U.S. patent application number 09/862392 was filed with the patent office on 2001-09-20 for adjustable coarse alignment tooling for packaged semiconductor devices.
Invention is credited to Aberasturi, Julian, Nuxoll, Jim.
Application Number | 20010022031 09/862392 |
Document ID | / |
Family ID | 23249892 |
Filed Date | 2001-09-20 |
United States Patent
Application |
20010022031 |
Kind Code |
A1 |
Nuxoll, Jim ; et
al. |
September 20, 2001 |
Adjustable coarse alignment tooling for packaged semiconductor
devices
Abstract
An apparatus and method for positioning packaged semiconductor
devices having different rectangular shapes and sizes. A
positioning apparatus includes an adjustable alignment guide
releasably coupled to a base. The adjustable alignment guide may be
positioned along a first axis to partially define a recess into
which the packaged semiconductor devices are placed during
positioning. The positioning apparatus may also include additional
adjustable alignment guides that may be positioned along the first
or a second axis to further define the recess into which the
packaged semiconductor device is to placed during positioning. The
adjustable alignment guides may have alignment surfaces against
which the integrated circuit rests when placed into the recess that
is partially defined by the alignment surfaces. The adjustable
alignment guides may be slidably attached to a base, and moved by
sliding the guides to an appropriate position according to the
shape and size of the packaged semiconductor device to be
positioned.
Inventors: |
Nuxoll, Jim; (Boise, ID)
; Aberasturi, Julian; (Boise, ID) |
Correspondence
Address: |
Kimton N. Eng, Esq.
DORSEY & WHITNEY LLP
Suite 3400
1420 Fifth Avenue
Seattle
WA
98101
US
|
Family ID: |
23249892 |
Appl. No.: |
09/862392 |
Filed: |
May 21, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
09862392 |
May 21, 2001 |
|
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|
09321266 |
May 27, 1999 |
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Current U.S.
Class: |
33/1M |
Current CPC
Class: |
Y10S 269/903 20130101;
B65H 9/101 20130101; G01R 31/2893 20130101 |
Class at
Publication: |
33/1.00M |
International
Class: |
B65H 001/00 |
Claims
1. An apparatus for positioning an integrated circuit, comprising:
a base having an upper surface; and an adjustable guide having a
plurality of guide members that define therebetween a recess into
which the integrated circuit is placed for positioning, at least
one of the guide members being releasably coupled to the upper
surface of the base and having respective adjustable positions to
adjust the shape or size of the recess.
2. The apparatus of claim 1, further comprising a second adjustable
guide detachably coupled to the upper surface of the base and
having an adjustable position along a second axis, the adjustable
guide positioned to partially define the recess into which the
integrated circuit is placed for positioning.
3. The apparatus of claim 2 wherein the first and second guides
further comprise first and second alignment surfaces, respectively,
against which the integrated circuit butts when placed into the
recess partially defined by the first and second alignment
surfaces.
4. The apparatus of claim 3 wherein the first and second alignment
surfaces are chamfered.
5. The apparatus of claim 2 wherein the adjustable guide is
slidably attached to the base and the adjustable guide is adjusted
by sliding the guide along the first axis into position to
partially define the recess.
6. The apparatus of claim 2, further comprising second, third, and
fourth adjustable guides, each guide detachably coupled to the
upper surface of the base, the second and fourth adjustable guides
having an adjustable position along a second axis, and the third
guide having an adjustable position along the first axis, the
first, second, third, and fourth adjustable guides positioned to
partially define the recess into which the integrated circuit is
placed for alignment.
7. The apparatus of claim 2 wherein the first and second axes are
orthogonal.
8. An apparatus for positioning a packaged semiconductor device,
comprising: a base; and an adjustable alignment fixture having a
first alignment surface against which the packaged semiconductor
device abuts when placed into a recess partially defined by the
first alignment surface for positioning, the adjustable alignment
fixture being releasably attached to the base and having an
adjustable position along a first axis to adjust the shape or size
of the recess.
9. The apparatus of claim 8 wherein the first alignment surface is
chamfered.
