U.S. patent application number 09/414729 was filed with the patent office on 2001-08-30 for method of substrate temperature control and method of assessing substrate temperature controllability.
Invention is credited to IKEDA, MASAYOSHI.
Application Number | 20010017205 09/414729 |
Document ID | / |
Family ID | 12961636 |
Filed Date | 2001-08-30 |
United States Patent
Application |
20010017205 |
Kind Code |
A1 |
IKEDA, MASAYOSHI |
August 30, 2001 |
METHOD OF SUBSTRATE TEMPERATURE CONTROL AND METHOD OF ASSESSING
SUBSTRATE TEMPERATURE CONTROLLABILITY
Abstract
A method of substrate temperature control for plasma processing
apparatus in which a substrate which is being held on a substrate
holder in a process chamber is being processed, and He gas is
passed through the gap between the substrate and the substrate
mounting surface during the processing of the substrate, the
substrate temperature is controlled by the thermal transfer
characteristics of the gas and the substrate is cooled to the
prescribed temperature, and the pressure of the He gas is preset by
a pressure setting part 50a, the actual pressure is measured with a
pressure gauge 49, and the gas flow rate is controlled in such a
way that the measured pressure becomes equal to the set pressure by
a pressure control valve 46. Furthermore, the substrate temperature
controllability is assessed by monitoring the gas flow rate with a
substrate temperature controllability assessment part 50b.
Inventors: |
IKEDA, MASAYOSHI; (TOKYO,
JP) |
Correspondence
Address: |
BURNS DOANE SWECKER & MATHIS L L P
POST OFFICE BOX 1404
ALEXANDRIA
VA
22313-1404
US
|
Family ID: |
12961636 |
Appl. No.: |
09/414729 |
Filed: |
October 8, 1999 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
09414729 |
Oct 8, 1999 |
|
|
|
08976041 |
Nov 21, 1997 |
|
|
|
Current U.S.
Class: |
165/275 ;
361/234 |
Current CPC
Class: |
C23C 16/463 20130101;
C23C 16/507 20130101; C23C 16/45557 20130101; H01L 21/67248
20130101; Y10T 279/23 20150115; C23C 16/52 20130101 |
Class at
Publication: |
165/275 ;
361/234 |
International
Class: |
G01M 003/02; F28F
007/00; H01H 001/00; H02B 001/00; H01G 002/00; H01T 023/00; F28F
027/00; C25B 009/00; H05F 001/00; H02H 001/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 21, 1997 |
JP |
9-54116 |
Claims
What is claimed is:
1. A method of substrate temperature control, comprising the steps
of: measuring the pressure of a heat transfer gas flowing in a gap
between a substrate and a substrate mounting surface of a substrate
holder; controlling a flow rate of the heat transfer gas in such a
way that the measured pressure of the heat transfer gas becomes
equal to a preset pressure.
2. The method of substrate temperature control according to claim
1, wherein a pressure control valve which is established in the
heat transfer gas flow way has a set pressure signal input from a
pressure setting part and a measured pressure input from a pressure
gauge, and the flow rate of the heat transfer gas is controlled
such that the measured pressure becomes equal to the set
pressure.
3. The method of substrate temperature control according to claim
1, further comprising the step of holding the substrate on an
electrostatic chucking stage which is included in the substrate
holder.
4. A method of assessing a substrate condition, comprising the
steps of: measuring the pressure of a heat transfer gas which is
flowing in a gap between a substrate and a substrate mounting
surface of a substrate holder; controlling the flow rate of the
heat transfer gas such that the measured pressure of the heat
transfer gas becomes equal to a preset pressure; assessing a state
of the gap between the substrate and the substrate mounting surface
on a basis of a comparison of the heat transfer gas flow rate with
a standard value.
5. The method of assessing a substrate condition according to claim
4, wherein the substrate holder includes an electrostatic chucking
stage, and temperature controllability of the substrate is assessed
by assessing a state of electrostatic force between the substrate
and the electrostatic chucking stage.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention concerns a method of substrate
temperature control, and a method of assessing substrate
temperature controllability in a substrate processing apparatus,
and in particular it concerns a method of controlling the substrate
temperature which can be used in a substrate processing apparatus
in which a substrate is held on a substrate holder by means of an
electrostatic force and a heat transfer gas for substrate cooling
purposes is passed between the substrate and the electrostatic
chucking stage, and a method of assessing the controllability of
the substrate temperature.
