U.S. patent application number 09/330155 was filed with the patent office on 2002-01-31 for probe stylus.
Invention is credited to NODA, HIROSHI.
Application Number | 20020011853 09/330155 |
Document ID | / |
Family ID | 11771599 |
Filed Date | 2002-01-31 |
United States Patent
Application |
20020011853 |
Kind Code |
A1 |
NODA, HIROSHI |
January 31, 2002 |
PROBE STYLUS
Abstract
The present invention relates to a probe stylus 1 for an
inspection of semiconductor device in a state of wafer. When a
large number of pad 5 are disposed in a semiconductor device,
setting of the probe styluses 1 onto a probe card, on which a
semiconductor to be inspected shall be mounted, is difficult. An
objet of the present invention is to improve the form of the probe
stylus to solve this problem. The object is attained by a probe
stylus according to the present invention. The probe stylus 1 is
comprised of a first electrically conductive member 2, a second
electrically conductive member 3, and an insulating member 4
disposed between the first and second electrically conductive
members 2,3, wherein the first and second electrically conductive
members 2,3 have a form of a needle and they form a single needle.
In an embodiment, the first and second electrically conductive
members have a half round cross section. In another embodiment,
each of the first and second electrically conductive members has a
resilient portion at their tip portion. In another embodiment, the
first electrically conductive member is covered with the insulating
member, and the insulating member is covered with the second
electrically conductive member. In further another embodiment, a
slit is disposed between the first and second electrically
conductive members.
Inventors: |
NODA, HIROSHI; (TOKYO,
JP) |
Correspondence
Address: |
BURNS DOANE SWECKER & MATHIS L L P
POST OFFICE BOX 1404
ALEXANDRIA
VA
22313-1404
US
|
Family ID: |
11771599 |
Appl. No.: |
09/330155 |
Filed: |
June 11, 1999 |
Current U.S.
Class: |
324/755.11 |
Current CPC
Class: |
G01R 1/06761 20130101;
G01R 1/06738 20130101; G01R 1/0675 20130101; G01R 1/06716
20130101 |
Class at
Publication: |
324/754 |
International
Class: |
G01R 031/02 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 19, 1999 |
JP |
11-11208 |
Claims
What is claimed is:
1. A probe stylus for inspecting a semiconductor device, which
contacts with a pad disposed in a semiconductor device at an
inspection of the semiconductor device, wherein the probe stylus
comprises a first electrically conductive member formed as a
needle, a second electrically conductive member formed as a needle,
and an insulating member arranged between them and connecting them
so that the first and second electrically conductive members and
the insulating member form a single needle.
2. A probe stylus for inspecting a semiconductor device according
to claim 1, wherein the cross section of each of the first and
second electrically conductive members perpendicular to their
longitudinal direction is half round.
3. A probe stylus for inspecting a semiconductor device according
to claim 2, wherein the first and second electrically conductive
members are electrically connected to each other at their tip
portion.
4. A probe stylus for inspecting a semiconductor device according
to claim 2, wherein the first and second electrically conductive
members are not electrically connected to each other at their tip
portion, but are connected to each other through a pad disposed in
a semiconductor device at an inspection of the semiconductor
device.
5. A probe stylus for inspecting a semiconductor device according
to claim 2, wherein the probe stylus is a cantilever type probe
stylus.
6. A probe stylus for inspecting a semiconductor device according
to claim 2, wherein the probe stylus is a perpendicular type probe
stylus.
7. A probe stylus for inspecting a semiconductor device according
to claim 1, wherein each of the first and second electrically
conductive members has a resilient portion at their tip portion,
where the probe stylus contacts with a pad disposed in a
semiconductor device.
8. A probe stylus for inspecting a semiconductor device according
to claim 7, wherein the resilient portion of the first and second
electrically conductive member form a round resilient portion.
9. A probe stylus for inspecting a semiconductor device according
to claim 7, wherein the resilient portion of the first and second
electrically conductive portion form a Y-formed resilient
portion.
10. A probe stylus for inspecting a semiconductor device according
to claim 7, wherein the resilient portion of the first and second
electrically conductive member form an arc or jack-knifed resilient
portion.
11. A probe stylus for inspecting a semiconductor device according
to claim 7, wherein the first and second electrically conductive
members are electrically connected to each other at their tip
portion.
12. A probe stylus for inspecting a semiconductor device according
to claim 7, wherein the first and second electrically conductive
members are not electrically connected to each other at their tip
portion, but are connected to each other through the pad disposed
in a semiconductor device at an inspection of the semiconductor
device.
13. A probe stylus for inspecting a semiconductor device according
to claim 7, wherein the cross section of each of the first and
second electrically conductive members is half round.
14. A probe stylus for inspecting a semiconductor device according
to claim 7, wherein the cross section of each of the first and
second electrically conductive members is round.
15. A probe stylus for inspecting a semiconductor device according
to claim 14, wherein the diameter of the cross section of one of
the first and second electrically conductive members is smaller
than that of the other.
16. A probe stylus for inspecting a semiconductor device according
to claim 7, wherein the first electrically conductive member is
covered with the insulating member, and the insulating member is
covered with the second electrically insulating member.
17. A probe stylus for inspecting a semiconductor device according
to claim 1, wherein the first electrically conductive member is
covered with the insulating member, and the insulating member is
covered with the second electrically insulating member, and the
first and second electrically conductive members are electrically
connected to each other at their tip portion.
18. A probe stylus for inspecting a semiconductor device according
to claim 1, wherein the first electrically conductive member is
covered with the insulating member, and the insulating member is
covered with the second electrically insulating member, and the
first and second electrically conductive members are not
electrically connected to each other at their tip portion, but are
connected to each other through a pad disposed in a semiconductor
device at an inspection of the semiconductor device.
19. A probe stylus for inspecting a semiconductor device according
to claim 1, wherein the probe stylus is a cantilever type probe
stylus, and a slit is disposed between the first and second
electrically conductive members at their tip portion, where the
probe stylus contacts with a pad disposed in a semiconductor
device, the slit opens when the probe stylus contacts with a pad
disposed in a semiconductor device so that the first and second
electrically conductive members separate from each other.
20. A probe stylus for inspecting a semiconductor device according
to claim 19, wherein the cross section of each of the first and
second electrically conductive members to their longitudinal
direction are an arc or a quadrate.
Description
BACKBROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a probe stylus for
inspecting a semiconductor at a wafer state.
[0003] 2. Description of the Prior Art
[0004] A probe stylus in the prior art is constituted as a single
electrically conductive needle. In a high precise inspection of a
semiconductor device at a wafer state, probe styluses for forcing
and probe styluses for sensing are connected to pads disposed in a
semiconductor. And these probe styluses are connected to form a
Kelvin connection. In such a probe stylus, a cantilever type probe
stylus and a perpendicular type probe stylus are known. The
cantilever type probe stylus contacts obliquely with a pad disposed
in a semiconductor device, and the perpendicular type probe stylus
contacts perpendicularly with a pad, at an inspection of a
semiconductor.
[0005] At an inspection of an I/O of a semiconductor device, for
example, a high speed logic element, when an output data of a
driver of a tester is inputted into a signal input terminal of a
semiconductor, and the output from the output terminal of the
semiconductor is received by a comparator of the tester, there is
case that a dead band appears. For eliminating such a dead band, it
is proposed to use a signal line specialized for transferring the
data signal from the output terminal of the tester to the input
terminal of the semiconductor and another signal line specialized
for transferring the signal from the output terminal of the
semiconductor to the comparator of the tester. A dead band means a
period, in which the tester cannot judge the semiconductor, because
of a conflict of the signals from the output terminal of the
semiconductor and the data signal from the output terminal of the
driver of the tester.
[0006] Many probe styluses have already been known, which allows to
inspect precisely a semiconductor device at a wafer state, even
when a large number of pads are disposed in the semiconductor
device. Such probe styluses are disclosed, for example, in Japanese
Patent Applications JP-A-5-144895, JP-Utility-Model-A-1-174932,
JP-A-Utility-Model-61-104380, JP-A-2-124469 and JP-A-4-288847.
[0007] FIG. 62 is a perspective view of a probe stylus disclosed in
JP-A-5-144895. FIG. 62 shows a state that a probe stylus 201
contacts with a pad 204 disposed in a semiconductor. The probe
stylus 201 is a so-called cantilever type probe stylus constituted
of a first electrically conductive member 202 and a second
electrically conductive member 203, which are jointed to each other
so as to form a branching structure.
[0008] FIG. 63 is a cross sectional view of a probe stylus
disclosed in JP-Utility-Model-A-1-174932. FIG. 63 shows that a
probe stylus 211 contacts with a pad 216 disposed in a
semiconductor. The probe stylus 211 is a so-called perpendicular
type probe stylus constituted of a first electrically conductive
member 212, a second electrically conductive member 203 and an
insulating member 214 disposed between the first and second probe
stylus. The first and second electrically conductive members 212,
213, have a form of a conventional perpendicular type probe stylus.
The first and second electrically conductive members 212, 213 and
the insulating member 214 are adhered to each other by an adhesive
215.
[0009] FIG. 64 is a cross sectional view of a probe stylus
disclosed in JP-Utility-Model-A-61-104380. FIG. 64 shows that a
probe stylus 221 contacts with a pad disposed in a semiconductor.
