U.S. patent application number 09/901968 was filed with the patent office on 2001-11-22 for acoustic transducer and method of making the same.
This patent application is currently assigned to Sensant Corporation. Invention is credited to Ladabaum, Igal.
Application Number | 20010043029 09/901968 |
Document ID | / |
Family ID | 23226538 |
Filed Date | 2001-11-22 |
United States Patent
Application |
20010043029 |
Kind Code |
A1 |
Ladabaum, Igal |
November 22, 2001 |
Acoustic transducer and method of making the same
Abstract
The present invention provides an transducer and a method of
making the same. The transducer is comprised of a plurality of
transducer cells, and conductive interconnects between the cells.
Each transducer cell contains a bottom electrode formed on a layer
of insulator material, a lower insulating film portion formed over
the bottom electrode, a middle insulating film portion that
includes an air/vacuum void region, and an upper insulating film
portion that includes a top electrode formed within a portion of
the upper insulating film portion. A first layer of interconnects
electrically connect the bottom electrodes of each transducer cell
and a second layer of interconnects electrically connect the top
electrodes of each transducer cell. The top and bottom layers of
interconnects are patterned to avoid overlap between them, thus
reducing the parasitic capacitance. Further, as noted, the top
electrode is preferably formed within the upper insulating film
portion, closer to the air/vacuum void than to the top surface of
the insulating film, to increase the electric field for a given
voltage. Still furthermore, the electrodes within each transducer
cell are preferably formed to have dimensions that are smaller than
the overall surface area of the membrane that they excite.
Inventors: |
Ladabaum, Igal; (San Carlos,
CA) |
Correspondence
Address: |
Pillsbury Winthrop LLP
Intellectual Property Group
2550 Hanover Street
Palo Alto
CA
94304-3114
US
|
Assignee: |
Sensant Corporation
|
Family ID: |
23226538 |
Appl. No.: |
09/901968 |
Filed: |
July 9, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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09901968 |
Jul 9, 2001 |
|
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09315896 |
May 20, 1999 |
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6271620 |
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Current U.S.
Class: |
310/334 ;
310/365; 310/369 |
Current CPC
Class: |
Y10T 29/49005 20150115;
G01H 11/06 20130101; Y10T 29/4908 20150115; B06B 1/0292 20130101;
Y10T 29/49156 20150115; Y10T 29/42 20150115; Y10T 29/49007
20150115 |
Class at
Publication: |
310/334 ;
310/365; 310/369 |
International
Class: |
H01L 041/08 |
Claims
I claim:
1. A transducer comprising: a supporting substrate; at least two
transducer cells formed on the substrate, each transducer cell
including: a first electrode formed over the substrate; an
insulating film formed over the first electrode and including a
void region therein; and a second electrode disposed at least
substantially parallel to the first electrode and formed over at
least a portion of the insulating film such that the void region is
disposed between the first electrode and the second electrode; a
first interconnect that electrically connects the first electrodes
of each of the at least two transducer cells; and a second
interconnect that electrically connects the second electrodes of
each of the at least two transducer cells, wherein the first and
second interconnect do not substantially overlap.
2. The transducer of claim 1 further including an insulator
material disposed between the substrate and the transducer
cells.
3. The transducer of claim 2 wherein the substrate is silicon, the
insulator material is silicon oxide and the insulating film is
silicon nitride.
4. The transducer of claim 2 wherein there is no overlap of the
first and second interconnects at areas which do not overlap the
void regions.
5. The transducer of claim 1 wherein the second electrode is formed
within the insulating film.
6. The transducer of claim 5 wherein the first and second
interconnects are formed on the same conductor layer as the first
and second electrodes, respectively.
7. The transducer of claim 6 wherein the first and second
electrodes each have a surface area that is smaller than a surface
area of the corresponding void region.
8. The transducer of claim 7 wherein the first and second
interconnects are formed on the same conductor layer as the first
and second electrodes, respectively.
9. The transducer of claim 1 wherein the first and second
interconnects are formed on the same conductor layer as the first
and second electrodes, respectively.
