U.S. patent application number 09/852179 was filed with the patent office on 2002-03-28 for polishing apparatus and method with constant polishing pressure.
This patent application is currently assigned to NEC Corporation. Invention is credited to Hayashi, Yoshihiro, Onodera, Takahiro, Samitsu, Yamato, Sasaki, Naoki, Tanaka, Kiyoshi.
Application Number | 20020037680 09/852179 |
Document ID | / |
Family ID | 15965802 |
Filed Date | 2002-03-28 |
United States Patent
Application |
20020037680 |
Kind Code |
A1 |
Hayashi, Yoshihiro ; et
al. |
March 28, 2002 |
Polishing apparatus and method with constant polishing pressure
Abstract
In an apparatus for polishing a substrate, including a polishing
platen for mounting the substrate thereon, a polishing head, a
polishing pad adhered to a bottom face of the polishing head, and a
rocking section for rocking. I.e., moving the polishing head in the
horizontal direction with respect to the polishing platen, a
control circuit controls a load of the polishing pad applied to the
substrate in accordance with a contact area of the polishing pad to
the substrate.
Inventors: |
Hayashi, Yoshihiro; (Tokyo,
JP) ; Onodera, Takahiro; (Tokyo, JP) ;
Samitsu, Yamato; (Kanagawa, JP) ; Tanaka,
Kiyoshi; (Kanagawa, JP) ; Sasaki, Naoki;
(Kanagawa, JP) |
Correspondence
Address: |
SCULLY, SCOTT, MURPHY & PRESSER
400 Garden City Plaza
Garden City
NY
11530
US
|
Assignee: |
NEC Corporation
Tokyo
JP
|
Family ID: |
15965802 |
Appl. No.: |
09/852179 |
Filed: |
May 9, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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09852179 |
May 9, 2001 |
|
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|
09335985 |
Jun 18, 1999 |
|
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6270392 |
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Current U.S.
Class: |
451/5 |
Current CPC
Class: |
B24B 37/042 20130101;
B24B 37/105 20130101 |
Class at
Publication: |
451/5 |
International
Class: |
B24B 049/00; B24B
051/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 19, 1998 |
JP |
173715/1998 |
Claims
1. An apparatus for polishing a substrate, comprising: a polishing
platen for mounting said substrate; a polishing head; a polishing
pad adhered to a bottom face of said polishing head; a rocking
section, connected to said polishing head, for rocking said
polishing head with respect to said polishing platen; and a control
circuit, connected to said polishing head and said rocking section,
for controlling a load of said polishing pad applied to said
substrate in accordance with a contact area of said polishing pad
to said substrate.
2. The apparatus as set forth in claim 1, wherein said control
circuit calculates the contact area of said polishing pad to said
substrate and allocates the load of said polishing pad by
multiplying the contact area of said polishing pad to said
substrate by a constant polishing pressure value.
3. The apparatus as set forth in claim 1, wherein a substrate
diameter of said polishing pad is approximately half of a diameter
of said substrate.
4. The apparatus as set forth in claim 1, wherein said polishing
pad is circular.
5. The apparatus as set forth in claim 1, wherein said polishing
pad is elliptic.
6. The apparatus as set forth in claim 5, wherein a short diameter
of said polishing pad is smaller than a radius of said
substrate.
7. The apparatus as set forth in claim 1, wherein said polishing
pad is non-circular.
8. The apparatus as set forth in claim 7, wherein said polishing
pad is a polishing pad obtained by partly cutting out at least one
region of a periphery of a circular polishing pad.
9. The apparatus as set forth in claim 1, wherein said control
circuit drives said polishing platen and said polishing head to
rotate in opposite directions to each other.
10. The apparatus as set forth in claim 1, wherein said polishing
head comprises a pipe for supplying polishing liquid to said
substrate.
11. An apparatus for polishing a substrate, comprising: a polishing
platen for mounting said substrate; a polishing head; a polishing
pad adhered to a bottom face of said polishing head; and a rocking
section, connected to said polishing head, for rocking said
polishing head with respect to said polishing platen; a substrate
diameter of said polishing pad being approximately half of a
diameter of said substrate.
12. The apparatus as set forth in claim 11, wherein said polishing
pad is circular.
13. The apparatus as set forth in claim 11, wherein said polishing
pad is elliptic.
14. The apparatus as set forth in claim 11, wherein a short
diameter of said polishing pad is smaller than a radius of said
substrate.
15. The apparatus as set forth in claim 11, wherein said polishing
pad is non-circular.
16. The apparatus as set forth in claim 15, wherein said polishing
pad is a polishing pad obtained by partly cutting out at least one
region of a periphery of a circular polishing pad.
17. The apparatus as set forth in claim 11, further comprising a
control circuit, connected to said polishing platter and polishing
head, for driving said polishing platen and said polishing head to
rotate in opposite directions to each other.
18. The apparatus as set forth in claim 11, wherein said polishing
head comprises a pipe for supplying polishing liquid to said
substrate.
19. A method for polishing a substrate in a polishing apparatus
including: a polishing platen for mounting said substrate; a
polishing head; a polishing pad adhered to a bottom face of said
polishing head; and a rocking section, connected to said polishing
head, for rocking said polishing head with respect to said
polishing platen, comprising the steps of: calculating a contact
area of said polishing pad to said substrate; calculating a load of
said polishing pad by multiplying the contact are of said polishing
pad to said substrate a constant polishing pressure value; and
controlling a load of said polishing pad in accordance with the
calculated load of said polishing pad.
20. The method as set forth in claim 19, wherein a substrate
diameter of said polishing pad is approximately half of a diameter
of said substrate.
21. The method as set forth in claim 19, wherein said polishing pad
is circular.
22. The method as set forth in claim 19, wherein said polishing pad
is elliptic.
23. The method as set forth in claim 22, wherein said contact are
calculating step calculates an area of said polishing pad by
.pi.(a+b).sup.2/4 where "a" is a long diameter of said polishing
pad; and "b" is a short diameter of said polishing pad.
24. The method as set for the in claim 22, wherein a short diameter
of said polishing pad is smaller than a radius of said
substrate.
25. The method as set forth in claim 19, wherein said polishing pad
is non-circular.
26. The method as set forth in claim 25, wherein said polishing pad
is a polishing pad obtained by partly cutting out at least one
region of a periphery of a circular polishing pad.
27. The method as set forth in claim 25, wherein said contact are
calculating step calculations an area of said polishing pad by
.pi.r.sup.2 where r is an equivalent radius of a circular polishing
pad having the same area as said polishing pad.
28. The method as se forth in claim 19, further comprising a step
of driving said polishing platen and said polishing head to rotate
in opposite directions to each other.
29. The method as set forth in claim 28, wherein a rotational speed
of said polishing head is twice a rotational speed of said
substrate.
