U.S. patent application number 09/099395 was filed with the patent office on 2001-09-06 for sheet-framed ic carrier and method for producing the same.
This patent application is currently assigned to DAI NIPPON PRINTING CO., LTD.. Invention is credited to IGARASHI, EIICHI, TAKEDA, MITSUNORI, YOSHIDA, HIDEYO.
Application Number | 20010018984 09/099395 |
Document ID | / |
Family ID | 16080564 |
Filed Date | 2001-09-06 |
United States Patent
Application |
20010018984 |
Kind Code |
A1 |
TAKEDA, MITSUNORI ; et
al. |
September 6, 2001 |
SHEET-FRAMED IC CARRIER AND METHOD FOR PRODUCING THE SAME
Abstract
A frame sheet comprises a core sheet, and oversheets. A recess
is formed in the sheet frame. The oversheet is left in the recess
in the sheet frame, and an IC carrier is mounted in the recess. The
IC carrier is held, adhered to the oversheet left in the
recess.
Inventors: |
TAKEDA, MITSUNORI;
(SHINJUKU-KU, JP) ; IGARASHI, EIICHI;
(SHINJUKU-KU, JP) ; YOSHIDA, HIDEYO; (SHINJUKU-KU,
JP) |
Correspondence
Address: |
PARKHURST & WENDEL
1421 PRINCE STREET
SUITE 210
ALEXANDRIA
VA
223142805
|
Assignee: |
DAI NIPPON PRINTING CO.,
LTD.
|
Family ID: |
16080564 |
Appl. No.: |
09/099395 |
Filed: |
June 18, 1998 |
Current U.S.
Class: |
174/256 ;
174/257; 174/258; 361/737 |
Current CPC
Class: |
H01L 2924/00 20130101;
G06K 19/07739 20130101; H01L 2924/0002 20130101; G06K 19/07745
20130101; Y10T 29/49139 20150115; Y10T 29/4913 20150115; H01L
2924/0002 20130101 |
Class at
Publication: |
174/256 ;
174/257; 174/258; 361/737 |
International
Class: |
H05K 001/03; H05K
001/09 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 23, 1997 |
JP |
180286/1997 |
Claims
What is claimed is:
1. A sheet-framed IC carrier comprising: a sheet frame including a
core sheet and an oversheet provided on at least one surface of the
core sheet, and including a recess formed therein with the
oversheet left; and an IC carrier mounted in the recess of the
sheet frame, held by the oversheet left in the recess and including
an IC module.
2. A sheet-framed IC carrier according to claim 1, wherein a
fusion-preventing layer is provided on an adhesion surface of the
IC carrier to which the oversheet is adhered.
3. A sheet-framed IC carrier according to claim 2, wherein the
fusion preventing layer is formed on a surface of the IC carrier on
the side of the IC module.
4. A sheet-framed IC carrier according to claim 2, wherein the
fusion preventing layer is formed on a surface of the IC carrier on
the opposite side of the IC module.
5. A sheet-framed IC carrier according to claim 2, wherein the
fusion preventing layer is a print application layer of a
solvent-free photo-setting or thermo-setting ink.
6. A sheet-framed IC carrier according to claim 2, wherein the
fusion preventing layer includes a number of halftone dots, the
fusion preventing layer is divided in a plurality of regions, and
halftone dot area percentages of the respective regions are
different from each other.
7. A sheet-framed IC carrier according to claim 1, wherein the IC
carrier includes another core sheet and another oversheet provided
on at least one surface of the core sheet; and the core sheets of
the sheet frame and the IC carrier and the oversheets of the sheet
frame and the IC carrier are formed of the same composition
respectively.
8. A sheet-framed IC carrier according to claim 7, wherein the core
sheets of the sheet frame and the IC carrier, and the oversheets of
the sheet frame and the IC carrier are formed of vinyl chloride
resin.
9. A sheet-framed IC carrier according to claim 1, wherein the core
sheet or the oversheet is formed of polycarbonate resin; a mixture
of polycarbonate resin and ABS resin; a mixture of polycarbonate
resin and PET resin; or a mixture of polycarbonate resin and PBT
resin.
10. A method for producing a sheet-framed IC carrier including a
sheet frame which has a core sheet and an oversheet provided on at
least one surface of the core sheet and has a recess formed therein
with the oversheet left; and an IC carrier which is mounted in the
recess of the sheet frame and held by the oversheet left in the
recess, and has an IC module, the method comprising the steps of:
laying the oversheet on at least one surface of the core sheet and
press-fusing the core sheet and the oversheet to each other;
spot-facing the core sheet to form the recess; forming in the core
sheet a peripheral slit to be a peripheral edge of the IC carrier;
and mounting the IC module in the recess.
11. A method for producing a sheet-framed IC carrier according to
claim 10, further comprising the step of providing a required print
layer on the core sheet before the oversheet is laid on the core
sheet.
12. A method for producing a sheet-framed IC carrier according to
claim 10, further comprising the step of forming a fusion
preventing layer on a portion of the core sheet corresponding to
the IC carrier before the oversheet is laid on the core sheet.
13. A method for producing a sheet-framed IC carrier according to
claim 12, wherein the fusion preventing layer is formed on a
surface of the core sheet on the side of the IC module.
