U.S. patent application number 09/897204 was filed with the patent office on 2002-01-10 for bonding member and gypsum board mounting method using the same.
This patent application is currently assigned to Max Co., LTD.. Invention is credited to Agehara, Kigen, Akatsu, Motoshige, Harigaya, Takumi, Murayama, Keijiro, Nishikawa, Hiroyuki, Sekiguchi, Nobuaki, Shiokawa, Hiroshi, Shioya, Tsutomu, Takatsuru, Mitsuhiro, Takayama, Takashi, Yamaguchi, Masakatsu.
Application Number | 20020002805 09/897204 |
Document ID | / |
Family ID | 27481420 |
Filed Date | 2002-01-10 |
United States Patent
Application |
20020002805 |
Kind Code |
A1 |
Yamaguchi, Masakatsu ; et
al. |
January 10, 2002 |
Bonding member and gypsum board mounting method using the same
Abstract
A bonding member 1 comprising a metallic plate 2 formed as a
small piece onto which a hot melt adhesive layer 3 is formed at
least one side of said metallic plate 2, and a gypsum board
mounting method for mounting a gypsum board 5 using the bonding
member 1, comprising: fixing said bonding member 5 temporarily;
pushing said gypsum board 5, heating the metallic plate 2 with
electromagnetic induction to melt said hot melt adhesive layer 3;
and thereby allowing the gypsum board 5 to be bonded easily without
noise. The bonded gypsum board 5 can be recycled because it can be
peeled off easily with melting the adhesive layer 3 without damage
of the board.
Inventors: |
Yamaguchi, Masakatsu;
(Tokyo, JP) ; Murayama, Keijiro; (Tokyo, JP)
; Takatsuru, Mitsuhiro; (Tokyo, JP) ; Takayama,
Takashi; (Tokyo, JP) ; Shioya, Tsutomu;
(Tokyo, JP) ; Shiokawa, Hiroshi; (Tokyo, JP)
; Nishikawa, Hiroyuki; (Tokyo, JP) ; Sekiguchi,
Nobuaki; (Tokyo, JP) ; Harigaya, Takumi;
(Tokyo, JP) ; Agehara, Kigen; (Tokyo, JP) ;
Akatsu, Motoshige; (Tokyo, JP) |
Correspondence
Address: |
CHAPMAN AND CUTLER
111 WEST MONROE STREET
CHICAGO
IL
60603
US
|
Assignee: |
Max Co., LTD.
6-6, Nihonbashi Hakozaki-cho
Tokyo
JP
|
Family ID: |
27481420 |
Appl. No.: |
09/897204 |
Filed: |
July 2, 2001 |
Current U.S.
Class: |
52/396.05 ;
52/396.04; 52/459; 52/460; 52/463; 52/582.1; 52/717.05;
52/745.21 |
Current CPC
Class: |
E04B 2002/7468 20130101;
E04B 2/723 20130101; E04B 2002/7472 20130101; E04B 2/7457
20130101 |
Class at
Publication: |
52/396.05 ;
52/396.04; 52/459; 52/460; 52/463; 52/582.1; 52/745.21;
52/717.05 |
International
Class: |
E04B 001/68; E04F
015/14 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 4, 2000 |
JP |
2000-202643 |
Jul 4, 2000 |
JP |
2000-202644 |
Jul 4, 2000 |
JP |
2000-202645 |
Jul 4, 2000 |
JP |
2000-202646 |
Claims
What is claimed is:
1. A bonding member comprising a metallic plate formed as a small
piece onto which a hot melt adhesive layer is formed at least one
side of said metallic plate.
2. A bonding member according to claim 1, characterized in that
said bonding member is disposed between a gypsum board and a
pillar, and said metallic plate is heated with electromagnetic
induction from the surface side of said gypsum board to melt said
hot melt adhesive layer, whereby the metallic plate is bonded to at
least said gypsum board or said pillar.
