U.S. patent application number 09/318731 was filed with the patent office on 2001-10-11 for accommodation container, accommodation container for accommodating semiconductor devices and method of carrying semiconductor devices.
Invention is credited to ANDO, YUKIO, HASHIBA, HIDEYASU, KANAZAWA, YUUKI, SASAMURA, KEIICHI, SUZUKI, SHIGEO.
Application Number | 20010027933 09/318731 |
Document ID | / |
Family ID | 26575411 |
Filed Date | 2001-10-11 |
United States Patent
Application |
20010027933 |
Kind Code |
A1 |
SASAMURA, KEIICHI ; et
al. |
October 11, 2001 |
ACCOMMODATION CONTAINER, ACCOMMODATION CONTAINER FOR ACCOMMODATING
SEMICONDUCTOR DEVICES AND METHOD OF CARRYING SEMICONDUCTOR
DEVICES
Abstract
An accommodation container including: at least one first
container body and at least one second container body which can be
stacked onto the at least one first container body, respectively,
and at least one accommodation part provided between the at least
one first container body and the at least one second container
body, the accommodation part being capable of accommodating a
semiconductor device having a plurality of external connection
terminals. The accommodation part is made of a soft material at
least at a portion to be in contact with the external connection
terminals of the semiconductor device.
Inventors: |
SASAMURA, KEIICHI;
(AIZUWAKAMATSU-SHI, JP) ; HASHIBA, HIDEYASU;
(KAWASAKI-SHI, JP) ; ANDO, YUKIO;
(AIZUWAKAMATSU-SHI, JP) ; SUZUKI, SHIGEO;
(KAWASAKI-SHI, JP) ; KANAZAWA, YUUKI;
(KAWASAKI-SHI, JP) |
Correspondence
Address: |
STAAS & HALSEY LLP
700 11TH STREET, NW
SUITE 500
WASHINGTON
DC
20001
US
|
Family ID: |
26575411 |
Appl. No.: |
09/318731 |
Filed: |
May 26, 1999 |
Current U.S.
Class: |
206/706 ;
206/707; 206/722; 206/728 |
Current CPC
Class: |
H01L 2221/68309
20130101; H01L 21/67333 20130101; H01L 21/67336 20130101; H01L
2221/68313 20130101; H01L 21/67356 20130101 |
Class at
Publication: |
206/706 ;
206/707; 206/722; 206/728 |
International
Class: |
B65D 085/00; B65D
085/30; B65D 085/48 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 26, 1998 |
JP |
10-336234 |
Dec 18, 1998 |
JP |
10-361614 |
Claims
What is claimed is:
1. A container comprising: at least one first container body and at
least one second container body which can be stacked onto said at
least one first container body, respectively, and at least one
accommodation part provided between said at least one first
container body and said at least one second container body, said
accommodation part being capable of accommodating a device having a
plurality of terminals, said accommodation part being made of a
soft material at least at a portion to be in contact with said
terminals of the device.
2. An accommodation container comprising: at least one first
container body and at least one second container body which can be
stacked onto said at least one first container body, respectively,
and at least one accommodation part provided between said at least
one first container body and said at least one second container
body, said accommodation part being capable of accommodating a
semiconductor device having a plurality of external connection
terminals, said accommodation part being made of a soft material at
least at a portion to be in contact with said external terminals of
the semiconductor device.
3. The accommodation container as claimed in claim 2, wherein said
first container body and said second container body are entirely
made of a soft material which is softer than said external
connection terminals.
4. The accommodation container as claimed in claim 3, wherein said
soft material is urethane.
5. The accommodation container as claimed in claim 2, wherein said
first container body includes a first outer hard portion formed at
an outer part by a hard material and a first inner soft portion
formed at an inner part adjacent to the accommodation part by a
soft material, and said second container body includes a second
outer hard portion formed at an outer part by a hard material and a
second inner soft portion formed at an inner part adjacent to the
accommodation part by a soft material.
6. The accommodation container as claimed in claim 5, wherein said
first outer hard portion and said first inner soft portion are
formed integrally, and said second outer hard portion and said
second inner soft portion are formed integrally.
7. The accommodation container as claimed in claim 2, wherein said
first container body and said second container body can be
separated at a level below a height of said semiconductor device in
an accommodated state.
8. The accommodation container as claimed in claim 2, wherein said
first container body and said second container body are made of
members having an identical shape, each of said members having at
least one upper accommodation part half body on its lower surface
and at least one lower accommodation part half body on its upper
surface, a plurality of said members being stackable.
9. The accommodation container as claimed in claim 2, wherein said
at least one accommodating part is defined by fence members
provided between said first container body and said second
container body.
10. The accommodation container as claimed in claim 9, wherein said
second container body is provided with fence portions for holding
said fence members.
11. A container comprising: a plurality of container bodies; and at
least one accommodation part provided between said container
bodies, said accommodation part being capable of accommodating a
device having a plurality of terminals, said accommodation part
being provided with a plurality of protruded portions and a
plurality of terminal accommodating portions formed between said
protruded portions, said protruded portions being in contact with a
bottom surface of a device housing at positions between said
terminals, said device being supported such that said terminals and
a lower one of said container bodies are not in contact, and a
distance (E) between said terminal and said protruded portion being
greater than a distance (D) between said device housing and said
accommodating part (E>D).