14. A method for producing a sheet-framed IC carrier according to
claim 12, wherein the fusion preventing layer is formed on a
surface of the core sheet on the oppositse side of the IC
module.
15. A method for producing a sheet-framed IC carrier according to
claim 12, wherein the fusion preventing layer is formed of a
solvent-free photo-setting or thermo-setting ink.
Description
TECHNICAL FIELD OF THE INVENTION
[0001] The present invention relates to a small-sized IC carrier
with an IC module mounted on, and a method for producing a
sheet-framed IC carrier including a sheet frame.
BACKGROUND ART
[0002] FIG. 11(A) is a view which explains a conventional IC
carrier and a method for using the same.
[0003] As shown in FIG. 11(A), an IC carrier 41 has an IC module 42
mounted on, which includes a CPU, memories, electrodes, etc.
integrated. The IC carrier 41 is used as, for example, SIMs
(Subscriber Identity Module) of portable telephones, etc.
[0004] A user acquires an SIM, which corresponds to a telephone
subscription, and can buy a portable telephone 50 of common
specifications in accordance with his use, and he uses the portable
telephone 50 with the SIM (the IC carrier 41) mounted thereon.
[0005] However, the IC carrier 41 1s not sufficiently prevalent and
is limited in uses, and construction of special plants for
mass-production of the IC carrier 41 will lead to cost increase. In
a case that the IC carrier 41 is used as an SIM, the IC carrier 41
is mailed in an envelope, and its enveloping operation is
bothering. A subscriber who has received the SIM might erroneously
handle and break the SIM before mounting the SIM on the portable
telephone 50 or might lose.
[0006] In consideration of the above, it is proposed that the IC
card 40 is formed by the conventional equipments, and as shown in
FIG. 11(B), a slit 44 for facilitating the removal of the IC card
40 is formed in a sheet frame 43 with bridges 45 left at a
plurality of positions to enable the IC carrier 41 alone to be
removed for use. This proposal allows not only the conventional
equipments for producing and inspecting the IC card but also the
conventional issue and mail systems of the IC card to be used as
they are.
[0007] However, in the IC carrier of such conventional structure,
when the IC carrier is removed form the IC base, disadvantageously
loads, such as flex, torsion, etc. are applied to the IC module 42,
with possible risks of breakage, leap-out, etc. Disadvantageously
the bridges remain as residual projections when the IC carrier is
removed from the sheet frame 43, which makes it difficult for the
IC carrier is placed in a mount of the portable telephone 50 and
which reversely may damage the IC carrier.
[0008] FIG. 12(A) is a view which explains another example of the
conventional IC carrier.
[0009] An application (Japanese Patent Laid-Open Publication No.
276870/1995) filed by the applicant of the present application
before the filing of the present application proposed an IC card 40
comprising, as shown in FIG. 12(B), an adhesive layer 46a provided
on one surface of a sheet frame 43 having a recess, and a backing
film 46 adhered to the backside of the sheet frame 43 through the
adhesive layer 46a. An IC carrier 41 is held fixed in the recess by
the adhesive layer 46a applied to the backing film 46.
[0010] This example also need the step specialized in providing the
backing film 46 to the backside of the sheet frame 43, which
disadvantageously adds to costs. Disadvantageously it is difficult
to adhere the baking film 46 flat with no air layer between the
sheet frame 43 and the same.
SUMMARY OF THE INVENTION
[0011] In view of the above-described disadvantages the present
invention was made, and an object of the present invention is to
provide a sheet-framed IC carrier which permits an IC carrier to be
properly held in a sheet frame without the use of the bridges and
backing film, and a method for producing the sheet-framed IC
carrier.
[0012] The present invention relates to a sheet-framed IC carrier
comprising a sheet frame including a core sheet and an oversheet
provided on at least one surface of the core sheet, and including a
recess formed therein with the oversheet left; and an IC carrier
mounted in the recess of the sheet frame, held by the oversheet
left in the recess and including an IC module. The present
invention also relates to a method for producing a sheet-framed IC
carrier including a sheet frame which has a core sheet and an
oversheet provided on at least one surface of the core sheet and
has a recess formed therein with the oversheet left; and an IC
carrier which is mounted in the recess of the sheet frame and held
by the oversheet left in the recess, and has an IC module, the
method comprising the step of laying the oversheet on at least one
surface of the core sheet and press-fusing the core sheet and the
oversheet to each other; the step of spot-facing the core sheet to
form a recess; the step of forming in the core sheet a peripheral
slit to be a peripheral edge of the IC carrier; and the step of
mounting the IC module in the recess.
[0013] In the sheet-framed IC carrier according to the present
invention as the IC carrier is held, releasably adhered to the
oversheet on the sheet frame, with the recess formed, the IC
carrier can be easily released from the sheet frame when
required.
[0014] Furthermore, contrary to the conventional IC carrier which
is held by the sheet frame through bridges, the IC carrier of the
present invention is free from residues and breakages of the edge
caused by breakage of the bridges. It is not necessary to use a
special material and use a separate step, contrary to the
conventional case that the IC carrier is held by an adhesive
film.