10. The apparatus of claim 8, further comprising a second
adjustable alignment fixture having a second alignment surface
against which the packaged semiconductor device abuts when
positioned in the recess partially defined by the first and second
alignment surface, the second adjustable alignment fixture
releasably attached to the base and adjustable along a second axis
to further adjust the shape or size of the recess.
11. The apparatus of claim 8, further comprising second and third
adjustable alignment fixtures releasably attached to the base and
having second and third alignment surfaces, respectively, against
which the packaged semiconductor device abuts when positioned in
the recess partially defined by the first, second, and third
alignment surfaces, the second adjustable alignment fixture
adjustable along a second axis and the third adjustable alignment
fixture adjustable along the first axis.
12. The apparatus of claim 8, further comprising second, third, and
fourth adjustable alignment fixtures releasably attached to the
base and having second, third, and fourth alignment surfaces,
respectively, against which the packaged semiconductor device abuts
when positioned in the recess partially defined by the first,
second, third, and fourth alignment surfaces, the second and fourth
adjustable alignment fixtures adjustable along a second axis and
the third adjustable alignment fixture adjustable along the first
axis.
13. The apparatus of claim 8, further comprising second, third, and
fourth adjustable alignment fixtures having second, third, and
fourth alignment surfaces, respectively, against which the packaged
semiconductor device abuts when positioned in the recess partially
defined by the first, second, third, and fourth alignment surfaces,
the second and fourth adjustable alignment fixtures adjustable
along a second axis and the third adjustable alignment fixture
adjustable along the first axis, wherein the first, second, third,
and fourth alignment fixtures are slidably attached to the
base.
14. The apparatus of claim 8 wherein the first alignment surface
defines a corner of the recess.
15. The apparatus of claim 10 wherein the first and second axes are
orthogonal.
16. An apparatus for coarsely positioning a rectangular integrated
circuit, comprising a base having a rectangular recess partially
defined on at least one side by an adjustable guide positioned
adjacent the base and having an adjustable position along a first
axis, the integrated circuit positioned by being placed into the
recess.
17. The apparatus of claim 16 wherein the adjustable guide
comprises an alignment surface against which the rectangular
integrated circuit rests when placed into the rectangular recess
partially defined on at least one side by the alignment
surface.
18. The apparatus of claim 17 wherein the alignment surface defines
a corner of the recess.
19. The apparatus of claim 16, further comprising a second
adjustable guide positioned adjacent to the base and having an
adjustable position along a second axis, the second adjustable
guide partially defining a second side of the rectangular
recess.
20. The apparatus of claim 19 wherein the first and second axes are
orthogonal.
21. The apparatus of claim 19, further comprising third and fourth
adjustable guides positioned adjacent to the base and having an
adjustable position along the first and second axes, respectively,
the third and fourth adjustable guides partially defining third and
fourth sides of the rectangular recess, respectively.
22. An automated handler for positioning an integrated circuit,
comprising: a loading mechanism for receiving and loading the
integrated circuit into the automated handler; a handler boat for
receiving the integrated circuit after being loaded into the
automated handler by the loading mechanism and for transporting the
integrated circuit within the handler, the handler boat having an
adjustable singulated positioning apparatus having a base having an
upper surface; and an adjustable guide having a plurality of guide
members that define therebetween a recess into which the integrated
circuit is placed for positioning, a first guide member being
detachably coupled to the upper surface of the base and having an
adjustable position along a first axis to adjust the shape or size
of the recess; a handler chuck for receiving the integrated circuit
from the handler boat and for positioning the integrated circuit to
a predetermined orientation; and an unloading mechanism for
receiving the integrated circuit after being positioned by the
handler chuck and for unloading the integrated circuit from the
automated handler.
23. The automated handler of claim 22, further comprising a
precisor for receiving the integrated circuit from the loading
mechanism and for coarsely aligning the integrated circuit prior to
being transferred to the handler boat, the precisor having an
adjustable singulated positioning apparatus comprising: a base
having an upper surface; and an adjustable guide having a plurality
of guide members that define therebetween a recess into which the
integrated circuit is placed for positioning, at least one of the
guide members being releasably coupled to the upper surface of the
base and having respective adjustable positions to adjust the shape
or size of the recess.