[0003] 2. Description of Related Art
[0004] A conventional method of substrate temperature control in a
plasma processing apparatus is described below with reference to
FIG. 4 and FIG. 5. Any plasma source can be used in this plasma
processing apparatus, and it is not shown in the drawing. In the
drawings, reference number 101 is the process chamber, and the
construction of its upper part is not shown in the drawing. A
substrate holder 102 is arranged in the bottom part of the process
chamber 101, and a substrate 103 is arranged on the substrate
holder 102. The substrate 103 is held by means of an electrostatic
chucking stage 104. The substrate holder 102 comprises a bias
electrode 105 and a circulator 106, which circulates a cooling
medium which cools the electrostatic chucking stage 104. A
substrate bias electrode radio frequency power source 107 and a
direct current power source 108 are connected to the bias electrode
105.
[0005] A gap is formed between the substrate 103 and the
electrostatic chucking stage 104. An inert gas, such as helium (He)
gas for example, is supplied into this space by means of a pipe
109. He gas is present and functions as a heat transfer gas, which
enhances the thermal transfer characteristics between the substrate
103 and the electrostatic chucking stage 104 and cools the
substrate 103. Moreover, reference number 110 is a conventional
helium pressure control apparatus and reference number 111 is an
evacuation pump which exhausts the He gas. The pressure of the
aforementioned He gas is controlled by means of the helium pressure
control apparatus 110 and the evacuation pump 111. The helium
pressure control apparatus 110 comprises a helium pressure
controller 112, a pressure gauge 113, a mass flow controller 114,
valves 115 and 116, and a bypass valve 117.
[0006] The substrate 103 which is held on the substrate holder 102
by an electrostatic force is subjected to an etch process with the
plasma which is generated by the plasma source. During this
process, a radio frequency (RF) is applied to the bias electrode
105 from the RF power source 107, and a self bias voltage is
generated at the surface of the substrate 103. A direct current
(DC) voltage is applied from the DC power source 108, and an
electrostatic force is generated by the potential difference
between the DC voltage and the self bias voltage, and this holds
the substrate 103.
[0007] The method of controlling the He gas pressure is described
below. Thus, He gas pressure control is achieved by means of the
helium pressure controller 112. The helium pressure controller 112
sends a set flow-rate value via a signal line 118 to the mass flow
controller 114 and recognizes the measured pressure which is sent
from the pressure gauge 113 via a signal line 119. Thus, the helium
pressure controller 112 sends open or close signals via a signal
line 120 when the measured pressure is displaced from the set
pressure value, the bypass valve 117 is opened or closed, and the
He gas pressure is controlled.
[0008] This is described in more detail below with reference to
FIG. 5. When the substrate 103 is not being etched, the valve 115
is closed, the bypass valve 117 is open and the valve 116 is
closed. Moreover, the set He gas flow rate of the mass flow
controller 114 is set to 0 sccm, and the set pressure value for the
He gas is 0 Torr. The He gas pressure control which is carried out
during the etch process of the substrate 103 starts after the
substrate bias electrode RF power source 107 has been switched ON.
At this time, the valve 115 is switched from closed to open, the
bypass valve 117 is switched from open to closed, and the valve 116
is switched from closed to open. For pressure control, a set flow
rate value signal for 20 sccm He gas is sent from the helium
pressure controller 112 to the mass flow controller 114, and the He
gas pressure is brought up to the set pressure value of 15
Torr.
[0009] With this pressure control, no He gas flows after the He gas
measured pressure value has reached the set pressure value. A small
amount, for example some 0.5 sccm, of He gas leaks into the space
inside the process chamber 101 from between the substrate 103 and
the electrostatic chucking stage 104. The measured He gas pressure
falls below the set pressure value. He gas in an amount slightly
greater than the amount which is leaked out, for example 0.6 sccm,
is passed, and a fall in the measured He gas pressure is prevented.
