U.S. patent application number 09/815635 was filed with the patent office on 2001-10-18 for heat sink apparatus and method of attaching the heat sink apparatus to a device.
This patent application is currently assigned to Powerware Corporation. Invention is credited to Edevold, Craig, Winch, Cary.
Application Number | 20010030852 09/815635 |
Document ID | / |
Family ID | 23365453 |
Filed Date | 2001-10-18 |
United States Patent
Application |
20010030852 |
Kind Code |
A1 |
Edevold, Craig ; et
al. |
October 18, 2001 |
Heat sink apparatus and method of attaching the heat sink apparatus
to a device
Abstract
A heat sink apparatus for drawing heat from one or more devices
and a method of attaching such a heat sink to one or more devices
is provided. The heat sink includes a mounting surface, which draws
heat into the heat sink where it is dissipated by fins. The heat
sink can be mounted next to the device to be cooled with minimum
insertion force since the weight of the heat sink is borne by the
printed circuit board upon which the electronic device is
installed. a rotatable cam is turned by the user, which engages a
pivot arm. The pivot arm rotates a number of spring clips against
the device thereby holding it in place. Once in a fully closed
position, the cam locks into place to prevent the pivot arm and
spring clips from rotating back to an open position. The spring
clips affix the heat sink and maintains contact between the
mounting surface and the device being cooled. The individually
articulated spring clips allow the heat sink to be mounted over
multiple devices of various dimensions and locations along the heat
sink.
Inventors: |
Edevold, Craig; (Tomah,
WI) ; Winch, Cary; (Necedah, WI) |
Correspondence
Address: |
LEYDIG VOIT & MAYER, LTD
6815 WEAVER ROAD
ROCKFORD
IL
61114-8018
US
|
Assignee: |
Powerware Corporation
8609 Forks Road
Raleigh
NC
27615
|
Family ID: |
23365453 |
Appl. No.: |
09/815635 |
Filed: |
March 23, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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09815635 |
Mar 23, 2001 |
|
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09347828 |
Jul 2, 1999 |
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6219246 |
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Current U.S.
Class: |
361/704 ;
257/E23.086; 257/E23.104 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 2924/00 20130101; H01L 2924/0002 20130101; H01L 23/3675
20130101; H01L 23/4093 20130101 |
Class at
Publication: |
361/704 |
International
Class: |
H05K 007/20 |
Claims
What is claimed is:
1. A heat sink apparatus for dissipating heat generated by a
device, said apparatus comprising: a body including a mounting
surface; and a holding member connected to said mounting surface
for movement of said holding member between a clamped position and
a released position.
2. The heat sink of claim 1 wherein said mounting surface includes
a plurality of cooling fins extending from said mounting surface to
further radiate heat from said device.
3. The heat sink of claim 1 wherein said holding member may be
fixedly attached to a plurality of devices of varied size and
location.
4. The heat sink of claim 1 wherein said heat sink is comprised of
metal.
5. The heat sink of claim 1 wherein said heat sink is comprised of
a material having a thermal conductivity sufficient to allow the
conduction of heat away from said device.
6. The heat sink of claim 1 where in said heat sink further
comprises a power actuated fan.
7. The heat sink of claim 1 and further comprising a cam pivotally
mounted in said body and connected to said holding member so that
rotation of said cam moves said holding member between said clamped
and released positions.
8. The heat sink of claim 7 where in said cam includes a stop
member to prevent release of said holding member through
reverse-rotation of said cam.
9. A heat sink apparatus for conducting heat away from a device,
said heat sink comprising: a body including a mounting surface; and
means for securing said mounting surface to said device so that
said heat generated by said device is conducted by said mounting
surface through said heat sink apparatus and away from said
device.
10. The heat sink of claim 9 wherein said mounting surface includes
a plurality of cooling fins extending from said mounting surface to
further radiate heat from said device.
