U.S. patent application number 09/753669 was filed with the patent office on 2002-01-31 for semiconductor device and method of manufacturing the same.
This patent application is currently assigned to Fujitsu Limited. Invention is credited to Shimizu, Masayuki.
Application Number | 20020011671 09/753669 |
Document ID | / |
Family ID | 18725196 |
Filed Date | 2002-01-31 |
United States Patent
Application |
20020011671 |
Kind Code |
A1 |
Shimizu, Masayuki |
January 31, 2002 |
Semiconductor device and method of manufacturing the same
Abstract
There is provided a semiconductor device which comprises a
trench formed in the first insulating film, a metal wiring buried
in the trench and having a fluorine concentration on a surface
which is lower than an oxygen concentration, a
fluorine-noncontaining insulating film formed on the metal wiring,
a second fluorine-containing insulating film formed on the metal
wiring, holes formed at least in a lower portion of the second
fluorine-containing insulating film and the fluorine-noncontaining
insulating film on the first metal wiring, and metal plugs buried
in the holes.
Inventors: |
Shimizu, Masayuki;
(Kawasaki, JP) |
Correspondence
Address: |
ARMSTRONG, WESTERMAN, HATTORI,
McLELAND & NAUGHTON
1725 K Street, N.W., Suite 1000
Washington
DC
20006
US
|
Assignee: |
Fujitsu Limited
Kawasaki
JP
|
Family ID: |
18725196 |
Appl. No.: |
09/753669 |
Filed: |
January 4, 2001 |
Current U.S.
Class: |
257/758 ;
257/E21.252; 257/E21.276; 257/E21.304; 257/E21.576; 257/E21.579;
257/E23.167 |
Current CPC
Class: |
H01L 21/76808 20130101;
H01L 21/3212 20130101; H01L 2924/0002 20130101; H01L 21/31116
20130101; H01L 21/76807 20130101; H01L 21/31629 20130101; H01L
23/53238 20130101; H01L 23/5329 20130101; H01L 21/76801 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
257/758 |
International
Class: |
H01L 023/52 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 31, 2000 |
JP |
2000-232522 |
Claims
What is claimed is:
1. A semiconductor device comprising: a semiconductor substrate; a
first insulating film formed on the semiconductor substrate and
containing fluorine; a trench formed in the first insulating film;
a first metal wiring buried in the trench and having a fluorine
concentration on a surface which is lower than an oxygen
concentration; a fluorine-noncontaining insulating film formed on
the first metal wiring; a second insulating film formed on the
fluorine-noncontaining insulating film; a hole formed at least in a
lower portion of the second insulating film and the
fluorine-noncontaining insulating film on the first metal wiring;
and a metal plug buried in the hole.
2. A semiconductor device according to claim 1, further comprising:
one of a second metal wiring and a metal pad buried at least in an
upper portion of the second insulating film and connected to the
first metal wiring via the metal plug.
3. A semiconductor device according to claim 1, wherein the
fluorine concentration on the surface of the first metal wiring is
less than 3.9 atom %.
4. A semiconductor device according to claim 1, wherein the first
metal wiring has a plural-layered structure consisting of an
underlying metal film and a main metal film.
5. A semiconductor device according to claim 4, wherein the main
metal film is formed of a copper film.
6. A semiconductor device according to claim 1, wherein the
fluorine-noncontaining insulating film is formed of a silicon
nitride film or a silicon carbide film.
7. A semiconductor device comprising: a semiconductor substrate; a
first insulating film formed on the semiconductor substrate and
containing fluorine; a trench formed in the first insulating film;
a first metal wiring buried in the trench and having a fluorine
concentration on a surface which is less than 10 atom %; a
fluorine-noncontaining insulating film formed on the first metal
wiring; a second insulating film formed on the
fluorine-noncontaining insulating film; a hole formed at least in a
lower portion of the second insulating film and on the first metal
wiring in the fluorine-noncontaining insulating film; and a metal
plug buried in the hole.
8. A semiconductor device according to claim 7, further comprising:
one of a second metal wiring and a metal pad buried at least in an
upper portion of the second insulating film and connected to the
first metal wiring via the metal plug.
9. A semiconductor device according to claim 7, wherein the
fluorine concentration on the surface of the first metal wiring is
less than 3.9 atom %.
10. A semiconductor device according to claim 7, wherein the first
metal wiring has a plural-layered structure consisting of an
underlying metal film and a main metal film.
11. A semiconductor device according to claim 10, wherein the main
metal film is formed of a copper film.
12. A semiconductor device according to claim 7, wherein the
fluorine-noncontaining insulating film is formed of a silicon
nitride film or a silicon carbide film.
13. A semiconductor device manufacturing method comprising the
steps of: forming a first fluorine-containing insulating film over
a semiconductor substrate; forming a trench in the first
fluorine-containing insulating film; forming a first metal film in
the trench and on the first fluorine-containing insulating film;
leaving the first metal film in the trench and removing the first
metal film from an upper surface of the first fluorine-containing
insulating film, by polishing the first metal film; reducing an
amount of fluorine adhered to a surface of the first metal film
being left in the trench; and forming a fluorine-noncontaining
insulating film on the first metal film in the trench and the first
fluorine-containing insulating film.
14. A semiconductor device manufacturing method according to claim
13, wherein the step of reducing the amount of fluorine adhered to
the surface of the first metal film being left in the trench,
including the steps of, sputtering a surface of the first metal
film in the trench, and exposing the surface to a reducing gas
plasma.
