U.S. patent application number 09/912373 was filed with the patent office on 2001-11-29 for bubble cycling heat exchanger.
Invention is credited to Li, Jia Hao.
Application Number | 20010045271 09/912373 |
Document ID | / |
Family ID | 23895285 |
Filed Date | 2001-11-29 |
United States Patent
Application |
20010045271 |
Kind Code |
A1 |
Li, Jia Hao |
November 29, 2001 |
Bubble cycling heat exchanger
Abstract
A bubble cycling heat exchanger is disclosed. A closed fluid
loop is in contact with a heat absorbing source through a heat
conducting block; the loop has a bubble generator, an expanding
area for generating bubbles is installed at loop; the loop is also
formed with a guide region from which bubbles is easily separable
and a radiator; a heat conducting block of the closed loop is
connected to a heat absorbing source; since the overheat of the
heat absorbing source will cause the loop to generate bubble; by an
unequilibrium formed at the guide region of the loop, the bubbles
will separate from the heat absorbing source so that the liquid in
the loop flows for transferring heat so that heat is radiated by
the fins or other elements of the radiator from the primary element
of a computer at the heat absorbing source, the loop operates
continuously until a heat equilibrium is achieved.
Inventors: |
Li, Jia Hao; (Kao Hsiung
Hsien, TW) |
Correspondence
Address: |
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY
MD
21043
US
|
Family ID: |
23895285 |
Appl. No.: |
09/912373 |
Filed: |
July 26, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
09912373 |
Jul 26, 2001 |
|
|
|
09477284 |
Jan 4, 2000 |
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Current U.S.
Class: |
165/104.29 ;
165/104.33; 257/E23.098 |
Current CPC
Class: |
H01L 2924/00 20130101;
F28D 15/0266 20130101; H01L 2924/0002 20130101; F28F 13/00
20130101; H01L 23/473 20130101; H01L 2924/0002 20130101; G06F 1/20
20130101 |
Class at
Publication: |
165/104.29 ;
165/104.33 |
International
Class: |
F28D 015/00 |
Claims
What is claimed is:
1. A bubble cycling heat exchanger, wherein a closed fluid loop is
in contact with a heat absorbing source through a heat conducting
block; the loop has a bubble generator, an expanding area for
generating bubbles is installed at loop; the loop is also formed
with a guide region from which bubbles is easily separable and a
radiator; a heat conducting block of the closed loop is connected
to a heat absorbing source; since the overheat of the heat
absorbing source will cause the loop to generate bubble; by an
unequilibrium formed at the guide region of the loop, the bubbles
will separate from the heat absorbing source so that the liquid in
the loop flows for transferring heat so that heat is radiated by
the fins or other elements of the radiator from the primary element
of a computer at the heat absorbing source, the loop operates
continuously until a heat equilibrium is achieved.
2. The bubble cycling heat exchanger as claimed in claim 1, wherein
the primary element of the computer at the heat absorbing source is
a central processing unit.
3. The bubble cycling heat exchanger as claimed in claim 2, wherein
the loop at the heat conducting block on the central processing
unit is installed with at least one fin.
4. The bubble cycling heat exchanger as claimed in claim 3, wherein
a plurality of loops connected in parallel are installed.
5. The bubble cycling heat exchanger as claimed in claim 3, wherein
one side of the fin set is connected to a blower.
6. The bubble cycling heat exchanger as claimed in claim 3, wherein
a blower is connected above the top surface of the fin set.
7. The bubble cycling heat exchanger as claimed in claim 3, wherein
a blower is connected below the top surface of the fin set.
8. The bubble cycling heat exchanger as claimed in claim 1, wherein
the bubble generator is a spiral wire embedded in the loop.
9. The bubble cycling heat exchanger as claimed in claim 1, wherein
a bubble generator is installed within the heat conducting
block.
10. The bubble cycling heat exchanger as claimed in claim 1,
wherein a guide region is installed in the heat conducting
block.
11. The bubble cycling heat exchanger as claimed in claim 1,
wherein at least one loop is installed in the heat conducting
block.
12. The bubble cycling heat exchanger as claimed in claim 11,
wherein the loops in the heat conducting block are arranged at the
left and right sides.
13. The bubble cycling heat exchanger as claimed in claim 11,
wherein the loops in the heat conducting block are arranged at the
upper and lower sides.