11. The heat sink of claim 9 wherein said means for securing said
mounting surface to the device comprises a holding member and a
user-actuated cam mechanically associated with said holding member
so as to move said holding member between clamped and released
positions, and wherein said holding member further includes a pivot
arm and a plurality of spring clips which pivotally engage said
device.
12. The heat sink of claim 11 where said holding member is
comprised of a metal with sufficient spring compression strength to
maintain tension between said mounting surface and said device.
13. The heat sink of claim 9 wherein said heat sink apparatus
further comprises a cam channel, a cam member pivotally mounted in
said cam channel, and a holding member connected to said body so
that rotation of said cam causes movement of said holding member to
a clamped position to secure said device between said mounting
surface and said holding member.
14. The heat sink of claim 9 wherein said heat sink further
comprises a power actuated fan.
15. The heat sink of claim 9 wherein said heat sink further
comprises a base having a mounting surface and wherein
substantially all of the weight of said heat sink is supported by
said base.
16. The heat sink of claim 15 wherein said heat sink further
comprises a thermally conductive, electrically insulating material
on said mounting surface.
17. The heat sink of claim 15 wherein said mounting surface is made
from a thermally conductive, electrically insulating material.
18. The heat sink of claim 9 wherein said means for securing said
mounting surface to the deice includes a holding member having an
engagement surface spaced from said mounting surface and movable
between a clamped position and a released position and wherein said
heat sink apparatus further comprises a cam pivotally mounted in
said body so that rotation of said cam causes movement of said
holding member between said clamped and released positions.
19. The heat sink of claim 9 wherein said body includes a second
mounting surface, and means for securing said second mounting
surface to a second device so that said heat generated by said
second device is conducted by said second mounting surface through
said heat sink apparatus and away from said second device.
21. The heat sink of claim 9 wherein said heat sink further
includes a means for monitoring and reporting the temperature of
said device.
22. A method of mounting a heat sink to a device, said heat sink
including a mounting surface and a holding member connected to said
mounting surface for movement between a clamped position and a
released position, said method comprising the acts of: positioning
said heat sink adjacent to said device; and biasing said holding
member toward said mounting surface so as to clamp said device
between said mounting surface of said heat sink and said holding
member.
23. The method of claim 22 further comprising the additional acts
of: biasing said holding member away from said mounting surface to
release said device from between said mounting surface of said heat
sink and said holding member; and removing said heat sink from said
device.
24. A heat sink apparatus for dissipating heat generated by a
device, said apparatus comprising: a body including a mounting
surface; a holding member connected to said mounting surface for
movement of said holding member between a clamped position and a
released position; and a cam pivotally mounted in said body and
connected to said holding member so that rotation of said cam moves
said holding member between said clamped and released
positions.
25. The heat sink of claim 24 wherein said mounting surface
includes a plurality of cooling fins extending from said mounting
surface to further radiate heat from said device.
26. The heat sink of claim 24 wherein said holding member may be
fixedly attached to a plurality of devices of varied size and
location.
27. The heat sink of claim 24 wherein said heat sink is comprised
of metal.
28. The heat sink of claim 24 wherein said heat sink is comprised
of a material with a thermal conductivity greater than said
device.
29. The heat sink of claim 25 where in said heat sink further
comprises a power actuated fan.
30. The heat sink of claim 24 wherein said cam includes a stop
member to prevent release of said holding member through
reverse-rotation of said cam.
Description
BACKGROUND OF THE INVENTION
[0001] The invention relates to heat sinks and a method of
attaching a heat sink to a device in order to allow the heat sink
to draw heat away from the device. In particular, the invention
relates to a heat sink which can be mounted and dismounted with
minimum insertion force and which has a resilient holding member
for securing the heat sink to the device, and to a method of
mounting the heat sink.
[0002] It is commonly known in the art to connect a heat sink to
various mechanical or electrical machines or devices in order to
draw heat away from the machine or device. Many electronic devices
fail if the temperature of the device rises above a particular
temperature. Specifically, integrated circuits, capacitors, power
amplifiers and other electronic components generate heat as
electric current passes through the component. That heat must be
dissipated in order to allow the device to operate normally.