15. A semiconductor device manufacturing method according to claim
13, wherein the step of reducing the amount of fluorine adhered to
the surface of the first metal film being left in the trench, is
the step of re-polishing by changing conditions after the metal
film is removed from an upper surface of the first
fluorine-containing insulating film by polishing.
16. A semiconductor device manufacturing method according to claim
13, wherein the first metal wiring is formed as a plural-layered
structure consisting of an underlying metal film and an overlying
main metal film.
17. A semiconductor device manufacturing method according to claim
16, further comprising the step of: removing the underlying metal
film from an upper surface of the first fluorine-containing
insulating film by polishing the underlying metal film while
changing conditions after the main metal film is left in the trench
by polishing.
18. A semiconductor device manufacturing method according to claim
16, wherein the main metal film is formed of a copper film, and the
underlying metal film is formed of a metal nitride film.
19. A semiconductor device manufacturing method according to claim
13, wherein, after an amount of the fluorine that is adhered onto
the surface of the first metal film in the trench is reduced, an
amount of the fluorine on the surface is set lower than an oxygen
concentration on the surface of the first metal film.
20. A semiconductor device manufacturing method according to claim
13, wherein, after an amount of the fluorine that is adhered onto
the surface of the first metal film in the trench is reduced, an
amount of the fluorine on the surface is less than 3.9 atom %.
21. A semiconductor device manufacturing method according to claim
13, further comprising the steps of: forming a second
fluorine-containing insulating film on the fluorine-noncontaining
insulating film; forming a hole in the second fluorine-containing
insulating film and the fluorine-noncontaining insulating film over
the first metal wiring; and forming a metal plug in the hole.
22. A semiconductor device manufacturing method according to claim
21, further comprising the steps of: forming an upper trench, that
is connected to the metal plug, in an upper portion of the second
fluorine-containing insulating film; and forming one of a metal
wiring and a metal pad to be buried in the second trench.
23. A semiconductor device manufacturing method according to claim
22, wherein the metal wiring or the metal pad and the metal plug
are formed by burying simultaneously a second metal film in the
holes and the upper trench, and then removing the second metal film
from an upper surface of the second fluorine-containing insulating
film by polishing the second metal film.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a semiconductor device and
to a method of manufacturing the same and, more particularly, to a
semiconductor device having a structure in which plugs or wirings
are connected onto a metal pattern buried in a fluorine-containing
insulating film and to a method of manufacturing the same.
[0003] 2. Description of the Prior Art
[0004] In recent LSI, in order to achieve the higher speed of LSI,
the insulating film between wirings is made of the low dielectric
constant material. As such the low dielectric constant material,
there is a silicon oxide film in which fluorine or carbon is
contained, for example.
[0005] The step of connecting a pad to a damascene structure metal
wiring formed in an interlayer insulating film containing fluorine
will now be explained.
[0006] First, as shown in FIG. 1A, a first silicon nitride film 103
is formed on an insulating film 102 made of silicon oxide, etc.,
formed on a semiconductor substrate 101, and then a first silicon
oxide fluoride (SiOF) film 104 is formed thereon.
[0007] Then, as shown in FIG. 1B, a wiring trench (recess) 105 is
formed by patterning the first SiOF film 104 and the first silicon
nitride film 103. In this case, the first silicon nitride film 103
is used as an etching stopper in etching the first SiOF film 104.
Then, a first barrier metal film 106 made of tantalum nitride and a
first copper film 107 are formed in sequence on an inner surface of
the wiring trench 105 and the first SiOF film 104. Then, as shown
in FIG.1C, the first copper film 107 on the first SiOF film 104 and
the first barrier metal film 106 are left only in the wiring trench
105 by polishing them by virtue of the CMP method. The first copper
film 107 and the first barrier metal film 106 in the wiring trench
105 are used as a wiring 108.
[0008] Then, a surface of the wiring 108 is cleaned by the
chemicals. Then, as shown in FIG. 1D, a second silicon nitride film
109 and a second SiOF film 110 are formed in sequence on the wiring
108 and the first SiOF film 104. Then, by patterning the second
SiOF film 110 and the second silicon nitride film 109 in sequence,
a plurality of holes 110a are formed in the lower portion of the
second SiOF film 110 and also a pad trench 110b is formed on the
holes 110a.
[0009] Then, as shown in FIG. 1E, a second barrier metal layer 111
is formed on inner surfaces of a plurality of holes 110a, an inner
surface of the pad trench 110b and an upper surface of the second
SiOF film 110, and then a second copper film 112 is buried in the
holes 110a and the pad trench 110b. Then, the second copper film
112 and the second barrier metal layer 111 are removed from an
upper surface of the second SiOF film 110 by polishing them by
virtue of the CMP method. Accordingly, the second copper film 112
left in the pad trench 110b is used as a pad electrode 114, and the
second copper film 112 left in the holes 110a are used as plugs
113.
[0010] After this, as shown in FIG. 1F, a third silicon nitride
film 112 is formed on the pad electrode 114 and the second SiOF
film 110, and then a protection insulating film 116 is formed on
the third silicon nitride film 112.
[0011] However, according to the above steps, as shown in FIG. 2,
the plugs 113 are peeled off from the upper surface of the wiring
108 after the protection insulating film 116 is formed. In
contrast, since such peeling-off of the plugs 113 is not caused
when the silicon oxide film is formed in place of the first SiOF
film 104, it may be supposed that fluorine contained in the first
SiOF film 104 participates in the peeling-off of the plugs 113.
[0012] By the way, the event that the metal is degraded when the
metal is formed on the fluorine-containing insulating film is set
forth in Patent Application Publication (KOKAI) Hei 10-144793.
However, since there is no recitation that the plugs are peeled off
from the polished metal wiring, the technology set forth in the
above Publication cannot be applied to prevent the peeling-off of
the plugs from the metal wiring.
