U.S. patent application number 09/947443 was filed with the patent office on 2002-04-25 for cooling device using magnetizated thermal-conduction liquid.
Invention is credited to Huang, Wen-Shi, Lin, Kuo-Cheng, Yu, Chien-Wen.
Application Number | 20020046825 09/947443 |
Document ID | / |
Family ID | 21661656 |
Filed Date | 2002-04-25 |
United States Patent
Application |
20020046825 |
Kind Code |
A1 |
Huang, Wen-Shi ; et
al. |
April 25, 2002 |
Cooling device using magnetizated thermal-conduction liquid
Abstract
The present invention discloses a cooling device using
thermal-conductive liquid. The present invention includes a base, a
means for generating magnetic field and a plurality of
thermal-conductive fins. Among these, the base includes a circuit
pipe accommodating a magnetized thermal-conductive liquid. The
means for generating magnetic field is positioned in the base and
used to generate a magnetic field. The thermal-conductive fins are
formed on the base and the surround the circuit pipe. The magnetic
field generated by the means for generating magnetic field makes
the magnetized thermal-conductive liquid flows so as to dissipate
heat.
Inventors: |
Huang, Wen-Shi; (Taoyuan
Hsien, TW) ; Lin, Kuo-Cheng; (Taoyuan Hsien, TW)
; Yu, Chien-Wen; (Taipei, TW) |
Correspondence
Address: |
BIRCH STEWART KOLASCH & BIRCH
PO BOX 747
FALLS CHURCH
VA
22040-0747
US
|
Family ID: |
21661656 |
Appl. No.: |
09/947443 |
Filed: |
September 7, 2001 |
Current U.S.
Class: |
165/80.4 ;
165/185; 257/E23.098 |
Current CPC
Class: |
H01L 2924/00 20130101;
H01L 23/473 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
165/80.4 ;
165/185 |
International
Class: |
F28F 007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 23, 2000 |
TW |
089122267 |
Claims
What is claimed is:
1. A cooling device, comprising: a base, including a circuit pipe
accommodating a magnetized thermal-conductive liquid; and a means
for generating a magnetic field.
2. The cooling device according to claim 1, wherein said cooling
device further comprises a plurality thermal-conductive fins formed
on said base.
3. The cooling device according to claim 2, wherein said cooling
device further comprises a seal interposed between said base and
said base.
4. The cooling device according to claim 1, wherein said means for
generating a magnetic field comprises a winding.
5. The cooling device according to claim 1, wherein said magnetic
field generated by said means for generating a magnetic field makes
said magnetized thermal-conductive liquid flow.
6. The cooling device according to claim 1, wherein said magnetized
thermal-conductive liquid comprises a liquid having magnetic
particles.
7. The cooling device according to claim 1, wherein said magnetized
thermal-conductive liquid comprises a liquid having metallic
particles.
8. A cooling device, comprising: a base, including a circuit pipe
accommodating a magnetized thermal-conductive liquid; a means for
generating a magnetic field; and a plurality of thermal-conductive
fins, formed on the base.
9. The cooling device according to claim 8, wherein said cooling
device further comprises a seal interposed between said base and
said base.
10. The cooling device according to claim 8, wherein said means for
generating a magnetic field comprises a winding.
11. The cooling device according to claim 8, wherein said magnetic
field generated by said means for generating a magnetic field makes
said magnetized thermal-conductive liquid flow.
12. The cooling device according to claim 8, wherein said
magnetized thermal-conductive liquid comprises a liquid having
magnetic particles.
13. The cooling device according to claim 8, wherein said
magnetized thermal-conductive liquid comprises a liquid having
metallic particles.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a cooling device, and more
particularly to a cooling device using magnetized
thermal-conduction liquid to dissipate heat.
[0003] 2. Description of the Prior Art
[0004] As the electric device progresses in performance, a cooling
device or system becomes indispensable for dissipating the heat
generated by the electric device. The heat generated by the
electric device should be properly dissipated, otherwise the
performance may be encumbered with the accumulated heat or the
worst burns the electric devices. With regard to the
micro-electrical device (i.e. integrated circuit), the cooling
device is more important. Further, as the circuit density on a
single chip and the package technology increasingly progress, the
area of the integrated circuit is reduced. Meanwhile, the heat
accumulated per unit area increases. In this case, prior art fails
to meet the requirement of the cooling efficiency.
[0005] In prior art, the conventional cooling device generally uses
of airflow to dissipate the heat. For example, the blade structure
made of aluminum is attached to the top of the electrical device.
Alternatively, a fan is further superimposed on the blade
structure. As such, the heat from the electrical device is
previously directed to the blade structure and then the rotating
fan dissipates the heat. However, some portent reveals that the
conventional cooling device does not meet the requirement of the
advanced or high-speed electrical device. Air is not the preferred
material for heat dissipation. The other material, such as water or
some liquid has better heat conduction ability than air. That is,
the cooling device using water or some liquid has superior effect
compared to the cooling device simply using air.