When the pressure exceeds the set pressure value, by 5 Torr for
example, the bypass valve 117 is opened and He gas is exhausted
with the evacuation pump 111 until the measured He gas pressure
reaches the set pressure value of 15 Torr. The bypass valve 117 is
closed again when the measured pressure reaches the set pressure
value. Subsequently, the operation of the region indicated by 121
in FIG. 5 is repeated and the He gas pressure is controlled until
the RF power source 107 is switched OFF. With this pressure
control, the valve 116 is switched from open to closed and the
bypass valve 117 is switched from closed to open at the same time
as the RF power source 107 is switched OFF. Moreover, the set flow
rate of the mass flow controller 114 is set to 0 sccm and the set
pressure value is set to 0 Torr. The He gas between the substrate
103 and the electrostatic chucking stage 104 is exhausted for a
fixed period of time with the evacuation pump 111, and then the
valve 115 is switched from open to closed.
OBJECTS AND SUMMARY
[0010] In the conventional method of He gas pressure control, the
control of He gas pressure during the interval 121 shown in FIG. 5
is carried out simply by opening and closing the bypass valve 117.
However, fine control of the He gas pressure between the substrate
103 and the electrostatic chucking stage 104 by simply opening and
closing the bypass valve 117 is very difficult in practice. The
variability in the change in the measured pressure with respect to
the set pressure value is considerable. As a result, a variability
arises in the substrate temperature from substrate to substrate
when substrates 103 are continually being subjected to an etch
process. Such a variability of the substrate temperature results in
a variability between substrates in the selectivity to the mask and
the selectivity to the underlying layer which are sensitive to
changes in the substrate temperature. As a result, the
reproducibility of the etch profile is poor.
[0011] In general plasma processing apparatus with which etching is
carried out, by-products which are formed during the etching
process become attached to the electrostatic chucking stage as many
substrates are etched repeatedly, the state of chucking between the
substrate and the electrostatic chucking stage becomes inadequate
and so the cooling of the substrate becomes inadequate and the
substrate temperature rises. If the substrate etch process is
carried out at a high temperature, then a problem arises in that
the reproducibility of the etch profile becomes poor. In terms of
this problem, execution of the etch process at high temperatures
can be avoided if the etch process which is being carried out
continuously is stopped when the state of chucking between the
substrate and the electrostatic chucking stage becomes poor.
However, with the conventional plasma processing apparatus
described above there is no mechanism for determining whether the
state of chucking between the substrate and the electrostatic
chucking stage is good or bad, and so it is impossible to avoid
execution of the substrate etch process at high temperature.
[0012] The problems described above are problems which occur
generally in substrate processing apparatus.
[0013] An aim of the invention is to provide a method of substrate
temperature control for a substrate processing apparatus with which
the control of the heat transfer gas such as helium gas is
improved, and with which the controllability of the substrate
temperature is improved.
[0014] Another aim of the invention is to provide a method of
assessing the substrate temperature controllability in a substrate
processing apparatus where a heat transfer gas is being used,
wherein the state of the substrate temperature control is assessed
by monitoring the state of the gap between the substrate and the
surface of the electrostatic chucking stage on which the substrate
is arranged.
[0015] According to a method of the present invention, the pressure
of the heat transfer gas which is flowing in the gap between the
substrate and the substrate mounting surface of the substrate
holder is measured and the flow rate of the heat transfer gas is
controlled in such way that the measured pressure of the heat
transfer gas becomes equal to a preset pressure value. Control of
the substrate temperature is achieved in accordance with the heat
transfer characteristics of the heat transfer gas which is flowing
in the gap between the substrate and the surface of the substrate
mounting surface of the substrate holder.
[0016] To execute this method of substrate temperature control, a
means of establishing the target pressure of heat transfer gas (a
pressure setting part) and a means for measuring the actual
pressure of the heat transfer gas which is being introduced into
the abovementioned gap (pressure gauge) are established in the
structure of the apparatus. The set pressure value and the measured
pressure are compared and the flow rate of the heat transfer gas is
controlled on the basis of the difference between these values in
such a way that the difference becomes zero. The control is carried
out in such a way that the measured pressure rapidly approaches the
set pressure value, and rapid control is achieved without giving
rise to variability in the control.