SUMMARY OF THE INVENTION
[0013] It is an object of the present invention to provide a
semiconductor device capable of maintaining good connection between
a metal film buried in a trench of a fluorine-containing insulating
film and another metal film connected to such metal film, and a
method of manufacturing the same.
[0014] According to the present invention, after the trench is
formed in the fluorine-containing insulating film, then the metal
film is formed in the trench and on the fluorine-containing
insulating film, and then the metal film is polished to remove from
the fluorine-containing insulating film but leave in the trench,
the fluorine stuck onto the surface of the metal film can be
reduced.
[0015] Accordingly, after the fluorine-noncontaining insulating
film, e.g., the silicon nitride film, the silicon carbide film, or
the silicon oxide film is formed on the metal film buried in the
trench and then the metal plugs that penetrate the
fluorine-noncontaining insulating film are connected to the upper
surface of the metal film, the situation that the
fluorine-noncontaining insulating film is never peeled off from the
metal film or the metal plugs are never separated from the metal
film can be eliminated. Thus, the adhesiveness between the
fluorine-noncontaining insulating film and the metal film can be
improved and the connection between the metal film and the metal
plugs is good.
[0016] If an amount of the fluorine on the surface of the metal
film buried in the trench in this manner is reduced to less than
60% of that obtained when the surface of the copper wiring is
cleaned, more preferably, less than 3.9 atom %, the adhesiveness
between the metal film and the metal plugs or the metal film and
the overlying fluorine-noncontaining insulating film can be
improved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] FIGS. 1A to 1F are sectional views showing steps of forming
a copper wiring having a damascene structure and a copper pad in
the prior art;
[0018] FIG. 2 is a sectional view showing contact defect between
the copper pad and the copper wiring caused by the steps shown in
FIGS. 1A to 1F in the prior art;
[0019] FIGS. 3A to 3K are sectional views showing steps of
manufacturing a semiconductor device according to a first
embodiment of the present invention;
[0020] FIG. 4 is a sectional view, depicted based on a
microphotograph, showing contact defect between plugs and a wiring
of the semiconductor device formed by the steps in the prior
art;
[0021] FIG. 5 is an analysis diagram showing an element amount on a
surface of the copper wiring after the copper wiring is formed in
the fluorine-containing insulating film and then the surface is
wet-cleaning;
[0022] FIG. 6 is a diagram showing a distribution of the fluorine
in the copper wiring in the depth direction after the copper wiring
is formed in the fluorine-containing insulating film and then the
surface is wet-cleaning;
[0023] FIG. 7 is an analysis diagram showing an element amount on
the surface of the copper wiring after the copper wiring is formed
in the fluorine-containing insulating film and then the surface is
sputtered by an argon;
[0024] FIG. 8 is a plan view showing the state of pads and wirings
of the semiconductor device that is formed via steps of forming the
copper wiring in the fluorine-containing insulating film, then
exposing the surface to the ammonia plasma, and then forming an
insulating film on the copper wiring;
[0025] FIG. 9 is an analysis diagram showing an element amount on
the surface of the copper wiring after the copper wiring is formed
in the fluorine-containing insulating film and then the surface is
exposed to the ammonia plasma;
[0026] FIG. 10 is a diagram showing a distribution of the fluorine
in the copper wiring in the depth direction after the copper wiring
is formed in the fluorine-containing insulating film and then the
surface is exposed to the ammonia plasma;
[0027] FIG. 11 is a plan view showing the state of pads and wirings
of the semiconductor device that is formed via steps of forming the
copper wiring in the fluorine-containing insulating film, then
sputtering the surface by the argon, then exposing the surface to
the ammonia plasma, and then forming the insulating film on the
copper wiring;
[0028] FIG. 12 is an analysis diagram showing an element amount on
the surface of the copper wiring after the copper wiring is formed
in the fluorine-containing insulating film, then the surface is
sputtered by the argon, and then the surface is exposed to the
ammonia plasma;
[0029] FIG. 13 is a diagram showing a distribution of the fluorine
in the copper wiring in the depth direction after the copper wiring
is formed in the fluorine-containing insulating film, then the
surface is sputtered by the argon, and then the surface is exposed
to the ammonia plasma;
[0030] FIG. 14 is an analysis diagram showing an element amount on
the surface of the copper wiring after the copper wiring is formed
in the fluorine-containing insulating film, and then the surface is
re-polished;
[0031] FIGS. 15A to 15I are sectional views showing steps of
manufacturing a semiconductor device according to a second
embodiment of the present invention; and
[0032] FIG. 16 is a flowchart showing steps of forming the wiring
having the damascene structure in the first and second
embodiments.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0033] Embodiments of the present invention will be explained with
reference to the accompanying drawings hereinafter.
[0034] (First Embodiment)
[0035] FIGS. 3A to 3K are sectional views showing steps of
manufacturing a semiconductor device according to a first
embodiment of the present invention.
[0036] First, as shown in FIG. 3A, a protection insulating film 2
made of silicon dioxide, silicon nitride, silicon nitride oxide, or
the like is formed on a silicon (semiconductor) substrate 1 on
which a device isolation structure and transistors (not shown) are
formed, and then a single layer or plural-layered interlayer
insulating film 3 is formed thereon. As the interlayer insulating
film 3, insulating material such as BPSG, silicon oxide, SiOF, or
the like is employed.