30. A method for polishing a substrate, in a polishing apparatus
including: a polishing platen for mounting said substrate; a
polishing head; a polishing pad adhered to a bottom face of said
polishing head; and a rocking section, connected to said polishing
head, for rocking said polishing head with respect to said
polishing platen, comprising the steps of; calculating a
relationship between center positions of said polishing pad and
loads of said polishing pad; storing said relationship in a table;
and controlling a load of said polishing pad applied to said
substrate in accordance with a current center position of said
polishing pad with reference to said table, so that a contact
polishing pressure of said polishing pad to said substrate is
brought close to a contact value.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] The present application is a divisional application of
application Ser. No. 09/335,985 filed on Jun. 18, 1999.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a polishing apparatus and
method for polishing a substrate in a process of plagiarizing the
surface of a semiconductor wafer where a semiconductor device
pattern is formed. Such a polishing apparatus is called a chemical
mechanical polishing (CMP) apparatus.
[0004] 2. Description of the Related Art
[0005] In a first prior art CMP apparatus (see JP-A-63-256356), a
polishing platen associated with a polishing cloth (pad) thereon is
rotated in one direction, and a polishing head is rotated in the
same direction as that of the polishing platen.
[0006] Also, the back face of a semiconductor wafer is chucked to
the bottom face of the polishing head. Therefore, the rotating
polishing head with the semiconductor wafer is pushed onto the
rotating polishing cloth while the rotating polishing head is
rocking moving forward and backward in the horizontal direction.
Thus, the front face of the semiconductor wafer can be flattened
(planarized). This will be explained later in detail.
[0007] In the above-described first prior art CMP apparatus,
however, since the polishing face of the semiconductor wafer is
pushed onto the polishing cloth, it is impossible to observe the
polishing face of the semiconductor wafer, so that an accurate
control of thickness of the surface layer of the semiconductor
wafer cannot be expected. Also, since the diameter of the polishing
cloth is twice or more than that of the semiconductor wafer, most
of the polishing liquid (abrasive) is dispersed by the centrifugal
force due to the rotation of the polishing platen without
contributing to the polishing of the semiconductor wafer, the
utilization efficiency of the polishing liquid is low.
[0008] In a second prior art CMP apparatus (see JP-A-5-160088), a
polishing platen for mounting a semiconductor wafer is rotated in
one direction, and a polishing head associated with a polishing
cloth thereon is rotated in the same direction as that of the
polishing platen. In this case, the back face of the semiconductor
wafer is checked to the face of the polishing platen. Also, the
diameter of the polishing cloth is much smaller than that of the
semiconductor wafer. Further, the polishing platen and the
polishing cloth are rotated in the same direction. This also will
be explained later in detail.
[0009] In the above-described second prior art CMP apparatus,
however, since the diameter of the polishing cloth is much smaller
that of the semiconductor wafer, the contact area of the polishing
cloth to the semiconductor wafer W is very small, so that the
polishing efficiency is very small.
[0010] Also, when the polishing cloth deviates from the edge of the
semiconductor wafer, the contact area of the polishing cloth to the
semiconductor wafer becomes small. As a result, the polishing speed
in the edge of the semiconductor wafer increases.
[0011] Further, since the rotational direction of the polishing
platen, i.e., the semiconductor wafer is the same as that of the
polishing head, most of the polishing liquid is dispersed by the
centrifugal force due to the polishing platen in addition to the
centrifugal force due to the polishing head without contributing to
the polishing of the semiconductor wafer, so that the utilization
efficiency of the polishing liquid is low.
[0012] Additionally, since the polishing cloth is circular, the
polishing power of the polishing cloth at its periphery is
substantially increased.
[0013] Therefore, the polishing power is small at the center of the
polishing cloth, while the polishing power is large at its
periphery. Thus, it is difficult to homogenize the polishing power
over the semiconductor wafer in spite of the rocking operation.
[0014] A third prior art CMP apparatus (see JP-A-7-88759), which
also will be explained later in detail, also has the same problems
as in the second prior art CMP apparatus.
SUMMARY OF THE INVENTION
[0015] It is an object of the present invention to provide a
polishing apparatus and method having a large polishing efficiency,
a suppressed polishing speed around the periphery of a
semiconductor wafer (substrate), and high utilization of polishing
liquid.
[0016] According to the present invention, in an apparatus for
polishing a substrate, including a polishing platen for mounting
the substrate thereon, a polishing head, a polishing pad adhered to
a bottom face of the polishing head, and a rocking section, for
rocking (moving) the polishing head in the horizontal direction
with respect to the polishing platen, a control circuit controls a
load of the polishing pad applied to the substrate in accordance
with a contact area of the polishing pad to the substrate. Thus,
the polishing pressure can be constant over the substrate.
[0017] Also, in a polishing method, a contact area of the polishing
pad to the substrate is calculated. Then, a load of the polishing
pad is calculated by multiplying the contact area of the polishing
pad to the substrate by a contact polishing pressure. Finally, a
load of the polishing pad is controlled in accordance with the
calculated load of the polishing pad.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The present invention will be more clearly understood from
the description set forth below, as compared with the prior art,
with reference to the accompanying drawings, wherein:
[0019] FIG. 1 is a side view illustrating a first prior art CMP
apparatus;
[0020] FIG. 2 is a side view illustrating a second prior art CMP
apparatus;
[0021] FIG. 3 is a side view illustrating a third prior art CMP
apparatus;
[0022] FIG. 4 is a side view illustrating an embodiment of the CMP
apparatus according to the present invention;
[0023] FIGS. 5A, 5B and 5C are diagrams for explaining a first
rocking operation of the CMP apparatus of FIG. 4;
[0024] FIGS. 6A, 6B and 6C are diagrams for explaining a second
rocking operation of the CMP apparatus of FIG. 4;
[0025] FIG. 7 is a diagram illustrating a modification of the
polishing cloth in FIGS. 6A, 6B and 6C;
[0026] FIG. 8 is a diagram for explaining the flow of polishing
liquid in the CMP apparatus of FIG. 4;
[0027] FIG. 9A is a graph showing the relationship between the
rocking distance and the polishing rate when using a circular
polishing cloth in the CMP apparatus of FIG. 4 under the condition
that the load of the polishing head is definite;
[0028] FIG. 9B is a graph showing the relationship between the
rocking distance and the polishing unevenness when using a circular
polishing cloth in the CMP apparatus of FIG. 4 under the condition
that the load of the polishing head is definite;
[0029] FIG. 10 is a graph showing the relationship between the
rocking distance and the polishing rate when using a circular
polishing cloth in the CMP apparatus of FIG. 4 under the condition
that the polishing pressure is definite;
[0030] FIG. 11 is a graph showing the relationship between the
rocking distance and the polishing unevenness when using an
elliptic polishing cloth in the CMP apparatus of FIG. 4 under the
condition that the polishing pressure is definite;
[0031] FIG. 12 is a diagram illustrating a rocking distance using
an elliptic polishing cloth in the CMP apparatus of FIG. 4;
[0032] FIG. 13A is a graph showing the relationship between the
starting point of the rocking distance and the polishing rate when
using an elliptic polishing cloth in the CMP apparatus of FIG. 4
under the condition that the polishing pressure is definite;
[0033] FIG. 13B is a graph showing the relationship between the
starting point of the rocking distance and the polishing unevenness
when using an elliptic polishing cloth in the CMP apparatus of FIG.
