U.S. patent application number 09/788955 was filed with the patent office on 2001-11-15 for electromagnetic interference cover for an electronics module, method of manufacture therefore and an electronic equipment chassis employing the same.
Invention is credited to Buskmiller, Michael R., Byrne, Vincent M., Fontana, Edward C., Kolides, Dan, Mandelcorn, Yehoshua.
Application Number | 20010040797 09/788955 |
Document ID | / |
Family ID | 23561462 |
Filed Date | 2001-11-15 |
United States Patent
Application |
20010040797 |
Kind Code |
A1 |
Buskmiller, Michael R. ; et
al. |
November 15, 2001 |
Electromagnetic interference cover for an electronics module,
method of manufacture therefore and an electronic equipment chassis
employing the same
Abstract
The present invention provides an electromagnetic interference
(EMI) module cover for use in an electronics module that is
configured to house electrical components that are capable of
generating electromagnetic emissions that cause EMI. In one
embodiment a conductive sidepanel has a resilient cantilever member
formed therefrom with a fixed end that is integrally formed with
the sidepanel and a movable end that is free of a module coupler,
thereby allowing the resilient cantilever member to flex as the
module is installed in a chassis. The resilient cantilever member
has a boss that is formed proximate to the movable free end. The
boss extends outward from the sidepanel a distance sufficient to
provide a conductive path between the conductive sidepanel and an
adjacent conductive surface when the module is installed in the
chassis.
Inventors: |
Buskmiller, Michael R.;
(Dallas, TX) ; Byrne, Vincent M.; (Mesquite,
TX) ; Fontana, Edward C.; (Rockwall, TX) ;
Kolides, Dan; (Mesquite, TX) ; Mandelcorn,
Yehoshua; (Dallas, TX) |
Correspondence
Address: |
HITT GAINES & BOISBRUN P.C.
P.O. BOX 832570
RICHARDSON
TX
75083
US
|
Family ID: |
23561462 |
Appl. No.: |
09/788955 |
Filed: |
February 19, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
09788955 |
Feb 19, 2001 |
|
|
|
09395041 |
Sep 13, 1999 |
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Current U.S.
Class: |
361/818 |
Current CPC
Class: |
H05K 7/1461 20130101;
H05K 9/0016 20130101 |
Class at
Publication: |
361/818 |
International
Class: |
H05K 009/00 |
Claims
What is claimed is:
1. For use in an electronics module configured to house electrical
components capable of generating electromagnetic emissions that
cause electromagnetic interference (EMI), an EMI module cover,
comprising: a conductive sidepanel having a resilient cantilever
member formed therefrom, said resilient cantilever member having a
fixed end integrally formed with said sidepanel and a movable end
free of a module coupler, thereby to allow said resilient
cantilever member to flex as said module is installed in a chassis;
and a boss formed proximate said movable free end and extending
outwardly from said sidepanel a distance sufficient to provide a
conductive path between said conductive sidepanel and an adjacent
conductive surface when said module is installed in said
chassis.
2. The EMI module cover as recited in claim 1 wherein said
sidepanel has a plurality of said resilient cantilever members.
3. The EMI module cover as recited in claim 2 wherein at least one
of said resilient cantilever members has an asymmetrical
orientation to at least one other of said resilient cantilever
members.
4. The EMI module cover as recited in claim 1 wherein said
sidepanel includes two of said resilient cantilever members, said
resilient cantilever members located on opposing ends of said
sidepanel.
5. The EMI module cover as recited in claim 1 wherein said
cantilever member is formed within a perimeter of said
sidepanel.
6. The EMI module cover as recited in claim 1 wherein said
sidepanel further comprises a cantilever member having a fixed end
integrally formed with said sidepanel and a movable end having a
module coupler.
7. For use in an electronics module configured to house electrical
components capable of generating electromagnetic emissions that
cause electromagnetic interference (EMI), a method of manufacturing
an EMI module cover, comprising: forming a conductive sidepanel
having a resilient cantilever member formed therefrom, said
resilient cantilever member having a fixed end integrally formed
with said sidepanel and a movable end free of a module coupler,
thereby to allow said resilient cantilever member to flex as said
module is installed in a chassis; and forming a boss formed
proximate said movable free end and extending outwardly from said
sidepanel a distance sufficient to provide a conductive path
between said conductive sidepanel and an adjacent conductive
surface when said module is installed in said chassis.