24. The automated handler of claim 22 wherein the handler chuck
comprises an adjustable singulated positioning apparatus having a
base having an upper surface; and an adjustable guide having a
plurality of guide members that define therebetween a recess into
which the integrated circuit is placed for positioning, at least
one of the guide members being releasably coupled to the upper
surface of the base and having respective adjustable positions to
adjust the shape or size of the recess.
25. The automated handler of claim 22, further comprising: an
electrical-mechanical actuation system having a positioning
mechanism coupled to the adjustable guide to position the
adjustable guide according to a control signal; and a controller
system generating the control signal and being coupled to provide
the control signal to the electrical-mechanical actuation system to
position the adjustable guide.
26. The automated handler of claim 22, wherein the handler boat
further comprises a second adjustable guide detachably coupled to
the upper surface of the base and having an adjustable position
along a second axis, the adjustable guide positioned to partially
define the recess into which the integrated circuit is placed for
positioning.
27. The automated handler of claim 26 wherein the first and second
adjustable guides further comprise first and second alignment
surfaces, respectively, against which the integrated circuit butts
when placed into the recess partially defined by the first and
second alignment surfaces.
28. The automated handler of claim 27 wherein the first and second
alignment surfaces are chamfered.
29. The automated handler of claim 22 wherein the first adjustable
guide is slidably attached to the base and the adjustable guide is
adjusted by sliding the guide along the first axis into position to
partially define the recess.
30. The automated handler of claim 22, wherein the handler boat
further comprises second, third, and fourth adjustable guides, each
guide detachably coupled to the upper surface of the base, the
second and fourth adjustable guides having an adjustable position
along a second axis, and the third guide having an adjustable
position along the first axis, the first, second, third, and fourth
adjustable guides positioned to partially define the recess into
which the integrated circuit is placed for alignment.
31. The apparatus of claim 26 wherein the first and second axes are
orthogonal.
32. A method for positioning first and second packaged
semiconductor devices having first and second shapes, respectively,
the method comprising: placing the first packaged semiconductor
device into a recess partially defined by at least one adjustable
guide member, the recess having a dimension to accommodate the
first shape; removing the first packaged semiconductor device from
the recess; adjusting the at least one adjustable guide member to
redefine the recess to have a dimension to accommodate the second
shape; and placing the second packaged semiconductor device into
the recess partially defined by the at least one adjustable guide
member.
33. The method of claim 32 wherein adjusting the at least one
adjustable guide member comprises sliding the adjustable alignment
guide along a first axis to position the adjustable alignment guide
to partially define at least one side of the recess.
34. The method of claim 32, further comprising adjusting the
position of a second adjustable alignment guide to partially define
a second side of the recess.
35. The method of claim 32, further comprising adjusting the
position of second and third adjustable alignment guides to
partially define second and third sides, respectively, of the
recess.
36. The method of claim 32, further comprising adjusting the
position of second, third, and fourth adjustable alignment guides
to partially define second, third, and fourth sides, respectively,
of the recess.
37. A method of changing a positioning apparatus having a recess
for positioning a first packaged semiconductor device of a first
size to position a second packaged semiconductor of a second size,
the method comprising: adjusting the size of a recess into which a
packaged semiconductor is placed for positioning to accommodate
positioning the second packaged semiconductor device.
38. The method of claim 37 wherein adjusting the size of the recess
comprises adjusting the position of a first adjustable alignment
guide that partially defines at least one side of the recess to
accommodate the second packaged semiconductor device.
39. The method of claim 38 wherein adjusting the position of the
first adjustable alignment guide comprises sliding the adjustable
alignment guide along a first axis to position the adjustable
alignment guide to partially define at least one side of the
recess.
40. The method of claim 38, further comprising adjusting the
position of a second adjustable alignment guide to partially define
a second side of the recess.
41. The method of claim 38, further comprising adjusting the
position of second and third adjustable alignment guides to
partially define second and third sides, respectively, of the
recess.