[0037] Then, a first silicon nitride (Si.sub.3N.sub.4) film 4 of 30
nm thickness is formed on the interlayer insulating film 3 by the
CVD method, and also a first SiOF film 5 of 500 nm thickness is
formed on the first silicon nitride film 4 by the CVD method. It is
preferable that a concentration of the fluorine contained in the
first SiOF film (fluorine-containing insulating film) 5 should be
set to 10 wt %, for example, to reduce the dielectric constant.
[0038] Then, a window 6a having a wiring shape is formed by coating
resist 6 on the first SiOF film 5 and then exposing/ developing the
resist 6. Then, a wiring trench 7 that reaches the first silicon
nitride film 4 is formed by dry-etching the first SiOF film 5 via
the window 6a in the resist 6 in the etching atmosphere, in which a
C.sub.4F.sub.8 gas, an Ar gas, and an O.sub.2 gas are introduced at
flow rates of 5 to 15 cc/min, 300 cc/min, and 5 cc/min
respectively, and under the condition of the applied power of 600
W. In this case, the first silicon nitride film 4 functions as the
etching stopper and thus variation in depth of the wiring trench 7
does not substantially occur. In addition, the wiring trench 7 is
deepened by etching the first silicon nitride film 4 via the window
6a in the resist 6. In this case, the interlayer insulating film 3
is also etched slightly.
[0039] Then, a shape shown in FIG. 3B is obtained by removing the
resist 6.
[0040] Then, as shown in FIG. 3C, a first tantalum nitride (TaN)
film 8 of 25 nm thickness is formed on an inner surface of the
wiring trench 7 and the first SiOF film 5 by the sputter method.
Then, a thin copper seed layer (not shown) is formed on the first
tantalum nitride film 8 by the sputter method. Then, a first copper
(Cu) film 9 having a thickness that can bury completely the wiring
trench 7, e.g., 1300 nm, is formed on the first tantalum nitride
film 8 by the electrolytic plating method using the copper seed
layer as the growth core. In this case, the first tantalum nitride
film 8 acts as the barrier metal for the first copper film 9.
[0041] Then, as shown in FIG. 3D, the first copper film 9 is left
only in the wiring trench 7 by polishing it by means of the CMP
method using slurry A. Then, as shown in FIG. 3E, the first
tantalum nitride film 8 is polished by the CMP method using slurry
B. Since surfaces of an copper oxide formed on a surface of the
first copper film 9 and the first SiOF film 5 are also polished in
polishing the first tantalum nitride film 8, fluorine (F) contained
in the first SiOF film 5 is adhered onto the surface of the first
copper film 9.
[0042] Here, the slurry A contains a phosphoric acid group ammonia
solution, a citric acid group ammonia solution, an antiseptic
solution, and hydrogen peroxide, while the slurry B contains an
alkaline solution whose PH is adjusted near 10.
[0043] The first tantalum nitride film 8 and the first copper film
9 that are left in the wiring trench 7 by such CMP method are used
as a copper wiring 10.
[0044] Then, after the CMP step using the slurry B is completed,
any one of following two methods will be applied to remove the
fluorine adhered to the surface of the copper wiring 10 after the
surface is cleaned, as shown in FIG. 3F.
[0045] A first method is that, after the first tantalum nitride
film 8 is removed from the surface of the first SiOF film 5 by
using the slurry B, the first copper film 9 is polished by the CMP
method using the slurry A once again.
[0046] A second method is that first the surface of the first
copper film 9 is etched up to 5 nm in terms of the film thickness
of the silicon oxide film, for example, by the argon sputter after
the first tantalum nitride film 8 is polished by the CMP method,
and then the surface of the first copper film 9 is exposed to the
ammonia (NH.sub.3) plasma. According to the ammonia plasma, copper
oxide (CuO.sub.x) on the surface of the first copper film 9 is
reduced and also the fluorine is sublimated as hydrogen fluoride.
As the conditions for the argon sputter, for example, a flow rate
of the argon gas introduced into the sputtering equipment is set to
4 to 5 cc/min, an applied power is set to 400 kW, a degree of
vacuum in the equipment is set to 0.5 mTorr. Also, as the
conditions of the ammonia plasma, for example, in the parallel
plate type plasma generator, a flow rate of the ammonia gas
introduced into the equipment is set to 3850 cc/min, a flow rate of
the nitrogen gas is set to 2800 cc/min, a degree of vacuum in the
equipment is set to 2.2 Torr, and an electrode applied power is set
to 560 kW.
[0047] If any one of these methods is employed, the fluorine is
almost removed from the surface of the first copper film 9
constituting the copper wiring 10. Details of these two methods
will be described later.
[0048] After this, the process goes to the steps of forming the
copper pads on the copper film by the dual damascene method.
[0049] First, as shown in FIG. 3G, a second silicon nitride film
(fluorine-noncontaining insulating film) 11 of 70 nm thickness is
formed on the copper wiring 10 and the first SiOF film 5 by the CVD
method. Then, a second SiOF film (fluorine-containing insulating
film) 12 of 1700 nm thickness is formed on the second silicon
nitride film 11 by the CVD method. In this case, a silicon carbide
film may be formed in place of the second silicon nitride film
11.
[0050] Next, steps required to get the structure shown in FIG. 3H
will be explained hereunder.
[0051] First, a plurality of holes 12a are formed in a pad forming
region by patterning the second SiOF film 12 and the second silicon
nitride 11. Then, organic insulating material (not shown) is
stacked on the bottom of the holes 12a, and then a pad trench 12b
is formed in the upper area of the second SiOF film 12 by
patterning the second SiOF film 12 again by virtue of the
photolithography method. Accordingly, a plurality of holes 12a is
formed under the pad trench 12b to project toward the copper wiring
10. The organic insulating material is removed together with the
resist used in the photolithography method.