10. The transducer of claim 1 wherein the first and second
electrodes each have a surface area that is smaller than a surface
area of the corresponding void region.
11. The transducer of claim 1 wherein the first and second
electrodes and the first and second interconnects are made of
aluminum.
12. The transducer of claim 1 wherein the first and second
electrodes and the first and second interconnects are made of
copper.
13. The transducer of claim 1 wherein the first and second
electrodes and the first and second interconnects are made of
tungsten.
14. An transducer comprising: a supporting substrate; and a
transducer cell formed on the substrate, said transducer cell
including: a first electrode formed over the substrate; an
insulating film formed over the first electrode and including a
void region therein; and a second electrode disposed at least
substantially parallel to the first electrode and formed within the
insulating film such that the void region is disposed between the
first electrode and the second electrode, and the thickness of the
insulating film is greater than the spacing between the first and
second electrode.
15. The transducer of claim 14 further including an insulator
material disposed between the substrate and the transducer
cell.
16. The transducer of claim 14 wherein the insulating film is
silicon nitride.
17. The transducer of claim 14 wherein the the first and second
electrodes each have a surface area that is smaller than a surface
area of the corresponding void region.
18. A method of manufacturing a transducer comprising: depositing a
first conductive layer on a substrate; etching the first conductive
layer to form at least two first electrodes and a first
interconnect electrically connecting the at least two first
electrodes; depositing a first insulating film layer of insulator
material on the etched conductor; depositing a sacrificial layer
over the first insulating film; etching the sacrificial layer to
create at least two sacrificial portions, each in substantial
alignment with and overlapping one of the two first electrodes;
depositing a second insulating film layer of insulator material
over the etched sacrificial layer; depositing a second conductive
layer over the second insulating film layer; etching the second
conductive layer to form at least two second electrode that overlap
and substantially align with the first electrodes, and a second
interconnect electrically connecting the two second electrodes,
wherein the second interconnect does not overlap the first
interconnect; and removing the sacrificial portions to form
corresponding void areas.
19. The method of claim 18 wherein further comprising the step of
depositing a third insulating film layer of insulator material over
the etched second conductive layer.
20. The method of claim 19 wherein the step of removing takes place
after the step of depositing the second insulating film layer.
21. The method of claim 18 wherein: the step of creating the
sacrificial layer further creates a sacrificial pathway connected
to the at least two sacrificial portions; and the step of removing
the sacrificial portions includes the steps of: creating a via hole
in the second insulating film layer to the sacrificial pathway; and
etching the sacrificial pathway and the at least two sacrificial
portions.
22. The method of claim 18 wherein the steps of depositing the
first and second conductive layers deposit aluminum.
23. The method of claim 22 wherein the step of depositing the
sacrificial layer deposits aluminum.
24. The method of claim 18 wherein the steps of depositing the
first and second conductive layers deposit copper.
25. The method of claim 18 wherein the steps of depositing the
first and second conductive layers deposit tungsten.
26. The method of claim 18 wherein the steps of depositing the
first and second insulating film layers deposit silicon nitride
using plasma-enhanced chemical vapor deposition.
27. The method of claim 18 wherein the step of depositing the
sacrificial layer deposits a low temperature oxide.
28. The method of claim 19 wherein the step of depositing the
sacrificial layer deposits aluminum.
29. The method of claim 18 wherein the step of etching the
sacrificial layer creates the at least two sacrificial portions
such that each sacrificial portion has a surface area that is
larger than the corresponding first electrode.
30. The method of claim 18 wherein a plurality of transducers are
simultaneously formed in an array.
Description
BACKGROUND OF THE INVENTION
[0001] I. Field of the Invention
[0002] The present invention relates to the field of acoustic
transducers. More specifically, the present invention relates to a
novel electrostatic ultrasonic transducer capable of operating in
high frequency ranges, and novel methods of fabricating such a
transducer.