4 under the condition that the polishing pressure is definite;
[0034] FIG. 14A is a graph showing the relationship between the
wafer rotational speed and the polishing rate when using a circular
polishing cloth in the CMP apparatus of FIG. 4 under the condition
that the polishing pressure is definite;
[0035] FIG. 14B is a graph showing the relationship between the
wafer rotational speed and the polishing unevenness when using a
circular polishing cloth in the CMP apparatus of FIG. 4 under the
condition that the polishing pressure is definite;
[0036] FIG. 15 is a partly cut perspective automatic polishing
apparatus to which the CMP apparatus of FIG. 4 is applied;
[0037] FIG. 16 is a perspective view of a part of the apparatus of
FIG. 15; and
[0038] FIG. 17 is a cross-sectional view of the polishing head of
FIG. 15.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0039] Before the description of the preferred embodiment, prior
art CMP apparatuses will be explained with reference to FIGS. 1, 2
and 3.
[0040] In FIG. 1, which is a side view illustrating a first CMP
apparatus (see JP-A-63-256356), a polishing platen 101 associated
with a polishing cloth (pad) 102 thereon is rotated in one
direction by a motor 103, and a polishing head 104 is rotated in
the same direction as that of the polishing platen 101 by a motor
105. In this case, the rotational sped of the polishing platen 101
is about the same as that of the polishing head 104.
[0041] Also, the back face of a semiconductor wafer W is chucked to
the bottom face of the polishing head 104. Therefore, when the
rotating polishing head 104 is pushed onto the rotating polishing
cloth 102 while the rotating polishing head 104 is rocking
(moving)) in the horizontal direction by a stationary cylinder 106a
and a rocking cylinder 106b in combination, the front face of the
semiconductor wafer W can be flattened.
[0042] Further, a polishing liquid supplying nozzle 107 is provided
above the center of the polishing platen 102. As a result, onto the
polishing cloth 102 is dripped polishing liquid PL from the
polishing liquid supplying nozzle 107, so that the polishing liquid
PL is dispersed from the center of the polishing cloth 102 to the
periphery thereof by the centrifugal force due to the rotation of
the polishing platen 101.
[0043] In the CMP apparatus of FIG. 1, however, since the polishing
face of the semiconductor wafer W is pushed onto the polishing
cloth 102, it is impossible to observe the polishing face of the
semiconductor wafer W, so that an accurate control of thickness of
the surface layer of the semiconductor wafer W cannot be expected.
Also, since the diameter of the polishing cloth 102 is twice or
more than that of the semiconductor wafer w, most of the polishing
liquid PL is dispersed by the centrifugal force due to the rotation
of the polishing platen 101 without contributing to the polishing
of the semiconductor wafer W, the utilization efficiency of the
polishing liquid PL is low.
[0044] In FIG. 2, which is a side view illustrating a second CMP
apparatus (see JP-A-5-160088, a polishing platen 201 for mounting a
semiconductor wafer W is rotated in one direction by a motor 202,
and a polishing head associated with a polishing cloth 204 thereon
is rotated in the same direction as that of the polishing platen
201 by a motor 205. In this case, the back face of the
semiconductor wafer W is chucked to the face of the polishing
platen 201. Also, the diameter of the polishing cloth 204 is much
smaller than that of the semiconductor wafer W.
[0045] Also, a pushing mechanism 206 is provided to push the
polishing cloth 204 onto the semiconductor wafer W, and a detector
207 is provided to detect the thickness of a layer such as an
insulating layer of the semiconductor wafer W.
[0046] Further, a control circuit 208 receives an output signal of
the detector 207 to control the motors 202 and 205 and the pushing
mechanism 206.
[0047] In the CMP apparatus of FIG. 2, the polishing platen 201 is
rotated at a sped of about 0 to several rpm and the polishing cloth
204 is rotated at a speed of about 60 to 200 rpm. Also, the control
circuit 208 controls the pushing mechanism 206 in accordance with
the thickness of the layer of the semiconductor wafer W detected by
the detector 207. Thus, the polishing head 203 is rocking in the
horizontal direction. The thickness of the layer becomes
homogeneous over the semiconductor wafer W.
[0048] In the CMP apparatus of FIG. 2, however, since the diameter
of the polishing cloth 204 is much smaller than that of the
semiconductor wafer W, the contact area of the polishing cloth 203
to the semiconductor wafer W is very small, so that the polishing
efficiency is very small.
[0049] Also, when the polishing cloth 204 deviates from the edge of
the semiconductor wafer W, the contact area of the polishing cloth
204 to the semiconductor wafer W becomes small. In this case, if
the load L of the polishing head 203 is definite, the effective
polishing pressure P increases. Note that the effective polishing
pressure P can be represented by
P=L/S
[0050] where S is the contact area of the polishing cloth 204 to
the semiconductor wafer W. As a result, the polishing speed
increases. Particularly, if the diameter of the polishing cloth 204
is very small, the polishing speed remarkably increases, which is a
serious problem.
[0051] Further, since the rotational direction of the polishing
platen 201, i.e., the semiconductor wafer W is the same as that of
the polishing head 203, most of the polishing liquid is dispersed
by the centrifugal force due to the polishing platen 201 in
addition to the centrifugal force due to the polishing head 203
without contributing to the polishing of the semiconductor wafer W,
so that the utilization efficiency of the polishing liquid is
low.
[0052] Additionally, since the polishing cloth 204 is circular, the
polishing power PP of the polishing cloth 204 at its periphery is
substantially increased. That is, the circumferential speed V of
the polishing cloth 204 is represented by
V=R.multidot..omega. (1)
[0053] where R is a radius of the polishing cloth 204; and
[0054] .omega.is an angular speed of the polishing cloth 204.
[0055] Also, the circumference length CL of the polishing cloth 204
is represented by
CL=2.pi.R (2)
[0056] On the other hand, if the polishing load is definite, the
polishing power PP is represented by
PP=V.multidot.L (3)
[0057] From the equations (1), (2) and (3),
PP=2.pi.R.sup.2.multidot..omega.
[0058] Therefore, the polishing power PP is small at the center of
the polishing cloth 204, while the polishing power PP is large at
its periphery. Thus, if the rotational speed of the clothing cloth
204 is increased to increase the polishing efficiency, it is
difficult to homogenize the polishing power PP over the
semiconductor wafer W in spite of the rocking operation.