[0052] In turn, as shown in FIG. 3I, the oxide film formed on the
surface is removed by etching the surface of the copper wiring 10
via a plurality of holes 12a by virtue of the sputter. In this
case, shoulder portions of the second SiOF film 12 around the holes
12a are obliquely scraped off to expand a diameter of the holes 12a
in the neighborhood of the pad trench 12b.
[0053] Then, a second tantalum nitride film 13 is formed on inner
surfaces of the pad trench 12b and the holes 12a and a surface of
the second SiOF film 12. Then, a second copper film 14 is formed on
the second tantalum nitride film 13 to have a thickness that can
perfectly cover the pad trench 12b. The second copper film 14 is
formed by the electrolytic plating method after a copper seed film
(not shown) is formed on the second tantalum nitride film 13.
[0054] Then, as shown in FIG. 3J, the second copper film 14 is left
only in the pad trench 12b and the holes 12a by polishing it by the
CMP method using the slurry A. Then, the second tantalum nitride
film 13 formed on the second SiOF film 12 is removed by the CMP
method using the slurry B.
[0055] Accordingly, the second copper film 14 and the second
tantalum nitride film 13 left in the holes 12a are used as plugs
15, and the second copper film 14 left in the pad trench 12b is
used as a pad 16.
[0056] Next, steps required to get the structure shown in FIG. 3K
will be explained hereunder.
[0057] First, a third silicon nitride film 17 of 70 nm thickness is
formed on the pad 16 and the second SiOF film 12 by the CVD method.
Then, a first cover film 18 formed of silicon oxide to have a
thickness of 400 nm and a second cover film 19 formed of silicon
nitride to have a thickness of 300 nm are formed on the third
silicon nitride film 17 by the CVD method at the substrate
temperature of about 400.degree. C. respectively.
[0058] As described above, when the fluorine on the surface of the
copper wiring 10 is removed by the above method after the copper
wiring 10 is formed by polishing the first copper film 9 and the
first tantalum nitride film 8 by means of the CMP method, no
peeling-off is caused between the copper wiring 10 and the
overlying plugs 15 after the first cover film 18 and the second
cover film 19 are formed.
[0059] Next, the peeling-off of the plugs 15 from the copper wiring
10 will be explained hereunder.
[0060] The inventors of the present invention have performed the
experiment described in the following.
[0061] First, the prior art will be explained. That is, in the
prior art, the copper wiring 108 is formed, then the surface of the
copper wiring 108 is cleaned, and then the silicon nitride film
109, the SiOF film 110, the plugs 113, the pad 114, the silicon
nitride film 115 and the cover film 116 are formed in sequence on
the copper wiring 108. In the worst case, as shown in FIG. 4, the
plugs 113 and the silicon nitride film 109 are lifted from the
copper wiring 108 and thus the plugs 113 and the copper wiring 108
are brought into their disconnected state. In this case, FIG. 4 is
a sectional microphotograph of the semiconductor device depicted as
a diagram.
[0062] When an elemental analysis of elements existing on the
surface is performed after the surface of the copper wiring 108 is
cleaned, an analysis result shown in FIG. 5 can be derived.
According to FIG. 5, it becomes apparent that a great deal of
fluorine exists on the surface of the copper wiring 108. It may be
guessed that the fluorine appeared in FIG. 5 is linked to the
copper element and oxygen is also linked to the copper element.
Then, when a distribution of the fluorine in the cleaned copper
wiring 108 in the depth direction is examined, the result shown in
FIG. 6 is derived. The fluorine is present from the surface of the
copper wiring 108 to a depth of about 50 nm while being
reduced.
[0063] Meanwhile, as shown in FIG. 1C, since the first copper film
107 is formed on the tantalum nitride film 106, the fluorine is
never mixed into the first copper film 107 at the time of formation
of the first copper film 107. As a result, it may be concluded that
the fluorine escaped from the first SiOF film 104 that is polished
together with the first tantalum nitride film 106 is stuck onto the
surface of the copper wiring 108.
[0064] Then, the copper wiring 10 is formed as shown in FIG. 3E,
then the surface is cleaned, and then the surface of the copper
wiring 10 is scraped off by the argon sputter. Then, as described
above, the silicon nitride film 11 and the SiOF film 12 are formed
on the copper wiring 10, then the holes 12a and the pad trench 12b
are formed in the silicon nitride film 11 and the SiOF film 12, and
then the plugs 15, the pad 16, the silicon nitride film 17, and the
cover films 18, 19 are formed in sequence. In the worst case, the
plugs 15 are lifted from the copper wiring 10 and thus the contact
between them is almost disconnected.
[0065] After the surface of the copper wiring 10 is cleaned and
then the copper wiring 10 is etched by the argon sputter up to a
depth of 5 nm in terms of the thickness of the silicon oxide film,
the elemental analysis of the elements existing on the surface is
performed. At this time, the analysis result shown in FIG. 7 has
been derived. According to FIG. 7, it becomes apparent that the
fluorine exists on the surface of the copper wiring 10, but an
amount of the fluorine can be reduced to 60% rather than the case
shown in FIG. 5.
