U.S. patent application number 09/863519 was filed with the patent office on 2002-03-14 for socket for pga package.
Invention is credited to Hirata, Toshihisa, Hirayama, Takaaki, Sasao, Masami.
Application Number | 20020031922 09/863519 |
Document ID | / |
Family ID | 18683934 |
Filed Date | 2002-03-14 |
United States Patent
Application |
20020031922 |
Kind Code |
A1 |
Hirata, Toshihisa ; et
al. |
March 14, 2002 |
Socket for PGA package
Abstract
A socket for a PGA package includes a planar insulative housing
for mounting a plurality of terminals in grid array fashion. Each
of the terminals has a solder tail projecting from one side surface
of the insulative housing to be soldered to a printed circuit
board. Each of the terminals includes a planar main portion
extending in the direction of mounting to the insulative housing,
an anchor portion for engaging with the insulative housing on side
edges of the main body, a contact piece folded back into generally
U-shaped configuration from a lower end of the main body and
mutually opposing to the main body, and a solder tail extending
toward the printed circuit board. The contact piece has a contact
portion on an outside surface thereof for contacting with a pin of
the PGA package.
Inventors: |
Hirata, Toshihisa;
(Yamato-shi, JP) ; Sasao, Masami; (Yokohama,
JP) ; Hirayama, Takaaki; (Odawara-shi, JP) |
Correspondence
Address: |
Robert A. Yesukevich
MOLEX INCORPORATED
2222 Wellington Court
Lisle
IL
60532
US
|
Family ID: |
18683934 |
Appl. No.: |
09/863519 |
Filed: |
May 23, 2001 |
Current U.S.
Class: |
439/70 |
Current CPC
Class: |
H01R 43/20 20130101;
H05K 7/1084 20130101; H01R 43/16 20130101 |
Class at
Publication: |
439/70 |
International
Class: |
H05K 001/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 19, 2000 |
JP |
183332/2000 |
Claims
what is claimed is:
1. A socket for a PGA package including a planar insulative housing
for mounting a plurality of terminals in grid array fashion, each
of said terminals having a solder tail projecting from one side
surface of said insulative housing to be soldered to a printed
circuit board, each of said terminals comprising: a planar main
portion extending in the direction of mounting to said insulative
housing; an anchor portion for engaging with said insulative
housing on side edges of said main body; a contact piece folded
back into generally U-shaped configuration from a lower end of said
main body and mutually opposing to said main body, said contact
piece having a contact portion on an outside surface thereof for
contacting with a pin of said PGApackage; and a solder tail
extending toward said printed circuit board.
2. A socket for a PGA package as set forth in claim 1, wherein each
of said terminals is mounted to said insulative housing from a
surface opposite to said printed circuit board, and said anchor
portion is fixed into engagement with said insulative housing.
3. A socket for a PGA package as set forth in claim 2, wherein each
of said terminals is connected to a carrier at an upper end of said
main body via tabs, and said tabs are cut to remove said carrier
after mounting said terminals to said insulative housing.
4. A socket for a PGA package as set forth in claim 1, wherein said
solder tail and said contact piece are extended from an inner side
portion with respect to said anchor portion at said lower end of
said main body.
5. A socket for a PGA package as set forth in claim 4, wherein said
insulative housing includes a terminal mounting portion provided
with an overhang portion, and said overhang portion covers said
anchor portion between said main body and said contact piece.
6. A socket for a PGA package as set forth in claim 1, wherein said
contact piece is straightly extended f rom said lower end of said
main portion to said contact portion.
7. A socket for a PGA package as set forth in claim 3, wherein said
terminal is constructed by folding back said contact piece on said
main body side, after stamping a terminal blank from a resilient
metal sheet into a configuration in which said terminal blank is
connected to said carrier via said tabs.
8. A socket for a PGA package, as set forth in claim 7, wherein
said solder tail is obliquely formed in such a manner that the
distance from said contact piece becomes greater toward the tip end
of said solder tail, before being folded back.
