U.S. patent application number 09/165006 was filed with the patent office on 2001-11-15 for thermal connector for joining mobile electronic devices to docking stations.
Invention is credited to HALEY, KEVIN J., O'CONNOR, MICHAEL.
Application Number | 20010040788 09/165006 |
Document ID | / |
Family ID | 22597014 |
Filed Date | 2001-11-15 |
United States Patent
Application |
20010040788 |
Kind Code |
A1 |
O'CONNOR, MICHAEL ; et
al. |
November 15, 2001 |
THERMAL CONNECTOR FOR JOINING MOBILE ELECTRONIC DEVICES TO DOCKING
STATIONS
Abstract
A heat exchanger. A first heat transfer element has an end which
forms an engaging surface. A second heat transfer element has a
receptacle portion which is integrally formed and has an engaging
surface that is urged against the engaging surface of the first
heat transfer element when the first heat transfer element and the
second heat transfer element are mated.
Inventors: |
O'CONNOR, MICHAEL;
(CUPERTINO, CA) ; HALEY, KEVIN J.; (SAN JOSE,
CA) |
Correspondence
Address: |
MICHAEL J MALLIE
BLAKELY SOKOLOFF TAYLOR & ZAFMAN
12400 WILSHIRE BOULEVARD
7TH FLOOR
LOS ANGELES
CA
90025
|
Family ID: |
22597014 |
Appl. No.: |
09/165006 |
Filed: |
September 30, 1998 |
Current U.S.
Class: |
361/679.46 |
Current CPC
Class: |
G06F 1/1632
20130101 |
Class at
Publication: |
361/687 |
International
Class: |
G06F 001/20 |
Claims
1. A heat exchanger comprising: a first heat transfer element
having a first end which forms a first engaging surface; and a
second heat transfer element having a receptacle portion, the
receptacle portion being integrally formed and having a receptacle
engaging surface urged against the first engaging surface of the
first heat transfer element when the first heat transfer element
and the second heat transfer element are mated.
2. The heat exchanger of claim 1 wherein the receptacle portion is
a spring clip portion and the receptacle engaging surface is a
spring clip engaging surface.
3. The heat exchanger of claim 2 wherein the first heat transfer
element and the second heat transfer element are heat pipes.
4. The heat exchanger of claim 2 wherein the spring clip portion
has a resilient unitary body which is deformed by insertion of the
first heat transfer element.
5. The heat exchanger of claim 2 wherein the spring clip portion is
fixedly mounted to provide a receptacle which is smaller than the
first end of the first heat transfer element prior to insertion
into the receptacle of the first end of the first heat transfer
element, the spring clip being expandable to conform to the first
end of the first heat transfer element.
6. The heat exchanger of claim 2 wherein the spring clip portion
comprises a rectangular contact having resilient and substantially
parallel plates for contacting the first heat transfer element.
7. The heat exchanger of claim 6 wherein the second heat transfer
element comprises a heat pipe having a rectangular aperture which
houses the spring clip portion.
8. The heat exchanger of claim 7 wherein the spring clip portion
further comprises a spring clip housing which is mounted in the
rectangular aperture of the heat pipe and which secures the
parallel plates, and further wherein a thermally conductive
material fills a gap formed between the parallel plates and the
spring clip housing.
9. The heat exchanger of claim 8 wherein the first heat transfer
element is plated with a durable and thermally conductive material
and wherein the first heat transfer element is tapered towards the
first end.
10. The heat exchanger of claim 9 wherein the durable and thermally
conductive material is gold.
11. The heat exchanger of claim 2 wherein the spring clip portion
comprises a cylindrical spring clip having a slit to allow
expansion thereof.
12. The heat exchanger of claim 11 wherein the spring clip portion
is formed using spring steel and is welded to the first heat
transfer element.
13. The heat exchanger of claim 11 wherein the spring clip portion
has a beveled edge which receives the first heat transfer element
and wherein the first engaging surface and the spring clip engaging
surface are plated with a durable and thermally conductive
material.
14. The heat exchanger of claim 13 wherein the durable and
thermally conductive metal is gold.
15. The heat exchanger of claim 2 further comprising: a spring clip
compression structure attached to the spring clip portion which
urges the spring clip portion against the first heat transfer
element when the first heat transfer element and the second heat
transfer element are mated.