[0015] In the method for producing the sheet-framed IC carrier
according to the present invention, such sheet-framed IC carrier
can be produced easily and at low costs by using the conventional
equipments.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1(A) is a plan view of the sheet-framed IC carrier
according to a first embodiment of the present invention.
[0017] FIG. 1(B) is an A-A sectional view of FIG. 1A.
[0018] FIG. 1(C) is a backside view of the sheet-framed IC carrier
according to the first embodiment of the present invention.
[0019] FIG. 2(A) is a plan view of the sheet-framed IC carrier
according to a second embodiment of the present invention.
[0020] FIG. 2(B) is an A-A sectional view FIG. 2A.
[0021] FIG. 2(C) is a backside view of the sheet-framed IC carrier
according to the second embodiment of the present invention.
[0022] FIG. 3 is a sectional view of the sheet-framed IC carrier
according to a third embodiment of the present invention.
[0023] FIG. 4 is a sectional view of the sheet-framed IC carrier
according to a fourth embodiment of the present invention.
[0024] FIG. 5(A) is a plan view of the IC carrier.
[0025] FIG. 5(B) is a backside view of the IC carrier.
[0026] FIG. 6 is a plan view detailing the IC carrier.
[0027] FIG. 7 is a view of the steps of producing the sheet-framed
IC carrier according to the present invention.
[0028] FIG. 8(A) is a view explaining the fusion preventing layer
provided on the IC carrier.
[0029] FIG. 8(B) is a view explaining the fusion preventing layer
provided on the IC carrier.
[0030] FIG. 8(C) is a view explaining the fusion preventing layer
provided on the IC carrier.
[0031] FIG. 9(A) is a view of a state of the IC carrier held on the
upper oversheet being peeled off.
[0032] FIG. 9(B) is a view of a state of the IC carrier held on the
upper oversheet being peeled off.
[0033] FIG. 10(A) is a view of a state of the IC carrier held on
the lower oversheet being peeled off.
[0034] FIG. 10(B) is a view of a state of the IC carrier held on
the lower oversheet being peeled off.
[0035] FIG. 11(A) is a view of the conventional IC carrier and a
view explaining a use thereof.
[0036] FIG. 11(B) is a view of the conventional IC carrier and a
view of a use thereof.
[0037] FIG. 12(A) is a plan view of another example of the
conventional IC carrier.
[0038] FIG. 12(B) is a B-B sectional view of FIG. 12(A).
PREFERRED EMBODIMENTS
[0039] A First Embodiment of the Sheet-Framed IC Carrier
[0040] FIGS. 1(A) to 1(C), FIGS. 5(A) to 5(B), and FIG. 6 are views
of the sheet-framed IC carrier according to a first embodiment of
the present invention. FIG. 1(A) is a plan view of the sheet-framed
IC carrier according to the first embodiment. FIG. 1(B) is a
sectional view of the sheet-framed IC carrier according to the
first embodiment along A-A in FIG. 1(A). FIG. 1(C)is a backside
view of the sheet-framed IC carrier according to the first
embodiment of the present invention.
[0041] As shown in FIGS. 1(A) to 1(C), the sheet-framed IC carrier
10 comprises a sheet frame 13 with a recess 30(FIG. 9(B) formed in
which has a core sheet 21 and oversheets 22. 23 provided on both
surfaces of the core sheet 21, and an IC carrier 11 mounted in the
recess 30 of the sheet frame 13 and having an IC module 12 mounted
on. One of the oversheets, e.g., the oversheet 22 is left in the
recess 30 of the sheet frame 13, and the IC carrier in the recess
is secured, and adhered to the oversheet 22.
[0042] The core sheet 21 of the sheet frame 13 and the oversheet 22
are formed of a resin sheet, as of vinyl chloride resin or others,
and the IC carrier 11 is held by the oversheet 22 on the side of
the module 12. A peripheral edge slit 13a is formed in the core
sheet 21 and the oversheet 23 along the outer periphery of the IC
module 12. The peripheral edge slit 13a is shown by the dot line in
FIG. 1(A) and by the solid line in FIG. 1(C). A display 18a is
provided on the sheet frame 13, and a display 18b is provided on
the IC carrier 11. A sign panel 19 is provided on the sheet frame
13. A fusion preventing layer 14 for preventing fusion with the
oversheet 22 is provided on the surface of the IC carrier 11 on the
side of the IC module 12.
[0043] Then, the IC carrier 11 will be detailed with reference to
FIGS. 5(A) and 5(B), and FIG. 6.
[0044] FIG. 5(A) shows the surface of the IC carrier, and FIG. 5(B)
shows the backside of the IC carrier. As shown in FIG. 5(A), the IC
carrier 11 comprises a base 11a of a resin of a length Y1 (about
15.00 mm).times.a width X1 (about 25.00) and the IC module 12 of a
length Y2 (an about 10.6 mm).times.a width X2 (about 12.0 mm)
mounted on the base 11a. A cut-off 11b is formed on the base 11a
for positioning the IC carrier 11 when the IC carrier 11 is mounted
on a machine or tool for the IC carrier 11 to be mounted on. The
cut-off 11b has a length Z of about 3.00 mm.