[0066] Then, the copper wiring 10 is formed as shown in FIG. 3E,
then the surface is cleaned, and then the copper wiring 10 is
exposed to the ammonia plasma. Then, as described above, the
silicon nitride film 11 and the SiOF film 12 are formed on the
copper wiring 10, then the holes 12a and the pad trench 12b are
formed in the silicon nitride film 11 and the SiOF film 12, and
then the plugs 15, the pad 16, the silicon nitride film 17, and the
cover films 18, 19 are formed in sequence. In the worst case, the
plugs 15 are lifted from the copper wiring 10 and thus the contact
between them is almost disconnected. Also, when upper surfaces of
the pads 16 and the wiring 10 are checked after the second cover
film 19 is formed, a planar shape of the second cover film 19
appears, as shown in FIG. 8, and also an expanded portion X is
present in the pad 16. In this case, even if the silicon carbide
film is formed in place of the silicon nitride film 11 that covers
the copper wiring 10, generation of the expanded portion X, i.e.,
peeling-off of the copper wiring 10 and the silicon carbide film
cannot be prevented. For this reason, this is similarly true of the
case where other silicon compound insulating film is used in place
of the silicon nitride film 11.
[0067] After the surface of the copper wiring 10 is cleaned and
then the copper wiring 10 is exposed to the ammonia plasma, the
elemental analysis of the elements existing on the surface is
performed. At this time, the analysis result shown in FIG. 9 has
been derived. According to FIG. 9, it is apparent that the fluorine
exists on the surface of the copper wiring 10, but an amount of the
fluorine can be reduced to 60% rather than the case shown in FIG.
5. In addition, when a distribution of the fluorine in the copper
wiring in the depth direction after the copper wiring is exposed to
the ammonia plasma, the result shown in FIG. 10 can be obtained.
The fluorine is present from the surface of the copper wiring 10 to
a depth of about 30 nm while being reduced.
[0068] Then, the copper wiring 10 is formed as shown in FIG. 3E,
then the surface is cleaned, then the copper wiring 10 is etched by
the argon sputter up to a depth of 5 nm, and then the copper wiring
10 is exposed to the ammonia plasma. Then, as described above, the
silicon nitride film 11 and the SiOF film 12 are formed on the
copper wiring 10, then the holes 12a and the pad trench 12b are
formed in the silicon nitride film 11 and the SiOF film 12, and
then the plugs 15, the pad 16, the silicon nitride film 17, and the
cover films 18, 19 are formed in sequence. At this time, the plugs
15 are never lifted from the copper wiring 10 and thus an ideal
sectional shape can be obtained. Also, when the upper surfaces of
the pads 16 and the copper wiring 10 are checked after the second
cover film 19 is formed, a planar shape of the second cover film 19
shown in FIG. 11 appears and the upper surfaces of the pads 16
become a flat surface and thus becomes the normal state. In this
case, because the flatness of the upper surface of the pad 16 is
not lost even if the silicon carbide film is formed in place of the
silicon nitride film for covering the copper wiring 10, it is
possible to say that, even if other silicon compound insulating
film is used in place of the silicon nitride film 11, the
peeling-off is never caused between the copper wiring 10 and the
overlying insulating film.
[0069] After the surface of the copper wiring 10 is cleaned and
then the copper wiring 10 is exposed to the ammonia plasma, the
elemental analysis of the elements existing on the surface is
performed. At this time, the result shown in FIG. 12 has been
derived. According to FIG. 12, an amount of the fluorine can be
reduced to 20% rather than the case shown in FIG. 5. An amount of
the fluorine on the surface of the copper wiring 10 is examined,
therefore such amount of the fluorine is 3.9 atom %. Also, if the
surfaces are compared mutually by using spectra that are calculated
by differentiating the number of Auger electrons obtained by the
Auger electron spectroscopy by the energy of the electron, an
amount of the fluorine on the surface is smaller than an amount of
the oxygen on the surface. In addition, a distribution of the
fluorine in the copper wiring 10 in the depth direction after the
copper wiring 10 is subjected to the argon sputter process and the
ammonia plasma process is examined, the result shown in FIG. 13 is
derived. The fluorine is present up to a depth of about 10 nm, but
an amount of such fluorine is extremely small.
[0070] Next, as shown in FIG. 3D and FIG. 3E, the first copper film
9 is polished by the slurry A, then the copper wiring 10 is formed
in the wiring trench 7 by polishing the first tantalum nitride film
using the slurry B, and then the surface of the copper wiring 10 is
polished by using the slurry A. Then, as described above, the
silicon nitride film 11 and the SiOF film 12 are formed on the
copper wiring 10, then the holes 12a and the pad trench 12b are
formed in the SiOF film 12 and the silicon nitride film 11, and
then the plugs 15, the pad 16, the silicon nitride film 17, and the
cover films 18, 19 are formed sequentially. At this time, the plugs
are not lifted from the copper wiring 10 and thus the ideal
sectional shape can be obtained. When the surfaces of the pad 16
and the copper wiring 10 are checked after the second cover film 19
is formed, the planar shape similar to FIG. 11 appears and the
upper surface of the pad 16 becomes a flat surface, and thus the
normal state can be achieved.
[0071] When the elemental analysis of the elements that exist on
the surface of the copper wiring 10 whose surface is re-polished,
the result shown in FIG. 14 is derived. An amount of the fluorine
can be reduced up to 4.5% rather than FIG. 5.
[0072] With the above, it has been confirmed that, if either the
steps of sputtering the surface of the copper wiring 10 by the
argon and then exposing to the ammonia plasma are employed after
the copper wiring 10 is formed in the wiring trench 7 by polishing
the second copper film 9 and the second tantalum nitride film 8 or
the step of polishing the copper film 10 by virtue of the CMP
method using the slurry A once again is employed after the copper
wiring 10 is formed, the peeling-off of the copper wiring 10 from
the plugs or the peeling-off of the copper wiring 10 from the
second silicon nitride film 11 is not caused.
