U.S. patent application number 09/866711 was filed with the patent office on 2002-01-03 for resistor array board.
Invention is credited to Suzuki, Etsuji.
Application Number | 20020000906 09/866711 |
Document ID | / |
Family ID | 18675358 |
Filed Date | 2002-01-03 |
United States Patent
Application |
20020000906 |
Kind Code |
A1 |
Suzuki, Etsuji |
January 3, 2002 |
Resistor array board
Abstract
To easily achieve an object for inserting, as one group, a
plurality of protective resistors between circuit forming elements
and properly press contacting opposite ends of each protective
resistor to each circuit forming element. Also to make it easy to
replace the protective resistor when it is broken. A resistor array
board 1 comprises a porous plate 3 having a plurality of
through-holes 2 arranged in array and opening at opposite surfaces
thereof; and a plurality of protective resistors R removably
loosely inserted into the through-holes 12 respectively, each of
protective resistors R being resiliently retained by each
electrically conductive spring element R, and opposite ends of each
of the protective resistors R being press contacted with each of
the circuit forming elements 10, 10' which are arranged in opposing
relation on each surface of said porous plate 3.
Inventors: |
Suzuki, Etsuji;
(Kanagawa-ken, JP) |
Correspondence
Address: |
WENDEROTH, LIND & PONACK, L.L.P.
2033 K STREET N. W.
SUITE 800
WASHINGTON
DC
20006-1021
US
|
Family ID: |
18675358 |
Appl. No.: |
09/866711 |
Filed: |
May 30, 2001 |
Current U.S.
Class: |
338/320 |
Current CPC
Class: |
H05K 1/145 20130101;
H05K 3/325 20130101; H01C 1/01 20130101 |
Class at
Publication: |
338/320 |
International
Class: |
H01C 001/01 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 9, 2000 |
JP |
2000-173060 |
Claims
What is claimed is:
1. A resistor array board comprising a porous plate having a
plurality of through-holes arranged in array and opening at
opposite surfaces thereof; and a plurality of protective resistors
removably loosely inserted into said through-holes, each of said
protective resistors being resiliently retained by each
electrically conductive spring element, and opposite ends of each
of said protective resistors being press contacted with each of
circuit forming elements which are arranged in opposing relation on
each surface of said porous plate.
2. A resistor array board according to claim 1, wherein one end of
said protective resistor is resiliently retained by said
electrically conductive spring, one end of said protective resistor
is press contacted with one of said circuit forming elements
through said electrically conductive spring element and the other
end of said protective resistor is press contacted with the other
circuit forming element.
3. A resistor array board according to claim 1 or 2, wherein said
porous plate is formed of a metal plate, which further comprises
means for connecting said porous plate to a grounding line of one
or both of said circuit forming elements.
4. A resistor array board according to claim 1 or 2, wherein said
porous plate has a through-hole separately formed therein from said
plurality of through holes in which said plurality of protective
resistors loosely inserted therein, a grounding contact is loosely
inserted in said separately formed through-hole, said grounding
contact is resiliently retained by said electrically conductive
spring element, opposite ends of said grounding contact are press
contacted with said circuit forming element by a resilient force of
said electrically conductive spring element, and a grounding line
is formed between said circuit forming elements.
5. A resistor array board according to any one of claims 1 to 4,
wherein said porous plate has a through-hole separately formed
therein from said plurality of through holes in which said
plurality of protective resistors are loosely inserted therein, a
power supply contact is loosely inserted in said separately formed
through-hole, said power supply contact is resiliently retained by
said electrically conductive spring element, opposite ends of said
power supply contact are press contacted with said circuit forming
element by a resilient force of said electrically conductive spring
element, and a power supply line is formed between said circuit
forming elements.
6. A resistor array board according to any one of claims 1 to 5,
wherein said porous plate is formed of a metal plate and an inner
peripheral surface of said through-hole for loosely inserting said
protective resistor of said porous plate is coated with an
insulative material.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] This invention relates to a resistor array board which is
interposed between circuit forming elements such that a plurality
of resistors are inserted between the elements.
[0003] 2. Related Art
[0004] In general, for mounting a conventional protective
resistors, there is employed, among others, a method in which
terminals of protective resistors are inserted into through-holes
of circuit forming elements and the terminals are attached thereto
by soldering and there is also employed a method in which a
plurality of resistors are loaded on a board by soldering and the
board is connected to circuit forming elements.