42. The method of claim 38, further comprising adjusting the
position of second, third, and fourth adjustable alignment guides
to partially define second, third, and fourth sides, respectively,
of the recess.
Description
TECHNICAL FIELD
[0001] The present invention relates generally to the field of
semiconductor device manufacturing, and more particularly, to an
apparatus and method of coarsely aligning a packaged semiconductor
device.
BACKGROUND OF THE INVENTION
[0002] Semiconductor devices are typically fabricated on thin
wafers of silicon. Several die are produced on each wafer, with
each die representing a single semiconductor device. Each die on a
wafer is tested for gross functionality, and sorted according to
whether the die passes or fails the gross functionality test. After
being sorted according to gross functionality, the wafers are cut
using a wafer saw and the individual die are separated. The die
determined to be non-functional are scrapped. The functional die
are packaged and further tested to ensure that each packaged device
satisfies a minimum level of performance. The reliability of the
packaged devices are tested by further subjecting them to a
"burn-in" period where the devices are tested at an elevated
voltage and elevated temperature for a period of time.
[0003] Functional devices may be permanently packaged by
encapsulating the die in a plastic package, or temporarily packaged
by mounting the die in a ceramic package. Packaging the functional
devices facilitates handling of the device and also protects the
die from damage during performance and reliability testing. The
packaged devices are typically stored in carrying trays having
recesses into which the device is placed. The packaged devices are
transported from one test station to another in the carrying
trays.
[0004] Automated device handlers are used during the testing and
burn-in phase to facilitate handling of the packaged devices. The
handlers automatically unload the packaged devices from the
carrying trays, and transport and position the devices for testing
by a test unit. The handler then reloads the packaged devices into
a carrying tray when testing is complete.
[0005] When unloading a packaged device from a carrying tray, the
handler may need to align the packaged device prior to placing it
into a handler boat. Although the carrying tray provides some
alignment, it may not be within the precision required for
placement into the handler boat without damaging the packaged
device. A mechanical structure known as a precisor is used to
coarsely align the packaged device. The packaged device is placed
into a recess in the precisor for alignment. The packaged device is
then removed from the precisor and placed into the handler boat to
be transported within the automated device handler to a handler
chuck.
[0006] The handler chuck receives the packaged device from the
handler boat and positions it to come in contact with a contactor.
The contactor has a series conductors that electrically contact the
leads of the packaged device. A tester unit connected to the
contactor applies a series of signals to the packaged device
through the series of conductors in order to test the functionality
of the device. Before the handler chuck puts the packaged device
into contact with the contactor, the packaged device must be
correctly oriented. Although the contactor is designed to receive a
packaged device that is not precisely oriented to the contactor,
the packaged device must still be coarsely aligned within a certain
measure. An incorrectly oriented packaged device may be damaged
when forced into contact with the contactor, or incorrectly tested
when the leads of the packaged device contact the incorrect
conductors because the device is misaligned with respect to the
contactor.
[0007] After testing is complete, the packaged device is pulled
away from the contactor by the handler chuck and returned to the
handler boat. The packaged device is transported by the handler
boat to be reloaded into a carrying tray.
[0008] Shown in FIG. 1 is an example of a conventional fixed
alignment tooling 2 used for coarsely aligning a packaged device 3.
The fixed alignment tooling 2 may be used in the singulated device
handling applications described previously, that is, for a
precisor, or handler boat or chuck. The fixed tooling 2 includes a
base 4 having a recess 6 defined by chamfered surfaces 8a-d. The
packaged device 3 is coarsely aligned by the chamfered surfaces
when placed into the recess 6 and rests on either on the package
balls or on the package substrate if relief for the ball pattern is
provided. The chamfered surfaces 8a-d also guide the packaged
device 3 into the recess 6 when slightly skewed and facilitate
positioning of the packaged device 3 within the recess 6. The
coarsely aligned packaged device 3 can then be transported or
transferred within the automatic handler positioned with the proper
alignment.
[0009] It can be seen that the fixed tooling 2 works only for a
packaged device having a particular shape and size. The fixed
alignment tooling 2 requires replacement when the shape or size of
the packaged device changes. The costs involved with changing the
fixed tooling 2 is considerable when refitting an entire test area.