The probe stylus 221 is a so-called cantilever type probe stylus
constituted of a first electrically conductive member 222, a second
electrically conductive member 223, and insulating member 224
disposed between and around the first and second electrically
conductive members 222, 223. The first electrically conductive
member 222 has a form of a conventional cantilever type probe
stylus. The second electrically conductive member 223 is thinner
than the first electrically conductive member 222. The first and
second electrically conductive members 222, 223 are fixed to each
other by the insulating member 224 so that they form a single
body.
[0010] FIG. 65 (a) is a side view of a probe stylus disclosed in
JP-A-2-124469, FIG. 65(b) is a E1-E1 cross sectional view of FIG.
65 (a). The probe stylus 231 is a so-called cantilever type probe
stylus constituted of a first electrically conductive member for
forcing 232, a second electrically conductive member for sensing
233, and an insulating member 234 disposed between the first and
second electrically conductive members 232, 233. The first
electrically conductive member for forcing 232 has a form of a
conventional cantilever type probe stylus. The outside of the first
electrically conductive member 232 is covered with the insulating
member 234, and the outside of the insulating member 234, in turn,
is covered with the second electrically conductive members 233.
[0011] Also, JP-A-4-288847 discloses a similar probe stylus
constituted of a first electrically conductive member for forcing
232, which has a form of a conventional cantilever type probe
stylus and is covered with an insulating member 234, and a second
electrically conductive member for sensing 233, which covers the
outside of the insulating member 234.
[0012] The probe stylus of the prior art, constituted as a single
electrically conductive needle, has following drawbacks. In
general, a large number of probe styluses are required for high
precision inspection of a semiconductor in a wafer state, when a
large number of pad is disposed in the semiconductor device.
However, the setting of the probe styluses of the prior art onto a
probe card are difficult, when a large number of pads are disposed
in a semiconductor device.
[0013] Another drawback is that a probe card tends to warp, when
perpendicular type probe styluses contact with the pads disposed in
a semiconductor device.
SUMMARY OF THE INVENTION
[0014] An object of the present invention is to eliminate these
drawbacks of the probe stylus of the prior art.
[0015] Another object is to propose a probe stylus, which allows to
inspect precisely a semiconductor at a wafer state, even when a
large number of the pads are disposed in a semiconductor
device.
[0016] Another object is to propose a probe stylus, which does not
cause a warp of the probe card, when the probe styluses contact
with the pads, even when a large number of pads are disposed in a
semiconductor device.
[0017] The object is attained by a probe stylus according to claim
1.
[0018] In an embodiment the probe stylus of the present invention,
the cross section of each of the first and second electrically
conductive members perpendicular to their longitudinal direction is
half round.
[0019] In another embodiment the probe stylus of the present
invention, each of the first and second electrically conductive
members has a resilient portion at their tip portion, where the
probe stylus contacts with a pad disposed in a semiconductor
device.
[0020] In another embodiment the probe stylus of the present
invention, the first electrically conductive member is covered with
the insulating member, and the insulating member is covered with
the second electrically insulating member, and the first and second
electrically conductive members are electrically connected to each
other at their tip portion.
[0021] In another embodiment the probe stylus of the present
invention, the first electrically conductive member is covered with
the insulating member, and the insulating member is covered with
the second electrically insulating member, and the first and second
electrically conductive members are not electrically connected to
each other at their tip portion, but are connected to each other
through a pad disposed in a semiconductor device at an inspection
of the semiconductor device.
[0022] In another embodiment the probe stylus of the present
invention, the probe stylus is a cantilever type probe stylus, and
a slit is disposed between the first and second electrically
conductive members at their tip portion, where the probe stylus
contacts with a pad disposed in a semiconductor device, the slit
opens when the probe stylus contacts with a pad disposed in the
semiconductor device so that the first and second electrically
conductive members separate from each other.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] FIG. 1 is a schematic side view of a probe stylus as a first
embodiment of the present invention.
[0024] FIG. 2 is a plan view of the probe stylus seen from the side
A in FIG. 1.
[0025] FIG. 3 is a cross sectional view of the probe stylus along
B-B line in FIG. 1.
[0026] FIG. 4 is a cross sectional view of a probe card having
probe styluses according to the first embodiment of the present
invention.
[0027] FIG. 5 is a detailed cross sectional view of the a
connecting portion of a probe stylus and the probe card of FIG.
4.
[0028] FIG. 6 is a plan view of the connecting portion of a probe
stylus and the probe card seen from the side D in FIG. 5.
[0029] FIG. 7 is a schematic side view of a probe stylus as a
second embodiment of the present invention.
[0030] FIG. 8 is a cross sectional view of the probe stylus along
E-E line in FIG. 7.
[0031] FIG. 9 is a plan view of a probe stylus as a third
embodiment of the present invention.
[0032] FIG. 10 is a side view of the probe stylus seen from the
side F in FIG. 9.
[0033] FIG. 11 is a cross sectional view of the probe stylus along
G-G line in FIG. 11.
[0034] FIG. 12 is a plan view of the connecting portion of a probe
stylus according to the third embodiment and a probe card seen from
the bottom side.
[0035] FIG. 13 is a plan view of a probe stylus according to the
fourth embodiment.
[0036] FIG. 14 is a cross sectional view of the probe stylus along
H-H line in FIG. 13.
[0037] FIG. 15 is a schematic side view of a probe stylus as a
fifth embodiment of the present invention.
[0038] FIG. 16 is a cross sectional view of the probe stylus along
I-I line in FIG. 15.
[0039] FIG. 17 is a cross sectional views of a probe card having
probe styluses according to the fifth embodiment of the present
invention.
[0040] FIG. 18 is a detailed cross sectional view of the probe card
at the connecting portion of a probe card and a probe stylus
according to the fifth embodiment, showing an example of the
connection between them.
[0041] FIG. 19 a detailed cross sectional view of the probe card at
the connecting portion of a probe card and a probe stylus according
to the fifth embodiment, showing another example of the connection
between them.
[0042] FIG. 20 is a schematic side view of a probe stylus as a
sixth embodiment of the present invention.
[0043] FIG. 21 is a cross sectional view of the probe stylus along
K-K line in FIG. 20.
[0044] FIG. 22 is a schematic side view of a probe stylus as a
seventh embodiment of the present invention.
[0045] FIG. 23 is a cross sectional view of the probe stylus along
L-L line in FIG. 22.
[0046] FIG. 24 is a schematic side view of a probe stylus as an
eighth embodiment of the present invention.
[0047] FIG. 25 is a cross sectional view of the probe stylus along
M-M line in FIG. 24.
[0048] FIG. 26 is a schematic side view of a probe stylus as a
ninth embodiment of the present invention.
[0049] FIG. 27 is a cross sectional view of the probe stylus along
N-N line in FIG. 26.
[0050] FIG. 28 is a schematic side view of a probe stylus as a
tenth embodiment of the present invention.
[0051] FIG. 29 is a cross sectional view of the probe stylus along
O-O line in FIG. 28.
[0052] FIG. 30 is a schematic side view of a probe stylus as an
eleventh embodiment of the present invention.
[0053] FIG. 31 is a cross sectional view of the probe stylus along
P-P line in FIG. 30.
[0054] FIG. 32 is a schematic side view of a probe stylus as a
twelfth embodiment of the present invention.
[0055] FIG. 33 is a cross sectional view of the probe stylus along
Q-Q line in FIG. 32.
[0056] FIG. 34 is a schematic side view of a probe stylus as a
thirteenth embodiment of the present invention.
[0057] FIG. 35 is a cross sectional view of the probe stylus along
R-R line in FIG. 34.
[0058] FIG. 36 is a schematic side view of a probe stylus as a
fourteenth embodiment of the present invention.
[0059] FIG. 37 is a cross sectional view of the probe stylus along
S-S line in FIG. 36.
[0060] FIG. 38 is a schematic side view of a probe stylus as a
fifteenth embodiment of the present invention.
[0061] FIG. 39 is a cross sectional view of the probe stylus along
T-T line in FIG. 38.
[0062] FIG. 40 is a schematic side view of a probe stylus as a
sixteenth embodiment of the present invention.
[0063] FIG. 41 is a cross sectional view of the probe stylus along
U-U line in FIG. 40.
[0064] FIG. 42 is a schematic side view of a probe stylus as a
seventeenth embodiment of the present invention.
[0065] FIG. 43 is a cross sectional view of the probe stylus along
V-V line in FIG. 42.
[0066] FIG. 44 is a cross sectional views of a connecting portion
between a probe card a probe stylus according to the seventeenth
embodiment of the present invention.
[0067] FIG. 45 is a schematic side view of a probe stylus as a
eighteenth embodiment of the present invention.
[0068] FIG. 46 is a cross sectional view of the probe stylus along
W-W line in FIG. 45.
[0069] FIG. 47 is a schematic side view of a probe stylus as a
nineteenth embodiment of the present invention.
[0070] FIG. 48 is a cross sectional view of the probe stylus along
X-X line in FIG. 47.
[0071] FIG. 49 is a detailed cross sectional view of an example of
the connecting portion between the probe card and a substrate of a
probe stylus according to the nineteenth embodiment.
[0072] FIG. 50 is a detailed cross sectional view of another
example of the connecting portion between the probe card and a
substrate of a probe stylus according to the nineteenth
embodiment.
