U.S. patent application number 09/742078 was filed with the patent office on 2001-05-03 for semiconductor integrated circuit device.
Invention is credited to Fujisawa, Hiroki, Fukui, Kenichi, Kajigaya, Kazuhiko, Tachibana, Toshikazu.
Application Number | 20010000691 09/742078 |
Document ID | / |
Family ID | 14634836 |
Filed Date | 2001-05-03 |
United States Patent
Application |
20010000691 |
Kind Code |
A1 |
Fujisawa, Hiroki ; et
al. |
May 3, 2001 |
Semiconductor integrated circuit device
Abstract
In a semiconductor integrated circuit in which an internal
voltage generation circuit operating on a power supply voltage
supplied through an external terminal forms either or both of a low
voltage and a boosted voltage to operate internal circuits, a first
internal circuit operating on the power supply voltage supplied
through the external terminal or the boosted voltage formed by the
internal voltage generation circuit is constituted by a first
MOSFET with a gate insulation film having a large thickness adapted
to the power supply voltage or boosted voltage, and a second
internal circuit operating on the low voltage is constituted by a
second MOSFET with a gate insulation film having a small thickness
adapted to the low voltage.
Inventors: |
Fujisawa, Hiroki; (Tokyo,
JP) ; Kajigaya, Kazuhiko; (Iruma-shi, JP) ;
Fukui, Kenichi; (Tokyo, JP) ; Tachibana,
Toshikazu; (Tachikawa-shi, JP) |
Correspondence
Address: |
ANTONELLI TERRY STOUT AND KRAUS
SUITE 1800
1300 NORTH SEVENTEENTH STREET
ARLINGTON
VA
22209
|
Family ID: |
14634836 |
Appl. No.: |
09/742078 |
Filed: |
December 22, 2000 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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09742078 |
Dec 22, 2000 |
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09288512 |
Apr 8, 1999 |
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6195305 |
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Current U.S.
Class: |
365/226 |
Current CPC
Class: |
G11C 5/147 20130101 |
Class at
Publication: |
365/226 |
International
Class: |
G11C 008/00 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 9, 1998 |
JP |
10-114317 |
Claims
What is claimed is:
1. A semiconductor integrated circuit comprising: an external
terminal for receiving an external power supply voltage; an
internal voltage generation circuit which generates either or both
of a low voltage lower than said external power supply voltage and
a boosted voltage higher than said external power supply voltage; a
first internal circuit operating on said external power supply
voltage or said boosted voltage; and a second internal circuit
operating on said low voltage, wherein said first internal circuit
comprises a first MOSFET with a gate insulation film having a large
thickness adapted to said external power supply voltage or boosted
voltage and wherein said second internal circuit comprising a
second MOSFET with a gate insulation film having a small thickness
adapted to said low voltage.
2. A semiconductor integrated circuit device according to claim 1,
wherein said boosted voltage increases depending said external
power supply voltage when it is equal to or higher than a
predetermined voltage and wherein said low voltage increases
depending on said external power supply voltage when it is equal to
or higher than a predetermined voltage.
3. A semiconductor integrated circuit device according to claim 1,
wherein said first internal circuit comprises an input circuit
which receives an input signal supplied through an external
terminal, an output circuit which transmits an output signal to the
external terminal and a third internal circuit operating on said
boosted voltage.
4. A semiconductor integrated circuit device according to claim 3,
wherein said second internal circuit comprises a fourth internal
circuit operated in association with the operation of said third
internal circuit and wherein said fourth internal circuit is
operated by an operation timing signal which is delayed from the
operation timing signal of said third internal circuit by a first
delay circuit including said first MOSFET.
5. A semiconductor integrated circuit device according to claim 4,
wherein said third internal circuit comprises a dynamic memory cell
formed by an address selection MOSFET and a storage capacitor and a
word driver which forms a selection signal for word lines to which
such a dynamic memory cell is connected; said input circuit
receives an address signal; and said output circuit outputs a
readout signal read out from said memory cell.
6. A semiconductor integrated circuit device according to claim 5,
wherein a negative back bias voltage is supplied to a semiconductor
region where the address selection MOSFET of said memory cell is
formed and wherein such a back bias voltage is formed by said
internal voltage generation circuit.
7. A semiconductor integrated circuit device according to claim 5,
wherein said fourth internal circuit comprises a driving circuit
which drives a sense amplifier and wherein said driving circuit is
operated by an operation timing signal which is obtained by
delaying the operation timing signal of said word driver with first
delay circuit including said first MOSFET.
8. A semiconductor integrated circuit device according to claim 7,
wherein said driving circuit comprises: a first N-channel type
MOSFET for overdriving for supplying the power supply voltage to
the source of a P-channel type MOSFET that constitutes a sense
amplifier; a second N-channel type MOSFET for driving which
supplies said low voltage to the source of a P-channel type MOSFET
that constitutes said sense amplifier; and a third N-channel type
MOSFET for driving which supplies a ground potential of a circuit
to the source of an N-channel type MOSFET that constitutes said
sense amplifier, wherein said first and second N-channel type
MOSFETs comprise said first MOSFET having a thick gate insulation
film and said third N-channel type MOSFET comprises said second
MOSFET having a thin gate insulation film.
9. A semiconductor integrated circuit device according to claim 4
or 8, wherein said first delay circuit comprises: an inverter
circuit having said first MOSFET to which an input signal to be
delayed is supplied at an input terminal thereof; resistor which
transmits an output signal of said inverter circuit; a capacitor to
which the signal is transmitted through said resistor and which is
formed utilizing the gate capacitance of said second MOSFET; and an
inverter circuit having said second MOSFET to which an output
signal of a time constant circuit formed by said resistor and
capacitor is supplied at an input terminal thereof to form said
delay signal.
10. A semiconductor integrated circuit device according to claim 1,
wherein said first internal circuit operating on said external
power supply voltage or said boosted voltage includes either or
both of a smoothing MOS capacitance and a capacitance for phase
compensation to which such a voltage is applied at the gate thereof
and wherein said second internal circuit operating on said low
voltage includes either or both of a smoothing MOS capacitance and
a capacitance for phase compensation to which such a voltage is
applied to the gate thereof.
11. A semiconductor integrated circuit device according to claim 6,
wherein said internal voltage generation circuit comprises a
substrate back bias voltage generation circuit; such a substrate
back bias voltage generation circuit comprising a voltage detection
circuit for setting a substrate voltage at a desired voltage; said
voltage detection circuit comprises a fourth N-channel type MOSFET
constituted by said second MOSFET having a current source provided
at the drain thereof, a gate connected to the ground potential of a
circuit and a detection voltage adjusting portion provided between
the source and a substrate voltage and comprises an inverter
circuit for forming a detection signal in response to an output
from the drain of said fourth MOSFET; said detection voltage
adjusting portion comprises fifth, sixth and seventh N-channel type
MOSFETs provided between the source of said fourth N-channel type
MOSFET and the substrate voltage whose gates are connected to the
source of said fourth N-channel type MOSFET and whose drain and
source paths are series-connected and fuse means for shorting the
drains and source of them; said fifth and sixth N-channel type
MOSFETs comprise said first MOSFET having a thick gate insulation
film and said seventh N-channel type MOSFET comprises said second
MOSFET having a thin gate insulation film, the gate lengths thereof
being set to provide different threshold voltages; and said fuses
are selectively cut off to adjust said detection voltage.
12. A semiconductor integrated circuit device according to claim 5,
wherein said third internal circuit comprises: main word lines;
subarrays having sub word lines whose length is divided in the
direction in which said main word lines extend, which are arranged
in plurality in the direction of the bit lines crossing said main
word lines and to which address selection terminals of a plurality
of dynamic memory cells are connected and having a plurality of
complementary bit lines which are provided perpendicular to said
plurality of sub word lines and to one of which input/output
terminals of said dynamic memory cells are connected; a plurality
of sub word line driving circuit which forms a selection signal for
said sub word lines in response to a selection signal for said main
word lines and a selection signal transmitted through said sub word
selection lines; and a main word line driving circuit which forms a
selection signal for said main word lines.