SUMMARY OF THE INVENTION
[0003] In the case of electrical devices such as integrated
circuits that are soldered to a printed circuit board, commonly
known methods of connecting a heat sink to the device often causes
stress on the package or on the leads connecting the package to the
printed circuit board.
[0004] Commonly known heat sink devices in the art require a high
insertion force, a mounting surface external to the device being
cooled or must be mounted prior to soldering the package to the
circuit board. Exemplary devices are shown and described in U.S.
Pat. Nos. 4,872,089, 4,899,255, 4,972,294, 5,864,464, 5,875,097,
and 5,886,870.
[0005] Accordingly, the invention provides a heat sink apparatus
for drawing heat away from a device, and means for connecting the
heat sink apparatus to a device with minimal insertion force. In
particular, the means for connecting the heat sink apparatus to the
device includes a mounting surface and a resilient holding member
pivotally connected to the mounting surface for adjustable movement
between a clamped position and a released position. In a preferred
embodiment, the heat sink further includes a cam with a cam
engagement surface, a removable user-operated cam actuator
connected to the cam and a holding member which includes a pivot
arm and spring clips. Rotational movement of the cam actuator is
translated into horizontal movement of the holding member between
the clamped and released positions to secure and release,
respectively, the heat sink from the device.
[0006] The user of individual spring clips allows the heat sink to
be mounted to multiple devices of different styles, shapes and at
different locations along the mounting surface. Individual spring
clips which do not engage a device pivotally rotate towards the
mounting surface, but do not become compressed and do not
contribute to the clamping of the heat sink.
[0007] The invention also provides a method of securing a heat sink
apparatus to a device, the heat sink apparatus having a resilient
holding member and a mounting surface, the method including placing
the heat sink on the device so that the device is positioned
between the mounting surface and the resilient holding member and
rotating the cam actuator, thereby moving the resilient holding
member between the released position and the clamped position to
secure the heat sink to the device. In a preferred embodiment the
heat sink includes cooling fins to provide a greater surface area
to dissipate heat into the surrounding air.
[0008] In an alternative embodiment the cooling capability of the
cooling fins on the heat sink could be supplemented with a
power-actuated fan. Such power-actuated fans are well known in the
art. In an additional alternative embodiment, a temperature monitor
could be installed on the heat sink to monitor and report the
operating temperature of the heat sink, thereby indicating the
relative internal operating temperature of the device. Inclusion of
such a monitor would ensure that the device was operating within
safe operational temperature parameters and would allow for user
intervention prior to device failure. Such temperature monitors are
well known in the art.
[0009] It is a principal advantage of the invention to provide a
heat sink that can be secured to a device either before or after
soldering the device to a printed circuit board without stressing
the device or device leads during installation.
[0010] It is another advantage of the invention to provide a heat
sink that can be removed from a device after mounting the heat sink
to the device on a printed circuit board without stressing the
device or device leads during heat sink removal.
[0011] It is another advantage of the invention to provide a heat
sink capable of simultaneously clamping a plurality of devices of
varying styles to the heat sink.
[0012] It is another advantage of the invention to provide a heat
sink that does not require front access to the device to mount the
heat sink to the device.
[0013] It is yet another advantage of the invention to provide a
heat sink that can be secured to the device without any additional
hardware or external mounting surfaces.
[0014] Various other features and advantages of the invention are
set forth in the following detailed description, drawings and
claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is a partial perspective view of the heat sink
apparatus embodying the invention, and showing a tool for operating
the heat sink apparatus.
[0016] FIG. 2 is a side elevational view of the heat sink apparatus
shown in FIG. 1.
[0017] FIG. 3 is a view similar to FIG. 2 showing the heat sink
apparatus positioned over a device.
[0018] FIG. 4 is a view similar to FIG. 3 showing the heat sink
apparatus positioned over the device and being clamped to the
device.