14. The bubble cycling heat exchanger as claimed in claim 1,
wherein at least one loop is formed.
15. The bubble cycling heat exchanger as claimed in claim 14,
wherein the loops are symmetric at the left and right sides.
16. The bubble cycling heat exchanger as claimed in claim 14,
wherein the loops are arranged at left and right sides,
alternatively.
17. The bubble cycling heat exchanger as claimed in claim 14,
wherein a multiple layers of loops arranged at longitudinal
direction is installed.
18. The bubble cycling heat exchanger as claimed in claim 1,
wherein the computer is a notebook computer.
19. The bubble cycling heat exchanger as claimed in claim 18,
wherein a wind channel is installed at a side of a case of the
notebook computer.
20. The bubble cycling heat exchanger as claimed in claim 19,
wherein a blower is installed at the wind channel.
21. The bubble cycling heat exchanger as claimed in claim 20,
wherein the blower is at the wind inlet of the wind channel.
22. The bubble cycling heat exchanger as claimed in claim 20,
wherein the blower is at the wind outlet of the wind channel.
23. The bubble cycling heat exchanger as claimed in claim 19,
wherein the wind inlet of the wind channel is at a bottom of the
case.
24. The bubble cycling heat exchanger as claimed in claim 19,
wherein the wind inlet of the wind channel is at a lateral surface
of the case.
25. The bubble cycling heat exchanger as claimed in claim 19,
wherein the wind outlet of the wind channel is at a lateral surface
of the case.
26. The bubble cycling heat exchanger as claimed in claim 19,
wherein the wind outlet of the wind channel is at two sides of the
case.
27. The bubble cycling heat exchanger as claimed in claim 19,
wherein a bottom wind inlet is installed at a middle section of the
wind channel.
28. The bubble cycling heat exchanger as claimed in claim 19,
wherein in the wind channel, a radiator is formed by a plurality of
stacked and spaced fins.
29. The bubble cycling heat exchanger as claimed in claim 28,
wherein a loop is installed at a top of the wind channel.
30. The bubble cycling heat exchanger as claimed in claim 29,
wherein the loop of the wind channel is connected to at least one
central conductive piece.
31. The bubble cycling heat exchanger as claimed in claim 30,
wherein the conductive piece passes through each fin.
32. The bubble cycling heat exchanger as claimed in claim 19,
wherein the wind channel is bendable.
33. The bubble cycling heat exchanger as claimed in claim 1,
wherein the computer is a personal computer.
34. The bubble cycling heat exchanger as claimed in claim 33,
wherein a wind outlet is installed at a side of the personal
computer.
35. The bubble cycling heat exchanger as claimed in claim 34,
wherein a blower is installed at the wind outlet of the wind
channel.
36. The bubble cycling heat exchanger as claimed in claim 35,
wherein at least one fin passes through the loop.
37. The bubble cycling heat exchanger as claimed in claim 33,
wherein at least one fin passes through the loop.
38. The bubble cycling heat exchanger as claimed in claim 37,
wherein the fin passing through the loop is installed at the wind
inlet in front of a power supply.
39. The bubble cycling heat exchanger as claimed in claim 37,
wherein the fin passing through the loop is installed at the wind
inlet at the rear side of a power supply.
40. The bubble cycling heat exchanger as claimed in claim 33,
wherein the radiator of the loop is a case of a computer.
41. The bubble cycling heat exchanger as claimed in claim 40,
wherein the loop is adhered to one lateral surface of the case.
42. The bubble cycling heat exchanger as claimed in claim 40,
wherein the loop is subdivided into two secondary loops between
which a heat conducting body is connected.
43. The bubble cycling heat exchanger as claimed in claim 42,
wherein the heat conducting body is similar to a heat conducting
block and; is with path to be connected to the bubble generator and
guide region.
44. The bubble cycling heat exchanger as claimed in claim 1,
wherein the primary element of computer to be a the heat absorbing
source is a power radiating element.
45. The bubble cycling heat exchanger as claimed in claim 44,
wherein at least one fin passes through the loop.
46. The bubble cycling heat exchanger as claimed in claim 45,
wherein a blower is added to the fin of the loop.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a bubble cycling heat
exchanger, and especially to a heat exchanger, wherein in a closed
liquid pipe, the cold and heat liquids flows to as to form a
preferred heat exchange.