3. A bonding member according to claim 1, characterized in that
said metallic plate is provided with an inserting projection for
fixing the bonding member temporarily to a portion to which the
gypsum board is to be mounted.
4. A bonding member according to claim 3, characterized in that
said metallic plate is provided with a pair of holding plate
portions for allowing the bonding member to be held by and
temporarily fixed to said pillar.
5. A bonding member according to claim 1, characterized in that
said metallic plate is magnetized.
6. A gypsum board mounting method for mounting the gypsum board to
a portion where said gypsum board is to be mounted using a bonding
member comprising a metallic plate formed as a small piece onto
which a hot melt adhesive layer is formed at least one side of said
metallic plate, characterized in that said method comprising:
fixing said bonding member temporarily to said portion; pushing
said gypsum board onto said bonding member; heating said metallic
plate of the bonding member with electromagnetic induction from
above said gypsum board to melt said hot melt adhesive layer; and
thereby allowing the gypsum board to be bonded to said portion.
7. A gypsum board mounting method according to claim 6,
characterized in that said temporary fixing is performed while at
least a top bonding member out of plural bonding members
interconnected with an elongated member is fastened to said portion
to which the gypsum board is to be mounted.
8. A gypsum board mounting method according to claim 6,
characterized in that said temporary fixing is performed with
driving an inserting member into said portion to which the gypsum
board is to be mounted, so as to pierce through the bonding
member.
9. A gypsum board mounting method according to claim 6,
characterized in that said temporary fixing is performed with
adhesively bonding together said bonding member and said portion to
which the gypsum board is to be mounted, while interposing a
double-side coated adhesive tape between said bonding member and
said portion, said double-side coated adhesive tape being smaller
than said hot melt adhesive layer.
10. A gypsum board mounting method according to claim 6,
characterized in that said method further comprising: detecting
said metallic plate by a metal detecting means from above said
gypsum board; and then heating the metallic plate with
electromagnetic induction at the position where the metallic plate
is detected by said metal detecting means.
11. A gypsum board mounting method according to claim 10,
characterized in that said metal detecting means utilizes an
electromagnetic induction heater for heating said metallic
plate.
12. A building dismantlement method for dismantling a building to
which gypsum boards have been mounted by a method using a bonding
member comprising a metallic plate formed as a small piece onto
which a hot melt adhesive layer is formed at least one side of said
metallic plate, characterized in that said mounting method
comprising: fixing said bonding member temporarily to said portion;
pushing said gypsum board onto said bonding member; heating said
metallic plate of the bonding member with electromagnetic induction
from above said gypsum board to melt said hot melt adhesive layer;
and thereby allowing the gypsum board to be bonded to said portion,
wherein said dismantlement method comprising: heating said metallic
plate by an electromagnetic induction heating means; melting said
hot melt adhesive layer; and removing said gypsum board from its
mounted portion.
13. A building dismantlement method according to claim 12,
characterized in that said method further comprising: detecting
said metallic plate by a metal detecting means from above said
gypsum board; and heating the metallic plate by said
electromagnetic induction heating means at the position where the
metallic plate is detected by said metal detecting means.
14. A building dismantlement method according to claim 13,
characterized in that said metallic plate is detected by said
electromagnetic induction heating means.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a bonding member for
bonding, for example, gypsum board or panel to a pillar or the
like, as well as a gypsum board mounting method for mounting a
gypsum board with use of the bonding member.
[0003] 2. Description of the Prior Art
[0004] Heretofore, nails, wood screws, staples, and adhesives have
been used for bonding gypsum board, panel, and the like to pillars
and the like.
[0005] Recently there has been a demand for recycling gypsum boards
at the time of reforming or after dismantlement and a demand for
suppressing noise during the execution of work.
[0006] If a gypsum board is fixed to a pillar using nails, staples,
or wood screws as in the prior art, there occurs a striking noise
or a noise from a motor-operated driver or the like. As further
problems, the gypsum board may be broken when stripped from the
pillar and it may become impossible to recycle the gypsum board, or
the gypsum board may be damaged into a more bulky mass, requiring
much time and labor for classifying work and a higher cost for
discarding the board.