[0059] In FIG. 3, which is a side view illustrating a third prior
art CMP apparatus (see JP-A-7-88759), a polishing platen 301 for
mounting a semiconductor wafer W is rotated in one direction by a
motor 302, and a polishing head associated with a polishing cloth
304 thereon is rotated in the same direction as that of the
polishing platen 301 by a motor 305. In this case, the back face of
the semiconductor wafer W is chucked to the face of the polishing
platen 301. Also, the diameter of the polishing cloth 304 is much
smaller than that of the semiconductor wafer W.
[0060] Also, an arm 306 and an air cylinder 307 as a pushing
mechanism are provided to push the polishing cloth 304 onto the
semiconductor wafer W.
[0061] Further, the polishing head 303 is rocking in the horizontal
direction by a motor 308.
[0062] Additionally, polishing liquid supplying nozzles 309a and
309b are provided above the polishing platen 301. As a result, onto
the semiconductor wafer W is dripped polishing liquid PL from the
polishing liquid supplying nozzles 309a and 309b.
[0063] In the CMP apparatus of FIG. 3, the polishing platen 301 is
rotated at a speed of about 50 rpm and the polishing cloth 304 is
rotated at a speed of about 1000 rpm. Also, the load L of the
polishing head 304 is set at about 0.01 to 0.5 kg/cm.sup.2 by the
air cylinder 305.
[0064] If the polishing head 303 is rocking in the horizontal
direction at about 10 to 100 times per minute by the motor 308, the
thickness of the layer becomes homogeneous over the semiconductor
wafer W.
[0065] In the CMP apparatus of FIG. 3, however, since the diameter
of the polishing cloth 303 is much smaller that of the
semiconductor wafer W, the contact area of the polishing cloth 303
to the semiconductor wafer W is very small, so that the polishing
efficiency is very small.
[0066] Also, when the polishing cloth 304 deviates from the edge of
the semiconductor wafer W, the contact area of the polishing cloth
304 to the semiconductor wafer W becomes small. In this case, if
the load L of the polishing head 303 is definite, the effective
polishing pressure P increases. As a result, the polishing speed
increases. Particularly, if the diameter of the polishing cloth 304
is very small, the polishing speed remarkably increases, which is a
serious problem.
[0067] Further, since the rotational direction of the polishing
platen 301, i.e., the semiconductor wafer W is the same as that of
the polishing head 303, most of the polishing liquid is dispersed
by the centrifugal force due to the polishing platen 301 in
addition to the centrifugal force due to the polishing head 303
without contributing to the polishing of the semiconductor wafer W,
so that the utilization efficiency of the polishing liquid is
low.
[0068] Additionally, in the same way as in the CMP apparatus of
FIG. 2, since the polishing cloth 204 is circular, if the
rotational speed of the clothing cloth 304 is increased to increase
the polishing efficiency, it is difficult to homogenize the
polishing power PP over the semiconductor wafer W in spite of the
rocking operation.
[0069] In FIG. 4, which illustrates an embodiment of the CMP
apparatus according to the present invention, a polishing platen 11
for mounting a semiconductor wafer W is rotated in a first
direction such as in a counter-clockwise direction by a motor 12,
and a polishing head 13 associated with a polishing cloth 14
thereon is rotated in a second direction such as in a clockwise
direction opposite to the first direction by a carrier 15 coupled
to a motor 16. In this case, the back face of semiconductor wafer W
is chucked to the face of the polishing platen 11. Also, the
polishing cloth 14 is circular or non-circular; however, its
substantial diameter is about half of the diameter of the
semiconductor wafer W.
[0070] The polishing head 13 is constructed by a pressurizing
chamber 131 and a plate 132 for adhering the polishing cloth 14, to
thereby push the polishing cloth 14 on to the semiconductor wafer
W. In this case, the pressure of the pressurizing chamber 131 is
controlled by an air cylinder (not shown) to change the load L(t)
of the polishing cloth 14 applied to the semiconductor wafer W.
[0071] The polishing head 13 is rocking in the horizontal direction
by a rocking guide rail 17 which is driven by a rocking driving
section (motor) 18.
[0072] A pipe 19 is provided in the center of the polishing head
13, the carrier 15 and the motor 16 to supply polishing liquid from
a pump 20 to the semiconductor wafer W under the polishing cloth
14.
[0073] The motor 12, the load L(x) of the pressurizing chamber 131,
the rocking driving section 18, the motor 16 and the pump 20 are
controlled by a control circuit 21 which is constructed by a
computer, for example.
[0074] A first rocking operation of the CMP apparatus of FIG. 4 is
explained next with reference to FIGS. 5A, 5B and 5C, where the
polishing cloth 14 is circular and its diameter is approximately
half of that of the semiconductor wafer W. That is,
r.apprxeq.R/2
[0075] where r is a radiums of the polishing cloth 14; and
[0076] R is a radius of the semiconductor wafer W.
[0077] First, referring to FIG. 5A, at time t.sub.0, the coordinate
X of the center of polishing cloth 14 in the right direction with
respect to the center of the semiconductor wafer W is set to be
X(t.sub.0)=X.sub.s
[0078] where X.sub.x is a start rocking distance and is R/2, for
example. In this case, the contact area S(t) of the polishing cloth
14 to the semiconductor wafer W is
S(t.sub.0)=.pi.R.sup.2
[0079] Therefore, if an initial load L(t.sub.0) of the polishing
head 13 is given by L.sub.0, the polishing pressure P is
represented by
P=L.sub.0/S.sub.0
[0080] Next, referring to FIG. 5B, the coordinate X of the center
of the polishing cloth 14 becomes
X(t.sub.1)=X.sub.m>X.sub.s
[0081] In this case, the contact area S(t) of the polishing cloth
14 to the semiconductor wafer W becomes smaller, i.e.,
S(t.sub.1)=S.sub.1<S.sub.0
[0082] Therefore, the control circuit 21 reduces the load of the
polishing head 13 to 1 L ( t 1 ) = L 0 S 1 / S 0 = P S 1
[0083] Finally, referring to FIG. 5C, the coordinate X of the
center of the polishing cloth 14 becomes
X(t.sub.2)=X.sub.0>X.sub.s
[0084] where X.sub.0 is 0.8R, for example. In this case, the
contact area S(t) of the polishing cloth 14 to the semiconductor
wafer W becomes even smaller, i.e.,
S(t.sub.2)=S.sub.2<S.sub.1
[0085] Therefore, the control circuit 21 reduces the load of the
polishing head 13 to 2 L ( L 2 ) = L 0 S 2 / S 0 = P S 2
[0086] Note that it is desirable that the cycle period from time
t.sub.0 to time t.sub.2 of the rocking operation is larger than the
cycle period of revolution of the semiconductor wafer W.
[0087] Thus, since the load L(t) of the polishing head 13 is
changed in accordance with the contact area S(t) of the polishing
cloth 14 to the semiconductor wafer W, the polishing pressure P can
be definite.