[0003] II. Description of the Related Art
[0004] An acoustic transducer is an electronic device used to emit
and receive sound waves. An ultrasonic transducer is a type of
acoustic transducer that operates at a frequency range beyond that
of human perception, about 20 KHz Acoustic transducers are used in
medical imaging, non-destructive evaluation, and other
applications. The most common forms of acoustic transducers are
piezoelectric transducers, which operate in low and narrow band
frequencies. Piezoelectric transducers are not efficient in the
conversion between electric and acoustic energy in air.
Furthermore, the operating frequencies of piezoelectric transducers
in air are quite low.
[0005] Air coupled ultrasonic transducers with higher operating
frequencies, which rely on certain microfabrication techniques, are
described by Haller et al. in U.S. Pat. No. 5,619,476 entitled
"Electrostatic Ultrasonic Transducer," issued Apr. 9, 1997, and
Ladabaum et al. in U.S. Pat. No. 5,870,351 entitled "Broadband
Microfabricated Ultrasonic Transducer and Method of Fabrication,"
issued Feb. 9, 1999. Published material known in the art also
demonstrates that immersion transducers can be made with similar
techniques. Air-coupled transducers are usually resonant, while
liquid-coupled transducers are typically not. As shown in FIGS. 1A
and 1B taken from the '476 patent, the transducer disclosed therein
is made of a substrate 11 and a gold contact layer 14 that forms
one one plate of a capacitor, and a membrane including a nitride
layer 13 and a gold contact layer 14B that form the other plate of
the capacitor (while the gold contact layer 14 is the electrode,
with the nitride layer 13 being an insulator, the reference to
electrode 13/14 will be used so as to distinguish the other
electrode 11/14 that has a gold contact layer 14 adjacent the
conductive substrate 11 as illustrated in the above-mentioned
patents). Holes 16 etched in the nitride layer 13 and the gold
layer 14 are used to etch away portions of the sacrificial oxide
layer 12, while remaining posts of the sacrificial layer 12 support
the membrane. By noting the change in capacitance between the two
electrodes 13/14 and 11/14, the ultrasonic resonance of the
membrane can be detected.
[0006] Such microfabricated ultrasonic transducers use resilient
membranes that have very little inertia. The momentum carried by
approximately half of a wavelength of air molecules is able to set
the membrane in motion and visa versa. Electrostatic actuation and
detection enable the realization and control of such resonant
membranes. When distances are small, electrostatic attractions can
exert very large forces on the actuators of interest.
[0007] Microfabricated ultrasonic transducers of this design have
practical problems that prohibit their use at high frequencies,
typically above about 10 MHz, and that reduce their efficiency at
any frequency range. It has been realized by the present inventor
that there are various reasons that prohibit the use of
microfabricated ultrasonic transducers. One reason is that the
electrodes 13/14 and 11/14 are each formed as a conductive sheet.
As illustrated in FIG. 1A, while the gold contact layer 14 covers
the voids where the sacrificial layer 12 has been etched away, the
gold contact layer 14 also entirely covers the posts which support
the membrane. Similarly, the substrate 11 and the gold contact
layer 14 associated therewith is another conductive sheet.
Accordingly, at areas other than where sacrificial etch access
holes 15 exist, there is no area where the electrodes 13/14 and
11/14 do not overlap. This overlap causes a parasitic capacitance,
which is exacerbated due to the fact that the dielectric constant
of the semiconductor insulators between the areas of the
sacrificial layer 12 posts can be approximately one order of
magnitude larger than that of the air/vacuum gap at the center of
the membrane. As frequencies become higher, the parasitic
capacitance becomes significant and sometimes even a dominant
factor in transducer performance. Thus, even if the overlap at the
areas of the sacrificial layer 12 posts accounts for only {fraction
(1/10)} of the active area of the transducer, such overlap may
account for half the capacitance.
[0008] Furthermore, the spacing between the top electrode 13/14 and
the bottom electrode 11/14 is a further reason that the parasitic
capacitance increases. In particular, the membrane has a thickness
that, due to physical constraints, needs to be at least about 2,500
Angstroms thick. Thus, when the gold contact layer 14 is placed
over the nitride layer 13, there is additional parasitic
capacitance due to the thickness of the nitride layer.