12. An accommodation container comprising: a plurality of container
bodies; and at least one accommodation part provided between said
container bodies, said accommodation part being capable of
accommodating a semiconductor device having a plurality of external
connection terminals, said accommodation part being provided with a
plurality of protruded portions and a plurality of terminal
accommodating portions formed between said protruded portions, said
protruded portions being in contact with a bottom surface of a
semiconductor device main body at positions between said external
connection terminals, said semiconductor device being supported
such that said external connection terminals and a lower one of
said container bodies are not in contact, and a distance (E)
between said external connection terminal and said protruded
portion being greater than a distance (D) between said
semiconductor device main body and said accommodating part
(E>D).
13. The accommodation container as claimed in claim 12, wherein
said terminal accommodating portions are configured so as to
correspond to the shape of said external connection terminals.
14. The accommodation container as claimed in claim 12, wherein
said terminal accommodating portions penetrate through said
container body and are open to an exterior environment.
15. The accommodation container as claimed in claim 12, wherein
said plurality of container bodies are stackable.
16. A method of carrying semiconductor devices using an
accommodation container having at least one first container body
and at least one second container body which can be stacked onto
said at least one first container body, respectively, and at least
one accommodation part provided between said at least one first
container body and said at least one second container body, said
accommodation part being capable of accommodating a semiconductor
device having a plurality of external connection terminals, wherein
said accommodation part is made of a soft material at least at a
portion to be in contact with said external connection terminals of
the semiconductor device.
17. A method of carrying semiconductor devices using an
accommodation container having a plurality of container bodies and
at least one accommodation part provided between said container
bodies, wherein said semiconductor devices are accommodated in said
accommodation parts, said accommodation part being provided with a
plurality of protruded portions and a plurality of terminal
accommodating portions formed between said protruded portions, said
protruded portions being in contact with a bottom surface of a
semiconductor device main body at positions between external
connection terminals of said semiconductor device, said
semiconductor device being supported such that said external
connection terminals and a lower one of said container bodies are
not in contact, and a distance (E) between said external connection
terminal and said protruded portion being greater than a distance
(D) between said semiconductor device main body and said
accommodating part (E>D)
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention generally relates to an accommodation
container, and particularly relates to an accommodation container
suitable for accommodating small-sized high-density semiconductor
devices.
[0003] Recent small-sized high-density semiconductor devices may
include devices such as a CPS (Chip Size Package) and BGA (Ball
Grid Array). Also, in order to achieve a higher reliability of the
semiconductor devices, various efforts are made during a
manufacturing process.
[0004] The semiconductor devices are accommodated in accommodation
containers for the following carrying and shipping operations.
During the carrying process, the accommodation containers may be
subjected to an external force, which could damage the
semiconductor devices. Therefore, even if the semiconductor devices
are manufactured with a comparatively high reliability, the overall
reliability of the semiconductor devices may be reduced.
[0005] Accordingly, in order to improve the reliability of the
semiconductor devices, there is a need for an accommodation
container for accommodating the semiconductor devices which can
prevent the semiconductor devices from being damaged during the
carrying process.
[0006] 2. Description of the Related Art
[0007] FIGS. 1 to 3 are diagrams showing an accommodation container
1 of a first example for accommodating small-sized semiconductor
devices 5 such as a CSP (Chip Size Package), a BGA (Ball Grid
Array) and an LGA (Lead Grid Array).
[0008] The accommodation container 1 is a hard case made of hard
resin. The accommodation container 1 includes an upper half body 3
and a lower half body 2. The lower half body 2 is provided with an
accommodation part 9 for accommodating the semiconductor device 5
and a lower positioning fence 6 for positioning the semiconductor
device 5. The upper half body 3 is provided with a pressure surface
8 for preventing the semiconductor device 5 from being raised in
the accommodation part 9 and an upper positioning fence 7
cooperating with the lower positioning fence 6 for positioning the
semiconductor device 5.
[0009] The semiconductor device 5 of a package structure described
above includes a semiconductor device main body having external
connection terminals on its mounting surface side. The
semiconductor device main body is a structure having a
semiconductor chip sealed therein and may be referred to as a
"package" in the present application. FIG. 3 shows the
semiconductor device 5 provided with solder bumps 4 (hereinafter
referred to as "bumps") which serve as external connection
terminals. When an external force or an impact is applied, the
bumps 4 may easily be deformed since the bumps 4 are made of soft
solder.
[0010] In order to prevent such deformation of the bumps 4, the
lower half body 2 of the accommodation container 1 of the related
art is provided with a mounting part 10. For the sake of
convenience, the mounting surface of the semiconductor device 5 is
divided into a central region provided with the bumps 4 and a
peripheral region (shown by "W" in FIG. 3) surrounding the central
region. The semiconductor device 5 is accommodated in the
accommodation container 1 in such a manner that the peripheral
region of the semiconductor device 5 lies on the mounting part 10
of the lower half body 2.
[0011] With the above-described structure, the bumps 4 are held
above the bottom surface of the accommodation part 9. Therefore,
even if an external force or an impact is applied to the
accommodation container 1, such external force or impact is
prevented from being directly applied to the bumps 4. Thus, the
bumps 4 are prevented from being deformed.