[0019] Before one embodiment of the invention is explained in
detail, it is to be understood that the invention is not limited in
its application to the details of the construction and the
arrangements of the components set forth in the following
description or illustrated I the drawings. The invention is capable
of other embodiments and of being practiced or being carried out in
various ways. Also, it is to be understood that the phraseology and
terminology used herein is for the purpose of description and
should not be regarded as limiting.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0020] As seen in FIGS. 1 through 4 the heat sink apparatus 10
embodying the invention includes a body 14 and means for securing
the heat sink apparatus 10 to a device to conduct heat away from
the device. The means for securing includes a cam 18 and a holding
member 22. The body 14 has a length which may be reduced or
enlarged according to the application to accommodate any number of
devices 26.
[0021] The body 14 is preferably manufactured from a dense,
thermally conductive material. The body 14 includes a mounting
surface 30. As seen in FIGS. 3 and 4, the mounting surface 30
contacts the device 26 once the heat sink apparatus 10 is mounted
adjacent to the device 26. In one embodiment, a thermally
conductive, electrically insulating material is applied to the
mounting surface before the heat sink is secured to the device.
Typically, the thermally conductive, electrically insulating
material is applied as an adhesively bonded sheet or label. Such
materials are commonly commercially available. In other embodiments
(not shown), the mounting surface is actually made from a thermally
conductive, electrically insulating material.
[0022] The body 14 also includes a base 32. The base 32 provides a
surface for supporting the heat sink apparatus 10 on a printed
circuit board (not shown). As seen in FIG. 1, the base 32 of the
body 14 is machined to provide a small surface area. In the
embodiment depicted, the entire body 14 is machined, extruded or
cast from single piece of aluminum.
[0023] The body 14 also includes a heat sink 34. The heat sink 34
is partially depicted in FIGS. 2 through 4 and more completely
depicted in FIG. 1. As best seen in FIG. 4, the heat sink 34
includes a number of cooling fins 42 which extend from the body
14.
[0024] The body 14 also includes a cam channel 24. The cam channel
24 is a recess formed between the body 14 and the heat sink 34. The
cam channel 24 extends along the entire length of the body 14, and
is shaped to accommodate a cylindrical cam 18 pivotally mounted in
the cam channel 24 for axial rotation.
[0025] As seen in FIG. 1, the cam 18 is a cylindrical member
machined, extruded or cast to a length slightly longer than the
body 14 of the heat sink apparatus 10. As seen in FIGS. 1 through
4, the cam 18 includes a V-shaped engagement surface 54 which runs
the entire length of the cam 18.
[0026] The cam 18 also includes a grooved, recessed portion 58
which runs across the entire length of the cam 18. The portion 58
prevents reverse rotation of the cam 18 in the cam channel 24.
[0027] A portion of the cam 18 extends beyond the body 14 to
provide an interface with a cam actuator 50. In the embodiment
shown, the cam actuator 50 is a wrench having a socket designed to
accept the cross-sectional shape of the cam 18. In the embodiment
depicted, the cam 18 is machined, extruded or cast from a single
piece if aluminum.
[0028] The heat sink apparatus 10 also includes a holding member
retainer 20 connected to the body 14 and a holding member 22
mounted in the holding member retainer 20. Preferably, the holding
member retainer 20 and holding member 22 extend along the length of
the body 14.
[0029] The holding member 22 is a resilient member that
mechanically biases the device 26 against the mounting surface 30.
The holding member 22 is manufactured from a single, flat piece of
metal pressed and formed into a curved shape to define a pivot arm
46 and a spring clip or clips 62 connected to the pivot arm 46 at a
curved portion 74. In the embodiment shown, the holding member 22
is manufactured from stainless spring steel. The holding member 22
is pivotally movable in the cam channel 24 between a released
position as shown in FIG. 3 and a clamped position as shown in FIG.
4.