[0017] The abovementioned method of substrate temperature control
according to this invention is preferably such that the pressure
control valve which has been established in the heat transfer gas
flow way controls the flow rate of the heat transfer gas in such a
way that the measured pressure becomes equal to the set pressure
value with the input of a signal for the set pressure value from
the pressure setting part and the input of a signal for the
measured pressure from the pressure gauge.
[0018] The abovementioned method of substrate temperature control
is preferably such that the abovementioned substrate is held on an
electrostatic chucking stage which is included in the substrate
holder.
[0019] According to one embodiment of the present invention, the
pressure of the heat transfer gas which is flowing in the gap
between the substrate and the substrate mounting surface of the
substrate holder is measured, the flow rate of the heat transfer
gas is controlled in such a way that the measured pressure of the
heat transfer gas becomes equal to a preset pressure value, and
then the state of the gap between the substrate and the substrate
mounting surface is assessed on the basis of a comparison of this
flow rate of the heat transfer gas and a standard value.
[0020] According to the present invention, it is possible to obtain
information concerning the actual flow rate of the heat transfer
gas for controlling the transfer gas flow rate. In terms of the
actual flow rate of the heat transfer gas, the amount of heat
transfer gas which leaks from the gap between the substrate and the
electrostatic chucking stage depends on the size of the gap.
Moreover, the size of this gap is determined by the state in which
the substrate is held on the substrate holder. The actual flow rate
of the heat transfer gas which is detected is monitored. The state
of the thermal transfer characteristics in the abovementioned gap,
which is to say the state of substrate temperature controllability,
can be assessed by comparing this with a standard flow rate of heat
transfer gas.
[0021] The abovementioned method of assessing substrate temperature
controllability of this invention preferably assesses the substrate
temperature controllability by assessing the state of electrostatic
force between the substrate and the electrostatic chucking
stage.
[0022] With the method of controlling substrate temperature of this
invention, the set pressure value of the heat transfer gas and the
actual measured pressure are compared and the heat transfer gas
flow rate is controlled in such a way that the measured pressure
rapidly becomes equal to the set pressure value, and so control of
the heat transfer gas pressure is improved. Hence, the thermal
transfer characteristics of the heat transfer gas can be maintained
at the optimum level and substrate temperature controllability is
improved.
[0023] With the method of assessing substrate temperature
controllability of this invention, the flow rate of the heat
transfer gas which is introduced into the gap between the substrate
and the electrostatic chucking stage is monitored and, by comparing
this with a standard flow rate, it is possible to assess whether
the state of substrate temperature control using the heat transfer
gas is good or bad.
BRIEF EXPLANATION OF THE DRAWINGS
[0024] FIG. 1 shows a substrate temperature control in a plasma
processing apparatus which is a typical embodiment of the
invention.
[0025] FIG. 2 is a detailed drawing of the helium pressure control
apparatus shown in FIG. 1.
[0026] FIG. 3 is a timing chart of the control procedure.
[0027] FIG. 4 is a drawing which shows substrate temperature
control in a conventional plasma processing apparatus.
[0028] FIG. 5 is a timing chart showing the details of the
conventional control.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0029] A typical embodiment of the present invention is shown in
FIG. 1, and the detailed structure of a part thereof is shown in
FIG. 2. The substrate processing apparatus of this embodiment is a
plasma processing apparatus. This is used for etching substrates
using plasma, or for CVD processing: A helicon wave excited plasma
source is used in the plasma processing apparatus of this
embodiment.
[0030] Such a plasma processing apparatus is described below with
reference to FIG. 1. A process chamber 11 comprises a vacuum
chamber 12 for plasma generation purposes (referred to hereinafter
as the generating chamber) and a vacuum chamber 13 for plasma
diffusion purposes (referred to hereinafter as the diffusion
chamber). The generating chamber 12 is arranged in the top wall of
the diffusion chamber 13, and the spaces within each of these
chambers are connected. A helicon wave exciting antenna 14 is
arranged in a region outside the generating chamber 12. An
electromagnet 15 for generating a magnetic field is arranged in the
region outside the antenna 14. The antenna 14 is connected to a
plasma generating RF power source 16. Plasma is generated in the
space inside the generating chamber 12 to which the process gas has
been supplied by means of a process gas supply mechanism (not shown
in the drawing) when the power of a fixed electric field is
supplied by the antenna 14. The distribution of the plasma in the
generating chamber 12 is controlled by the electromagnet 15.
