no measurable change in
moisture absorption was seen over about 155 hours after deposition,
illustrating the PSG film stability over extended periods.
[0296] As demonstrated by FIG. 25, the deposited PSG film is dense,
resistant to absorbing moisture. Deposition of a PSG film at high
temperatures, for example at about 600.degree. C., tends to drive
out any moisture that might be absorbed into the film, resulting in
a dense film. As a dense film, the PSG film deposited at high
temperature has the advantage of not requiring an additional step
for further densification of the film. The dense nature of the
deposited PSG film makes it compatible for use as a PMD layer which
can be planarized either by a subsequent anneal at a temperature
greater than about 1000.degree. C., or preferably by a CMP step. In
addition to moisture absorption resistance, the present PSG film
deposited at high temperatures is able to provide good film
thickness uniformity, as well as good gap fill without formation of
voids or weak seams that can cause subsequent device problems. The
high temperature PSG film is particularly useful as a PMD layer as
it provides good phosphorus incorporation (between about 2-8 wt %
phosphorus), which is important for gettering or trapping mobile
ions such as sodium (Na+) ions that might otherwise migrate and
cause shorting in the device.
[0297] The above description of experiments depositing and
measuring characteristics of the deposited PSG film demonstrates
its suitability for use, for example, as a PMD layer. However, the
description should not be considered as limiting the scope of the
invention.
[0298] C. USG for Oxide Filling Layer in Shallow Trench
Isolation
[0299] To demonstrate the operation of the apparatus and method
according to embodiments of the present invention, experiments were
performed to deposit a USG film, for example, as a high quality
oxide filling layer for shallow trench isolation. Prior to the
deposition of USG film as the high quality oxide filling layer, the
wafer has typically been subjected to multiple processing steps to
form, for example, gate electrodes, oxide sidewalls, isolation
trenches, etc. In the experiments, the USG films were deposited in
a resistively-heated Giga Fill.TM. Centura chamber (a closed system
having a total volume of about 6 liters and outfitted for 200-mm
wafers) manufactured by Applied Materials, Inc.
[0300] In the experiments, pre-deposition steps were performed to
bring chamber 15 to the desired deposition pressure and to
stabilize the gas/liquid flows before depositing the USG film as a
filling layer on a wafer. Of course, it is recognized that
pre-deposition steps may be varied from the below description
(which is merely an exemplary specific embodiment), as is optimal
for different deposition recipes. The pre-deposition steps reduce
unnecessary deposition on chamber walls and also contribute to
yielding uniform depth profiles for the deposited films. Before any
pre-deposition steps occur, a wafer is loaded in vacuum chamber 15
onto heater 25 through the vacuum-lock door, which is then closed.
Heater 25 is heated up to the processing temperature of about
550.degree. C., which is maintained throughout the pre-deposition
steps, the deposition step and the post-deposition steps.
[0301] In a first pre-deposition step, heater 25 at a position
about 600 mil from gas distribution plate 20. With the throttle
valve open for about 5 seconds, helium at a flow rate of about 7000
sccm, and O.sub.2 at a flow rate of about 2900 sccm are introduced
into chamber 15. The neutral gases, helium and O.sub.2, are
introduced first into chamber 15 for their flow rates to stabilize.
These flow rates of helium and O.sub.2 are maintained throughout
the pre-deposition steps.
[0302] In the second pre-deposition step, the throttle valve is
closed and the pressure in chamber 15 is increased to the
deposition pressure. The second pre-deposition step lasts less than
about 40 seconds and allows the pressure, which may initially
fluctuate somewhat around the desired deposition pressure, to
stabilize in chamber 15. Heater 25 is moved to the processing
position of about 350 mil from gas distribution plate 20 during the
second pre-deposition step.
[0303] In the third pre-deposition step, when the pressure in
chamber 15 has stabilized to the deposition pressure of about 600
torr, liquid TEOS is introduced to allow stabilization of TEOS and
helium (or nitrogen) flow. With the TEOS flow rate at about 2000
mgm, the vaporized TEOS gas mixes with the helium (or nitrogen)
carrier gas for about 5 seconds during the third pre-deposition
step, prior to the deposition step.
[0304] Having stabilized the chamber pressure, temperature, and
TEOS/helium gas flows, and adjusted the position of heater 25,
deposition processing can begin. At the onset of the deposition
step, O.sub.2 flow is terminated while O.sub.3 (about 12.5 wt %
oxygen) is introduced at a rate of about 5000 sccm. Being liquid,
the TEOS source is vaporized by the liquid injection system and
then combined with the inert carrier gas helium. This mixture is
introduced into chamber 15 from gas distribution plate 20 to supply
reactive gases to the wafer surface where heat-induced chemical
reactions take place to produce the desired USG film. The above
conditions result in a USG film deposited at a rate of about 1450
.ANG./minute. By controlling the deposition time, a USG film having
a thickness of about 10000 .ANG. is formed at the process
conditions described above in about 414 seconds.