[0007] In the case where a gypsum board is mounted using staples or
nails, it is necessary to pull out the staples or nails for
removing the gypsum board, but at this time the gypsum board is
damaged to a degree of scarcely having any original form. This is
also the case with stripping a gypsum board from an adhesive used
for bonding the gypsum board.
[0008] Where a gypsum board is fixed with screws, if the screws are
removed one by one, the gypsum board will not be damaged. However,
since a gypsum board is usually fixed using 40 or more screws, 40
or more tapped holes will ba left after removal of the screws;
besides, the gypsum collapses in the holes, so it is difficult to
use those holes for re-clamping the gypsum board, and thus such a
gypsum board is not suitable for recycling. Moreover, since 40 or
more screws are used, much time is required for removing the screws
one by one. Actually, therefore, the gypsum board is destroyed for
removal.
SUMMARY OF THE INVENTION
[0009] It is an object of the present invention to provide a
bonding member and a gypsum board mounting method using the bonding
member, not generating noise in a gypsum board mounting work,
capable of preventing destruction of gypsum boards in renovating
the interior finish or in building dismantlement, thereby making it
possible to recycle the gypsum boards, and capable of minimizing
labor and cost also in a gypsum board discarding work.
[0010] A first aspect of the present invention is characterized in
a bonding member comprising a metallic plate formed as a small
piece onto which a hot melt adhesive layer is formed at least one
side of said metallic plate.
[0011] A second aspect of the present invention is characterized in
a gypsum board mounting method for mounting the gypsum board to a
portion where said gypsum board is to be mounted using a bonding
member comprising a metallic plate formed as a small piece onto
which a hot melt adhesive layer is formed at least one side of said
metallic plate, characterized in that said method comprising:
fixing said bonding member temporarily to said portion; pushing
said gypsum board onto said bonding member; heating said metallic
plate of the bonding member with electromagnetic induction from
above said gypsum board to melt said hot melt adhesive layer; and
thereby allowing the gypsum board to be bonded to said portion.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Hereinafter embodiments of members and gypsum board mounting
methods according to the present invention will be explained in
detail with reference to attached drawings, in that:
[0013] FIG. 1 is a perspective view showing the configuration of a
bonding member according to a first embodiment of the present
invention;
[0014] FIG. 2 is a plan view of the bonding member on which a
double side coated adhesive tape provided;
[0015] FIG. 3 is an explanatory diagram explaining how to mount a
gypsum board using the bonding member;
[0016] FIG. 4 is a block diagram showing the configuration of an
electromagnetic induction system;
[0017] FIG. 5 is an explanatory diagram for illustrating an
inconvenience involved in using a belt-like metallic plate;
[0018] FIG. 6 is an explanatory diagram illustrating a gypsum board
mounting method according to a second embodiment of the present
invention;
[0019] FIG. 7 is an explanatory diagram illustrating a connected
bonding member constituted by plural bonding members arranged on a
double-side coated adhesive tape;
[0020] FIG. 8 is an explanatory diagram illustrating a bonding
member in the second embodiment;
[0021] FIG. 9 is an explanatory diagram illustrating a bonding
member according to a third embodiment of the present
invention;
[0022] FIG. 10 is an explanatory diagram illustrating a temporarily
fixed state of a bonding member with a pin;
[0023] FIG. 11 is a sectional plan view illustrating a gypsum board
mounting structure;
[0024] FIG. 12 is a front view of the gypsum board mounting
structure shown in FIG. 11;
[0025] FIG. 13 is a perspective view illustrating a mounted state
of a gypsum board to a stud;
[0026] FIG. 14 is a sectional view illustrating the configuration
of a bonding member;
[0027] FIG. 15 is a perspective view of the configuration of a
bonding member shown in FIG. 14;
[0028] FIG. 16 is a block diagram illustrating the configuration of
an electromagnetic induction system; and
[0029] FIG. 17 is an explanatory diagram illustrating in what state
a hot melt is melted by the electromagnetic induction system.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0030] First Embodiment
[0031] A bonding member 1 shown in FIG. 1 is made up of a metallic
plate 2 and hot melt adhesive layers 3 formed on both sides of the
metallic plate 2.