[0045] FIG. 6 is a plan view detailing another example of the IC
carrier according to the present invention. The IC carrier 11
comprises a base 11a, and an IC module 12 mounted on the base 11a.
The IC module 12 has an external terminal 12c including 8 contacts
(C1-C8), and the respective external terminals 12c are
substantially quadrangular. It is preferable that the external
terminal 12c is positioned in accordance with ISO (a position of an
IC module of an IC card in accordance with ISO). That is, as viewed
in FIG. 6, a distance a, a distance b, a distance c and a distance
d from the left edge of the IC carrier 11 are respectively 4.0 mm
at maximum, 6.0 mm at minimum, 11.62 mm at maximum and 13.62 mm at
minimum, and a distance e, a distance f, a distance g, a distance
h, a distance i, a distance j, a distance k and a distance 1 from
the upper edge of the IC carrier 11 are respectively 2.75 mm at
maximum, 4.45 mm at minimum, 5.29 mm at maximum, 6.99 mm at
minimum, 7.83 mm at maximum, 9.53 at minimum, 10.37 mm at maximum
and a 12.07 at minimum. As viewed in FIG. 6, distances o and q of
the IC carrier 11 from edges of the sheet frame 13 are respectively
16.48 mm and 6.25 mm. The IC carrier 11 has a shape having a
dimension p of 15.+-.0.1 mm and a dimension r of 25.+-.0.1 mm. The
cut-off has a size having dimensions m and n of 3.+-.0.1 mm.
[0046] Then, materials of the respective members will be described.
The core sheets 21 of the sheet frame 13 and the IC carrier 11 are
formed of vinyl chloride but may be formed of a hard resin, as of
acryl, polymethylmethacrylate, polycarbonate,
acrylonitrile-butadiene-styrene copolymer (ABS),
polybutyleneterephthalate (PBT), polymer alloys of these resins, or
others. Of these resins acryl resin and polycarbonate resin, which
are capable of being easily cut, which allows the spot-facing with
high precision. Generally hard vinyl chloride with no or a small
amount (1-5%) of a plasticizer added is used.
[0047] A material and a thickness of the oversheets 22, 23
preferably have an above 80% total light transmission. The
oversheets 22, 23 having a high light transmission are transparent
and make color tones of printed pictures and patterns visible
without impairing appearance. The oversheets 22, 23 can be formed
of a resin of polyvinyl chloride, polycarbonate,
polymethylmethacrylate, polybutyleneterephthalate (PBT), cellulose
acetate, nylon, ethylene-vinyl acetate copolymer saponificate,
polypropylene, polyvinyl butyral, acrylonitrile-butadienestyrene
copolymer, methyl methacrylate-butadiene-styrene copolymer or a
polymer alloy of them as long as they have good thermal fusion with
the core sheet 21.
[0048] A printing ink vehicle forming the fusion preventing layer
14 is preferably one that is not dissolved with the core sheet 21
and the oversheets 22, 23 when heated. That is, vinyl chloride and
other vinyl-based ones are not used, but cellulose-based ones, as
of nitrocellulose, ethyl cellulose, etc., can be used for this end.
The printing ink vehicle containing a solvent dissolves the
material of the core sheet 21 and tends to cause the fusion.
Accordingly it is also preferable that the printing ink is composed
of a photo-setting or thermo-setting monomer and contains no
solvent. As the photo-setting ink a (metha)acrylate-modified resin
monomer, such as urethane-based (metha)acrylate, polyester-based
(metha)acrylate or others can be used together with a reactive
diluent and a photo-setting initiator.
[0049] A Second Embodiment of the Sheet-Framed IC Carrier
[0050] FIG. 2(A) is a plan view of the sheet-framed IC carrier
according to a second embodiment of the present invention. FIG.
2(B) is a sectional view of the sheet-framed IC carrier along the
line A-A in FIG. 2(A). FIG. 2(C) is a backside view of the
sheet-framed IC carrier according to the second embodiment.
[0051] The second embodiment shown in FIGS. 2(A) to 2(C) is
different from the first embodiment only in that an IC carrier is
mounted in a recess 30 in a sheet frame 13, and the IC carrier is
held, adhered to an oversheet 23 below a core sheet 21, but is
substantially the same as the first embodiment shown in FIGS. 1(A)
to 1(C), FIGS. 5(a) to 5(B) and FIG. 6. The same members of the
second embodiment as those of the first embodiment are represented
by the same reference numbers not to repeat their detailed
explanation.
[0052] A sheet-framed IC carrier according to the present
embodiment includes an IC carrier 11 and a sheet frame 13. The
sheet frame 13 is formed of a sheet resin of vinyl chloride or
others. The IC carrier 11 is held by an oversheet 23 on the
opposite side of an IC module. A peripheral edge slit 13a is formed
along a peripheral edge of the IC carrier 11. The peripheral edge
slit 13a is indicated by the solid line in FIG. 2(A) and indicated
by the dot line on the backside shown in FIG. 2(C).
[0053] A fusion preventing layer 14 for preventing the fusion with
the oversheet 23 is provided on the surface of the IC carrier 11
opposite to the IC module 12.