[0073] FIG. 51 is a schematic side view of a probe stylus as a
twentieth embodiment of the present invention.
[0074] FIG. 52 is a cross sectional view of the probe stylus along
Y-Y line in FIG. 51.
[0075] FIG. 53 is a schematic side view of a probe stylus as a
twenty-first embodiment of the present invention.
[0076] FIG. 54 is a cross sectional view of the probe stylus along
Z-Z line in FIG. 53.
[0077] FIG. 55 is a schematic side view of a probe stylus as a
twenty-second embodiment of the present invention.
[0078] FIG. 56 is a cross sectional view of the probe stylus along
A1-A1 line in FIG. 55.
[0079] FIG. 57 is a schematic plan view of a probe stylus according
to the twenty-third embodiment at a state that the probe stylus is
not contacting with a pad disposed in a semiconductor.
[0080] FIG. 58 is a schematic plan view of a probe stylus according
to the twenty-third embodiment at a state that the probe stylus is
contacting with a pad disposed in a semiconductor.
[0081] FIG. 59 is a side view of a probe stylus seen from the side
B1 in FIG. 57.
[0082] FIG. 60 is a cross sectional view of an example of a probe
stylus, (a) shows a cross section along the line C1-C1 in FIG. 57,
(b) shows a cross section along the line D1-D1 in FIG. 57.
[0083] FIG. 61 is a cross sectional view of another example of a
probe stylus, which has a form different from that of FIG. 60, (a)
shows a cross section along the line C1-C1 in FIG. 57, (b) shows a
cross section along the line D1-D1 in FIG. 57.
[0084] FIG. 62 is a perspective view of a probe stylus disclosed in
JP-A-5-144895.
[0085] FIG. 63 is a cross sectional view of a probe stylus
disclosed in JP-Utility-Model-A-5-144895.
[0086] FIG. 64 is a cross sectional view of a probe stylus
disclosed in JP-Utility-Model-A-61-104380.
[0087] FIG. 65 (a) is a side view of a probe stylus disclosed in
JP-A-61-104380, FIG. 65(b) is a E1-E1 cross sectional view of FIG.
65 (a).
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0088] FIRST EMBODIMENT
[0089] The first embodiment of the probe stylus according to the
present invention is explained below, referring to FIG. 1-6. FIGS.
1 and 2 show that the probe stylus 1 is contacting with a pad 5
disposed in a semiconductor device.
[0090] The probe stylus 1 of the first embodiment of the present
invention is a so-called cantilever type probe stylus. Each of the
first and second electrically conductive members 2,3 has a form of
needle. The cross section perpendicular to the longitudinal
direction of the needle is half round. Namely, each of the first
and second electrically conductive member has a form of a
conventional cantilever type probe stylus divided equally along its
longitudinal axis. Thus, the assembly of the probe stylus of the
first embodiment has a thickness substantially equal to the
conventional probe stylus. The first and second electrically
conductive members 2, 3 are connected to each other at their tip,
where the probe stylus 1 contacts with a pad 5 disposed in a
semiconductor device. In this embodiment, the first and second
electrically conductive members 2, 3 are arranged so that one of
them is positioned over the other.
[0091] Referring to FIG. 4, a base substrate 12 of the probe card
11 has a center hole 13, and a probe stylus 1 is fixed to a ring 14
by a synthetic resin 15. FIG. 5 shows a detailed cross sectional
view of the part C in FIG. 4 framed by a broken line. FIG. 6 is a
plan view of the connecting portion of a probe stylus and the probe
card seen from the side D in FIG. 5. Referring to FIG. 6, first and
second lands 16, 17 are disposed on the base substrate 12 of the
probe card 1. And the first electrically conductive member 2
contacts with a first land 16, the second electrically conductive
member 3 contacts with a second land 17. Reference numeral 18
denotes soldering portion connecting the first and second
electrically conductive members 2, 3 with the first and second land
16, 17, respectively. The structure of the other part is similar to
that shown in FIGS. 1,4.
[0092] The function of the probe card and the probe stylus is
explained below.
[0093] At a precise inspection of a semiconductor device at a wafer
state, a probe stylus 1 is brought in contact with a pad 5 disposed
in a semiconductor device. And one of the first and second
electrically conductive member 2, 3 is used as an electrically
conductive member for forcing, and the other is used as an
electrically conducting member for sensing. In this case, the first
and second electrically conductive members are connected at their
tip, therefore, the value of voltage and/or electric current can be
compensated up to the tip of the probe stylus 1, when a Kelvin
connection is formed at the tips of the first and second
electrically conductive members 2, 3.
[0094] At an inspection of an I/O of a semiconductor device at a
wafer state, the probe stylus 1 is brought in contact with a pad 5
disposed in the semiconductor device, and one of the first and
second electrically conductive member 2, 3 is used as an
electrically conductive member for driving and the other is used as
an electrically conductive member for tester. In this case, the
first and second electrically conductive members are contacted
electrically to each other at their tip. Therefore, the line
specialized for transferring output data signal from the driver to
the pad 5 disposed in the semiconductor device, and the line
specialized for transferring the output data signal from the pad 5
to the comparator of the tester are assured up to the tip of the
probe stylus.
[0095] As explained, the probe stylus 1 according to the first
embodiment of the present invention has a first electrically
conductive member 2 and a second electrically conductive member 3.
Therefore, such a probe stylus functions equivalent to two probe
styluses of the prior art. As a result, by contacting one probe
stylus to one of the pads disposed in a semiconductor device, it is
possible to eliminate so-called dead band in the comparator in a
precise inspection of a semiconductor device at a wafer state, or
in an inspection of an I/O of a semiconductor device at a wafer
state. Also in a case that a large number of pads are disposed in a
semiconductor device, corresponding large number of probe styluses
can be disposed on a probe card, so that so-called dead band in the
comparator can be eliminated in such a precise inspection of a
semiconductor device at a wafer state, or in an inspection of an
I/O of a semiconductor device at a wafer state.
[0096] A probe stylus according to the first embodiment of the
present invention functions equivalently to two probe styluses of
the prior art, hence, the number of probe styluses 1 to be attached
to a probe card and/or the area required for the arrangement of the
probe stylus in a probe card can be reduced, as a result, the
fabrication cost can be reduced.
[0097] Additionally, according to the first embodiment of the
present invention, each of the first and second electrically
conductive members has a half round cross section perpendicular to
the longitudinal direction. Therefore, the thickness of the probe
stylus according to the first embodiment is smaller than that of
bundled two probe styluses of the prior art. As a result, also in a
case that a large number of pads are disposed in a semiconductor
device, a corresponding number of the probe styluses 1 can be
attached onto a probe card.
[0098] SECOND EMBODIMENT
[0099] In a probe stylus according to the first embodiment, the
first and second electrically conductive members 2, 3 are connected
at their tip. On the other hand, in a probe stylus according to the
second embodiment of the present invention, the first and second
electrically conductive members are not connected at their tip. And
at an inspection of a semiconductor device, they are connected to
each other through a pad disposed in a semiconductor device. The
other feature is similar to that of the first embodiment.
[0100] FIG. 7 shows that the probe stylus 1a is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figure,
reference numerals 1a, 2a, 3a denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 2a, 3a are connected by an insulating member 4a
arranged between them. Reference numeral 5 denotes a pad disposed
in a semiconductor.
[0101] The structure of a probe card having probe stylus 1a
according to the second embodiment is similar to that of the probe
card shown in FIG. 4. The connection between a probe stylus 1a and
the substrate of a probe card is similar to that shown in FIGS. 5,
6.
[0102] The function of the probe card and the probe stylus is
explained below.
[0103] At a precise inspection of a semiconductor device at a wafer
state, a probe stylus 1a is brought in contact with a pad 5
disposed in the semiconductor device. And one of the first and
second electrically conductive member 2a, 3a is used as an
electrically conductive member for forcing, and the other is used
as an electrically conducting member for sensing. In this case, the
first and second electrically conductive members connects
electrically through the pad 5, therefore, the value of voltage
and/or electric current can be compensated up to the pad 5, when a
Kelvin connection are formed on the pad 5.
[0104] At an inspection of an I/O of a semiconductor device at a
wafer state, the probe stylus 1a is brought in contact with a pad 5
disposed in the semiconductor device, and one of the first and
second electrically conductive member 2a, 3a is used as an
electrically conductive member for driving and the other is used as
an electrically conductive member for tester. In this case, the
first and second electrically conductive member 2a, 3a contact
electrically to each other through the pad 5. Therefore, a line
specialized for transferring output data signal from the driver to
the pad 5 disposed in the semiconductor device (hereinafter
referred to "a line for driver"), and a line specialized for
transferring the output data signal from the pad 5 to the
comparator of the tester (hereinafter referred to "a line for
comparator) are assured up to the pad 5.
[0105] As explained, the first and second electrically conductive
members 2a, 3a in the probe stylus according to the second
embodiment contact electrically to each other through a pad 5
disposed in the semiconductor at an inspection of a semiconductor
device. Therefore, the value of voltage and/or electric current can
be compensated up to the pad 5, at a precise inspection of a
semiconductor device at a wafer state. And a line for driver and a
line for comparator are assured up to the pad 5, at an inspection
of an I/O of a semiconductor device at a wafer state. As a result,
a higher precision inspection of a semiconductor device is
possible.
[0106] A probe stylus according to the second embodiment has
similar advantages to that of a probe stylus according to the first
embodiment.