[0032] The metallic plate 2 is formed of, for example, aluminum or
iron and may be in a square or rectangular shape (length and width:
1-10 cm) or may be in any other shape, including a circular shape.
The thickness of the metallic plate 2 is set at a value suitable
for induction heating, such as 0.1-2 mm.
[0033] The hot melt adhesive layers 3 are each formed by
heat-melting a solid thermoplastic resin adhesive at a high
temperature and applied with painting the thus melted adhesive to
the metallic plate 2. The hot melt adhesive is a contact bonding
adhesive and is constituted, for example, by any or a mixture of
polyvinyl acetate, ethylene/vinyl acetate copolymer, polyimide,
phenoxy resin, ethyl cellulose, polyisobutylene, petroleum resin,
polyester, terpene resin, asphalt, rosin, and derivatives
thereof.
[0034] As shown in FIG. 2, a double-side coated adhesive tape 6 may
be used to affix beforehand to the surface of a hot melt adhesive
layer 3 and a releasing paper may be used to affix onto the
double-side coated adhesive tape 6.
[0035] The following description is now provided about a gypsum
board mounting method using the bonding member 1.
[0036] First, as shown in FIG. 3, a plurality of bonding members 1
are temporarily fixed to pillars 4, 4 beforehand with double side
coated adhesive tapes 6. For this temporary fixing, the double side
coated adhesive tapes 6 are affixed beforehand to either the
pillars 4, 4 or the bonding members 1.
[0037] Next, a gypsum board 5 is put on the temporarily fixed
bonding members 1 so as to cover the bonding members, then is
established its positional relation with respect to the pillars 4,
4 and is held in that positional relation.
[0038] Then, a high frequency is generated from above the gypsum
board 5 by means of an electromagnetic induction system 7 and
applied to heat the metallic plate 2 of each bonding member 1 by
induction heating. As a result, the hot melt adhesive layers 3
begin to melt. After melting of the hot melt adhesive layers 3, the
gypsum board 5 is pushed toward the pillars 4, 4, with the result
that the gypsum board 5 is bonded to the pillars 4, 4.
[0039] Heating of the metallic plate 2 is done efficiently because
the metallic plate is a small piece and the hot melt adhesive
layers 3 are formed on both sides thereof and they function as heat
insulating layers. As a result, heating of the hot melt adhesive
layers 3 is done efficiently. Moreover, if the area of the metallic
plate 2 is preset to an appropriate value, it becomes possible to
install the gypsum board 5 with a certain holding force. Further,
since small metallic plates 2 are arranged at predetermined
intervals, the weight per unit area applied to the hot melt
adhesive layers 3 can be taken large when pushing the gypsum board
5 for bonding. Consequently, the gypsum board 5 can be bonded to
the pillars 4, 4 surely.
[0040] When the gypsum board 5 is applied to the temporarily fixed
metallic plates 2, it becomes impossible to detect the positions of
the metallic plates 2 where they are, however, it can be detected
easily by using such a detecting means as a metal detector. For the
metal detection there may be utilized a characteristic of the
electromagnetic induction system 7 which is used for heating the
hot melt adhesive layers 3. That is to say, when the
electromagnetic induction system 7 is placed in a position facing
to a metallic plate 2, an electric current will flow through the
metallic plate 2 due to electromagnetic induction effect, with
consequent a high frequency current flowing in the coil of the
electromagnetic induction system 7 increases. By detecting this
increase it is possible to detect the position of the metallic
plate 2.