BACKGROUND OF THE INVENTION
[0002] A prior art heat pipe radiator includes a seal vacuum
chamber filled with proper working fluid. A plurality of radiating
fins are installed thereon. A capillary section is installed in the
chamber. The heating way is to heat one end of the pipe to boil and
evaporate the working fluid. The heat is transferred from a hot
section at one side to a cold section at another side. After the
gas is condensed to become liquid at the cold section. The liquid
flows back due to gravitation or capillary force.
[0003] Thus, due to the structure of the heat pipe, the amount of
heat to be transferred will be deteriorated with the increment of
an operation inclination. Due to the capillary force from the
structure of the heat pipe, if overheat occurs, a dry out will be
induced. Once dry out occurs, no liquid flows back so that the
heating area is full of high temperature gas so that only gas phase
exists. Therefore, temperature will increase dramatically so that
heat supper conduction in the heat pipe fail and thus the effect is
reduced greatly. Furthermore, the non-condensing gas in the heat
pipe must be removed completely otherwise super conduction will be
affected. Moreover, since an operation inclination exist, the heat
pipe is possibly moved or folded. Accordingly, it is apparent that
heat pipe has some original disadvantages necessary to be
improved.
SUMMARY OF THE INVENTION
[0004] Accordingly, the primary object of the present invention is
to provide a bubble cycling heat exchanger, wherein the vapor will
expand so that bubble will separate and thus generate a push force.
Thus, fluid in a seal loop will flow so as to transfer heat from
one radiating section of electronic elements to another radiating
section. Then, the fluid will flow back to the original position.
Many different designs are used for being used in a computer so as
to improve the radiating effect. Therefore, a higher radiating
requirement of a computer is achieved.
[0005] In order to achieve the above said objects, a bubble cycling
heat exchanger is disclosed in the present invention. A closed
fluid loop is in contact with a heat absorbing source through a
heat conducting block; the loop has a bubble generator, an
expanding area for generating bubbles is installed at loop; the
loop is also formed with a guide region from which bubbles is
easily separable and a radiator; a heat conducting block of the
closed loop is connected to a heat absorbing source; since the
overheat of the heat absorbing source will cause the loop to
generate bubble; by an unequilibrium formed at the guide region of
the loop, the bubbles will separate from the heat absorbing source
so that the liquid in the loop flows for transferring heat so that
heat is radiated by the fins or other elements of the radiator from
the primary element of a computer at the heat absorbing source, the
loop operates continuously until a heat equilibrium is
achieved.
[0006] The various objects and advantages of the present invention
will be more readily understood from the following detailed
description when read in conjunction with the appended drawing.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1A is an upper cross sectional view of the first
embodiment according to the present invention.
[0008] FIG. 1B is a front cross sectional view of the first
embodiment according to the present invention.
[0009] FIG. 1C is a left cross sectional view of the first
embodiment according to the present invention.
[0010] FIG. 2A is an upper cross sectional view of the second
embodiment according to the present invention.
[0011] FIG. 2B is a front cross sectional view of the second
embodiment according to the present invention.
[0012] FIG. 2C is a left cross sectional view of the second
embodiment according to the present invention. FIG. 3A is an upper
cross sectional view of the third embodiment according to the
present invention.
[0013] FIG. 3B is a front cross sectional view of the third
embodiment according to the present invention.
[0014] FIG. 3C is a left cross sectional view of the third
embodiment according to the present invention.
[0015] FIG. 4A is an upper cross sectional view of the fourth
embodiment according to the present invention.
[0016] FIG. 4B is a front cross sectional view of the fourth
embodiment according to the present invention.
[0017] FIG. 4C is a left cross sectional view of the fourth
embodiment according to the present invention.
[0018] FIG. 5A is an upper cross sectional view of the fifth
embodiment according to the present invention.
[0019] FIG. 5B is a front cross sectional view of the fifth
embodiment according to the present invention.
[0020] FIG. 5C is a left cross sectional view of the fifth
embodiment according to the present invention.
[0021] FIG. 6A is an upper cross sectional view of the sixth
embodiment according to the present invention.
[0022] FIG. 6B is a front cross sectional view of the sixth
embodiment according to the present invention.