[0031] A substrate holder 17 is arranged on the lower side within
the diffusion chamber 13. An electrostatic chucking stage 18 is
established on the top of the substrate holder 17, and a substrate
19 is held on the electrostatic chucking stage 18 by an
electrostatic force. The surface of the substrate 19 faces the
space within the generating chamber 12 which is located above. The
plasma which has been generated in the generating chamber 12 enters
the diffusion chamber 13, diffuses over the substrate 19 and
processes the surface of the substrate 19 which is being held on
the substrate holder 17.
[0032] A bias electrode 20, and a circulator 21 which circulates a
cooling medium which cools the bias electrode 20 and the
abovementioned electrostatic chucking stage 18 to a prescribed
temperature are established in the substrate holder 17. An RF power
source 22, which imparts a bias voltage to the bias electrode 20,
and a DC power source 23 for generating the electrostatic force by
which the substrate 19 is held on the electrostatic chucking stage
18, are connected to the substrate holder 17.
[0033] In the abovementioned embodiment, the thermal transfer
characteristics between the substrate and the electrostatic
chucking stage are controlled in order to control (cool) the
temperature of the substrate 19 which is being held on the
electrostatic chucking stage 18 during substrate processing. He gas
is passed at the required pressure between the substrate 19 and the
electrostatic chucking stage 18 in order to control the thermal
transfer characteristics. This He gas is used as a heat transfer
gas between the substrate 19 and the electrostatic chucking stage
18. The pressure of the He gas is controlled by a helium pressure
control apparatus 32. The He gas is exhausted by means of an
evacuation pump 33. The supply of He gas to the gap between the
substrate 19 and the electrostatic chucking stage 18 and the
exhausting of the He gas from this gap are carried out via a
pipework 31. The He gas supply tank is not shown in the
drawing.
[0034] To carry out plasma processing in the process chamber 11,
the process chamber 11 is pumped out to the ultimate pressure by
means of a pumping mechanism and a pressure control mechanism,
which are not shown in the drawing. The required amount of process
gas is introduced by means of a process gas delivery mechanism and
a mass flow controller, which are not shown in the drawing.
[0035] The helium pressure control apparatus 32 is described in
detail below with reference to FIG. 2. The pipework 41 is connected
to the abovementioned pipework 31 and the pipework 42 is connected
to the evacuation pump 33, and the pipework 43 is connected to a He
supply tank which is not shown in the drawing. Valves 44 and 45 are
established in the pipeworks 41 and 43, respectively, and a
pressure control valve 46 is established between the valves 44 and
45 in the pipework 43. The pipework 42, which is connected to the
evacuation pump 33, is connected to the part of the pipework 47
between the pressure control valve 46 and the valve 44. A bypass
valve 48, through which the He gas is passed during evacuation, is
established in part of the pipework 47.
[0036] A pressure gauge 49 for measuring the pressure of the He gas
in the pipework 47 is established in part of the pipework.
[0037] A helium pressure controller 50 is provided for this
pipework system. The helium pressure controller 50 includes a
pressure setting part 50a and a substrate temperature
controllability assessment part 50b, and it also includes other
required functional parts, such as, valve opening and closing
controls. The helium pressure controller 50 receives a measured He
gas flow rate signal 51 from the pressure control valve 46 as
input, and a He gas flow rate (the He gas pressure value) setting
command signal 52 for the pressure control valve 46 is output from
the helium pressure controller 50.
[0038] The pressure control valve 46 receives a measured He gas
flow rate (He gas pressure value) signal 53 from the pressure gauge
49 as input. Moreover, the helium pressure controller 50 controls
the opening and closing of the valves 44 and 45 and the opening and
closing of the bypass valve 48 on the basis of the opening and
closing command signals 54, 55 and 56.