[0305] After USG deposition, a purge step is performed that is
optimizes the stability of the deposited USG film to provide
moisture resistance. In the purge step, which lasts for about 3
seconds, the deposition conditions are maintained while TEOS flow
is terminated.
[0306] After the USG deposition step and purge step,
post-deposition steps are utilized to control the ramping down of
chamber pressure and to control gas shut-off. By adjusting the
pressure and gas shut-off, the post-deposition steps help reduce
particle formation which otherwise can cause wafer contamination
and damage.
[0307] In a specific embodiment, three post-deposition steps were
used. In the first post-deposition step immediately following the
above termination step, the carrier gas flow into chamber 15 is
terminated by pumping it through bypass valve. Heater 25 is moved
into a position about 600 mil from gas distribution plate 20, as
the throttle valve is opened periodically to gradually ramp down
chamber pressure during the first post-deposition step, which lasts
about 15 seconds. In the second post-deposition step, the throttle
valve is opened periodically to continue ramping down chamber
pressure, and O.sub.3 flow into chamber 15 is continued. Heater 25
is also moved lower to a position about 600 mil from plate 20
during the second post-deposition step, which lasts about 15
seconds. In the third post-deposition step, which lasts about 3
seconds, the throttle valve is opened and O.sub.3 flow into chamber
15 is terminated by pumping it through a final valve.
[0308] The above experimental conditions for the deposition of USG
suitable for being used as a high quality oxide filling layer for
shallow trench isolation are optimal to provide the best film
quality with high throughput. In shallow trench isolation
applications, the deposited USG film should be capable of void-free
gap fill (typically at a nominal angle of about 85.degree.), in
addition to being a very dense and uniform film. The deposited USG
film exhibited good film thickness uniformity. Specifically, film
thickness uniformity (49 pt., 1.sigma.) at about 5000 .ANG.
thickness of the deposited USG film was measured to be less than
about 1.5.
[0309] FIGS. 26A and 26B are photomicrographs demonstrating the
relative gap fill capabilities of TEOS/O.sub.3 USG films deposited
at about 400.degree. C. and about 550.degree. C., respectively,
after reflow at about 1050.degree. C. and a 6:1 buffered oxide etch
(BOE), in accordance with a specific embodiment of the present
invention. In particular, FIG. 26A illustrates a trench structure
having about 0.35 .mu.m width and about 0.70 .mu.m depth (about 2:1
aspect ratio gap) with a filling layer that is a USG film deposited
at about 400.degree. C. after a reflow at about 1050.degree. C.
FIG. 26A shows large voids in the deposited USG film, indicating
that the USG film deposited at about 400.degree. C. is not very
dense and appears to have been prone to shrinkage. Even after a
reflow at a temperature above about 1000.degree. C., which can
densify a USG film to some extent, the USG film deposited at the
temperature of about 400.degree. C. is not very dense and does not
survive the high temperature anneal or a subsequent wet etch
processing without opening up voids. In comparison, FIG. 26B shows
a trench structure having about 0.18 .mu.m width and about 0.45
.mu.m depth (about 2.5:1 aspect ratio gap) with a void-free filling
layer that is a USG film deposited at about 550.degree. C. after a
reflow at about 1050.degree. C. and a subsequent wet etch
processing. The USG film deposited at about 550.degree. C. is
capable of filling high aspect ratio gaps without the formation of
voids after reflow, unlike USG films deposited at 400.degree. C.,
as seen from FIGS. 26A and 26B. After etch processes at very
uniform etch rates, USG films deposited at about 550.degree. C.
retain their superior step coverage without opening up voids.
[0310] As further evidence of the high aspect ratio gap filling
capability of USG films deposited at about 550.degree. C., FIG. 27
is a photomicrograph demonstrating the gap fill capability of the
deposited USG film after an anneal at about 1000.degree. C. and a
subsequent wet etch processing, in accordance with a specific
embodiment of the present invention. FIG. 27 shows a trench
structure having about 0.16 .mu.m width and about 0.48 .mu.m depth
(about 3:1 aspect ratio gap) with a filling layer that is a USG
film deposited at about 550.degree. C. after a reflow at about
1000.degree. C. The trench structure of FIG. 27 has a smaller
spacing and a higher aspect ratio than the trench structures shown
in FIGS. 26A and 26B, illustrating the superior gap filling
capability of the USG film deposited at about 550.degree. C.