[0005] As means for mounting, as one group, a plurality of
protective resistors, Japanese Patent Application Unexamined
Publication No. H10-185989 discloses a method in which a plurality
of protective resistors are molded to form a resistor package such
that male terminals of the protective resistors project from
opposite surfaces of the resistor package, and the male terminals
are inserted into through-holes of circuit forming elements and
soldered, and then the resistor package is mounted between the
circuit forming elements.
[0006] However, the above-mentioned conventional methods have such
problems that the work for inserting the protective resistors is
complicated and time consuming. Moreover, in the later method for
mounting the resistor package into the through-holes, although the
protective resistors can be mounted as one group, there are
encountered with such problems that it cannot cope with the
construction in which the opposite ends of the protective resistors
are press contacted with the two circuit forming elements, the
resistor package must be totally discarded when the protective
resistor(s) is broken, and adverse effect caused by heat
accumulation is exerted to electronic parts.
SUMMARY OF THE INVENTION
[0007] It is, therefore, an object of the present invention to
provide a resistor array board, in which a plurality of protective
resistors can easily be inserted as one group merely by interposing
a resistor array board between circuit forming elements and
opposite ends of the protective resistors can properly be press
contacted with the circuit forming elements.
[0008] Another object of the present invention is to provide a
resistor array board, in which a protective resistor(s) can easily
be replaced when broken.
[0009] To achieve the above objects, a resistor array board
according to the present invention comprises a porous plate having
a plurality of through-holes arranged in array and opening at
opposite surfaces thereof; and a plurality of protective resistors
removably loosely inserted into the through-holes.
[0010] Each of the protective resistors is resiliently retained by
each electrically conductive spring element, and opposite ends of
each of the protective resistors are press contacted, either
directly or indirectly, with each of circuit forming elements which
are arranged in opposing relation on each surface of the porous
plate.
[0011] Preferably, one end of the protective resistor is
resiliently retained by the electrically conductive spring, one end
of the protective resistor is press contacted with one of the
circuit forming elements through the electrically conductive spring
element and the other end of the protective resistor is press
contacted with the other circuit forming element.
[0012] The porous plate is formed of a metal plate, the resistor
array board further comprises means for connecting the porous plate
to a grounding line of one or both of the circuit forming elements,
so that the means serves as a shield plate in which a shielding
effect can be obtained by the porous plate.
[0013] The porous plate has a through-hole separately formed
therein from the plurality of through holes in which the plurality
of protective resistors loosely inserted therein, a grounding
contact is loosely inserted in the separately formed through-hole,
the grounding contact is resiliently retained by the electrically
conductive spring element, opposite ends of the grounding contact
are press contacted, either directly or indirectly, with the
circuit forming element by a resilient force of the electrically
conductive spring element, and a grounding line is formed between
the circuit forming elements.
[0014] The porous plate has a through-hole separately formed
therein from the plurality of through holes in which the plurality
of protective resistors are loosely inserted therein, a power
supply contact is loosely inserted in the separately formed
through-hole, the power supply contact is resiliently retained by
the electrically conductive spring element, opposite ends of the
power supply contact are press contacted, either directly or
indirectly, with the circuit forming element by a resilient force
of the electrically conductive spring element, and a power supply
line is formed between the circuit forming elements.
[0015] Preferably, the porous plate is formed of a metal plate and
an inner peripheral surface of the through-hole for allowing the
protective resistor of the porous plate to be loosely inserted
therein is coated with an insulative material.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1 is a sectional view showing one example of a
construction of a resistor array board according to the present
invention interposed between circuit forming elements;
[0017] FIG. 2 is a sectional view showing another example of a
construction of a resistor array board according to the present
invention interposed between circuit forming elements;
[0018] FIG. 3 is a plan view showing a porous plate, in which a
protective resistor is omitted, forming the above resistor array
board;
[0019] FIG. 4 is a plan view showing another example of the porous
plate, in which the protective resistor is omitted;
[0020] FIG. 5 is a sectional view of the above protective
resistor;
[0021] FIG. 6 is an enlarged sectional view of the above porous
plate; and
[0022] FIG. 7 is a sectional view showing a contactor, a grounding
contact or a power source contact having the above resistor array
board.
DETAILED DESCRIPTION OF THE INVENTION
[0023] The present invention will now be described in the form of
one preferred embodiment with reference to FIGS. 1 to 7.