[0023] FIG. 6C is a left cross sectional view of the sixth
embodiment according to the present invention.
[0024] FIG. 7A is a front cross sectional view of the seventh
embodiment according to the present invention.
[0025] FIG. 7B is a left cross sectional view of the seventh
embodiment according to the present invention.
[0026] FIG. 8A is a front cross sectional view of the eighth
embodiment according to the present invention.
[0027] FIG. 8B is a left cross sectional view of the eighth
embodiment according to the present invention.
[0028] FIG. 9A is a front cross sectional view of the ninth
embodiment according to the present invention.
[0029] FIG. 9B is a left cross sectional view of the ninth
embodiment according to the present invention.
[0030] FIG. 10A is a front cross sectional view of the tenth
embodiment according to the present invention.
[0031] FIG. 10B is a left cross sectional view of the tenth
embodiment according to the present invention.
[0032] FIG. 11 A is a front cross sectional view of the eleventh
embodiment according to the present invention.
[0033] FIG. 11 B is a left cross sectional view of the eleventh
embodiment according to the present invention.
[0034] FIG. 12A is a front view of the 12th embodiment according to
the present invention.
[0035] FIG. 12B is a right cross sectional view of the 12th
embodiment according to the present invention.
[0036] FIG. 12C is a front view of the 12th embodiment without fin
according to the present invention.
[0037] FIG. 13A is a front view of the 13th embodiment according to
the present invention.
[0038] FIG. 13B is a right cross sectional view of the 13th
embodiment according to the present invention.
[0039] FIG. 13C is a front view of the 13th embodiment without fin
according to the present invention.
[0040] FIG. 14A is a front view of the 14th embodiment according to
the present invention.
[0041] FIG. 14B is a right view of the 14th embodiment according to
the present invention.
[0042] FIG. 14C is an upper view of the 14th embodiment according
to the present invention.
[0043] FIG. 15A is a front view of the 15th embodiment according to
the present invention.
[0044] FIG. 15B is a right view of the 15th embodiment according to
the present invention.
[0045] FIG. 15C is an upper view of the 15th embodiment according
to the present invention.
[0046] FIG. 16A is a front view of the 16th embodiment according to
the present invention.
[0047] FIG. 16B is an upper view of the 16th embodiment according
to the present invention.
[0048] FIG. 16C is a right view of the 16th embodiment according to
the present invention.
[0049] FIG. 17A is a front view of the 17th embodiment according to
the present invention.
[0050] FIG. 17B is an upper view of the 17th embodiment according
to the present invention.
[0051] FIG. 17C is a right view of the 17th embodiment according to
the present invention.
[0052] FIG. 18A is a front view of the 18th embodiment according to
the present invention.
[0053] FIG. 18B is an upper view of the 18th embodiment according
to the present invention.
[0054] FIG. 18C is a right view of the 18th embodiment according to
the present invention.
[0055] FIG. 19A is a front view of the 19th embodiment according to
the present invention.
[0056] FIG. 19B is an upper view of the 19th embodiment according
to the present invention.
[0057] FIG. 19C is a right view of the 19th embodiment according to
the present invention.
[0058] FIG. 20A is a front view of the 20th embodiment according to
the present invention.
[0059] FIG. 20B is an upper view of the 20th embodiment according
to the present invention.
[0060] FIG. 20C is a right view of the 20th embodiment according to
the present invention.
DETAILED DESCRIPTION OF THE PREFERRED
EMBODIMENTS
[0061] With reference to FIGS. 1 to 6, six embodiments about the
first kind of the bubble cycling heat exchanger of the present
invention are illustrated. In the present invention, a closed fluid
loop 2 is contacted with a heat absorbing source 1 through a heat
conducting block 20. The loop 2 is filled of liquid 22. In the
bubble generator 24, an expanding area 23 for generating bubbles is
installed at loop 2. The loop 2 is also formed with a guide region
from which bubbles is easily separable and a radiator 5. The heat
conducting block 20 at one end of the closed loop 2 is connected to
a heat absorbing source 1. The primary elements of the notebook
computer is on the surface of a central processing unit, in
generally, which is locked to the central processing unit (the type
shown in the figure) by two screws. The heat conducting block 20
can be fixed by a buckle. Another end of the loop 2 is connected to
a radiator 5. The heat conducting block 20 at the center of the
loop 2 has a bubble generator 24. Since the overheat of the heat
absorbing source 1 will cause the loop 2 to generate bubble. By an
unequilibrium formed at the guide region 21 of the loop, the
bubbles will separate from the heat absorbing source so that the
liquid 22 in the loop 2 flows for transferring heat so that heat is
radiated by the radiator 5. The loop 2 operates continuously to an
heat equilibrium condition. An inlet for liquid 3 must be installed
at the loop 2, which is a necessary device for the loop, but is a
secondary factor. The radiator 5 can be assembled with a machine
body 10, a wind inlet 11, a wind channel 13, a wind outlet 12, a
radiating fin 52, and a blower 51 for forming different
embodiment.
