U.S. patent application number 10/021216 was filed with the patent office on 2002-06-20 for manufacturing method of ink-jet haead.
This patent application is currently assigned to KONICA CORPORATION. Invention is credited to Yamada, Minoru.
Application Number | 20020073544 10/021216 |
Document ID | / |
Family ID | 18851571 |
Filed Date | 2002-06-20 |
United States Patent
Application |
20020073544 |
Kind Code |
A1 |
Yamada, Minoru |
June 20, 2002 |
Manufacturing method of ink-jet haead
Abstract
In a method for manufacturing an ink-jet print head in which ink
channels are formed on a member including a piezoelectric body, and
ink is jetted from each of the ink channels by applying a voltage
to electrodes provided on the piezoelectric body according to each
of the ink channels, thereby driving the piezoelectric body, the
method includes the steps of: plating a surface of a channel plate
having a plurality of grooves for the ink channels thereby forming
a thin-film plating layer which is thinner than a desired
thickness; removing a part of the thin-film plating layer by a
laser beam; and plating again the channel plate thereby forming an
additional plating layer on the thin-film plating which has not
been removed by the laser beam, and thereby forming the electrodes
of the desired thickness.
Inventors: |
Yamada, Minoru; (Tokyo,
JP) |
Correspondence
Address: |
FRISHAUF, HOLTZ, GOODMAN, LANGER & CHICK, P.C.
25th Floor
767 Third Avenue
New York
NY
10017-2023
US
|
Assignee: |
KONICA CORPORATION
Tokyo
JP
|
Family ID: |
18851571 |
Appl. No.: |
10/021216 |
Filed: |
December 12, 2001 |
Current U.S.
Class: |
29/890.1 |
Current CPC
Class: |
B41J 2/1634 20130101;
B41J 2/1643 20130101; H05K 3/027 20130101; Y10T 29/49401 20150115;
B41J 2/1609 20130101 |
Class at
Publication: |
29/890.1 |
International
Class: |
B21D 053/76 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 18, 2000 |
JP |
384020/2000 |
Claims
What is claimed is:
1. A method for manufacturing an ink-jet print head in which ink
channels are formed on a member including a piezoelectric body, and
ink is jetted from each of the ink channels by applying a voltage
to electrodes provided on the piezoelectric body according to each
of the ink channels thereby driving the piezoelectric body, the
method comprising the steps of: plating a surface of a channel
plate having a plurality of grooves for the ink channels thereby
forming a thin-film plating layer which is thinner than a desired
thickness; removing a part of the thin-film plating layer by a
laser beam; and plating again the channel plate thereby forming an
additional plating layer on the thin-film plating which has not
been removed by the laser beam, and thereby forming the electrodes
of the desired thickness.
2. The method of claim 1, wherein the electrodes are made of nickel
or copper.
3. A method for manufacturing an ink-jet print head in which ink
channels are formed on a member including a piezoelectric body, and
ink is jetted from each of the ink channels by applying a voltage
to electrodes provided on the piezoelectric body according to each
of the ink channels thereby driving the piezoelectric body, the
method comprising the steps of: adsorbing a catalyst onto a channel
plate having a plurality of grooves for the ink channels; removing
a part of the catalyst by a laser beam; and plating at least one
side surface and a bottom surface of the channel plate, thereby
forming a plating layer serving as the electrodes on the catalyst
which has not been removed by the laser beam.
4. A method for manufacturing an ink-jet print head in which ink
channels are formed on a member including a piezoelectric body, and
ink is jetted from each of the ink channels by applying a voltage
to electrodes provided on the piezoelectric body thereby driving
the piezoelectric body according to each of the ink channels, the
method comprising the steps of: adhering a channel plate having a
plurality of grooves for the ink channels and a cover plate
together, thereby forming a print head chip; forming a plating
layer serving as the electrodes on both inside and outside of each
of a plurality of pipe-shaped channels, which have been formed on
the print head chip for the ink channels; and removing a part of a
plating layer formed on an outside surface of the print head chip
by a laser beam, thereby forming the electrodes inside the
pipe-shaped channels and on an outside surface of the print head
chip.
5. The method of claim 4, wherein the plating layer formed as the
electrodes have a plating layer thickness thinner than a desired
thickness, and the method further comprises the step of plating
again the inside of each of the plurality of pipe-shaped channels
and the outside surface of the print head chip after the step of
the removing the part of the thin-film of the plating layer by the
laser beam, thereby forming an additional plating layer on the
thin-film of the plating layer which has not been removed by the
laser beam.
6. The method of claim 4, wherein the electrodes are made of nickel
or copper.
7. A method for manufacturing an ink-jet print head in which ink
channels are formed on a member including a piezoelectric body, and
ink is jetted from each of the ink channels by applying a voltage
to electrodes provided on the piezoelectric body thereby driving
the piezoelectric body according to each of the ink channels, the
method comprising the steps of: adhering a channel plate having a
plurality of grooves for the ink channels and a cover plate
together, thereby forming a print head chip; adsorbing a catalyst
on the print head chip; removing a part of the catalyst formed on
an outside surface of the print head chip by a laser beam; and
plating an inner wall of each of the plurality of the ink channels
and the outside surface of the print head chip, thereby forming a
plating layer serving as the electrodes, on the catalyst which has
not been removed by the laser beam.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates to a method of manufacturing
an ink jet print head of a shear mode type using a piezoelectric
element and having a high image quality, a high speed, and a high
density. An ink jet print head of a shear mode type has ink
channels formed in a polarized piezoelectric substrate by cutting
and grinding, and has electrodes formed on the partition walls of
the channel grooves; it jets ink drops when an electric field is
applied to these electrodes to cause the partition walls of the
grooves to be deformed to become dog-legged shape by a shearing
force, to apply a pressure to ink in the grooves. For this ink jet
print head, electrodes in the grooves and connection electrodes
outside the grooves which transmit a signal to the electrodes are
necessary. The present invention is a new method of forming the
electrodes and the connection electrodes, using a laser and an
electroless plating process without using a conventional
photosensitive resist.
