U.S. patent application number 09/922865 was filed with the patent office on 2001-11-29 for method of manufacturing card-type storage device and card-type storage device.
This patent application is currently assigned to KABUSHIKI KAISHA TOSHIBA. Invention is credited to Iwasaki, Hiroshi, Suzuki, Osami.
Application Number | 20010046152 09/922865 |
Document ID | / |
Family ID | 17379722 |
Filed Date | 2001-11-29 |
United States Patent
Application |
20010046152 |
Kind Code |
A1 |
Iwasaki, Hiroshi ; et
al. |
November 29, 2001 |
Method of manufacturing card-type storage device and card-type
storage device
Abstract
A method of manufacturing a small, thin card-type storage device
is capable of easily manufacturing a frame for the storage device
from a variety of resin materials without molding a very thin
recessed bottom of the supporter. The method prepares a card-type
support frame member from resin and a sheet material, cuts the
sheet material into the size of the support frame member, to form a
support sheet, bonds the support sheet to a bottom surface of the
support frame member, to form a frame, and fits a memory module to
be fixed in an opening of the support frame member in the frame,
thereby completing the card-type storage device.
Inventors: |
Iwasaki, Hiroshi;
(Yokohama-shi, JP) ; Suzuki, Osami; (Tokyo,
JP) |
Correspondence
Address: |
FINNEGAN, HENDERSON, FARABOW, GARRETT &
DUNNER LLP
1300 I STREET, NW
WASHINGTON
DC
20005
US
|
Assignee: |
KABUSHIKI KAISHA TOSHIBA
|
Family ID: |
17379722 |
Appl. No.: |
09/922865 |
Filed: |
August 7, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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09922865 |
Aug 7, 2001 |
|
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09494048 |
Jan 31, 2000 |
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6295221 |
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Current U.S.
Class: |
365/63 |
Current CPC
Class: |
Y10T 29/4913 20150115;
Y10T 29/49176 20150115; Y10T 29/49172 20150115; G06K 19/077
20130101; Y10T 29/49126 20150115; H01L 2924/0002 20130101; Y10T
29/49155 20150115; G06K 19/07745 20130101; H01L 2924/0002 20130101;
H01L 2924/00 20130101 |
Class at
Publication: |
365/63 |
International
Class: |
G11C 005/06 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 16, 1999 |
JP |
P11-262724 |
Claims
What is claimed is:
1. A method of manufacturing a card-type storage device, comprising
the steps of: (a) preparing a card-type support frame member having
an opening; (a') preparing a sheet material; (b) cutting the sheet
material into the size of the support frame member, to form a
support sheet; (c) bonding the support sheet to a bottom surface of
the support frame member, to form a frame; and (d) fitting a memory
module to be fixed in the opening of the support frame member in
the frame, the memory module having at least one semiconductor
memory sealed therein on a first surface of the memory module and a
flat external terminal exposed on a second surface of the memory
module.
2. The method of claim 1, further comprising the step of: (e)
printing an image on the sheet material prepared at the step (a')
in a surface area to be bonded to the support frame member to form
an image-printed surface, the step (e) being carried out before the
step (b).
3. The method of claim 2, wherein the image-printed surface of the
support sheet is bonded to the bottom of the support frame member,
to form the frame in the step (c).
4. The method of claim 2, further comprising the step of: (f)
coating the image-printed surface area with a transparent or
translucent film, the step (f) being carried out before the step
(b).
5. The method of claim 1, further comprising the step of: (g)
printing an image on the support sheet cut at the step (b) to form
an image-printed surface, the step (g) being carried out before the
step (c).
6. The method of claim 5, wherein the image-printed surface of the
support sheet is bonded to the bottom of the support frame member,
to form the frame in the step (c).
7. The method of claim 5, further comprising the step of: (h)
coating the image-printed surface area with a transparent or
translucent film, the step (h) being carried out before the step
(b).
8. The method of claim 5, wherein the support frame member prepared
at the step (a) has a write-protect area adapted for being applied
a write-protect seal indicating that writing data into the
semiconductor memory is prohibited.
9. The method of claim 8, wherein, in the step (e), the image is
printed on an area other than the write-protect area.
10. The method of claim 8, wherein the step (a) affixes the
write-protect seal to the write-protect area.
11. The method of claim 6, further comprising the step of: (h)
coating the image-printed surface area with a transparent or
translucent film, the step (h) being carried out before the step
(c).
12. The method of claim 1, wherein the opening is provided with a
stepped area to hold the semiconductor memory and the flat external
terminal of the memory module, respectively.
13. The method of claim 1, wherein at least one of the support
frame member and sheet material is made from transparent or
translucent material.
14. The method of claim 13, wherein the support frame member and
sheet material are made from materials including at least one of
polycarbonate and polyester.
15. The method of claim 13, further comprising the step of: (e1)
printing an image on the sheet material prepared at the step (a')
in a surface area to be bonded to the support frame member, so that
the image may indicate information stored in the memory module.
16. The method of claim 2, wherein the support frame member
prepared at the step (a) has a write-protect area adapted for being
applied a write-protect seal indicating that writing data into the
semiconductor memory is prohibited.
