U.S. patent application number 09/737867 was filed with the patent office on 2001-05-31 for electronic apparatus and method of manufacturing thereof.
This patent application is currently assigned to Kabushiki Kaisha Toshiba. Invention is credited to Hosoi, Takashi, Ono, Yasuo, Takaki, Nobuyuki.
Application Number | 20010002021 09/737867 |
Document ID | / |
Family ID | 15952729 |
Filed Date | 2001-05-31 |
United States Patent
Application |
20010002021 |
Kind Code |
A1 |
Hosoi, Takashi ; et
al. |
May 31, 2001 |
Electronic apparatus and method of manufacturing thereof
Abstract
In an electronic apparatus such as a portable computer
comprising an electronic apparatus housing having boss portions,
projecting portions are formed at locations where boss portions are
to be formed. In addition, a boss separate body is provided which
has an engaging hole therein and is to be attached to each of the
projecting portions to form the boss portions.
Inventors: |
Hosoi, Takashi; (Tokyo,
JP) ; Takaki, Nobuyuki; (Tokyo, JP) ; Ono,
Yasuo; (Yokohama-shi, JP) |
Correspondence
Address: |
Finnegan, Henderson, Farabow
Garrett & Dunner, L.L.P.
1300 I Street, N.W.
Washington
DC
20005-3315
US
|
Assignee: |
Kabushiki Kaisha Toshiba
|
Family ID: |
15952729 |
Appl. No.: |
09/737867 |
Filed: |
December 18, 2000 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
09737867 |
Dec 18, 2000 |
|
|
|
PCT/JP99/01763 |
Apr 2, 1999 |
|
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Current U.S.
Class: |
220/505 |
Current CPC
Class: |
G06F 1/1656 20130101;
G06F 1/1616 20130101; H05K 7/142 20130101 |
Class at
Publication: |
220/505 |
International
Class: |
B65D 001/24; B65D
001/36; B65D 025/04; B65D 057/00; B65D 085/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 19, 1998 |
JP |
10-173020 |
Claims
1. An electronic apparatus comprising: a housing formed as one
piece with a first boss member; and a second boss member formed as
a separate piece from said first boss member, and mounted on said
housing to form a boss portion.
2. An electronic apparatus comprising: a housing having a
projecting portion formed as one piece therewith; and a boss member
to be mounted on said projecting portion to form a boss
portion.
3. An electronic apparatus according to claim 2, wherein said
second boss member is fixed to said projecting portion by screw
engagement.
4. An electronic apparatus according to claim 2, wherein a height
of projection of said projecting portions from said housing is
within a range of approximately 1.5-2.0 times an external diameter
of the projecting portions.
5. An electronic apparatus according to claim 1, wherein said
housing is formed of a magnesium alloy, and said boss members are
formed of metal.
6. A method of manufacturing an electronic apparatus having a
housing with a boss portion, comprising the steps of: a housing
forming step for forming the housing introducing molten metal into
a mold device, the housing having a projecting portion at a
location where said boss portion is to be formed, and the housing
constituting portions other than the boss portion of said housing;
and a boss portion forming step for forming the boss portion by
fixedly engaging a boss member, which is to constitute the boss
portion, with said projecting portion.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This is a Continuation of Application No. PCT/JP99/01763,
filed Apr. 2, 1999.
[0002] This application is based upon and claims the benefit of
priority from the prior Japanese Patent Application No. 10-173020,
filed Jun. 19, 1998, the entire contents of which are incorporated
herein by reference.
BACKGROUND OF THE INVENTION
[0003] This invention relates to a housing for electronic
apparatuses such as personal computers, in particular, a boss
structure of an electronic apparatus housing.
[0004] Recently, a housing mainly using a magnesium alloy as
material is adopted as an electronic apparatus housing formed of
light metal. The alloy is molded by a die-cast method and a
thixotropy method. Although these molding methods are different in
the device structure, they are performed under the condition where
the alloy which has been molten at 580-750.degree. C. is injected
and molded in a mold having a temperature of 100-350.degree. C.
[0005] FIG. 1 shows a structure of a conventional electronic
apparatus housing. In an electronic apparatus housing 1, molten
metal is introduced from a sprue 2 which is a part for introducing
molten metal into a molding device (in FIG. 1, explanation is made
by using parts corresponding to the form of the electronic
apparatus housing immediately after molding), and passed through a
runner 3 so that the molten metal is introduced into a desired
mold. The introduced molten metal extends through the whole cavity
4 to reach an air vent 5. A basin 6 is further connected to the air
vent 5. Therefore, when the molten metal is introduced from the
sprue 2, air can be released outside through the air vent 5, and
thereby the housing can be formed in the state where no void exists
in the housing.