[0024] As shown in FIGS. 1 and 2, a resistor array board 1 of the
present invention is formed by forming a porous plate 3 having a
plurality of through-holes 2 opening to opposite surfaces thereof
and arranged in juxtaposed relation and by removably loosely
inserting the protective resistors R into the corresponding
through-holes 2 in the axial direction.
[0025] Each resistor R is, as shown in FIG. 5, formed by passing
the wiring 6 between adjacent layers of multilayer insulative block
5 which is composed of a laminated body of insulative pieces such
as ceramics. One end of the wiring 6 is connected to an electrode 7
intimately contacted with an upper end of the block 5 and the other
end of the wiring 6 is connected to an electrode 7' intimately
contacted with a lower end of the block 5. The electrodes 7, 7' are
formed of metal having a low melting point such as Sn. The
electrodes 7, 7' are attached to the upper and lower ends of the
multilayer insulative block 5, respectively. The protective
resistor R has, for example, a prismatic or cylindrical
configuration as a whole.
[0026] As shown in FIGS. 3 and 4, the configuration of each
through-hole 2 formed in the porous plate 3 also has, for example,
a prismatic or cylindrical configuration so as to match with the
configuration of the protective resistor R Each protective resistor
R can be removably inserted into the corresponding through-hole 2
of the porous plate 3 in the axial direction so that only broken
protective resistor(s) R can be replaced.
[0027] Each protective resistor R loaded in the corresponding
through-hole 2 is resiliently retained by an electrically
conductive spring element 4. One specific example of its
construction will now be described with reference to FIG. 1.
[0028] A double face multi-point connecting board 8 having a
plurality of contactors 4' (electrically conductive elements) is
formed, and the double face multi-point connecting board 8 is
superposed on the porous plate 3 such that the surface of the
double face multi-point connecting board 8 is confronted (each
plate face is confronted) with the surface of the porous plate 3 to
thereby form the resistor array board 1.
[0029] The double face multi-point connecting board 8 forms the
porous plate 3' having a plurality of through-holes 9 which is open
at the opposing two surfaces, a pin-type contactor 4' having a
compressive elasticity in a thickness direction (axial direction of
the through-hole 9) of the double face multi-point connecting board
8 is loosely and removably inserted into the through-hole 9 in an
axial direction of the through-hole 9.
[0030] As shown in FIG. 7, the contactor 4' uses the pin-type
contactor which is composed of a pin terminal 4" fitted in a sleeve
24 such that the pin terminal 4" is nested in the sleeve 24. For
example, one pair of pin terminals 4" (male terminals) are
inserted, in nesting structure, one in an upper part and the other
in a lower part of the interior of the sleeve 24, a spring 23 such
as a coiled spring is built in the sleeve 24 such that the spring
23 is interposed between the pin terminals 4", and the pin
terminals 4" are resiliently retained by the spring 23 so that the
pin terminals 4" are repulsed upward and downward.
[0031] Each through-hole 9 of the porous plate 3' forming the
multi-point connecting board 8 is provided in such a manner as to
be communicated with each through-hole 2 of the porous plate 3,
thereby forming a porous plate having a two-plate structure. Within
the communicating through-holes 9, 2, one end of the protective
resistor R is resiliently retained by one end of the contactor
4'.
[0032] The resistor array board 1 is interposed between the circuit
forming elements 10, 10', and the resistor array board 1 and the
circuit forming elements 10, 10' are superposed such that their
surfaces are confronted with each other. The upper and lower pin
terminals 4" are pressed from opposite directions. As a result, the
contactor 4' (electrically conductive spring element) is compressed
to store resiliency.
[0033] Then, by the resilient force (biasing force) of the
contactor 4', one end of the protective resistor R is caused to be
press contacted, either directly or indirectly, with the circuit
forming element 10 which is arranged in opposing relation to one
surface (surface of the porous plate 3) of the resistor array board
1 and the other end is caused to be press contacted, through the
contactor 4' (electrically conductive spring element) with the
other circuit forming element 10' which is arranged in opposing
relation to the other surface (surface of the multi-point
connecting board 8) of the resistor array board 1.
[0034] That is to say, by interposing the resistor array board 1
between the circuit forming elements 10, 10', resistors can be
inserted, as one group, between the circuit forming elements 10,
10'. In order to more ensure the press contact of the opposite ends
of each contactor 4', the respective contacting parts may be
soldered.
