U.S. patent application number 09/157458 was filed with the patent office on 2002-01-03 for a method for encapsulating with a fixing member to secure an electronic device.
Invention is credited to LI, ALLEN.
Application Number | 20020001878 09/157458 |
Document ID | / |
Family ID | 21629675 |
Filed Date | 2002-01-03 |
United States Patent
Application |
20020001878 |
Kind Code |
A1 |
LI, ALLEN |
January 3, 2002 |
A METHOD FOR ENCAPSULATING WITH A FIXING MEMBER TO SECURE AN
ELECTRONIC DEVICE
Abstract
The present invention is to provide a effective method for
packing an electronic device including steps of: (a) putting an
electronic device having a plurality of pins in a frame having a
plurality of connecting members corresponding to said plurality of
pins; (b) electrically connecting the plurality of pins of the
electronic device with the corresponding connecting members; (c)
mounting a fixing member on the electronic device to fix the
electronic device with respect to the frame to form a semi-product;
and (d) packing the semi-product with the fixing member.
Inventors: |
LI, ALLEN; (TAOYUAN SHIEN,
TW) |
Correspondence
Address: |
LAFF WHITESEL CONTE & SARET
401 NORTH MICHIGAN AVENUE
CHICAGO
IL
606114212
|
Family ID: |
21629675 |
Appl. No.: |
09/157458 |
Filed: |
September 21, 1998 |
Current U.S.
Class: |
438/123 ;
257/E21.506 |
Current CPC
Class: |
H01L 2924/01006
20130101; H01L 2224/48247 20130101; H01L 2924/00 20130101; H01L
2924/14 20130101; H01L 2924/01005 20130101; H01L 2224/49171
20130101; H01L 2224/48247 20130101; H01L 24/80 20130101; H01L
2224/49171 20130101; H01L 2924/01033 20130101 |
Class at
Publication: |
438/123 |
International
Class: |
H01L 021/44; H01L
021/48; H01L 021/50 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 12, 1998 |
TW |
87103686 |
Claims
What is claimed is:
1. A method for packing an electronic device comprising steps of:
(a) putting an electronic device having a plurality of pins in a
frame having a plurality of connecting members corresponding to
said plurality of pins; (b) electrically connecting said plurality
of pins of said electronic device with said corresponding
connecting members; (c) mounting a fixing member on said electronic
device to fix said electronic device with respect to said frame to
form a semi-product; and (d) packing said semi-product with said
fixing member.
2. A method of claim 1, wherein said electronic device comprises a
chip having circuits thereon.
3. A method of claim 1, wherein in said step (a), said plurality of
pins are electrically connected to said corresponding connecting
members by welding wires between said pins and said corresponding
connecting members.
4. A method of claim 1, wherein before said step (b) further
comprises a step of (b1) applying a filling medium between said
electronic device and said frame.
5. A method of claim 1, wherein said step (c) further comprising a
step of (c1) mounting another fixing member under said electronic
device.
6. A method of claim 1, wherein in step (c), said fixing member is
an adhering piece made of a molding material.
7. A method of claim 1, wherein said step (d) further comprises
steps of (d1) providing a mold enveloping said electronic device
and said fixing member; (d2) filling a packing medium into said
mold; and (d3) curing said fixing member and said packing medium.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a method for packing
electronic device.
BACKGROUND OF THE INVENTION
[0002] The packing structure of electronic device are genarally
classified into two type as follows:
[0003] 1. Chip
[0004] FIG. 1 shows that the chip (10) having a plurality of
connectors is put on a suport (111) of a frame (11) having a
plurality of connecting pins (112) corresponding to the plurality
of connectors. The connecting member (112) are electrically
connected to the plurality of pins by a plurality of metal wires
(13). Then, a filling medium (14) is applied on the chip (10) or
between the chip (10) and the frame (11) to form a semi-product.
Finally, the semi-product is packed and hardened by a plastic
molding process to form a product.
[0005] 2. General electronic device
[0006] As shown in FIG. 2a and FIG. 2b, the traditional electronic
device having a circuit (20) (including a printed circuit board
(PCB) or not) is electrically connected to the plurality of
connecting members of a frame (21) through a plurality of metal
wires (23). Consequently, a filling medium (24) is applied on the
surface of the electronic device (20) or between the electronic
device and the connecting members (212) to form a semi-product. The
semi-product is further packed by a plastic molding process to form
product.
[0007] However, the methods of traditional packing electronic
device still have some disavantages as following:
[0008] 1. The semi-product must be precisely fixed in the center of
packing structure. If not, it will cause the semi-product to be
exposed during the packing process.
[0009] 2. During the plastic molding process, the filling medium
must be evenly distributed in the mold in order to prevent an
excess of the filling medium in one side of the mold. Otherwise,
the semi-product will be shifted and exposed.
[0010] Therefore, the present invention provides a method for
improving the above-described.
SUMMARY OF THE INVENTION
[0011] The present inventions provide an effective method for
packing the electronic devices by using a fixing member to avoid an
impact in packing process.