[0088] Note that the control circuit 21 can store a relationship
between the coordinate X(t) and the contact area S(X.sub.(L)) as a
table in a memory. In this case, the control circuit 21 detects the
current coordinate X(t) of the polishing cloth 14, and then,
calculates the contact area S(t) of the polishing cloth 14 to the
semiconductor wafer W by suing the above-mentioned table. Then, the
control circuit 21 calculates the load L(t) by
L(t)=P.multidot.S(t)
[0089] where P is the definite polishing pressure.
[0090] In FIGS. 5A, 5B and 5C, the polishing cloth 14 is circular,
the polishing power PP is small at the center of the polishing
cloth 14, while the polishing power PP is large its periphery.
Thus, if the rotational speed of the clothing cloth 14 is increased
to increase the polishing efficiency, it is difficult to homogenize
the polishing power PP over the semiconductor wafer W in spite of
the rocking operation. In order to homogenize the polish power PP
over the semiconductor wafer W, the polishing cloth 14 is caused to
be ellipsoidal as shown in FIGS. 6A, 6B and 6C.
[0091] A second rocking operation of the CMP apparatus of FIG. 4 is
explained next with reference to FIGS. 6A, 6B and 6C, where the
polishing cloth 14 is elliptic and its substantial diameter is
approximately half of that of the semiconductor wafer W. That
is,
r.apprxeq.R/2
r=(a+b)/2
[0092] where "a" is a long diameter of the polishing cloth 14;
[0093] "b" is a short diameter of the polishing cloth 14; and
[0094] R is a radius of the semiconductor wafer W. Note that the
short diameter "b" is preferably smaller than R; however, there is
no limitation on the long diameter "a".
[0095] First, referring to FIG. 6A, at time t.sub.0, the coordinate
X of the center of polishing cloth 14 in the right direction with
respect to the center of the semiconductor wafer W is set to be
X(t.sub.0)=X.sub.s
[0096] where X.sub.s is a start rocking distance and is smaller
than R/2 and large than b/2. Thus, the inner circle of the
polishing cloth 14 does not get to the center of the semiconductor
wafer W. In this case, the contact area S(t) of the polishing cloth
14 to the semiconductor wafer W is
S(t.sub.0)=.pi.r.sup.2
[0097] Therefore, if an initial load L(t.sub.0) of the polishing
head 13 is given by L.sub.0, the polishing pressure P is
represented by
P=L.sub.0/S.sub.0
[0098] Next, referring to FIG. 6B, the coordinate X of the center
of the polishing cloth 14 becomes
X(t.sub.1)=X.sub.m>X.sub.s
[0099] In this case, the contact area S(t) of the polishing cloth
14 to the semiconductor wafer W is S.sub.1, i.e.,
S(t.sub.1)=S.sub.1=S.sub.0
[0100] Therefore, the load of the polishing head 13 is 3 L ( t 1 )
= L 0 S 1 / S 0 = P S 1 = L 0
[0101] Finally, referring to FIG. 6C, the coordinate X of the
center of the polishing cloth 14 becomes
X(t.sub.2)=X.sub.e>X.sub.s
[0102] where X.sub.e is 0.85R for example. In this case, the
contact area S(t) of the polishing cloth 14 to the semiconductor
wafer W becomes smaller, i.e.,
S(L.sub.20=i S.sub.2<S.sub.1=S.sub.0
[0103] Therefore, the control circuit 21 reduces the load of the
polishing load 13 to 4 L ( t 2 ) = L o S 2 / S o = P S 2
[0104] Also, note that it is desirable that the cycle period from
time T.sub.0 to time t.sub.2 of the rocking operation is larger
than the cycle period of revolution of the semiconductor wafer
W.
[0105] Thus, since the load L(t) of the polishing head 13 is
changed in accordance with the contact area S(t) of the polishing
cloth 14 to the semiconductor wafer W, the polishing pressure P can
be definite.
[0106] In addition, the contact area of the peripheral part of the
polishing cloth 14 to the semiconductor wafer W is substantially
reduced. In other words, the inner circular area of the polishing
cloth 14 always contacts the semiconductor wafer W, while the
annular areas of the polishing cloth 14 defined by the outer circle
the long diameter "a" and the inner circle of the short diameter
"b" intermittently contacts the semiconductor wafer W. Therefore,
the relative increase of the polishing speed at the near the center
of the semiconductor wafer W where it contacts the outer periphery
of the polishing cloth 14 can be suppressed of the thus
homogenizing the polishing power PP over the semiconductor wafer
W.
[0107] Also, in FIGS. 6A, 6B and 6C, note that the control circuit
21 can store a relationship between the coordinate X(t) and the
contact area S(X(t)) as a table in a memory. In this case, the
control circuit 21 detects the current coordinate X(t) of the
polishing cloth 14, and then, calculates the contact area S(t) of
the polishing cloth 14 to the semiconductor wafer W by using the
above-mentioned table. Then, the control circuit 21 calculates the
load L(t) by
L(t)=P.multidot.S(t)
[0108] where P is the definite polishing pressure.
[0109] Further, in FIGS. 6A, 6B and 6C, the elliptic polishing
cloth 14 can be replaced by other non-circular polishing cloths.
For example, as illustrated in FIG. 7, such a non-circular
polishing cloth is obtained by partly cutting out areas of the
outer periphery of a circular polishing cloth. In this case, the
radius of an equivalent circle having the same area as the
non-circular polishing cloth is calculated in advance. Therefore,
the control circuit 21 can calculate the contact area S(t) of the
non-circular cloth 14 to the semiconductor wafer W by using the
coordinate X(t) and the radius of the equivalent circle.
[0110] In FIG. 8, which illustrates the flow of polishing liquid in
the CMP apparatus of FIG. 4, the polishing cloth 14 and hence the
polishing head 13 are made to rotate in a direction opposite to the
rotating direction of the semiconductor wafer W. Additionally, the
absolute value of the rate of revolution of the polishing head 13
is preferably at least twice of that of the semiconductor wafer W.
As a result the flow of polishing liquid as indicated by arrows 801
caused by the centrifugal force generated by the polishing cloth 14
is directed oppositely relative to the flow of polishing liquid as
indicated by arrows 802 caused by the centrifugal force generated
by the semiconductor wafer W, so that the two flows counter each
other to make polishing liquid stay for a long time on the surface
of the semiconductor wafer W. Thus, the rate of supply of polishing
liquid can be reduced.
[0111] The inverters operated the CMP apparatus of FIG. 4 under the
following conditions;
[0112] the diameter of the semiconductor wafer W having a silicon
oxide layer thereon was 200 mm;
[0113] the rotational speed of the semiconductor wafer W was 30 rpm
in the counter-clockwise direction;
[0114] the diameter of the circular polishing clothe 14 made of
trademark IC1000/suba400 layer pad with a girdwork of 1.5 mm wide
grooves arranged at a pitch of 5 to 10 mm was 106 mm;
[0115] The load L(t) of the polishing head 13 was definite and was
26.3 kgw;
[0116] the start coordinate X.sub.s of the rocking operation was 50
mm; and
[0117] the rate of supply of polishing liquid made of colloidal
silica particles into pure water by 20 wt % was 50 cc/min.
