U.S. patent application number 09/219100 was filed with the patent office on 2001-08-23 for configration of power electronic device modules.
Invention is credited to ATANUS, RONALD D., MIKOSZ, RICHARD P., O'LEARY, RAYMOND P..
Application Number | 20010015886 09/219100 |
Document ID | / |
Family ID | 22817874 |
Filed Date | 2001-08-23 |
United States Patent
Application |
20010015886 |
Kind Code |
A1 |
O'LEARY, RAYMOND P. ; et
al. |
August 23, 2001 |
CONFIGRATION OF POWER ELECTRONIC DEVICE MODULES
Abstract
An efficient configuration for a power system is provided, e.g.
for high-speed source transfer, utilizing power electronic
assemblies and a directed ventilation arrangement. Each power
electronic assembly includes a plurality of stacked power
electronic device modules that are electrically series connected
and energized at various voltages. Each power electronic device
module includes two heat sinks, a power electronic component
assembly interposed between the two heat sinks, and an arrangement
for clamping the heat sinks and the power electronic component
assembly. In a preferred embodiment, the power electronic component
assembly includes two stacked, series connected power electronic
components such that single-sided cooling is provided. In one
application, the power-electronic components are thyristors that
have a high short-term, fault-current rating and a relatively low
average current requirement. This arrangement provides a reduced
height configuration along with the advantages of modular clamping
for ease of assembly, simplicity of components, ease of maintenance
and overall reliability of components.
Inventors: |
O'LEARY, RAYMOND P.;
(EVANSTON, IL) ; ATANUS, RONALD D.; (PROSPECT,
IL) ; MIKOSZ, RICHARD P.; (HICKORY HILLS,
IL) |
Correspondence
Address: |
JAMES V LAPACEK
S&C ELECTRIC COMPANY
6601 NORTH RIDGE BOULEVARD
CHICAGO
IL
60626
|
Family ID: |
22817874 |
Appl. No.: |
09/219100 |
Filed: |
December 22, 1998 |
Current U.S.
Class: |
361/704 |
Current CPC
Class: |
H05K 7/209 20130101 |
Class at
Publication: |
361/704 |
International
Class: |
H05K 007/20 |
Claims
What is claimed and desired to be secured by Letters Patent of the
United States is:
1. A power electronic assembly comprising: a plurality of modules
being arranged to form a linear array, each of said plurality of
modules including heat-sink means and power electronic devices
disposed between said heat sink means, wherein said power
electronic devices are arranged for single-sided cooling of said
power electronic devices.
2. The power electronic assembly of claim 1 wherein said heat-sink
means comprise means for clamping said power electronic
devices.
3. The power electronic assembly of claim 1 wherein each of said
plurality of modules comprises two power electronic devices that
are stacked one atop the other in electrical series
relationship.
4. The power electronic assembly of claim 1 wherein said plurality
of modules are electrically series connected.
5. The power electronic assembly of claim 1 further comprising
means for defining directed air flow in a predetermined directed
relative to each of said heat-sink means.
6. The power electronic assembly of claim 1 further comprising
means for supporting said plurality of modules and for defining
predetermined ventilation paths through said plurality of
modules.
7. The power electronic assembly of claim 1 further comprising
means for electrically connecting said plurality of modules in
electrical series relationship and for directing air flow through
said medium-voltage power electronic assembly.
8. The power electronic assembly of claim 1 wherein said plurality
of modules are arranged in two or more stacks with said modules in
each stack are arranged in electrical series connection.
9. The power electronic assembly of claim 1 wherein each of said
plurality of modules includes four power electronic devices being
arranged in two pair of said power electronic devices with each of
said two pairs including two stacked power electronic devices.
10. A medium-voltage electronic device module comprising a power
semiconductor assembly, a heat sink assembly, and means for
clamping said power semiconductor assembly with respect to said
heat sink assembly, said power semiconductor assembly comprising
two power semiconductor devices arranged one atop the other.
11. The medium-voltage power electronic device module of claim 10
wherein said two power semiconductor devices are electrically
series connected.