[0041] As shown in FIG. 4, the electromagnetic induction system 7
comprises a high-frequency coil 21, a high-frequency current
generating circuit 22 for generating a high-frequency current
through the high-frequency coil 21, a detecting coil 23 for
detecting the high-frequency current flowing through the
high-frequency coil 21, a voltage output circuit 24 which outputs a
voltage corresponding to the electric current detected by the
detecting coil 23, a controller 25 for controlling the
high-frequency current generating circuit 22, and a display 26.
[0042] The controller 25 compares an output voltage Vt provided
from the voltage output circuit 24 with a predetermined reference
voltage V0 and, when the output voltage Vt is not lower than the
reference voltage V0, the controller judges that a metallic plate 2
is present at the position, causing the display 26 to make an
indication that the metallic plate 2 is present. The controller 25
is constituted by a CPU for example. Instead of the display 26
there may be used a lamp or a buzzer, causing the lamp to go on or
the buzzer to generate a detection sound such as an alarm
sound.
[0043] If the electromagnetic induction system 7 is moved along the
pillars 4, 4 and is stopped for a predetermined time at a position
at which the display 26 has indicated an increase of the
high-frequency current, it is possible to heat the metallic plate 2
surely.
[0044] The electromagnetic induction system 7 causes a
high-frequency current for heating a metallic plate 2 to flow
through the high-frequency coil 21 also during detection of a
metallic plate 2, but a modification may be made such that during
the detection a weak high-frequency current is only allowed to flow
to detect the metallic plate 2 and a high-frequency current for
heating is allowed to flow after detection of the metallic plate.
Although the electromagnetic induction system 7 uses the detecting
coil 23 and the voltage output circuit 24, there may be used a
metal detector instead.
[0045] In the case where the metallic plate of each bonding member
1 is a band-like long metallic plate 8, as shown in FIG. 5, the
metallic plate 8 is shaded by the gypsum board 5 and therefore it
is impossible to determine which portion of the metallic plate 8 is
bonded. Consequently, there occurs a case when a portions A which
has once been induction-heated and bonded, are melted again and
peeled off by subjecting those portions to induction heating. But
such an inconvenience does not occur in this embodiment because the
metallic plate 2 is a small piece, allowing the whole surface of
each bonding member 1 to be bonded to a pillar 4, 4 and the gypsum
board 5 in induction heating, and further because the induction
heating can be done for each bonding member 1. Consequently, it is
possible to effect the bonding with high reliability, to attain a
high heating efficiency, shorten the time required for the bonding
work, to reduce the amount of the hot melt adhesive layers 3 used
and hence to execute an interior finish work at low cost.
[0046] Although in the above embodiment the hot melt adhesive
layers 3 are formed on both sides of the metallic plate 2, such hot
melt adhesive layer may be formed on only one side of the metallic
plate. In this case, if an ordinary type of an adhesive is applied
to the other side of the metallic plate, it becomes unnecessary to
temporarily fix the bonding member 1 with a double-side coated
adhesive tape or the like.
[0047] For removing the gypsum board 5 from the pillars; 4, 4, each
metallic plate 2 is heated by the electromagnetic induction system
7 with the same manner as above described to melt the hot melt
adhesive layers 3. Since the hot melt adhesive layers 3 are in a
melted state during removal of the gypsum board 5, it is possible
to peel off, or remove, the gypsum board easily from the pillars 4,
4 without damage.
[0048] As described above, the gypsum boards 5 can be peeled off in
a simple manner moreover it is done without damage, the gypsum
board 5 can be recycled.
[0049] Although in the above embodiment the gypsum board 5 is
mounted with the bonding member 1, a wooden board for example can
be mounted instead.
[0050] Second Embodiment
[0051] FIG. 6 illustrates a mounting method for the gypsum board 5
according to a second embodiment of the present invention. Onto
each pillar 4 to which the gypsum board 5 is to be mounted there
are affixed bonding members 10 at an interval with use of a
continuously elongated double-side coated adhesive tape 11.