[0002] A fundamental structure of a conventional print head will be
explained by referring to FIG. 14. For example, according to the
publication of the examined patent application H6-61936, a
polarized piezoelectric substrate is coated with a photosensitive
resist by a spinning method. In another way, a photosensitive dry
film is laminated on it. Subsequently, mask exposure and
development is carried out to form a pattern of ink channels. Next,
grooves are formed by cutting and grinding along this pattern. Each
of these grooves is not uniformly formed over the whole length, but
by stopping the cutting and grinding operation on the way, a
straight groove portion 100, a shallow groove portion 101 having
its depth made gradually smaller, and an uncut portion 102 which is
not cut and ground at all are successively formed. Subsequently,
aluminum is coated by evaporation coating from an oblique direction
to the grooves, to cause electrodes to be formed on the partition
walls of the grooves, connection electrodes to be formed on the
shallow groove portions and uncut portions. By connecting the ends
of these connection electrodes to a drive circuit by flexible
cables, a signal can be sent to the electrodes. However, because
these shallow groove portion and uncut portion is not scarcely
deformed by the application of an electric voltage, they cannot
contribute to the jetting of ink drops. While this ink jet print
head is driven, owing to the hysteresis loss of the piezoelectric
element caused by the application of a high-frequency signal
voltage, it generates heat remarkably because the electric voltage
is applied also to these portions that do not scarcely contribute
to ink jetting. In particular, because the uncut portions 102 do
not come into direct contact with ink and is not cooled by ink, the
temperature rise in these portions is large. Depending on the print
pattern, it sometimes occurs that some channels do a larger number
of times of ink jetting and other channels do a smaller number of
times of ink jetting. Because heat generation is larger in channels
of a larger number of times of ink jetting, the viscosity of ink in
those channels gets lowered and the speed of jetted ink drops
becomes faster. As described in the above, if the speed of jetted
ink drops varies from one channel to another channel depending on
the print pattern, fluctuation of the landing position of the ink
drops landing on a medium which is moving at a constant speed with
respect to the print head is produced, which lowers image quality
remarkably. This is called a cross-talk depending on the print
pattern. Because this print head has a shape such that a
piezoelectric element is kept between electrodes, it has the same
structure as a capacitor, which makes the portions that do not
contribute to ink jetting have a large capacitance; therefore, the
deformation of the partition walls by a shearing force cannot
respond to a high-frequency signal. That is, the structure of a
conventional print head is not suitable for a head to have a high
image quality, a high speed, and a high density.
[0003] A print head of the present invention is characterized by
having only straight grooves from which portions not to contribute
to jetting are removed. As compared to the conventional one, heat
generation is small, and high-frequency response is good. However,
because it has neither shallow groove portions nor uncut portions,
there no space to form connection electrodes. Connection electrodes
must be formed in such a cubic way that they are made to turn
around the side surface to the rear surface, where they are
connected to flexible cables.
[0004] The present pattern formation technology employing a
photosensitive resist can form a planar pattern, but cannot form a
cubic pattern. Cubic wiring used in a print circuit board or in a
dashboard of automobiles is such a coarse one as to have a pitch of
mm order. Cubic wiring in the present invention should be such one
that, for a 300 DPI head, 70 to 520 stripes of electrodes are
formed at a pitch of 80 .mu.m in a cubic way.
[0005] The present invention provides a new method of forming a
cubic pattern using an electroless plating process and a laser
without using a resist.
[0006] For a high-speed print head of a high image quality, it is
essential to form straight grooves having no useless portions as
described in the above. However, if straight grooves are formed, a
conventional method of patterning by means of a photosensitive
resist cannot be used, because connection electrodes must be formed
in a cubic way.
[0007] Concerning a technology to form cubic connection electrodes
in an ink jet print head, for example, in a technology disclosed in
the publication of the unexamined patent application H7-132589
(corresponding to U.S. Pat. No. 5,646,661), straight horizontal
grooves are formed and vertical grooves are formed from one end of
them respectively. Next, after processing of electroless plating,
the vertical surface is ground to remove the plated metal, but
plated metal layer remains in vertical grooves to become a part of
connection electrodes. Because the piezoelectric element is very
hard and fragile, and further, because a high-density head has a
wall thickness of 50 .mu.m or under, the partition walls of the
grooves are easy to be chipped when the horizontal and vertical
grooves are cut and ground.
[0008] In the publication of the unexamined patent application
2000-141653, it is disclosed a method in which the rear wall of a
print head having straight grooves is masked by a photosensitive
resist in a pattern shape, and then electrodes and wiring are
formed by evaporation coating. However, because the thickness of
the head is as thin as 2 to 10 mm, it is difficult to form a minute
pattern by coating a photosensitive resist in this portion to be
exposed and developed. In the publication of the unexamined patent
application H10-766669, it is disclosed a technology to form a part
of connection electrodes by providing a through hole in the bottom
of each groove, filling it with a conductive substance. In
manufacturing piezoelectric elements, even though exact holes are
formed in a green sheet, when it is sintered, expansion and
contraction occurs remarkably, which makes it difficult to form
holes having a diameter of several tens .mu.m with an accuracy of
several .mu.m. Further, when grooves are worked with their position
adjusted to coincide with these via holes, it is produced a problem
that the positions are deviated for example. In the publication of
the unexamined patent application 2000-168094, it is disclosed a
method in which the whole of a head having straight grooves is
plated, and then, a part of the plating layer is removed by a laser
beam, to form connection electrodes. In the publication of the
unexamined patent application H8-300667, it is disclosed a method
in which electrodes are formed on the inner surfaces of grooves and
electrodes formed on the bottom surface of the grooves are removed
by a YAG laser. Because a plated metal, for example, nickel is very
hard, a large laser power is necessary in order to remove it by
evaporation; because laser working is pulse application for a short
time of several hundreds nS or under, only the surface layer is
rapidly heated to evaporate nickel, and influence to the part under
the surface layer is small. However, if the film thickness is
large, repeated irradiation is necessary, and there is a possible
risk of the deterioration of the underlying piezoelectric element
which is weak against heat.
[0009] The present invention is a method in which straight channels
are formed in a piezoelectric substrate, and there are formed
electrodes inside the channels and a cubic wiring for connection
outside the channels by an electroless plating process or by an
electrolytic plating process and a laser. It is a new method to
form electrodes and cubic connection electrodes using plating and a
laser without using a photosensitive resist.
[0010] The present invention is a new method of forming electrodes
and cubic connection electrodes in an ink jet print head by
electroless plating or by electrolytic plating and a laser. Up to
now, for example, according to the publications of the unexamined
patent applications 2000-168094 and H8-300667, after the whole of a
print head is plated in an electroless way, unnecessary portions of
the plating layer are removed by a laser beam; however, because the
plated metal, for example, nickel is a very hard metal, a large
laser power is necessary, and there is a possible risk of the
underlying piezoelectric element being overheated. When a
piezoelectric element is heated to the Curie temperature or over,
for example 200 to 300.degree. C., it loses the polarization to be
brought into a state of exhibiting no piezoelectricity. Hence, it
is necessary to suppress the temperature rise under the half of the
Curie temperature. It sometimes happens that when a hard nickel
layer on a piezoelectric element is evaporated by a laser beam, the
temperature of the piezoelectric element reaches several hundreds
degrees locally.