[0054] A Third Embodiment of the Sheet-Framed IC Carrier
[0055] Next, the sheet-framed IC carrier according to a third
embodiment of the present invention will be explained with
reference to FIG. 3.
[0056] The third embodiment shown in FIG. 3 is different from the
first only in the structure of the IC carrier 11 but is
substantially the same in the other points as the first embodiment
shown in FIG. 1(A) to 1(C), FIG. 5(A) to 5(B) and FIG. 6. The same
members of the third embodiment as those of the first embodiment
are represented by the same reference numbers not to repeat their
detailed explanation.
[0057] In FIG. 3, a sheet frame 13 comprises a core sheet 21
including an upper core sheet 21a and a lower core sheet 21b;
oversheets 22, 23; and an IC module recess 17 formed by machining
the core sheet 21 by means of a spot-facing tool. An IC module 12
of the IC carrier 11 is mounted in the IC module recess 17 machined
by the spot-facing tool and is secured to the IC module recess 17
by an adhesive 31. Hollows 17a, 17b are formed in the IC module
recess 17 and function to receive an excess of the adhesive and
mitigate flexural stress. The IC module 12 is adhered especially to
a projection 17c in the IC module recess 17. The IC module can be
fabricated, for example, by mounting an IC chip 12a on a print
substrate 12b and molding the IC chip 12a with a sealing resin 12d.
The surface of the IC module 12 is an external terminal 12c.
[0058] In the present embodiment, a peripheral edge slit 13a
defining a peripheral edge of the IC carrier 11 is formed by
spot-facing the opposite side of the IC module 12 by a spot-facing
tool, and the IC carrier 11 is held by the oversheet 22. A fusion
preventing layer 14 is formed between the oversheet 22 and the IC
carrier 11 and prevents complete fusion of the IC carrier 11 with
the oversheet 22 to allow the IC carrier 11 to be easily peeled off
at this part.
[0059] In this case, the fusion preventing layer 14 is provided on
the surface of the upper core sheet 21a forming the IC carrier 11.
Printed layers 15, 16 are respectively provided on the surface of
the core sheet 21 and the backside of the oversheet 23.
[0060] A Fourth Embodiment of Sheet-Framed IC Carrier
[0061] Next, with reference to FIG. 4, the sheet-framed IC carrier
according to a fourth embodiment of the present invention will be
explained. The fourth embodiment shown in FIG. 4 is different from
the third embodiment shown in FIG. 3 only in that an IC carrier 11
is mounted in a recess 30 in a sheet frame 13, and the IC carrier
11 is held by an lower oversheet 23 of a core sheet 21 but is
substantially the same in the other points as the third embodiment
shown in FIG. 3.
[0062] The same members of the fourth embodiment as those of the
third embodiment are represented by the same reference numbers not
to repeat their detailed explanation.
[0063] In FIG. 4 a peripheral edge slit 13a defining a peripheral
edge of the IC carrier 11 is formed from the side of the IC module
12 by a spot-facing tool, and the IC carrier 11 is held by the
oversheet 23. A fusion preventing layer 14 is formed between the
oversheet 23 and the IC carrier 11, and prevents complete fusion of
the IC carrier 11 with the oversheet 23 and allows the IC carrier
11 to be easily peeled off at this part.
[0064] In this case, the fusion preventing layer 14 is provided on
the surface of a lower core sheet 21b forming the IC carrier
14.
[0065] In the third and the fourth embodiments the IC carrier 11
can be easily removed from the sheet frame 13, but in the fourth
embodiment the IC carrier 11 is contact the oversheet 23 at a
larger area than in the third embodiment to strongly secure the IC
carrier 11. The oversheet 22 remains on the side of the IC module
12 after the IC carrier 1 has been removed, which allows the IC
carrier 11 to have better appearance.
[0066] Embodiments of Production of the Sheet-Frame IC Carrier and
Use of the Sheet-Framed IC Carrier
[0067] FIG. 7 is a flow chart of the production process of the
sheet-framed IC carrier according tot he present invention.
[0068] First in accordance with the method of producing a usual
plastic card, the core sheet 21 having the upper core sheet 21a and
the lower core sheet 21b to be the front side and the back side of
the core sheet 21, and the upper and the lower oversheets 22, 23
are laid one on another and press-adhered. The core sheet 21 may be
formed of one sheet as required, and therefore either of the upper
and the lower oversheets 22, 23 may be omitted.
[0069] Before the above press-adhered process, the usual ornamental
print layer 15 is suitably provided on a surface 21 of the core
sheet 21 to be faced outside by silk screen printing or offset
printing (S1, S2). The oversheets 22, 23 are cut off into a
required size (S3).
[0070] Then, the fusion preventing layer 14 is provided on the core
sheet 21 by printing or other means (S4, S5). As described above,
the fusion preventing layer 14 is for forming the peeling portion
where the IC carrier 11 is easily peeled off (released off) the
oversheets 22, 23. The fusion preventing layer 14 is formed on the
surface of the upper core sheet 21a on the side of the IC module
12, which contacts the oversheet 22 in the third embodiment shown
in FIG. 3, and in the fourth embodiment shown in FIG. 4 on the
surface of the lower core sheet 21b, which contacts the oversheet
23. Accordingly, either of the steps S4 and S5 is selected in
accordance with specifications.