12. A power electronic assembly comprising a plurality of stacked
power electronic device modules that are electrically series
connected and energized at various voltages, each of said power
electronic device modules comprising two heat sinks, a power
electronic component assembly interposed between said two heat
sinks, and means for clamping said heat sinks and said power
electronic component assembly, wherein said power electronic
component assembly comprises two stacked, series connected power
electronic components such that said components are provided
single-sided cooling
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates generally to power electronic
devices and more particularly to an efficient configuration of
stacked power electronic device modules.
[0003] 2. Description of the Related Art
[0004] Various assemblies of power electronic devices to form
medium voltage switches and the like are known. For example, the
following publications depict commercial arrangements: ABB brochure
34-300 (September 1996), and PQA'97 North America (Mar. 3-6, 1997)
paper entitled "Switching Megawatts in Microseconds". The power
electronic devices require compression clamping for suitable
operations and heat dissipation. This can be accomplished either by
clamping the overall assembly or individual clamping of
subassemblies. Heat sinks are required to maintain the power
electronic devices at suitable operating temperatures over the
desired operating range. To this end, heat sinks are clamped about
the power electronic devices.
[0005] While the enclosures of the prior art arrangements may be
useful to provide certain useful operational features, the prior
arrangements are large in size and are relatively difficult to
assemble and disassemble.
SUMMARY OF THE INVENTION
[0006] Accordingly, it is a principal object of the present
invention to provide an efficient configuration for a power system
utilizing stacked power electronic device modules and a directed
ventilation arrangement.
[0007] It is another object of the present invention to provide a
power electronics assembly of stacked power electronic modules that
are modularly clamped with each module including two back-to-back
power electronic components that are mounted between heat
sinks.
[0008] These and other objects of the present invention are
efficiently achieved by the provision of an efficient configuration
for a power system, e.g. for high-speed source transfer, utilizing
power electronic assemblies and a directed ventilation arrangement.
Each power electronic assembly includes a plurality of stacked
power electronic device modules that are electrically series
connected and energized at medium voltage. Each power electronic
device module includes two heat sinks, a power electronic component
assembly interposed between the two heat sinks, and an arrangement
for clamping the heat sinks and the power electronic component
assembly. In a preferred embodiment, the power electronic component
assembly includes two stacked, series connected power electronic
components such that single-sided cooling is provided. In one
application, the power-electronic components are thyristors that
have a high short-term, fault-current rating and a relatively low
average current requirement.
[0009] With this arrangement, the heat sinks are suitably
dimensioned to provide adequate temperature operation of the power
electronic components along with the directed ventilation. This
results in an overall power electronics assembly that is of smaller
dimensions and overall configuration compared to a double-sided
cooling configuration while also providing desirable clamping
configurations on a modular basis. While the heat sinks are taller
than conventional extruded heat sinks for double sided cooling
configurations, with modular clamping, the result is an overall
stack height of the power electronic assembly of power electronic
modules that would be more than fifty percent larger if
double-sided cooling were utilized. This arrangement also provides
the advantage of modular clamping for ease of assembly, simplicity
of components, ease of maintenance and overall reliability of
components.
BRIEF DESCRIPTION OF THE DRAWING
[0010] The invention, both as to its organization and method of
operation, together with further objects and advantages thereof,
will best be understood by reference to the specification taken in
conjunction with the accompanying drawing in which:
[0011] FIG. 1 is a right-side elevational view, with parts removed
for clarity, of a power system incorporating a configuration of
stacked power electronic device modules in accordance with the
present invention;
[0012] FIG. 2 is a top plan view of portions of the power system of
FIG. 1 with parts removed for clarity;
[0013] FIG. 3 is a perspective view of the configuration of stacked
power electronic device modules of the power system of FIGS. 1 and
2; and
[0014] FIG. 4 is a front elevational view of a power electronic
device module of the configuration of stacked power electronic
device modules of FIGS. 1-3.