13. A semiconductor integrated circuit device according to claim
12, wherein in said subarrays, said sub word line driving circuits
are separated and provided on both sides of said array of a
plurality of sub word lines associated with the subarrays; sense
amplifiers are separated and provided on both sides of said array
of a plurality of complementary bit lines; and one of said
subarrays is formed such that it is surrounded by said row of a
plurality of sub word line driving circuits and said row of a
plurality of sense amplifiers.
14. A semiconductor integrated circuit device according to claim
13, wherein said sense amplifiers are based on a shared sense
system and are commonly provided in association with the bit lines
of subarrays adjacent thereto; and said sub word line driving
circuit selects the sub word lines of the subarrays adjacent
thereto.
15. A semiconductor integrated circuit device according to claim 1
or 5, wherein said low voltage is a voltage which is substantially
equal to or lower than 2 V and which is higher than the lower limit
of the operating voltage of a CMOS circuit having the second
MOSFET.
16. A semiconductor integrated circuit device comprising: a low
voltage circuit which receives a first voltage supplied and for
generates a second voltage obtained by reducing the same; a first
internal circuit operating on a voltage higher than said second
voltage; and a second internal circuit operating on said second
voltage and wherein said first internal circuit comprises a first
MOSFET with a gate insulation film having a first thickness; said
second internal circuit comprises a second MOSFET with a gate
insulation film having a second thickness which is smaller than
said first thickness; and said second internal circuit comprises a
delay circuit which forms a timing signal for said first internal
circuit; and said delay circuit comprises said first MOSFET.
17. A semiconductor integrated circuit device according to claim
16, comprising word lines; data lines; sense amplifiers connected
to said data lines; a word line driving circuit; and a sense
amplifier driving circuit, wherein said first internal circuit
comprises said word line driving circuit; said second internal
circuit comprises said sense amplifier driving circuit; and said
delay circuit forms an operation timing signal for said sense
amplifier driving circuit which is a signal obtained by delaying
the operation timing signal of said word line driving circuit.
18. A semiconductor integrated circuit device comprising: word
lines; data lines; sense amplifiers connected to said data lines; a
word line driving circuit; a sense amplifier driving circuit; and a
delay circuit which forms an operation timing signal for said sense
amplifier driving circuit which is a signal obtained by delaying
the operation timing signal of said word line driving circuit,
wherein said word line driving circuit operates on a first power
supply voltage; said sense amplifier driving circuit and said delay
circuit operate on a second power supply voltage lower than said
first power supply voltage; said word line driving circuit and said
delay circuit comprise a first transistor with a gate insulation
film having a first thickness; and said sense amplifier driving
circuit comprises a second transistor with a gate insulation film
having a second thickness smaller than said first thickness.
19. A semiconductor integrated circuit device according to claim
18, comprising a boosting circuit which forms said first power
supply voltage.
20. A semiconductor integrated circuit device according to claim
18, comprising a low voltage circuit which forms said second power
supply voltage.
Description
BACKGROUND OF THE INVENTION
1. 1. Field of the Invention
2. The present invention relates to semiconductor integrated
circuits, e.g., a technique advantageous for dynamic RAMs (random
access memories) which are directed to higher speed and lower power
consumption.
3. Japanese unexamined patent publication No. 8-181292 disclosed an
example of dynamic RAMs which has a hierarchical word line
configuration and a triple well structure including an N-well of a
great depth.
4. In a dynamic RAM, a plurality of internal voltages are developed
from a power supply voltage supplied through an external terminal
and are supplied to internal circuit blocks. For example, a method
of operating internal circuits using a voltage (3 V) as a result of
a voltage drop from an external power supply voltage VDD (5 V) has
been widely used since the advent of 16 Mbit dynamic RAMs in order
to maintain the reliability of fine devices and to reduce power
consumption. The 64 Mbit generation is directed to lower operating
voltages in internal circuits, e.g., an external voltage VDD drops
to 3.3 V to supply a low voltage on the order of 2.5 V to
capacitors of memory cells and, further peripheral circuits are
also operated at the dropped voltage.
5. A dynamic memory cell must be formed to have a high threshold
voltage in order to prevent a reduction of information retention
time attributable to a leak current in an off state and a leak
current caused by the lifting of a word line. It is desirable to
reduce the operating voltage of internal circuits other than the
memory cells to reduce power consumption, and the threshold voltage
of MOSFETs (hereinafter, imply MISFETs according to general
recognition) is preferably low in order to maintain a desired
operating speed at such a low voltage.
6. In conventional dynamic RAMs, in order to satisfy the
contradicting requirements described above, a MOSFET having a
relatively high threshold voltage is formed in consideration to the
information retention time at the memory cell and the operating
speed of peripheral circuits as described above. The three-well
structure described above electrically isolates P-type well regions
where MOSFETs of memory cells are formed and P-type well regions or
a substrate where MOSFETs of peripheral circuits are formed; a
negative backward bias voltage is supplied to channel regions of
MOSFETs that form address selection MOSFETs of memory cells to make
a correction to increase a threshold voltage thereof; the ground
potential of the circuit is supplied to channel regions of MOSFETs
forming the peripheral circuits; and the impurity concentration of
the channel regions is corrected to a lower value to make an
adjustment to reduce the threshold voltage using an ion
implantation technique.
SUMMARY OF THE INVENTION
7. The inventors have studied the possibility of a reduction in the
operating voltage of a dynamic RAM provided with a mass storage
capacity, e.g., 256 Mbits to 2 V or less in order to achieve a
further reduction in power consumption. For such an operating
voltage as low as 2 V or 1.8 V, the above-described technique for
correcting a threshold voltage results in a problem not only in
that a desired operating speed can not be achieved but also in that
process-related variations are significant. Under such
circumstances, the inventors have conceived a configuration of a
single semiconductor integrated circuit device utilizing MOSFETs
having two kinds of gate insulation films that depends on operating
voltages. The use of such MOSFETs having two kinds of gate
insulation films has encountered a new problem in that control of
operations or adjustment of timing between circuits utilizing the
MOSFETs having two kinds of gate insulation films requires the
timing must be set based on the assumed worst case of operation
timing attributable to variations in the thickness of the gate
insulation films, which significantly affects the operating
speed.
8. It is an object of the present invention to provide a
semiconductor integrated circuit device in which devices can be
made finer, faster and less power-consuming without reducing
reliability. It is another object of the present invention to
provide a semiconductor integrated circuit device including dynamic
RAMs in which devices are made finer, faster, improvement of the
degree of the integration and less power-consuming without reducing
reliability. The above-described and other objects and novel
features of the present invention will become apparent from the
description of the present specification and the accompanying
drawing.
9. A typical aspect of the invention disclosed in this
specification can be briefly described as follows. In a
semiconductor integrated circuit device in which an internal
voltage generation circuit operating on a power supply voltage
supplied through an external terminal develops either or both of a
dropped voltage and boosted voltage to operate internal circuits, a
first internal circuit operating on the power supply voltage
supplied through the external terminal or the boosted voltage
developed at the internal voltage generation circuit is formed by a
first MOSFET having a gate insulation film having a large thickness
corresponding to the power supply voltage or the boosted voltage
and second internal circuit operating on the low voltage is formed
by a second MOSFET having a gate insulation film having a small
thickness corresponding to the low voltage.
10. Another typical aspect of the invention disclosed in the
present specification can be briefly described as follows. When the
second internal circuit is operated in association with the
operation of the first internal circuit, an operation timing signal
of the second internal circuit is formed by monitoring the state of
operation of the first internal circuit by a delay circuit
utilizing the first MOSFET forming a part of the first internal
circuit.
BRIEF DESCRIPTION OF THE DRAWINGS
11. FIG. 1 is a general block diagram of an embodiment of a dynamic
RAM according to the present invention.
12. FIG. 2 is a schematic block diagram of an embodiment of the
timing circuit shown in FIG. 1.
13. FIG. 3 is a circuit diagram of an embodiment of the delay
circuit DL2 shown in FIG. 2.
14. FIG. 4 is a circuit diagram of an embodiment of a sub word
driver used in a dynamic RAM according to the present
invention.
15. FIG. 5 is a timing chart for explaining an example of an
operation to select the row system of a dynamic RAM according to
the present invention.