[0035] Preferably, a screw tightening hole 11 is formed in the
porous plate 3 all the way through the porous plate' forming the
double face multi-point connecting board 8, and a screw 12 is
inserted in the screw tightening hole 11 to integrally connect the
porous plates 3, 3' in their superposed relation, thereby
maintaining a forming state of the resistor array board 1.
[0036] Referring again to FIG. 2, another specific example of a
construction for resiliently retaining the protective resistor R by
the electrically conductive spring element 4 will be described. The
resistor array board 1 is formed by disposing the electrically
conductive spring element 4 for resiliently retaining one end of
the protective resistor R within the through-hole 2 of the porous
plate 3 and disposing the electrically conductive spring element 4,
for example, at the side opposite to the circuit forming element
10' as shown.
[0037] The resistor array board 1 is interposed between the circuit
forming elements 10, 10' such that the surface of the resistor
array board 1 is superposed with the surfaces of the circuit
forming elements 10, 10' in confronting relation. By doing so, the
electrically conductive spring element 4 is held in an resilient
force accumulated state. By the resilient force (biasing force)
thereof, one end of the protective resistor R is press contacted,
either directly or indirectly, with the circuit forming element 10
which is disposed in an opposing relation to one surface (one
surface of the porous plate 3) of the resistor array board 1 and
the other end is press contacted, through the electrically
conductive spring 4, with the other circuit forming element 10'
which is disposed in a confronting relation to the other surface
(other surface of the porous plate 3) of the resistor array board
1.
[0038] That is to say, by interposing the resistor array board 1
between the circuit forming elements 10, 10', the resistors are
inserted, as one group, between the circuit forming elements 10,
10'. In order to more ensure the pressure contact of the opposite
ends of each electrically conductive spring element 4, the
respective contact parts may be soldered.
[0039] The porous plate 3 has a through-hole 13 which is formed
separately from the through-holes 2 into which the protective
resistors R are loosely inserted, and a pin-type grounding contact
14 is loosely inserted in the through-hole 13 in the thickness
direction.
[0040] As shown in FIG. 7, the grounding contact 14 uses the
pin-type contactor which is composed of a pin terminal 4" fitted in
a sleeve 15 such that the pin terminal 14' is nested in the sleeve
24. For example, one pair of pin terminals 14' (male terminals) are
inserted, in nesting structure, one in an upper part and the other
in a lower part of the interior of the sleeve 15, a spring 23 such
as a coiled spring is built in the sleeve 15 such that the spring
23 is interposed between the pin terminals 14', and the pin
terminals 14' are resiliently retained by the spring 23 so that the
pin terminals 14' are repulsed upward and downward.
[0041] The resistor array board 1 is interposed between the circuit
forming elements 10, 10'. The upper and lower pin terminals 14' are
pressed from opposite directions by the circuit forming elements
10, 10' to compress the electrically conductive spring element.
Then, by the resilient force (biasing force) of the electrically
conductive spring element, opposite ends of the grounding contact
14 are caused to be press contacted, either directly or indirectly,
with the circuit forming elements 10, 10' at the respective
surfaces of the resistor array board 1, thereby forming a grounding
line between the circuit forming elements 10, 10'.
[0042] As shown in FIG. 1, in the case where a resistor array board
1 having two-plate structure is formed, the through-hole 13 of the
porous plate 3 and the through-hole 16 of the porous plate 3' of
the double face multi-point connecting plate 8 are in communication
with each other, and the grounding contact 14 is loosely inserted
into the communicating through-holes 13, 16.
[0043] In that case, one end of the grounding contact 14 is press
contacted, either directly or indirectly, with the circuit forming
element 10 at the surface of the porous plate 3 and the other end
of the contact 9 is press contacted, either directly or indirectly,
with the other circuit forming element 10' at the surface of the
porous plate 3'.
[0044] The porous plate 3 has a through-hole 17 which is separately
formed from the through-hole 2 into which the protective resistor R
is loosely inserted and a pin-type power source contact 18 having a
compressive elasticity in a thickness direction is loosely inserted
into the through hole 17.
[0045] As shown in FIG. 7, the power source contact 18 uses the
pin-type contactor which is composed of a pin terminal 18' fitted
in a sleeve 15 such that the pin terminal 18' is nested in the
sleeve 15. For example, one pair of pin terminals 18' (male
terminals) are inserted, in nesting structure, one in an upper part
and the other in a lower part of the interior of the sleeve 15, a
spring 23 such as a coiled spring is built in the sleeve 15 such
that the spring 23 is interposed between the pin terminals 18', and
the pin terminals 14' are resiliently retained by the spring 23 so
that the pin terminals 18' are repulsed upward and downward.