[0062] The first embodiment of the present invention is shown in
FIG. 1A,1B and 1C. The heat conducting block 20 is installed with
an input channel. A bubble generator 24 is installed at the channel
at one side. Matching with the radiator 21 at an outlet channel,
the heat absorbing bubbles will flow out from the guide region 21,
and then the bubbles flows through one cycle at a pipe to return to
the inlet channel. The pipe in the loop 2 passes through the wind
channel 13. The pipe is supported on a fin set 52 having many
pieces of fins with heat transferring function with each other so
as to radiating heat from the radiator 5. A cover with parallel
spacers (not shown) is installed at the wind inlet 11 and wind
outlet 12. Thereby, the cold air at the wind inlet 11 will be
absorbed by an axial flow blower 5 at the wind outlet 12 so as to
heat exchange at the wind channel 13. Then, hot air is guided to
flow out from the wind outlet 12.
[0063] The difference of FIG. 2 from FIG. 1 is that the wind
channel is smaller so that the lateral wind inlet 11 at the first
embodiment is changed to a bottom wind inlet 14. The machine body
10 is suspended at the bottom thereof. The difference of FIG. 3
from FIG. 1 is the blower is installed at the bottom wind inlet 14
of the machine body 10, while the wind inlet 14 is at the middle
section of the wind channel 13. Two sides of the wind channel have
respective lateral wind outlet 12 and 15 so that wind can be
drained out rapidly, that is, heat can be radiated more rapidly.
The difference of FIG. 4 from FIG. 1 is a conducting piece 55 is
further installed at the loop, which is adhered to the bottom
surface of the loop, and then passes through the fin set 52 for
conducting heat to each fin 52. The difference of FIG. 5 from FIG.
4 is two heat conducting pieces 56 and 57 are installed at the
loop, and each heat conducting piece passes through the fin set 52
for speeding heat transferring. FIG. 6 is more special, which is
installed with a wind channel 16, moreover, the loop passes through
the fin 52. Therefore, a through hole 54 is installed at the fin 52
for meeting the requirement of a bending channel.
[0064] The second embodiment of the present invention is shown in
FIGS. 7 to 11, and this embodiment is applied to a central
processing unit. The primary of this embodiment is similat to that
of FIG. 1. The loop 2 passes with fin set 52. After heat is
conducted out from the central processing unit CPU of heat
absorbing source 1, the radiator 5 is formed as a blower 61 of the
power supply 6. In FIG. 7, the fin 52 is assembled in the wind
inlet 62 in front of the power supply 6. As shown in FIG. 8, the
fin set 52 is assembled to the wind outlet 63 at the rear side of
the blower 61 of the power supply 6. See FIG. 9, a further blower
51 and a front wind outlet 17 are installed at the front lower side
of the machine body 10. In these three embodiments, a blower 51 or
61 is necessary for achieving the object of pumping air for
cooling. The radiator 5 at FIG. 10 is the housing 10 of a computer
or a seat. The loop 2 is adhered to one lateral plate 18 of the
housing 10, then the metal lateral plate 18 serves to radiate heat.
The difference of FIG. 11 from FIG. 10 is that the loop 2 is
further installed with an indirect loop 7. Namely, two loops 2 and
7 are connected in series for conducting heat so that the pipes on
the loops can be fixed or connected in series conveniently. Namely,
an indirect loop 7 is installed at the lateral plate 18, and a
primary loop 2 is connected from the heat conducting block 20
connected to the central processing unit 1. The two loops 2 and 7
are connected by a heat conducting body 8 having a function
identically to the heat conducting block 8. The heat conducting
body 8 will cause the product to be installed conveniently and be
connected in series conveniently.