16. FIG. 6 is a sectional view of a device structure for explaining
an embodiment of a dynamic RAM according to the present
invention.
17. FIG. 7 is a schematic layout diagram of an embodiment of a
dynamic RAM according to the present invention.
18. FIG. 8 is a schematic layout diagram for explaining the dynamic
RAM according to the present invention in more detail.
19. FIG. 9 is a schematic layout diagram of an embodiment of a
subarray and peripheral circuits around the same in a dynamic RAM
according to the present invention.
20. FIG. 10 is a schematic layout diagram of an embodiment of well
regions in which the subarrays and peripheral circuits around the
same in the dynamic RAM according to the present invention are
formed.
21. FIG. 11 is a circuit diagram of an embodiment of a dynamic RAM
according to the present invention in which the process from
address input through data output is simplified primarily in a
sense amplifier.
22. FIG. 12 is a schematic layout diagram of another embodiment of
a dynamic RAM according to the present invention.
23. FIG. 13 is a circuit diagram of an embodiment of a capacitor
used in the present invention.
24. FIGS. 14A and 14B are a configuration diagram and an
operational illustration respectively for an embodiment of a
voltage detection circuit provided in a substrate voltage
generation circuit in a dynamic RAM according to the present
invention.
25. FIG. 15 is a block diagram of an embodiment of an internal
voltage generation circuit provided in a dynamic RAM according to
the present invention.
26. FIGS. 16A and 16B are circuit diagrams of an embodiment of a
level shift circuit used in the present invention.
27. FIGS. 17A and 17B are voltage characteristic diagrams of an
example of an internal voltage circuit of a dynamic RAM according
to the present invention.
DETAILED DESCRIPTION OF THE INVENTION
28. FIG. 1 is a general block diagram of an embodiment of a dynamic
RAM according to the present invention. Control input signals are a
row address strobe signal /RAS, a column address strobe signal
/CAS, a write enable signal /WE and an output enable signal /OE.
The symbol "/" here corresponds to an over bar of a logical symbol
for which the low level represents an active level. An X-address
signal and a Y-address signal are input in a time series from a
common address terminal Add in synchronism with the row address
strobe signal /RAS and the column address strobe signal /CAS.
29. X-address signals and Y-address signals input through an
address buffer are received by respective latch circuits. The
X-address signals received by the latch circuit are supplied by a
predecoder as described above, and signals output therefrom are
supplied to an X-decoder to form selection signals for word lines
WL. As a result of an word line selecting operation, read signals
as described above appear on complementary bit lines of the memory
array to cause an amplifying operation of the sense amplifier. The
Y-address signals received by the latch circuit are supplied to the
predecoder as described above, and signals output therefrom are
supplied to the Y-decoder to form selection signals for bit lines
BL. An X-relief circuit and Y-relief circuit compare an operation
of storing defective addresses, the stored defective addresses and
the above-described received address signals, instruct the
X-decoder and Y-decoder to select spare word lines or bit lines if
they match, and inhibit an operation of selecting the normal word
lines or normal bit lines.
30. The stored information is amplified by a sense amplifier and is
then selected by a column switch circuit which is not shown and the
selected pieces of information are connected to common input/output
lines to be transmitted to a main amplifier. There is no special
particular limitation on the main amplifier, it is an amplifier
which serves also as a write circuit, Specifically, it amplifies
readout signals which have been read out through a Y-switch circuit
and outputs them from an external terminal I/O through an output
buffer during a readout operation. During a write operation, write
signals input through the external terminal I/O are received
through an input buffer, transmitted to a common input/output line
and selected bit lines through the main amplifier. The write
signals are transmitted on the selected bit lines as a result of
the amplifying operation of the above-described sense amplifier,
and corresponding charge is maintained in capacitors of memory
cells.
31. A clock generation circuit (main control circuit) generates
various timing signals required for selecting memory cells such as
a fetch control timing signal for address signals input in
association with the signals /RAS and /CAS and an operation timings
signal for the sense amplifier. An internal power supply generation
circuit receives operational voltages such as VDD and VSS supplied
through a power supply terminal and generates the above-described
plate voltage, an internal boosted voltage VPP, internal low
voltages VDL, precharge voltages such as VDL/2 and various internal
voltages such as a substrate back-bias voltage VBB. A refresh
counter generates an address signal for refresh to be used for an
X-system selection operation when a refresh mode is enabled.
32. In the present embodiment, each of the circuits with slant
lines in FIG. 1 is constituted by a MOSFET having a relatively
thick gate insulation film such that it is not broken by the power
supply voltage VDD or boosted voltage VPP which is the operating
voltage of the same (in the present specification, the term
"MOSFET" is used to imply also insulated gate type field effect
transistor, i.e., so-called MISFET). The other circuits are
constituted by a MOSFET having a relatively thin gate insulation
film adapted to the low voltage VDL which is the operating voltage
of the same, with some exceptions as described below.
33. The address buffer, a control buffer which receives the control
signal, the input buffer and the output buffer are operated by the
power supply voltage VDD in order to interface them with other
devices operating on the system power supply voltage VDD. The
internal voltage generation circuit is inevitably operated by the
power supply voltage VDD because it develops the low voltage VDL,
boosted voltage VPP and negative voltage VBB based on the power
supply voltage VDD and ground potential VSS. The memory array
(memory cells) and word drivers are operated by the boosted voltage
VPP to perform a full-writing operation of capacitor charge into
the memory cells as described above. Such MOSFETs operated by
relatively high voltages are constituted by MOSFETs with a gate
insulation film having a relatively large thickness (e.g., 8 nm) as
described above. The boosted voltage VPP may be developed based on
the low voltage VDL.
34. Each of internal circuits of the main control circuit and clock
generation circuits excluding the control buffer, the refresh
counter, latch circuit, predecoder, X- and Y-relief circuits,
X-decoder, Y-decoder, sense amplifier and main amplifier is
operated by the low voltage VDL and is accordingly constituted by a
MOSFET with a gate insulation film having a relatively small
thickness (e.g., 4 nm) as described above. While their operating
voltage is the low voltage VDL, a timing circuit which forms a
timing signal for activating the sense amplifier in accordance with
a word line selecting operation is constituted by a delay circuit
utilizing a MOSFET with a relatively thick gate insulation film in
order to monitor the operation of the word drivers. The timing
signal is one of exceptions of the principle behind the present
invention that the thickness of the gate insulation film of a
MOSFET is set in relation to the operating voltage, i.e., withstand
voltage of the gate insulation film as described above.
35. FIG. 2 shows a schematic block diagram of an embodiment of the
timing circuit. In the present embodiment, control signals SHR and
BLEQ for a shared switch circuit and a bit line equalize circuit
are set (one of shared switches is turned off and an equalize
MOSFET and a precharge MOSFET are turned off) in response to a rise
of a clock signal RCLK for the row system; a sub word line SWL is
set (selected) by a delay signal of a delay circuit DL1; a sense
amplifier SA is set (enabled) depending on the delay time of a
delay circuit DL2; and an overdrive MOSFET is turned off by a delay
circuit DL3 and a switch MOSFET for supplying the low voltage VDL
is turned on instead. In response to a fall of the clock signal
RCLK, the sub word line SWL is reset (unselected), the sense
amplifier SA is reset (disabled) by a delay circuit DL4.
36. Since the shared switch MOSFET is switched on by the high
voltage VPP applied to its gate and is switched off by a transition
of the same to a low level, the delay circuit DL1 is constituted by
a MOSFET with a thick gate insulation film as described above to
monitor the operation of the same. Similarly, the delay circuit DL2
is also constituted by a MOSFET with a thick gate insulation film
as described above to monitor a sub word line selecting operation.
Specifically, the delay circuit DL2 is constituted by a MOSFET with
a thick gate insulation film as described above as for the sub word
driver because the sense amplifier must be operated after a period
of time required to select sub word lines, to turn on the address
selection MOSFETs for the selected memory cells and to establish
charge sharing between charge precharged in the capacity of the bit
lines and charge accumulated in the memory cell capacitors.