[0107] THIRD EMBODIMENT
[0108] The first and second electrically conductive members 2,3 in
a probe stylus according to the first embodiment are so arranged
that one of them is positioned over the other. On the other hand,
the first and second electrically conductive members in a probe
stylus according to the third embodiment are arranged side by side.
The other features of a probe stylus according to the third
embodiment are similar to that of the first embodiment.
[0109] FIG. 9 and 10 show that a probe stylus 1b contacts with a
pad 5 disposed in a semiconductor device. Referring to the figures,
reference numerals 1b, 2b, 3b denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 2b, 3b are connected by an insulating member 4b
arranged between them. Reference numeral 5 denotes a pad disposed
in a semiconductor.
[0110] The structure of a probe card having probe stylus 1b
according to the third embodiment is similar to that of the probe
card shown in FIG. 4. FIG. 12 corresponds to FIG. 6. An element in
FIG. 12 corresponding to an element in FIGS. 6, 9 are referred by
the same reference numeral. The function of each element of a probe
stylus according to the third embodiment is similar to that of a
probe stylus according to the first embodiment.
[0111] Because the first and second electrically conductive members
2b, 3b of the probe stylus according to the third embodiment are
arranged side by side, a force urges them equally, when the probe
stylus 1b contacts with a pad 5 disposed in a semiconductor. As a
result, the structural reliability of the probe stylus is
improved.
[0112] A probe stylus according to the third embodiment has similar
advantages to that of a probe stylus according to the first
embodiment.
[0113] FOURTH EMBODIMENT
[0114] In a probe stylus according to the third embodiment, the
first and second electrically conductive members 2b, 3b are
connected at their tip. On the other hand, in a probe stylus
according to the fourth embodiment of the present invention, the
first and second electrically conductive members are not connected
at their tip. And at an inspection of a semiconductor device, they
are connected to each other through a pad disposed in the
semiconductor device. The other feature is similar to that of the
third embodiment.
[0115] FIG. 13 shows that the probe stylus 1c is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figures,
reference numerals 1c, 2c, 3c denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 2c, 3c are connected by an insulating member 4c
arranged between them. Reference numeral 5 denotes a pad disposed
in a semiconductor.
[0116] The structure of a probe card having probe stylus 1c
according to the fourth embodiment is similar to that of the probe
card shown in FIG. 4. The connection between a probe stylus 1c and
the substrate of a probe card is similar to that shown in FIG. 12.
The function of the probe stylus according to the fourth embodiment
is similar to that of second embodiment.
[0117] As explained, the first and second electrically conductive
members 2c, 3c in the probe stylus according to the fourth
embodiment contact electrically to each other through a pad 5
disposed in the semiconductor at an inspection of a semiconductor
device. Therefore, the value of voltage and/or electric current can
be compensated up to the pad 5, at a precise inspection of a
semiconductor device at a wafer state. And a line for driver and a
line for comparator are assured up to the pad 5, at an inspection
of an I/O of a semiconductor device at a wafer state. As a result,
a higher precision inspection of a semiconductor device becomes
possible.
[0118] A probe stylus according to the fourth embodiment has
similar advantages to that of a probe stylus according to the third
embodiment.
[0119] FIFTH EMBODIMENT
[0120] FIG. 15 shows that the probe stylus 21 is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figure,
reference numerals 21, 22, 23 denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 22, 23 are connected by an insulating member 24
arranged between them. Reference numeral 5 denotes a pad disposed
in a semiconductor device.
[0121] The probe stylus 21 of the fifth embodiment of the present
invention is a so-called perpendicular type probe stylus. Each of
the first and second electrically conductive members 22, 23 has a
form of needle. The cross section perpendicular to the longitudinal
direction of the needle is half round. Namely, each of the first
and second electrically conductive member 22, 23 has a form of a
conventional perpendicular type probe stylus divided equally along
its longitudinal axis. Thus, the assembly of the probe stylus of
the fifth embodiment has a thickness substantially equal to the
conventional perpendicular type probe stylus. The first and second
electrically conductive members 22, 23 are connected to each other
at their tip, where the probe stylus 21 contacts with a pad 5
disposed in a semiconductor device.
[0122] Referring to FIG. 17, probe card 31 comprises a first
substrate 32, a second substrate 33, a third substrate 34, a ring
35 and wiring 36. FIG. 18 shows a detailed cross sectional view of
the part J framed by a broken line in FIG. 17. As shown in FIG. 18,
a first land 37, a second land 38 are formed at the second
substrate 33. And a fixing ring 39 fixes the probe stylus 21 to the
third substrate 34. The wiring 36 is fixed to the second substrate
33 by a soldering 40. The structure of other elements is similar to
that of the elements referred by the same reference numeral in
FIGS. 15 and 17.
[0123] FIG. 19 shows a different connection of the probe card and
the probe stylus according to the fifth embodiment. FIG. 19 shows a
detailed cross sectional view of the part J framed by a broken line
in FIG. 17. Referring to FIG. 19, wiring 36 is fixed to the second
substrate 33 through a first and second single contactors 41, 42. A
spring 43 is disposed between the hole of the second substrate and
each of the first and second single contactors 41, 42. The
structure of the other elements is similar to that of elements
referred by the same reference numeral in FIG. 18.
[0124] The function of the probe stylus according to the fifth
embodiment is identical to that of the first embodiment. And the
advantage of the probe stylus according to the fifth embodiment is
similar to that of third embodiment.
[0125] SIXTH EMBODIMENT
[0126] In a probe stylus according to the fifth embodiment, the
first and second electrically conductive members 22, 23 are
connected at their tip. On the other hand, in a probe stylus
according to the sixth embodiment of the present invention, the
first and second electrically conductive members 22, 23 are not
connected at their tip. And at an inspection of a semiconductor
device, they are connected to each other through a pad disposed in
a semiconductor device. The other feature is similar to that of the
fifth embodiment.
[0127] FIG. 20 shows that the probe stylus 21a is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figure,
reference numerals 21a, 22a, 23a denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 22a, 23a are connected by an insulating member
24a arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0128] The structure of a probe card having probe styluses 21a
according to the sixth embodiment is similar to that of probe card
shown in FIG. 17. The structure of the connecting part of a probe
card and a probe stylus 21a according to the sixth embodiment is
similar to that of shown in FIGS. 18, 19.
[0129] The function of the probe stylus according to the sixth
embodiment is similar to that of the second embodiment of the
present invention.
[0130] And the advantage of the probe stylus according to the sixth
embodiment is similar to that of fourth embodiment.
[0131] SEVENTH EMBODIMENT
[0132] FIG. 22 shows that the probe stylus 51 is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figure,
reference numerals 51, 52, 53 denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 52, 53 are connected by an insulating member 54
arranged between them. Reference numeral 5 denotes a pad disposed
in a semiconductor.
[0133] The probe stylus 51 of the seventh embodiment of the present
invention is a so-called perpendicular type probe stylus. Each of
the first and second electrically conductive members 52, 53 has a
form of needle. The cross section perpendicular to the longitudinal
direction of the needle is half round. Namely, each of the first
and second electrically conductive member has a form of a
conventional perpendicular type probe stylus divided equally along
its longitudinal axis. Thus, the assembly of the probe stylus of
the seventh embodiment has a diameter substantially equal to the
conventional probe stylus. The first and second electrically
conductive members 52, 53 are connected to each other at their tip,
where the probe stylus 1 contacts with a pad 5 disposed in the
semiconductor device. A probe stylus according to the seventh
embodiment of the present invention has a circular resilient
portion at the tip portion of the first and second electrically
conductive members 52, 53, with which the probe stylus 1 contacts
with a pad 5 disposed in a semiconductor device.
[0134] The structure of a probe card having probe styluses 51
according to the seventh embodiment is similar to that of probe
card shown in FIG. 17. The structure of the connecting part of a
probe card and a probe stylus 51 according to the seventh
embodiment is similar to that of shown in FIGS. 18, 19.
[0135] The function of the probe stylus according to the seventh
embodiment is similar to that of the first embodiment of the
present invention.
[0136] As explained, the probe stylus 51 according to the seventh
embodiment of the present invention has a first electrically
conductive member 52 and a second electrically conductive member
53. Therefore, the probe stylus functions equivalent to two probe
styluses in the prior art. As a result, by contacting one probe
stylus to each pad disposed in a semiconductor device, it is
possible to eliminate so-called dead band in the comparator in a
precise inspection of a semiconductor device at a wafer state, or
in an inspection of an I/O of a semiconductor device at a wafer
state. Also in a case that a large number of pads are disposed in a
semiconductor device, corresponding large number of probe styluses
can be disposed on a probe card, so that so-called dead band in the
comparator can be eliminated in a precise inspection of a
semiconductor device at a wafer state, or in an inspection of an
I/O of a semiconductor device at a wafer state.
[0137] A probe stylus according to the seventh embodiment of the
present invention functions equivalently to two probe stylus in the
prior art, hence, the number of probe styluses 51 to be attached to
a probe card and/or the area required for the arrangement of the
probe stylus in a probe card can be reduced, as a result, the
fabrication cost can be reduced.
[0138] Because the probe stylus 51 according to the seventh
embodiment is a so-called perpendicular type probe stylus, a force
urges the first and second electrically conductive members 52, 53
equally, when the probe stylus 51 contacts with a pad 5 disposed in
a semiconductor. As a result, the structural reliability of the
probe stylus 51 is improved.