[0039] The substrate processing operation with the plasma
processing apparatus described above is described below.
[0040] The interior of the generating chamber 12 and the diffusion
chamber 13 is pumped out using the pumping mechanism and the
pressure is reduced to the ultimate pressure. Then, the process gas
of which the flow rate is controlled by the flow rate controlling
mechanism is introduced into each of the abovementioned chambers 12
and 13. Control is achieved with the pressure controlling mechanism
in such a way that the pressure within the chambers is the required
pressure.
[0041] Next, the RF power which is supplied from the RF power
source 16 is supplied to the internal space of the generating
chamber 12 via the helicon wave exciting antenna 14. Plasma is
generated within the generating chamber 12 by the electric field
which is applied by the antenna 14. The plasma which is generated
diffuses into the diffusion chamber 13.
[0042] On the other hand, the substrate 19 which has been
transferred by means of a transfer mechanism (not shown in the
drawing) is held on the substrate holder 17 in the diffusion
chamber 13. A voltage is applied to the bias electrode 20 by means
of the DC power source 23. An electrostatic attractive force is
produced as a result of this voltage and the substrate 19 is held
on the electrostatic chucking stage 18. RF power is supplied to the
bias electrode 20 from the RF power source 22, and the substrate 19
is etched by the plasma which has diffused from the generating
chamber 12.
[0043] During the abovementioned etch process, the bias electrode
20 and the electrostatic chucking stage 18 are cooled by means of a
cooling medium which is circulated by the circulator 21 and
controlled to the prescribed temperature. He gas is supplied to the
gap between the substrate 19 and the electrostatic chucking stage
18, or exhausted from said gap, via the pipework 31. The thermal
transfer characteristics between the substrate 19 and the
electrostatic chucking stage 18 are controlled by controlling the
pressure (flow rate) of He gas between the substrate 19 and the
electrostatic chucking stage 18. In this way the temperature of the
substrate 19 is controlled to the prescribed temperature in
relation to the temperature of the electrostatic chucking stage
18.
[0044] The method of controlling the He gas pressure in this
embodiment is described below with reference to the abovementioned
FIGS. 1 and 2, and also FIG. 3, and the method of controlling the
substrate temperature on the basis of the method of controlling the
He gas pressure is also described. FIG. 3 is a timing chart which
shows the details of the He gas pressure control.
[0045] The control of the He gas pressure is carried out by the
abovementioned helium pressure controller 50. As shown in FIG. 2,
the helium pressure controller 50 supplies a set command signal 52
to the pressure control valve 46 by means of the pressure setting
part 50a. The data concerning the set pressure value is supplied to
the pressure control valve 46 by this means. The measured pressure
from the pressure gauge 49 is supplied to the pressure control
valve 46 as a measurement signal 53. The pressure control valve 46
compares the set pressure value supplied from the helium pressure
control part 50 and the measured pressure supplied from the
pressure gauge 49 and adjusts the He flow rate in such a way as to
make the measured pressure equal to the set pressure value. Control
of the He gas pressure is carried out in this way.
[0046] The He gas pressure control based on the control actions of
the helium pressure controller 50 and the pressure control valve 46
is described in detail below with reference to FIG. 3.
[0047] When the substrate 19 is not being etched, the valves 44 and
45 are closed, the bypass valve 48 is open and the set pressure
value of the pressure control valve 46 is set to approximately 0
Torr. At this time, the measured flow rate of the He gas which is
being introduced is approximately 0 sccm.
[0048] When the substrate 19 is set, the substrate bias electrode
RF power source 22 is switched ON (change 61) and then pressure
control with the helium pressure controller 50 is started. The
valves 44 and 45 are switched from closed to open (changes 62 and
63) and the bypass valve 48 is switched from open to closed (change
64) by pressure control with the helium pressure controller 50.