37. The delay circuit DL3 for setting the overdrive time of the
sense amplifier is constituted by a MOSFET formed with a thin gate
insulation film similar to that of the sense amplifier in order to
monitor the operation of the sense amplifier formed with a thin
gate insulation film. The sense amplifier which is disabled when
the sub word lines SWL are reset and the delay circuit DL4 which
sets the timing of the operation of the shared switch MOSFET and
equalize MOSFET are constituted by MOSFETs having a thick gate
insulation film as that of the sub word drivers in order to monitor
the operating time of the same. When the timing circuit is
constituted by a MOSFET having a thin gate insulation film similar
to those of other internal circuits, it is necessary to set an
extra time margin in consideration to both of the worst case
associated with the longest time spent by MOSFETs having a thick
gate insulation film such as those for the sub word drivers and the
like and the worst case associated with the shortest time spent by
the delay circuits utilizing MOSFETs having a thin gate insulation
film. As a result, an unduly long operating time can be set for the
sense amplifiers of most dynamic RAMs except in rare cases in which
the above-described two worst cases occur. In a dynamic RAM, the
operating time of the sense amplifier as described above occupies a
relatively large part of the time spent before a readout signal is
obtained after the input of an address corresponding thereto, and
it is quite important in achieving a high speed to select word
lines and activate the sense amplifier at timing as short as
possible.
38. FIG. 3 shows a circuit diagram of an embodiment of the delay
circuit DL2. While the delay circuit DL2 is constituted by a MOSFET
with a gate insulation film having the same thickness as that of
sub word drivers in order to monitor the operating time of the same
as described above, it does not mean that all of the elements are
constituted by a MOSFET having a thick gate insulation film. Since
the delay circuit DL2 is only required to monitor the operating
time of the sub word drivers as described above, it is only
required to form it to have a delay time in accordance with
process-related variations of MOSFETs having a thick gate
insulation film. According to this principle, a MOSFET having a
thick gate insulation film (hereinafter referred to as "thick film
MOS") is constituted by only a P-channel type MOSFET Q30 and an
N-channel type MOSFET Q31 for receiving an input signal. A time
constant circuit comprising resistors R10 and R11 and capacitors
utilizing gate capacitance of MOSFETs Q32 and Q33 comprising a thin
gate insulation film (hereinafter referred to as "thin film MOS")
is provided at an output portion of this CMOS inverter circuit. An
output timing signal RSA1T is formed through buffer circuits BA1
and BA2 which receive an output signal of the time constant
circuit. Delay time at the buffer circuits is negligible relative
to the overall delay time.
39. An ON resistance which depends on process-related variations of
the MOSFETs Q30 and Q31 plays a dominant roll in determining the
time constant resulting from the resistors R10 and R11 and the
capacitors. Specifically, in the delay circuit DL2 of the present
embodiment, the resistors R10 and R11 and the capacitors Q32 and
Q33 define a constant delay time independent of process-related
variations, and the ON resistance of the MOSFETs having a thick
gate insulation film plays a dominant roll in setting the delay
time of the word line selecting operation which depends on
process-related variations.
40. FIG. 4 shows a circuit diagram of an embodiment of the sub word
driver. The memory array of this embodiment is a hierarchical word
line system comprising main word lines and sub word lines. Although
such a hierarchical word line system will be detailed later, the
sub word driver receives a main word line selection signal and a
sub word selection line FX to form a sub word line selection
signal. Specifically, the main word lines are connected to an input
terminal of an inverter circuit by a P-channel type MOSFET Q34 and
an N-channel type MOSFET Q35, and the operating voltage of the same
is supplied by the sub word selection lines FX. The sub word
selection lines FX are also supplied to the gate of a MOSFET Q36
for resetting the sub word lines.
41. In order to set a selection level of the sub word line at a
high voltage corresponding to the boosted voltage VPP, the
selection level of the sub word selection line FX is set at a high
voltage such as VPP. A non-selection level of the main word lines
is set at a high voltage such as VPP. Therefore, the operating
voltage of the main word driver MWD is set at VPP. A predecoder
that supplies the selection signal to the main word driver MWD
operates on the low voltage VDL as the operating voltage.
Accordingly, a level conversion circuit for converting the VDL
signal into the VPP signal is provided at an input portion of the
main word driver. The predecoder operating on the low voltage VDL
is constituted by a thin film MOS, and the main word driver MWD and
sub word driver operating on the high voltage VPP are constituted
by a thick film MOS.
42. The sub word driver operates as follows. When a main word line
is at a selection level which is a low level; the FX line connected
to the source of the P-channel type MOSFET Q34 is at a selection
level at VPP; and the FX line connected to the gate of the
N-channel type MOSFET Q36 is at a selection level of 0 V, the
P-channel type MOSFET Q34 turns on and the N-channel type MOSFETs
Q35 and Q36 are turned off to put a sub word line at a selection
level such as VPP.
43. When a main word line is at a non-selection level which is a
high level like VPP, the P-channel type MOSFET Q34 and N-channel
type MOSFET Q35 turn off and on, respectively. As a result, a sub
word line is put in the non-selection level even if the FX line
connected to the source is at the selection level at VPP and the FX
line connected to the gate of the N-channel type MOSFET Q36 is at
the selection level of 0 V. Even if the main word line is at the
selection level which is a low level and the P-channel type MOSFET
Q34 is on, the MOSFET Q36 is turned on to put the sub word line at
a non-selection level such as 0 v if the FX line connected to the
source is at the non-selection level of 0 V and the FX line
connected to the gate of the N-channel type MOSFET Q36 is at the
non-selection level of VPP.
44. FIG. 5 shows a timing chart for explaining an example of the
above-described row system selecting operation. A rise of a clock
signal RCLK toward the high level caused the shared switch control
signal SHR and equalize signal BLEQ to change to the low level. As
a result, the unselected bit line is disconnected from the sense
amplifier, and the equalize MOSFET and precharge MOSFET are turned
off.
45. In response to a fall of the signal RCLK, the word lines change
from the low level to the selection level which is the high level.
Such a word line selection operation turns on the MOSFETs of
selected memory cells to cause a very small readout signal
corresponding to the charge stored in the selected memory cells to
appear on one of the complementary bit lines. A sense amplifier
activation signal RSAN is formed after the word line selecting
operation and the acquisition of the very small readout signal as a
result of charge sharing between parasitic capacitance at the bit
line and the capacitors of the memory cells as described above. In
practice, in order to allow the sense amplifier to operate at a
high speed, the sense amplifier is temporarily operated at a high
voltage such as the power supply voltage VDD at the beginning of
its operation.
46. When the clock signal RCLK falls, the word line is switched
from the selection level to the non-selection level. After the word
line is switched to the non-selection level, the sense amplifier
activation signal RSAN is changed to a non-activated level which is
a low level and the shared switch control signal SHR and equalize
signal BLEQ are changed to the high level to perform half
precharging (equalizing operation) of the complementary bit
lines.
47. As described above, thick film MOSFETs are used for the delay
circuits DL1, DL2 and DL4 which operate at a high voltage to
provide timing for word line selection performed while monitoring
the off state of the shared switch control signal SHR and equalize
signal BLEQ, to provide sense amplifier timing for activating the
sense amplifier depending on the timing of word line selection and
to provide sense amplifier timing for non-activating the sense
amplifier performed while monitoring the off state of the word
line. This makes it possible to set timing on which process-related
variations are reflected and to eliminate the need for setting an
extra time margin. As a result, it is possible to reduce the time
spent after the input of an address until the acquisition of a
readout signal, in other words, to reduce memory access time.
48. FIG. 6 shows a sectional view of a device structure for
explaining an embodiment of a dynamic RAM according to the present
invention. This embodiment shows a typical device structure
comprising a memory cell portion, a thick film MOS and a thin film
MOS as described above as an example. A storage capacitor at the
memory cell utilizes a second polysilicon layer as a storage node
SNCT and is connected to an N+ diffusion layer which constitutes
the source and drain of one of MOSFETs for address selection. The
storage node SNCT constituted by the second polysilicon layer has a
crown-shaped structure on which a plate electrode PLT constituted
by a third polysilicon layer is formed with a thin gate insulation
film interposed therebetween. The gate of the address selection
MOSFET is integrally formed with a sub word line SWL and is
constituted by a first polysilicon layer FG and tungsten silicide
(WSi) formed thereon.