16. The heat exchanger of claim 15 wherein the spring clip portion
is a cylindrical spring clip which is attached to a heat pipe and
wherein the spring clip compression structure has a closed end and
an open end, the closed end having two elongated spring members
extending outwardly to form the open end, the spring clip portion
being compressively held between the two elongated spring
members.
17. A computing device arrangement comprising: a portable computing
device having an electronic component therein; a docking station
which receives the portable computing device and has a heat
dissipation element therein; and a heat exchanger thermally
coupling the electronic component in the portable computing device
to the heat dissipation element in the docking station, the heat
exchanger including: a first heat transfer element having a first
end which forms a first engaging surface; and a second heat
transfer element having a receptacle, the receptacle being
integrally formed and having a receptacle engaging surface urged
against the first engaging surface of the first heat transfer
element when the first heat transfer element and the second heat
transfer element are mated.
18. The computing device arrangement of claim 17 wherein the
receptacle comprises a spring clip portion and the receptacle
engaging surface comprises a spring clip engaging surface
19. The computing device arrangement of claim 18 wherein the spring
clip portion comprises a rectangular contact having resilient and
substantially parallel plates for contacting the first heat
transfer element.
20. The computing device arrangement of claim 19 wherein the spring
clip portion further comprises a spring clip housing which is
mounted in a rectangular aperture of the heat pipe and which
secures the parallel plates, and further wherein a thermally
conductive and compressible material fills a gap formed between the
parallel plates and the spring clip housing.
21. The computing device arrangement of claim 18 wherein the spring
clip portion comprises a cylindrical spring clip having a slit to
allow expansion thereof.
22. An apparatus comprising: a mobile computing device having at
least one electronic component therein; a device including a heat
dissipation means for dissipating heat, the device having a
receptacle which mates with the mobile computing device; and heat
transfer means for thermally coupling the at least one electronic
component in the mobile computing device to the heat dissipation
means in the stationary computing device, the heat transfer means
comprising: a first heat transfer element coupled to the at least
one electronic component; a second heat transfer element coupled to
the heat dissipation means; and a spring clip means for removably
coupling the first heat transfer element to the second heat
transfer element.
Description
BACKGROUND
[0001] 1. Field of the Disclosure
[0002] The present disclosure pertains to the field of heat removal
from electronic components. More particularly, this disclosure
relates to heat removal from a computing device which mates with
another device such as a docking station.
[0003] 2. Description of Related Art
[0004] Faster and more powerful computer components allow the
design and construction of higher performance portable computing
devices such as laptop or notebook computers. Unfortunately, the
use of such faster and more powerful computer components often
results in increased heat generation by such computing devices.
Thus, improved heat dissipation technology is often needed to
maintain operating temperatures of portable computing devices
within the same range as their predecessors or some other
acceptable range.
[0005] Maintaining operating temperatures of computer system
components below certain levels is important to ensure performance,
reliability, and safety. Most integrated circuits have specified
maximum operating temperatures, above which the manufacturer does
not recommend operation. Additionally, most integrated circuits
have timing specifications that specify a window of time in which
input signals need to be received for proper functioning as well as
a window of time in which output signals are generated under normal
operating conditions. Transistors, the building blocks of
integrated circuits, tend to slow down as operating temperature
increases. Thus, a computer system that operates its integrated
circuits close to or beyond recommended timing specifications may
fail as temperature increases.
[0006] Additionally, integrated circuits may be physically damaged
if temperatures elevate beyond those recommended. Such physical
damage obviously can impact system reliability. Finally, the
computer system casing should be kept at a temperature which is
safe for human contact. This may necessitate spreading of heat
throughout a computer system base or efficiently expelling heat to
avoid hot spots near certain components such as a processor.
[0007] Typically, heat sinks, fans, and heat pipes are employed to
dissipate heat from integrated circuits and other electronic
components. Increases in heat generation are often accommodated by
simply increasing the quantity or size of these heat dissipation
elements. The relatively small size of a portable computing device,
however, complicates heat dissipation by limiting airflow, crowding
heat generating components, and reducing the space available for
heat dissipation devices.
[0008] A docking station is a well known computing device that
mates with a portable computing device to allow the portable
computing device access to various resources available to the
docking station. Many portable devices such as personal digital
assistants and/or organizers and communication devices may utilize
such a docking station arrangement. Additionally, many portable
computers (i.e., laptops or notebook computers) can operate in a
docking station arrangement. Alternatively, a docking station may
be any device that mates with, receives, or holds a portable
computing or other electronic device.