[0065] The third embodiment of the present invention is shown in
FIGS. 12 to 17, wherein the heat is radiated from the heat
absorbing source 1 on the central processing unit. The primary
structure of this embodiment is similar to that of FIG. 1. In FIG.
12, three loops 2 are connected in parallel; In the assembly of
loop 2, a plurality of fins 52 serves to be formed as a fin set.
Each fins 52 is buckled to the pipe of the loop through a matched
round ring by welding or sticky which is determined by the material
of the pipes. The heat absorbing source 1 is connected to the heat
conducting block 20 by a clip buckle 19. One side of the top piece
or bottom piece of the fin set is extended with four corners of the
blower 51 for forming a transversal air flow so as to assembly with
the fins 52, and thus, a better radiator 5 is formed. The
difference of FIG. 13 from FIG. 12 is that six loop parallel
connecting structure is installed, but blower 52 is connected to be
above the top plate of the fin 52. Then, each fin is installed with
vent so that air may flow downwards and transversally outwards.
Only the way for pumping wind is different so that the installation
work is easily. Moreover, that shown in FIG. 15 has four loops 2.
The blower 52 is inversely suspended from the lower side of the top
plate in the fin 52. Each fin 52 is installed with via hole and a
containing space for containing the blower 53, and thus the volume
of the radiator 5 is reduced and a preferred radiating effect is
achieved. Furthermore, as that shown in FIG. 16 and FIG. 17, the
example shown is different from that described above wherein fins
52 is the primary body for radiating. In this example, the loop 2
is the body for radiating, thus radiating pipes are more that
aforesaid examples. In FIG. 16, 46 loops are used with 23 loops at
each side. The heat conducting blocks are arranged in the upper and
lower layers, and the loops are arranged in the higher and lower
spaces. Each of four corners of the high and low loops is installed
with a respective blower 51. In FIG. 17, 21 sets of loops (three
layers with each layer has seven loops) are alternatively arranged
at two sides. Each loops 2 is a three layer arrangement to the heat
conducting block so as to complete the radiating effect without any
fin so that the loops can be assembled easily and conveniently.
Thus, the cost is reduced. Each of the four corners of the high
loops is installed with a respective blower 51. At the same
position, the loops of different layer have an identical flow
direction, while adjacent sets have opposite flow directions.
[0066] The fourth embodiment of the present invention is shown in
FIGS. 18 to 20. In this the present invention, the heat is radiated
directly from the radiating element 9 at the seat 90 of a personal
computer 90. The primary structure in loop 2 is similar to that in
FIG. 1, the loop 2 is contacted with at least the surface of the
radiating element 9 (FIG. 18) or passes through a hole (FIG. 19) of
a small heat conducting block 25. The loops in this two embodiments
have a plurality of fins 52. Since the copper or aluminum portions
on the radiating element 9 may radiate heat directly. The loop is
connected to a related position so that heat is dissipated from a
larger radiator 5. FIG. 20 shows a two loop structure which are
connected in parallel and have a common fin set 52.
[0067] The bubble cycling heat exchanger of the present invention
includes a closed flow loop 1 and a bubble generator 6, an
expanding section 4 for providing liquid 3 to loop 2 for generating
bubbles 5. When one end of the closed loop 2 is connected to a heat
source 1. Another end is connected to a radiator 5. The loop 2 has
a bubble generator 6. Since overheat will cause the loop 2 to
generate bubbles, as unequilibrium formed in the guide region in
the loop occurs, the bubble separates from the heat absorbing
source rapidly so that the liquid 3 in the loop flows so as to
transfer heat. By the radiator 5, the heat will be conducted. The
loop operates continuously until heat equilibrium is achieved. The
loop 2 must be installed with an inlet 7 for the liquid 3. This is
a necessary loop device, but is a secondary factor.