49. An N+ diffusion layer forming the source and drain of the other
MOSFET for address selection is connected to a bit line BL
constituted by a polysilicon layer and tungsten silicide (M1)
similar to that described above provided thereon. A main word line
MWL constituted by a second metal layer M2 and a sub word selection
line FXB (not shown) are formed above the memory cell, and a
Y-selection line YS and a sub word selection line FX constituted by
a third metal layer M3 are formed on the same. The gate insulation
films of the address selection MOSFETs are formed with a relatively
great thickness of about 8 nm. This makes it possible to provide a
withstand voltage sufficient for a selection level like the boosted
voltage VPP of the sub word line SWL to which the gates are
connected and to provide a relatively high threshold voltage
thereby maintaining information retention characteristics.
50. In the present embodiment, P-type well regions PWELL in which
the address selection MOSFETs are formed are electrically separated
by deeper N-type well regions DWELL and are supplied with a
negative back bias voltage VBB on the order of -1 V. The supply of
such a negative voltage VBB also increases the threshold voltage of
the address selection MOSFETs and prevents minority carriers
generated in the P-type well regions PWELL from reaching the N+
diffusion layer connected to the capacitor to increase information
retention time.
51. The N-channel type MOSFETs having a thick gate insulation film
that constitutes the sub word drivers SWD provided around the
memory cell portion, the input buffer operating on the power supply
voltage supplied by the external terminal and the like are formed
similarly to the address selection MOSFETs of the memory cell.
However, if the P-type well regions in which they are formed are
separated by the DWELL, the ground potential of the circuit is
supplied to them. While they are therefore formed with a gate
insulation film having the same thickness as those of the MOSFETs
that constitute the memory cells, they are formed to have a lower
threshold voltage. The N-channel type MOSFETs that constitute the
input buffer and the like formed apart from the memory array may be
formed on a P-type substrate.
52. A first metal layer M1 is formed to provide such peripheral
circuits. For example, the first metal layer M1 is used as wiring
for connecting the gates of an N-channel type MOSFET and a
P-channel type MOSFET having the same thick film structure which is
not shown to configure the above-described CMOS inverter circuit.
When the second metal layer M2 is used to connect the drains of the
MOSFETs forming the CMOS inverter circuit and the like to other
circuits, the connection is routed down to the first metal layer M1
as a dummy via through holes and is made to the drains through the
first wiring layer M1 and contacts.
53. N-channel type MOSFETs having a thin gate insulation films
operating on the low voltage VDL such as those for the predecoder
and sense amplifier are the same as the thick film MOSFETs
described above except that their gate insulation films are formed
to a thickness as small as 4 nm. Referring to the method of forming
two kinds of gate insulation films as described above, a thin gate
insulation film is first formed; the thin gate insulation film is
then removed using regions where thin film MOSs are to be formed as
a mask; and a thick gate insulation film is formed thereafter.
Alternatively, a gate insulation film may be formed on a thin gate
insulation film as described above in an overlapping relationship
to increase the thickness of the same. When a column selection
switch is constituted by such a thin film MOSFET and the
Y-selection line YS formed by the third metal layer M3 is connected
to the gate of the column selection switch MOSFET, the connection
is routed down to the metal layers M2 and M1 as a dummy as
described above via a through hole and is made to the gate of the
column switch MOSFET or to the source and drain thereof as
illustrated.
54. With a device structure as in the present embodiment, the
threshold voltage of a MOSFET operated on the low voltage VDL can
be made low because it is formed with a thin gate insulation film.
This makes it possible to maintain a desired operating speed
because the required current can be maintained even if the low
voltage VDL is reduced to a value on the order of 2 V or 1.8 V
which is in the vicinity of the lower limit of the operating
voltage of a CMOS circuit. At a burn-in test to be described later,
the withstand voltage of a thin gate insulation film as described
above can be maintained even though the low voltage VDL increases
with the power supply voltage VDD because the low voltage VDL is
about one-half of the power supply voltage VDD during the burn-in
test.
55. FIG. 7 illustrates a schematic layout of an embodiment of a
dynamic RAM according to the present invention. FIG. 7 is an
illustration which is simplified to clearly show the part of
circuit blocks forming the dynamic RAM related to the present
invention which are formed on a single semiconductor substrate such
as single crystal silicon using a well-known technique for
manufacturing semiconductor integrated circuits.
56. In the present embodiment, a memory array as a whole is divided
into eight parts, although the invention is not limited to such an
arrangement. Divided memory arrays are provided such that they are
viewed as four each upper and lower arrays and two each left and
right arrays in the longitudinal direction of a semiconductor chip.
Peripheral circuits (peripherals) including an address input
circuit, a data input/output circuit and an input/output interface
circuit comprising an array of bonding pads are provided in the
central region in the longitudinal direction of the chip. Main
amplifiers MA are provided in the middle of the memory arrays.
57. A predecoder circuit ROWPDC and a relief circuit ROWRED for the
X-system and a predecoder circuit COLPDC and a relief circuit
COLRED for the Y-system are provided in each of the eight memory
arrays in total which are divided such that they are viewed as four
each upper and lower arrays and two each left and right arrays in
the longitudinal direction of a semiconductor chip in lateral
middle positions as viewed in the longitudinal direction. Main word
driver regions MWD are formed along the middle portions of the
memory arrays such that each of them drives main word lines
provided to extend vertically in association with each memory
array.
58. In the memory arrays, Y-decoders YDC are provided on the chip
periphery opposite to the central portion of the chip, although the
invention is not limited thereto. In the present embodiment, the
main amplifiers MA provided in the middle and the Y-decoders YDC
provided on the periphery are arranged such that they sandwich the
eight respective divided memory arrays. The memory array is divided
into a plurality of sub arrays as described later. Such a sub array
is formed such that it is surrounded by a sense amplifier region
and a sub word driver region provided to sandwich the same. An
intersection between the sense amplifier region and the sub word
driver region is referred to as "cross area". Sense amplifiers
provided in the sense amplifier region are configured on a shared
sense basis, and are selectively connected to either of
complementary bit lines provided to the left and right of the sense
amplifiers except those provided on both ends of the memory cell
arrays.
59. The memory cell arrays divided into four sections in the
longitudinal direction of the semiconductor chip as described above
are arranged in pairs. The predecoder circuit ROWPDC and relief
circuit ROWRED for the X-system and the predecoder circuit COLPDC
and relief circuit COLRED for the y-system are provided in the
middle of two pairs of memory cell arrays. That is, memory cell
arrays are arranged above and under the predecoder circuit ROWPDC
and relief circuit ROWRED for the X-system and the predecoder
circuit COLPDC and relief circuit COLRED for the y-system. The main
word driver MWD forms a selection signal for a main word line
extending in the longitudinal direction of the chip through one of
the memory cell arrays. The main word driver MWD is also provided
with a driver for sub word selection which forms a selection signal
for a sub word selection line extending in parallel with the main
word line as will be described later.
60. Although not shown, one subarray is formed by 512 sub word
lines and 512 pairs of complementary bit lines (or data lines)
perpendicular thereto. Spare word lines and complementary bit lines
are provided to relieve defective word lines and defective bit
lines. In one memory array, since 16 subarrays are provided in the
direction in which the word lines are arranged, sub word lines of
about 8K are provided as a whole. Since eight subsrrays are
provided in the direction in which the bit lines are arranged, the
complementary bit lines of about 4K are provided as a whole. Since
eight of such memory arrays are provided in total, they provide a
storage capacity as large as 8.times.8K.times.4K=256 Mbits as a
whole. The length of the complementary bit lines is divided into
{fraction (1/16)} lengths corresponding to the 16 subarrays. The
sub word lines are divided into 1/8 lengths corresponding to the
eight subarrays.