[0012] FIGS. 4 and 5 are diagrams showing the first example of the
accommodation container when implementing an inspection of the
bumps 4 of the semiconductor device 5. First, the accommodation
container 1 is reversed upside down from the state shown in FIG. 3,
so that the lower half body 2 will be positioned above the upper
half body 3. Then, the lower half body 2 is removed from the upper
half body 3. Thus, as shown in FIGS. 4 and 5, the bumps 4 of the
semiconductor devices 5 will be exposed and an inspection can be
implemented.
[0013] FIGS. 7 and 8 are diagrams showing an accommodation
container 1 of a second example of the related art. In the figures,
elements similar to elements illustrated in FIGS. 1 to 6 are
indicated by similar reference numerals. The accommodation
container 1 is a hard case made of hard resin. The accommodation
container 1 includes a lower container main body 1A and an upper
container main body 1B.
[0014] The lower and upper container main bodies 1A, 1B are
identical and are each provided with accommodation parts 9A for
accommodating the semiconductor devices 5 and positioning fences 6A
for positioning the semiconductor devices 5.
[0015] In order to accommodate the semiconductor devices 5 in the
accommodation container 1, first of all, the semiconductor devices
5 are placed in the accommodation parts 9A of the lower container
main body 1A, as shown in FIG. 7. The lower surface of the package
17 lies on the mounting part 10A in the similar manner to the first
example described above. Also, the peripheral edge of the package
17 opposes the positioning fence 6A. Thus, the semiconductor device
5 will be positioned in a predetermined place the accommodation
container 1.
[0016] FIG. 8 shows a state where the upper container main body 1B
is placed on the lower container main body 1A provided with the
semiconductor device 5. The lower surface of the accommodation
container main body 1B serves as a pressure surface 8A for
restricting an upward displacement (slipping-off) of the
semiconductor device 5. Thus, the semiconductor device 5 is
accommodated between the lower and upper container main bodies 1A,
1B.
[0017] Now, the structure of the semiconductor device 5 to be
accommodated in the accommodation container 1 will be described.
The semiconductor device 5 is provided with solder bumps 4 provided
on a bottom surface 17B of the package 17 in which a semiconductor
chip (not shown) is sealed. The solder bumps 4 (hereinafter
referred to as "bumps") serves as external connection terminals.
When an external force or an impact is applied, the bumps 4 may
easily be deformed since the bumps 4 are made of soft solder.
[0018] In order to prevent such deformation of the bumps 4, the
accommodation container 1 of the related art is provided with a
mounting part 10A. For the sake of convenience, the bottom surface
17B of the package 17 is divided into a central region provided
with the bumps 4 and a peripheral region (shown by "W" in FIG. 8)
surrounding the central region. The semiconductor device 5 is
accommodated in the accommodation container 1 in such a manner that
the peripheral region of the package 17 lies on the mounting part
10A of the accommodation container 1.
[0019] With the above-described structure, the bumps 4 are held
above the bottom surface of the accommodation part 9A. Therefore,
even if an external force or an impact is applied to the
accommodation container 1, such external force or impact is
prevented from being directly applied to the bumps 4. Thus, the
bumps 4 are prevented from being deformed.
[0020] In FIG. 7, the mounting part 10A is provided as a stepped
configuration along the entire inner periphery of the accommodation
part 9A.
[0021] FIG. 10 is a diagram showing a third example of the
accommodation container of the related art. The accommodation
container shown in FIG. 10 is provided with a plurality of mounting
parts 10B configured as protrusions which are locally provided
along the inner periphery of the accommodation part 9B.
[0022] Recently, there is a need for a semiconductor device with a
further reduced size and higher density. Accordingly, the package
of the semiconductor device tends to be reduced in size while the
number of external connection terminals tends to be increased.
Thus, an area of the central region of the mounting surface of the
semiconductor device 5 needs to be increased. In other words, an
area of the peripheral region (W) surrounding the central region
tends to be reduced.
[0023] In the related art, it is possible to obtain the area of the
peripheral region (W) sufficient for holding the semiconductor
device 5 on the accommodation container 1. However, since the area
of the peripheral region (W) surrounding the central region tends
to be reduced as described above, it is difficult to maintain the
peripheral region (W) sufficient for holding the semiconductor
device 5 on the accommodation container 1.
[0024] Thus, a problem may occur during the carrying process, when
the semiconductor device 5 with reduced size and higher density is
accommodated in the accommodation container 1 having a conventional
structure. That is to say, the peripheral region (W) of the package
17 may slip off from the mounting part 10 of the accommodation
container 1 even in a case where a comparatively small external
force is applied.
[0025] If the peripheral region (W) slips off from the mounting
part 10, the bumps 4 made of soft material will collide with the
bottom surface of the accommodation part 9 of the accommodation
container 1, resulting in a deformation or breakage of the bumps
4.
[0026] FIG. 11 is a diagram showing a packaging process implemented
in the related art for preventing the bumps 4 from being deformed
or broken due to an external force or impulse applied during the
carrying process. In detail, first, the accommodation containers 1
accommodating the semiconductor devices 5 are placed in an inner
envelope 12 having a cushioning material 11 provided therein. Then,
the inner envelope 12 is placed in an interior box main body 14 and
is covered by an interior box lid 13. Then the interior box 13, 14
is placed in an exterior box 16. The exterior box 16 is also
provided with a cushioning material 15.
[0027] In the related art, in order to protect the bumps 4 from the
external force or the impulse, a plurality of packaging members 11
to 16 are required. Therefore, the packaging process is troublesome
and results in an increased product cost.