[0139] In a probe stylus according to the seventh embodiment of the
present invention, a circular resilient portion is formed at the
tip portion of the first and second electrically conductive members
52,53, with which the probe stylus 51 contacts with a pad 5
disposed in the semiconductor device. As a result, the impact at
the contact of the probe stylus and the pad disposed in the
semiconductor is absorbed by the circular resilient portion.
Therefore, a warp of a probe card, which may be caused by the
contact of the probe styluses and the pads, can be avoided.
[0140] According to the seventh embodiment of the present
invention, each of the first and second electrically conductive
members 52, 53 has a round cross section perpendicular to the
longitudinal direction. And the diameter of each of the first and
second electrically conductive members is equal to that of a probe
stylus in the prior art. Therefore, a current capacity of an
electrically conductive member for forcing can be assured to be
equal to that of probe stylus for forcing in the prior art, when
any one of the first and second electrically conductive members 52,
53 is used as an electrically conductive member for forcing at a
precise inspection of I/O of a semiconductor device.
[0141] EIGHTH EMBODIMENT
[0142] In a probe stylus according to the seventh embodiment, the
first and second electrically conductive members 52, 53 are
connected at their tip. On the other hand, in a probe stylus
according to the eighth embodiment of the present invention, the
first and second electrically conductive members are not connected
at their tip. And at an inspection of a semiconductor device, they
are connected to each other through a pad disposed in the
semiconductor device. The other feature is similar to that of the
first embodiment.
[0143] FIG. 24 shows that the probe stylus 51a is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figures,
reference numerals 51a, 52a, 53a denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 52a, 53a are connected by an insulating member
54a arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0144] The structure of a probe card having probe stylus 51a
according to the eighth embodiment is similar to that of the probe
card shown in FIG. 17. The connection between a probe stylus 51a
and the substrate of a probe card is similar to that shown in FIGS.
18, 19. The function of the probe stylus and the probe card is
similar to that of the second embodiment.
[0145] As explained, in the probe stylus according to the eighth
embodiment, the first and second electrically conductive members
52a, 53a contact electrically to each other through a pad 5
disposed in a semiconductor at an inspection of a semiconductor
device. Therefore, the value of voltage and/or electric current can
be compensated up to the pad 5, at a precise inspection of a
semiconductor device at a wafer state. And a line for driver and a
line for comparator are assured up to the pad 5, at an inspection
of an I/O of a semiconductor device at a wafer state. As a result,
a higher precision inspection of a semiconductor device becomes
possible. A probe stylus according to the eighth embodiment has
similar advantages to that of a probe stylus according to the
seventh embodiment.
[0146] NINTH EMBODIMENT
[0147] In a probe stylus according to the seventh embodiment, the
cross section perpendicular to the longitudinal direction of the
electrically conductive members 52, 53 is round. On the other hand,
the cross section perpendicular to the longitudinal direction of a
first and second electrically conductive members of a probe stylus
according to the ninth embodiment is half round. Namely, each of
the first and second electrically conductive member has a form of
an electrically conductive member divided equally along its
longitudinal axis. The other feature is similar to that of the
seventh embodiment.
[0148] FIG. 26 shows that the probe stylus 51a is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figure,
reference numerals 51b, 52b, 53b denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 52a, 53a are connected by an insulating member
54a arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0149] The structure of a probe card having probe stylus 51b
according to the ninth embodiment is similar to that of the probe
card shown in FIG. 17. The connection between a probe stylus 51b
and the substrate of a probe card is similar to that shown in FIGS.
18, 19. The function of the probe stylus and the probe card is
similar to that of the first embodiment.
[0150] As explained, the probe stylus 51b according to the ninth
embodiment of the present invention has a first electrically
conductive member 52b and a second electrically conductive member
53b. Therefore, the probe stylus 51b functions equivalently to two
probe styluses in the prior art. As a result, by contacting one
probe stylus to each pad disposed in the semiconductor device, it
is possible to eliminate so-called dead band in the comparator in a
precise inspection of a semiconductor device at a wafer state, or
in an inspection of an I/O of a semiconductor device at a wafer
state. Hence, in a case that a large number of pads are disposed in
a semiconductor device, corresponding large number of probe
styluses 51b can be disposed on a substrate of a probe card, so
that so-called dead band in the comparator can be eliminated in a
precise inspection of a semiconductor device at a wafer state, or
in an inspection of an I/O of a semiconductor device at a wafer
state.
[0151] Because the probe stylus 51b according to the ninth
embodiment functions equivalently to two probe styluses in the
prior art, the number of probe styluses 51b to be attached to a
probe card and/or the area required for the arrangement of the
probe stylus 51b in a probe card can be reduced. As a result, the
fabrication cost can be reduced.
[0152] Additionally, according to the ninth embodiment of the
present invention, each of the first and second electrically
conductive members 52b, 53b has a half round cross section
perpendicular to the longitudinal direction. Therefore, the
thickness of the probe stylus according to the first embodiment is
smaller than that of a bundle of two probe styluses of the prior
art. As a result, also in a case that a large number of pads are
disposed in a semiconductor device, a corresponding number of the
probe styluses 51b can be attached onto a probe card.
[0153] Because the probe stylus 51b according to the ninth
embodiment is a so-called perpendicular type probe stylus, a force
urges the first and second electrically conductive members 52, 53
equally, when a probe stylus 51b contacts with a pad 5 disposed in
a semiconductor. As a result, the structural reliability of the
probe stylus 51b is improved.
[0154] In a probe stylus according to the ninth embodiment of the
present invention, a circular resilient portion is formed at the
tip portion of the first and second electrically conductive members
52b, 53b, with which the probe stylus 51b contacts with a pad 5
disposed in the semiconductor device. As a result, the impact at
the contact of the probe stylus and the pad disposed in the
semiconductor is absorbed by the circular resilient portion.
Therefore, a warp of a probe card, which may be caused by the
contact of the probe styluses and the pads, can be avoided.
[0155] TENTH EMBODIMENT
[0156] In a probe stylus according to the ninth embodiment, the
first and second electrically conductive members 52b, 53b are
connected at their tip. On the other hand, in a probe stylus
according to the tenth embodiment of the present invention, the
first and second electrically conductive members are not connected
at their tip. And at an inspection of a semiconductor device, they
are connected to each other through a pad disposed in the
semiconductor device. The other feature is similar to that of the
ninth embodiment.
[0157] FIG. 28 shows that the probe stylus 51a is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figure,
reference numerals 51c, 52c, 53c denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 52c, 53c are connected by an insulating member
54a arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0158] The structure of a probe card having probe stylus 51c
according to the tenth embodiment is similar to that of the probe
card shown in FIG. 17. The connection between a probe stylus 51c
and the substrate of a probe card is similar to that shown in FIGS.
18, 19. The function of the probe stylus and the probe card is
similar to that of the second embodiment.
[0159] As explained, the first and second electrically conductive
members 52c, 53c in the probe stylus according to the tenth
embodiment contact electrically to each other through a pad 5
disposed in the semiconductor at an inspection of a semiconductor
device. Therefore, the value of voltage and/or electric current can
be compensated up to the pad 5, at a precise inspection of a
semiconductor device at a wafer state. And a line for driver and a
line for comparator are assured up to the pad 5, at an inspection
of an I/O of a semiconductor device at a wafer state. As a result,
a higher precision inspection of a semiconductor device becomes
possible.
[0160] A probe stylus according to the tenth embodiment has similar
advantages to that of a probe stylus according to the ninth
embodiment.
[0161] ELEVENTH EMBODIMENT
[0162] FIG. 30 shows that the probe stylus 61 is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figure,
reference numerals 61, 62, 63 denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 62, 63 are connected by an insulating member 64
arranged between them. Reference numeral 5 denotes a pad disposed
in a semiconductor.
[0163] The probe stylus 61 of the eleventh embodiment of the
present invention is a so-called perpendicular type probe stylus.
Each of the first and second electrically conductive members 62, 63
has a form of needle. The cross section perpendicular to the
longitudinal direction of the needle is round. Namely, each of the
first and second electrically conductive member 62, 63 has a form
of a conventional perpendicular type probe stylus.
[0164] A probe stylus according to the eleventh embodiment of the
present invention has a Y-formed resilient portion at the tip
portion of the first and second electrically conductive members
62,63, with which the probe stylus 61 contacts with a pad 5
disposed in a semiconductor device. The first and second
electrically conductive members 6 are connected to each other
through a third electrically conductive member 65, which is
disposed between the tip of the electrically conductive members,
where the probe stylus contacts with a pad disposed in a
semiconductor device.
[0165] The structure of a probe card having probe stylus 61
according to the eleventh embodiment is similar to that of the
probe card shown in FIG. 17. The connection between a probe stylus
61 and the substrate of a probe card is similar to that shown in
FIGS. 18, 19. The function of the probe stylus and the probe card
is similar to that of the second embodiment.
[0166] As explained, according to the eleventh embodiment, the tip
portion of a probe stylus 61, where the probe stylus contacts with
a pad disposed in a semiconductor device, is widened, therefore a
probe stylus 61 contacts with a pad 5 at two points. As a result,
the electric resistance at the contact between the probe stylus and
the pad is small. A probe stylus according to the eleventh
embodiment has advantages similar to that of the seventh
embodiment.