[0006] In prior art, the cooling device using heat conduction
liquid has been proposed and which is called "liquid-cooled
system". However, such the liquid-cooled system has to cooperate
with a stirrer, such as a pump, to the liquid flowing therein. As
such, the heat-generating device, the pump and the complex pipes
results in bulky volume.
[0007] Therefore, there is a need in the art for a novel cooling
device having and simplified pipes, and whose volume is close to
the heat-generating device.
SUMMARY OF THE INVENTION
[0008] The present cooling device is superimposed on a
heat-generating device, such as a microprocessor or a CPU. The
present cooling device includes a base, a stirrer and a
thermal-conductive fin structure. Among these, the base further
includes a circuit pipe extend all over the base as possible.
Especially, the circuit pipe is filled of thermal-conductive
liquid, such as magnetized thermal-conductive liquid. Such the
magnetized thermal-conductive liquid indicates the
thermal-conductive fluid having magnetism. For example, metallic
particles are added to the thermal-conductive liquid such that the
thermal-conductive liquid becomes the magnetized thermal-conductive
liquid. As a magnetic field or force is applied, the magnetized
thermal-conductive liquid flows due to the magnetism. Note that the
circuit pipe is partially full of the magnetized thermal-conductive
liquid and reserves the buffer space. The buffer space is used to
accommodate or tolerate the expansion of the heated magnetized
thermal-conductive.
[0009] Compared to prior art, the present invention does not
require the conventional stirrer (i.e. pump). The base further
includes a stirrer surrounding or adjacent to the circuit pipe. It
is preferred that the stirrer is a winding coupled to a power
supply, such as a DC or AC power supply. As the power supply
applies the electrical power to the winding, the winding generates
the magnetic field. In this manner, the magnetized
thermal-conductive liquid flows around the circuit pipe and thus
dissipates the heat.
[0010] A thermal-conductive fin structure, such as a plurality of
parallel metallic fins, is further provided on the base so as to
enlarge the surface area of the cooling device and thus enhance the
cooling efficiency. Besides, the seal is optionally formed between
the base and the thermal-conductive fin structure to prevent the
magnetized thermal-conductive liquid from leaking.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The foregoing aspects and many of the attendant advantages
of this invention will become more readily appreciated as the same
becomes better understood by reference to the following detailed
description, when taken in conjunction with the accompanying
drawings, wherein:
[0012] FIG. 1 depicts the cooling device according to the present
invention.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0013] Referring to FIG. 1, the present cooling device 100 is
superimposed on a heat-generating device, such as a microprocessor
or a CPU. The present cooling device 100 includes a base 200, a
stirrer (not shown) and a thermal-conductive fin structure 500.
Among these, the base 200 further includes a circuit pipe 210
extend all over the base 200 as possible. Especially, the circuit
pipe 210 is filled of thermal-conductive liquid, such as magnetized
thermal-conductive liquid. Such the magnetized thermal-conductive
liquid indicates the thermal-conductive fluid having magnetism. For
example, metallic particles are added to the thermal-conductive
liquid such that the thermal-conductive liquid becomes the
magnetized thermal-conductive liquid. As a magnetic field or force
is applied, the magnetized thermal-conductive liquid flows due to
the magnetism. Note that the circuit pipe 210 is partially full of
the magnetized thermal-conductive liquid and reserves the buffer
space. The buffer space is used to accommodate or tolerate the
expansion of the heated magnetized thermal-conductive.
[0014] Still referring to FIG. 1, the base 200 further includes a
stirrer (not shown) surrounding or adjacent to the circuit pipe
210. It is preferred that the stirrer is a winding coupled to a
power supply, such as a DC or AC power supply. As the power supply
applies the electrical power to the winding, the winding generates
the magnetic field. In this manner, the magnetized
thermal-conductive liquid flows around the circuit pipe 210 and
thus dissipates the heat.
[0015] Still referring to FIG. 1, a thermal-conductive fin
structure 500, such as a plurality of parallel metallic fins, is
further provided on the base 200 so as to enlarge the surface area
of the cooling device 100 and thus enhance the cooling efficiency.
Besides, the seal 600 is optionally formed between the base 200 and
the thermal-conductive fin structure 500 to prevent the magnetized
thermal-conductive liquid from leaking. In the preferred
embodiment, the seal 600 is an O-ring.
[0016] As described above, since the magnetized thermal-conductive
liquid is used to dissipate heat, the present invention does not
require the conventional stirrer (i.e. pump). Therefore, the
circuit pipe can be simplified and the volume can be reduced. That
is, the volume of the present cooling device is close to the volume
of the heat-generating device.
[0017] As is understood by a person skilled in the art, the
foregoing preferred embodiments of the present invention are
illustrated of the present invention rather than limiting of the
present invention. It is intended to cover various modifications
and similar arrangements included within the spirit and scope of
the appended claims, the scope of which should be accorded the
broadest interpretation so as to encompass all such modifications
and similar structure.
* * * * *