[0009] As a result of the above-mentioned parasitic capacitances,
transducers such as those described in Haller et al or Ladabaum et
al are not able to operate at higher frequencies, and operate less
efficiently than ultimately possible at lower frequencies.
Accordingly, there is the need for an improved acoustic
transducer.
SUMMARY OF THE INVENTION
[0010] It is an object of the present invention to provide an
ultrasonic transducer capable of operating at higher
frequencies.
[0011] It is a further object of the present invention to provide
an ultrasonic transducer capable of operating more efficiently than
previously known ultrasonic transducers.
[0012] It is a further object of the present invention to provide
an ultrasonic transducer that has reduced parasitic capacitance
between the electrodes used to alternatively detect and excite the
sound wave.
[0013] It is a further object of the present invention to form a
transducer of a plurality of transducer cells that have an
interconnect structure that reduces parasitic capacitance.
[0014] It is a further object of the present invention to provide a
method for fabricating an ultrasonic transducer that has the
above-mentioned characteristics.
[0015] The present invention achieves the above objects, among
others, with an ultrasonic transducer comprised of a plurality of
transducer cells, and conductive interconnects between the cells.
Each transducer cell contains a bottom electrode formed on a layer
of insulator material, a lower insulating film portion formed over
the bottom electrode, a middle insulating film portion that
includes an air/vacuum void region, and an upper insulating film
portion that includes a top electrode formed within a portion of
the upper insulating film portion. A first layer of interconnects
electrically connect the bottom electrodes of each transducer cell
and a second layer of interconnects electrically connect the top
electrodes of each transducer cell. The top and bottom layers of
interconnects are patterned to avoid overlap between them, thus
reducing the parasitic capacitance.
[0016] Further, as noted, the top electrode is preferably formed
within the upper insulating film portion, closer to the air/vacuum
void than to the top surface of the insulating film, to increase
the electric field for a given voltage.
[0017] Still furthermore, the electrodes within each transducer
cell are preferably formed to have dimensions that are smaller than
the overall surface area of the insulating film that they
excite.
[0018] A method of fabricating the ultrasonic transducer according
to the present invention is initiated by depositing and forming a
pattern of the bottom electrode and interconnects. Thereafter, the
lower insulating film portion of insulator material is deposited. A
sacrificial layer is then deposited over the lower insulating film
portion and etched to a desired pattern. The middle insulating film
portion of insulator material is deposited over the sacrificial
layer pattern, followed by the depositing and forming of the top
layer of electrode and interconnects. Thereafter, an upper
insulating film portion of insulator material is deposited to
complete the formation of the insulating film. Thereafter, the
insulating film is etched to form a via hole that allows an etchant
to reach the sacrificial layer pattern. Etching is then performed
to remove the remaining sacrificial layer pattern to form void
areas. Sometimes such via holes and etching is introduced after the
middle insulating film portion is deposited and before the top
layer of electrode and interconnects is deposited.
[0019] As noted above, the top layer of electrode and interconnects
is formed so that the top layer interconnects do not overlap the
bottom layer interconnects, thus reducing the parasitic
capacitance.
[0020] In a further embodiment of the invention, the ultrasonic
transducer is comprised of a number of interconnected transducer
cells. The transducer cells are electrically connected together to
form a single ultrasonic transducer. Multiple transducers can be
formed on the same substrate in an array. The ultrasonic
transducers, and each of the transducer cells formed therein, are
formed at the same time using the fabrication steps described
above.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The features, objects and advantages of the present
invention will become more apparent from the detailed description
set forth below when taken in conjunction with the drawings in
which like reference characters identify correspondingly throughout
and wherein:
[0022] FIGS. 1A and 1B illustrate a top-view and a cross-section of
an electrostatic transducer as is known in the prior art;
[0023] FIG. 2 is a top-view of an electrostatic transducer
according to a preferred embodiment of the present invention;
[0024] FIG. 3 is a cross-sectional view of an electrostatic
transducer according to a preferred embodiment of the present
invention;
[0025] FIGS. 4-15 illustrate a method of fabricating an
electrostatic transducer according to a preferred embodiment of the
present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0026] Reference will now be made in detail to the preferred
embodiments of the invention, examples of which are illustrated in
the accompanying drawings. While the invention will be described in
conjunction with the preferred embodiments, it will be understood
that they are not intended to limit the invention to those
embodiments. On the contrary, the invention is intended to cover
alternatives, modifications and equivalents, which may be included
within the spirit and scope of the invention as defined by the
appended claims.