17. The method of claim 16, wherein, in the step (e), the image is
printed on an area other than the write-protect area.
18. The method of claim 16, wherein the step (a) affixes the
write-protect seal to the write-protect area.
19. A method of manufacturing a card-type storage device,
comprising the steps of: (aa) preparing a card-type support frame
member having an opening; (aa') preparing a sheet material; (bb)
bonding a bottom surface of the support frame member onto the sheet
material; (cc) cutting the sheet material along the support frame
member, to form a frame made of the support frame member and the
cut sheet material serving as a support sheet attached to the
bottom surface of the support frame member; and (dd) fitting a
memory module to be fixed in the opening of the support frame
member in the frame, the memory module having at least one
semiconductor memory sealed therein on a first surface of the
memory module and a flat external terminal exposed on a second
surface of the memory module.
20. The method of claim 19, further comprising the step of: (ee)
printing an image on the sheet material prepared at the step (aa')
in a surface area to be bonded to the support frame member, the
step (ee) being carried out before the step (bb).
21. The method of claim 20, wherein the bottom surface of the
support frame member is bonded onto the image-printed surface of
the sheet material in the step (bb).
22. The method of claim 20, further comprising the step of: (ff)
coating the image-printed surface area with a transparent or
translucent film, the step (ff) being carried out before the step
(bb).
23. The method of claim 19, wherein the opening is provided with a
stepped area to hold the semiconductor memory and the flat external
terminal of the memory module, respectively.
24. The method of claim 19, wherein at least one of the support
frame member and sheet material is made from transparent or
translucent material.
25. The method of claim 24, wherein the support frame member and
sheet material are made from materials including at least one of
polycarbonate and polyester.
26. The method of claim 19, further comprising the step of: (ee1)
printing an image on the sheet material prepared at the step (aa')
in a surface area to be bonded to the support frame member, so that
the image may indicate information stored in the memory module.
27. The method of claim 20, wherein the support frame member
prepared at the step (aa) has a write-protect area adapted for
being applied a write-protect seal indicating that writing data
into the semiconductor memory is prohibited.
28. The method of claim 27, wherein, in the step (ee), the image is
printed on an area other than the write-protect area.
29. The method of claim 27, wherein the step (aa) affixes the
write-protect seal to the write-protect area.
30. A method of manufacturing card-type storage devices, comprising
the steps of: (aaa) preparing, from resin, a frame member set made
of consecutively joined card-type support frame members each having
an opening; (aaa') preparing a sheet material whose size is
substantially equal to or larger than the frame member set; (bbb)
bonding a bottom surface of the frame member set onto the sheet
material; (ccc) cutting the frame member set along the support
frame members to simultaneously form frames each made of the
support frame member and the cut sheet material serving as a
support sheet attached to the bottom surface of the support frame
member; and (ddd) fitting a memory module to be fixed in the
opening of the support frame member of each of the frames, the
memory module having at least one semiconductor memory sealed
therein on a first surface of the memory module and a flat external
terminal exposed on a second surface of the memory module.
31. The method of claim 30, further comprising the step of: (eee)
printing an image on the sheet material prepared at the step (aaa')
in each surface area to be bonded to each support frame member of
the frame member set to form an image-printed surface, the step
(eee) being carried out before the step (bbb).
32. The method of claim 31, wherein the bottom surface of the frame
member set is bonded onto the image-printed surface of the sheet
material in the step (bbb).
33. The method of claim 31, further comprising the step of: (fff)
coating the image-printed surface with a transparent or translucent
film, the step (fff) being carried out before the step (bbb).
34. The method of claim 30, wherein the opening is provided with a
stepped area to hold the semiconductor memory and the flat external
terminal of the memory module, respectively.
35. The method of claim 30, wherein at least one of the frame
member set and sheet material is made from transparent or
translucent material.
36. The method of claim 35, wherein the frame member set and sheet
material are made from materials including at least one of
polycarbonate and polyester.
37. The method of claim 30, further comprising the step of: (eee1)
printing an image on the sheet material prepared at the step (aaa')
in each area to be bonded to each support frame member of the frame
member set, so that the image may indicate information stored in
each memory module.
38. The method of claim 31, wherein each support frame in the frame
member set prepared at the step (aaa) has a write-protect area
adapted for being applied a write-protect seal indicating that
writing data into the semiconductor memory is prohibited.
39. The method of claim 38, wherein, the step (eee), the image is
printed on an area other than the write-protect area.
40. The method of claim 39, wherein the step (aaa) affixes the
write-protect seal to each write-protect area.
41. A method of manufacturing a card-type storage device, including
a card-type support frame member made of resin and having an
opening, a support sheet bonded to a bottom surface of the support
frame member , and a memory module having at least one
semiconductor memory sealed with resin on a first surface of the
memory module and a flat external terminal exposed on a second
surface of the memory module, comprising the steps of: (a)
preparing the support frame member and a sheet material; (b)
cutting the sheet material into the size of the support frame
member, to form the support sheet; (c) bonding the support sheet to
the bottom surface of the support frame member, to form a frame;
and (d) fitting the memory module to be fixed in the opening of the
support frame member in the frame.