[0006] A plurality of bosses 7 are provided on the electronic
apparatus housing 1 in order to mount various electronic circuits
or the like on the housing. The bosses 7 are formed as one piece
with a bottom portion of the electronic apparatus housing 1 by
pouring the molten metal in concave hole portions formed in the
mold. Further, the bosses 7 are provided so as to project from the
bottom portion of the electronic apparatus housing 1.
[0007] Further, screw holes 8 are formed at the bosses 7, which
make it possible to engage an electronic circuit and other various
parts by screw.
[0008] In the meantime, the hole portions which are formed in the
mold in order to form the bosses 7 are formed in the form of a deep
groove in a direction perpendicular to a direction of flow of the
molten metal along the cavity 4 of the mold, so as to conform to
the form of the bosses 7 of the electronic apparatus housing 1. In
this case, though the molten metal easily flows in a direction
along the flow of the molten metal of the cavity 4, the holes are
formed perpendicular to the cavity 4, and therefore the molten
metal does not easily flow into the holes as the form of the holes
is made deeper.
[0009] Specifically, since the temperature of the mold is lower
than the temperature of the molten metal, when the molten metal
comes into contact with an internal wall of the mold,
solidification of the molten metal is quickly started. However,
when the holes are formed deeply, solidification of the molten
metal is started before the molten metal flows into the end portion
side of the holes. Therefore, a portion into which the molten metal
is not filled is generated, and there are cases where the bosses 7
are not formed in a desired form, or do not have a desired
height.
[0010] In the case where such bosses 7 are formed, screw holes 8
cannot be formed inside the bosses 7 in a good state, and there can
be produced an inconvenience that an electronic circuit and other
various parts cannot be fixed in a good state.
BRIEF SUMMARY OF THE INVENTION
[0011] The present invention has been made on the basis of the
above circumstances. The object of the invention is to provide an
electronic apparatus having a housing which includes no non-filled
portion and can form a boss form in a good state, and a method of
manufacturing thereof.
[0012] In one preferred embodiment, an electronic apparatus of the
present invention comprises a housing, and a boss member formed as
a separate piece from the housing and mounted on the housing to
form a boss portion.
[0013] Further, a method of manufacturing an electronic apparatus
of the present invention is a method of manufacturing an electronic
apparatus having a housing with a boss portion of a predetermined
height, comprising the steps of: a housing forming step for forming
the housing introducing molten metal into a mold device, the
housing having a projecting portion at a location where the boss
portion is to be formed, and the housing constituting portions
other than the boss portion of the housing; and a boss portion
forming step for forming the boss portion by fixedly engaging a
boss member, which is to constitute the boss portion, with the
projecting portion.
[0014] Additional objects and advantages of the invention will be
set forth in the description which follows, and in part will be
obvious from the description, or may be learned by practice of the
invention. The objects and advantages of the invention may be
realized and obtained by means of the instrumentalities and
combinations particularly pointed out hereinafter.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
[0015] The accompanying drawings, which are incorporated in and
constitute a part of the specification, illustrate presently
preferred embodiments of the invention, and together with the
general description given above and the detailed description of the
preferred embodiments given below, serve to explain the principles
of the invention.
[0016] FIG. 1 is a perspective view showing a form of an electronic
apparatus housing concerning conventional art;
[0017] FIG. 2 is a perspective view showing a structure of a
portable computer used as an electronic apparatus concerning an
embodiment of the present invention;
[0018] FIG. 3 is a diagram showing a flow chart of a method of
manufacturing the electronic apparatus;
[0019] FIG. 4 is a perspective view showing a form of an electronic
apparatus housing used for the electronic apparatus;
[0020] FIG. 5 is a side cross-sectional view showing a state of a
boss portion and around the boss portion of the electronic
apparatus; and
[0021] FIG. 6 is a perspective view showing a form of a mold
device.
DETAILED DESCRIPTION OF THE INVENTION
[0022] An embodiment of the present invention will now be described
on the basis of FIGS. 2 to 6.