[0071] The fusion preventing layer 14 can be formed by a method
other than offset printing, but offset printing is more
advantageous in that the function of the fusion preventing layer 14
can be optionally adjusted dependidng on area percentages of
halftone dots, and the fusion preventing layer 14 can be formed
thin. The same effect can be achieved by halftone dot typographic
printing or inverted halftone gravure although their practical
possibility is low. Silk screen printing and the usual coating will
find it difficult to control halftone dot area percentages.
[0072] To facilitate the peel-off, an area percentage of halftone
dots forming the fusion preventing layer 14 is suitably 60-80%. For
some fusability, a 40-60% halftone dot area percentage is suitable.
When a halftone dot area is below 40%, strong fusion takes place
between the oversheets 22, 23 and the core sheet 21, unpreferably
with a risk that the IC carrier might be broken. But a degree of
the fusion prevention depends on characteristics of an ink and the
following press conditions, and further material qualities of the
oversheets 22, 23 and the core sheet 21, and the above-described
halftone dot area percentage cannot be uniformly defined.
[0073] The fusion preventing layer 14 can have a higher halftone
dot area percentage at the peripheral edge of the IC carrier 11 and
a lower hafltone dot area percentage at the central part of the IC
carrier 11. When the IC carrier 11 is peeled off, usually the
peripheral part of the IC carrier 11 will be pressed with finger
tips to peel off a part of the edge of the IC carrier 11, and the
partially peeled edge is pinched with fingers to release the IC
carrier 11. Accordingly, it is not necessary that the IC carrier 11
is made especially easily releasable at the part other than the
peripheral part thereof, and the hafltone dot area is smaller at
the central part of the IC carrier 11. In a case that the IC
carrier 11 generally has very weak adhesion with respect to the
oversheets 22, 23, a problem is that the IC carrier 11 may
unexpectedly fall and be lost.
[0074] Next, arrangement of the halftotne dots on the fusion
preventing layer 14 will be explained with reference to 13 FIGS.
8(A) to 8(C). FIG. 8(A) shows a case that the fusion preventing
layer 14 is printed on the surface of the IC carrier 11 on the side
of the IC module 12. FIG. 8(B) shows a case that the fusion
preventing layer 14 is printed on the backside. In both cases the
fusion preventing layer 14 can be formed in the same way. FIGS.
8(A) and 8(B) respectively show in the enlarged circles larger-area
hafltone dots 14a provided on the peripheral part of the IC carrier
11, and smaller-area halftone dots 14b provided at the central part
of the IC carrier 11.
[0075] In this case, in FIG. 8(A) the IC carrier is held by the
oversheet 22 (see FIG. 1(B)), and in FIG. 8(B) the IC carrier is
held by the oversheet 23 (see FIG. 2(B)).
[0076] It is possible that as shown in FIG. 8(C), the surface of
the IC carrier 11 on the side of the IC module 12 is divided in two
regions, and the fusion preventing layer 14 is not provided in one
region 33 with the IC module 12 and is provided only in the other
region 34. The IC carrier 11 shown in FIG. 8(C) substantially
corresponds to that shown in FIG. 8(A). In the IC carrier 11 shown
in 8(C), the fusion preventing layer 14 is provided in the other
region 34, whereby the IC carrier 11 can be easily peeled off the
sheet frame 13 in the other region 34.
[0077] Then, in accordance with the flow chart shown in FIG. 7, the
upper core sheet 21a, the lower core sheet 21b, and the oversheets
22, 23 are laid one on another and sandwiched by specular plates
and pressed the respective sheets 21a, 21b, 22, 23 by a press
machine to fuse them (S6). The press is performed at 150.degree. C.
for 15 minutes in a case that the respective sheets 21a, 21b, 22,
23 are formed of vinyl chloride resin.
[0078] Then, the fused sheets 21a, 21b, 22, 23 are punched in a
card size (S7). Transfer foil for the sign panel 19 is transferred
to the thus-prepared card (S8). The sign panel 19 is for the
signature of a use of the card, and a well-known type of the sign
panel is a transfer foil of a layer of a material which is easy to
write. Then, indications 18a, 18b, such as a manufacturer's serial
number, information of an issuer, necessary bar codes, etc., are
thermo-transferred by the use of thermo-transfer ribbons or others
(S9). The indications 18a, 18b may be printed by laser marking.
[0079] Next, the IC (module) recess 17 for the IC module 12 to be
mounted in is formed in the card by a spot-facing tool (S10). At
this time, in the third embodiment shown in FIG. 3 the IC module
recess 17 is cut deeper by a thickness of the upper oversheet 22
than the IC module recess 17 of the fourth embodiment shown in FIG.
4 so that the external output 12c of the IC module 12 is not
projected beyond the plane of the IC carrier 11. Following the
formation of the recess 17 by the spot-facing the peripheral edge
slit 13a defining the peripheral edge of the IC carrier 11 is
formed along the outer periphery of the IC module 12. At this time,
in the first and the third embodiments respectively shown in FIGS.