42. A card-type storage device, produced according to the process
of claim 1.
43. A card-type storage device, produced according to the process
of claim 19.
44. A card-type storage device, produced according to the process
claim 30.
45. A card-type storage device, comprising: a card-type support
frame member having an opening and made of transparent or
translucent material; a support sheet bonded to a bottom surface of
the support frame member; and a memory module having at least one
semiconductor memory sealed therein on a first surface of the
memory module and a flat external terminal exposed on a second
surface of the memory module, the card-type storage device being
manufactured through the steps of: (a") preparing the support frame
member and a sheet material; (b") cutting the sheet material into
the size of the support frame member, to form the support sheet;
(c") bonding the support sheet to the bottom surface of the support
frame member, to form a frame; and (d") fitting the memory module
to be fixed in the opening of the support frame member in the
frame.
46. A card-type storage device, comprising: (a) a frame including,
a card-type support frame member having an opening and made of
resin, and a support sheet bonded to a bottom surface of the
support frame member; and (b) a memory module including at least
one semiconductor memory sealed therin on a first surface of the
memory module and a flat external terminal exposed on a second
surface of the memory module, the memory module being fitted in the
opening of the support frame member in the frame such that the
second surface thereof aligns with a top surface of the frame.
47. The device of claim 46, wherein the support sheet has an image
printed on the surface thereof bonded to the support frame
member.
48. The device of claim 47, wherein at least one of the support
frame member and support sheet is made from transparent or
translucent material.
49. The device of claim 47, wherein the support frame member has a
write-protect area separately from an area where the image printed
on the support sheet is present.
50. The device of claim 46, wherein the opening is provided with a
stepped area to hold the semiconductor memory and the flat external
terminal of the memory module, respectively.
51. The device of claim 46, wherein at least one of the support
frame member and support sheet is made from transparent or
translucent material.
52. The device of claim 51, wherein the support frame member and
support sheet are made from materials including at least one of
polycarbonate and polyester.
53. The device of claim 46, wherein the frame is one of a plurality
of frames that are simultaneously produced.
54. A card-type storage device, comprising: a card-type support
frame member including a first area and a second area, the first
area having an opening and at least a portion of the second area
being made from transparent or translucent material; and a memory
module fitted in the opening, the memory module including at least
non-volatile semiconductor memory, wherein said semiconductor
memory contains certain information, and the second area has a
picture or characters concerning said information.
55. The device of claim 54, wherein said information is digitized
music information, and said picture indicates a singer or a player
of the music.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a method of manufacturing a
card-type storage device and a card-type storage device. In
particular, the present invention relates to a technique for
facilitating a manufacturing a frame that supports a semiconductor
memory, and for enabling the storage device itself to indicate
contents stored in the storage device, in a thin type card-type
storage that incorporates a semiconductor memory.
[0003] 2. Description of the Background Art
[0004] FIGS. 1 and 2 show the structure of a conventional standard
card-type storage device, in which FIG. 1 is a perspective view and
FIG. 2 a sectional view.
[0005] This type of storage device is disclosed in, for example,
U.S. Pat. No. 5,550,709.
[0006] A conventional technique for manufacturing such a card-type
storage device injection-molds a card-type frame 111 of solid body
from plastic. The frame 111 has an opening 111a to receive a memory
module 113. The memory module 113 has a semiconductor memory 113a
and a flat electrode 113b and is fitted into the opening 111a of
the frame 111 to be fixed such that the flat electrode 113b is
exposed.
[0007] Above-mentioned conventional technique for manufacturing the
car-type storage device, however, has the following problems.
[0008] Apparatuses such as digital cameras that employ card-type
storage devices are becoming smaller, and therefore, the card-type
storage devices are required to be smaller and thinner. In the thin
storage device of FIGS. 1 and 2, the frame 111, which is
injection-molded into solid body, must have a very thin recessed
bottom 111b under the opening 111a for receiving the memory module
113. To form such a thin bottom 111b, a precision metal mold must
be prepared through difficult processes, and the inside of the
metal mold must be kept under a low pressure when injecting resin
into it. This complicates the structure of a molding mechanism and
makes the resin injection work difficult.
[0009] There is a risk of injection-molding the thin bottom 111b
into an unwanted shape depending on resin material used for the
frame 111. More particularly, to correctly form the thin bottom
111b, molten resin must be injected into the corners of a metal
mold. To achieve this, the resin must be heated to reduce the
viscosity thereof and must be injected into the injection point of
the metal mold with great pressure. At this time, however, the
resin will burn due to frictional heat if the resin has low heat
resistance. If heat-resistive resin is used to avoid the problem,
it may deform the thin bottom 111b because the heat-resistive resin
has high viscosity.
[0010] There are only limited resin materials that may correctly
form a card-type frame having a thin recessed bottom. Such
materials include MULTIRON TN-3813-B of Teijin Chemical Company.
This resin material, however, has limited applications because it
is incapable of forming transparent or translucent card-type frame
that withstands a high temperature of 100 degrees centigrade or
higher.