[0011] These prior arts are all methods of forming a pattern by
evaporating useless parts of plated metal by a laser beam after the
metal is plated in an electroless way. Because, in the present
invention, a pattern is formed by a laser before electroless
plating or on the way of electroless plating, only a low laser
power is required, and no excessive heat is applied to the
underlying piezoelectric element.
[0012] Electroless plating is a method of depositing a metal layer
on a support body having no electrical conductivity by chemically
reducing a solved metallic salt. Because it is not based on
electrolytic reduction which occurs in electrolytic plating,
reduction ability is not so strong, that a metal is not deposited
solely by it; therefore, it is necessary to make a plating catalyst
adsorbed beforehand on a supporting body. By electroless plating,
metal can be deposited only on a plating catalyst layer, but once
metal is deposited, the plating layer grows because the metal has a
self-catalyzing function. The outline of a method of forming
electrodes and connection electrodes and a method of assembly of a
head based on a conventional technology will be explained by
referring to FIG. 15(a) and FIG. 15(b). A plurality of straight
grooves 110 are formed in a polarized piezoelectric substrate.
Next, a plating catalyst is adsorbed by this head substrate, and
electroless plating is carried out. In this state, the whole of the
head substrate is uniformly plated. By grinding the front end 111
of the head substrate, that is, the surface to which a nozzle plate
is bonded, the plated metal is removed. Next, by applying a laser
beam to the part passing from the roof 112 of the partition walls
of the grooves, through the rear end of the head 113, to the bottom
surface of the head 114, the plated metal on the above-mentioned
line-shaped area is removed; thus, electrodes 115 and connection
electrodes 116 which are independent for each of the grooves can be
formed. Subsequently, by bonding a top plate with an adhesive, the
grooves are covered, and by bonding a nozzle plate, an ink inlet
plate and a manifold, and connecting flexible wires to the bottom
surface of the head, an ink jet print head is completed. In another
way, the plated metal on the part of the roofs 112 of the partition
walls may be removed by grinding. The present invention is an
improvement of this process. Because a part of a plating film is
removed before the thick layer is formed or on the way of plating
not after the thick film has been formed, it is a method in which
only a small power for a laser beam is necessary for a short time,
and thermal influence to the piezoelectric element is small.
[0013] It is an object of the present invention, by eliminating the
various defects of conventional technologies, to provide a method
of manufacturing an ink jet print head which is capable of
manufacturing at a low cost a high-density print head having a high
image quality, a high printing speed, and little cross talk and
being small-sized and capable of being driven by a low electric
current.
SUMMARY OF THE INVENTION
[0014] For the purpose of solving the above-mentioned problems and
accomplishing the object, the present invention has any one of the
structures described below.
[0015] The invention of structure 1 is a method of manufacturing an
ink jet print head which has channels formed of a member including
a piezoelectric body, and jets ink from the channel by the
application of an electric voltage to electrodes to drive the
piezoelectric body, characterized in that, in the method, after a
catalyst layer is adsorbed over the whole surface of the channel
plate having a plurality of channel grooves and a thin electroless
plating film is formed on the channel plate, a laser beam is
applied to at least one side surface and the bottom surface of the
channel plate to remove the thin plating film at the irradiated
portion, and then plating is practiced again to form electrodes and
cubic connection electrodes.
[0016] In addition, the term "electrodes" in every structure
implies both of electrodes provided on the inner walls of each
channel and connection electrodes connected to the electrodes which
are provided outside each channel, respectively.
[0017] According to the description set forth in this structure 1,
the invention is a method in which a plating film thinner than the
thickness required for electrodes is previously formed, and after
the thin plating film deposited on the portions for which no
plating is necessary is removed by a laser beam, plating processing
is done over again. In doing plating over again, by the
self-catalyzing function of the thin plating film remaining not
removed, further plating film is deposited on the places where the
thin plating film remains, to form electrodes and connection
electrodes. Because a plating film which is thinner than that to be
removed in conventional methods is removed by a laser beam, only a
small power for a laser beam is necessary, the deterioration of the
property of the piezoelectric body is prevented, electrode
formation with a good production efficiency can be performed, and
generation of defective products in the manufacturing process is
suppressed, which makes it possible to manufacture a high-precision
ink jet print head, whose miniaturization is in progress, at a low
cost.
[0018] The invention of structure 2 is a method of manufacturing an
ink jet print head which has channels formed of a member including
a piezoelectric body, and jets ink from the channels by the
application of an electric voltage to electrodes to drive the
piezoelectric body, characterized in that, in the method, after a
plating catalyst layer is adsorbed by a channel plate having a
plurality of channel grooves, a laser beam is applied to at least
one side surface and the bottom surface of the channel plate to
remove the catalyst layer adsorbed at the portions where the
plating is not required, and then plating is practiced to form
electrodes and cubic connection electrodes on the portions which
are not irradiated by the laser beam.
[0019] In the invention set forth in this structure 2, the metal
for electrodes should desirably be nickel or copper, and
especially, nickel is more desirable because of corrosion
resistance.
[0020] In the invention of structure 3, after a catalyst layer is
adsorbed over the whole surface of the channel plate, the catalyst
layer on the places for which no plating is necessary is removed by
a laser beam, and after that, by applying electroless plating, a
plating film is deposited on the places where the catalyst layer
remains, to form electrodes and connection electrodes. Because only
it is necessary to remove adsorbed catalyst layer having a weight
of ng order or to inactivate it by thermal oxidization, only an
extremely small power is necessary for the laser, the deterioration
of the property of the piezoelectric body is prevented, electrode
formation with a good production efficiency can be performed, and
generation of defective products in the manufacturing process is
suppressed, which makes it possible to manufacture a high-precision
ink jet print head, whose miniaturization is in progress, at a low
cost.