[0027] A preferred embodiment of the present invention will first
be described with respect to FIGS. 2-3. FIG. 2 illustrates a
top-view diagram illustrating certain aspects of the present
invention. As illustrated, a transducer 100 is illustrated as
including three connected octagonal-shaped transducer cells 200A-C
are shown. Of course the transducer 100 may have as few as one or
many more than three, such as hundreds or thousands, transducer
cells 200 associated with it. Many such transducers 100 will
typically be formed at the same time on a wafer, with the wafer cut
into different die as is known in the art. The discussions
hereinafter, however, will be made with respect to a single
transducer 100.
[0028] The octagonal shape of the transducer cells 200 illustrated
in FIG. 2 is for illustrative purposes, and it is understood that
the shape of the transducer cell can be a variety of different
shapes, such as hexagonal, round, square, rectangular, triangular,
or any other suitable configuration. In addition, transducer cells
200 may be of different sizes to provide broadband frequency
response. Transducer cells 200 may also be of certain shapes, such
as rectangular, so that they may resonate at a plurality of
frequencies. Any number of transducer cells 200 can be
interconnected, as described in further detail hereinafter, to form
a single transducer.
[0029] One aspect of the present invention illustrated in FIG. 2 is
the usage of top and bottom interconnects 220 and 230 that are used
to electrically connect top and bottom electrodes, respectively, of
adjacent transducer cells 200. Rather than a sheet of conductor
forming both the electrode and the "interconnect" as in the prior
art, the present invention forms transducer cells which each have
their own top and bottom electrodes, and then interconnects having
dimensions smaller than the entire sheet of conductor are used to
electrically connect different electrodes. While the top and bottom
electrodes of the various cell transducers can be electrically
viewed as being single top and bottom electrodes, the discussion
hereinafter will use the top and bottom electrodes to refer to the
electrodes associated with a single transducer cell.
[0030] Preferably, according to the present invention, when viewed
from a top view, the interconnects 220 and 230 also do not overlap
with each other. As used herein, the term "overlap" with respect to
the interconnects will be used in this manner. Accordingly, a
multi-membrane transducer is formed by interconnecting transducer
cells 200A-C on a substrate 300. The transducer cells 200 may be of
the same size, as shown, or be of different sizes. In such a
transducer, each transducer cell 200 is electrically connected to
other transducer cells 200, such that each transducer cell 200 has
a top electrode 350 linked by a top layer interconnect 220, as
illustrated in FIG. 2. Each bottom electrode 320 (not shown in FIG.
2) is connected by a bottom layer interconnect 230. Accordingly,
overlap of the interconnect 220 and 230 is avoided. Thus, even
thought the dielectric constant of semiconductor insulators, such
as nitride, can be approximately one order of magnitude larger than
that of the air/vacuum, by eliminating, or at least minimizing,
overlap of the electrode interconnects, parasitic capacitance is
reduced.
[0031] FIG. 3 illustrates a cross-section taken along line 3-3 of
FIG. 2 of the plurality of transducer cells 200A-C. Each transducer
cell 200 is contains an air/vacuum cavity 340 surrounded by an
insulative insulating film layer 330, with a bottom electrode 320
and a top electrode 350 associated with each transducer cell 200.
Another aspect of the present invention is illustrated in FIG. 3,
with reference to the relative dimensions R, S, and D illustrated
in FIG. 3. The dimension R is the thickness of the membrane, which
is formed of a portion of the insulating layer 330 and the top
electrode disposed therein, that is disposed above the air/vacuum
cavity 340 and that is required for a certain acoustic impedance of
the transducer cells, such impedance governing the frequency range
of the transducer.