[0118] Under the above-mentioned conditions, i.e., under a definite
load while the diameter of the circular polishing cloth 14 was
approximately half of the semiconductor wafer W, as shown in FIG.
9A, the polishing rate was increased at any rate of revolution of
the polishing cloth 14 by the rocking operation. However, the
polishing rate tended to fall when the rocking distance
(=X.sub.0-X.sub.s) exceeded 30 mm. Also, as shown in FIG. 9B, under
the condition that the rocking speed was 330 m/min, the polishing
unevenness was remarkably decreased by the rocking operation.
However, the polishing unevenness was again increased when the
rocking distance (=X.sub.e-X.sub.s) was increased. For, example,
when the rate of revolution of the polishing cloth 14 in the
clockwise direction was 300 rpm, the polishing unevenness was as
high as 41% under no rocking operation, but the polishing
unevenness was reduced to .+-.20% by the rocking operation of the
rocking distance 10 mm (X.sub.e=60 mm).
[0119] However, it was found that the silicon oxide layer on the
semiconductor wafer W had been thinned locally at a central area
thereof and this tendency did not change when the rocking distance
was increased to 20 mm (X.sub.0=70 mm). Thus, the polishing
unevenness remained at the level of .+-.20%. When the rocking
distance was increased further, the polishing rate was increased
remarkably along the outer periphery of the semiconductor wafer W
to consequently increase the polishing unevenness once again. This
was because, when the rocking distance exceeded 20 mm (X.sub.e=70
mm), the polishing cloth 14 moved out of the outer periphery of the
semiconductor wafer W partly but significantly to reduce the
contact area of the polishing cloth 14 to the semiconductor wafer W
so that the effective polishing pressure P was raised to a
nonnegligible extent.
[0120] Thus, while the polishing uniformity can be improved and the
polishing rate can be raised by the rocking operation within the
face of the semiconductor wafer W, the extent to which the
polishing cloth 14 moves out of the outer periphery of the
semiconductor wafer W becomes nonnegligible when the rocking
distance (X.sub.n-X.sub.s) is raised excessively to consequently
increase the effective polishing pressure P with the increase of
the rocking distance of the polishing cloth 14 if a constant load
is used for polishing.
[0121] Thus, in the polishing apparatus of FIG. 4 adapted to polish
the face of the semiconductor wafer W, a function of compensating
for the effect of the polishing cloth 14 moving out of the outer
periphery of the semiconductor wafer W in order to produce a
constant polishing pressure is indispensable.
[0122] Under the above-mentioned conditions, the polishing pressure
P was caused to be definite and was 0.3 kg/cm.sup.2 instead of the
definite load L(t) of the polishing head 13. That is, the load L(t)
of the polishing head 13 was changed in accordance with the contact
area S(t) of the polishing cloth 14 to the semiconductor wafer W so
that the polishing pressure P (=L(t)/S(t)) was made definite. As a
result, as shown in FIG. 10, in the case of using a circular
polishing cloth, it was found that the polishing unevenness could
be reduced by correcting the area by which the polishing cloth 14
moved out of the semiconductor wafer W to keep the polishing
pressure P constant if compared with the use of a constant load.
This represents a result obtained by correcting abnormal polishing
at and near the outer periphery of the semiconductor wafer W,
although the polishing unevenness became remarkable once again when
the rocking distance (=X.sub.0-X.sub.s) exceeded 30 mm.
Additionally, the polishing unevenness remained as large as .+-.17%
when the rocking distance (=X.sub.e-X.sub.s) was reduced to 20 mm.
As a result of analyzing the distribution of polishing rate within
the surface of the semiconductor wafer, it was found that the
polishing rate was high in a central area and also in an outer
peripheral area of the semiconductor wafer W even after correcting
the unevenness of the polishing cloth 14 to realize a constant
polishing pressure. Thus, it was made clear that the polishing
unevenness was caused not only by fluctuations in the polishing
pressure but also by an increase in the relative polishing rate of
a central area and an outer peripheral area of the semiconductor
wafer W that contacted an outer peripheral portion of the polishing
cloth 14 that was revolving at a rate greater that any other
remaining portions of the polishing cloth 14.
[0123] In order to alleviate the relative polishing rate of the
central are and outer peripheral area of the semiconductor wafer W,
an outermost peripheral portion of the circular polishing cloth 14
was cut out to produce an elliptic polishing cloth, which was then
used to polish the semiconductor wafer W. For example, the elliptic
polishing cloth 14 had a long diameter of 100 mm and a short
diameter of 80 mm. As a result, as shown in FIG. 11, it was found
that the increase in the relative polishing rate in the central
area and the outer peripheral area was alleviated to further
improve the polishing unevenness to a level of .+-.5% even when the
rocking distance of 30 mm (X.sub.0=80 mm) was selected. In FIGS. 10
and 11, note that the rotational speed of the polishing cloth 14 in
the clockwise direction is 400 rpm.
[0124] Meanwhile, as shown in FIG. 12, when X.sub.s=50 mm was
selected for the point of starting the rocking motion of the
elliptic polishing cloth 14 with a long diameter of 100 mm and a
short diameter of 80 mm, the center of the semiconductor wafer W
was polished only when the two apexes of the elliptic polishing
cloth 14 passed there. As a result, the polishing rate at the
center of the semiconductor wafer W was relatively reduced when the
elliptic polishing cloth 14 was used.
[0125] When the elliptic polishing cloth 14 is not rocking, the
elliptic polishing cloth 14 constantly contact the semiconductor
wafer W in the inside of the inner circle and, in the region
between the outer circle and the inner circle, the time of contact
of the elliptic polishing cloth 14 to the semiconductor wafer W
relatively decreases near the outer circle. As shown in FIG. 13,
the relative contact time of the center of the semiconductor wafer
W and the elliptic polishing cloth 14 can be regulated by moving
the starting point X.sub.s of the rocking motion of the elliptic
polishing cloth 14 toward the center of the semiconductor wafer
W.
[0126] FIGS. 13A and 13B are graphs showing the effect of the star
point X.sub.s of the rocking motion of the polishing unevenness
obtained when an elliptic polishing cloth with a long diameter of
100 mm and a short diameter of 80 mm was used. Here, the end point
X.sub.0 of rocking motion was held to 80 mm and the polishing
pressure P was also held constant (0.3 kg/cm.sup.2), by taking the
motion of the elliptic polishing cloth 14 partly moving out of the
semiconductor wafer W as a result of the rocking operation of the
elliptic polishing cloth 14 into consideration.
[0127] The polishing unevenness was reduced by bringing the start
point X.sub.s of the rocking operation close of the center of the
semiconductor wafer W, i.e., by reducing the starting point
X.sub.s. The polishing unevenness was minimized to X.sub.s=45 mm.