[0021] The invention of structure 4 is a method of manufacturing an
ink jet print head which has channels formed of a member including
a piezoelectric body, and jets ink from said channels by the
application of an electric voltage to electrodes to drive said
piezoelectric body, characterized in that, in said method, a
channel plate having a plurality of channel grooves and a cover
plate are bonded to each other to make up a head tip, and after an
electroless plating film is formed on the inner wall surface of a
plurality of tube-shaped channels formed in this head chip and on
the outer peripheral surface, the plating film on specified
portions of said outer peripheral surface is removed by a laser
beam, to form a plurality of electrodes and connection electrodes
corresponding to said channels on the outer peripheral surface of
said head tip.
[0022] According to the invention set forth in this structure 4,
after a plating film is formed on the inner walls of a plurality of
tube-shaped channels formed on a head tip and the outer peripheral
surface by applying plating processing to the inner wall surface,
the plating film on specified portions of the outer peripheral
surface is removed by a laser beam, to form electrodes in the
channels and connection electrodes on the outer peripheral surface
of the head tip. Because the top plate is bonded before plating, it
is unnecessary to irradiate the roof portion of the partition walls
of the grooves by a laser beam; therefore, laser irradiation time
becomes shorter. Because the partition walls of the grooves, which
are concerned with the jetting of ink drops, are not irradiated by
a laser beam, and only it is necessary to irradiate the outer
surface of the head tip, which does not influence the jetting of
ink so much, deterioration caused by heat is not produced so much,
and plating of only one time is necessary. Thus, the deterioration
of the property of the piezoelectric body is prevented, electrode
formation with a good production efficiency can be performed, and
generation of defective products in the manufacturing process is
suppressed, which makes it possible to manufacture a high-precision
ink jet head, whose miniaturization is in progress, at a low
cost.
[0023] In the invention of structure 5, after a thin plating film
is formed on the inner walls of a plurality of tube-shaped channels
formed on a head tip and on the outer peripheral surface, the
plating film on specified portions of the outer peripheral surface
is removed by a laser beam, and electroless plating is carried out
again, to form electrodes in said channels and connection
electrodes on the outer peripheral surface of the head tip. Because
the top plate is bonded before plating, it is unnecessary to
irradiate the roof portion of the partition walls of the grooves by
a laser beam; that is, it is not required to irradiate the portions
which are directly concerned with ink jetting by a laser beam. The
deterioration of the property of the piezoelectric body is
prevented, and generation of defective products in the
manufacturing process is suppressed, which makes it possible to
manufacture a high-precision ink jet head, whose miniaturization is
in progress, at a low cost.
[0024] In the invention of structure 6, it is desirable to use
nickel or copper for the metal of the electrodes, and in
particular, nickel is desirable because it is excellent in
resistivity against corrosion.
[0025] In the invention of structure 7, after a catalyst layer is
adsorbed on the inner walls of a plurality of tube-shaped channels
and on the outer peripheral surface, the catalyst layer on the
unnecessary portions is removed by the application of a laser beam,
and plating is carried out. Because the catalyst layer is partially
removed, an extremely weak laser beam may be used.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] FIG. 1 is a flow chart of a manufacturing process of an ink
jet print head;
[0027] FIG. 2(a) to FIG. 2(j) are outline drawings showing a
manufacturing process of an ink jet print head;
[0028] FIG. 3 is a drawing showing the application of a laser
beam;
[0029] FIG. 4 is an exploded perspective view of a head block;
[0030] FIG. 5 is the plan of an ink jet print head;
[0031] FIG. 6 is the cross-sectional view at the 6-6 line in FIG.
5;
[0032] FIG. 7 is the cross-sectional view at the 7-7 line in FIG.
5;
[0033] FIG. 8 is a perspective view showing an assembly process of
an ink jet print head;
[0034] FIG. 9 is a flow chart of a manufacturing process of an ink
jet print head;
[0035] FIG. 10(a) to FIG. 10(j) are outline drawings showing a
manufacturing process of an ink jet print head;
[0036] FIG. 11 is a flow chart of a manufacturing process of an ink
jet print head;
[0037] FIG. 12(a) to FIG. 12(j) are outline drawings showing a
manufacturing process of an ink jet print head;
[0038] FIG. 13 is a perspective view of a head tip;
[0039] FIG. 14 is a perspective view showing a conventional channel
plate;
[0040] FIG. 15(a) is a perspective view of a channel plate as seen
from the bottom side; and
[0041] FIG. 15(b) is a perspective view showing a channel plate
from which the thin plating film is removed by a laser beam.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0042] In the following, the embodiment of a method of
manufacturing an ink jet print head of the present invention will
be explained on the basis of the drawings, but the present
invention is not limited to this embodiment.
[0043] To state the first example of the present invention, in
electroless plating which is applied to a head substrate having
straight grooves formed, when an extremely thin plating layer
having a thickness of 0.5 .mu.m for example has been produced, it
is taken out from the plating bath and is washed by water, and
then, as shown in FIG. 15(a) and FIG. 15(b), a laser beam is
applied to linear areas extending from the roof of the side wall of
grooves, through the rear end surface, to the bottom surface of the
head, to remove the plated metal on them. Because the amount of
metal to evaporate is very small, the temperature of the
piezoelectric substrate is not so much raised. After washing, it is
put into the plating bath again; then, plating layer begins to grow
again because the metal layer having been already deposited has a
self-catalyzing function. However, on the portions from which the
metal layer has been removed by the laser beam, plating metal is
not deposited. When the plating metal on the front end of the head
substrate is removed by grinding, electrodes and cubic connection
electrodes are formed independently for each of the grooves.
Because electroless plating is of high cost, and has a low plating
speed, also it is appropriate to employ electrolytic plating for
plating again.
[0044] In the second example of the present invention, after a
catalyst for electroless plating is adsorbed on a head substrate
having straight grooves formed, a laser beam is applied to linear
areas extending from the roof of the wall of grooves, through the
rear end surface of the head, to the bottom surface of the head, to
remove the catalyst layer on them, and then, electroless plating is
carried out. Because the amount of the adsorbed catalyst, for
example palladium, is in an order of ng, and if it is oxidized by
heating to be inactivated without evaporating, an extremely weak
laser power is enough for it. Because a catalyst is chemically
active, it is easy to be oxidized by air; therefore, it is
necessary that nitrogen gas is made to flow over the portions to be
irradiated by a laser beam to prevent oxidization, and at the same
time, to remove the evaporated substance. Subsequently, electroless
plating is continued and finished, and the plated metal on the
front end surface of the head substrate is removed by grinding;
then, electrodes and cubic connection electrodes can be formed
independently for each of the grooves.