[0023] FIG. 2 is an outside drawing showing a form of a portable
computer 10 such as a notebook computer used as a kind of
electronic apparatus. In FIG. 2, the portable computer 10 comprises
a computer main body 11, and a display unit 12 which is rotatably
supported on the computer main body 11. Further, the computer main
body 11 comprises a housing 13, and the housing 13 has a structure
wherein a lower housing 14 and an upper housing 15 are joined by
screw or the like. However, the structure for joining the lower
housing 14 and the upper housing 15 is not limited to it, and the
housings may be jointed by other structures.
[0024] In the following description, a housing applied to an
electronic apparatus such as the portable computer 10 will be
explained as an electronic apparatus housing 20, and a method of
manufacturing an electronic apparatus using the electronic
apparatus housing 20 will also be explained. Further, the method of
manufacturing the electronic apparatus is shown in FIG. 3, and the
process will also be described.
[0025] The electronic apparatus housing 20 shown in FIG. 4, which
is used for an electronic apparatus such as personal computer and
formed of a light metal made of a magnesium alloy has boss portions
21 in order to mount an electronic circuit and other various parts
inside. In the electronic apparatus housing 20, in order to form
the boss portions 21, the electronic apparatus housing 20 is formed
by the following steps.
[0026] Specifically, a mold device 30 used in FIG. 6 is used in
order to form the electronic apparatus housing 20. The mold device
30 comprises an upper mold 31 and a lower mold 32, and the mold
device 30 is formed by engaging these molds. The mold device 30 is
provided with a sprue 33 which is an introducing port of molten
metal, and a runner 34 which guides molten metal from the sprue 33
into a cavity 35 of the mold device 30 so that the molten metal is
uniformly diffused. The molten metal guided by the runner 34 is
introduced into the cavity 35 of the mold device 30.
[0027] The molten metal is a molten magnesium alloy. In addition to
this, a molten metal of a molten aluminum alloy can be used, for
example.
[0028] In the cavity 35, in order to form boss portions 21
projecting from a bottom surface of the above electronic apparatus
housing 20, the internal wall surface of the cavity 35 is hollowed
by a predetermined diameter to form hole portions 36. Although the
hole portions 36 do not have a height necessary as the boss
portions 21, the depth of the hole portions 36 are set so as to
form projecting portions 22 having a height to reach a halfway
portion of the boss portions 21.
[0029] Specifically, in the case where a molten metal of magnesium
alloy is used, when the diameter of the projecting portions 22 is d
and the height of the projecting portions 22 is h as shown in FIG.
5, they are provided so as to fall within the range of h/d=
1.5-2.0.
[0030] The molten metal filled into the cavity 35 reaches an air
vent 37 provided on the other end side of the cavity 35. The air
vent 37 is aimed at releasing air existing in the cavity 35 from
the inside of the cavity 35 to the outside. Thereby, the molten
metal introduced into the cavity 35 reaches a basin 38 while
generation of void in the cavity 35 is prevented.
[0031] The molten metal is introduced into the cavity 35 by
injection molding so that the molten metal instantly reaches the
above air vent 37. When the molten metal reaches the air vent 37,
since the temperature of the mold device 30 is low, that is, about
100-350.degree., the solidification of the molten metal as a molded
product 40 is started immediately in a part of the internal wall
surface of the mold device 30 with which the molten metal is
brought in contact (a housing forming step).
[0032] After the molded product 40 has been formed, the molded
product 40 is taken out from the mold device 30. Then, a screw hole
23 serving as a female screw is formed at each projecting portion
22, and a boss separate body 24 formed as a separate piece is
engaged in the screw hole 23 (a boss-portion forming step). The
boss separate body 24 is formed of metal, and has a structure for
conducting charged electricity to the molded product 40 when an
electric circuit 41 or the like mounted on the upper end side of
the boss separate body 24 is charged.
[0033] As shown in FIG. 5, in order to make it possible to mount
the boss separate body 24 by screw engagement, the boss separate
body 24 is provided with a screw portion 26 which is formed with a
smaller diameter to project from a main body 25 of the boss
separate body 24 so as to correspond to the screw hole 23 formed at
the projecting portion 22. Specifically, the boss separate body 24
has a structure wherein the screw portion 26 is formed with a
smaller diameter to project from the main body 25 of the boss
separate body 24.
[0034] A screw groove serving as a male screw is formed on an
external surface of the screw portion 26. The screw groove is
engaged with the screw hole 23, and thereby the boss separate body
24 is fixed to the projecting portion 22 by screw engagement.
[0035] Further, an external diameter of the boss separate body 24
is formed to be almost equivalent to that of the projecting portion
22. Thereby, the external diameter of the boss portion 21 is made
uniform.