9. A socket for a PGA package including a planar insulative housing
for mounting a plurality of terminals in grid array fashion, each
of said terminals having a solder tail projecting from one side
surf ace of said insulative housing to be soldered to a printed
circuit board, each of said terminals comprising: a planar main
portion extending in the direction of mounting to said insulative
housing; an anchor portion for engaging with said insulative
housing on side edges of said main body and said anchor portion is
fixed into engagement with said insulative housing; a contact piece
folded back into generally U-shaped configuration from a lower end
of said main body and mutually opposing to said main body, said
contact piece having a contact portion on an outside surface
thereof for contacting with a pin of said PGA package; a solder
tail extending toward said printed circuit board; and wherein each
of said terminals is mounted to said insulative housing from a
surface opposite to said printed circuit board.
10. A socket for a PGA package as set forth in claim 9, wherein
each of said terminals is connected to a carrier at an upper end of
said main body via tabs, and said tabs are cut to remove said
carrier after mounting said terminals to said insulative
housing.
11. A socket for a PGA package as set forth in claim 9, wherein
said solder tail and said contact piece are extended from an inner
side portion with respect to said anchor portion at said lower end
of said main body.
12. A socket for a PGA package as set forth in claim 11, wherein
said insulative housing includes a terminal mounting portion
provided with an overhang portion, said overhand portion covers
said anchor portion between said main body and said contract
piece.
13. A socket for a PGA package as set forth in claim 9, wherein
said contact piece is straightly extended from said lower end of
said main portion to said contact portion.
14. A socket for a PGA package as set forth in claim 10 wherein
said terminal is constructed by folding back said contact piece on
said main body side, after stamping a terminal blank from a
resilient metal sheet into a configuration in which said terminal
blank is connected to said carrier via said tabs.
15. A socket for a PGA package as set forth in claim 14, wherein
said solder tail is obliquely formed in such a manner that the
distance from said contact piece becomes greater toward the tip end
of said solder tail, before being folded back.
Description
[0001] 1. Field of the Invention
[0002] The present invention relates generally to a socket for a
PGA (pin grid array package to which the PGA package can be
connected.
[0003] 2. Description of the Related Art
[0004] Conventionally, a socket for a PGA package as shown in FIG.
12 is well known in the art (See Japanese Unexamined Patent
Publication (Kokai) No. Heisei 9-204969 and Japanese Unexamined
Patent Publication (Kohyo) No. Heisei 10-508143 and the like, for
example). The socket f or the PGA package comprises a planar
insulative housing 300 in which terminals are located in grid array
fashion, and a cover 302 including pin insertion holes 301 formed
in grid array fashion corresponding to the respective terminals. It
is possible to slide the cover 302 on the insulative housing 300 by
operation of a lever 303 and the like. Upon sliding the cover 302,
pins of the PGA package respectively opposing to a contact piece of
the respective terminals through the respective pin insertion holes
301 are adapted f or engagement with the contact pieces.
[0005] The respective terminals mounted on the insulative housing
include a solder tail extending from a bottom surface of the
insulative housing and soldered to circuit pads of a printed
circuit board. With the structure of the terminal, the structure as
shown in FIG. 13 (see Japanese Unexamined Utility Model Publication
(Kokai) No. Heisei 9-35838) and the structure as shown in FIG. 14
Publication (Kokai see Japanese Unexamined Utility Model No. Beisei
7-11787) are been well known in the art. With the structure of the
terminal shown in FIG. 13, the reference numeral 310 denotes a
contact piece, and the reference numeral 311 denotes a solder tail.
Upon sliding the cover 302, a pin 320 is moved as indicated by
arrow to contact with the contact piece 310. With the structure of
the terminal shown in FIG. 14, the reference numerals 330 denote a
pair of mutually opposing contact pieces, and the reference numeral
331 denotes a solder tail. Upon sliding the cover 302, the pin is
moved between the mutually opposing contact pieces 330 to contact
with the contact pieces 330.
[0006] With the typical structure of the terminal as set forth
above, it is difficult to hold the terminal by the insulative
housing in the structure of FIG. 13, since a moment is caused on
the terminal when the pin of the package is engaged with the
contact piece. Accordingly, this moment necessitates means such as
provision of an anchor for engaging with the insulative housing in
the direction of thickness of the terminal. Furthermore in the
structure of FIG. 14, the terminal becomes relatively large upon
being spread out, so that it lacks for process yield in case of
stamping it from a resilient metal sheet. In conjunction therewith,
it is difficult to make the terminal, since it is necessary to
balance the resilience of the mutually opposing contact pieces.