For example, the fixed tooling of the precisor, handler boats and
chucks would need to be retrofitted to accommodate a packaged
device having a new shape or size. Fortunately, the need to change
the fixed tooling 2 arises infrequently because the shape and size
of current device package types, for example, SOJ, ZIP, or TSOP
packages, are not affected when the size of the die encapsulated
within the package is decreased.
[0010] The die size of a semiconductor device is typically shrunk
in an effort to increase the number of die fabricated on each
wafer, and consequently, increase the number of die potentially
yielded by each wafer. Die shrinks occur throughout the lifetime of
a semiconductor device. The shape and size of the package is
generally unaffected by a die shrink because each succeeding
generation of smaller die are simply encapsulated in the same sized
package as their larger progenitor. Thus, the infrequency of
changing the fixed tooling 2 allows for the associated costs to be
amortized over a relatively long period of time. However, as the
shape or size of device packages change more frequently during the
lifetime of a device, the relative costs will increase. Therefore,
it can be appreciated that there is a need for an apparatus that
can coarsely align packaged semiconductor devices and minimize the
costs associated with changing the fixed toolings whenever the size
of the device package changes.
SUMMARY OF THE INVENTION
[0011] The present invention is directed to an apparatus and method
for positioning packaged semiconductor devices having different
rectangular shapes and sizes. A positioning apparatus includes an
adjustable alignment guide that may be positioned along a first
axis to partially define a recess into which the packaged
semiconductor devices are placed during positioning. The adjustable
alignment guide may be an alignment surface against which the
integrated circuit rests when placed into the recess partially
defined by the alignment surface. The adjustable alignment guide
may be slidably attached to a base, and moved by sliding the guide
to the appropriate position according to the shape and size of the
packaged semiconductor device to be positioned. The positioning
apparatus may also include additional adjustable alignment guides
that may be positioned along the first or a second axis to further
define the recess into which the packaged semiconductor device is
to placed during positioning.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is an isometric view of a conventional coarse
alignment tooling.
[0013] FIG. 2 is an isometric view of a coarse alignment tooling
according to an embodiment of the present invention.
[0014] FIG. 3 is an isometric view of the coarse alignment tooling
of FIG. 2.
[0015] FIGS. 4A-D are partial isometric views of the coarse
alignment tooling according to several embodiments of the present
invention.
[0016] FIG. 5 is an block isometric view of an automated coarse
alignment tooling according to another embodiment of the present
invention.
[0017] FIG. 6 is a block diagram of a test system including an
automated handler having the coarse alignment tooling of FIG.
2.
DETAILED DESCRIPTION OF THE INVENTION
[0018] As discussed previously, the fixed alignment tooling must be
changed whenever the shape or size of the package device changes.
As the frequency with which the package shape or size changes
increases, the relative costs associated with re-fitting singulated
device handling equipment with new fixed alignment toolings will
also increase. Exacerbating this problem is the fact that the
frequency with which die shrinks occur has accelerated as a result
of a greater demand for smaller and faster semiconductor
devices.
[0019] Additionally, new package types are currently being
developed that have shapes and sizes that are affected by the size
of the encapsulated die. For example, fine pitch ball grid array
(FBGA) packages, and other chip scale packages (CSPs) have package
dimensions that are slightly larger than the dimension of the
encapsulated die. Therefore, each time a die shrink occurs, the
size of the resulting packaged device also decreases. Consequently,
the fixed alignment tooling must be changed to accommodate the
smaller sized package each time a die shrink occurs. As mentioned
previously, die shrinks are occurring more frequently during the
lifetime of a semiconductor device.
[0020] The present invention is embodied in an adjustable alignment
tooling 12 shown in FIG. 2. The adjustable alignment tooling 12 may
be used in precising systems utilized in singulated device handling
equipment, such as those discussed above. The adjustable alignment
tooling 12 may be adjusted to accommodate various package shapes,
thus reducing the need to replace the fixed alignment tooling
whenever the shape or size of the device package changes. The
adjustable alignment tooling 12 is especially useful in light of
the recent development in CSPs.