[0052] Each bonding member 10 shown in FIG. 7, comprises a metallic
plate (not shown) and hot melt adhesive layers 3 formed on both
sides of the metallic plate, like the bonding member 1 shown in
FIG. 1. The double-side coated adhesive tape 11 which has
adhesiveness, is affixed onto the hot melt adhesive layer 3 on one
side and the bonding members 10 are arranged to locate at
approximately equal intervals on the double-side coated adhesive
tape 11.
[0053] A connected bonding member 12 which is constituted by
affixing a large number of bonding members 10 to the double-side
coated adhesive tape 11, when the connected bonding member 12 is
not in use, a releasing paper, for example, which is made of
silicon coated paper, is affixed to the adhesive portion of the
double-side coated adhesive tape 11.
[0054] By peeling off the releasing paper from the connected
bonding member 12 and affixing the bonding members 10 to each of
pillars 4, a temporary fixing of the bonding members 10 is
completed in a simple manner without generation of noise. After
completion of the temporary fixing, the gypsum board 5 is pushed
against the pillars 4 by hand while taking care so as not to cause
a positional discrepancy of the gypsum board. Since the adhesive of
the double-side coated adhesive tape 11 is exposed between adjacent
and connected bonding members 10, the surface paper of the gypsum
board 5 is bonded to the tape at those portions.
[0055] In this state, when a high frequency is generated with
induction from above the gypsum board 5 by means of the
electromagnetic induction system 7, the metallic plates of the
bonding members 10 are induction-heated and the hot melt adhesive
layers 3 as surface layers are melted. Then, by pushing the gypsum
board 5, the gypsum board 5 is bonded to the pillars 4, 4 with
adhesion. Since the double-side coated adhesive tape 11 is narrower
than the portion of the hot melt adhesive layers 3 on each bonding
member 10, there is no fear that the bonding force of the bonding
member 10 may become insufficient.
[0056] Although the double-side coated adhesive tape 11 is used as
a continuously elongated member in this embodiment, it may be
substituted by a string or tape which has the adhesive force not
throughout the whole surface thereof but it has the adhesive force
on its only surface of abutting with the bonding members 10. These
string or tape can be formed using paper or plastic film. In case
of temporary fixing of the string or tape, the bonding member 10
located at the top position may be fastened with pin or a small
double-side coated adhesive tape and then the gypsum board 5 may be
mounted while covering the connected bonding member 12 and the pin,
even by these manner there will arise no problem.
[0057] FIG. 8 illustrates a bonding member 13 according to the
second embodiment of the present invention. The bonding member 13
of this embodiment is provided with a pair of inserting projections
15, 15 formed at corners of a metallic plate 14 and the top of it
have sharp tips. Hot melt adhesive layers 14A and 14B are formed on
both surfaces, front and back, of the metallic plate 14.
[0058] For fixing the bonding member 13 temporarily, the inserting
projections 15, 15 are inserted into the pillar 4 shown in FIG. 5
by hand or with a hammer. Instead of the inserting projections 15,
15, there may be formed a chevron shaped projection 15' near a
central part of the metallic plate 14 as shown in FIG. 8.
[0059] Also in this second embodiment, by heating the metallic
plate 10 with the electromagnetic induction system 7 to melt the
hot melt adhesive layers 3, it is possible to peel off the gypsum
board 5 easily from the pillars 4, 4 without damage of the board,
the same effects as in the first embodiment can be obtained.
[0060] Third Embodiment
[0061] FIG. 9 illustrates a bonding member 16 according to a third
embodiment of the present invention. The bonding member 16, which
is formed by bending a metallic plate in roughly U shape, comprises
a flat plate portion 18 and a pair of holding plate portions 17, 17
formed on both sides of the flat plate portion 18. The distal end
sides of the holding plates 17, 17 are bent slightly inwards so as
to become narrower. The flat plate portion 18 is formed flat and
hot melt adhesive layers (not shown) are formed on both surfaces,
front and back of the flat plate portion 18.