[0011] In this way, the conventional technique is hardly capable of
manufacturing thin, small card-type storage devices having a thin
recessed bottom 111b.
[0012] Making a card-type storage device with transparent or
translucent material provides an advantage to show an image printed
on the storage device to a user so that the user may easily
recognize the contents of information stored therein, as a
characteristic of above mentioned card-type storage device.
However, the conventional technique allows only limited materials
to form card-type frame 111 of solid body. Accordingly, the
conventional technique is unable to freely form transparent or
translucent card-type storage devices to meet various applications
for card-type frame thereof.
SUMMARY OF THE INVENTION
[0013] An object of the present invention is to provide a method of
manufacturing a small, thin card-type storage device, capable of
easily manufacturing a frame for the storage device from a variety
of resin materials without forming a very thin recessed bottom of
the frame.
[0014] Another object of the present invention is to provide a
card-type storage device enabling the storage device to indicate
contents stored therein.
[0015] In order to accomplish the objects, the present invention
forms a card-type storage device frame with a sheet and a support
frame member. The sheet and support frame member may be made of
transparent or translucent material.
[0016] More precisely, one aspect of the present invention provides
a method of manufacturing a card-type storage device, including the
steps of (a) preparing a card-type support frame member having an
opening, (a') preparing a sheet material, (b) cutting the sheet
material into the size of the support frame member, to form a
support sheet, (c) bonding the support sheet to a bottom surface of
the support frame member, to form a frame, and (d) fitting a memory
module to be fixed in the opening of the support frame member in
the frame. The memory module has at least one semiconductor memory
sealed therein on a first surface of the memory module and a flat
external terminal exposed on a second surface of the memory module.
The memory module is fitted in the opening of the support frame
member in the frame such that the second surface thereof aligns
with a top surface of the frame.
[0017] Another aspect of the present invention provides a method of
manufacturing a card-type storage device, including the steps of
(aa) preparing a card-type support frame member having an opening,
(aa') preparing a sheet material, (bb) bonding a bottom surface of
the support frame member onto the sheet material, (cc) cutting the
sheet material along the support frame member, to form a frame made
of the support frame member and the cut sheet material serving as a
support sheet attached to the bottom surface of the support frame
member, and (dd) fitting a memory module to be fixed in the opening
of the support frame member in the frame. The memory module has at
least one semiconductor memory sealed therein on a first surface of
the memory module and a flat external terminal exposed on a second
surface of the memory module.
[0018] Another aspect of the present invention provides a method of
manufacturing card-type storage devices, including the steps of
(aaa) preparing, from resin, a frame member set made of
consecutively joined card-type support frame members each having an
opening, as well as a sheet material whose size is substantially
equal to or larger than the frame member set; (bbb) bonding a
bottom surface of the frame member set onto the sheet material,
(ccc) cutting the frame set along the support frame members to
simultaneously form frames each made of the support frame member
and the cut sheet material serving as a support sheet attached to
the bottom surface of the support frame member, and (ddd) fitting a
memory module to be fixed in the opening of the support frame
member of each of the frames. The memory module has at least one
semiconductor memory sealed with resin on a first surface of the
memory module and a flat external terminal exposed on a second
surface of the memory module.
[0019] Another aspect of the present invention provides a method of
manufacturing a card-type storage device, including a card-type
support frame member made of resin and having an opening, a support
sheet bonded to a bottom surface of the support frame member, and a
memory module having at least one semiconductor memory sealed with
resin on a first surface of the memory module and a flat external
terminal exposed on a second surface of the memory module. The
method includes the steps of (a) preparing the support frame member
and a sheet material, (b) cutting the sheet material into the size
of the support frame member, to form the support sheet, (c) bonding
the support sheet to the bottom surface of the support frame
member, to form a frame, and (d) fitting the memory module to be
fixed in the opening of the support frame member in the frame.
[0020] Another aspect of the present invention provides a card-type
storage device having a card-type support frame member having an
opening and made of transparent or translucent material, a support
sheet bonded to a bottom surface of the support frame member, and a
memory module having at least one semiconductor memory sealed
therein on a first surface of the memory module and a flat external
terminal exposed on a second surface of the memory module. The
card-type storage device is manufactured by the steps of (a")
preparing the support frame member and a sheet material, (b")
cutting the sheet material into the size of the support frame
member, to form the support sheet, (c") bonding the support sheet
to the bottom surface of the support frame member, to form a frame,
and (d") fitting the memory module to be fixed in the opening of
the support frame member in the frame.
[0021] Another aspect of the present invention provides a card-type
storage device having (a) a frame and (b) a memory module. The
frame includes a card-type support frame member having an opening
and made of resin, and a support sheet bonded to a bottom surface
of the support frame member. The support frame member bottomed with
the support sheet forms the frame. The memory module includes at
least one semiconductor memory sealed therein on a first surface of
the memory module and a flat external terminal exposed on a second
surface of the memory module.
[0022] Other features and advantages of the present invention will
become apparent from the following description taken in conjunction
with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings, which are incorporated in and
constitute a part of the specification, illustrate presently
preferred embodiments of the invention, and together with the
general description given above and the detailed description of the
preferred embodiments given below, serve to explain the principles
of the invention.