[0009] In the case of portable computers, the base of the portable
computer typically connects to the docking station to allow use of
a larger monitor and a fall size keyboard among other things. This
advantageously allows a portable computer user to operate a
portable computing device in a more ergonomic desktop computer
setting rather than using the small keyboard and screen often
provided in a portable computing device.
[0010] Mating a portable computing device with a docking station
often compounds the difficulty of cooling portable computing
devices because the display is typically closed. This reduces the
natural or passive cooling capability of the portable computing
device because convective airflow over the top of the base is
mostly blocked by the screen. Additionally, portable computers are
now being designed to operate in a higher power mode when docked at
the docking station, resulting in the generation of more heat to
dissipate.
[0011] The prior art does not sufficiently take advantage of
docking stations to dissipate heat. Particularly, the prior art
does not provide an economical heat exchanger which transfers heat
from a portable computing device to a docking station for
dissipation via connectors which are designed to withstand repeated
insertion and removal cycles and still provide low thermal
resistance between the portable computing device and the docking
station.
SUMMARY
[0012] A heat exchanger is disclosed. A first heat transfer element
has an end which forms an engaging surface. A second heat transfer
element has an integrally formed receptacle portion which has an
engaging surface that is urged against the engaging surface of the
first heat transfer element when the first heat transfer element
and the second heat transfer element are mated.
BRIEF DESCRIPTION OF THE FIGURES
[0013] The present invention is illustrated by way of example and
not limitation in the figures of the accompanying drawings.
[0014] FIG. 1 illustrates a side cross sectional view of one
embodiment of a portable computing device and a docking
station.
[0015] FIG. 2a illustrates a partial cross section view of one
embodiment of the connection of a heat transfer element to an
electronic component.
[0016] FIG. 2b illustrates a partial cross section view of another
embodiment of the connection of a heat transfer element to an
electronic component.
[0017] FIG. 3 illustrates a partial elevation view of one
embodiment of a heat exchanger.
[0018] FIG. 4 illustrates a cross sectional view of one embodiment
including a spring clip compression structure which may be used
with the cylindrical spring clip illustrated in FIG. 3.
[0019] FIG. 5a illustrates an elevation view of one embodiment of a
rectangular heat exchanger.
[0020] FIG. 5b illustrates a cross sectional view of the
rectangular heat exchanger shown in FIG. 5a.
[0021] FIG. 6 illustrates a cross sectional view of the rectangular
heat exchanger of FIGS. 5a and 5b in a mated position.
DETAILED DESCRIPTION
[0022] The following description provides a thermal connector for
joining mobile electronic devices to docking stations. In the
following description, numerous specific details such as particular
shapes, forms, and materials are set forth in order to provide a
more thorough understanding of certain embodiments of the present
invention. It will be appreciated, however, by one skilled in the
art that the invention may be practiced without such specific
details.
[0023] The present disclosure provides several solutions to remove
heat from a portable computing device through a mated docking
station. Some embodiments provide a durable connection which
maintains a low thermal resistance despite repeated insertion and
removal cycles. With the ability to remove additional heat through
the docking station, it may be possible to operate components such
as a processor in a portable computing device at a higher power
level. As a result, a portable computing device may be able to
obtain higher performance while docked at a docking station.
[0024] FIG. 1 illustrates one embodiment of a portable computing
device 105 which mates with a docking station. The portable
computing device 105 may be a laptop computer, a notebook computer,
or any other portable computing device which may utilize additional
cooling capacity when docked at a docking station 100. The portable
computing device 105 includes at least an electronic component 120
and a heat transfer element 125 to convey heat away from the
electronic component. Additionally, the portable computing device
includes a base 115 and a display 110 mounted using a hinge
mechanism (not shown) at one edge of the base 115.
[0025] In one embodiment, the electronic component 120 is a
processor; however, other components or regions of the portable
computing device may be cooled according to the techniques
disclosed herein. In a typical laptop or notebook computer, a
memory system, a disk and/or CD ROM drive, audio and video
hardware, connectivity (i.e., network and modem) hardware, as well
as a power supply may all be present. These or other individual
components as well as circuit boards or regional heat sinks within
the portable computing device 105 may be cooled according to the
present invention.
[0026] One end of the heat transfer element 125 is thermally
coupled to the electronic component 120. FIGS. 2a and 2b illustrate
embodiments of the thermal coupling of the electronic component 120
to the heat transfer element 125. In FIG. 2a, the electronic
component 120 is mounted on one side of a motherboard 205 and
thermally coupled to the heat transfer element 125 by several heat
conducting components.