[0028] Further, there is a need for an accommodation container
which can be used for implementing a proper inspection. In the
related art, as shown in FIGS. 4 and 5, the upper half body 3 for
holding the semiconductor device 5 during the inspection is
configured as a so-called hard case structure. Thus, when an
external force is applied to the upper half body 3, for example by
a touch of a finger of an inspector, such external force will be
directly applied to the semiconductor device 5. Then, as shown in
FIG. 6, the semiconductor device 5 will be easily raised from the
upper half body 3, and will lean on the upper positioning fence
7.
SUMMARY OF THE INVENTION
[0029] Accordingly, it is a general object of the present invention
to provide a container which can satisfy the needs described
above.
[0030] It is another and more specific object of the present
invention to provide an accommodation container for a semiconductor
device and a method of carrying the semiconductor device which can
positively protect the semiconductor device with a simple
structure.
[0031] In order to achieve the above objects according to the
present invention, a container includes at least one first
container body and at least one second container body which can be
stacked onto the at least one first container body, respectively,
and at least one accommodation part provided between the at least
one first container body and the at least one second container
body. The accommodation part is capable of accommodating a device
having a plurality of terminals. The accommodation part is made of
a soft material at least at a portion to be in contact with the
terminals of the device.
[0032] The container described above can accommodate the devices in
the accommodation part in such a manner that the terminals of the
devices are in contact with the portion made of a material which is
softer than the terminals. Therefore, the terminals will not be
damaged or deformed when in direct contact with the accommodation
part. Thus, semiconductor devices having small terminals at a
narrow pitch can be securely accommodated in the container.
[0033] Also, the container described above is provided with a
greater holding region. Therefore, the semiconductor devices can be
securely accommodated even if an external force is applied.
[0034] Further, since the container itself has a cushioning effect,
the container can be packaged in a simpler and smaller package.
[0035] It is still another object of the present invention to
provide a container including a plurality of container bodies and
at least one accommodation part provided between the container
bodies. The accommodation part is capable of accommodating a device
having a plurality of terminals. The accommodation part is provided
with a plurality of protruded portions and a plurality of terminal
accommodating portions formed between the protruded portions. The
protruded portions are in contact with a bottom surface of a device
housing at positions between the terminals. The device is supported
such that the terminals and a lower one of the container bodies are
not in contact. A distance (E) between the terminal and the
protruded portion is greater than a distance (D) between the device
housing and the accommodating part (E>D).
[0036] The container described above can accommodate the devices in
the accommodation part in such a manner that the protruded portions
formed in the accommodation part are in contact with the bottom
surface of the device, while the terminals and the container body
are not in contact. Therefore, the terminals will not be damaged or
deformed when small-sized semiconductor devices are
accommodated.
[0037] Also, since the distance (E) between the terminal and the
protruded portion is greater than a distance (D) between the device
housing and the accommodating part (E>D), when the device is
displaced laterally in the accommodation part, the terminals will
come into contact with inner walls of the accommodation part before
coming into contact with the protrusions.
[0038] Therefore, the terminals will not be damaged or deformed
when an external force is applied to the container and the device
is displaced laterally in the accommodation part. Thus, a
reliability of the container is improved.
[0039] Further, in order to achieve the above-described objects, an
accommodation container for a semiconductor device and a method of
carrying the semiconductor device which can positively protect the
semiconductor device with a simple structure are provided.
[0040] Other objects and further features of the present invention
will be apparent from the following detailed description when read
in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0041] FIG. 1 is a schematic perspective view showing an
accommodation container of the related art.
[0042] FIG. 2 is an enlarged perspective view of an accommodation
container of a first example of the related art, particularly
showing a region near an accommodating part.
[0043] FIG. 3 is a cross-sectional diagram of the accommodation
container of the first example of the related art, particularly
showing the region near the accommodating part.
[0044] FIG. 4 is a perspective view of the accommodation container
of the first example of the related art, particularly used for
explaining a problematic aspect of the accommodation container of
the related art.
[0045] FIG. 5 is a cross-sectional diagram of the first example of
the accommodation container of the related art, particularly used
for explaining a problematic aspect of the accommodation container
of the related art.
[0046] FIG. 6 is another cross-sectional diagram of the
accommodation container of the first example of the related art,
particularly used for explaining a problematic aspect of the
accommodation container of the related art.
[0047] FIG. 7 is an enlarged perspective view of an accommodation
container of a second example of the related art, particularly
showing a region near an accommodating part.
[0048] FIG. 8 is a cross-sectional diagram of the accommodation
container of the second example of the related art, particularly
showing the region near the accommodating part.
[0049] FIG. 9 is a side view of a semiconductor device,
particularly used for explaining a problematic aspect of the
accommodation container of the related art.
[0050] FIG. 10 is an enlarged perspective view of an accommodation
container of a third example of the related art, particularly
showing a region near an accommodating part.
[0051] FIG. 11 is a schematic view showing a problematic aspect of
the accommodation container of the related art.
[0052] FIG. 12 is a cross-sectional diagram showing an
accommodation container of a first embodiment of the present
invention.
[0053] FIG. 13 is a perspective diagram showing a half body of the
accommodation container shown in FIG. 12.
[0054] FIG. 14 is a cross-sectional diagram showing a first method
of implementing an inspection of the semiconductor device.
[0055] FIG. 15 is a cross-sectional diagram showing a second method
of implementing an inspection of the semiconductor device.