[0062] For mounting the gypsum board 5 to a pillar 4 with use of
this bonding member 16, the distal end sides of the holding plate
portions 17, 17 are slightly expanded and the pillar 4 is inserted
between the holding plate portions 17, 17. In this case, the pillar
4 is inserted until the whole of the hot melt adhesive layer (not
shown) formed on the back of the flat plate portion 18 comes into
contact with the surface of the pillar 4. Once the pillar 4 is
inserted between the holding plate portions 17, 17, the holding
plate portions are held on the pillar by virtue of an elastic force
thereof, whereby the bonding member 16 is temporarily fixed to the
pillar 4.
[0063] Next, the gypsum board 5 (see FIG. 3) is pushed against the
flat plate portion 18 of the bonding member 16 and in this state
the gypsum board is heated from above by means of the
electromagnetic induction system 7 (see FIG. 3), allowing the
bonding member 16 to be bonded to the pillar 4 and also to the
gypsum board 5. A small, rectangular, double-side coated adhesive
tape may be used to affix to flat plate portion 18 on the side
which comes into contact with the gypsum board 5, thereby allowing
the flat plate portion to lightly hold the gypsum board before the
electromagnetic induction heating.
[0064] FIG. 10 illustrates another method for temporarily fixing
the bonding member at the time of mounting the gypsum board 5 to
the pillar 4. According to this temporarily fixing method, a pin
(inserting member) 19 is driven into the pillar 4 through the
bonding member 1 as shown in FIG. 1 to fix the bonding member to
the pillar temporarily. As examples of other inserting members
employable than the pin 19, there are mentioned nail, wooden screw,
and staple. After the bonding member 1 has been temporarily fixed
to the pillar 4, the gypsum board 5 is pushed against the surface
of the bonding member 1 and is induction-heated from above by means
of the electromagnetic induction system 7.
[0065] In the case where the pillar 4 is a steel frame such as H
shaped steel though it is not shown in the drawings, if the
metallic plate of the bonding member 1 is magnetized to allow the
bonding member to be adhered to the steel frame magnetically, it
becomes easier to effect the temporary fixing of the bonding member
1. After the bonding member 1 has been fixed temporarily, the
gypsum board 5 is pushed against the bonding member 1 and is
subjected to electromagnetic induction heating from above, as noted
above.
[0066] Also in this third embodiment, by heating the flat plate
portion 18 as a metallic plate with use of the electromagnetic
induction system 7 to melt the hot melt adhesive layers 3, the
gypsum board 5 can be peeled off easily from the pillars 4, 4
without damage thereto and it is possible to obtain the same
effects as in the first embodiment.
[0067] Besides, as described above, since the bonding members 1,
13, and 16 are small pieces, they can be removed easy, and even
when they are to be discarded, the discarding work can be done at
low cost in a simple manner.
[0068] Fourth Embodiment
[0069] Next, a building dismantlement method will be described
below with reference to drawings.
[0070] In FIGS. 11 and 12, the numeral 101 denotes a building,
which is provided with a pillar 102 and walls 103. Between the
pillar (support pillar) 102 and a pillar (not shown) are disposed
wooden or steel frame studs (support posts) 104 and 105. A gypsum
board 106 is attached to the support pillar 102 and the stud 104.
Further, the gypsum board 106 and a gypsum board 107 are attached
to the stud 105, as shown in FIG. 13.
[0071] In spaces 108 and 109 formed between opposed sides of the
gypsum boards 106, 107 and the pillar 102 and studs 104, 105 are
disposed a plurality of bonding members 112 as small pieces at
predetermined intervals. As shown in FIGS. 14 and 15, the bonding
members 112 respectively comprise a metallic plate 110 made of iron
or aluminum for example and hot melt adhesive layers 111 formed on
both sides of the metallic plate 110. The metallic plate 110 is
about 0.1 to 2 mm thick and about 1 to 10 cm in length and
width.