Moreover, the helium pressure controller 50 supplies the set
pressure value, for example the 15 Torr set command signal 52, to
the pressure control valve 46. In the state before executing this
pressure control, the measured pressure value is 0 Torr, and so a
high He gas flow rate (for example, about 100 sccm) is passed by
the pressure control valve 46 on the basis of the difference
between the set pressure value and the measured pressure. As a
result of this, control such that the measured pressure reaches the
set pressure value is carried out in a short period of time (within
about 1 second) (states 65 and 66). As the measured pressure
obtained from the pressure gauge 49 gradually approaches the set
pressure value, the pressure control valve 46 passes a gradually
reducing flow rate of He so as to match the difference between the
set pressure value and the measured pressure so that the measured
pressure approaches the set pressure value asymptotically. After a
suitable period of time (for example 30 seconds, period 67 in FIG.
3) has elapsed after introducing He gas, the pressure control valve
46 has executed control in such a way that the measured pressure is
more or less equal to the set pressure value. As a result, the He
gas flow rate becomes constant (for example, about 0.5 sccm, state
68 in FIG. 3). This fixed flow rate value corresponds to the extent
of the leakage of the He gas which is lost from between the
substrate 19 and the electrostatic chucking stage 18. Subsequently,
He gas corresponding to the amount which is leaking from between
the substrate 19 and the electrostatic chucking stage 18 is passed
by the pressure control valve 46 during the interval until the RF
power source 22 is switched OFF (change 69). By this means, the
measured pressure value and the set pressure value are matched
during the etch process.
[0049] When the RF power source 22 is switched OFF, the valve 45 is
switched from open to closed and the bypass valve 48 is switched
from closed to open at the same time. Furthermore, the valve 44 is
closed after being held open for a fixed interval of time. When
this is done the measured pressure reverts to 0 Torr.
[0050] With this method of substrate temperature control using
pressure control of the He gas, the variability of the measured
pressure of the He gas can be reduced and it is possible to carry
out substrate temperature control using the thermal transfer
characteristics of He gas both quickly and in a stable manner.
[0051] This embodiment will now be described from the viewpoint of
the method of assessing the substrate temperature controllability
in the abovementioned plasma processing apparatus, with reference
once again to FIGS. 1 to 3.
[0052] With the pressure control system of FIGS. 1 and 2, the
amount of He gas leaking from between the substrate 19 and the
electrostatic chucking stage 18 during the etch process can be
estimated by the helium pressure controller 50 on the basis of the
measured flow rate signal 51 which is sent from the pressure
control valve 46. The amount of He gas which leaks out is
determined by the state of chucking between the substrate 19 and
the electrostatic chucking stage 18. The state of chucking between
the substrate 19 and the electrostatic chucking stage 18 can be
monitored using the measured flow rate which is obtained as the
measured signal 51. Monitoring of the state of chucking in this way
is carried out starting after a fixed interval of time (for
example, about 30 seconds) after introducing the He gas between the
substrate 19 and the electrostatic chucking stage 18. This
monitoring assesses that the state of chucking between the
substrate 19 and the electrostatic chucking stage 18 is
satisfactory when the estimated leakage from between the substrate
19 and the electrostatic chucking stage 18 is 0.5 sccm, or below,
for example, and that it is inadequate when it is greater than 0.5
sccm. The substrate 19 is not being chucked on the electrostatic
chucking stage 18 satisfactorily when the amount of He gas leaking
out is high. Temperature control of the substrate 19 becomes
unsatisfactory and the temperature of the substrate rises. Hence,
it is possible by monitoring the state of the electrostatic force
of the substrate 19 to assess the temperature controllability of
the substrate 19 using the measured flow rate of He gas with the
measurement signal 51. This assessment is carried out by the
substrate temperature controllability assessment part 50b of the
helium pressure controller 50. The substrate temperature
controllability assessment part 50b stops the etch process when the
measured flow rate based on the measurement signal 51 rises and it
is assessed that the state of chucking is unsatisfactory.
[0053] With the method of assessing substrate temperature
controllability described above, the etch process is stopped when
the cooling of the substrate is inadequate and the etch process is
being carried out at a temperature higher than the normal
temperature, and it enables poor etching of the substrate to be
prevented.
[0054] The invention is not limited to the embodiment described
above, and it can be used generally with other types of plasma
processing apparatus, and it can also be used in cases where a
plasma source other than a helicon wave plasma source is being
used. Moreover, the gas which is used for substrate cooling is not
limited to He gas, and other gases can also be used.
* * * * *