[0056] FIG. 16 is a cross-sectional diagram showing a stack of a
plurality of the accommodation containers shown in FIG. 12.
[0057] FIG. 17 is a cross-sectional diagram showing an
accommodation container of a second embodiment of the present
invention.
[0058] FIG. 18 is a cross-sectional diagram showing an
accommodation container of a third embodiment of the present
invention.
[0059] FIG. 19 is a cross-sectional diagram showing an
accommodation container of a fourth embodiment of the present
invention.
[0060] FIG. 20 is a perspective view showing a stack of a plurality
of the accommodation containers shown in FIG. 19.
[0061] FIG. 21 is a cross-sectional diagram showing a stack of a
plurality of the accommodation containers shown in FIG. 19.
[0062] FIG. 22 is a cross-sectional diagram showing an
accommodation container of a fifth embodiment of the present
invention.
[0063] FIG. 23 is a cross-sectional diagram showing an
accommodation container of a sixth embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0064] In the following, principles and embodiments of the present
invention will be described with reference to the accompanying
drawings.
[0065] FIG. 12 is a cross-sectional diagram showing an
accommodation container 20 of a first embodiment of the present
invention. The accommodation container 20 accommodates
semiconductor devices 5 between a pair of container half bodies
21.
[0066] In the following description, when necessary, the container
half bodies 21 at upper and lower positions will be referred to as
an upper container half body 23 and a lower container half body 22,
respectively.
[0067] FIG. 13 is a perspective diagram showing a half body of the
accommodation container shown in FIG. 12. As shown in FIG. 13, the
container half body 21 is a plate-like member. An upper surface of
the container half body 21 is provided with a plurality of upper
accommodation parts 26 each defined by upper fences 27. Also, a
lower surface of the container half body 21 is provided with a
plurality of lower accommodation parts 25 each defined by lower
fences 28. The lower fences 28 and the lower accommodation part 25
are not shown in FIG. 13.
[0068] In the present embodiment, the container half body 21 is
entirely made of a soft material. In detail, the container half
body 21 is made of an integrally formed urethane. Also, the
hardness of urethane is selected to be softer than the hardness of
the bumps 4 formed on the semiconductor devices 25 to be
accommodated in the accommodation container 20. That is to say, the
container half body 21 is made of a material which is softer than
the bumps 4.
[0069] The accommodation container 20 has a basic structure in
which a pair of the container half bodies 21 (the lower container
half body 22 and the upper container half body 23) are provided in
a stacked configuration. When the lower container half body 22 and
the upper container half body 23 are stacked, the upper fences 27
of the lower container half body 22 will be in contact with the
lower fences 28 of the upper container half body 23. Also, the
lower accommodation part 25 and the upper accommodation part 26
cooperate so as to form an accommodation part 24.
[0070] In the following description, a line indicated by an arrow A
is referred to as a separating level. In FIG. 12, at the separating
level, the upper and lower fences 27 and 28 are in contact. In
other words, the lower and upper accommodation parts 25 and 26 are
in contact at the separating level A.
[0071] FIG. 12 is a diagram showing the semiconductor device 5
accommodated in the accommodation container 20. The semiconductor
device 5 is accommodated in the accommodation container 20 in such
a manner that the bumps 4 of the semiconductor device 5 are
directly in contact with the bottom surface of the upper
accommodation part 26 formed in the lower container half body 22.
This is because, since the semiconductor device 5 has a reduced
size and higher density, it is no longer possible to hold the
accommodation structure of the related art as shown in FIG. 3.
[0072] In the related art, when the bumps 4 are directly in contact
with the bottom surface of the upper accommodation part 26, there
is a problem that the bumps may be deformed. However, the lower and
upper container half bodies 22, 23 of the present embodiment, and
thus the bottom surface of the upper accommodation part 26, are
integrally formed of a soft urethane material.
[0073] Therefore, in the present embodiment, since the bumps 4 will
be directly in contact with the bottom surface of the upper
accommodation part 26, which surface is made of soft urethane, the
bumps 4 will not be deformed or damaged. Therefore, it is possible
to securely hold (or accommodate) the small-sized high-density
semiconductor devices 5 in the accommodation container 20.
[0074] Also, since the bumps 4 are held with the bumps 4 being in
contact with the accommodation part 24, the accommodation part 24
and the semiconductor device 5 will be in contact over a greater
region. That is to say, a holding region is increased. Therefore,
the semiconductor device 5 can be securely held even if an external
force is applied to the accommodation container 20.
[0075] Further, since a cushioning effect may be provided for the
accommodation container 20 itself, the accommodation containers 20
can be packaged with simpler and smaller packaging members as
compared to those shown in FIG. 11. Thus, reduced manufacturing
steps and cost can be achieved for a packaging process.
[0076] Also, in the present embodiment, the lower and upper
container half bodies 22 and 23 are entirely made of urethane (soft
material) as described above. Therefore, each of the lower and
upper container half bodies 22 and 23 can be easily manufactured
compared to a structure in which the soft material is locally
provided on the accommodation container. Also, since the
accommodation part 24 is entirely made of soft material, the
semiconductor device 5 will not be damaged by being in contact with
the accommodation container 20.
[0077] Further, in the present embodiment, the accommodation
container 20 is constructed by a plurality of container half bodies
21 having an identical shape (the lower container half body 22 and
the upper container half body 23). Therefore, a reduced
manufacturing cost and easier management of the container half
bodies 21 can be achieved compared to a structure in which the
upper and lower container half bodies have different
configurations. That is to say, it is not necessary to store the
upper container half bodies 22 and the lower container half bodies
23 separately.