8. The method of manufacturing as recited in claim 7 further
comprising forming a plurality of said resilient cantilever
members.
9. The method of manufacturing as recited in claim 8 further
comprising forming at least one of said resilient cantilever
members with an orientation asymmetric to at least one other of
said resilient cantilever members.
10. The method of manufacturing as recited in claim 7 further
comprising forming two of said resilient cantilever members, said
resilient cantilever members located on opposing ends of said
sidepanel.
11. The method of manufacturing as recited in claim 7 further
comprising forming said cantilever member within a perimeter of
said sidepanel.
12. The method of manufacturing as recited in claim 7 further
comprising forming a cantilever member having a fixed end
integrally formed with said sidepanel and a movable end having a
module coupler.
13. An electronic equipment chassis, comprising: a frame; an
electronics module configured to be received within said frame and
configured to house electrical components capable of generating
electromagnetic emissions that cause electromagnetic interference
(EMI), said electronics module having an EMI module cover,
including: a conductive sidepanel having a resilient cantilever
member formed therefrom, said resilient cantilever member having a
fixed end integrally formed with said sidepanel and a movable end
free of a module coupler, thereby to allow said resilient
cantilever member to flex as said module is installed in a chassis;
and a boss formed proximate said movable free end and extending
outwardly from said sidepanel a distance sufficient to provide a
conductive path between said conductive sidepanel and an adjacent
conductive surface when said module is installed in said
chassis.
14. The electronic equipment chassis as recited in claim 13 wherein
said sidepanel has a plurality of said resilient cantilever
members.
15. The electronic equipment chassis as recited in claim 14 wherein
at least one of said resilient cantilever members has an
asymmetrical orientation to at least one other of said resilient
cantilever members.
16. The electronic equipment chassis as recited in claim 13 wherein
said sidepanel includes two of said resilient cantilever members,
said resilient cantilever members located on opposing ends of said
sidepanel.
17. The electronic equipment chassis as recited in claim 13 wherein
said cantilever member is formed within a perimeter of said
sidepanel.
18. The electronic equipment chassis as recited in claim 15 wherein
said sidepanel further comprises a cantilever member having a fixed
end integrally formed with said sidepanel and a movable end having
a module coupler.
19. An electronics module configured to be received within a frame
of an electronics chassis and capable of generating electromagnetic
emissions that cause electromagnetic interference (EMI),
comprising; an electrical components housing having interlocking
opposing sidewalls, at least one of said sidewalls being an EMI
module cover comprising; a conductive sidepanel having a resilient
cantilever member formed therefrom, said resilient cantilever
member having a fixed end integrally formed with said sidepanel and
a movable end free of a sidewalls coupler, thereby to allow said
resilient cantilever member to flex as said electrical components
housing is installed in said electronics chassis; and a boss formed
proximate said movable free end and extending outwardly from said
sidepanel a distance sufficient to provide a conductive path
between said conductive sidepanel and an adjacent conductive
surface when said module is installed in said electronic
chassis.
20. The electronics module as recited in claim 19 wherein said
conductive sidepanel has a plurality of said resilient cantilever
members.
21. The electronics module as recited in claim 20 wherein at least
one of said resilient cantilever members has an asymmetrical
orientation to at least one other of said resilient cantilever
members.
22. The electronics module as recited in claim 19 wherein said
conductive sidepanel includes two of said resilient cantilever
members, said resilient cantilever members located on opposing ends
of said conductive sidepanel.
23. The electronics module as recited in claim 19 wherein said
cantilever member is formed within a perimeter of said conductive
sidepanel.
24. The electronics module as recited in claim 19 wherein said
conductive sidepanel further comprises a cantilever member having a
fixed end integrally formed with said conductive sidepanel and a
movable end having a module coupler.
Description
TECHNICAL FIELD OF THE INVENTION
[0001] The present invention is directed, in general, to electronic
equipment systems and, more specifically, to an electromagnetic
interference (EMI) cover for an electronics module, a method of
manufacturing an EMI cover and an electronic equipment chassis
employing the same.
BACKGROUND OF THE INVENTION
[0002] Electronic equipment in the telecommunications and other
industries is generally designed based upon a modular format. The
modular subassemblies that combine to make up an electronic
assembly are generally housed in a chassis that has multiple racks
with modular compartments.