[0045] In the third example of the present invention, a top plate
is bonded to a head substrate having straight grooves formed, to
cover the ink grooves. A catalyst layer is adsorbed and electroless
plating is carried out. Because the partition walls which are
directly concerned with the jetting of ink drops are not irradiated
by a laser beam, and only the portions which are not so much
concerned with the jetting of ink drops are irradiated by a laser
beam, plating only once instead of plating twice is also
appropriate. Alternatively, when a thin plating film is deposited,
the head tip is taken out from the plating bath, and after washing
by water and drying, a laser beam is applied to the linear areas
extending from the rear end surface of the head substrate to the
bottom surface of it, to remove the plated metal on them. It is put
into the plating bath again, to resume plating. In another way, it
is subjected to electrolytic plating which is low cost. By removing
the plated metal on the front end surface of the head substrate by
grinding, electrodes and cubic connection wires can be formed
independently for each of the grooves. Because the straight grooves
are covered by the top plate, the irradiation by a laser beam is
not required.
[0046] In the fourth example of the present invention, which is
similar to the third example, after the adsorption of a catalyst
layer to the partition walls in direct relation to the jetting of
ink, a laser beam is applied to the linear areas extending from the
rear end surface to the bottom surface of the head substrate in a
nitrogen flow to remove the catalyst layer on them, and then,
plating is carried out. Accordingly, only an extremely small
irradiation is necessary for the laser.
[0047] First, the first example of the embodiment will be
explained.
[0048] FIG. 1 is a flow chart of a manufacturing process of an ink
jet print head; FIG. 2(a) to FIG. 2(j) are outline drawings showing
a manufacturing process of an ink jet print head; FIG. 3 is a
drawing showing the application of a laser beam; FIG. 4 is an
exploded perspective view of a head block; FIG. 5 is the plan of an
ink jet print head; FIG. 6 is the cross-sectional view at the 6-6
line in FIG. 5; FIG. 7 is the cross-sectional view at the 7-7 line
in FIG. 5; and FIG. 8 is a perspective view showing an assembly
process of an ink jet print head.
[0049] In the first example of the embodiment, manufacturing of ink
jet print head is carried out in the order of channel plate
producing process A1, channel plate groove working process A2,
channel plate block working process A3, channel plate pre-treatment
process A4, electrode forming process A5, plating process A6, cover
plate producing process A7, channel plate-cover plate bonding
process A8, nozzle plate bonding process A9, ink inlet plate
bonding process A10, ink manifold bonding process A11, base body
bonding process A12, drive control circuit board connecting process
A13, board fixing process A14, and coupler bonding process A15.
[0050] In the following, the manufacturing process of this ink jet
print head will be explained.
[0051] (Channel Plate Producing Process A1)--FIG. 2(a)
[0052] A thin plate member 1 made of a PZT material, having a
thickness of 0.9 mm and a thin plate member 2 made of a PZT
material having a thickness of 0.155 mm, both of which have been
subjected to a polarization treatment in the width direction, are
adjusted to the respective directions in respect of their
polarization, and pressed with a load falling within a range of 14
to 20 Kg/cm.sup.2, while they are heated to a temperature of about
90 to 100.degree. C. for about 30 to 40 minutes, to be bonded
together, which makes the adhesive layer have a thickness of about
2 .mu.m; thus, a channel plate 3 having a thickness of 1.057 mm
including the adhesive layer is produced.
[0053] In respect of this channel plate producing process A1, it is
important that the operation is carried out in a clean room in
order that dusts etc. may not adhere to the bonding surfaces, and
close attention is paid in order that uneven bonding, bubbles, etc.
may remain behind.
[0054] It is for the purpose of making larger the deformation of
partition walls during the application of a voltage, by forming the
partition walls of the channels of the ink jet print head of a
shearing mode, of two PZT plates, that the two PZT plate members 1
and 2 are bonded to each other.
[0055] (Channel Plate Groove Working Process A2)--FIG. 2(b)
[0056] The grooves 4 which make the channels are formed by the
cutting working of the channel plate 3.
[0057] In this case of the first example of the embodiment, in
order to form 128 ink channels, with a blade having a thickness
approximately equal to the width of the grooves, from the side of
the plate 2 having the 0.155 mm thickness of the channel plate 3, a
total of 263 grooves having a depth of 0.31 mm, a groove width of
0.07 mm, and a partition wall width of 0.071 mm, that is, with a
pitch of 0.141 mm are worked to have a shape of the teeth of a
comb.
[0058] In this case of the first example of the embodiment, because
air channels are provided at the both sides of each ink channel,
257 grooves are necessary; further, holding portions with a length
of 4 mm are provided respectively at the both sides of the 257
grooves, and in these holding portions, three spare grooves for
each portion are provided successively to the above-mentioned 257
grooves, to make the total 263 grooves.
[0059] Besides, the three grooves at each of the both sides are so
called glue-guards which are provided in order that the adhesive
may not come over into the nozzle area, and on top of it, it is
possible to make them function as spare channels for such a case
that an unexpected situation occurs in some nozzles in the nozzle
area.
[0060] (Channel Plate Block Working Process A3)--FIG. 2(c)
[0061] The channel plate 3, which has a plurality of grooves 4
formed, is cut at positions 5 in accordance with the size of an ink
jet print head to have blocks 6.
[0062] In this case of the first example of the embodiment, the
channel plate 3 having a thickness of 1.057 mm is cut into pieces
of blocks each having a shape of width 2 mm and length 44.166
mm.
[0063] (Channel Plate Pre-treatment Process A4)--FIG. 2(d)
[0064] The block 6 of a channel plate 3 is coated with a plating
film which is thinner than the proper thickness of plating 2 to 5
.mu.m. For example, a thin film plating with a thickness not
greater than 1 .mu.m is applied. The thickness of the plating layer
is measured by an X-ray fluorescence thickness meter.
[0065] (Electrode Forming Process A5)--FIG. 2(e)
[0066] After a thin film plating is applied beforehand to the block
6 of the channel plate 3, and the thin plating film on the
unnecessary portions is removed by a laser beam, both electrodes
and connection electrodes having desired thickness are formed by
doing plating process over again. In this way, by means of a
process such that, after a part of a thin plating film, which has
been formed at least on one side surface and the bottom surface of
the channel plate 3 having a plurality of channel grooves is
removed by a laser beam, plating processing is done over again,
electrodes and connection electrodes are formed by the further
deposition of plating metal on the thin plating film which has not
been removed. Hence, because the plating layer to be removed by a
laser beam has a thickness smaller than that required properly, the
metallic plating layer can be removed by a laser beam having a
comparatively small power. Hence, the deterioration of the property
of the piezoelectric body which is produced at the time of removing
the plating layer by a laser beam can be prevented.
