U.S. patent application number 09/531568 was filed with the patent office on 2002-05-09 for cooling apparatus and cooling method for heating elements.
Invention is credited to Ishikawa, Tetsuhiro, Matsuki, Tsutomu, Ogushi, Tetsurou, Yoshida, Shigekazu.
Application Number | 20020053420 09/531568 |
Document ID | / |
Family ID | 26424030 |
Filed Date | 2002-05-09 |
United States Patent
Application |
20020053420 |
Kind Code |
A1 |
Matsuki, Tsutomu ; et
al. |
May 9, 2002 |
Cooling apparatus and cooling method for heating elements
Abstract
A cooling liquid 28 with a boiling temperature lower than the
maximum allowed temperature for the operating atmosphere of
switching elements 42 and which is highly insulative is used to
liquid seal the switching elements 42. This cooling liquid 28 is
cooled by a liquid cooler 50. The cooling liquid 28 vaporizes and
removes the heat generated by the switching elements 42 to cool the
switching elements 42. Vaporized cooling liquid 28 is cooled by the
liquid cooler 50 and is liquefied. The switching elements 42 can be
efficiently cooled and the size of the apparatus can be
reduced.
Inventors: |
Matsuki, Tsutomu;
(Aichi-ken, JP) ; Ishikawa, Tetsuhiro; (Aichi,
JP) ; Ogushi, Tetsurou; (Tokyo, JP) ; Yoshida,
Shigekazu; (Tokyo, JP) |
Correspondence
Address: |
KENYON & KENYON
1500 K STREET, N.W., SUITE 700
WASHINGTON
DC
20005
US
|
Family ID: |
26424030 |
Appl. No.: |
09/531568 |
Filed: |
March 20, 2000 |
Current U.S.
Class: |
165/80.4 ;
257/E23.088; 257/E23.098 |
Current CPC
Class: |
H01L 2224/48091
20130101; H01L 2924/13055 20130101; H01L 2924/13055 20130101; H01L
23/473 20130101; H01L 2224/48091 20130101; H01L 2924/00014
20130101; H01L 2924/1305 20130101; H01L 2924/00 20130101; H01L
2924/00 20130101; H01L 2924/1305 20130101; H01L 23/427
20130101 |
Class at
Publication: |
165/80.4 |
International
Class: |
F28F 007/00 |
Claims
What is claimed is:
1. A cooling apparatus for cooling heating elements, comprising, a
liquid sealing container for liquid sealing heating elements using
a cooling liquid having a boiling temperature within the allowed
temperature range for the operating atmosphere of said heating
elements, and a cooling mechanism for cooling said cooling
liquid.
2. A cooling apparatus of claim 1, wherein, said heating elements
are switching elements and said cooling liquid is an insulator.
3. A cooling apparatus of claim 2, wherein, said cooling liquid is
perfluoro carbon.
4. A cooling apparatus of claim 1, wherein, said liquid sealing
container removes fluids other than said cooling liquid and liquid
seals said heating elements using said cooling liquid.
5. A cooling apparatus of claim 4, wherein, said heating elements
are switching elements and said cooling liquid is an insulator.
6. A cooling apparatus of claim 5, wherein, said cooling liquid is
perfluoro carbon.
7. A cooling apparatus of claim 1, wherein, said liquid sealing
container has a flow path for a cooling medium used by said cooling
mechanism.
8. A cooling apparatus of claim 7, wherein, said heating elements
are switching elements and said cooling liquid is an insulator.
9. A cooling apparatus of claim 8, wherein, said cooling liquid is
perfluoro carbon.
10. A cooling method for cooling heating elements, comprising the
steps of, cooling heating elements using the heat of vaporization
of a cooling liquid having a boiling temperature within the allowed
temperature range for the operating atmosphere of said heating
elements and contacting with one or more of said heating elements,
and cooling said cooling liquid using a cooling medium other than
said cooling liquid.
11. A cooling method of claim 10, wherein, said heating elements
are switching elements and said cooling liquid is an insulator.
12. A cooling method of claim 11, wherein, said cooling liquid is
perfluoro carbon.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a cooling apparatus and a
cooling method for heating elements.
[0003] 2. Description of the Related Art
[0004] A type of cooling apparatus for heating elements has been
proposed in which IGBT elements (switching elements) used as
heating elements are cooled by an inverter constituted from the
IGBT elements mounted on an opening of a liquid cooling heat sink.
This is described in, for example, Japanese Patent Laid-Open
Publication No. Hei 9-121557. In this apparatus, the heat generated
by the IGBT elements is transferred to the liquid cooling heat sink
by heat conduction and removed by a cooling medium, such as water,
flowing through a path formed at the opening of the liquid cooling
heat sink. Thereby, the IGBT elements are cooled.
[0005] Another cooling apparatus for heating elements is proposed
in which semiconductor elements are liquid sealed by Freon and
partitions are provided between the semiconductor elements (for
example, Japanese Patent Laid-Open Publication No. Sho 57-141945).