[0024] FIGS. 1 is a perspective view showing a conventional
standard card-type storage device;
[0025] FIG. 2 is a sectional view taken along line II-II of FIG. 1
showing a conventional standard card-type storage device;
[0026] FIG. 3 is a perspective view showing a card-type storage
device manufactured according to a method of a first embodiment of
the present invention;
[0027] FIG. 4 is a sectional view taken along line IV-IV of FIG. 3
showing a card-type storage device manufactured according to a
method of a first embodiment of the present invention;
[0028] FIG. 5 shows a first surface of a memory module shown in
FIG. 3;
[0029] FIG. 6 is a process diagram generally showing the process
procedures according to the first embodiment;
[0030] FIG. 7 is a perspective view showing a support sheet
according to the first embodiment;
[0031] FIG. 8 is a perspective view showing a card-type support
frame member according to the first embodiment;
[0032] FIG. 9 is a sectional view taken along line IX-IX of FIG. 8
showing the card-type support frame member according to the first
embodiment;
[0033] FIG. 10 is a perspective view showing a card-type frame
according to the first embodiment;
[0034] FIG. 11 is a sectional view taken along line XI-XI of FIG.
10 showing a card-type frame according to the first embodiment;
[0035] FIG. 12 is a perspective view showing a support sheet with a
printed image;
[0036] FIG. 13 is a top perspective view showing a card-type
storage device having a transparent or translucent frame;
[0037] FIG. 14 is a bottom perspective view showing a card-type
storage device having a transparent or translucent frame;
[0038] FIG. 15 is a perspective view showing a card-type storage
device with another printed image;
[0039] FIG. 16 is a front view showing a card-type storage device
of FIG. 15.
[0040] FIG. 17 is a back view showing a card-type storage device of
FIG. 15.
[0041] FIG. 18 is a process diagram generally showing process
procedures according to a second embodiment of the present
invention;
[0042] FIGS. 19A, 19B and 19C are sectional view explaining
manufacturing steps of the second embodiment;
[0043] FIG. 20 is a process diagram generally showing process
procedures according to a third embodiment of the present
invention;
[0044] FIG. 21 is a plan view explaining manufacturing steps of the
third embodiment;
[0045] FIG. 22 is a sectional view taken along line XXII-XXII of
FIG. 21 explaining manufacturing steps of the third embodiment;
[0046] FIG. 23 is a plan view explaining another manufacturing
steps of the third embodiment; and
[0047] FIG. 24 is a sectional view taken along line XXIV-XXIV of
FIG. 23 explaining another manufacturing steps of the third
embodiment.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0048] Now, the preferred embodiments of the methods of
manufacturing card-type storage devices and the card-type storage
devices themselves according to the present invention will be
explained in detail with reference to FIGS. 3 to 24.
[0049] First Embodiment
[0050] FIG. 3 is a perspective view showing a card-type storage
device manufactured according to the first embodiment of the
present invention and FIG. 4 is a sectional view taken along a line
IV-IV of FIG. 3. FIG. 5 shows a first surface of a memory module
installed in the storage device of FIGS. 3 and 4.
[0051] This storage device is a so-called "SmartMedia" (that is
registered trademark), which is a small, thin card-type storage
device. The storage device comprises the memory module 13 of about,
for example, 0.665 mm thick and a card-type frame 10 of about 0.76
mm+0.08 mm thick.
[0052] The frame 10 comprises a card-type support frame member 11
made of resin having an opening 11a, and a support sheet 12 bonded
to a bottom surface of the support frame member 11. The opening 11a
consists of a recess 11b and a through hole 11c that is formed at
the bottom of the recess 11b and is smaller than the recess 11b.
Making the through hole 11c smaller than the recess 11b is to
firmly fit a semiconductor memory 13b of the memory module 13 to be
fixed in the opening 11a. The support frame member 11 has a
write-protect area 11d for prohibiting data in the memory 13b from
being rewritten, and a label area 11e.
[0053] The memory module 13 has a circuit board 13a having first
and second surfaces. The semiconductor memory 13b is sealed with
resin on the first surface of the circuit board 13a. Each
connection terminal of the semiconductor memory 13b is connected to
a wire 13e, which is connected to a through hole 13d. The through
hole 13d is connected to a flat external terminal 13c, which is
arranged on the second surface of the circuit board 13a. The memory
module 13 is fitted to the support frame 11 such that the second
surface of the memory module 13 aligns with a top surface of the
support frame member 11.
[0054] The memory module 13 fits to be fixed in the opening 11a of
the frame 10 such that the flat external terminal 13c is exposed.
More precisely, as shown in FIG. 4, the circuit board 13a is
engaged in the recess 11b of the opening 11a, and the terminal 13c
is flash with and exposed from the top surface of the frame 10. At
the same time, the semiconductor memory 13b fits to be fixed in the
through hole 11c. Namely, the recess 11b and through hole 11c of
the opening 11a form a stepped structure to properly hold the
semiconductor memory 13b and the terminal 13c of the memory module
13. The semiconductor memory 13b is, for example, a flash memory or
a mask ROM.