[0003] The modular design provides several advantages including
reliability, ease of maintenance and economic savings. For example,
if a module in the electronic assembly malfunctions, a service
technician can remove and replace the malfunctioning module without
taking the system employing the module out of service. If
necessary, the malfunctioning module can then be repaired at a
service location by specialized technicians familiar with that type
of module. This permits field maintenance to be carried out by less
skilled personnel and also results in a more reliable system.
[0004] The type of chassis used to accommodate the modules varies
depending on the environment where the equipment is located. One
type of chassis commonly used in the telecommunications business
has a series of modules installed adjacent to one another. This
type of chassis is commonly employed, for example, to house
rectifier modules that combine to make up a rectifier assembly.
[0005] Regardless of the type of electronic equipment the chassis
assembly accommodates, the chassis is used to provide the framework
to deliver electrical power to or from the modules and provide for
electrical connectivity between modules. Because of the type of
electrical components that have to be used in rectifiers or
converters, power supply modules are generally of the type that
will generate electromagnetic emissions that can cause interference
with other nearby electronic devices. For this reason, the various
regulatory agencies will generally specify a maximum level of EMI
emission that a power system is permitted to radiate. Because of
this, one of the major concerns of manufacturers and users of
telecommunications power systems is the level of EMI emission of
such a system.
[0006] One method of controlling radiated EMI emissions in a
modular electronic assembly is the establishment of low impedance
connections to provide a common voltage potential between a chassis
and the various modules housed in the chassis. By providing a
common ground voltage potential, the radiated EMI generated by
differing voltages is reduced.
[0007] One prior art method of providing a common grounding voltage
between each conductive case in a chassis is to couple each module
to the chassis with a separate wire. This approach, however,
exhibits characteristic impedances that are too high to be
effective for efficient EMI control. Another conventional method
employs a conductive, compliant gasketing material. However the use
of gasketing materials adds to both materials and labor costs and
are therefore undesirable. Another EMI control method is to provide
for a direct contact between the chassis and the module cases and
between cases of adjacent modules. However, even in situations
where a common voltage potential can be established between module
cases and the chassis or between adjacent module cases by direct
contact, the degree of design tolerance necessary to provide for a
direct connection common path for the modular case to the chassis
or between adjacent module cases generally increases the total
manufacturing cost and decreases reliability.
[0008] Accordingly, what is needed in the art is a device that is
employable in an electronic equipment chassis that can establish a
common voltage potential between the electronic modules and the
chassis housing the modules to provide an assured grounding
connection that reduces EMI emissions to an acceptable level.
SUMMARY OF THE INVENTION
[0009] To address the above discussed deficiencies of the prior
art, the present invention provides an electromagnetic interference
(EMI) module cover for use in an electronic module that is
configured to house electrical components capable of generating
such EMI emissions. In one embodiment, a conductive sidepanel has a
resilient cantilever member formed therefrom with a fixed end that
is integrally formed with the sidepanel and a movable end that is
free of a module coupler. This configuration allows the resilient
cantilever member to flex as the module is installed in a chassis.
The resilient cantilever member has a boss that is formed proximate
the movable free end. The boss extends outward from the sidepanel a
distance sufficient to provide a conductive path between the
conductive sidepanel and an adjacent conductive surface when the
module is installed in the chassis.
[0010] Thus, in a broad scope, the present invention provides an
EMI module cover that provides a positive contact to assure a
conductive path between the electronic module and the chassis in
which it resides. This positive contact equalizes voltage
potentials between the module and the chassis and, thereby, reduces
EMI emissions.
[0011] One embodiment of the present invention provides that the
EMI module cover have a sidepanel with a plurality of resilient
cantilever members. An aspect of this embodiment provides for at
least one of the resilient cantilever members to have an
asymmetrical orientation to at least one other of the resilient
cantilever members. Another embodiment provides for an EMI module
cover having a sidepanel with two resilient cantilever members that
are located on opposing ends of the sidepanel.
[0012] In one useful embodiment of an EMI module cover, the
invention provides for that the resilient cantilever member be
formed within the perimeter of the sidepanel. This feature assures
contact between the boss on the cantilever member and an adjacent
conductive sidepanel by reducing the possibility of interference
from fasteners or other protuberances along the edges of the
module.
[0013] In yet another embodiment, the sidepanel of the EMI module
cover has a cantilever member with a fixed end that is integrally
formed from the sidepanel and a movable end with a module coupler.