[0078] FIG. 16 is a cross-sectional diagram showing a stack of a
plurality of the accommodation containers 20 shown in FIG. 12. As
shown in FIG. 16, in the present embodiment, the lower container
half body 22 and the upper container half body 23 have identical
configurations. Also, the lower and upper container half bodies 22
and 23 are provided with the lower accommodation part 25 on the
lower surface and the upper accommodation part 26 on the upper
surface. Thus, by stacking the container half bodies 21 as shown in
FIG. 16, the semiconductor devices 5 can be accommodated
three-dimensionally. Therefore, the accommodation efficiency of the
semiconductor device 5 can be improved.
[0079] FIGS. 14 and 15 are cross-sectional diagrams used for
explaining how the semiconductor devices 5 are inspected. Such
inspections may include a visual inspection of a label formed on
the upper surface 17A of the package 17 and a visual or image
processed inspection of the bumps 4 formed on the lower surface
(mounting surface) 17B.
[0080] In order to implement the label inspection of the
semiconductor device 5, which is held at an accommodation state
shown in FIG. 12, the upper container half body 22 is removed from
the lower container half body 22. The separating level A is chosen
at a level below a height H of the semiconductor device 5 in an
accommodated state. With such a structure, in order to expose the
upper surface 17A of the semiconductor device 5, the upper
container half body 22 may be removed from the lower container half
body 22. Thus, inspections such as the label inspection can be
implemented.
[0081] Also, in order to implement a visual inspection of the bumps
4, the accommodation container 20 in a state shown in FIG. 12 is
reversed in such a manner that the lower container half body 22 and
the upper container half body 22 are positioned upside-down. Then,
the lower container half body 22 is removed from the upper
container half body 22. Thereby, the bumps 4 of the semiconductor
device 5 will be exposed as shown in FIG. 15. Thus, the visual
inspection of the bumps 4 can be implemented.
[0082] As has been described above, with the accommodation
container 1 of the related art, the semiconductor device 5 may slip
of f from the lower half body 2 and the upper half body 3 as a
result of possible vibrations caused by a touch of the
inspector.
[0083] However, the accommodation container 20 of the present
embodiment includes the lower container half body 22 and the upper
container half body 22 made of soft material (urethane). Thus, any
vibrations described above will be absorbed by the lower container
half body 22 and by the upper container half body 22. Therefore,
the semiconductor device 5 will not slip off from the lower
container half body 22 or from the upper container half body 22.
Thus, the reliability of the inspection can be improved.
[0084] FIG. 17 is a cross-sectional diagram showing an
accommodation container 30 of a second embodiment of the present
invention. The accommodation container 30 of the present invention
includes at least one lower half body 32 and at least one upper
half body 33. The lower half body 32 includes a first outer hard
portion 32A formed at an outer part by a hard material and a first
inner soft portion 32B formed at an inner part adjacent to an
accommodation part 34 by a soft material. The hard material is, for
example, a hard resin and the soft material is, for example,
urethane.
[0085] The upper half body 33 includes a second outer hard portion
33A formed at an outer part by a hard material and a second inner
soft portion 33B formed at an inner part adjacent to the
accommodation part 34 by a soft material. The hard material is, for
example, a hard resin and the soft material is, for example,
urethane.
[0086] Further, a plurality of fence members 35 are provided
between the first and second inner soft portions 32B, 33B in such a
manner that accommodation parts formed between the first and second
inner soft portions 32B, 33B correspond to the shape of the
semiconductor devices 5. The fence members 35 are made of a soft
material similar to that of the first and second inner soft
portions 32B, 33B.
[0087] Note that in the present invention, each one of the hard
portions serves as a first outer hard portion 32A and as a second
outer hard portion 33A. That is to say, the first outer hard
portion 32A of the lower half body 32 accommodating upper
semiconductor devices 5 also serves as the second outer hard
portion 33A of the upper half body 33 accommodating lower
semiconductor devices 5. An exception is that the second outer hard
portion 33A at the uppermost position serves as a lid 31.
[0088] In the present embodiment, the lower and upper half bodies
32, 33 include the first and second outer hard portions 32A, 33A
formed at outer parts by a hard material. The first and second
inner soft portions 32B, 33B are formed at inner parts adjacent to
the accommodation part 34 by a soft material. Thus, it is possible
to maintain the rigidity of the entire accommodation container
30.
[0089] Therefore, the accommodation container 30 will not be flexed
or deformed when the accommodation container 30 is grasped for
being transferred or stacked. Thus, it is possible to improve the
ease of handling.
[0090] Also, in the present embodiment, the first and second outer
hard portions 32B, 33B and the first and second inner soft portions
32A, 33A are made of separate members. However, it is possible to
provide the first outer hard portion 32A and the first inner soft
portion 32B as an integrated member and the second outer hard
portion 33B and the second inner soft portion 33B as another
integrated member.
[0091] In order to achieve such structure, when forming the lower
and upper half bodies 32, 33 using resin, the first and second
inner soft portions 33A, 33B may be made by foaming.