[0167] TWELFTH EMBODIMENT
[0168] In a probe stylus according to the eleventh embodiment, the
first and second electrically conductive members 62, 63 are
connected through a third electrically conductive member 65
disposed at their tip. On the other hand, in a probe stylus
according to the twelfth embodiment of the present invention, no
such a third electrically conductive member for connecting the
first and second electrically conductive members 62, 63 are
disposed. And at an inspection of a semiconductor device, they are
connected to each other through a pad disposed in the semiconductor
device. The other feature is similar to that of the eleventh
embodiment.
[0169] FIG. 32 shows that the probe stylus 61a is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figure,
reference numerals 61a, 62a, 63a denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 62a, 63a are connected by an insulating member
64a arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0170] The structure of a probe card having probe stylus 61a
according to the twelfth embodiment is similar to that of the probe
card shown in FIG. 17. The connection between a probe stylus 61a
and the substrate of a probe card is similar to that shown in FIGS.
18, 19. The function of the probe stylus and the probe card is
similar to that of the second embodiment.
[0171] As explained, according to the twelfth embodiment, the tip
portion of a probe stylus 61a, where the probe stylus contacts with
the pad disposed in a semiconductor device, is widened, therefore a
probe stylus 61 contacts with a pad 5 at two points. As a result,
the electric resistance at the contact between the probe stylus and
the pad is small. A probe stylus according to the twelfth
embodiment has advantages similar to that of the eighth
embodiment.
[0172] THIRTEENTH EMBODIMENT
[0173] In a probe stylus according to the eleventh embodiment, the
cross section perpendicular to the longitudinal direction of the
electrically conductive members 52, 53 is round. On the other hand,
the cross section perpendicular to the longitudinal direction of a
first and second electrically conductive members of a probe stylus
according to the thirteenth embodiment is half round. Namely, each
of the first and second electrically conductive member has a form
of a first and second electrically conductive members in the
eleventh embodiment divided equally along its longitudinal axis.
The other feature is similar to that of the seventh embodiment.
[0174] FIG. 34 shows that the probe stylus 61b is contacting with a
pad 5 disposed in a semiconductor device. Referring to the figure,
reference numerals 61b, 62b, 63b denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 62a, 63a are connected by an insulating member
64a arranged between them. The firsts and second electrically
conductive members 62b, 63b are electrically connected by a third
electrically conductive member 65b. Reference numeral 5 denotes a
pad disposed in a semiconductor.
[0175] The structure of a probe card having probe stylus 61b
according to the thirteenth embodiment is similar to that of the
probe card shown in FIG. 17. The connection between a probe stylus
61b and the substrate of a probe card is similar to that shown in
FIGS. 18, 19. The function of the probe stylus and the probe card
is similar to that of the first embodiment.
[0176] A probe stylus according to the thirteenth embodiment has
advantages similar to that of the ninth embodiment.
[0177] FOURTEENTH EMBODIMENT
[0178] In a probe stylus according to the thirteenth embodiment,
the first and second electrically conductive members 62b, 63b are
connected through a third electrically conductive member 65b
disposed near to their tip. On the other hand, in a probe stylus
according to the fourteenth embodiment of the present invention, no
such a third electrically conductive member for connecting the
first aid second electrically conductive members are disposed. And
at an inspection of a semiconductor device, they are connected to
each other through a pad disposed in a semiconductor device. The
other feature is similar to that of the thirteenth embodiment.
[0179] FIG. 36 shows that the probe stylus is contacting with a pad
disposed in a semiconductor device. Referring to the figure,
reference numerals 61c, 62c, 63c denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 62a, 63a are connected by an insulating member
64c arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0180] The structure of a probe card having probe stylus 61c
according to the fourteenth embodiment is similar to that of the
probe card shown in FIG. 17. The connection between a probe stylus
61c and the substrate of a probe card is similar to that shown in
FIGS. 18, 19. The function of the probe stylus and the probe card
is similar to that of the second embodiment.
[0181] A probe stylus according to the fourteenth embodiment has
advantages similar to that of the tenth embodiment.
[0182] FIFTEENTH EMBODIMENT
[0183] FIG. 38 shows that the probe stylus is contacting with a pad
disposed in a semiconductor device. Referring to the figure,
reference numerals 71, 72, 73 denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 72, 73 are connected by an insulating member 74
arranged between them. Reference numeral 5 denotes a pad disposed
in a semiconductor.
[0184] The probe stylus 71 of the fifteen embodiment of the present
invention is a so-called perpendicular type probe stylus. Each of
the first and second electrically conductive members 72, 73 has a
form of needle. The cross section perpendicular to the longitudinal
direction of the needle is round. In this embodiment, the diameter
of the second electrically conductive member 72 is smaller than
that of the first electrically conductive member 73. Namely, the
assembly of the probe stylus of the fifteenth embodiment has a
thickness substantially equal to the conventional probe stylus. A
probe stylus according to the fifteenth embodiment of the present
invention has an arc or jack-knifed resilient portion at the tip
portion of the first and second electrically conductive members
72,73, with which the probe stylus contacts with a pad 5 disposed
in a semiconductor device. The first and second electrically
conductive members 72, 73 are connected to each other at their tip
portion, where the probe stylus contacts with a pad 5 disposed in
the semiconductor device.
[0185] The structure of a probe card having probe styluses 71
according to the fifteenth embodiment is similar to that of probe
card shown in FIG. 17. The structure of the connecting part of a
probe card and a probe stylus 71 according to the seventh
embodiment is similar to that of shown in FIGS. 18, 19. The
function of the probe stylus according to the fifteenth embodiment
is similar to that of the first embodiment of the present
invention.
[0186] As explained, the probe stylus 71 according to the fifteenth
embodiment of the present invention has a first electrically
conductive member 72 and a second electrically conductive member
73. Therefore, the probe stylus functions equivalent to two probe
styluses in the prior art. As a result, by contacting one probe
stylus to each pad disposed in the semiconductor device, it is
possible to eliminate so-called dead band in the comparator in a
precise inspection of a semiconductor device at a wafer state, or
in an inspection of an I/O of a semiconductor device at a wafer
state. Also in a case that a large number of pads are disposed in a
semiconductor device, corresponding large number of probe styluses
can be disposed on a probe card, so that so-called dead band in the
comparator can be eliminated in a precise inspection of a
semiconductor device at a wafer state, or in an inspection of an
I/O of a semiconductor device at a wafer state.
[0187] A probe stylus according to the fifteenth embodiment of the
present invention functions equivalently to two probe stylus in the
prior art, hence, the number of probe styluses 71 to be attached to
a probe card and/or the area required for the arrangement of the
probe stylus in a probe card can be reduced, as a result, the
fabrication cost can be reduced.
[0188] According to the fifteenth embodiment of the present
invention, the diameter of the second electrically conductive
member 73 is smaller than that of the first electrically conductive
member 72. And the diameter of the probe stylus 71 is substantially
equal to that of a probe stylus of the prior art. Therefore, the
thickness of the probe stylus 71 according to the fifteenth
embodiment is smaller than that of bundled two probe styluses in
the prior art. As a result, also in a case that a large number of
pads are disposed in a semiconductor device, a corresponding number
of the probe styluses 1 can be attached onto a probe card.
[0189] In a probe stylus according to the fifteenth embodiment of
the present invention, an arc or jack-knifed resilient portion is
formed at the tip portion of the first and second electrically
conductive members 72,73, with which the probe stylus 71 contacts
with a pad 5 disposed in the semiconductor device. As a result, the
impact at the contact of the probe stylus and the pad disposed in
the semiconductor is absorbed by the resilient portion. Therefore,
a warp of a probe card, which may be caused by the contact of the
probe styluses and the pads, can be avoided.
[0190] According to the fifteenth embodiment, the first
electrically conductive member 72 has a round cross section
perpendicular to the longitudinal direction. And the diameter of
the first electrically conductive members is substantially equal to
that of a probe stylus in the prior art. Therefore, a current
capacity of an electrically conductive member for forcing at a
precise inspection of I/O of a semiconductor device at a wafer
state can be assured to be equal to that of probe stylus for
forcing in the prior art.
[0191] SIXTEENTH EMBODIMENT
[0192] In a probe stylus according to the fifteenth embodiment, the
first and second electrically conductive members 72, 73 are
connected to each other. On the other hand, in a probe stylus
according to the sixteenth embodiment of the present invention, the
first and second electrically conductive member are not connected
to each other. And at an inspection of a semiconductor device, they
are connected to each other through a pad disposed in a
semiconductor device. The other feature is similar to that of the
fifteenth embodiment.
[0193] FIG. 40 shows that the probe stylus is contacting with a pad
disposed in a semiconductor device. Referring to the figure,
reference numerals 71c, 72c, 73c denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 72a, 73a are connected by an insulating member
74c arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0194] The structure of a probe card having probe stylus 71c
according to the sixteenth embodiment is similar to that of the
probe card shown in FIG. 17. The connection between a probe stylus
71c and the substrate of a probe card is similar to that shown in
FIGS. 18, 19. The function of the probe stylus and the probe card
is similar to that of the second embodiment.