SUMMARY OF THE INVENTION
[0007] The present invention has been worked out in order to solve
the problems set forth above. Therefore, it is an object of the
present invention to provide a socket f or a PGA package for
mounting terminals having a structure adapted for being firmly held
on an insulative housing, and stably engaging with pins of the PGA
package.
[0008] To accomplish the above-mentioned object, the present
invention contemplates the provision of a socket f or a PGA package
including a planar insulative housing for mounting a plurality of
terminals in grid array fashion, each said terminals having a
solder tail projecting from one side surf ace of said insulative
housing to be soldered to a printed circuit board, each said
terminals may comprise:
[0009] a planar main portion extending in the direction of mounting
to said insulative housing;
[0010] an anchor portion for engaging with said insulative housing
on side edges of said main body;
[0011] a contact piece folded back into generally U-shaped
configuration from a lower end of said main body and mutually
opposing to said main body;
[0012] a solder tail extending toward said printed circuit board;
and
[0013] said contact piece having a contact portion on an outside
surface thereof for contacting with a pin of said PGA package.
[0014] According to the socket for the PGA package of the present
invention, the terminal has a construction in which the contact
piece is folded back into generally U-shaped configuration from the
lower end of the main body to be opposed to the main body, and the
contact portion engaging with the pin of the PGA package is formed
on the outside surface of the contact piece. Accordingly, the
contact piece with which the pin is engaged, is resiliently
deformed about an U-shaped folded back portion in the direction of
pivotal motion, and then this deformation force is transferred to
the main body. Since the main body of the terminal can be mated
with the inner wall of the terminal mounting portion of the
insualtive housing, it is possible to bear the deformation force by
the whole area of the main body. As a result, it is possible to
avoid causing the rotational moment on the terminal. Furthermore,
the engagement between the pins and the contact pieces are also
stabilized. still further, in case of stamping the terminals
(terminal blanks) from the resilient metal sheet, it is possible to
arrange them for a small pitch to improve the, process yield of
materials, since each terminal has a construction in which the
contact piece is folded back so as to be opposed to the main
body.
[0015] The present invention will be understood more fully from
detailed description given herebelow and f rom the accompanying
drawings of the pref erred embodiment of the present invention,
which, however, should not be taken to be limitative to the
invention, but are for explanation and understanding only. in the
drawings:
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1 is a perspective view of a terminal according to one
embodiment of the present invention;
[0017] FIG. 2 is a top plan view of the terminal according to one
embodiment of the present invention;
[0018] FIG. 3 is a top plan view of a terminal blank stamped from a
resilient metal sheet;
[0019] FIG. 4 is a top plan view showing the condition where the
terminal is formed from the terminal blank;
[0020] FIG. 5 is a plan view showing the condition where the
terminal is formed from the terminal blank;
[0021] FIG. 6 is a partially enlarged plan view of an insulative
housing;
[0022] FIG. 7 is a partially enlarges section view of the
insulative housing to which the terminals are mounted;
[0023] FIG. 8 is a partially enlarged top plan view of the
insulative housing to which the terminal is mounted;
[0024] FIG. 9 is a top plan view of the terminal blank f or a
terminal according to another embodiment of the present.
DESCRIPTION OF PREFERRED EMBODIMENTS
[0025] The present invention will be discussed hereinafter in
detail in terms of preferred embodiments of the present invention
with reference to the accompanying drawings. In the following
description, numerous specific details are set forth in order to
provide a thorough understanding of the present invention. It will
be obvious, however, to those skilled in the art that the present
invention may be practiced without these specific details. In other
instance, well-known structures are not shown in detail in order to
avoid unnecessarily obscure the present invention.
[0026] FIGS. 1 and 2 are, respectively, illustration of one
embodiment of a terminal 1. The terminal 1 is provided with anchor
portions 4 each comprising an engaging projection 3 along the side
edges of a planar main body 2. A contact piece 5 and a solder tail
6 are respectively extended from the lower end of the main body 2.