[0092] With the structure described above, the accommodation
container 30 can be manufactured with reduced components and
manufacturing steps compared to those of the structure in which the
outer hard portions 32A, 33A and the inner soft portions 32B, 33B
are provided as separate members. Thus, it is possible to reduce
the cost of the accommodation container 30.
[0093] FIG. 18 is a cross-sectional diagram showing an
accommodation container 40 of a third embodiment of the present
invention. The accommodation container 40 of the present invention
includes at least one lower half body 42 and at least one upper
half body 43. The lower half body 42 includes a first outer hard
portion 42A formed at an outer part by a hard material and a first
inner soft portion 42B formed at an inner part adjacent to the
accommodation part 44 by a soft material. The hard material is, for
example, a hard resin and the soft material is, for example,
urethane. The upper half body 43 is made of a hard resin.
[0094] The lower half body 42 has a structure similar to that of
the second embodiment described above. Also, the upper half body 43
is provided with fence portions 45 for holding the fence members
35.
[0095] In the present embodiment, the lower half body 42 and the
upper half body 43 are provided as a combined member. An exception
is that the upper half body 43 at the uppermost position serves as
a lid 43. If at least a portion of the accommodation container to
be in contact with the bumps 4 of the semiconductor device 5 is
made of a soft material, it is possible to achieve effects similar
to the above-described effects.
[0096] In the following, further embodiments of the present
invention will be described.
[0097] FIG. 19 is a cross-sectional diagram showing an
accommodation container 120 of a fourth embodiment of the present
invention. The accommodation container 120 accommodates the
semiconductor devices 5 therein. Generally, the accommodation
container 120 includes an accommodation container main body 126, a
protruded portion 122, a terminal-accommodating portion 123, a
semiconductor device accommodating portion 124, and a positioning
fence 127.
[0098] The accommodation container 120 is a hard case made of hard
resin. In the following description, the accommodation container
120 at the lower position may be referred to as a lower
accommodation container 120A and the accommodation container 120 at
the upper position may be referred to as an upper accommodation
container 120B. Note that the lower accommodation container 120A
and the upper accommodation container 120B have identical
structures.
[0099] The lower and upper accommodation containers 120A and 120B
cooperate so as to accommodate the semiconductor devices 5. In the
present embodiment, the semiconductor device 5, having a structure
as shown in FIG. 9, is a so-called BGA-type semiconductor device
having a plurality of bumps 4 provided on the lower surface 17B of
the package 17.
[0100] In the following, the structure of the accommodation
container 120 will be described in detail. As shown in FIG. 20, the
accommodation container 120 is a plate-like container provided with
a plurality of positioning fences 127 on an upper surface for
defining a plurality of semiconductor device accommodating portions
124. The semiconductor device accommodating portion 124 is a
recessed structure formed on the surface of the accommodation
container main body 126. The semiconductor device accommodating
portion 124 includes a bottom surface 125 having a plurality of
protruded portions 122 protruding upwards which are formed
integrally with the bottom surface 125.
[0101] The protruded portions 122 are positioned such that the
upper surfaces of the protruded portions 122 are in contact with
the lower surface 17B of the package 17 at positions where the
bumps 4 are not formed. In other words, when the semiconductor
device 5 is accommodated in the semiconductor device accommodating
portion 124, the semiconductor device 5 is supported by the
plurality of protruded portions 122.
[0102] As shown in FIG. 19, the bumps 4 provided on the package 17
will be placed between the protruded portions 122. In the
following, regions surrounded by the protruded portions 122 in
which the regions bumps 4 are to be accommodated will be referred
to as terminal accommodating portions 123.
[0103] The protruded portion 122 has a height (FIG. 19, arrow H)
greater than a diameter (FIG. 19, arrow R) of the bump 4 (H>R).
Also, a pitch (FIG. 19, arrow P) between neighboring protruded
portions 122 is also greater than the diameter (FIG. 19, arrow R)
of the bump 4 (P>R). Therefore, when the semiconductor device 5
is accommodated in the semiconductor device accommodating portion
124, each bump 4 will be loosely fit in the terminal accommodating
portion 123. In other words, the bumps 4 and the accommodation
container 120 will not be in contact. Therefore, the bumps 4 can be
prevented from being damaged or deformed.
[0104] As shown in FIG. 19, the semiconductor device accommodating
portion 124 has tapered side walls (hereinafter referred to as
positioning fences 127). The positioning fences 127 guide the
semiconductor device 5to the predetermined position on the
protruded portions 122.
[0105] Since the positioning fences 127 serve as guiding members
for guiding the semiconductor device 5 to the predetermined
position in the semiconductor device accommodating portion 124, the
semiconductor device 5 can be easily and securely accommodated in
the semiconductor device accommodating portion 124. Also, since the
semiconductor device 5 is accommodated with improved accuracy, the
bumps 4 will not be in contact with the protruded portions 122.
Therefore, the bumps 4 can be prevented from being damaged or
deformed.
[0106] As has been described above, the accommodation container 1
of the related art (see FIGS. 1 to 11) is configured such that the
peripheral region A of the package 17 is placed on the mounting
part 10A or 10B. With such structure, for example due to an
external force during a carrying process, the semiconductor device
5 may slip off from the mounting part 10A of the accommodation
container 1. Therefore, the bumps 4 may be damaged.
[0107] However, the accommodation container 120 of the present
embodiment is structured such that the semiconductor device 5 is
placed on the upper surfaces of the plurality of protruded portions
122. Thus, the semiconductor device 5 can be prevented from
slipping off from the protruded portions 122.