[0195] As explained, the first and second electrically conductive
members 72a, 73a in the probe stylus according to the sixteenth
embodiment contact electrically to each other through a pad 5
disposed in a semiconductor at an inspection of a semiconductor
device. Therefore, the value of voltage and/or electric current can
be compensated up to the pad 5, at a precise inspection of a
semiconductor device at a wafer state. And a line for driver and a
line for comparator are assured up to the pad 5, at an inspection
of an I/O of a semiconductor device at a wafer state. As a result,
a higher precision inspection of a semiconductor device becomes
possible.
[0196] A probe stylus according to the sixteenth embodiment has
advantages similar to that of the fifteenth embodiment.
[0197] SEVENTEENTH EMBODIMENT
[0198] FIG. 42 shows that the probe stylus is contacting with a pad
disposed in a semiconductor device. Referring to the figure,
reference numerals 81, 82, 83 denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 82, 83 are connected by an insulating member 84
arranged between them. Reference numeral 5 denotes a pad disposed
in a semiconductor.
[0199] The probe stylus 81 of the seventeenth embodiment of the
present invention is a so-called cantilever type probe stylus. The
first electrically conductive members 82 has a form of needle. The
cross section perpendicular to the longitudinal direction of the
needle is round. The second electrically conductive member 83 has a
form of cylinder covering the first electrically conductive member
82. In this embodiment, the first electrically conductive member 82
has a thickness equal to that of a cantilever type probe stylus in
the prior art, and the outer side of the first electrically
conductive member is covered with an insulating member 84. Further,
the outside of the insulating member 84 is covered with the second
electrically conductive member 83. Thus, the assembly of the probe
stylus of the seventeenth embodiment has a thickness substantially
equal to a cantilever type probe stylus in the prior art. The first
and second electrically conductive members 82, 83 are connected to
each other at their tip, where the probe stylus contacts with a pad
disposed in a semiconductor device.
[0200] The structure of a probe card having probe stylus 81
according to the seventeenth embodiment is similar to that of the
probe card shown in FIG. 4. FIG. 44 is a detailed cross sectional
view of the connecting portion between the probe card and a probe
stylus according to the seventeenth embodiment. FIG. 44 corresponds
to FIG. 5. Each element in FIG. 44 corresponding to an element in
FIGS. 5 and/or 42 is referred by the same reference numeral. The
function of the probe stylus and the probe card is similar to that
of the first embodiment.
[0201] As explained, the probe stylus 81 according to the
seventeenth embodiment of the present invention has a first
electrically conductive member 82 and a second electrically
conductive member 83. Therefore, such a probe stylus functions
equivalent to two probe styluses in the prior art. As a result, by
contacting one probe stylus to each pad disposed in the
semiconductor device, it is possible to eliminate so-called dead
band in the comparator in a precise inspection of a semiconductor
device at a wafer state, or in an inspection of an I/O of a
semiconductor device at a wafer state. Also in a case that a large
number of pads are disposed in a semiconductor device,
corresponding large number of probe styluses can be disposed on a
probe card, so that so-called dead band in the comparator can be
eliminated in a precise inspection of a semiconductor device at a
wafer state, or in an inspection of an I/O of a semiconductor
device at a wafer state.
[0202] A probe stylus according to the seventeenth embodiment of
the present invention functions equivalently to two probe stylus in
the prior art, hence, the number of probe styluses 81 to be
attached to a probe card and/or the area required for the
arrangement of the probe stylus in a probe card can be reduced, as
a result, the fabrication cost can be reduced.
[0203] In this embodiment, the assembly of the probe stylus of the
seventeenth embodiment has a thickness substantially equal to a
cantilever type probe stylus in the prior art. Therefore, the
thickness of the probe stylus 81 according to the seventeenth
embodiment is smaller than that of bundled two probe styluses in
the prior art. As a result, also in a case that a large number of
pads are disposed in a semiconductor device, a corresponding number
of the probe styluses 81 can be attached onto a probe card.
[0204] According to the seventeenth embodiment of the present
invention, the first electrically conductive members 82 has a round
cross section perpendicular to the longitudinal direction. And the
diameter of the first electrically conductive members is
substantially equal to that of a probe stylus in the prior art.
Therefore, a current capacity of an electrically conductive member
for forcing can be assured to be equal to that of probe stylus for
forcing in the prior art, when the first electrically conductive
members 82 is used as an electrically conductive member for forcing
at a precise inspection of I/O of a semiconductor device at a wafer
state.
[0205] According to the seventeenth embodiment, the first
electrically conductive member 82 is covered with an insulating
member 84, and the insulating member 84, in turn, is covered with
the second electrically conductive member 83. Therefore, when the
first electrically conductive member 82 is used for sensing, the
electrically conductive member for sensing can be protected from
external noises.
[0206] EIGHTEENTH EMBODIMENT
[0207] In a probe stylus according to the seventeenth embodiment,
the first and second electrically conductive members 82, 83 are
connected at their tip. On the other hand, in a probe stylus
according to the eighteenth embodiment of the present invention,
the first and second electrically conductive members are not
connected at their tip. And at an inspection of a semiconductor
device, they are connected to each other through a pad disposed in
the semiconductor device. The other feature is similar to that of
the seventeenth embodiment.
[0208] Fig. 45 shows that the probe stylus is contacting with a pad
disposed in a semiconductor device. Referring to the figure,
reference numerals 81a, 82a, 83a denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 82a, 83a are connected by an insulating member
84a arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0209] The structure of a probe card having probe stylus 81a
according to the eighteenth embodiment is similar to that of the
probe card shown in FIG. 4. The connection between a probe stylus
81a and the substrate of a probe card is similar to that shown in
FIG. 44. The function of the probe card and the probe stylus is
similar to that of the second embodiment.
[0210] As explained, the first and second electrically conductive
members 82a, 83a in the probe stylus according to the eighteenth
embodiment contact electrically to each other through a pad 5
disposed in the semiconductor at an inspection of a semiconductor
device. Therefore, the value of voltage and/or electric current can
be compensated up to the pad 5, at a precise inspection of a
semiconductor device at a wafer state. And a line for driver and a
line for comparator are assured up to the pad 5, at an inspection
of an I/O of a semiconductor device at a wafer state. As a result,
a higher precision inspection of a semiconductor device becomes
possible.
[0211] A probe stylus according to the eighteenth embodiment has
advantages similar to that of the seventeenth embodiment.
[0212] NINETEENTH EMBODIMENT
[0213] FIG. 47 shows that the probe stylus is contacting with a pad
disposed in a semiconductor device. Referring to the figure,
reference numerals 91, 92, 93 denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 92, 93 are connected by an insulating member 94
arranged between them. Reference numeral 5 denotes a pad disposed
in a semiconductor.
[0214] The probe stylus 91 of the nineteenth embodiment of the
present invention is a so-called perpendicular type probe stylus.
The first electrically conductive members 92 has a form of needle
and its cross section perpendicular to the longitudinal direction
of the needle is round. The second electrically conductive member
93 has a form of a cylinder, and covers the first electrically
conductive member 92. In this embodiment, the first electrically
conductive member 92 has a thickness substantially equal to that of
a perpendicular type probe stylus in the prior art, and the outer
side of the first electrically conductive member is covered with an
insulating member 94. Further, the outside of the insulating member
94 is covered with the second electrically conductive member 93.
Thus, the assembly of the probe stylus of the nineteenth embodiment
has a thickness substantially equal to a perpendicular type probe
stylus in the prior art. The first and second electrically
conductive members 92, 93 are connected to each other at their tip
portion, where the probe stylus contacts with a pad 5 disposed in a
semiconductor device.
[0215] The structure of a probe card having probe stylus 91
according to the nineteenth embodiment is similar to that of the
probe card shown in FIG. 17.
[0216] FIG. 49 is a detailed cross sectional view of an example of
the connecting portion between the probe card and a substrate of a
probe stylus 91 according to the nineteenth embodiment. FIG. 49
corresponds to FIG. 18. In the figure, reference numeral 96 denotes
a electrically conductive boss. And reference numeral 97 denotes a
spring. The other element corresponding to an element in FIG. 47 is
referred by the same reference numeral.
[0217] FIG. 50 is a detailed cross sectional view of another
example of the connecting portion between the probe card and a
substrate of a probe stylus 91 according to the nineteenth
embodiment. FIG. 50 corresponds to FIG. 19. In the figure,
reference numerals 98, 99, and 100 denote a contacter, a
electrically conductive bar and an insulating member, respectively.
The other element corresponding to an element in FIG. 49 is
referred by the same reference numeral. The function of the probe
stylus and the probe card is similar to that of the first
embodiment. The probe stylus according to the nineteenth embodiment
has advantages similar to that of the seventeenth embodiment.
[0218] TWENTIETH EMBODIMENT
[0219] In a probe stylus according to the nineteenth embodiment,
the first and second electrically conductive members 92, 93 are
connected at their tip. On the other hand, in a probe stylus
according to the twentieth embodiment of the present invention, the
first and second electrically conductive members are not connected
at their tip. And at an inspection of a semiconductor device, they
are connected to each other through a pad disposed in the
semiconductor device. The other feature is similar to that of the
nineteenth embodiment.