[0055] Next, a method of manufacturing the card-type storage device
according to the first embodiment will be explained with reference
to FIGS. 6 to 11.
[0056] FIG. 6 is a process diagram generally showing the
manufacturing method of the first embodiment. FIGS. 7 to 11 show
manufacturing steps according to the first embodiment. FIG. 8 is a
perspective view showing the card-type support frame member 11 and
FIG. 9 is a sectional view taken along a line IX-IX of FIG. 8. FIG.
10 is a perspective view showing the card-type frame 10 and FIG. 11
is a sectional view taken along a line XI-XI of FIG. 10.
[0057] Step S11 prepares a sheet material of 0.10 mm to 0.17 mm
thick. Step S12 cuts the sheet material into the size of the
card-type support frame member 11, to form a support sheet 12 shown
in FIG. 7, for example. At the same time, step S13 prepares the
support frame member 11 having the opening 11a by, for example,
injection molding as shown in FIGS. 8 and 9. The thickness of the
support frame member 11 is, for example, about 0.665 mm, which is
the same as the thickness of the memory module 13.
[0058] Step S14 bonds the support sheet 12 to a bottom surface of
the support frame member 11 with the use of adhesive agent, for
example, to form the card-type frame 10 as shown in FIGS. 10 and
11. In the frame 10, the bottom of the opening 11a of the support
frame member 11 is closed with the support sheet 12. It is
necessary to precisely align the support sheet 12 with the support
frame member 11.
[0059] The last step S15 fixes the memory module 13 in the opening
11a of the frame 10 with the use of, for example, adhesive agent,
thereby completing the card-type storage device shown in FIG.
3.
[0060] When the thickness of the storage device must be equalized
to that of a bank card or credit card, i.e., about 0.76 mm.+-.0.08
mm, the recess bottom 111b should be formed (FIG. 2) to 0.13 mm to
0.15 mm. Therefor, it is nearly impossible for the conventional
technique to form the card-type supporter having such a thin recess
bottom by injection molding from transparent or translucent
material with respect to the above "SmartMedia".
[0061] On the other hand, the manufacturing method of the first
embodiment is capable of forming a small, thin card-type frame 10
without molding a very thin part of 0.2 mm thick or thinner from
resin material even with small and thin card-type storage device
such as "SmartMedia". As a result, the frame 10 of the first
embodiment is manufacturable with the use of existing metal molds
and injection molding machines. The frame 10 of the first
embodiment is easily molded from an extended range of resin
materials including transparent and translucent resin materials.
Accordingly, the support frame member 11 and support sheet 12 that
form the frame 10 may easily be formed to be transparent or
translucent. When the frame 10 is transparent or translucent, an
image that indicates and displays contents stored in the memory
module 13 may be printed on the frame 10, so that a user may easily
recognize the contents stored in the card-type storage device. In
other words, the first embodiment enables a card-type storage
device to have an indication of contents stored in the storage
device. The indication may be an image representing contents such
as music, book text, images, or voice reading a book.
[0062] Such an image is, for example, a photograph or picture of a
singer who sings the music stored in the storage device in computer
readable electronic format. FIG. 15 is a perspective view showing a
picture 12b of a singer. FIG. 16 is a front view of FIG. 15, as
well as FIG. 17 is a back view of FIG. 15.
[0063] The indication may be other than images. For example, the
indication may be characters or letters. Such characters may be a
code that uniquely identifies a particular music album by a
particular singer or a particular book by a particular writer.
Further, such characters may be just a title of a particular
book.
[0064] To make the support frame member 11 and support sheet 12
transparent or translucent, they may be made from polycarbonate.
The polycarbonate frame member 11 and sheet 12 hardly warp when
they are bonded together into the frame 10, so that the frame 10
may be flat. One of the support frame member 11 and support sheet
12 may be made of polycarbonate, and the other polyester. This
structure enables an image to firmly be printed on the frame
10.
[0065] Next, an example of processing a card-type frame 10
comprising transparent support frame member 11 and sheet 12 will be
explained.
[0066] After a transparent or translucent sheet is cut into the
support sheet 12 in step S12 of FIG. 6, an image 12a of, for
example, FIG. 14 is printed on the support sheet 12 in step S12b.
Thereafter, steps S13, S14, and S15 are successively carried out to
complete the transparent or translucent frame 10. A user can see
the image 12a through the transparent or translucent frame 10 as
shown in a top perspective view of FIG. 13 and a bottom perspective
view of FIG. 14. The image 12a is printed on the support sheet 12,
and then, the support sheet 12 is bonded to the support frame
member 11 to form the frame 10. This improves the value of the
card-type storage device serving as a package medium, that is a
package marketed with contents.
[0067] Instead of printing an image on the support sheet 12 in step
S12b, an image may be printed on a sheet material that is not cut
yet, in step S11b. Namely, step S11b prints the image 12a of FIG.
12 on the sheet material prepared in step S11 in a surface area
where the support frame member 11 is to be bonded, and thereafter,
step S12 cuts the sheet material into the support sheet 12.