[0021] The adjustable alignment tooling 12 includes a base 14 and
adjustable alignment fixtures 18a-d attached to the base 14. Each
of the adjustable alignment fixtures 18a-d has a respective
alignment surface 20a-d. The adjustable alignment fixtures 18a-d
are adjusted so that the respective alignment surfaces 20a-d define
a recess 22 into which the packaged semiconductor device is placed
for coarse alignment. The alignment surfaces 20a-d are chamfered to
facilitate placement of the packaged semiconductor into the recess
22 during alignment. Once the packaged semiconductor has been
placed into the recess 22, the packaged semiconductor device is
coarsely aligned to the correct orientation. In the case where the
packaged semiconductor device is in the form of a ball grid array
("BGA"), the device will rest on either the solder balls, or on the
package substrate if relief for the solder ball pattern (not shown)
is provided.
[0022] The adjustable alignment fixtures 18a, 18c and 18b, 18d may
be adjusted along two perpendicular axes 26 and 28, respectively,
to accommodate coarse alignment of packaged semiconductor devices
having different rectangular shapes and sizes. The adjustable
alignment tooling 12 is adjusted by moving the adjustable alignment
fixtures 18a-d toward or away from the oppositely positioned
adjustable alignment fixture, thereby decreasing or increasing the
area of the recess 22. That is, adjustable alignment fixtures 18a
and 18c may be moved along the axis 26, and adjustable alignment
fixtures 18b and 18d may be moved along the axis 28, to position
the respective alignment surfaces 20a-d and define a recess 22
having an appropriate shape and size with respect to a packaged
semiconductor device.
[0023] For example, a packaged device 70 has a shape and size
defined by a length 72, a width 74, and a height 76. The adjustable
alignment fixtures 18a-d are shown in FIG. 2 as being positioned to
define a recess 22 and a surface 24 having nearly the same
dimensions as the length 72 and the width 74. Thus, when the
packaged device 70 is placed into the recess 22 it will be coarsely
aligned. Although the alignment surfaces 20a-d do not fully enclose
the recess 22, the flat surfaces of the alignment surfaces have a
length sufficient to properly orient the packaged device 70 when
placed into the recess 22.
[0024] Now consider a packaged device 80, as shown in FIG. 3,
having a length 82, a width 84, and a height 86, where the length
82 and the width 84 is less than the length 72 and width 74,
respectively. The packaged device 80 will not be coarsely aligned
if placed into the recess 22 because the dimensions of the recess
22 are too great to properly orient the packaged device 80.
[0025] In order for the adjustable alignment tooling 12 to
correctly align the packaged device 80, the adjustable alignment
fixtures 18a-d should be positioned so that the respective
alignment surfaces 20a-d define a recess 22 and a surface 24 having
nearly the same dimensions as the length 82 and the width 84. This
can be accomplished by moving the alignment fixtures 18a and 18c
toward one another along the axis 26 until the distance separating
the alignment surfaces 20a and 20c along the surface 24 is slightly
less than the width 84. Similarly, the alignment fixtures 18b and
18d should be moved toward one another along the axis 28 until the
distance separating the alignment surfaces 20b and 20d along the
surface 24 is slightly less than the length 82. When the adjustable
alignment fixtures 18a-d are positioned in such a manner, the
packaged device 80 will be coarsely aligned to the proper
orientation when placed into the recess 22 and rests on the
alignment surfaces 20a-d.
[0026] As will be appreciated by a person of ordinary skill in the
art, the adjustable alignment tooling 12 may be adjusted to
correctly align packaged devices having different rectangular
shapes, as well as packaged devices having different sizes. For
example, if only the width 74 were to decrease while the length 72
were to remain constant (FIG. 2), the adjustable alignment fixtures
18a and 18c could be moved toward one another along the axis 26 so
that the packaged device 70 could still be correctly aligned by the
adjustable alignment tooling 12 when positioned in the recess 22.