DETAILED DESCRIPTION
[0015] Referring now to FIGS. 1 and 2, a power system 112 includes
power electronic assemblies 114, 116 and 118 of the present
invention illustrated in conjunction with a ventilation arrangement
110. The ventilation arrangement 110 is useful to provide a
predetermined pattern and volume of directed cooling air for the
power electronic assemblies 114, 116 and 118 within an enclosure
120 of the power system 112. In a specific embodiment, medium
voltages are applied across the power electronic assemblies 114,
116 and 118, e.g. 2-34 kv. In an illustrative application, each of
the power electronic assemblies 114, 116 and 118 corresponds to an
individual phase or pole of a multi-phase AC power system. The
power electronic assemblies 114, 116 and 118 dissipate large
quantities of heat such that large volumes of air flow are required
to ensure that the assemblies are maintained at suitable operating
temperatures to allow adequate performance of their functions. The
power-electronic assemblies 114, 116 and 118 are supported within
the enclosure 120 via suitable insulators, for example as
illustrated generally in FIG. 1 at 117, 119.
[0016] The ventilation arrangement 110 includes an air intake
section 122 (FIG. 2) which draws in air at 121 via an air intake
123 and high pressure blowers at 124. In a specific embodiment, two
blowers 124a and 124b are provided for redundancy in case one of
the blowers should become non-functional. The air is drawn through
filters 125 and through the high pressure blowers 124 and delivered
into a plenum 126. The plenum 126 communicates to insulating ducts
128. In the illustrative embodiment, three insulating ducts 128a,
128b and 128c (FIG. 2) are connected to supply air to respective
insulating plenums 130a, 130b and 130c, one to supply air to each
of the power electronic assemblies 114, 116, and 118. The air is
directed through the power electronic assemblies 114, 116 and 118
and exits at 134 into the interior of the enclosure 120 and out of
the enclosure 120 through an exhaust outlet at 136. Both the intake
123 and the outlet 136 include suitable vandal-deterrent features.
The plenum 130 is fabricated from insulating materials such as
GPO-3 fiberglass material. The insulating duct 128 is also
fabricated from insulating material. In a preferred embodiment for
medium-voltage applications, the insulating duct 128 is fabricated
from a material having extremely low leakage characteristics, e.g.
poly methyl methacrylate (acrylic) or cycloaliphatic epoxy, so as
to provide extremely low tracking characteristics. For example, the
insulating duct 128 provides appropriate dielectric withstand (e.g.
BIL voltages in the range of 50-150 kv) for the various maximum
potential differences between the power electronic assemblies 114,
116 and 118 and the connected air delivery components, e.g. the
plenum 126 which is fabricated from steel in a specific
embodiment.
[0017] Referring now additionally to FIG. 3, each of the power
electronic assemblies 114, 116 and 118 includes power electronic
device modules 140 that are stacked one atop the other, e.g. as
illustrated at 140a, 140b and 140c. In an illustrative embodiment,
the power electronic device module 140 include compression-mounted
power electronic devices 141 such as semiconductors that are
clamped between interposed heat sink arrangements 142, e.g. as
illustrated at 142a and 142b. The heat sinks 142 include spaced
fins 143 that are generally planar, e.g. as illustrated at 143a,
143b. The heat sinks 142 are arranged such that the end portion 150
faces the plenum 130, the air being directed out of the plenum 130
in a direction 152 between and along the fins 143 of the heat sinks
142, i.e. parallel to the planes of the fins 143, with the air
exiting from the front end portion 153 of the power electronic
stages 140 in a direction 154. The power electronic stages 140 are
carried or supported via angle brackets 155 so as to provide
slide-in rack mounting of the power electronic stages 140. The
angle brackets 155 are carried by opposed structural supports 156,
158. The structural supports 156, 158 are attached to and supported
by upper and lower channels 157 and 159. The channels 157 and 159
also provide support for the plenum 130. The supports 156, 158 and
the channels 157, 159 also provide additional flow-directing
functions by bounding the perimeter of the power electronic stages
140.