[0220] FIG. 51 shows that the probe stylus is contacting with a pad
disposed in a semiconductor device. Referring to the figure,
reference numerals 91a, 92a, 93a denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 92a, 93a are connected by an insulating member
94a arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0221] The structure of a probe card having probe stylus 91a
according to the twentieth embodiment is similar to that of the
probe card shown in FIG. 17. The connection between a probe stylus
91a and the substrate of a probe card is similar to that shown in
FIGS. 49 and 50. The function of the probe card and the probe
stylus is similar to that of the second embodiment. The probe
stylus according to the twentieth embodiment has advantages similar
to that of the eighteenth embodiment.
[0222] TWENTY-FIRST EMBODIMENT
[0223] FIG. 53 shows that the probe stylus is contacting with a pad
disposed in a semiconductor device. Referring to the figure,
reference numerals 101, 102, 103 denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 102, 103 are connected by an insulating member
104 arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0224] The probe stylus 101 of the twenty-first embodiment of the
present invention is a so-called perpendicular type probe stylus.
The first electrically conductive members 102 has a form of needle
and its cross section perpendicular to the longitudinal direction
of the needle is round. The second electrically conductive member
103 has a form of cylinder, and covers the first electrically
conductive member 102. In this embodiment, the first electrically
conductive member 102 has a thickness equal to that of a
perpendicular type probe stylus in the prior art, and the outer
side of the first electrically conductive member is covered with an
insulating member 104. Further, the outside of the insulating
member 104 is covered with the second electrically conductive
member 103. Thus, the assembly of the probe stylus of the
twenty-first embodiment has a thickness substantially equal to a
perpendicular type probe stylus in the prior art.
[0225] A probe stylus 101 according to the twenty-first embodiment
of the present invention has an arc or jack-knifed resilient
portion at the tip portion of the first and second electrically
conductive members 102, 103, with which the probe stylus 101
contacts with a pad 5 disposed in the semiconductor device. The
first and second electrically conductive members 102, 103 are
connected to each other at their tip, where the probe stylus 101
contacts with a pad 5 disposed in the semiconductor device.
[0226] The structure of a probe card having probe stylus 101
according to the twenty-first embodiment is similar to that of the
probe card shown in FIG. 17. The connection between a probe stylus
101 and the substrate of a probe card is similar to that shown in
FIGS. 49 and 50. The function of the probe card and the probe
stylus is similar to that of the first embodiment.
[0227] In a probe stylus according to the twenty-first embodiment
of the present invention, an arc or jack-knifed resilient portion
is formed at the tip portion of the first and second electrically
conductive members 102, 103, with which the probe stylus contacts
with a pad 5, which is disposed in a semiconductor device. As a
result, the impact at the contact of the probe stylus and the pad
disposed in the semiconductor is absorbed by the resilient portion.
Therefore, a warp of a probe card, which may be caused by the
contact of the probe styluses and the pads, can be avoided. The
probe stylus according to the twenty-first embodiment has
advantages similar to that of the seventeenth embodiment.
[0228] TWENTY-SECOND EMBODIMENT
[0229] In a probe stylus according to the twenty-first embodiment,
the first and second electrically conductive members 102, 103 are
connected at their tip. On the other hand, in a probe stylus
according to the twenty-second embodiment of the present invention,
the first and second electrically conductive members are not
connected at their tip. And at an inspection of a semiconductor
device, they are connected to each other through a pad disposed in
a semiconductor device. The other feature is similar to that of the
twenty-first embodiment.
[0230] FIG. 55 shows that the probe stylus is contacting with a pad
disposed in a semiconductor device. Referring to the figure,
reference numerals 101a, 102a, 103a denote a probe stylus, a first
electrically conductive member, and a second electrically
conductive member, respectively. The first and second electrically
conductive members 102a, 103a are connected by an insulating member
104a arranged between them. Reference numeral 5 denotes a pad
disposed in a semiconductor.
[0231] The structure of a probe card having probe stylus 101a
according to the twenty-second embodiment is similar to that of the
probe card shown in FIG. 17. The connection between a probe stylus
101a and the substrate of a probe card is similar to that shown in
FIGS. 49, 50. The function of the probe card and the probe stylus
is similar to that of the second embodiment.
[0232] In a probe stylus according to the twenty-second embodiment
of the present invention, an arc or jack-knifed resilient portion
is formed at the tip portion of the first and second electrically
conductive members 102a, 103a, with which the probe stylus contacts
with a pad 5, which is disposed in a semiconductor device. As a
result, the impact at the contact of the probe stylus and the pad
disposed in the semiconductor is absorbed by the resilient portion.
Therefore, a warp of a probe card, which may be caused by the
contact of the probe styluses 101a and the pads, can be avoided.
The probe stylus according to the twenty-second embodiment has
advantages similar to that of the eighteenth embodiment.
[0233] TWENTY-THIRD EMBODIMENT
[0234] FIG. 57, 58 are schematic plan views of a probe stylus
according to the twenty-third embodiment. FIG. 57 shows a state
that the probe stylus is not contacting with a pad disposed in a
semiconductor. And FIG. 58 shows a state that the probe stylus is
contacting with a pad disposed in a semiconductor. FIG. 59 is a
side view of a probe stylus seen from the side B1 in FIG. 57. FIG.
60 is a cross sectional view of an example of a probe stylus. FIG.
60(a) shows a cross section along the line C1-C1 in FIG. 57. FIG.
60(b) shows a cross section along the line D1-D1 in FIG. 57. FIG.
61 is a cross sectional view of another example of a probe stylus,
which has a form different from that of FIG. 60. FIG. 61(a) shows a
cross section along the line C1-C1 in FIG. 57. FIG. 61(b) shows a
cross section along the line D1-D1 in FIG. 57.
[0235] Referring to the figures, reference numerals 111, 112, 113
denote a probe stylus, a first electrically conductive member, and
a second electrically conductive member, respectively. The first
and second electrically conductive members 112, 113 are connected
by an insulating member 114 arranged between them. Reference
numeral 5 denotes a pad disposed in a semiconductor
[0236] A probe stylus according to the twenty third embodiment of
the present invention is a so-called perpendicular type probe
stylus. The first and second electrically conductive members 112,
113 have a form of needle. Their cross section perpendicular to
their longitudinal direction are an arc as shown in FIGS. 60(a),
(b) or a quadrate as shown in FIGS. 61(a), (b). The nearer to their
tip, where the probe stylus contacts with a pad 5 disposed in a
semiconductor device, the thinner their thickness is. According to
the twenty-third embodiment, a slit is disposed in the tip portion
of the probe stylus, where the probe stylus contacts with a pad
disposed in a semiconductor stylus. When the probe stylus does not
contact with a pad 5, the slit closes so that the first and second
electrically conductive members 112, 113 contact to each other. On
the other hand, when the probe stylus contacts with a pad 5, the
slit opens so that the first and second electrically conductive
members 112, 113 separate from each other.
[0237] The structure of a probe card having probe stylus 111
according to the twenty-third embodiment is similar to that of the
probe card shown in FIG. 4. The connection between a probe stylus
111 and the substrate of a probe card is similar to that shown in
FIG. 12. The function of the probe card and the probe stylus is
similar to that of the second embodiment.
[0238] As explained, the probe stylus 1 according to the
twenty-third embodiment of the present invention has a first
electrically conductive member 112 and a second electrically
conductive member 113. Therefore, such a probe stylus functions
equivalent to two probe styluses in the prior art. As a result, by
contacting one probe stylus to each pad disposed in the
semiconductor device, it is possible to eliminate so-called dead
band in the comparator in a precise inspection of a semiconductor
device at a wafer state, or in an inspection of an I/O of a
semiconductor device at a wafer state. Also in a case that a large
number of pads are disposed in a semiconductor device,
corresponding large number of probe styluses can be disposed on a
probe card, so that so-called dead band in the comparator can be
eliminated in a precise inspection of a semiconductor device at a
wafer state, or in an inspection of an I/O of a semiconductor
device at a wafer state.
[0239] A probe stylus according to the twenty-third embodiment of
the present invention functions equivalently to two probe stylus in
the prior art, hence, the number of probe styluses 111 to be
attached to a probe card and/or the area required for the
arrangement of the probe stylus in a probe card can be reduced, as
a result, the fabrication cost can be reduced.
[0240] Because the first and second electrically conductive members
112, 113 of the probe stylus according to the twenty-third
embodiment are arranged side by side, a force urges them equally,
when the probe stylus 111 contacts with a pad 5 disposed in a
semiconductor. As a result, the structural reliability of the probe
stylus is improved.
[0241] In a probe stylus according to the twenty-third embodiment
of the present invention, a slit is disposed between the tip
portion of the first and second electrically conductive members
112,113, with which the probe stylus 111 contacts with a pad 5
disposed in the semiconductor device. As a result, the impact at
the contact of the probe stylus 111 and the pad 5 disposed in the
semiconductor is absorbed by the slit portion. Therefore, a warp of
a probe card, which may be caused by the contact of the probe
styluses and the pads, can be avoided.
[0242] The first and second electrically conductive members 112,
113 in the probe stylus 111 according to the twenty-third
embodiment separate from each other, when the probe stylus 111
contacts with a pad 5 disposed in a semiconductor. Therefore, the
value of voltage and/or electric current can be compensated up to
the pad 5, at a precise inspection of a semiconductor device at a
wafer state. And a line for driver and a line for comparator are
assured up to the pad 5, at an inspection of an I/O of a
semiconductor device at a wafer state. As a result, a higher
precision inspection of a semiconductor device becomes
possible.
* * * * *