In this embodiment, the module coupler on the movable end is used
to interconnect with another panel in forming an exterior cover or
housing for the module. When the module coupler is engaged by a
cooperating panel, the cantilever member is fixed and is no longer
resilient.
[0014] In yet another embodiment of the invention, an electronics
module is configured to be received within a frame of an
electronics chassis. This module has an electrical components
housing with interlocking opposing sidewalls, at least one of which
is an EMI module cover of the type described above. Another aspect
of the invention provide for an electronics equipment chassis,
consisting of a frame and an electronics module configured to be
received within the frame, where the module has an EMI cover with a
conductive sidepanel as described above.
[0015] The present invention also provides for a method of
manufacturing an EMI module cover for use on an electronics module
configured to house electrical components capable of EMI emissions.
The method, in one embodiment, comprises forming a conductive
sidepanel having a resilient cantilever member integrally formed
therefrom. The resilient cantilever member is formed with its
movable end free from a module coupler, so that the resilient
cantilever member can flex as the module is installed in a chassis
and provide conductive contact with the chassis after installation.
Proximate the movable end, a boss is formed that extends outward
from the sidepanel a sufficient distance so that a conductive path
between the conductive sidepanel and an adjacent conductive surface
is provided.
[0016] The foregoing has outlined, rather broadly, preferred and
alternative features of the present invention so that those skilled
in the art may better understand the detailed description of the
invention that follows. Additional features of the invention will
be described hereinafter that form the subject of the claims of the
invention. Those skilled in the art should appreciate that they can
readily use the disclosed conception and specific embodiment as a
basis for designing or modifying other structures for carrying out
the same purposes of the present invention. Those skilled in the
art should also realize that such equivalent constructions do not
depart from the spirit and scope of the invention in its broadest
form.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] For a more complete understanding of the present invention,
reference is now made to the following descriptions taken in
conjunction with the accompanying drawings, in which:
[0018] FIG. 1A illustrates a an elevational side view of one
embodiment of an EMI module cover constructed in accordance with
the present invention;
[0019] FIG. 1B illustrates top planar view of the EMI cover
illustrated in FIG. 1A;
[0020] FIG. 1C illustrates an isometric view of the embodiment of
an EMI panel illustrated in FIG. 1A;
[0021] FIG. 1D illustrates an isometric side view on an embodiment
of the invention that has two resilient cantilever members on
opposing ends of the sidepanel;
[0022] FIG. 2 illustrates an isometric view of an electronics
module with an embodiment of an EMI cover covered by the invention
that is configured to be received within the framework of a
chassis;
[0023] FIG. 3 illustrates an isometric view of an electronics
chassis configured to receive three electronics modules illustrated
in FIG. 2 where each of the modules has an embodiment of the EMI
covered by the invention; and
[0024] FIG. 4 illustrates an embodiment of a method of
manufacturing an EMI cover.
DETAILED DESCRIPTION
[0025] Referring initially to FIGS. 1A-1C, illustrated are three
different views of an embodiment of an EMI module cover 100
constructed in accordance with the present invention. Illustrated
in FIG. 1A is an elevational side view of the EMI cover 100. FIG.
1B illustrates a top planar view of the EMI cover 100 illustrated
in FIG. 1A. Illustrated in FIG. 1C is an isometric view of the EMI
cover 100. These three figures will be used to explain certain
exemplary embodiments of the present invention.
[0026] The EMI cover illustrated in FIG. 1A, has a sidepanel 110
with a flexible cantilever member 120 formed therefrom. The
cantilever member 120 has a fixed end 125 that is integrally formed
with the sidepanel 110 and a movable end 130. Proximate the movable
end 130, is a boss 140 that extends outward from the sidepanel 110.
The boss 140 extends outward a sufficient distance to provide a
conductive path between the sidepanel 110 and an adjacent
conductive surface when a module with the EMI module cover 100 is
installed in a chassis. The outward extension of the boss 140 from
the sidepanel 110 can be clearly seen in FIG. 1B. Of course, if
design so dictates, the sidepanel 110 may include a plurality of
such cantilever members 150 as illustrated in FIG. 1A.