[0018] In one specific embodiment, bus interconnection plates 144,
146 are provided at the front end 153 of the power electronic
stages 140 to provide electrical connection between the stages 140a
and 140b and the stages 140b and 140c respectively so as to connect
the stages 140a, 140b and 140c in electrical series relationship. A
bus connection plate 148 is provided at the front end of the stage
140c, a similar bus connection plate (not shown) being provided at
the front end of the stage 140a. In a specific illustrative
arrangement, the power electronic assemblies 114, 116 and 118 are
connected to bus structure generally referred to at 111, 113 in
FIG. 1. The plates 144, 146 and 148 provide additional flow
efficiency by closing off the openings at the front 153 of the
power electronic stages 140, creating a high pressure zone at the
output of the plenum 130 at the back end portion 150 of the power
electronic stage 140.
[0019] In another specific embodiment, a bus interconnection plate
149 is utilized to provide electrical interconnection between the
stages, e.g. 140b and 140c, in which case the plates 144, 146 and
148 solely provide the function of an air dam and need not be
conductive.
[0020] In accordance with important aspects of the present
invention, and referring now additionally to FIG. 4, preferably the
power electronic device modules 140 includes a clamping arrangement
10 to apply suitable clamping forces to a compression-mounted
semiconductor device 12 through two heat sinks 15, 17 mounted on
opposed sides of the interposed semiconductor device 12. The
clamping arrangement 10 includes provisions on either side of the
semiconductor device 12 and the heat sinks 15, 17 for applying
predetermined suitable clamping forces, e.g. in a specific
illustration, 10-17,000 pounds of clamping force. To this end, the
clamping arrangement 10 includes two spaced apart clamping beams
14, 16, which may also be characterized as bar members, are
provided on opposite sides of the semiconductor device 12, an
operable clamping member 18 carried by the clamping beam 16, and a
stack or plurality of spring washers 20 positioned the between the
semiconductor device 12 and the clamping beam member 16. The
clamping arrangement 10 also includes elongated members 22, 24,
generally in the shape of rods, for mounting and retaining the
clamping beams 14, 16 when the operable member 18 is manipulated to
apply clamping force to the semiconductor device 12.
[0021] The spring washers 20 provide a desirable force
distribution, the desired clamping force for appropriate electrical
connection of the semiconductor device 12, and suitable heat
conduction to the heat sinks 15,17. The elongated members 22, 24
are fabricated from an insulating material, and are pultruded
fiberglass rods in a specific embodiment. Since there is an
impressed electrical potential across the semiconductor device 12,
electric field stress concentrations must be considered and
minimized via the appropriate conformity and interfitting of the
various components that interface with the elongated members 22, 24
and the clamping beams which are electrically at the potential at
of the semiconductor device 12.
[0022] The elongated members 22, 24 and the clamping beam members
14, 16 include cooperating structure and arrangements that are
generally referred to at 26, 28, 30 and 32 which cooperate to hold
the clamping beam members 14, 16 about the semiconductor device 12
when clamping force is applied via the operable member 18. For
example the operable member 18 includes a threaded bolt 19 that is
threadingly received through a threaded portion 34 of the clamping
beam 14 with the bolt 19 extending to apply force to a base plate
21 of the heat sink 15 through an interposed clamping disc 23.
[0023] In accordance with important aspects of the present
invention, each of the semiconductor devices 12 includes back to
back devices 12a, 12b that are arranged in the power electronic
device module 140 for single-sided cooling. With this arrangement,
the heat sinks 15, 17 are suitably dimensioned to provide adequate
temperature operation of the devices 12a, 12b along with the
directed ventilation via 110. This results in an overall power
electronics assemblies such as 114, 116 and 118 that are of smaller
dimensions and overall configuration than double-sided cooling
configuration while also providing desirable clamping
configurations on a modular basis. While the heat sinks 15, 17 are
taller than conventional extruded heat sinks for double sided
cooling configurations, with modular clamping, the result is an
overall stack height for 114 which would be more than fifty percent
taller if double-sided cooling were utilized while also providing
the advantages of modular clamping for ease of assembly, simplicity
of components, ease of maintenance and overall reliability of
components.
[0024] While there have been illustrated and described various
embodiments of the present invention, it will be apparent that
various changes and modifications will occur to those skilled in
the art. Accordingly, it is intended in the appended claims to
cover all such changes and modifications that fall within the true
spirit and scope of the present invention.
* * * * *