[0068] Further, the image 12a may be preferably printed on the
surface of the support sheet 12 that is to be bonded to the support
frame member 11, so that the image 12a may withstand abrasion. Yet
further, the surface of the support sheet 12 on which the image 12a
is printed may be coated with a thin film to prevent adhesive agent
from deteriorating or erasing the image 12a.
[0069] Second Embodiment
[0070] FIGS. 18 to 19C show a method of manufacturing a card-type
storage device according to the second embodiment of the present
invention. The difference of the second embodiment from the first
embodiment will be explained.
[0071] FIG. 18 is a process diagram generally showing the
manufacturing method of the second embodiment, and FIGS. 19A to 19C
explain manufacturing processes of the second embodiment.
[0072] Step S21 prepares a sheet material 12A of 0.10 mm to 0.17 mm
thick as shown in FIG. 19A. The size of the sheet material 12A is
larger than the support frame member 11. Step S22 prepares the
support frame member 11, which is the same as that of FIGS. 8 and
9.
[0073] Step S23 bonds a bottom surface of the support frame member
11 onto the sheet material 12A as shown in FIG. 19B. Step S24 cuts
the sheet material 12A along the support frame member 11 as shown
in FIG. 19C, to complete a card-type frame 10 like the one shown in
FIGS. 10 and 11.
[0074] The last step S25 fits a memory module 13 to be fixed in an
opening 11a of the support frame member 11 with the use of, for
example, adhesive agent, to complete a card-type storage device
like the one shown in FIG. 3.
[0075] In this way, the second embodiment prepares the large sheet
material 12A, bonds the card-type support frame member 11 onto the
sheet material 12A, and cuts the sheet material 12A along the
support frame member 11. Unlike the first embodiment, the second
embodiment requires no precision when attaching the support frame
member 11 to the sheet material 12A, thereby making the
manufacturing of a card-type storage device easier.
[0076] To print an image 12a, step S21 prepares the sheet material
12A first, and step S21b prints the image 12a in an area of the
sheet material 12A where the support frame member 11 is to be
bonded. Thereafter, step S23 bonds the support frame member 11 and
sheet material 12A together, and step S24 cuts the sheet material
12A along the support frame member 11.
[0077] Like the first embodiment, it is preferable to print the
image 12a on the surface area of the sheet material 12A that is to
be bonded to the support frame member 11 and to coat the
image-printed surface of the sheet material 12A with a thin film,
to realize the effects of the first embodiment (FIGS. 13 and
14).
[0078] Third Embodiment
[0079] FIGS. 20 to 24 show a method of manufacturing a card-type
storage device according to the third embodiment of the present
invention. The difference of the third embodiment from the first
and second embodiment will be explained.
[0080] FIG. 20 is a process diagram generally showing the
manufacturing method of the third embodiment, and FIGS. 21 to 24
explain manufacturing processes of the third embodiment.
[0081] Step S31 prepares, from resin, a frame member set made of
consecutively joined card-type support frame members 11 as shown in
FIG. 21. Each boundary between the adjacent frame members 11 is
provided with a tapered cut 11f as shown in FIG. 22. At the same
time, step S32 prepares a sheet material 12A whose size corresponds
to the frame member set. The tapered cuts 11f make the following
cut process easier, reduce stress on the support frame members 11,
and provide smooth cut edges. The size of the sheet material 12A is
substantially equal to or slightly larger than the size of the
frame member set.
[0082] Step S33 bonds a bottom surface of the frame member set onto
the sheet material 12A as shown in FIGS. 23 and 24. Step S34 uses
the cuts 11f as guides to cut and separate the support frame
members 11 and sheet material 12A from one another with the use of
a metal mold, to simultaneously form card-type frames 10 each
consisting of the support frame member 11 and a support sheet 12
attaching to the bottom of the support frame member 11.
[0083] The last step S35 fits a memory module 13 to be fixed in an
opening 11a of the support frame member 11 of each of the frames 10
with the use of, for example, adhesive agent, thereby
simultaneously providing card-type storage devices each having the
structure of FIGS. 3 and 4.
[0084] In this way, the third embodiment prepares a frame member
set consisting of card-type support frame members 11 from resin,
bonds the frame member set onto a sheet material 12A, and
simultaneously cuts the frame member set and sheet material into
card-type frames. Consequently, the third embodiment simultaneously
produces card-type storage devices each having the structure of
FIGS. 3 and 4, to make the manufacturing of card-type storage
devices easier and manufacturing costs lower compared with the
first and second embodiments.
[0085] Printing an image 12a is carried out in the same manner as
the second embodiment. Namely, step S32 prepares a sheet material
12A, and step S32b prints the image 12a in each area of the sheet
material 12A where each frame member 11 is to be fixed. Thereafter,
step S33 bonds a frame member set and the sheet material 12A
together, and step S34 separates support frame members 11 from one
another.
[0086] Like the first embodiment, it is preferable to print the
images 12a on the surface of the sheet material 12A to be bonded to
the frame member set and to coat the image-printed surface of the
sheet material 12A with a thin film, to realize the effects of the
first embodiment (FIGS. 13 and 14).