1 and 3 the spot-facing is performed on the opposite side of the IC
module 12, and the spot-facing is performed on the side of the IC
module 12 in the second and the fourth embodiments respectively
shown in FIGS. 2 and 4.
[0080] The spot-facing is performed in a depth which allows the
cores sheet 21 to be completely cuts off but does not allow the
oversheets 22, 23 to be cut off (the oversheets 22, 23 may be cut
by a part of their thickness) (S11). It is possible that the
spot-facing may be performed by the so-called half blanking in
which the core sheet 12 is completely cut off by punching, but the
oversheets 22, 23 are not cut off.
[0081] Then, a thermo-setting adhesive is injected into the IC
module recess 17 for the IC module 12, and the IC module 12 is
mounted and is pressed by hot platens (S12). The IC module 12 is
thus mounted on the card into which the sheets 21a, 21b, 22 and 23
for the IC carrier 11 have been press-fused and punched. The IC
module 12 can be adhered by other adhesives, adhesive double coated
seals or by the use of both. Next, IC inspections for IC
characteristics, etc. are conducted on the IC module 12 (S13).
Then, an issue processing step of writing data in accordance with a
use of the IC carrier is performed (S14). The issue processing is
specifically for inputting in memories the telephone number of a
subscriber, the ID number of the subscriber, the pass word of the
subscriber, etc. Then, the step of fitting the sheet-framed IC
carrier into a base with a slit, and enveloping the same, closing
the envelope and delivering the same (S15).
[0082] In the above-described steps the printing of numbers, etc.
(S9) may be performed after the module sealing (S12), and the
spot-facing of the IC module (S10) and the spot-facing of the IC
carrier (S11) may be replaced in sequence by each other.
[0083] The above-described method for producing a sheet-framed IC
carrier according to the present invention is the same except
printing the fusion preventing layer 14 and spot-facing the
peripheral edge slit 3a defining the peripheral edge of the IC
carrier 11 as the conventional method for producing an IC card.
Furthermore, because the step of printing the fusion preventing
layer 14 and the step of spot-facing the peripheral slit 13a can be
performed by the production equipment for the conventional IC card,
the step of various inspections of the IC carrier 11, and the
packaging and delivery step of the enveloping can be performed by
the process of producing the IC card as it is, and sufficient
machining precision can be ensured.
[0084] Generally cards, such as sheet frames, are restricted to
have a 0.76 mm.+-.0.08 mm thickness. For the sheet frame 13 having
such thickness, the peripheral edge slit 13a has preferably a
0.1-3.0 mm width. When the peripheral edge slit 13a has a width of
above 3.0 mm, unexpected peel-off may take place, and the
appearance is not satisfactory. When the peripheral edge slit 13a
has a width of below 0.1 mm, a spot-facing drill is so thin that
the spot-facing step is made difficult. When the peripheral edge
slit 13a has a width of below 0.5 mm, it is preferable for
efficiency that the peripheral edge slit 13a is formed by punching
by a press in place of the spot-facing.
[0085] Then, the method of using the sheet-framed IC carrier will
be explained with reference to FIG. 9(A) to FIG. 10(B).
[0086] FIGS. 9(A) and 9(B) are view showing states of the IC
carrier 11 held by the oversheet 22 which is peeled off the sheet
frame 13. In this case, the fusion preventing layer 14 is formed on
the surface of the IC carrier on the side of the IC module 12, and
the oversheet 22 is left on the side of the sheet frame 13 with
none of the oversheet 22 left on the backside of the IC carrier 11.
Accordingly, when the indication 18b, such as numbers, etc., are
printed, it is necessary to print the indication on the surface of
the IC carrier 11 on the side opposite to the IC module 12.
[0087] FIGS. 10(A) and 10(B) are views showing states of the IC
carrier 11 held by the oversheet 23, which is peeled off the sheet
frame 13. In this case, the fusion preventing layer 14 is formed on
the surface of the IC carrier 11 on the side opposite to the IC
module 12, and the oversheet 23 is left on the side of the sheet
frame 13 with none of the oversheet 23 left on the backside of the
IC carrier 11. Accordingly, the indication 18b, such as numbers,
etc., can be printed on the surface of the IC carrier on the side
of the IC module 12.
[0088] As apparent in FIG. 9(A) to FIG. 10(B), in the respective
cases after the IC carrier 11 is removed from the sheet frame 13,
the base 11 of the IC carrier 11 and the external terminal 12c of
the IC module are in the same plane.
EXAMPLES
[0089] Next, examples of the present invention will be
explained.
Example 1
[0090] The sheet-framed IC carrier 10 shown in FIG. 3 was produced
by the production process shown in FIG. 7. The process will be
explained with reference to FIG. 7.
[0091] A polymer alloy (heat resistance temperature: 120.degree.
C.) prepared by mixing acrylonitrile-butadiene-styrene (ABS) resin
(50 weight parts) and polycarbonate resin (50 weight parts) was
blended with titanium oxide (5 weight parts) and was extruded by T
die technique into the core sheet 21 of 0.35 mm-thickness formed of
a white upper core sheet 21 and a white lower core sheet 21b. The
core sheet 21 was formed of a polymer alloy of such resins to be
easily cut for the spot-facing and especially to have higher heat
resistance which allows the IC carrier to endure severe
environments, e.g., the IC carrier 11 is left in a car in the hot
summer weather, while ensuring, for example, sheeting properties
required of the sheet frame 12.