[0036] An engaging hole 27 for engaging another member is formed in
the boss separate body 24 downward from the upper end of the boss
separate body 24. The engaging hole 27 is provided for mounting and
fixing the electronic circuit 41 and other various parts which are
separated from the electronic apparatus housing 20.
[0037] Specifically, the boss portion 21 is formed by forming the
screw hole 23 at the projecting portion 22 of the molded product
40, further providing the boss separate body 24 and forming a screw
groove on the screw portion 26, and engaging the boss separate body
24 in the screw hole 23.
[0038] Thereby, an electronic circuit or other various parts can be
fixedly engaged in the engaging hole 27 located in the boss portion
21 via a screw and bolt.
[0039] According to the electronic apparatus housing 20 and the
method of manufacturing the electronic apparatus housing 20 having
the structure as described above, in the mold device 30, the hole
portions 36 are formed to project to conform to the projecting
portions 22, and the molded product 40 is formed by introducing the
molten metal into the hole portions 36. Therefore, if the height of
the projecting portions 22 is made low, that is, if the depth of
the hole portions 36 of the mold device 30 is made shallow, it is
possible to flow the molten metal into the hole portions 36 in a
good state.
[0040] Specifically, when the molten metal is introduced into the
cavity 35, in particular, in the case where the diameter of the
projecting portions 22 is d and the height thereof is h, by setting
d and h within the range of h/d=1.5-2.0, it is possible to fill the
molten metal into the hole portions earlier than start of
solidification of the molten metal.
[0041] Therefore, even in the case of using a molten metal of
magnesium alloy having a low flowability, whose flowability is apt
to deteriorate when it comes into contact with a low-temperature
part inside the cavity 35, it is possible to fill the molten metal
in a good state into the end portion side of the hole portions 36.
Thereby, no non-filled portion is generated in the hole portions
36, and it is possible to form the projecting portions 22 in a good
state.
[0042] Further, since the apparatus has the structure wherein the
boss separate body 24 is separately fixed by screw engagement to
the projecting portion 22 whose height is reduced, if the height of
the boss separate body 24 is set appropriately, it is possible to
set the boss portions 21 to a desired height.
[0043] Furthermore, since the boss separate body 24 is formed of
metal, even if the electronic circuit 41 or the like is mounted on
the upper end side of the boss separate body 24, the electronic
circuit 41 or the like is not charged with static electricity and
the static electricity is introduced into the molded product 40
through the boss separate body 24. Specifically, the electronic
circuit 41 or the like is earthed.
[0044] Thereby, it is possible to prevent break of the electronic
circuit 41 or the like due to flowing of a large current into the
electronic circuit 41 or the like by short circuit.
[0045] Further, since the apparatus has the structure wherein the
projecting portions 22 are formed and the boss separate bodies 24
are fixed to the projecting portions 22 by screw engagement, there
is no inconvenience that screw threads project from a lower surface
of the thin molded product 40, in comparison with the case where
the boss separate bodies 24 are mounted on a part where projecting
portions 22 are not formed. Therefore, in the case where a personal
computer or the like is placed with its lower surface positioned at
the bottom, it is possible to improve the stability in placement.
Further, in order to improve the stability in placement, there is
no need to form hollows for receiving head portions of bolts.
[0046] Although the embodiment of the present invention has been
described above, in addition to the above, the present invention
can be modified in various ways as described below.
[0047] Although in the above embodiment the boss separate bodies 24
are engaged with the projecting portions 22, the boss separate
bodies 24 may also be mounted on the projecting portions 22 by
means of press fitting or caulking, for example.
[0048] Further, the apparatus may have a structure wherein the
screw portion 26 provided on the boss separate body 24 and the
screw hole 23 are provided vice versa. Specifically, the lower end
of each boss separate body 24 is formed to have a larger diameter
and a screw hole is formed in the portion, and each projecting
portion is formed to have a smaller diameter and a screw thread is
formed on the external surface of the projecting portion 22 to form
a screw portion.
[0049] Further, other various modifications are possible within the
range which does not change the gist of the present invention.
[0050] Additional advantages and modifications will readily occur
to those skilled in the art. Therefore, the invention in its
broader aspects is not limited to the specific details and
representative embodiments shown and described herein. Accordingly,
various modifications may be made without departing from the spirit
or scope of the general inventive concept as defined by the
appended claims and their equivalents.
* * * * *