[0087] In each of the first to third embodiments, the thickness of
the card-type support frame member 11 is equal to the thickness
(0.665 mm) of the memory module 13. The thickness of the support
frame member 11 may be thicker than the memory module 13 by about
0.01 mm to 0.10 mm. In this case, there will be a gap between the
semiconductor memory 13b and the support sheet 12. The gap may
relax warping force applied to the card-type storage device, to
prevent a breakage of the memory module 13.
[0088] In FIGS. 13 and 14, the image 12a is printed on the support
sheet 12 so that the image 12a may not overlap the write-protect
area 11d of the support frame member 11 when the support frame
member 11 and support sheet 12 are bonded together. The
write-protect area 11d is an area where a write-protect conductive
seal is attached to prohibit data stored in the semiconductor
memory 13b from erroneously being rewritten. The conductive seal is
made of adhesive paper coated with aluminum or stainless steel.
Usually, the support frame member 11 is made of nonconductive
material, and therefore, two electrodes are brought in contact with
the write-protect area 11d to check the conductivity of a signal
applied between the two electrodes and determine whether or not it
is write-protected.
[0089] If the image 12a overlaps the write-protect area 11d, the
area 11d may partly hide the image 12a when attaching the
conductive seal to the write-protect area 11d. Although partly
hiding the image 12a causes no electrical or functional problem, it
is not preferable in terms of appearance. Accordingly, it is
preferable to estimate and avoid the write-protect area 11d when
printing an image on the support sheet 12. Namely, it is preferable
to separate the image 12a from the write-protect area 11d.
[0090] Fourth Embodiment
[0091] Next, a novel card-type storage device manufactured
according to the method of any one of the embodiments of the
present invention will be explained.
[0092] According to the manufacturing method of the present
invention, a card-type support frame member and a support sheet are
separately prepared and are bonded together. Accordingly, the
support frame member and sheet may be made of different materials
and may have different colors. For example, the support frame
member may be white and the support sheet red, to form a two-color
card-type storage device. This technique enables users to
distinguish card-type storage devices, which have the same
dimensions and shapes and different functions, from one another.
Among card-type storage devices, there are high-function storage
devices that store individual identification (ID) data. Such
high-function storage devices may be made in two-color structures,
and low-function cards having no identification data in
single-color structures, so that users may easily distinguish them
from others.
[0093] In another case, card-type storage devices incorporating
flash memories that are electrically programmable may be made in
two-color structures, and card-type storage devices incorporating
mask ROMs that are read-only may be made in single-color
structures.
[0094] When providing a card-type support frame member and a
support sheet with different colors, at least the support frame
member may be transparent or translucent so that a user may see an
image printed on the support sheet through the support frame
member. The image may indicate contents to be stored in the storage
device, so that the storage device itself may display
identification data for the contents thereof. Unlike printing an
image on a label and attaching the label to the storage device, the
image serving as contents identification data printed on the
storage device thereof is hardly deteriorated or erased.
[0095] In summary, as explained above in detail, the present
invention cuts a sheet material into the size of a card-type
support frame member and bonds the cut sheet to a bottom surface of
the support frame member, to form a frame for a card-type storage
device. The frame involves no thin part to be molded from resin,
and therefore, is applicable even to form a so-called "SmartMedia"
that is very small and thin. The supporter of the present invention
is easy to manufacture from an extended range of resin materials
with the use of existing metal molds and injecting machines.
[0096] Alternatively, the present invention prepares a sheet
material larger than a card-type support frame member, bonds a
bottom surface of the support frame member onto the sheet material,
and then cuts the sheet material along the support frame member to
form a frame. This frame provides the same effect as the
above-mentioned frame. This technique eliminates a precise
alignment between the sheet and the support frame member, to make
the manufacturing of a card-type storage device easier.
[0097] Alternatively, the present invention prepares a frame member
set consisting of consecutively joined card-type support frame
members, bonds a bottom surface of the frame member set onto a
sheet material, and then cuts the sheet-bonded frame member set
along each of the support frame members, to simultaneously produce
a plurality frames. In addition to the above-mentioned effects,
this technique simultaneously manufactures a plurality of card-type
storage devices to make the manufacturing of card-type storage
devices easier and reduce the manufacturing costs of the storage
devices.
[0098] The present invention extends a range of resin materials to
manufacture card-type storage devices. Namely, the present
invention enables transparent and translucent resin materials to be
used for manufacturing support frame members and sheets to form
transparent and translucent card-type storage devices.
[0099] According to the present invention, an image may be printed
on a support sheet that forms a transparent or translucent frame of
a card-type storage device, so that the image may be seen through
the frame. This improves the value of the card-type storage device
when marketed as a package medium.
[0100] The image-printed surface of the support sheet may be coated
with a film so that the image may not be deteriorated or erased due
to, for example, adhesive agent.
[0101] It is to be noted that, besides those already mentioned
above, many modifications and variations of the above embodiments
may be made without departing from the novel and advantageous
features of the present invention. Accordingly, all such
modifications and variations are intended to be included within the
scope of the appended claims.
* * * * *