[0068] FIG. 1 shows a simple embodiment of the present invention,
wherein a heat absorbing source 1 and a loop 2 with liquid 3 are
included. The radiator 5 is the loop 2 itself or associated
radiating devices. The loop 2 includes a bubble generator 6 or an
expanding area 4. The heat absorbing source 1 is placed at the
middle point the lower section of the loop. The guide region 21 is
a shift due to the shiftness of pipes. It possibly runs rightwards
or leftwards. Those shown in FIG. 2 to FIG. 7 are similar to that
that in FIG. 1. The differences therebetween will be described in
the following: The guide region 21 in FIG. 2 has a loop with a
chamfered section at the right side of the heat absorbing source 1
so that vapor moves thereto, the detail condition is shown in FIG.
3. In FIG. 4, two sides of the heat absorbing sources are unequal,
and thus, the vapor will be guided leftwards. Similarly, the heat
absorbing source of FIG. 5 is at the corner of the loop so that the
vapor directly moves upwards. In FIG. 6, the corner at right side
is larger than that at left side, this design also causes that the
vapor moves rightwards. In FIG. 8, a pair of parallel loops are
installed, this is similar to the embodiment of FIG. 5. The most
important is, as that in FIG. 9, that the loops can be connected in
series and extends. For example, two loops are installed. One loop
is directly contact with one heat absorbing source 1, and then the
radiator of the loop can be a heat transfer body 8. Heat is
transferred to another loop through the heat transferring body 8
and thus heat is radiated by the radiator 5 at another loop. Thus,
a specific serial connection is completed. Therefore, the
production and assembly works are inconvenient without any
arranging loop. Similarly, the same heat absorbing sources have
many loops to be connected in parallel.
[0069] The length of the loop 2 is not limited. The bubble
generator can be formed by the inner wall of the cross section of
the loop with various shapes, or is embedding objects, or is the
connections of pipes with different sizes, or is the loops
connected in series or in parallel, or even is a net shape loop.
The bubble generator 6 can be installed at the loop having liquid.
Namely, the overheat temperature of the boiling bubble in the loop
is not too high so that the actuating temperature of the boiling
bubble become low. Thus, many boiling bubbles are generated and
thus, the cycling in the loop can occur easily and rapidly so that
the temperature of the heat absorbing source is further reduced. At
the inner wall of the loop of the bubble generator 2 can be
installed with convex or concave structures with proper sizes, such
as points, blocks, surfaces, grooves, thread spirals, or other
geometrical structure. Other objects can be embedded into the loop
2, such as rings, sleeves, porous sleeves, spiral wires, spiral
bars, straight fiber wires, spiral bars, straight fiber wires,
sintered objects (slabs, bats, blocks, sleeves, rings), screen
mashes, plates, blocks, balls, particles, or other assemblies or
shapes. Besides, the cross section of the pipe may be any
geometrical shapes, which is regular or irregular polygons, such as
round shapes, oblong shapes, triangular shapes, rectangular shapes,
pentagons, polygons, star-like shapes, inward rectangular shapes,
inward triangular shapes. Moreover, connecting corners can be
formed between a large diameter pipe and a small diameter pipe of
the loop. Therefore, the loop 2 can have the shape of single loop,
double loops, multiple loops or web loops, or is a single layer
loop, double layer loop, multiple layer loop, or porous loop, or
the combinations thereof. Accordingly, many aspects can be used to
embody the bubble generator 6. After bubbles are generated through
a heat source, the fluid in the loop may be cycled rapidly. A
better guide means is required for guiding bubble out of the loop
and driving the cycling operation.
[0070] A guide region for easily guiding the bubbles in the loop 2
is necessary. No matter where the loop is located, a triggering
structure for guiding is necessary so that bubbles generated at the
rear side of the bubble generator 6 can easily separate from the
guide region 21. The guide region 21 will cause the heat flow in
the loop 2 to become more asymmetric both in heating positions and
radiating positions or the loop itself to cause a pressure
unbalance in the loop so that the generated bubbles and liquids
flow toward single one direction. When the thermal flow in the loop
has a higher asymmetry, the bubbles and fluid in the loop will
steadily flow toward single one direction more and more apparently.
Since they flow steadily toward single one direction so that the
efficiency of heat exchanging is greatly improved. Therefore, the
temperature in the loop can be reduced. If the symmetry about the
balance of the whole loop is high, since the symmetry of the heat
flow is insufficient, this will induce that the bubbles and fluid
in the loop 2 swing near the heat absorbing source 1 so as to
oscillate in the loop, and thus the efficiency of heat exchanging
is deteriorated and therefore the system has a higher temperature.