61. A sub word driver (sub word line driving circuit) is provided
for each of the subarrays as divisions of one memory array as
described above. A sub word driver is divided into lengths each
corresponding to 1/8 of a main word line to form a selection signal
for a sub word line extending in parallel with it. In the present
embodiment, in order to reduce the number of the main word lines,
i.e., to increase the pitch of the main word lines, four sub word
lines are provided for one main word line in the direction of the
complementary bit lines, although the present invention is not
limited to such an arrangement. A sub word selection driver (not
shown) is provided at a main word driver MWD to select one of four
sub word lines assigned in the direction of the complementary bit
lines, which are divided into eight in the direction of the main
word lines. Such a sub word selection driver forms a selection
signal for selecting one of four sub word selection lines extending
in the direction in which the sub word drivers are arranged.
62. When the layout shown in FIG. 7 is employed, an input Y-address
is transmitted through an address buffer ADDBUP and through the
relief circuit and predecoder provided in the middle of the memory
array to a Y-decoder YDC provided on the periphery of the chip
where a Y-selection signal is formed. The complementary bit lines
of one subarray are selected according to the Y-selection signal
and are transmitted to the main amplifier MA opposite thereto in
the middle of the chip to be amplified and output through an output
circuit which is not shown.
63. It seems that this configuration consumes a long time in
routing a signal within the chip and outputting a readout signal.
However, since an address signal must be input to the relief
circuit as it is, the output time of the predecoder is determined
after the result of determination on whether it is a defective
address or not becomes available if the relief circuit is disposed
anywhere in the middle of the chip. That is, if the predecoder and
relief circuit are apart, any delay of the signal between them can
delay the actual Y-selection operation.
64. In the present embodiment, since a main amplifiers MA and a
Y-decoder YDC are provided on both sides of a memory array, the sum
of the transmission path of the signal for selecting the
complementary bit lines of a subarray and the signal transmission
path extending from the selected complementary bit lines through
the input/output lines and the input of the main amplifier MA
becomes a signal transmission path which extends only to traverse
the memory array regardless of the complementary bit line selected.
This makes it possible to halve the length transmission path from
that of the roundtrip path described above. This allows the memory
to be accessed at a higher speed.
65. FIG. 8 illustrates a schematic layout for explaining the
dynamic RAM according to the invention in more detail. FIG. 8 shows
a schematic layout of the memory chip as a whole and a layout of
one of the eight divided memory arrays. FIG. 8 illustrates the
embodiment in FIG. 1 from a different point of view. Specifically,
as in FIG. 1, the memory chip is divided into eight memory arrays
which are viewed as four each upper and lower arrays and two each
left and right arrays in the longitudinal direction (the direction
of the word lines), and a plurality of bonding pads and peripheral
circuits such as input/output circuits are provided in the central
region in the longitudinal direction.
66. Each of the eight memory arrays has a storage capacity of about
32 Mbits as described above and is divided into eight parts in the
direction of the word lines and into 16 parts in the direction of
the bit lines to provide subarrays one of which is shown in an
enlarged view. Sense amplifiers are provided on both sides of the
subarrays in the direction of the bit lines. Sub word drivers are
provided on both sides of the subarrays as viewed in the direction
of the word lines.
67. Each of the memory arrays includes 8192 word lines and 4096
pairs of complementary bit lines in total. As a result, a total
storage capacity of about 32 Mbits. Since the 8192 word lines are
divided and provided in 16 subarrays as described above, each
subarray has 512 word lines (sub word lines). Since the 4096 pairs
of complementary bit lines are divided and provided in eight
subarrays as described above, each subarray has 512 pairs of
complementary bit lines.
68. Main word drivers MWD are provided in association with the main
word lines of the memory arrays. An array control circuit and a
main word driver are provided on the left of the memory array shown
in FIG. 8. The array control circuit includes drivers for driving
first sub word selection lines. Main word lines are provided in the
memory array such that they extend through the eight divided
subarrays. The main word driver drives the main word lines. The
first sub word selection lines extend through the eight divided
subarrays like the main word lines. A Y-decoder and a Y-selection
line driver are provided at the bottom of the array (the periphery
of the chip).
69. FIG. 9 illustrates a schematic layout of an embodiment of
subarrays and peripheral circuits thereof in a dynamic RAM
according to the invention. FIG. 9 shows four subarrays SBARY
provided in the shaded position of the memory array shown in FIG. 8
as an example. In FIG. 9, the regions where the subarrays SBARY are
formed are shaded to allow sub word driver regions, sense amplifier
regions and cross areas provided around them to be clearly
distinguished.
70. A subarray SBARY 15 is formed by 512 sub word lines SWL and 512
pairs of complementary bit lines arranged in the horizontal
direction in which the word lines extend. Therefore, 512 sub word
drivers SWD 17 associated with the 512 sub word lines SWL are
provided such that they are divided into 256 lines on each of the
left and right sides of such a subarray. 512 sense amplifiers SA 16
associated with the 512 pairs of complementary bit lines BL are
based on the shared sense amplifier system described above and are
provided such that they are divided into 256 each above and under
such a subarray.
71. Although not shown, the subarray SBARY 15 includes auxiliary
word lines in addition to the 512 regular sub word lines SWL.
Therefore, the sub word drivers SWD 17 associated with the 512 sub
word lines SWL and the auxiliary sub word lines are provided on the
left and right sides of the subarray 15. The lower right subarray
15 comprises 512 pairs of complementary bit lines BL as described
above, and 256 sense amplifiers 16 are provided above and under the
same as described above. The 256 pairs of complementary bit lines
formed above and under the right subarray SBARY are commonly
connected to the sense amplifiers SA sandwiched therebetween
through a shared switch MOSFET. Although not shown again, auxiliary
bit lines are also provided and upper and lower sense amplifiers 16
are provided in association therewith.
72. Main word lines MWL extend as indicated by the one line
illustrated as an example. Column selection lines YS extend in the
vertical direction of FIG. 9 as indicated by the one line
illustrated as an example. Sub word lines SWL are provided in
parallel with the main word lines MWL, and complementary bit lines
(not shown) are provided in parallel with the column selection
lines YS. Eight sub word selection lines FX0B through FX7B extend
through the four pairs of (eight) subarrays like the main word
lines MWL. The group of four sub word selection lines FX0B through
FX3B and the group of four sub word selection lines FX4B through
FX7B extend on the upper and lower subarrays separately. The set of
sub word selection lines FX0B through FX7B are assigned to two
subarrays and are provided such that they extend on the subarrays
in order to reduce the chip size.
73. If the eight sub word selection lines FX0B through FX7B are
assigned to each subarray and are formed in wiring channels on the
sense amplifier area, as many as 16 subarrays are provided on each
of the upper and lower memory arrays to total at 32 like the memory
array shown in FIG. 4, which results in a need for wiring channels
in a quantity as large as 8.times.32=256. The present embodiment
makes it possible to provide the wiring without any special wiring
channel by allocating the eight sub word selection lines FX0B
through FX7B to two subarrays and arranging them such that they
pass through the sub arrays.
74. One main word line is provided for eight sub word lines on a
subarray, and sub word selection lines are required to select one
of the eight sub word lines. Since one main word line is formed for
every eight sub word lines formed in alignment with the pitch of
memory cells, main word lines are provided at a moderate pitch. It
is therefore relatively easy to form sub word selection lines
between main word lines utilizing the same wiring layer on which
the main word lines are provided.
75. Let us assume that the first sub word selection line FX0B
extends in parallel with the main word line MWL. Then, a second sub
word line FX0 is provided in the upper left cross area which
supplies a selection signal to the upper and lower sub word drivers
through a sub word selection line driving circuit FXD which
receives a selection signal from the first sub word selection line
FX0B. The first sub word selection line FX0B extends in parallel
with the main word lines MWL and sub word lines SWL, whereas the
second sub word selection line extends in parallel with the column
selection lines YS and complementary bit lines BL perpendicular
thereto. Unlike the eight first sub word selection lines FX0B
through FX7B, second sub word selection lines FX0 through FX7 are
divided into a group of even- numbered lines FX0, FX2, FX4 and FX6
and a group of odd-numbered lines FX1, FX3, FX5 and FX7 which are
respectively provided at the sub word drivers SWD on the left and
right sides of the subarray SBARY.