In other words, if the starting point X.sub.s was further brought
close to the center of the semiconductor wafer W, the relative
polishing rate of the center of the semiconductor wafer was
increased once again to consequently increase the polishing
unevenness.
[0128] Thus, in the case of an elliptic polishing cloth, while the
short diameter should be smaller than half of diameter of the
semiconductor wafer W to be polished, the long diameter a is not
subjected to any limitations. For example, for polishing a
semiconductor wafer with a radius of R, an optimum effect can be
produced when the shot diameter of the elliptic polishing cloth is
between 0.9R and 0.7R and the long diameter is between 1.0R and
1.5R. The starting point X.sub.s of the rocking motion (the origin
of the coordinate of the elliptic polishing cloth) that is located
on a radial line passing through the center of the semiconductor
wafer W may be such that the center of the semiconductor wafer W is
located between the annular belt defined by an outer circle and an
inner circle of the elliptic polishing cloth. In other words,
0.5 b.ltoreq.X.sub.s.ltoreq.0.5 a
[0129] where "a" is a long diameter of elliptic polishing 14;
and
[0130] "b" is a short diameter of the elliptic polishing cloth
14.
[0131] The relationship rotational speed of the semiconductor wafer
W and the polishing rate will be explained next with reference to
FIG. 14A.
[0132] In FIG. 14A, the CMP apparatus of FIG. 4 was operated under
the following conditions:
[0133] the diameter of the semiconductor wafer W having a silicon
oxide layer thereon was 200 mm;
[0134] the diameter of the circular polishing cloth 14 made of
trademark IC1000/suba400 layer pad with a gridwork of 1.5 mm wide
grooves arranged at a pitch of 5 to 10 mm was 106 mm;
[0135] the start coordinate X.sub.s of the rocking operation was 50
mm;
[0136] the end coordinate X.sub.e of the rocking operation was 70
mm;
[0137] the rocking speed was 300 mm/min; and
[0138] the polishing pressure P was 0.3 kg/cm.sup.2.
[0139] As shown in FIG. 14A, when the semiconductor wafer W was
driven to rotate counterclockwise at a speed of 100 rpm (indicated
as -100 rpm), the silicon oxide layer on the semiconductor wafer W
was polished at a rate of 1,100 .ANG./min. When the wafer
rotational speed was reduced to -30 rpm, the polishing rate was
also reduced slightly. Then, the polishing rate was reduced
monotonically until the semiconductor wafer W became driven
clockwise the same as the polishing cloth 14 until 200 rpm. This is
because, when the polishing cloth 14 has a diameter equal to a half
of the diameter of the semiconductor wafer W to be polished, the
peripheral speed of the polishing cloth 14 revolving at 400 rpm is
equal to the peripheral speed of the semiconductor wafer W
revolving at 200 rpm, so that the polishing power PP is reduced
significantly.
[0140] Thereafter, the polishing rate came to show an increase.
However, when the wafer rotational speed exceeded 100 rpm, the
surface being polished became damaged with a rate of supply of
polishing liquid of 50 cc/min, so that the rate of supply of
polishing liquid had to be increased to 200 cc/min. The surface
being polished was not damaged when the semiconductor wafer W was
driven to rotate at 100 rpm oppositely relative to the polishing
cloth 14 (therefore -100 rpm).
[0141] This means that the rotating direction of the semiconductor
wafer W and that of the polishing cloth 14 are strongly related.
While the centrifugal force applied to the polishing liquid on the
semiconductor wafer W by the rotating wafer does not depend of the
rotating direction, the rotating polishing cloth 14 is located
above the semiconductor wafer and the polishing liquid is also
affected by the centrifugal force generated by the rotating
polishing cloth 14. When both the semiconductor wafer W and the
polishing cloth 14 are driven to rotate in the same direction,
polishing liquid flows on the semiconductor wafer W in a fixed
direction by the combined centrifugal force, so that the polishing
liquid is acceleratedly dispersed from the surface of the
semiconductor wafer W. This may be the reason why polishing liquid
had to be supplied at an enhanced rate in the above experiment.
[0142] The relationship between the rotational speed of the
semiconductor wafer W and the polishing unevenness will be
explained next with reference to FIG. 14B.
[0143] In FIG. 14B, the CMP apparatus of FIG. 4 was operated in the
same conditions as in FIG. 14A.
[0144] As shown in FIG. 14B, the polishing unevenness was minimized
when the semiconductor wafer W was rotating at a speed of -30 rpm,
and was increased as the rotational speed of the semiconductor
wafer W in the same direction as that of the polishing cloth 14 was
increased. Particularly, the polishing unevenness became remarkable
when the semiconductor wafer W and the polishing cloth 14 were
driven to rotate in the same direction at 400 rpm.
[0145] Thus, it is very important that the polishing cloth 14 and
the semiconductor wafer W are driven to rotate in opposite
directions to each other, in order to carry out a high speed
polishing operation, using polishing liquid efficiently and
economically, without damaging the surface of the semiconductor
wafer W.
[0146] An automatic polishing apparatus to which the CMP apparatus
of FIG. 4 is applied will be explained next with reference to FIGS.
15, 16 and 17. The automatic polishing apparatus is adapted to
perform a primary polishing operation and a second polishing
operation upon a semiconductor wafer.
[0147] In FIG. 15, reference numeral 31 designates a wafer carrier,
32 designates and index table, and 33 designates a wafer
conveyer.
[0148] The index table 32 is partitioned in a wafer loading station
S1, a primary polishing station S2, a secondary polishing station
S3 and a wafer unloading station S4.
[0149] Note that the stations S1 through S4 are allocated
respective stop positions of the indexing table 32. Therefore, the
index table 32 has four holders 321 for holding semiconductor
wafers W, and sequentially feeds each of the semiconductor wafers W
to the stations S1, S2, S3 and S4 as it turns by 90.degree..
[0150] The wafer loading station S1 is a region for moving
semiconductor wafers W onto the index table 32 and the unloading
station S4 is a region for moving semiconductor wafers W out of the
index table 32. The primary policing station S2 refers to a region
where the semiconductor wafers W moved onto the index table 32 are
subjected to a planarizing process, whereas the secondary polishing
station S3 refers to a region where the semiconductor wafers W are
finished after completing the planarizing process.
[0151] At the wafer loading station S1, the semiconductor wafers W
stored in the wafer carrier 31 are taken out one by one by a robot
arm 34 onto a pin clamp 35 and washed at the rear surface by a
wafer rear side cleaning brush (not shown). At the same time, the
surface of the holder 321 of the wafer loading stations S1 is
scraped and cleansed by a rotary ceramic plate 36 while it is
supplied with pure water.
[0152] The semiconductor wafer W with a cleaned rear surface is
then moved onto the holder 321 of the loading station S1 that has a
cleansed surface and firmly and securely adsorbed by a vacuum
chuck. Then, as the index table 32 is turned by 90.degree., the
semiconductor wafer W on the holder 321 is moved into the primary
polishing station S2.