[0073] Also, in the above explanation, it is preferable that, after
the copper wiring 10 is formed by polishing the first copper wiring
9 and the second tantalum nitride film 8 by means of the CMP
method, an amount of the fluorine on the surface should be reduced
to less than 60% of that obtained when the surface of the copper
wiring 10 is merely cleaned or reduced to less than 10 atom %, more
preferably, less than 20% or less than 3.9 atom %.
[0074] In addition, the argon is used in the sputtering after the
copper wiring 10 is formed, but the inert gas such as helium, neon,
krypton, etc. may be used. Further, a mixed gas that is formed by
mixing hydrogen, for example, in the ammonia may be used as the
plasma used after the sputtering, or other hydrogen compound
reducing gas may be used.
[0075] (Second Embodiment)
[0076] In the first embodiment, a structure for connecting the
copper pad to the copper wiring and the method of forming the same
are explained. But they can be similarly applied to the connection
between the underlying wiring and the overlying wiring. Therefore,
such embodiment will be explained hereinafter.
[0077] First, steps required to get a structure shown in FIG. 15A
will be explained hereunder.
[0078] A device isolation insulating film 24 having a shallow
trench isolation (STI) structure is formed in a p-type silicon
(semiconductor) substrate 21 to surround a first device forming
region 22 and a second device forming region 23. The device
isolation insulating film 24 is not limited to the STI structure,
and an insulating film formed by the LOCOS method, for example, may
be used.
[0079] Then, an n well 25 is formed by introducing an n-type
impurity into the first device forming region 22. A region into
which the n-type impurity is not introduced is a p well 26. Then,
gate electrodes 27, 28 are formed on the n well 25 and the p well
26 on the silicon substrate 1 via a gate insulating film 27a and a
gate insulating film 28a respectively.
[0080] Also, a first p-type impurity diffusion layer 29a and a
second p-type impurity diffusion layer 29b are formed by
introducing the p-type impurity into the n well 25 on both sides of
the gate electrode 27, and a first n-type impurity diffusion layer
30a and a second n-type impurity diffusion layer 30b are formed by
introducing the n-type impurity into the p well 26 on both sides of
the gate electrode 28. In turn, insulating sidewalls 31 are formed
on side surfaces of the gate electrodes 27, 28. Then, the p-type
impurity is introduced into the n well 25 on both sides of the gate
electrode 27 and the insulating sidewalls 31, and also the n-type
impurity is introduced into the p well 26 on both sides of the gate
electrode 28 and the insulating sidewalls 31. Accordingly, the
p-type impurity diffusion layers 29a, 29b and the n-type impurity
diffusion layers 30a, 30b have an LDD structure respectively.
[0081] A first MOS transistor consists of the p-type impurity
diffusion layers 29a, 29b, the gate electrode 27, etc. in the n
well 25. Also, a second MOS transistor consists of the p-type
impurity diffusion layers 30a, 30b, the gate electrode 28, etc. in
the p well 26.
[0082] An underlying wiring 20 is formed on the device isolation
insulating film 24.
[0083] In turn, a first interlayer insulating film 32 for covering
the first and second MOS transistors is formed on the silicon
substrate 21, and then a surface of the first interlayer insulating
film 32 is planarized by the CMP method. Then, contact holes 32a to
32e are formed in the first interlayer insulating film 32 on the
p-type impurity diffusion layers 29a, 29b, the p-type impurity
diffusion layers 30a, 30b, and the underlying wiring 20
respectively. Then, first layer first to fifth plugs 33a to 33e are
buried into the contact holes 32a to 32e. The plugs 33a to 33e are
formed by burying titanium, titanium nitride, and tungsten in
sequence into the contact holes 32a to 32e. The titanium, the
titanium nitride, and the tungsten formed on the first interlayer
insulating film 32 are removed by the CMP method.
[0084] In addition, a wiring 34 that connects the third plug 3c on
the first n-type impurity diffusion layer 30a and the second plug
33b on the p-type impurity diffusion layer 29b is formed on the
first interlayer insulating film 32.
[0085] In turn, a second interlayer insulating film 35 is formed on
the first interlayer insulating film 32, then second layer contact
holes 36a, 36d, 36e are formed at positions to overlap with the
first plug 32a on the first p-type impurity diffusion layers 29a,
the fourth plug 33d on the second n-type impurity diffusion layer
30b, and the underlying wiring 20 respectively, and then second
layer first and second plugs 37a, 37d, 37e are formed in these
contact holes 36a, 36d, 36e. The second layer first and second
plugs 37a, 37d, 37e are formed of a metal film that has the same
structure as the first layer plugs 33a to 33e.
[0086] Next, steps required to get a structure shown in FIG. 15B
will be explained hereunder.
[0087] First, a first silicon nitride (Si.sub.3N.sub.4) film 38 is
formed on the second layer first and second plugs 37a, 37d and the
second interlayer insulating film 35 by the CVD method. Also, a
first SiOF film (fluorine-containing insulating film) 39 is formed
on the first silicon nitride film 38 by the CVD method.
[0088] Then, first to fifth wiring trenches 38a to 38e are formed
by patterning the first SiOF film 39 and the first silicon nitride
film 38 by virtue of the photolithography method. The first, second
and fifth wiring trenches 38a, 38d, 38e are formed at positions to
partially overlap with the second layer first to third plugs 37a,
37d, 37e.
[0089] Then, as shown in FIG. 15C, a first tantalum nitride (TaN)
film 40 is formed on inner surfaces of the first to fifth wiring
trenches 38a to 38e and the first SiOF film 39. Then, a first
copper film 41 having a thickness that can bury perfectly the
wiring trenches 38a to 38e is formed on the first tantalum nitride
film 40 by the electrolytic plating method.