Similarly, the adjustable alignment tooling 12 could have only two
adjacent adjustable alignment fixtures and still accommodate
packaged devices of various rectangular shapes and sizes. For
example, with reference to FIG. 2, the alignment fixtures 18a and
18d should have fixed positions while alignment fixtures 18b and
18c would remain adjustable along the axes 28 and 26, respectively.
When correctly aligning a different shaped or sized packaged
device, only adjustable alignment fixtures 18b and 18c would be
adjusted to accommodate the new packaged device. One corner of the
recess 22 is defined by the fixed alignment fixtures 18a and 18d,
while the diagonal corner of the recess 22 is defined by the
adjustable alignment fixtures 18b and 18c. By defining two corners
of the recess 22, the new packaged device can be correctly aligned
when placed into the resulting recess 22.
[0027] As illustrated above, the number of adjustable alignment
fixtures may range from one to four, depending on the flexibility
desired and the specific application. In the case where the
adjustable alignment tooling 12 has only one adjustable alignment
fixture, it can accommodate packaged devices having different
dimensions only along one axis, that is, either a different length
or width.
[0028] The adjustable alignment fixtures 18a-d may be positioned on
and attached to the base 14 in a variety of manners. One example is
shown in FIG. 4A with respect to the adjustable alignment fixture
18c. A slot 30 is formed through the alignment fixture 18c. A pin
34 is fixed to the base 14 and protrudes perpendicular to the
surface of the base to fit into the slot 30. A screw 32 also fits
through the slot 30 and threads into a threaded hole formed in the
surface of the base 14. The pin 34 and the screw 32 are aligned
along the axis 26. In this arrangement, movement of the adjustable
alignment fixture 18c will be along the axis 26 when the screw 32
is loosened. After the adjustable alignment fixture 18c is properly
positioned, the screw 32 is tightened snug so that the overlapping
portion of the screw head contacting the upper surface of the
adjustable alignment fixture 18c will hold it in place. If so
desired, the pin 34 may be replaced by a second screw if a second
threaded hole is formed into the base 14.
[0029] Another arrangement for attaching the adjustable alignment
fixtures 18a-d to the base 14 is shown in FIG. 4B with respect to
the adjustable alignment fixture 18c. Two slots 36a and 36b are
formed through the alignment fixture 18c. The two slots 36a and 36b
are formed laterally from each other and parallel to the axis 26.
Two screws 38a and 38b fit through slots 36a and 36b, respectively,
and thread into threaded holes formed in the base 14. The alignment
fixture 18a may be moved in a direction along the axis 26 when the
screws 36a and 36b are loosened. Once correctly positioned, the
alignment fixture 18a may be held in place by tightening the screws
36a and 36b snug against the upper surface of the alignment fixture
18a.
[0030] The adjustable alignment fixtures 18a-d may also be attached
to the base 14 through the arrangement shown in FIG. 4C with
respect to alignment fixture 18c. A slot 40 is formed through the
base 14. A screw 42 is fit through the slot 40 and threads into a
threaded hole formed into the lower surface of the alignment
fixture 18c. A recessed region is also formed in the base 14 along
the slot 40 to accommodate the head of the screw 42. A pin 44
protrudes perpendicularly from the lower surface of the alignment
fixture 18c and fits into the slot 40. The pin 44 and the screw 42
are both aligned along the axis 26 to ensure that movement of the
alignment fixture 18c is along the axis 26. The alignment fixture
18c may be adjusted to the correct position and held in place by
tightening the screw 42 snug.
[0031] The adjustable alignment fixtures 18a-d may also be attached
to the base 14 through the arrangement illustrated in FIG. 4D with
respect to alignment fixture 18c. Two pins 52, 54 protruding from
the bottom surface of the adjustable alignment fixture 18c fit into
a series of evenly spaced holes 56 formed in the surface of the
base 14. The alignment fixture 18c can be moved by lifting it away
from the surface of the base 14 until the two pins 52, 54 are
removed from the holes 56. The alignment fixture 18c is then
repositioned by reinserting the pins 52, 54 into another set of the
holes 56. The frictional fit between the pins 52, 54 and the holes
56 will prevent the alignment fixture from being inadvertently
removed.