[0012] An object of the present invention is to provide a practical
method for packing an electronic device. The method includes the
steps of (a) putting an electronic device having a plurality of
pins in a frame having a plurality of connecting members
corresponding to the plurality of pins, (b) electrically connecting
the plurality of pins of the electronic device with the
corresponding connecting members, (c) mounting a fixing member on
the frame to fix the electronic device with respect to the frame to
form a semi-product, and (d) packing the semi-product with the
fixing member.
[0013] In accordance with an aspect of the present invention, the
electronic device includes a chip or a functional block having
circuits thereon.
[0014] In accordance with another aspect of the present invention,
in the step (b), the plurality of pins are electrically connected
to the corresponding connecting members by welding wires between
the pins and the corresponding connecting members.
[0015] In accordance with another aspect of the present invention,
the step (b) further includes a step of (b1) applying a filling
medium between the electronic device and the frame.
[0016] In accordance with another aspect of the present invention,
the step (c) further includes a step of (c1) mounting another
fixing member under the electronic device.
[0017] In accordance with another aspect of the present invention
in the step (c), the fixing member is an adhering piece made of a
molding material.
[0018] In accordance with another aspect of the present invention,
the step (d) further includes: (d1) providing a mold enveloping the
electronic device and the fixing member; (d2) filling a packing
medium into the mold; and (d3) curing the fixing member and the
packing medium.
[0019] The present invention may best be understood through the
following description with reference to the accompanying drawings,
in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 shows a structure for packing a chip according to
prior art;
[0021] FIG. 2a shows a structure for packing an electronic device
according to prior art;
[0022] FIG. 2b is a side view of a packing structure in FIG.
2a;
[0023] FIG. 3a shows a preferred embodiment of a method for packing
electronic device according to the present invention;
[0024] FIG. 3b is a side view of a packing structure shown in FIG.
3a;
[0025] FIG. 4a shows a preferred embodiment of a method for packing
a chip according to the present invention;
[0026] FIG. 4b shows a structure for packing IC according to the
present invention;
[0027] FIG. 5 shows a structure of an electronic circuit with the
printed circuit board (PCB); and
[0028] FIG. 6 shows a structure of an electronic circuit having a
functional block.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0029] FIG. 3a and FIG. 3b show the first preferable embodiment of
present invention for packing an electronic device. Firstly, an
electronic device having a circuit (30) is put in a frame (31).
FIG. 5 shows the electronic device has a circuit structure in
printed circuit board (PCB). FIG. 6 shows an electronic device with
a functional block which does not include PCB. A plurality of metal
wires (33) was used to make an electrical connection between a
plurality of pins in the electronic device (30) and a plurality of
corresponding connecting members (312) in the frame (31). Then, a
filling medium (34) is applied between the electronic device (31)
and connecting members (312) to fix the electronic device in the
center of the frame (31) to form a semi-product. The above
described method is the same as the prior art. Two fixing members
(35), (36) are respectively attached to the top and bottom surface
of the semi-product to fix the semi-product. Finally, a plastic
molding process is performed to pack the semi-product. The process
includes following steps as: providing a mold enveloping the
electronic device and the fixing member, filling a packing medium
into the mold, and curing the fixing member and the packing
medium.
[0030] The fixing member is an adhering piece made of a molding
material. The fixing members (35), (36) can protect the
semi-product from an impact in the plastic molding. The impact
often causes an exposure of the semi-product or the breakage of the
electrical contact wires. So, according to the present invention,
the semi-product is not so required to be precisely positioned like
the prior art. In addition, the flux design of the mold can also be
simplified. Therefore, the present invention can greatly reduce the
design cost and the manufacturing cost. The fixing member can
effectively fix the semi-product and protect the semi-product from
being impacted. It is unnecessary to allow the semi-product to have
a lot of safely moving space. Thus, the package of the electronic
device can be minimized. This method will greatly simplify the
packing process and reduce the cost of production.
[0031] Moreover, the same method is applied on the package of a
chip. As FIG. 4(a) and FIG. 4(b) show the second preferred
embodiment of the method of present invention for packing a chip.
First of all, a chip (40) having a circuit thereon is put on a
support (411) in the frame (41). Thereafter, a plurality of metal
wires (43) is used to make an electrical connection between a
plurality of pins in the electronic device (40) and a plurality of
corresponding connectors in the frame (412). Then, a filling medium
(44) is applied between the chip and the frame to form a
semi-product. The fixing members (45), (46) are mounted on the chip
to fix the chip with respect to the frame. The final process is to
provide a mold enveloping the electronic device and the fixing
member. Then, filling a packing medium into the mold, the fixing
member and the packing medium are cured to form product.
[0032] While the invention has been described in terms of what are
presently considered to be the most practical and preferred
embodiments, it is to be understood that the invention needs not be
limited to the disclosed embodiment. On the contrary, it is
intended to cover various modifications and similar arrangements
included within the spirit and scope of the appended claims which
are to be accorded with the broadest interpretation so as to
encompass all such modifications and similar structures.
* * * * *