[0032] FIG. 2 illustrates a certain known microfabricated
electronic transducer that uses a gold contact layer 14 fabricated
on the top surface of the nitride layer 13 as a top electrode of
the transducer. The nitride layer 13 illustrated in FIG. 2 and the
membrane of the present invention both must operate in the
frequency range of interest, as described previously. In contrast
to the structure illustrated in FIG. 2, however, the present
invention forms the top electrode 350 within the membrane.
Accordingly, whereas the separation distance of the bottom and the
top electrodes is D in the prior art electronic transducer
described in FIG. 2, the separation distance of the bottom and top
electrodes according to the present invention is S. Since the top
electrode is formed within the membrane, the distance S will, for
an otherwise equivalent transducer, always be less than D. By
forming the top electrode within the membrane, as described fully
hereinafter, parasitic capacitance in the present invention is
further reduced.
[0033] Another aspect of the present invention illustrated by FIGS.
2 and 3 is that the surface area of the electrodes 320 and 350 is
smaller than the surface area of the corresponding air/vacuum
cavity 340. As noted hereinafter, this further allows for a
reduction in the parasitic capacitance of the resulting ultrasonic
transducer.
[0034] With the above features of the present invention, it is
therefore possible to obtain a microfabricated acoustic transducer
capable of operating at frequencies greater than 40 MHz, as well as
to operate at lower frequencies with more efficiency. It should be
noted that the dimensions and other specifics of the preferred
embodiment are provided hereinafter for completeness, but that the
present invention can be practiced without those particular
dimensions and specifics as provided in the preferred embodiments.
That notwithstanding, the transducer cells 200 according to the
present invention can have a variety of shapes and dimensions. For
example, membrane will typically have an area that ranges from
about 300 to 30,000 .mu.m.sup.2 with a membrane thickness that
ranges from about 0.05 to 1 .mu.m, a residual stress in the PECVD
nitride ranging from about 10 to 400 MPa and a gap thickness
ranging from about 0.1 to 2 .mu.m. It is understood, however, that
these dimensions are illustrative only and that any dimensions
which meet the characteristics of the invention described herein
can be used, as previously mentioned.
[0035] The process of fabricating an acoustic transducer in
accordance with a preferred embodiment of the present invention
will now be described with reference to FIGS. 4-15. It will be
apparent that various different steps and sequences of steps can be
used to fabricate the acoustic transducer according to the present
invention.
[0036] Starting with FIG. 4, the process begins with a silicon or
other semiconductor support substrate 300. Thereafter, a layer of
thermal oxide 310 is grown, preferably having a thickness in the
range of 5,000-10,000 .ANG., followed by a deposition of a
conductor 320, which may, for example, have a thickness in the
range of 2,500-5,000 .ANG.. In the preferred embodiment, this
conductor is aluminum (Al), but the conductor could also be any
conductor known in the art, such as copper (Cu) or tungsten (W) or
polysilicon.
[0037] A resist pattern is transferred lithographically to the
substrate, and the conductor 320 is etched to leave behind a
patterned bottom electrodes 350 and associated interconnects. FIG.
5 illustrates the resultant patterned bottom electrodes 350A-C and
FIG. 2 illustrates the resultant patterned bottom interconnect.
[0038] Thereafter, as shown with reference to FIG. 6, a lower
insulating film portion 330A of the insulating film 330 is
deposited. This lower insulating film portion 330A is an insulator,
such as nitride, applied using, for instance a plasma-enhanced
chemical vapor deposition (also known as "PECVD"). The applied
lower insulating film portion 330A will typically have a measured
residual stress that is less than 50 MPas. The residual stress may
be adjusted by varying the frequency of the plasma and the relative
concentration of nitrogen and silicon carrying gases. The lower
insulating film portion 330A will typically be deposited to a
thickness of about 0.25 .mu.m. Further, although illustrated for
convenience as being a planarized layer, in fact the deposited
lower insulating film portion 330A will typically not be
planarized, instead having a substantially even thickness over the
various surfaces, so that the contours of the surface to which the
lower insulating film portion 330 is applied will continue to
perpetuate through the application of subsequently applied layers,
as is known in the art. Planarization can be used, but is not
necessary and often introduces substantial additional cost and
potential for defects. Accordingly, since this phenomenon is well
understood, it will not be described further hereinafter.