[0032] The movement of the adjustable alignment fixtures 18a-d may
also be performed through automated means, as shown in FIG. 5, if
the alignment fixtures 18a-d are coupled to a computer driven
actuating system 60. Such an arrangement allows the adjustable
alignment tooling 12 to be quickly adjusted to accommodate a
variety of rectangular shaped device packages. A computer driven
actuation system having a computer 62 and an actuator 64 may be
incorporated into a handler so that the computer 62 may be
programmed to move the adjustable alignment fixtures 18a-d via
connecting arm 66 to predetermined positions whenever a different
shaped packaged device is tested. An automated actuation system as
described is well known in the art, and may be employed in the
precising systems utilized in singulated handling equipment
described previously.
[0033] Although specific arrangements of attaching the adjustable
alignment fixtures 18a-d to the base 14 have been provided above,
the principles of the present invention are applicable regardless
of the specific form of attachment. Accordingly, the present
invention is not limited by the specific method of attaching the
adjustable alignment fixtures 18a-d to the base 14.
[0034] A person of ordinary skill in the art will appreciate that
the minimum size of the recess 22 defined by the adjustable
alignment fixtures 18a-d is limited by the length of the respective
alignment surfaces 20a-d. The minimum size of the recess 22 will
result when the adjustable alignment fixtures 18a-d are moved
toward one another until the adjacent alignment fixtures butt
against the alignment fixture being moved. This situation is
illustrated in FIG. 3. However, the adjustable alignment fixtures
18a-d may be replaced with adjustable alignment fixtures having
alignment surfaces 20a-d with decreased widths. Consequently, the
respective adjustable alignment fixtures 18a-d may be moved closer
together to accommodate smaller packaged devices.
[0035] Shown in FIG. 6 is a block diagram of a test system 70 for
packaged semiconductor devices. An automated handler 72 is includes
a loading mechanism 74 that loads packaged semiconductor devices
into the automated handler 72. The devices are placed into a
precisor 75 to be coarsely aligned. The precisor includes an
embodiment of an adjustable alignment tooling 12 according to the
principles of the present invention. A handler boat 76 receives the
packaged devices from the precisor 75 and provides the device to a
handler chuck 78. The handler boat 76 also includes an embodiment
of the adjustable alignment tooling 12 so that the device is
coarsely aligned when transferred to the handler chuck 78. The
handler chuck 78 receives the device from the handler boat 76 and
positions the device in physical proximity to a test head 84 having
a contactor 82. As mentioned previously, when the device comes into
contact with the contactor 82, electrical signals generated by a
test unit 86 may be applied to the device. In order to correctly
position the device within the contactor 82, the handler chuck also
includes an embodiment of the adjustable alignment tooling 12 that
aligns the device with respect to the contactor 82. After testing
of the device is complete, the handler chuck 78 withdraws the
device from the contactor 82, and returns the device to the handler
boat 76. The handler boat 76 receives the device and provides the
device to an unloading mechanism 80, which unloads the device from
the automated handler 72 and returns the device to a carrying
tray.
[0036] From the foregoing it will be appreciated that although
specific embodiments of the invention have been described herein
for purposes of illustration, various modifications may be made
without deviating from the spirit and scope of the invention. For
example, the adjustable alignment fixtures 18a-d have been shown as
being positioned to align a packaged device having a square shape.
However, the adjustable alignment fixtures 18a-d may be adjusted
for a packaged device having a rectangular shape as well.
Furthermore, the present invention has been described with respect
to handling a packaged device during testing. However, some or all
of the principles of the present invention are applicable to other
operations where singulated packaged device handling equipment is
used. For example, tape and reel, device inspection, and packing
operations. Furthermore, as will be appreciated by one skilled in
the art, a plurality of adjustable alignment toolings according to
the embodiments described previously may be used together to
facilitate the mass production of semiconductor devices. For
example, with reference to FIG. 6, the precisor 75, handler boat
76, and the handler chuck 78, may each include more than one
adjustable alignment tooling 12 so that several semiconductor
devices may be tested simultaneously. Accordingly, the invention is
not limited except as by the appended claims.
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