[0067] The removal of the thin film by a laser beam is carried out
by an apparatus shown in FIG. 3. The laser beam from a He-Ne laser
generator 151 is used for indicating the position of irradiation by
the laser beam from a YAG laser generator 154 for removing a
plating layer. A pattern is formed on a thin plating film by laser
trimming in the following way: The channel block 6 of a channel
plate 3 is placed on an XY table 150 capable of moving in the X
direction and Y direction; first, a laser beam is applied from the
He-Ne laser generator 151 through the reflecting mirror 152 and the
convergent lens 153 to the channel block 6, to indicate the
position to be irradiated by the laser beam from the YAG laser
generator 154, and next, a laser beam is applied from the YAG laser
generator 154 through the reflecting mirror 155 and the convergent
lens 153 to the thin plating film on the channel block 6.
[0068] (Plating Process A6)--FIG. 2(f)
[0069] As described in the foregoing, because a thin plating film
having a thickness not greater than 1 .mu.m is formed beforehand,
and the thin plating film on the portions where electrodes and
connection electrodes are unnecessary has been removed by a laser
beam, in this plating process A6, plating processing is done over
again so as to obtain a specified thickness. Either electroless
plating or electrolytic plating for re-plating process is
appropriate.
[0070] (Cover Plate Producing Process A7)--FIG. 2(g)
[0071] In order to cover the upper surface of the channel plate 3,
a cover plate 10 is produced using the same material PZT as the
channel plate. Because this cover member needs neither groove
working nor polarization treatment, it is unnecessary that the
material is PZT, but if the cover member is made of a material
whose mechanical property is remarkably different from that of a
PZT material, it influences badly the generation of a shearing
force in the PZT member, which influences the ink jetting
performance of the head etc., and further, bending or deformation
is produced after the bonding to the channel plate; therefore, it
is desirable that the cover member has properties such as
mechanical strength and the linear coefficient of expansion which
are equal to or extremely approximate to those of the PZT member;
in this example of the embodiment, the same plate member as the
thicker plate member which has been used in producing a channel
plate is commonly used after depolarization treatment.
[0072] (Channel Plate-cover Plate Bonding Process A8)--FIG.
2(h)
[0073] A block 6 of a channel plate 3 having electrodes formed and
a block 13 of a cover plate 10 are bonded to each other.
[0074] In this first example of the embodiment, an amount of
adhesive with a weight of about 1 .mu.g is uniformly coated on the
block 13 of the cover plate 10 to make an adhesive layer about 2
.mu.m thick, and it is bonded to the block 6 of the cover plate 10
by heating. The condition of bonding through heating is the same as
the condition of bonding at the time of producing a channel plate
3.
[0075] (Nozzle Plate Bonding Process A9)--FIG. 2(i)
[0076] After the end surface of a head tip 20 is ground, a nozzle
plate 30 is bonded to it. The nozzle plate 30 is formed of a
sheet-shaped thin plate generally made of a stainless steel
material or a resin material such as a polyimide having a plurality
of through holes 30a for jetting ink provided. The dimensions
relating to the shape such as the diameter of the through holes
(nozzle diameter), the thickness, the width, and the length of the
nozzle plate are different in accordance with the specification of
the ink jet apparatus; in this example of the embodiment, a
polyimide resin sheet having a thickness of about 125 .mu.m is
processed by an eximer laser beam to form 128 through holes
(nozzles) 30a having a hole diameter of about 18 .mu.m, and on the
surface of the nozzle plate, ink-repellent treatment is applied in
order that the holes 30a may not be influenced by the scattered ink
drops.
[0077] An amount of adhesive is coated on a specified part of the
nozzle plate 30 or on a specified part of the head tip 20, to bond
the nozzle plate 30 to the head tip 20, and then the bonding
strength is made higher by the following procedures that the bonded
body is inserted in a heating device, then it is heated, for
example in this example of the embodiment, at a temperature of
about 80.degree. C. for about 40 minutes, although this condition
varies with the kinds of the adhesive used, the objects of bonding,
etc., and further it is heated at about 100.degree. C. for 20
minutes, to raise the bonding strength.
[0078] Besides, the bonding process must be carried out with enough
care taken in order that the nozzle plate 30 may keep parallel
surfaces and the adhesive may not fill the inside of the ink
channels, and in such a manner that no leakage of ink occurs when
ink is injected, and each of the ink channels certainly forms an
independent space separately. In order that the nozzles 30a may not
be stopped up by the adhesive, it is important to practice the
control of the amount and the layer thickness of the adhesive. In
addition, if the wettability of the adhesive is enhanced by
applying plasma processing to the head tip 20, bonding is performed
easily and certainly. Therefore, it is desirable to apply plasma
processing to the head tip 20, because not only the bonding of the
nozzle plate 30 but also the bonding of the ink inlet plate is to
be done.
[0079] (Ink Inlet Plate Bonding Process A10)--FIG. 2(j)
[0080] An ink inlet plate 40 is bonded to the other of the end
surfaces of the head tip 20 to one of which the nozzle plate 30 has
been bonded, to produce a head block 50.
[0081] Besides, the ink inlet plate 40 has a function to let ink
not flow into the channels at the both sides of each ink channel
having the through hole (nozzle) 30a, and a function to make it
possible to prevent the pressure generated in the ink channels for
jetting ink from escaping to the manifold.
[0082] In this first example of the embodiment, the ink inlet plate
40 is formed of a polyimide sheet, the same material as the nozzle
plate 30, having a thickness of 125 .mu.m, and is provided with 128
rectangular-shaped holes 40a of width 110 .mu.m and length 350
.mu.m at a pitch of 282 .mu.m. Of course, these dimensions relating
to the shape are based on the specification etc. of the ink jet
apparatus in the same way as the nozzle plate 30, and it is
needless to say that the present invention is not limited to this
example.
[0083] (Ink Manifold Bonding Process All)
[0084] When a nozzle plate 30 and an ink inlet plate 40 have been
bonded to a head tip 20, as shown in FIG. 4, a head block 50 is
completed. It is necessary to fix a ink manifold member 60 to this
head block 50 with an adhesive so as to make it possible to supply
ink as shown in FIG. 6 to FIG. 8.