The contact piece is folded back into generally U-shaped
configuration to be opposed to the main body 2. More specifically,
the solder tail 6 is obliquely extended downwardly, and provided
with a planar solder tail portion 7 at the tip end thereof. The
contact piece 5 and the solder tail 6 are respectively extended
from the inner side portion with respect to the anchor portion 4 at
the lower end of the main body 2. A tip end of the contact piece 5
is laterally extended, and formed into an outwardly directing arch
configuration in cross-section to provide a contact portion 8.
[0027] FIG. 3 is an illustration of terminal blanks 9 stamped from
a resilient metal. sheet. Furthermore, FIGS. 4 and 5 are,
respectively, illustrations of the manner that the terminal 1 is
constructed by forming the terminal blank 9. As shown in each
drawing, the terminal blanks 9 and the terminals 1 are stamped and
formed in lateral alignment longitudinally of a carrier 10. The
carrier 10 and the main body 2 of the terminal 1 are connected via
a tab 11, so that it is possible to separate the individual
terminal 1 by cutting the tab 11. The arrangement pitch of the
terminal blanks 9 and the terminals 1 laterally aligned in the
longitudinal direction of the carrier 10 corresponds to the pitch
(for example, 1.27 mm pitch) of terminal mounting portions 13 (see
FIGS. 6 and 7) provided with the insulative housing 12 constructing
the socket for the PGA package in a grid array fashion.
Accordingly, it is possible to gang load a plurality of the
terminals 1 to the terminal mounting portions 13 arranged in one
row.
[0028] FIG. 6 is a partially enlarged top plan view of the
insulative housing 12 constructing the socket for the PGA package,
shows the terminal mounting portions 13 arranged in one row. By
providing the terminal mounting portions 13 arranged in one row in
a plurality of rows, the terminal mounting portions 13 are provided
in grid array fashion within the insulative housing 12 as a whole.
Furthermore, FIG. 7 is a partially enlarged section showing the
condition where the respective terminals 1 are mounted to the
respective terminal mounting portions 13. FIG. 8 is a partially
enlarged top plan view of FIG. 7. It is possible that a plurality
of the terminals 1 still connected to the carrier 10 are gang
loaded to each row of the terminal mounting portions 13 from the
upper surface of the insulative housing 12, i.e., the surface
opposite to a printed circuit board (not shown). After mounting
them, the portion of the tabs 11 connecting between the carrier 10
and the terminals 1 is cut to separate the respective terminals 1
from the carrier 10.
[0029] The terminal mounting portion 13 is extended from the upper
surface to the bottom surface of the insulative housing 12.
Mutually opposing inner walls 14a, 14b are respectively provided
with an overhang portion 15 in the vertical direction thereof, and
the respective overhang portions 15 cooperate with an adjacent
inner wall 14c to form a mounting groove 16. The respective anchor
portions 4 formed at the side edges of the main body 2 are inserted
into the mounting grooves 16 with orienting the main body 2 in the
mounting direction to mount the terminallto the insulative housing
12. The engaging portion 3 of the respective anchor portions 4 is
engaged with the insulative housing 12 to maintain the mounting
condition. The overhang portion 15 is positioned between the main
body 2 and the contact piece 5 of the terminal 1 to cover the
anchor portion 4.
[0030] The solder tail 6 provided on the terminal 1 is outwardly
projected from the bottom surface of the insulative housing 12
through the terminal mounting portion 13, and extended toward the
printed circuit board to which this socket is mounted. Accordingly,
it becomes possible that the solder tail portions 7 formed at the
tip end of the solder tail 6 are soldered to the circuit pads on
the printed circuit board, respectively.
[0031] With the socket for the PGA package in which the terminals 1
are mounted to the insulative housing 12 as set forth above, a pin
17 of the PGA socket to be slid by a cover (not shown) is moved
from the position P to the direction indicated by arrow 18 to
engage with the contact portion 8 provided on the outside face at
the tip end of the contact piece 5, as shown in FIG. 8. FIG. 7
shows the condition where the pin 17 is engaged with the contact
portion B. The contact piece 5 is engaged with the pin 17 to be
pivotably moved to on the side of the main body 2 about a base
portion folded back into the U-shaped configuration (which is
indicated by the reference numeral 0 in FIG. 7. The deformation
force due to this pivotal motion is transferred to the main body 2,
and bore by the whole area of the inner wall 14c of the terminal
mounting portion 13 with which the main body 2 is contact.