[0090] Then, as shown in FIG. 15D, the first copper film 41 is
polished by means of CMP method using the slurry A to leave only in
the first to fifth wiring trenches 38a to 38e, then the first
tantalum nitride film 40 is polished by the CMP method using the
slurry B to remove from the upper surface of the first SiOF film
39. In polishing the first tantalum nitride film 40, the surface of
the first SiOF film 39 is also polished slightly and thus the
fluorine (F) contained in the first SiOF film 39 is stuck onto the
surface of the first copper film 41.
[0091] The first copper film 41 being left in the first to fifth
wiring trenches 38a to 38e by such CMP method is used as first
layer copper wirings 42a to 42e.
[0092] Then, after the CMP step using the slurry B is finished, the
method similar to the first embodiment is applied to remove the
fluorine stuck onto the surface of the first copper film 41 being
left in the first to fifth wiring trenches 38a to 38e.
[0093] In other words, the method of polishing the first copper
film 41 by the CMP method using the slurry A again is applied after
the first tantalum nitride film 40 is removed from the surface of
the first SiOF film 39, otherwise the method of exposing the
surface of the first copper film 41 to the ammonia (NH.sub.3)
plasma is applied after the surface of the first copper film 41 is
etched by the argon sputter method.
[0094] Then, as shown in FIG. 15E, a second silicon nitride film
(fluorine-noncontaining insulating film) 43 is formed on the first
layer copper wirings 42a to 42e and the first SiOF film 39 by the
CVD method. Also, a second SiOF film (fluorine-containing
insulating film) 44 is formed on the second silicon nitride film 43
by the CVD method.
[0095] Then, as shown in FIG. 15F, holes 44a, 44b are formed on a
part of the first layer copper wirings 42a to 42e by patterning the
second SiOF film 44 and the second silicon nitride film 43 by means
of the photolithography method.
[0096] After this, a second tantalum nitride (TaN) film 45 is
formed on inner surfaces of the holes 44a, 44b and the second SiOF
film 44 by the sputter method. Then, a second copper film 46 having
a thickness that can perfectly bury the holes 44a, 44b is formed on
the second tantalum nitride film 45 by the electrolytic plating
method
[0097] Then, as shown in FIG. 15G, the second copper film 46 is
polished by the CMP method using the slurry A to leave only in the
holes 44a, 44b, and then the second tantalum nitride film 45 is
polished by using the slurry B to remove from the upper surface of
the second SiOF film 44. In polishing the second tantalum nitride
film 45, the surface of the second SiOF film 44 is also polished
slightly and thus the fluorine (F) contained in the second SiOF
film 44 is stuck onto the surface of the second tantalum nitride
film 45. As the method of removing the fluorine on the second
tantalum nitride film 45, the method of removing the fluorine from
the surfaces of the first layer copper wirings 42a to 42e is
similarly employed. The second tantalum nitride film 45 and the
second copper film 46 left in the holes 44a, 44b are used as plugs
47a, 47b.
[0098] Then, as shown in FIG. 15H, a third silicon nitride
(Si.sub.3N.sub.4) film 48 is formed on the second SiOF film 44 and
the plugs 47a, 47b formed therein by the CVD method. Also, a third
SiOF film (fluorine-containing insulating film) 49 is formed on the
third silicon nitride film 48 by the CVD method.
[0099] After this, as shown in FIG. 15I, second layer copper
wirings 52a to 52c consisting of a third tantalum nitride film 50
and a third copper film 51 are formed in the third silicon nitride
film 48 and the third SiOF film 49 by the similar method applied to
the first layer copper wirings 42a to 42e. A part of the second
layer copper wirings 52a to 52c is connected to the underlying
plugs 47a, 47b.
[0100] In this manner, the wirings and the plugs are formed in
plural repeatedly, and then the cover films (not shown) shown in
the first embodiment are formed finally.
[0101] In the case where the copper wiring having the above
damascene structure is employed, like the first embodiment, the
peeling-off between the copper wiring and the overlying silicon
nitride film can be prevented and also the peeling-off between the
copper wiring and the overlying copper plugs can be prevented if
the surface of the copper wiring is polished by the CMP method once
again after the barrier metal film under the copper film is
polished or if the argon sputter process and the ammonia plasma
process are applied to the copper film after the barrier metal film
is polished.
[0102] In particular, as shown in FIG. 15G, if both the plugs 47a,
47b and the silicon nitride film 43 come in contact with the copper
wirings 42a, 42b, the event that the silicon nitride film 43 is
peeled off from the copper wirings 42a, 42b and then the plugs 47a,
47b are substantially disconnected from the copper wirings 42a, 42b
can be avoided in the second embodiment.
[0103] (Other Embodiment)
[0104] In the first and second embodiments, the explanation has
been made to form the wiring having the damascene structure, the
plugs, or the pad by the copper. But, the above embodiments may be
also applied to the case where the wiring is formed of aluminum, or
other metal in place of the copper.
[0105] In this case, a process flow for forming the normal
damascene structure in first and second embodiments may be shown in
FIG. 16.
[0106] As described above, according to the present invention,
after the trench is formed in the fluorine-containing insulating
film, then the metal film is formed in the trench and the
fluorine-containing insulating film and then the metal film is
polished to remove from the fluorine-containing insulating film but
leave in the trench, the fluorine adhered to the metal film can be
reduced. Therefore, after the fluorine-noncontaining insulating
film is formed on the metal film buried in the trench and then the
metal plugs penetrating the fluorine-noncontaining insulating film
are connected onto the metal film, the peeling-off of the
fluorine-noncontaining insulating film from the metal film or the
separation of the metal plugs from the metal film can be
prevented.
* * * * *