[0039] As shown in FIG. 7, a sacrificial layer 700, as known in the
art, such as aluminum or low temperature oxide (LTO), is deposited.
The deposit thickness may range from 0.05 to 1 .mu.m. A resist
pattern is transferred lithographically, and the sacrificial layer
700 is etched to leave behind a pattern, such as shown in FIG. 8.
As illustrated, the sacrificial layer contains portions 700A, 700B
and 700C, which will each correspond to a void region that will be
made within each transducer cell 200A, 200B and 200C, respectively.
Also illustrated is a pathway 702, which pathway 702 will allow for
the etchant that removes the sacrificial layer to be introduced
from a location that is physically separate from the transducer
cells.
[0040] A middle insulating film portion 330B is then deposited,
preferably an insulator that is the same as that of the lower
insulating film portion 330A. Thus, according to the preferred
embodiment, PECVD silicon nitride is deposited as the middle
insulating film portion 330B to a thickness of about 0.15 .mu.m
over the patterned sacrificial layer 700 to surround and cover the
patterned sacrificial layer 700, as illustrated by FIG. 9.
[0041] Thereafter, as shown in FIG. 10, the top conductor layer 920
is deposited, and subsequently etched in a pattern to produce a top
electrode 350 and the resulting interconnects, as shown in FIGS. 3
and 11 and described previously. Thus, while the electrodes 320A,
320B and 320C will overlap the electrodes 350A, 350B and 350C,
respectively, the top interconnects 220 will not overlap with the
bottom interconnects 230, as described previously. This is ensured
by selection of an appropriate pattern for the top and bottom
interconnects, one such pattern being illustrated in FIG. 2.
[0042] The top insulating film portion 330C of the insulating film
330 is then deposited, as shown in FIG. 12, and the material for
the top insulating film portion 330C is preferably the same as that
used for the bottom insulating film portion 330A and the middle
insulating film portion 330B, previously described.
[0043] Thereafter, as shown in FIG. 13, using a combination of
forming a resist pattern and a suitable plasma etch, via holes 900
are created to provide for an etchant path to the remaining
portions of the sacrificial layer, such as portions 700A, 700B,
700C and 702 illustrated in FIG. 8. Accordingly, after the via
holes 900 are formed, the remaining portions of the sacrificial
layer are then etched away by a sacrificial wet etch or other
technique known in the art. For example, buffered hydrofluoric acid
can be used in the case of a low temperature oxide (LTO)
sacrificial layer 700. The sacrificial etch results in an
air/vacuum cavities being formed, such as the cavities 340A, 340B
and 340C illustrated in FIG. 14. Thereafter, the via holes 900 can
be filled in, preferably using the same material as the insulating
film 330, if needed, such as for an immersion transducer. Of
course, the additional material added over the top insulating film
portion 330C can also become part of the insulating film 330, or it
can be subsequently etched from all areas except for the sealing
locations.
[0044] While the present invention has been described herein with
reference to particular embodiments thereof, a latitude of
modification, various changes and substitutions are intended in the
foregoing disclosure. For example, only certain features and not
others of the present invention can be used to reduce parasitic
capacitance and still be within the intended scope of the present
invention. Also, this invention can be used in devices other than
acoustic transducers, such as, for example, a capacitive
accelerometer or a capacitive pressure sensor, or other devices
that use capacitive behavior in the transducing process.
Accordingly, it will be appreciated that in some instances some
features of the invention will be employed without a corresponding
use of other features without departing from the spirit and scope
of the invention as set forth in the appended claims.
* * * * *