[0027] The heat conducting components of FIG. 2a include
motherboard vias 210 and a heat conducting block 215. The block 215
may be an aluminum block and the vias 210 may be filled with
solder. The heat transfer element 125 is affixed to the heat
conducting block 215 using solder, thermal epoxy, or other suitable
means as are known or otherwise available in the art. This type of
mounting may be preferable if the electronic component does not
have a rigid package which can withstand a direct connection with
the heat transfer element 125.
[0028] FIG. 2b illustrates an embodiment in which the heat transfer
element 125 is directly mounted on an outer surface of the
electronic component 120 using a thermal epoxy, solder, or similar
mounting mechanisms. The inner surface of the component is affixed
to the motherboard 205. Either of these types of connections may be
used as well as any other means of thermally coupling the
electronic component 120 and the heat transfer element 125.
[0029] Referring back to FIG. 1, an end portion 135 of the heat
transfer element 125 may be exposed through a closeable aperture at
a mating end of the portable computing device 105 when the portable
computing device 105 is docked. Mechanisms known in the art or
otherwise available may be used to cause a door 130 to open the
closeable aperture, either automatically or manually.
[0030] The docking station 100 includes a second heat transfer
element 145. The second heat transfer element 145 is secured to the
docking station 100 by a pair of mounting brackets 155a and 155b.
Other known mounting mechanisms may be used as is convenient for a
particular docking station configuration. For instance, only a
single mounting bracket may be used, or more than two mounting
brackets may be used. A set of heat dissipation fins 150 and a fan
160 as well as the heat transfer element 145 may be used as a heat
dissipation mechanism in the docking station.
[0031] A heat exchanger is formed by the mating of heat transfer
elements 125 and 145. One end portion 140 of the heat transfer
element 145 is thermally coupled to the end portion 135 of the heat
transfer element 125 when the docking station 100 and the portable
computing device 105 mate. As illustrated, in one embodiment, the
heat exchange mechanism is formed by receptacle such as a spring
clip 132 attached to the heat transfer element 125 engaging a male
end portion 140 of the heat transfer element 145. Alternatively,
these mechanisms may be reversed so that the spring clip 132 is
attached to the docking station.
[0032] In one embodiment, the heat transfer element 145 is a
cylindrical or at least substantially cylindrical heat pipe. In
this embodiment, the spring clip 132 is a cylindrical receptacle
that engages the similarly shaped male end portion 140. The spring
clip 132 is soldered or otherwise strongly thermally and
mechanically bonded to a heat pipe which conveys heat from the
electronic component 120. In other embodiments, one or both of the
heat pipes may be rectangular or another shape as long as the
spring clip 132 is also appropriately shaped to sufficiently
thermally engage the end portion 140 of the heat transfer element
145 and provide a low thermal resistance path.
[0033] FIG. 3 illustrates one embodiment of the heat exchanger
shown in FIG. 1. In particular, the end portion 140 of the heat
transfer element 145 as well as the spring clip 132 and the heat
transfer element 125 are shown. In this embodiment, the end portion
140 of the heat transfer element 145 has a tapered portion 310 to
facilitate insertion into the spring clip 132.
[0034] In addition, the heat transfer element has a non-plated
portion 325 and a plated portion 320, the plated portion 320 being
plated with a durable and thermally conductive material. For
example, gold, molybdenum, an alloy, or another durable and
thermally conductive material may be used. The plated portion 320
forms an engaging surface which comes into direct contact with the
spring clip 132.
[0035] In the embodiment illustrated in FIG. 3, the spring clip 132
is an integrally formed separate body (i.e., it is one piece) which
is affixed to the heat transfer element 125 via a weld 340 or
another suitable thermally conductive attachment mechanism. In some
embodiments, the spring clip 132 may also be formed integrally with
the entire heat transfer element 125. In either case, the resilient
unitary body of the spring clip forms a receptacle with a single
integrally formed body that urges its engaging surface into contact
with the heat transfer element when appropriately mated. External
springs or similar mechanisms may not be necessary. The resilient
unitary body of the spring clip 132 has a slit 330 allowing the
spring clip 132 to deform and accommodate the heat transfer element
125.
[0036] Typically the spring clip 132 is slightly smaller than the
heat transfer element 125 and expands to conform to the heat
transfer element 145. The spring clip 132 may also include a plated
engaging surface 335 and the leading edge may be beveled to further
ease insertion. Similarly to the end portion 140 of the heat
transfer element 145, the engaging surface 335 of the spring clip
132 may be coated with any appropriate thermally conductive and
durable material such as gold.