[0085] (Base Body Bonding Process A12)
[0086] Further, a ink manifold is made up through bonding a head
unit, to which a head block 50 and a ink manifold member 60 have
been bonded with an adhesive, to a base body 61 with an adhesive,
to be brought in a state where ink can be injected in the head
unit. In bonding the head unit, attention should be paid so as not
to produce a positional deviation and a tilt of the head block 50
of the head unit to the base body 61, while attention should be
paid also so as not to produce leakage of ink from the periphery of
the ink manifold member 60 to be bonded to the base body 61.
[0087] (Drive Control Board Connecting Process A13)
[0088] A drive control board 62 for applying an electric voltage
for jetting ink is connected to a head unit which has been
completed to a degree such that ink can be injected into it.
[0089] In this first example of the embodiment, the electrodes
which have been formed on the channel plate 3 of the head tip 20
are electrically connected to a flexible print circuit (FPC) 64
provided on the drive control board 62, using an anisotropic
conductive film (ACF) 63 with heat and a pressing force by a load
of about 14 Kg applied uniformly at a temperature of about
170.degree..degree.C. for about 20 seconds.
[0090] (Board Fixing Process A14)
[0091] A head unit and a drive control board 62 are attached to a
base body 61, to complete an ink jet print head. In this first
example of the embodiment, after the drive control board 62 is
electrically connected to the head unit through the flexible print
circuit 64, the drive control board 62 is fixed to the base body 61
with coupling members such as screws, while the head unit is fixed
to the base body by fixing its top cover 66 with coupling members
such as screws, to complete the ink jet print head.
[0092] (Coupler Bonding Process A15)
[0093] It becomes possible to jet ink drops from the nozzles of the
ink jet print head through a process comprising the steps of
bonding a coupler 68 to the base body 61 of this ink jet print
head, injecting ink into the ink manifold member 60 from a
separately provided ink injecting apparatus through the coupler 68,
connecting a power source to the connector 69 provided on the drive
control board 62, and executing a control for jetting ink
drops.
[0094] Besides, in this first example of the embodiment, the
coupler 68 for coupling the tube of the ink injecting apparatus and
the liquid room in order to let ink flow into the ink jet head from
the ink injecting apparatus is discretely provided, but it is
needless to say that, in the case where a base body, a liquid room,
or a filter room is provided, this coupler may be integrally built
with the filter room. Further, generally speaking, it is put into
practice that inspection in respect of specified items is performed
in each of the processes and products are sent to the next process;
then, at the stage of completion of an ink jet head, ink jetting
performance etc. are inspected with a simulated ink and products
which have passed the inspection are sent to a delivery process;
therefore, the situation is quite the same in this first example of
the embodiment, and explanation concerning inspection has been
omitted. In addition, the essential points have been explained in
the order of the processes; however, modification of processes such
as exchanging the orders of processes for the convenience of
operation, or making it possible to carry out simultaneously plural
operations is not to depart from the essential points of the
present invention.
[0095] Next, the second example of the embodiment will be
explained.
[0096] FIG. 9 is a flow chart of a manufacturing process of an ink
jet print head, and FIG. 10(a) to FIG. 10(j) are outline drawings
showing a manufacturing process of an ink jet print head.
[0097] In the following, this manufacturing process of an ink jet
print head will be explained.
[0098] (Processes B1, B2, And B3)--FIG. 10(a) to FIG. 10(c)
[0099] Explanation will be omitted because these processes have the
same structure as the channel plate producing process Al etc. in
the first example of the embodiment.
[0100] (Channel Plate Pre-treatment Process B4)--FIG. 10(d)
[0101] A catalyst is adsorbed on the whole surface of the channel
plate.
[0102] (Electrode Forming Process B5)--FIG. 10(e)
[0103] Electrodes are formed independently for each of the grooves
of the channel plate 3, and connection electrodes to transmit a
signal to these electrodes are formed on the part ranging from one
end surface to the bottom surface of the channel plate 3.
[0104] In this second example of the embodiment, Pd (palladium) is
used as a catalyst, and an extremely small amount of it having a
weight of ng order is adsorbed. As shown in FIG. 3, while nitrogen
gas is made to flow, the catalyst layer on the central part of the
top surface of a partition wall of a groove of the channel plate 3
is removed by a laser beam along the front and rear direction, and
further, the catalyst layer is removed subsequently from the end
surface of the channel plate and then from the bottom surface of
the channel plate 3, by rotating the channel plate 3 without
changing the direction of the laser beam progressing as if the
channel plate 3 were sliced by the laser beam.
[0105] (Plating Process B6)--FIG. 10(f)
[0106] The channel plate 3 from which a part of the catalyst layer
on the specified portions is removed by a laser beam is subjected
to an electroless plating process.
[0107] In this way, after the catalyst layer on the portions where
plating metal should not be deposited is removed by a laser beam,
electrodes and connection electrodes are formed by electroless
plating processing on the parts which have not been irradiated by
the laser beam. Because an extremely small amount of catalyst is
removed by a laser beam, which needs only a very weak irradiation,
the laser device becomes simple, thus the deterioration of the
property of the piezoelectric body can be prevented.
[0108] (Processes B7 to B15)--FIG. 10(g) to FIG. 10(j)
[0109] Explanation will be omitted because these processes are the
same as the cover plate producing process A7 etc. in the first
example of the embodiment.
[0110] Next, the third and fourth examples of the embodiment will
be explained.
[0111] In the following, this manufacturing process of an ink jet
print head will be explained.
[0112] FIG. 11 is a flow chart of a manufacturing process of an ink
jet print head, FIG. 12(a) to FIG. 12(j) are outline drawings
showing a manufacturing process of an ink jet print head, and FIG.
13 is a perspective view of a head tip.
[0113] (Processes C1 and C2)--FIG. 12(a)
[0114] Explanation will be omitted because these processes are the
same as the channel plate producing process A1 etc. in the first
example of the embodiment.
[0115] (Cover Plate Producing Process C3)--FIG. 12(c)
[0116] A plate member made of PZT having the same width and length
as the channel plate 3 which has been worked to form grooves is
prepared for a cover plate 10. The same plate member as the thicker
plate member which has been used in producing a channel plate is
commonly used through depolarization treatment.
[0117] (Channel Plate-cover Plate Bonding Process C4)--FIG.
12(d)
[0118] A cover plate 10 is bonded to a channel plate which has been
worked to form grooves. Because both have the same size, bonding is
carried out by using a fixture or the like so as not to produce
positional deviation. An adhesive is uniformly coated by an amount
to make a layer of about 2 .mu.m thickness after bonding with heat
applied, and bonding is carried out with heat and a load falling
within a range of 14 to 20 Kg/cm.sup.2 applied at a temperature
between 90.degree. C. and 100.degree. C. for about 30 to 40
minutes.