In this apparatus, the semiconductor elements are cooled by
removing the heat of vaporization of Freon from the semiconductor
elements. In this apparatus, decrease in cooling effect due to
generation of film of bubbles between the semiconductors is
prevented by providing partitions.
[0006] However, in this type of apparatus for cooling IGBT elements
using a liquid cooling heat sink, there is a problem that the IGBT
elements cannot be effectively or sufficiently cooled. Especially
in recent years, there is a strong demand for reducing the size of
all devices including the inverter etc., and to fulfill this
demand, the switching elements of the inverter are closely packed.
Therefore, although sufficient cooling of these switching elements
remains a requirement, the amount of heat which can be removed by
cooling using heat conduction is not sufficient.
[0007] In the apparatus in which the semiconductor elements are
liquid sealed by Freon, some of the semiconductor elements are
released from the liquid sealing when the apparatus is tilted,
thereby causing a problem where the semiconductor elements are not
sufficiently cooled. Moreover, when the semiconductor elements are
used for long period of time, the temperature of Freon reaches its
boiling temperature causing intense vaporization, generating a
vaporization film around the semiconductor elements, and again
causing a problem that the semiconductor elements are not
sufficiently cooled.
SUMMARY OF THE INVENTION
[0008] One object of a cooling apparatus of heating elements
according to the present invention is to efficiently and
sufficiently cool the heating elements. Another object of the
cooling apparatus of heating elements of the present invention is
to sufficiently cool the heating elements, even when the apparatus
is tilted. A further object of the cooling apparatus of the heating
elements of the present invention is a reduction in size of the
apparatus. One object of a cooling method of heating elements
according to the present invention is to provide a method for
efficiently and sufficiently cooling the heating elements.
[0009] In order to solve the objects mentioned above, the cooling
apparatus and cooling method of the heating elements according to
the present invention are configured as described below.
[0010] The heating element cooling apparatus according to the
present invention is a cooling apparatus for cooling heating
elements comprising a liquid sealing container for liquid sealing
said heating elements using a cooling liquid having a boiling
temperature lower than the allowed temperature of operating
atmosphere of said heating elements, and a cooling mechanism for
cooling said cooling liquid.
[0011] With the heating element cooling apparatus of the present
invention, the heating elements are cooled by removing the heat of
vaporization of the cooling liquid having a boiling temperature
lower than the allowed temperature of operating atmosphere of the
heating elements directly or indirectly from the heating elements,
thereby increasing the cooling efficiency. Furthermore, the
vaporized gas of the cooling liquid can be liquefied by cooling the
gas with the cooling mechanism. The reliquefied gas can be re-used
for cooling the heating elements, placing the temperature of the
operating atmosphere of the heating elements within the allowed
temperature range.
[0012] In accordance with one aspect of the heating element cooling
apparatus of the present invention, said liquid sealing container
can be means for removing fluids other than said cooling liquid and
for liquid sealing said heating elements using said cooling liquid.
With this configuration, the heating elements do not expose
themselves out of the cooling liquid even when the apparatus is
tilted, and the heating elements can be cooled even in such a
case.
[0013] In accordance with another aspect of the heating element
cooling apparatus of the present invention, said liquid sealing
container can be means having a flow path for the cooling medium
used by said cooling mechanism. In this manner, the cooling liquid
used for liquid sealing can be cooled using the cooling medium.
[0014] In accordance with further aspect of the heating element
cooling apparatus of the present invention, said heating elements
can be switching elements and said cooling liquid can be an
insulator. With this configuration, electric short-circuiting by
liquid sealing can be prevented. In the cooling apparatus of the
heating elements of this aspect of the present invention, said
cooling liquid can be perfluoro carbon.
[0015] A heating element cooling method according to the present
invention is a cooling method for cooling heating elements,
comprising the steps of cooling said heating elements using the
heat of vaporization of a cooling liquid having a boiling
temperature lower than the allowed temperature of the operating
atmosphere of said heating elements and contacting with at least
some of said heating elements, and cooling said cooling liquid
using a cooling medium different from said cooling liquid.
[0016] With the heating element cooling method of the present
invention, cooling can be efficiently performed because the heating
elements are cooled by directly or indirectly removing the heat of
vaporization of the cooling liquid having a boiling temperature
lower than the allowed temperature of the operating atmosphere of
the heating elements from the heating elements. Moreover, by
cooling the cooling liquid using a cooling medium other than the
cooling liquid, vaporized gas of the cooling liquid can be
liquefied and the liquefied gas can be re-used for cooling the
heating elements, thereby maintaining the temperature of the
operating atmosphere of the heating elements within the allowed
temperature range.
[0017] In accordance with one aspect of the cooling method of the
heating elements of the present invention, said heating elements
can be switching elements and said cooling liquid can be an
insulator. In this manner, electric short-circuiting by the liquid
sealing can be prevented. In the cooling method of heating elements
of this aspect of the present invention, said cooling liquid can be
perfluoro carbon.