76. Two each sub word selection line driving circuits FXD as
described above are provided above and under one cross area as
indicated by the solid squares in FIG. 9. Specifically, the lower
sub word selection line driving circuits in the upper left cross
area described above are associated with the first sub word
selection line FX0B; the two sub word selection line driving
circuits FXD provided in the middle left cross area are associated
with the first sub word selection lines FX2B and FX4B; and the
upper sub word selection line driving circuits in the lower left
cross area are associated with the first sub word selection line
FX6B.
77. The lower sub word selection line driving circuits in the upper
center cross area 18 are associated with the first sub word
selection line FX1B; the two sub word selection line driving
circuits FXD provided in the middle center cross area are
associated with the first sub word selection lines FX3B and FX5B;
and the upper sub word selection line driving circuits in the lower
center cross area are associated with the first sub word selection
line FX7B. The lower sub word selection line driving circuits in
the upper right cross area are associated with the first sub word
selection line FX0B; the two sub word selection line driving
circuits FXD provided in the middle right cross area are associated
with the first sub word selection lines FX2B and FX4B; and the
upper sub word selection line driving circuits in the lower right
cross area are associated with the first sub word selection line
FX6B. Thus, a sub word driver provided at an end of a memory array
drives only a sub word line SWL located to the left of the same
because there is not sub array to the right of the same.
78. Since no special wiring channel is required for the
configuration of the present embodiment in which sub word selection
lines are provided in the intervals between main word lines on a
subarray, there will be no increase in the size of a memory chip
even if eight sub word selection lines are provided on one
subarray. However, the formation of sub word selection line driving
circuits FXD as described above requires an increase in a chip
area, which hinders improvement of the degree of integration.
Specifically, there is no marginal area on the cross areas because
peripheral circuits are formed thereon including switch circuits
IOSW provided in association with main input/output lines MIO and
sub input/output lines LIO, power MOSFETs for driving the sense
amplifiers, driving circuits for driving shared switch MOSFETs and
driving circuits for driving precharge MOSFETs as indicated by
dotted line in FIG. 9.
79. Referring to the sub word drivers, wiring is provided for the
second sub word selection lines FX0 through FX6 in parallel
therewith to transmit selection signals associated with the first
sub word selection lines FX0B through FX6B. Since the load applied
to the wiring is small as will be described later the wiring is
directly connected to the first sub word selection lines FX0B
through FX6B without any separate drivers FXD as for the second sub
word selection lines FX0 through FX6. The wiring layer used is the
same as that for the second sub word selection lines FX0 through
FX6.
80. In the cross areas provided in the direction A in which the
even-numbered second sub word selection lines among the lines FX0
through FX6 extend, there is provided N-channel type power MOSFETs
for supplying the low voltage VDL to the sense amplifiers as
indicated by the circled P's, N-channel type power MOSFETs for
supplying the power supply voltage VDD for overdriving to be
described later to the sense amplifiers as indicated by the circled
0's and N-channel type power MOSFETs for supplying the ground
potential VSS of the circuits to the sense amplifiers as indicated
by the circled N's.
81. In the cross areas provided in the direction B in which the
odd-numbered second sub word selection lines among the lines FX0
through FX6 extend, there is provided N-channel type driving
MOSFETs for turning off MOSFETs for precharging and equalizing the
bit lines as indicated by the circled B's and N-channel type power
MOSFETs for supplying the ground potential VSS of the circuits to
the sense amplifiers as indicated by the circled N's. The N-channel
type power MOSFETs supply the ground potential to the sources of
MOSFETs for amplifying N-channel type power MOSFETs that constitute
the sense amplifiers from both sides of the array of sense
amplifiers. That is, the ground potential is supplied to 128 or 130
sense amplifiers provided in the sense amplifier areas by both of
the N-channel type power MOSFETs provided in the cross areas
indicated by A and the N-channel type power MOSFETS provided in the
cross areas indicated by B.
82. As described above, a sub word line driving circuit SWD selects
the sub word lines of the subarrays on both sides thereof. In
response, the two sense amplifiers associated with the sub word
lines of the two selected subarrays are activated. This is
necessary because a rewriting operation is required in which the
sense amplifiers is activated to recover the initial state of the
charge at the storage capacitors which has been combined with the
charge on the bit lines when the sub word lines have been selected
to turn on the address selection MOSFETs. For this reason, the
power MOSFETs indicated by P, O and N are used to activate the
sense amplifiers on both sides thereof except those associated with
the subarrays located at the edge. The sub word line driving
circuit SWD provided on the right side of the subarrays at the edge
of a memory array selects only the sub word lines of such
subarrays, the power MOSFETs indicated by the P, O and N activate
only the sense amplifiers associated with those subarrays.
83. The sense amplifier is based on the shared sense system and
performs a rewrite operation in which shared switch MOSFETs
associated with the complementary bit lines of one of the subarrays
on both sides thereof whose sub word lines have been unselected are
turned off and disconnected to allow readout signals on the
complementary bit lines associated with the selected sub word lines
to be amplified and to return the storage capacitors of the memory
cells to the initial state of charge.
84. FIG. 10 illustrates a schematic layout of an embodiment of well
regions in which subarrays and peripheral circuits thereof in the
dynamic RAM according to the invention are formed. In FIG. 10,
eight subarrays are shown as examples which are enclosed by the
dotted line in the memory array in FIG. 8 and include the four
subarrays SBARY provided in the shaded position.
85. In FIG. 10, the white areas represent a P-type substrate
(PSUB). The P-type substrate PSUB is provided with the ground
potential VSS for the circuits. Two kinds of N-type well regions
NWELL (VDL) and NWELL (VDD or VDDCLP) are formed on the P-type
substrate PSUB as indicated by oblique lines. Specifically, a clamp
voltage VDDCLP or VDD formed utilizing the boosted voltage VPP is
supplied to N-type well regions where P-channel type amplifier
MOSFETs that constitute the sense amplifiers SA are formed and to
N-type well regions where the power switch MOSFETs provided in the
rows of cross areas indicated by A are formed.
86. In the row of cross areas indicated by B, N-type well regions
are formed where P-channel type MOSFETs that constitute the switch
circuits IOSW provided in association with the sub input/output
lines LIO and P-channel type MOSFETS for precharging and equalizing
provided at the main input/output lines are formed, and the low
voltage VDL is supplied thereto.
87. A deep N-type well region DWELL is formed to cover the entire
area where the subarrays and sub word line driving circuits SWD are
formed. The boosted voltage VPP corresponding to the selection
level of the word lines is supplied to this deep N-type well
region. In this deep N-type well region DWELL, N-type well regions
NWELL are formed in which P-channel type MOSFETs that constitute
the sub word line driving circuits SWD are formed, and the boosted
voltage VPP is applied thereto like the deep N-type well region
DWELL.
88. In the deep N-type well region DWELL, there is formed P-type
well regions PWELL for forming N-channel type address selection
MOSFETs that constitute the memory cells and N-channel type MOSFETs
of the sub word driving circuits SWD. The substrate back bias
voltage VBB which is a negative voltage is supplied to those P-type
well regions PWELL.
89. Referring to one of the eight divided arrays shown in FIG. 8,
16 units of subarrays as a whole arranged in the direction of the
bit lines are formed in the deep N-type well region DWELL where
eight subarrays arranged in the direction of the word lines form
one unit, although the present invention is not limited to such an
arrangement. The cross areas associated with the sub word drivers
provided on both ends of the main word lines extending on the
arrays correspond to the rows A and are alternately arranged with
the row B as described above. Therefore, common N-channel type well
regions NWELL (VDD or VDDCLP) are formed for forming the row A and
P-channel type MOSFETs of the two sense amplifiers provided on both
sides thereof except at the edge of the chip.
90. FIG. 11 shows a circuit diagram of a simplified embodiment of
processes from address input up to data output illustrated with
focus on the sense amplifier portion of a dynamic RAM according to
the present invention. FIG. 11 shows a circuit, as an example,
provided in the sense amplifier 16 sandwiched by the two subarrays
15 from above and below and the cross area 18, the rest is shown in
the form of a block diagram. The circuit blocks indicated by dotted
lines are designated by reference numbers which have appeared
above.