[0030] Curved portion 74 engages pivot portion 94 of the inside of
the cam channel 24 formed by the holding member retainer 20. As
best depicted in FIG. 2, the pivot arm 46 includes an end 76 that
extends into the vortex of the V-shaped engagement surface 54 of
the cam 18.
[0031] As seen in FIGS. 1 through 4, the spring clips 62 extend
beyond the cam channel 24 in spaced relation to the mounting
surface 30. In the embodiment shown in the drawings, the ends of
the spring clips 62 are slightly curved away from the mounting
surface 30 to provide an engagement surface 78 with the device
26.
[0032] As shown in the drawings, the holding member includes a
holding member stop 82 on each end of the pivot arm 46 of the
holding member 22 to secure the holding member 22 in the cam
channel 24. The holding member stop 82 is a flat piece of the pivot
arm 46 formed perpendicular to the pivot arm 46. The holding member
stop 82 provides a surface to engage the body 14 thereby securing
the holding member 22 in the cam channel 24.
[0033] As seen in FIGS. 1 through 4, the heat sink apparatus 10
includes a second cam channel 86 and second mounting surface 90 to
accommodate a second cam (not shown) and second holding member (not
shown). The second cam (not shown) pivotally engages a second
holding member (not shown) which engages a second device (not
shown) in substantially the same method and manner as cam 18 and
holding member 22.
[0034] In general, the method of mounting the heat sink to a device
includes positioning the heat sink adjacent to the device, and
biasing the holding member toward the mounting surface so as to
clamp the device between the mounting surface of the heat sink and
the holding member. The ability to secure the heat sink to a device
by clamping the device between the mounting surface of the heat
sink and the holding member reduces the risk that the thermally
conductive, electrically insulating material will be damaged during
installation of the heat sink.
[0035] More specifically, the heat sink apparatus 10 is supported
on the printed circuit board (not shown) so that the device 26 is
positioned between mounting surface 30 and holding member 22. The
heat sink apparatus 10 is then secured to the device 26 by rotating
the cam 18 with the cam actuator 50. As seen in FIG. 1, the cam
actuator 50 has an opening or socket therein that is shaped to fit
the cam 18. Turning again to FIGS. 3 and 4, rotation of the cam 18
causes the cam engagement surface 54 to engage the pivot arm 46
which rotates the pivot arm 46 inside the cam channel 24 thereby
causing the holding member 22 to pivot into the clamped position
(as seen in FIG. 4). Engagement of ridge member 58 with end 76 of
pivot arm 46 prevents release of said holding member 22 and
reverse-rotation of the cam 18. The pivot arm 46 translates the
rotational movement of the cam 18 into the clamping action of the
holding member 22. The flexible spring clips 62 bias the device 26
against the mounting surface 30 so that heat generated by the
device 26 is transferred to the body 14 to dissipated into the
ambient environment by heat sink 34. With further rotation of the
cam, the end 76 returns to the V-shaped surface 54 thereby
returning the holding member 22 to the released position as shown
in FIG. 2. The heat sink apparatus 10 can then be easily removed
without stressing the device 26 or the device leads 98.
[0036] Mounting the heat sink apparatus 10 in the manner described
above ensures maximum contact and thermal transfer between the
mounting surface 30 and the device 26 thereby allowing heat
generated by the device 26 to be conducted through the mounting
surface 30 and body 14 into the heat sink 34 and away from the
device 26. In the embodiment depicted, the mounting surface 30 and
heat sink 34 provide a dense material to conduct thermal energy
away from the device 26 while the cooling fins 42 provide a greater
surface area for the heat sink 34 to dissipate the heat into the
surrounding air.
[0037] In other embodiments (not shown), the heat sink may include
means for sensing the temperature of the heat sink or of the
device. Such means may include any type of known temperature
sensor, and this sensor may be connected to a control circuit for
operating a cooling fan. Triggering of the control circuit by the
temperature sensor causes operation of the fan to blow cooling air
over the heat sink to further facilitate cooling of the device.
[0038] Various features and advantages of the invention are set
forth in the following claims.
* * * * *