[0046] The resistor array board 1 is interposed between the circuit
forming elements 10, 10'. The upper and lower pin terminals 18' are
pressed from opposite directions by the circuit forming elements
10, 10' to compress the electrically conductive spring element.
Then, by the resilient force (biasing force) of the electrically
conductive spring element, opposite ends of the power source
contact 18 are caused to be press contacted, either directly or
indirectly, with the circuit forming elements 10, 10' at the
respective surfaces of the resistor array board 1, thereby forming
a power source line between the circuit forming elements 10,
10'.
[0047] As shown in FIG. 1, in the case where a resistor array board
1 having two-plate structure is formed, the through-hole 17 of the
porous plate 3 and the through-hole 20 of the porous plate 3' of
the double face multi-point connecting plate 8 are in communication
with each other, and the power source contact 18 is loosely
inserted into the communicating through-holes 17, 20.
[0048] In that case, one end of the power source contact 18 is
press contacted, either directly or indirectly, with the circuit
forming element 10 at the surface of the porous plate 3 and the
other end of the contact 18 is press contacted, either directly or
indirectly, with the other circuit forming element 10' at the
surface of the porous plate 3'.
[0049] The porous plates 3, 3', which constitute the resistor array
board 1 of FIGS. 1 and 2, are formed of an insulative material such
as a synthetic resin.
[0050] As shown in FIG. 6, the porous plates 3, 3' are formed of a
metal plate, and the inner peripheral surfaces of the respective
through-holes 2, into which the protective resistors R are loosely
inserted, of the metal-made porous plates 3, 3' are applied with a
coating 21 composed of an insulative material.
[0051] The opposite surfaces of the metal-made porous plates 3, 3',
the inner peripheral surfaces of the respective through-holes 2
into which the protective resistors R are loosely inserted, the
inner surfaces of the through-hole 9 into which the contactor 4' is
loosely inserted and the through-holes 17, 20, into which the power
source contacts 18 are loosely inserted are applied with a
continuous coating 21 which is composed of an insulative
material.
[0052] Means is provided for connecting the metal-made porous plate
3 to the grounding line of one or both of the circuit forming
elements 10/10, 10'.
[0053] As one example, the metal-made porous plates 3, 3' are
provided at proper places of their surfaces with a grounding
terminal, or as shown in FIG. 6, the inner peripheral surfaces of
the through-holes 13 or 13, 16, into which the grounding contact 14
is loosely inserted, are allowed to expose the electrically
conductive metal surfaces instead of being applied with the
insulative coating 21, and the grounding contact 14 is contacted
with the electrically conductive surfaces, so that signal for
enhancing the grounding effect and shielding effect is delivered at
a high speed.
[0054] The resistor array board 1 has a recess 22 at its surface
opposite to the circuit forming elements 10, 10', electronic parts
such as a power source condenser chip loaded on the circuit forming
elements 10, 10' are received in the recess 22.
[0055] In the resistor array board 1 having a two-plate structure
of FIG. 1, the recess 22 is formed in a surface opposite to the
circuit forming element 10' of the porous plate 3' of the double
face multi-point connecting board 8. Moreover, in the case where a
resistor array board having a plate structure of FIG. 2, the
resistor array board is formed at the surface opposite to the
circuit forming elements 10 of the porous plate 3.
[0056] According to the present invention, the object for
inserting, as one group, a plurality of protective resistors can be
achieved merely by interposing a single resistor array board
between the circuit forming elements, and opposite ends of the
respective resistors can properly be press contacted with the
respective circuit forming elements. Moreover, the protective
resistors are loosely removably inserted into the porous plate so
that the protective resistor(s) can easily be replaced when the
protective resistor(s) is broken.
[0057] The grounding line can easily be formed between the circuit
forming elements through the grounding contact had by the resistor
array board.
[0058] Moreover, the power source line can easily be formed between
the circuit forming elements through the power supply contact had
by the resistor array board.
[0059] Obviously, many modifications and variations of the present
invention can be made in light of the above teachings. It is,
therefore, to be understood that within the scope of the appended
claims, the present invention may be practiced otherwise than as
specifically described hereinbefore.
* * * * *