Therefore, the pin 17 is engaged with the contact portion 8 under
an appropriate contact pressure.
[0032] As set forth above, when the pin 17 is engaged with the
contact piece 5 of the terminal 1, the deformation force of the
contact piece 5 is transferred to the side of the insulative
housing 12 through the whole are of the main body 2 to be bore, so
that it prevents causing the moment on the terminal 1. Accordingly,
it is possible to firmly hold the terminal 1 constantly via
engagement between the anchor portion 4 and the insulative housing
12, and also possible to stabilize the engagement between the
contact piece 5 and the pin 17.
[0033] Furthermore, the terminal has a construction in which the
contact piece 5 connected to the lower end of the main body 2 is
folded back into the U-shaped configuration to be opposed to the
main body 2. Therefore, it is possible to form the respective
terminals 1 under the condition where the terminals 1 are laterally
aligned with the carrier 10 for a small pitch corresponding to the
pitch of the terminal mounting portion 13 on the side of the
insulative housing 12. As a result, a plurality of the terminals 1
can be gang loaded to the insulative housing 12.
[0034] FIGS. 9 to 11 respectively show another embodiment of
terminals 31 adapted for being gang loaded to the insulative
housing 12 as is the case with the preferred embodiment set forth
above. FIG. 9 is an illustration of a terminal blank 39, and FIGS.
10 and 11 are respectively illustration of a terminal 31. The
configuration of a contact piece 35 is different from that of the
contact piece 5 of the above-mentioned embodiment. The contact
piece 35 is extended generally straightly from the lower end of a
main body 32. The contact piece 35 extending generally straightly
permits to reduce inductance of the terminal 31 interposed between
the pin 17 of the PGA package and the circuit pad of the printed
circuit board as low as possible.
[0035] A solder tail portion 37 to be formed at the tip end of a
solder tail 36 is generally circular. This circular configuration
is meant f or mounting a solder ball 50 as indicated by dotted line
in FIGS. 10 and 11. In case where the terminal 31 is contact with
the printed circuit board by mounting the solder ball 50 to the
solder portion 37, it is desirable that the solder tail portion 37
is generally in flush with the bottom surface (the lower surface in
FIG. 7) of the insulative housing 12 under the condition where the
terminal 31 formed by shortening the solder tail 36 is mounted to
the insulative housing 12.
[0036] In either of the preferred embodiments set forth above, the
solder tails 6 and 36 projecting from the main bodies 2 and 32 are
respectively obliquely extended relative to contact pieces 5 and 35
adjacent thereto under the condition where the terminals 1 and 31
are still connected to the carrier 10 as the terminal blanks 9 and
39. In other words, the solder tails 6, 36 are respectively formed
in such a manner that distance from the respective contact pieces 5
and 35 becomes greater toward the tip end of the respective solder
tails 6, 36. Due to such a configuration, a die assembly is easily
removed from the contact pieces 5 and 35 and the solder tails 6 36,
when the terminal blanks 9 and 39 are stamped from the resilient
metal sheet.
[0037] As set forth above, the present invention is contemplated
the provision of the terminal including the main body of which the
whole area is contact with the inner wall of the terminal mounting
portion of the insulative housing, and the contact portion provided
on the outside surface of the contact piece which is folded back
into U-shaped configuration from the lower end of the main body.
Accordingly, the terminals are firmly held on the insulative
housing, and engagement between the terminals and the pins of the
PGA package is also stabilized, so that it is possible to obtain
the highly reliable socket for the PGA package.
[0038] Although the present invention has been illustrated and
described with respect to exemplary embodiment thereof, should be
understood by those skilled in the art that foregoing and various
other changes, omissions and additions may be made therein and
thereto, without departing from the spirit and scope of the present
invention. Therefore, present invention should not be understood as
limited to the specific embodiment set out above but to include all
possible embodiments which can be embodied within a scope
encompassed and equivalents thereof with respect to the feature set
out in the appended claims.
* * * * *