[0311] In addition to having excellent gap fill capability for high
aspect ratios, USG films deposited at about 550.degree. C.
advantageously are dense films that exhibit high resistance to
moisture absorption. Moisture absorption of the deposited USG film
deposited was measured using conventional FTIR techniques. FIG. 28
illustrates the FTIR spectra of a USG film deposited at about
550.degree. C. under the following exemplary process conditions,
according to a specific embodiment. According to the specific
embodiment, the exemplary process conditions include TEOS flow of
about 2000 mgm, helium flow of about 7000 sccm, and ozone (about
12.5 wt % oxygen) flow of about 5000 sccm, at a pressure of about
600 torr and spacing of about 350 mil between heater 25 and gas
distribution plate 20. As seen in FIG. 28, the FTIR spectra of the
USG film deposited at about 550.degree. C. demonstrated low
moisture absorption (less than about 1 wt % moisture). Further,
FIG. 28 also illustrates that a moisture increase of less than
about 0.5 wt % moisture in the USG film was seen over about 160
hours after deposition, indicating the stability of the USG film
over extended periods.
[0312] Accordingly, as supported by FIG. 28, the deposited USG film
is dense, resistant to absorbing moisture. Deposition of a USG film
at high temperatures, for example at about 550.degree. C., tends to
drive out most moisture that might be absorbed into the film,
resulting in a dense film. As a dense film, the USG film deposited
at high temperatures of at least about 550.degree. C. has the
advantage of being less prone to shrinkage that might result in
void formation after an annealing step and a subsequent wet etch
processing, compared to USG films deposited at lower temperatures.
The dense nature of the deposited USG film makes it compatible for
use as a high quality oxide layer for filling trenches used in
shallow trench isolation applications. Due to its high density, USG
films deposited at high temperatures and used as oxide filling
layers can be planarized by either a subsequent anneal or a CMP
step, with minimized likelihood of opening up voids. In addition to
moisture absorption resistance and good film thickness uniformity,
the present USG film deposited at high temperatures provides
excellent high aspect ratio gap fill without formation of voids or
weak seams that can cause subsequent device problems.
[0313] In general, high pressure O.sub.3/TEOS USG films may exhibit
pattern or surface sensitivity effects, resulting in uneven
deposition, which is undesirable. It has been seen that problems
with uneven deposition are worsened with higher O.sub.3/TEOS
ratios. Advantageously, deposition of USG films at high
temperatures such as at least about 550.degree. C. requires use of
more TEOS in order to achieve adequate deposition rates.
Accordingly, the O.sub.3/TEOS ratio of USG films deposited at high
temperatures is low (less than about 5:1), thereby eliminating any
pattern or surface sensitivity effects. Moreover, the film quality
(e.g., density, shrinkage, etc.) is high for USG films deposited at
high temperatures. Because of the high density of these high
temperature deposition USG films, plasma densification treatments
or plasma oxide caps are not needed, thereby avoiding any plasma
damage to the wafer. The lack of a plasma from such treatments in
the chamber thus reduces possibility of metal contamination and
potential shorting of devices in the wafer. Compared to low
temperature thermal USG films, which often require a plasma
densification treatment or plasma oxide cap and may shrink to open
voids after an anneal, thermal USG films deposited at temperatures
of about 550.degree. C. exhibit excellent gap fill capability,
minimal shrinkage, and uniform film density, and low metal
contamination, without plasma damage, in accordance with the
present invention.
[0314] The above description of experiments demonstrates the
suitability of the deposited USG film for use, by way of example,
as a high quality oxide layer for filling high aspect ratio
trenches for shallow trench isolation. The same CVD apparatus also
may be used to deposit USG films at temperatures lower than
500.degree. C. for IMD applications. Of course, the above
description should not be considered as limiting the scope of the
invention.
[0315] It is to be understood that the above description is
intended to be illustrative and not restrictive. Many embodiments
will be apparent to those of skill in the art upon reviewing the
above description. By way of example, the inventions herein have
been illustrated primarily with regard to a USG, BSG, PSG, and BPSG
process recipes, but they are not so limited. For example, the
dielectric film formed according to other embodiments may be an
arsenic doped silicon oxide film, or other doped film. As another
example, the deposition of dielectric films has been described
using carrier gas such as helium, but other carrier gases like
argon or nitrogen, may be used as well. As a further example,
dielectric layers have been described for particular applications,
including doped junction formation, PMD layers, IMD layers, oxide
filling layers, capping layers, etc. Of course, it is recognized
that the same CVD apparatus discussed above may be used to deposit
dielectric layers at temperatures lower than about 400.degree. C.,
as well as temperatures above 500.degree. C. Additionally, various
aspects of the present invention may also be used for other
applications. Those skilled in the art will recognize other
equivalent or alternative methods of depositing the dielectric
layer while remaining within the scope of the claims of the present
invention. The scope of the invention should, therefore, be
determined not with reference to the above description, but should
instead be determined with reference to the appended claims, along
with the full scope of equivalents to which such claims are
entitled.
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