[0092] The print layer of 6 colors 15 is formed on a required part
of the upper core sheet 21a of the core sheet 21 by silk screen
printing (S2). The print layer of 1 color 15 is formed on a
required part of the lower core sheet 21b by silk screen printing
(S1). Next, a transparent offset print was made only on a part of
the upper core sheet 21a corresponding to the IC carrier by using
an UV-setting ink ("KALTON OP NISU" by The Intek Kabushiki Kaisha)
(S5). This offset printed part is to be the fusion preventing layer
of the IC carrier 11. In this case, the fusion preventing layer 14
was formed so that the 2 mm-width peripheral part of the IC carrier
22 has a 70% halftone dot area percentage and a 40% hafltone dot
area percenetage at the other part, e.g., the central part of the
IC carrier 11.
[0093] On the other hand, the oversheets 22, 23 were provided by a
50 .mu.m-thickness polycarbonate resin film. The oversheets 22, 23
were cut in the same size as the core sheet 21, loaded into a
fusion-press, sandwiched by specular platens, and fusion-pressed
under conditions of 160.degree. C., 20 kgf/cm.sup.2 and 10 minutes
(S6). Thus the respective sheets 21a, 21b, 22, 23 were
fusion-adhered to each other. Because polycarbonate-based resins
have high fusion points, the fusion press was set at a temperature
higher than 150.degree. C. of the usual hard vinyl chloride.
[0094] Then, the fusion-adhered sheets 21a, 21b, 22, 23 were
punched in a card size, and a transfer foil for a sign panel 19 was
transferred to a required part of each of the punched cards (S8).
The sign panel 19 is for the signature of the user of the card.
Then, information (indications) 18a, 18b, such as a manufacturer's
number, required bar codes, etc., were printed by thermo-transfer
(S9).
[0095] Next, the IC module recess 17 for the IC module 12 to be
mounted on was formed in the card by spot-facing (S10). In this
case, the IC module 12 has a 0.6 mm-thickness, the recess had a
0.65 mm-thickness from the surface of the oversheet. The IC module
recess 17 was formed so as to have the sectional shape, as shown in
FIG. 3, having a half-cut space 17a around the IC module recess 17.
This structure can mitigate external flexural stress.
[0096] To define a shape of the IC carrier 11, after the IC module
recess 17 was formed, the spot-facing was performed on the side of
the backside of the card (the surface opposite to the surface with
the IC module 12 mounted on) to a depth which did not cut off the
oversheet 22, and the sheet frame 13 and the IC carrier 11 were
defined (S11).
[0097] Then, a thermo-setting adhesive was dropped into the IC
module recess 17, the IC module 12 was mounted in the IC module
recess 17, and the IC module was sealed (S12). IC inspections, as
of functions, etc. of the IC module 12 were made (S13). Then, the
telephone number, the ID number, etc. of a subscriber were inputted
in the memories, and the issue processing was performed (S14).
[0098] The part where the IC carrier 11 is positioned was pressed
from the surface of the IC carrier with fingers, whereby the IC
carrier 11 could be readily peeled off the sheet frame 13. At this
time, the fusion preventing layer 14 was left on the IC carrier 11
capably of protecting the print layer 15.
Example 2
[0099] The sheet-framed IC carrier 10 shown in FIG. 4 was produced
by the production process shown in FIG. 7. The same basic materials
as in Example 1 were used. A 6-color print was made on a required
part of the upper core sheet 21a by silk screen printing. A 1-color
print was made on a required part of the lower core sheet 21b by
silk screen printing. Next, a transparent offset print was made
only on a part of the lower core sheet 21a corresponding to the IC
carrier by using an UV-setting ink ("KALTON M OP NISU" by The Intek
Kabushiki Kaisha), and the fusion preventing layer 14 was formed
(S4). In this case, the fusion preventing layer 14 was processed so
that the 3 mm-width peripheral part of the IC carrier 22 has a 70%
halftone dot area percenetage and a 40% hafltotne dot area
percentage at the other part, e.g., the central part of the IC
carrier Then, the steps up to the spot-facing of the IC module
recess 17 for the IC module (S10) were performed in the same way as
in Example 1. To define a shape of the IC carrier 11, after the IC
module recess 17 was formed, the peripheral slit 13a was spot-faced
on the surface of each card (the surface with the IC module 12
mounted on) to a depth which did not cut off the oversheet 23, and
the sheet frame 13 and the IC carrier 11 were defined (S11). Then,
a thermo-setting adhesive was dropped into the IC module recess 17,
and the IC module 12 was mounted in the IC module recess 17, and
the IC module was sealed (S12). IC inspections, as of functions,
etc. of the IC module 12 were made (S13). Then, the telephone
number, the ID number, etc. of a subscriber were inputted in the
memories, and the issue processing was performed (S14).
[0100] The part where the IC carrier 11 is positioned was pressed
from the surface of the IC carrier 11 with fingers, whereby the IC
carrier 11 could be readily peeled off the sheet frame 13.
* * * * *