[0027] In the illustrated embodiments, the sidepanel 110 has
additional cantilever members 150 integrally formed with the
sidepanel 110 with a module coupler 165 on a movable end 160, which
are designed to engage corresponding module couplers of other
sidepanel members and cooperatively form a module cover or housing
as shown in FIG. 2. The module coupler 165 is clearly visible in
FIGS. 1B and 1C. These cantilever members 150 are similar to the
resilient cantilever members 120 with respect to a fixed end 155
being integrally formed with the sidepanel 110. The functional
distinction between the two types of cantilever members 120, 150,
however, is the module coupler 165. When the module coupler 165 is
used to secure the EMI module cover 100 to another module cover,
the cantilever member 150 is fixed into position and is no longer
resilient. The resilient cantilever member 120, on the other hand,
retains its resiliency. This continuing resiliency assures that a
conductive path will be maintained between the sidepanel 110 and an
adjacent conductive surface because the resilient cantilever member
150 will be flexible enough to force the outwardly extended bosses
140 against the adjacent conductive surface when the module is
installed in a chassis.
[0028] In one embodiment of the invention, the sidepanel 110 has a
plurality of resilient cantilever members 120 on it. One aspect of
this embodiment provides for at least one of the resilient
cantilever members 120 to have an asymmetrical orientation to at
least one other resilient cantilever member 120. In still another
embodiment, the resilient cantilever members 120 are formed within
the perimeter of the sidepanel 110. All of these embodiments are
illustrated in FIGS. 1A-1C.
[0029] Turning now to FIG. 1D, illustrated is an embodiment of the
invention with two resilient cantilever members 120 located on
opposing ends of the sidepanel 110. Those of ordinary skill in the
art will readily understand that any orientation of these two
resilient cantilever members 120 on opposing ends of the sidepanel
110 is within the scope of the present invention.
[0030] Turning to FIG. 2, illustrated is an isometric view of an
electronic module 200 that is configured to be received within the
frame of an electronic chassis (not shown). The module 200 has a
number of electrical components (not shown) contained within a
housing 220. Because the electrical components generate EMI
emissions, and the electronics module 200 will be a source of such
emissions unless controlled, some EMI control mechanism or
technique must be employed. In this instance, the electrical
components housing 220 has interlocking sidewalls 230, at least one
of which is an EMI module cover 100 as described above. This EMI
module cover 100 provides the requisite EMI control by providing
electrical contact between the module 200 and an adjacent surface,
such as a sidepanel of a chassis or a sidepanel of another module.
Those of ordinary skill in the art will readily understand that the
EMI module cover 100 can be employed on any surface of the module
200 that will be adjacent to a conductive surface and still be
within the scope of the present invention.
[0031] Now turning to FIG. 3 illustrated is an electronic equipment
chassis 300 configured to receive three electronic modules 200. The
chassis 300 has a frame 310 to receive the electronics modules 200,
each of which is configured to be received within such frame 310.
An examination of this FIG. 3 clarifies how the resilient
cantilever members 120 formed from the sidepanel 110 will flex as
the module 200 is inserted into the chassis 300. Because the boss
140 on the moveable end 130 of the resilient cantilever member 120
extends outward from the sidepanel 110, a conductive path between
the sidepanel 110 and the adjacent conductive surface 320 (not
visible) is assured. Those of ordinary skill in the art will
understand that the adjacent conductive surface 320 can be on an
adjacent module 200 or it can be on the chassis 300 itself.
[0032] Turning now to FIG. 4, illustrated is a flow diagram of one
embodiment of a method of manufacturing 400 an EMI cover for an
electronics module in accordance with the principles of the present
invention. The method commences with a start step 410. In a form
conductive sidepanel step 420, a conductive sidepanel is formed
with a resilient cantilever member formed from the sidepanel. The
resilient cantilever member has a fixed end integrally formed with
the sidepanel and a movable end free from a module coupler so that
the resilient cantilever member can flex as the electronics module
is installed in a chassis. In a form boss step 430, a boss is
formed proximate the movable end of the resilient cantilever
member. The boss is formed so that it extends outwardly from the
sidepanel a distance sufficient to provide a conductive path
between the conductive sidepanel and an adjacent conductive surface
when the module is installed in a chassis. The manufacturing method
concludes with an end step 440. Those skilled in the art will
readily understand that additional steps covering additional
embodiments of the invention can be made and that the steps
providing for herein can be modified or changed and still be within
the scope of the intended invention.
[0033] Although the present invention has been described in detail,
those skilled in the art should understand that they can make
various changes, substitutions and alterations herein without
departing from the spirit and scope of the invention in its
broadest form.
* * * * *