[0037] FIG. 4 illustrates a spring clip compression structure 405.
The spring clip compression structure may provide additional
compression force on a cylindrical spring clip 410, urging the
spring clip 410 against a heat transfer element so that a better
thermal connection may be made with the heat transfer element. The
spring clip compression structure 405 may also allow a less
resilient material to be used for the spring clip 410. For example,
without the compression structure, a spring steel material may be
needed for the cylindrical spring clip 410 to form an adequate
contact with an inserted heat transfer element. With the
compression structure, a less resilient material which may have
better thermal properties (e.g., copper) may be used.
[0038] The spring clip compression structure 405 has a closed end
407 and an open end 409. The closed end 407 has two elongated
spring members 430 and 435 which extend from the closed end and
which hold the spring clip 410 so that a compressing force is
exerted on the spring clip 410. A weld 425 or another appropriate
thermally conductive bond affixes a heat pipe 415 or other heat
transfer element to the spring clip 410. Other mechanical forms
which provide compressive force and/or which secure the heat pipe
415 and spring clip 410 may be used to provide a spring clip
compression structure.
[0039] FIG. 5a illustrates one embodiment of a rectangular heat
exchange apparatus. In FIG. 5a, a rectangular heat pipe 505 with a
tapered end 510 having a durable plating 515 is engaged by a spring
clip 522 secured in an open end of a heat pipe 520. The spring clip
522 has a housing 530 which secures the spring clip 522 in the
rectangular aperture formed by the open end of the heat pipe 520.
Additionally, substantially parallel and resilient plates form
compressible engaging surfaces 545 and 550 which respectively
provide top and bottom surfaces that mate with the heat pipe 505 to
provide a thermal connection. A rear surface 555 may also be
resilient and compressible to accommodate the heat pipe 505.
[0040] As shown, the spring clip 522 has a housing 530. This
housing 530 may be secured in the aperture of the heat pipe 520 by
forcible insertion. The housing 530 and therefore the spring clip
522 may be designed to be equal in size or marginally larger than
the aperture such that the housing 530 remains in place once
inserted. Either in addition or as a separate securing mechanism,
nubs or other mechanical or bonding means may be used to hold the
housing 530 in place.
[0041] Alternatively, the spring clip 522 itself may be formed as a
part of the heat pipe 520 or as an integral part of another type of
heat transfer element substituted for the heat pipe 520. The spring
clip 522 itself, like the cylindrical spring clip previously
discussed, however, may be uncomplicated and easily manufactured
integral body which provides an efficient durable mechanism for
thermal transfer. Such spring clip mechanisms have few moving parts
and may advantageously be manufactured and deployed in computer
systems similarly to existing electrical connectors often used
between removable electronic components.
[0042] FIG. 5b is a cross sectional view of the receptacle
structure in FIG. 5a which illustrates several additional features
which may be present in some embodiments. A plating 535 provides a
durable high thermal conductivity interface for the heat pipe 505
like the plated surfaces previously discussed. Additionally, the
housing 530 of the spring clip 522 contains a thermally conductive
and compressible material 540. For example, this material may be a
thermal grease, a thermally conductive polymer, a thermally
conductive compressible elastomer or another thermally conductive,
flexible, or yielding material.
[0043] FIG. 6 illustrates the compression which occurs to the
spring clip 522 shown in FIGS. 5a and 5b when the heat pipe 505 is
inserted. As can be appreciated from FIG. 6, although the heat pipe
505 may be taller than the opening formed by the compressible
engaging surfaces 545 and 550 in their relaxed state, these
surfaces compress to snugly fit the heat pipe 505 and form a strong
thermal connection. The thermally conductive and compressible
material 540 maintains a low thermal resistance from the engaging
surfaces 545 and 550 to the heat pipe 520 despite the change in
shape of the spring clip engaging surfaces.
[0044] Thus, a thermal connector for joining mobile electronic
devices to docking stations is disclosed. While certain exemplary
embodiments have been described and shown in the accompanying
drawings, it is to be understood that such embodiments are merely
illustrative of and not restrictive on the broad invention, and
that this invention not be limited to the specific constructions
and arrangements shown and described, since various other
modifications may occur to those ordinarily skilled in the art upon
studying this disclosure.
* * * * *