[0072] In mounting the gypsum boards 106 and 107, the position of
each metallic plate 110 can be detected easily by using a detecting
means such as a metal detector. Alternatively, a characteristic of
an electromagnetic induction system 120 (see FIG. 16) used for
heating the hot melt adhesive layers 111 may be utilized for metal
detection. In this case, a metallic plate 110 is detected by the
electromagnetic induction system (electromagnetic induction heating
means) 120, then the thus-detected metallic plate 110 is heated
with an electromagnetic induction system 120 to melt the hot melt
adhesive layers 111, and the gypsum boards 106 and 107 are pushed
and bonded to the pillar 102 and studs 104, 105.
[0073] The electromagnetic induction system 120 is of completely
the same configuration as that of the electromagnetic induction
system 7 shown in FIG. 4 and therefore an explanation thereof will
here be omitted.
[0074] The following description is now provided about how to
remove the gypsum boards 106 and 107 for dismantlement of the
building 101.
[0075] First, a high-frequency current is allowed to flow through
the high-frequency coil 21 in the electromagnetic induction system
120. Then, the electromagnetic induction system 120 is moved along
the pillar 102 and studs 104, 105, as shown in FIG. 17. When the
electromagnetic induction system 120 arrives at a position opposing
to a metallic plate 110, an electric current is flowed in the
metallic plate 110 with electromagnetic induction, with consequent
increase of the high-frequency current flowing through the
high-frequency coil 21 in the electromagnetic induction system 120.
Further, the electric current detected by the detecting coil 23
increases and the output voltage Vt provided from the voltage
output circuit 24 takes a value of not lower than the reference
voltage V0. In this state the controller 25 judges that a metallic
plate 110 is present, and causes the display 26 to provide an
indication that the metallic plate 110 is present.
[0076] Once the presence of the metallic plate 110 is indicated on
the display 26, the movement of the electromagnetic induction
system 120 is stopped at that position by the user and is operated
to heat the metallic plate 110 for a predetermined time (several
seconds), causing the hot melt adhesive layers 111 to melt.
Thereafter, the electromagnetic induction system 120 is again moved
along the pillar 102 and studs 104, 105 while searching for the
position of another metallic plate 110 in the same manner as above,
followed by heating the metallic plate 110 and melting the hot melt
adhesive layers 111.
[0077] Since the metallic plate 110 is a small piece and the hot
melt adhesive layers 111 applied to both sides of the metallic
plate function as a heat insulating material, the metallic plate
110 is heated efficiently. Consequently, heating of the hot melt
adhesive layers 111 is done efficiently. Besides, since the heat of
the metallic plate 110 is retained by the hot melt adhesive layers
111 and plural such metallic plates 110 are arranged at
predetermined intervals, heat does not escape to the other metallic
portion than the heated portion in comparison with the case where a
metallic plate is disposed throughout the whole of opposing
surfaces of the gypsum boards 106, 107 and the studs 104, 105, thus
making it possible to effect efficient heating.
[0078] For removal of the gypsum board 106, the gypsum board is
peeled off from the heated portions in a successive manner. At this
time, since the hot melt adhesive layers 111 on each metallic plate
110 are in a melted state, the removal of the gypsum board 106 can
be done easily without being damaged.
[0079] In the same manner as above, also with respect to the gypsum
board 107, all of the metallic plates 110 are heated and the gypsum
board 107 is peeled off.
[0080] As described above, the gypsum boards 106 and 107 can be
peeled off in a simple manner moreover it is done without damage,
the gypsum board 106 and 107 can be recycled.
[0081] Although in the above embodiments the hot melt adhesive
layers 111 are applied to both sides of each metallic plate 110,
only one of either side of the metallic plate may be coated with
such adhesive layer. In this case, an ordinary type of an adhesive
may be applied to the other side.
[0082] Further, although also during detection of a metallic plate
110 the electromagnetic induction system 120 causes a
high-frequency current to flow in the high-frequency coil 21 for
heating the metallic plate, there may be adopted a modification
such that during the detection a weak high-frequency current is
allowed to flow to detect a metallic plate 110 and a high-frequency
current for heating is allowed to flow upon detection of the
metallic plate.
* * * * *