[0153] At the primary polishing station S2, the semiconductor wafer
W is subjected to a planarizing process performed by a polishing
head 37 and then moved to the secondary polishing station S3, where
it is subjected to a finishing process performed by another
polishing head 37' and then moved to the wafer unloading station
S4, where the polished surface of the semiconductor wafer W is
roughly cleaned by means of a wafer front side cleaning brush
38.
[0154] After the rough cleaning, the semiconductor wafer W is moved
from the holder 321 onto the pin clamp 35', where its rear surface
is roughly cleaned by means of a wafer rear side cleaning brush
(not shown). Subsequently, the semiconductor wafer W is moved onto
the wafer conveyer 33 that leads to a precision wafer cleaning unit
(not shown) by means of another robot arm 34'. Meanwhile, the index
table 32 is turned by 90.degree. to return the holder 321 that is
now free from the semiconductor wafer W to the wafer loading
station S1 and becomes ready for receiving the next wafer W.
[0155] Also, the primary polishing station S2 and the secondary
polishing station S3 are provided respectively with pad
conditioners 40 and 40', and pad cleaning brushes 41 and 41'.
[0156] In more detail, referring to FIG. 16, the pad conditioners
40 and 40' are used to cleanse the surface of the polishing cloths
374 shown not in FIG. 16 but in FIG. 17 bonded to the bottom of the
polishing head 37.
[0157] The polishing head 37 carrying the polishing cloth on the
bottom (plate with a polishing pad bonded thereto) is set in
position on a carrier 42, which is provided with an air cylinder 43
for vertically moving up and down the polishing head 37 and a
rotary drive motor 44 for driving the polishing head 37 to rotate.
A carrier rocking drive section 45 is arranged along a rail 46.
[0158] In the rocking drive section 45, a feed screw 451 rotates as
it is driven by a feed drive mechanism (motor) 452 of the carrier
42, so that the carrier 42 is moved from a standby position along
the rail 46 onto the holder 321 of the primary polishing station S2
by the rotating feed screw 451. Then, it moves down along the
holder 321 under the control of the air cylinder. Thus, the
polishing head 37 is made to rotate under the control the rotary
drive motor 44, while linearly moving along the rail 46, to
consequently show a rocking motion on the semiconductor wafer W
that is rotating on the holder 321.
[0159] The rocking drive section 45 accurately detects the
coordinate of the center of the polishing head 37 and controls the
feeding rate and the rocking range thereof. Additionally, it
transmits data on the coordinate of the center of the polishing
head 37 to the control circuit 21.
[0160] In more detail, referring to FIG. 17, which is a detailed
cross-sectional view of the polishing head 37 of FIG. 15, the
polishing head 37 is constructed by a pressure cylinder 371, a base
plate 372 and a plate 373 with a polishing cloth 374. Also, a drive
plate 375 and a diaphragm 376 are arranged between the pressure
cylinder 371 and the base plate 372, and the multilayer structure
of the drive plate 375 and the diaphragm 376 is supported by a
flange at the outer periphery thereof while the pressure cylinder
371 is securely held by a bolt 377 at the lower edge thereof.
[0161] The plate 373 with the polishing cloth 374 is rigidly fitted
to the base plate 372. The polishing cloth 374 is made of membrane
of a hard polymer such as foamed polyurethane.
[0162] The diaphragm 376 is used to keep the inside of the pressure
cylinder 371 and the gap between the pressure cylinder 371 and the
base plate 372 airtight and is arranged so as to follow any
three-dimensional change in the direction of the base plate 372. It
also reinforced the strength of the base plate 372. According to
the present invention, the load to be applied onto a semiconductor
wafer is controlled by controlling the pressure of the pressure
chamber 371 of the polishing head 37.
[0163] As the pressure cylinder 371 is flexibly supported, the
polishing head 37 can have a three-dimensional clearance so that,
any change in the polishing load attributable to slight mechanical
inaccuracy of the rail 46 such as slight possible discrepancy in
the parallelism of the rail 46 and the wafer surface can be
compensated for. As a result, if the polishing head 37 is made to
rock, it can constantly apply a predetermined load to semiconductor
the wafer W.
[0164] In FIG. 17, reference numeral 378 designates a polishing
liquid supply hole.
[0165] In FIGS. 15, 16 and 17, it may be obvious that a polishing
method according to the present invention is not only effective for
a primary polishing process but also for a secondary polishing
process. A polishing process as used herein refers to a process of
planarizing the surface layer of a semiconductor wafer or a
semiconductor wafer per se, and also to a burying/planarizing
process for burying a metal layer or an insulting layer into the
grooves of a semiconductor wafer. Also, an elliptic polishing cloth
is used for the primary polishing process and a circular polishing
cloth is used for the secondary polishing process. The polishing
rate will be low in a central area and in an outer peripheral area
of the semiconductor wafer when an elliptic polishing cloth is
used, whereas the polishing rate will be contrarily high in those
areas when a circular polishing cloth is used. Thus, polishing
cloths with different contours may be used respectively for the
primary polishing process and the secondary polishing process to
offset the differentiated polishing rate distribution, so that the
entire surface to the semiconductor wafer may be polished highly
uniformly. It may be needless to say that, conversely, a circular
polishing cloth may be used for the primary polishing process and
an elliptic polishing cloth may be used for the secondary polishing
process to realize the same effect.
[0166] In the above-mentioned embodiment, although the surface
layer made of silicon oxide on a semiconductor wafer was polished
and planarized, there are no limitations for the material of the
wafer surface layer for the purpose of the present invention. Film
materials that can be used for the surface layer of a semiconductor
wafer to be planarized and polished by the polishing apparatus
according to the present invention include metals such as aluminum,
copper, tungsten, tantalum, niobium and silver, alloys such as TiW,
metal silicides such as tungsten silicide and titanium silicide,
metal nitrides such as tantalum nitride, titanium nitride and
tungsten nitride and polycrystalline silicon.
[0167] Additionally, materials that can be used for the surface
layer of a wafer to be planarized and polished by the polishing
apparatus according to the present invention further include
organic polymers with a low dielectric constant such as polyimide
amorphous carbon, polyether, benzocylobutane.
[0168] Further, polishing liquid that can be used for the purpose
of the present invention may be dispersed solution of silica fine
particles, alumina fine particles or cerium oxide fine
particles.
[0169] As explained hereinabove, according to the present
invention, since the polishing pressure can be definite over a
semiconductor wafer, any polishing unevenness can be minimized.
Also, since the semiconductor wafer and the polishing cloth are
driven to rotate in opposite directions, polishing liquid can be
used efficiently and economically to dramatically reduce the rate
of consumption of polishing liquid and hence the cost of polishing
a semiconductor wafer. A low rate of supplying polishing liquid to
the semiconductor wafer facilitates the operation of removing
polishing liquid from the part of the surface of the semiconductor
wafer being polished and improves the accuracy of detecting the
terminal point of the polishing operation.
* * * * *