BRIEF DESCRIPTION OF THE DRAWING
[0018] FIG. 1 is a structural diagram schematically showing an
example structure of a cooling apparatus according to the preferred
embodiment of the present invention.
DESCRIPTION OF PREFERRED EMBODIMENT
[0019] The preferred embodiment of the present invention is
described next. FIG. 1 is a structural diagram schematically
showing the structure of a cooling apparatus 20 for cooling
switching elements 42 which are heating elements according to one
embodiment of the present invention. As shown in the figure, the
cooling apparatus 20 of this embodiment comprises a box-shaped case
22 for storing a plurality of switching elements 42 in a storage
section 23, cooling liquid 28 filled into the storage section 23 of
the case 22, and a liquid cooler 50 for cooling the cooling liquid
28.
[0020] The case 22 is provided with a flow path 26 in the outer
wall for a cooling medium such as water. A flow-in end 24 and a
flow-out end 25 of the cooling medium are connected to a
circulation tube 52 of the liquid cooler 50. The storage section 23
inside the case 22 is sealed and switching elements 42 are placed
on a plate 40 by wire bonding 44 at the bottom of the storage
section 23. In this example, IGBT (Insulated Gate Bipolar
Transistor) elements are used as the heating elements. Because the
mounting substrate and electric wiring of the switching elements 42
do not constitute the main section of the present invention, they
are neither shown nor explained.
[0021] The cooling liquid 28 to be filled in the storage section 23
of the case 22 has a boiling temperature within the range of
operating atmosphere temperatures in which the switching elements
can comfortably operate. This cooling liquid 28 also is highly
insulative. In the present embodiment, perfluoro carbon (such as
Frorinate manufactured by Sumitomo 3M, Co.) which is highly
insulative and the boiling temperature of which is lower than the
allowed temperature of the operating atmosphere of IGBT. The
cooling liquid 28 cools the switching elements 42 by removing the
heat generated by the switching elements 42 through
vaporization.
[0022] The liquid cooler 50 comprises a circulation tube 52 which
is connected to the flow-in end 24 and the flow-out end 25 of the
case 22 and which forms a circulation path with the flow path 26 of
the case 22, a circulation pump 54 mounted on this circulation tube
52 for circulating the cooling medium through the circulation tube
52, and a radiator 56 also mounted on the circulation tube 52 for
cooling the cooling medium using the outside air. The liquid cooler
50 cools the cooling liquid 28 filling the storage section 23 of
the case 22 by circulating the liquid medium cooled by the outside
air through the circulation tube 52 using the circulation pump 54.
Thus, the cooling liquid 28 which is vaporized by the heat of the
switching elements 42 is cooled and liquefied by the liquid cooler
50.
[0023] With the heating element cooling apparatus 20 as described
above, the switching elements 42 can be cooled by directly or
indirectly removing the heat of vaporization of the cooling liquid
28 having a boiling temperature lower than the allowed temperature
of the operating atmosphere from the switching elements 42.
Moreover, because the cooling liquid 28 is cooled by the liquid
cooler 50, vaporized cooling liquid 28 can be liquefied and re-used
for cooling the switching elements 42. As a result, the cooling
efficiency can be improved and, at the same time, the size of the
apparatus can be reduced. Furthermore, because the cooling liquid
28 is highly insulative, electric short circuiting does not occur.
The temperature of the operating atmosphere of the switching
elements 42 can be placed within the allowed temperature range.
[0024] In the heating element cooling apparatus 20 as described,
because the storage section 23 of the case 22 is formed to have a
sealed structure and is filled with the cooling liquid 28, the
switching elements 42 are not exposed out of the cooling liquid 28,
even when the cooling apparatus 20 is tilted, enabling efficient
cooling of the switching elements 42 even under such
conditions.
[0025] Even though the cooling apparatus 20 of heating elements of
the present embodiment is constructed to cool the switching
elements 42 which are IGBT used as the heating elements, it can
also be constructed to cool switching elements other than IGBT or
to cool heating elements other than switching elements.
[0026] In the heating element cooling apparatus 20 described above,
perfluoro carbon is used as the cooling liquid 28 to fill the
storage section 23 of the case 22, but other liquid coolants can
also be used as long as they are sufficiently insulative and have a
boiling temperature within the allowed range of temperatures for
the operating atmosphere of the switching elements 42. When it is
not necessary to consider electrical short-circuiting for the
heating elements, the liquid need not be highly insulative.
[0027] In the cooling apparatus 20 of heating elements of the
embodiment, the flow path 26 for the cooling medium is provided on
the outer wall of the case 22, but a tube can also be provided
inside the storage section 23 to form the flow path for the cooling
medium.
[0028] The preferred embodiment of the present invention has been
described, but this description is not intended to limit the scope
of the invention, and variations and modifications can be realized
within the spirit and scope of the invention.
* * * * *