However, it must wait for a long time so that an unbalance flow is
formed in the loop. Moreover, the system has a higher temperature.
The heating contacting portion of the loop is made as an asymmetric
structure in heat flow and thermal flow, such as asymmetric long
loops, asymmetric loop corner angles, diameters of pipelines,
asymmetric geometric shapes, asymmetric cooling, heating
structures, or the combinations of the aforesaid structures, or
asymmetric devices and structures in physics.
[0071] The fluid in the loop can be selected according to the
requirement of operation and pressure. The loop can be exhausted to
vacuum or not be exhausted to vacuum, which is determined according
to the kinds of the fluids or the operating temperature range. The
loop can have any desired shapes, outlooks, material and the
combination thereof. The loop can be rigid, flexible, or the
combination thereof. The loops can be connected in series or
parallel, independently, multiple, or the combination of the
aforesaid structures.
[0072] The radiator can be the loop itself, or the loop can be
extended or prolonged to the place for heating exchanging. The
radiator can be connected to the prior art radiating structures for
heating exchanging.
[0073] The expanding area in the loop can be an expanding vapor
space or reduced vapor space, which can be placed in the inner
space of a loop with a proper size, i.e. the area without filling
liquid completely in loop, or the expanding area is attached to the
loop. Of course, the expanding area does not be included. It is a
device capable of deformation as a proper pressure is applied.
Then, the liquid can be filled in the whole loop without including
the expandable area. Therefore, a volume is provided for the vapor
from heating the liquid within the loop in order to avoid the
breakage of the loop.
[0074] The heat absorbing source of the loop may be connected to
the loop by various known ways for heat transferring. The bubble
generator in various kinds of loops can be installed at the heat
absorbing source to be in contact with the loop. The same effect
for generating bubbles is induced. The connection ways are various,
such as gluing, welding, riveting, buckling, etc., or the
combination thereof.
[0075] The loop must provide a structure for charging and sealing
the system liquid. The inlet and sealing way may be changed
according to the shape of the loop. It is only necessary that after
liquid is injected, the whole loop is sealed. The inlet can be
installed at proper place since the loop is designed as a liquid,
each joint must be sealed for reducing draining of liquid. In the
present invention, many sets of devices can be formed in parallel
or in series. Finally, a thermal equilibrium of the system is
achieved. Wherein the heat absorbing source can be a heating
device, and the radiator is a cooling device, while the medium of
heat transfer is liquid. The power for inducing a cycling is gas so
that the loop system original in a static cooling condition will
absorb heat and generate bubble from the radiator directly or
indirectly so as to push the liquid within the liquid to flow
toward an unequilibrium condition. The loop rotates continuously.
By the loop at another side, the heat of the vapor is dissipated
for cooling. After heat is dissipated, the liquid flows to the hot
place for performing the following heat exchange cycle. Therefore,
a sufficient heat exchanger is acquired, but the dry heating of the
thermal pipe will not occur so that the thermal pipe has no effect.
This will not occur in the present invention, since a large amount
of liquid is filled in the loop 2 of the present invention, this is
absolutely different from the condition that only a slight amount
of liquid 3 is in the thermal pipe.
[0076] Since the prior art thermal pipe has a capillary effect and
the operation orientation. However, the loop of the present
invention can be very long and many radiators are installed. That
is, the heat to be dissipated can be matched with proper designed
radiators. The radiators can be designed in the same position, or
different positions, or is the loop itself or at special locations.
The heat can be transferred to another places for heat exchanging
and thus heat can be transferred to a far end. The loops can be
bent, arranged, and stacked. These features can not be attained by
prior art designs.
[0077] In summary, in the present invention, a simple loop serves
to perform a heat exchange of thermal cycle. It can be used to many
structures, from a very small electronic element to a large power
plant. Therefore, the present invention is good structure of
thermal transfer.
[0078] Although the present invention has been described with
reference to the preferred embodiments, it will be understood that
the invention is not limited to the details described thereof.
Various substitutions and modifications have been suggested in the
foregoing description, and others will occur to those of ordinary
skill in the art. Therefore, all such substitutions and
modifications are intended to be embraced within the scope of the
invention as defined in the appended claims.
* * * * *