[0119] (Block Working Process C5)--FIG. 12(e)
[0120] The channel plate 3 and the cover plate 10, which have been
bonded to each other, are cut (70) into a plurality of pieces
having a shape of a tanzaku of 2 mm width and 44.166 mm length by
dicing working, to make a head tip 20.
[0121] (Head Tip Pre-treatment Process C6)--FIG. 12(f)
[0122] A catalyst is adsorbed by a head tip, and electroless nickel
plating is carried out. When a thin plating film is deposited, the
head tip is taken out from the plating bath, is washed by water,
and is dried.
[0123] (Electrode Forming Process C7)--FIG. 12(g)
[0124] A laser beam is applied to the thin plating film, to form a
pattern.
[0125] (Plating Process C8)--FIG. 12(h)
[0126] Plating processing for forming electrodes on a head tip 20
is carried out. In this third example of the embodiment, as shown
in FIG. 13, electroless or electrolytic plating is carried out to
form a nickel-phosphorous or nickel-boron plating layer of
thickness about 2-4 .mu.m. In another way, plating is done only
once. A plating film having a required thickness is formed in the
process shown in FIG. 12(f), and the process shown in FIG. 12(h) is
omitted.
[0127] In this process, it is extremely important to plate
uniformly the whole inner wall of the 263 channels (tube-shaped
holes of width 70 .mu.m, height 310 .mu.m, and length 2 mm). Also
it is appropriate to coat a resist layer on the cover plate part,
the nozzle plate bonding part, etc. where no electrode is to be
formed so as not to plate these parts. In addition, the material of
plating is not limited to this so long as it has a low electric
resistance and a high strength against peeling for a PZT
material.
[0128] (Processes C9 to C15) FIG. 12(i) AND FIG. 12(j)
[0129] Explanation will be omitted because these processes have the
same structure as the nozzle plate bonding process A9 etc. in the
first example of the embodiment.
[0130] The fifth example of the embodiment is nearly equal to the
fourth one; it is a method in which a laser beam is applied in a
nitrogen flow after a catalyst is adsorbed, and electroless plating
is carried out. The number of times of plating can be reduced.
[0131] As described in the foregoing, according to the invention
set forth in structure 1, after plating processing to form a layer
thinner than the thickness required for electrodes is carried out
beforehand, the thin plating film on the portions where no
electrode should be formed is removed by a laser beam, and after
that, plating processing is done over again. By doing this way, on
the thin plating film which remains without being removed, further
plating metal is deposited, to form electrodes. Hence, because the
laser power for removing the plating film on the unnecessary
portions can be lowered, the deterioration of the property of the
piezoelectric body to be produced at the time of removing the
plating film is prevented, electrode formation with a good
production efficiency can be performed, and generation of defective
products in the manufacturing process is suppressed, which makes it
possible to manufacture a high-precision ink jet print head, whose
miniaturization is in progress, at a low cost.
[0132] According to the invention set forth in structure 3, by
making a plating catalyst adsorbed by a head tip, then removing the
catalyst layer on the portions where no plating metal should be
deposited by a laser beam, and after that, carrying out plating
processing, electrodes are formed only on the portions where the
catalyst layer remains. Hence, because there is no need to remove a
plating metal layer by a laser beam, the deterioration of the
property of the piezoelectric body which is produced at the time of
removing a plating metal layer is prevented, electrode formation
with a good production efficiency can be performed, and generation
of defective products in the manufacturing process is suppressed,
which makes it possible to manufacture a high-precision ink jet
print head, whose miniaturization is in progress, at a low
cost.
[0133] According to the invention set forth in structure 4, by
forming a plating layer on the inner wall surface of a plurality of
tube-shaped channels formed in a head tip and on the outer
peripheral surface, and removing the plating layer on specified
portions of the outer peripheral surface by a laser beam, a
plurality of connection electrodes corresponding to electrodes of
channels are formed on the outer peripheral surface of the head
tip. Because the partition walls of the grooves which are directly
concerned with the jetting of ink drops are not irradiated by a
laser beam, and only the portions which are not so much concerned
with the jetting of ink drops are irradiated by a laser beam, only
a little deterioration is produced even if a thick plating film is
removed; therefore, plating for the second time can be omitted.
Hence, the deterioration of the property of the piezoelectric body
is prevented, electrode formation with a good production efficiency
can be performed, and generation of defective products in the
manufacturing process is suppressed, which makes it possible to
manufacture a high-precision ink jet print head, whose
miniaturization is in progress, at a low cost.
[0134] According to the invention set forth in structure 5, by
depositing a thin plating film on a head tip formed of a channel
plate and a cover plate bonded together, then removing the thin
plating film on the portions where plating is unnecessary by a
laser beam, and after that, carrying out plating processing again,
electrodes are formed only on the portions where the thin plating
film remains. Hence, because there is no need to remove a thick
plating metal film by a laser beam, the deterioration of the
property of the piezoelectric body, which may possibly be produced
by the laser beam in the plating processing, is prevented,
electrode formation with a good production efficiency can be
performed, and generation of defective products in the
manufacturing process is suppressed, which makes it possible to
manufacture a high-precision ink jet print head, whose
miniaturization is in progress, at a low cost.
[0135] According to the description of the invention of structure
7, after a catalyst layer is adsorbed on a head tip formed of a
channel plate and a cover plate bonded to each other, the catalyst
on the portions where plating is unnecessary is removed by a laser
beam, and plating is carried out. An extremely weak laser beam may
be used for removing the catalyst.
[0136] Further, in any one of the structures, because the pattern
is formed by a laser beam, which makes minute masking processing
etc. unnecessary, the head tip can be made small-sized and of high
density. Hence, it is possible to lower the voltage for carrying
out the jetting of ink drops, also it is possible to make high the
frequency of jetting ink drops, the resolution of printed images,
and the printing speed. Further, because the head tip can be made
small-sized, the amount of PZT to be used, which is a high-priced
material, is reduced, and the head has a high performance and a low
cost. Moreover, because the head tip can be made small-sized, the
degree of freedom in the arrangement of the manifold and the
circuit board is raised, the head is light-weighted and compact.
Because, if the head is used in a large-sized printer of a type in
which the ink jet print head prints characters etc. as moving, the
force of inertia of the ink jet print head can be made smaller, and
the moving velocity can be made higher, which makes it possible to
make the printing speed higher.
* * * * *