[0108] Also, when the semiconductor device 5 is simply placed on
the upper surface of the protruded portions 122 and is displaced
laterally (FIG. 19, arrows X1 and X2), the protruded portions 122
will not come into contact with the bumps 4. This is explained
below.
[0109] Referring to FIG. 19, the distance between the peripheral
side 17C of the package 17 (see FIG. 9) and the semiconductor
device accommodating portion 124 (in detail, the positioning fences
127) is indicated by an arrow D. This distance will be hereinafter
referred to as a package-fence distance D. Also, the distance
between the bump 4 and the protruded portion 122 is indicated by an
arrow E and will be hereinafter referred to as a bump-protrusion
distance E.
[0110] In the present embodiment, the package-fence distance D and
the bump-protrusion distance E satisfies the relationship E>D.
Therefore, even if the semiconductor device 5 is displaced in a
lateral direction on the protruded portions 122, the peripheral
side 17A of the package 17 will come into contact with the
positioning fence 127 before the bumps 4 come into contact with the
protruded portions 122.
[0111] Therefore, the bumps 4 made of soft material will not
contact the protruded portions 122 and will be prevented from being
damaged or deformed even if the semiconductor device 5 is displaced
in the semiconductor device accommodating portion 124 due to an
external formed applied on the accommodation container 120. Thus,
it is possible to improve a reliability of the accommodation
container 120 during a carrying process. Further, with such a
structure, the accommodation containers 120 can be packaged with
simpler and smaller packaging members as compared to those shown in
FIG. 11. Thus, reduced manufacturing steps and cost can be achieved
for a packaging process.
[0112] FIG. 20 is a perspective view showing a stack of a plurality
of the accommodation containers 120 shown in FIG. 19. As has been
described above, the accommodating container 120 of the present
embodiment includes the container main body 126 having a plurality
of semiconductor device accommodating portions 124. In the present
embodiment, the accommodation containers 120 are stackable.
[0113] In detail, as shown in FIG. 19, in the accommodating
container 120 of the present embodiment, the container main body
126 is provided with stepped portions 128 and leg portions 129
provided on the peripheral position. The leg portions 129 of the
upper accommodation container 120B can be fitted to the stepped
portions 128 of the lower accommodation container 120A. Thus, the
accommodation containers 120 are stackable in a vertical direction.
FIGS. 20 and 21 are diagrams showing the plurality of accommodation
containers 120 in a stacked state.
[0114] Thus, by providing the plurality of semiconductor device
accommodating portions 124 on the container main body 126 and by
stacking the plurality of accommodation containers 120, numerous
semiconductor devices 5 can be accommodated in a three-dimensional
manner. Therefore, the accommodation efficiency of the
semiconductor devices 5 can be improved.
[0115] FIG. 22 is a cross-sectional diagram showing an
accommodation container 130 of a fifth embodiment of the present
invention. FIG. 23 is a cross-sectional diagram showing a sixth
embodiment of an accommodation container 140 of the present
invention. In FIGS. 22 and 23, elements similar to elements
illustrated in FIGS. 19 to 21 are indicated by similar reference
numerals.
[0116] Referring to FIG. 22, the accommodation container 130 of the
fifth embodiment of the present invention is provided with terminal
accommodating portions 133 defined by protruded portions 132, the
terminal accommodating portions 133 being configured so as to
correspond to the shape of the bumps 4. In other words, the
terminal accommodating portion 133 is a recessed portion having a
substantially spherical shape.
[0117] With the container device 130 of the fifth embodiment, the
distance between the bump 4 and an inner wall of the terminal
accommodating portion 133 will be kept at a substantially uniform
distance at any position. Therefore, the bumps 4 can be prevented
from being in contact with the protruded portions 132 for an
external force applied in any direction.
[0118] Referring to FIG. 23, the accommodation container 140 of the
sixth embodiment of the present invention is provided with terminal
accommodating portions 143 defined by protruded portions 142, the
terminal accommodating portions 143 being penetrated through the
container main body 126 and open to an exterior environment.
[0119] With the container device 140 of the sixth embodiment, it is
now possible to connect test pins (testing terminals) 146 to the
bumps 4 via openings formed at the lower parts of the terminal
accommodating portions 143. That is to say, the semiconductor
devices 5 can be tested while being accommodated in the
accommodation container 140. Therefore, there is no need to
transfer the semiconductor devices 5 from the accommodation
container 140 to a testing table during a testing process.
Therefore, it is possible to improve a testing efficiency of the
semiconductor devices 5. Further, a visual inspection of the bumps
4 can be implemented via the opening described above.
[0120] The first to sixth embodiments of the present invention have
been described with the BGA-type semiconductor device 5 having
bumps 4 serving as the external connection terminals. However, the
present invention can also be applied for accommodating
semiconductor devices having any other package structure.
[0121] Also, the first to third embodiments of the present
invention have been described with urethane used as a soft
material. However, the soft material is not limited to urethane,
and any other material softer than the external connection
terminals provided on the semiconductor device can be used.
[0122] Further, the present invention is not limited to these
embodiments, but variations and modifications may be made without
departing from the scope of the present invention.
[0123] The present application is based on Japanese priority
application No. 10-336234 filed on Nov. 26, 1998 and No. 10-361614
filed on Dec. 18, 1998, the entire contents of which are hereby
incorporated by reference.
* * * * *