91. One dynamic memory cell is shown as an example which is
provided between a sub word line SWL and one of complementary bit
lines BL and BLB (the bit line BL) provided in the one subarray 15.
The dynamic memory cell is formed by an address selection MOSFET Qm
and a storage capacitor Cs. The gate, drain and source of the
address selection MOSFET Qm are connected to the sub word line SWL,
bit line BL and storage capacitor Cs, respectively. The other
electrode of the storage capacitor Cs is made common supplied with
the plate voltage VPLT. A negative back bias voltage VBB is applied
to the substrate (channel) of the MOSFET Qm. The back bias voltage
VBB is set at a value such as -1 V. The selection level of the sub
word line SWL is a high voltage VPP which is higher than the high
level of the bit line by a value corresponding to the threshold
voltage of address selection MOSFET Qm.
92. When the sense amplifier is adapted to operate on the low
voltage VDL, the high level supplied to the bit line after being
amplified by the sense amplifier is set at the level of the
internal voltage VDL. Therefore, the high voltage VPP associated
with the selection level of the word line is VDL+Vth+.alpha.. The
pair of complementary bit lines BL and BLB of the subarray provided
to the left of the sense amplifier are arranged in parallel with
each other as illustrated and are appropriately crossed as needed
for purposes such as balancing the capacities of the bit lines.
Such complementary bit lines BL and BLB are connected to
input/output nodes of a unit circuit of the sense amplifier by
shared switch MOSFETs Q1 and Q2.
93. The sense amplifier unit circuit is formed by N-channel type
amplifier MOSFETs Q5 and Q6 and P-channel type amplifier MOSFETs Q7
and Q8 which are latched by cross-connecting the gates and drains
thereof. The sources of the N-channel type amplifier MOSFETs Q5 and
Q6 are connected to a common source line CSN. The sources of the
P-channel type MOSFETs Q7 and Q8 are connected to a common source
line CSP. A power switch MOSFET is connected to each of the common
source lines CSN and CSP. An operating voltage in accordance with
the ground potential is supplied to the common source line CSN to
which the sources of the N-channel type amplifier MOSFETs Q5 and Q6
are connected by an N-channel type power switch MOSFET Q14 provided
in the cross area 18, although the present invention is not limited
to such an arrangement.
94. An N-channel type power MOSFET Q15 for overdriving and an
N-channel type power MOSFET Q16 for supplying the internal voltage
VDL provided in the cross area 18 are connected to the common
source line CSP to which the sources of the P-channel type
amplifier MOSFETs Q7 and Q8 are connected, although this is not
limiting the present invention. The power supply voltage VDD
supplied through the external terminal is used as a voltage for
overdriving, although this is not limiting the present invention.
Alternatively, in order to reduce the dependence of the sense
amplifier operating speed on the power supply voltage VDD, it is
possible to use a slightly reduced clamp voltage VDDCLP obtained
from the source of an N-channel type MOSFET which is applied with
the voltage VPP at the gate and supplied with the power supply
voltage VDD at the drain.
95. An activation signal SAP1 for the overdriving of the sense
amplifier supplied to the gate of the N-channel type power MOSFET
Q15 is a signal in the same phase as that of an activation signal
SAP2 supplied to the gate of the N-channel type MOSFET Q16, and the
signals SAP1 and SAP2 are put at a high level in a time sequence.
The high level of the signals SAP1 and SAP2 is a signal at the
level of the boosted voltage VPP, although this is not limiting the
present invention. Specifically, since the boosted voltage VPP is
about 3.8 V, the N-channel type MOSFET Q15 can be sufficiently
turned on. After the MOSFET Q15 is turned off, the MOSFET Q16 is
turned on, which allows a voltage in accordance with the internal
voltage VDL to be output from the source thereof.
96. In the sense amplifier driving circuit, the signals SAP1 and
SAP2 must be a high voltage in accordance with the level of the
voltage VPP and are therefore formed by performing level conversion
on timing signals at the level of the voltage VDL formed in the
timing circuit. Therefore, the MOSFETs Q15 and Q16 are constituted
by MOSFETs having a thick gate insulation film. Meanwhile, the
signal at the VDL level is supplied as it is as a timing signal SAN
supplied to the gate of the MOSFET Q14 at the ground potential, and
the MOSFET Q14 has a thin gate insulation film.
97. A precharge (equalize) circuit comprising an equalize MOSFET
Q11 for shorting the complementary bit lines and switch MOSFETs Q9
and Q10 for supplying a half precharge voltage VBLR to the
complementary bit lines is provided at an input/output node of the
sense amplifier unit circuit. A precharge signal PCB is commonly
supplied to the gates of the MOSFETs Q9 through Q11. The activation
of the driver circuit for forming the precharge signal PCB is
speeded up by providing inverter circuits in the cross areas,
although not shown. The MOSFETs Q9 through Q11 forming the
precharge circuit are switched at a high speed through the inverter
circuits distributed in the cross areas prior to the timing for
selecting word lines when memory access is started.
98. In addition to the circuits shown in FIG. 11, a half precharge
circuit for the common source lines CSP and CSN of the sense
amplifier, a half precharge circuit for the local input/output line
LIO, distributed driver circuits for shared selection signal lines
SHR and SHL and the like are provided as needed in the cross area
18.
99. The sense amplifier unit circuit is connected to similar
complementary bit lines BL and BLB of a subarray 15 in a lower part
of FIG. 11 through shared switch MOSFETs Q3 and Q4. Switch MOSFETs
Q12 and Q13 form a column switch circuit and are turned on when the
selection signal YS becomes the selection level (high level) to
connect the input/output node of the sense amplifier unit circuit
to local input/output lines LIO1, LIO1B, LIO2, LIO2B and the like.
For example, when the sub word line SWL of the upper subarray is
selected, the upper shared switch MOSFETs Q1 and Q2 of the sense
amplifier are turned on and the lower shared switch MOSFETs Q3 and
Q4 are turned off.
100. As a result, the input/output node of the sense amplifier is
connected to the upper complementary bit lines BL and BLB to
amplify very small signals on the memory cells connected to the
selected sub word line SWL and to transmit them to the local
input/output lines LIO1 and LIO1B through the column switch circuit
(Q12 and Q13). The local input/output lines LIO1 and LIO1B extend
along the row of sense amplifiers, i.e., in the horizontal
direction in FIG. 11. The local input/output lines LIO1 and LIO1B
are connected to main input/output lines MIO and MIOB to which an
input terminal of a main amplifier 61 is connected, through an I/O
switch circuit comprising N-channel type MOSFETs Q19 and Q20
provided in the cross area 18. The I/O switch circuit is controlled
for switching by a selection signal IOSW and is constituted by a
CMOS switch whose P-channel type MOSFET is parallel-connected to
each of the N-channel type MOSFETs Q19 and Q20 as will be described
later.
101. The column switch circuit connects two pairs of complementary
bit lines BL and BLB to two pairs of local input/output lines LIO1,
LIO1B and LIO2, LIO2B with a single selection signal YS, although
this is not limiting the present invention. Therefore, in a
subarray selected as a result of an operation of selecting one main
word line, four pairs of complementary bit lines are selected in
total by the two pairs of column switch circuits provided in
association with the pair of sense amplifiers on both sides of the
subarray. In a burst mode, the column selection signal YS is
switched to switch the local input/output lines LIO1 and LIO1B and
the complementary bit lines BL and BLB of the subarray
sequentially.
102. An address signal Ai is supplied to an address buffer 51. This
address buffer operates on a time-division bases to fetch an
X-address signal and a Y-address signal. The X-address signal is
supplied to a predecoder 52 to form a selection signal for a main
word line MWL through a main row decoder 11 and a main word driver
12. The address buffer 51 receives the address signal Ai which is
supplied through the external terminal and therefore operates on
the power supply voltage VDD supplied through the external
terminal; the predecoder 52 operates on the low voltage VDL; and
the main word driver 12 operates on the boosted voltage VPP. A
column decoder (driver) 53 receives the Y-address signal supplied
as a result of the operation of the address buffer 51 on a
time-division basis to form the selection signal YS.
103. A main amplifier 61 operates on the low voltage VDL and
provides output from an external terminal Dout through an output
buffer 62 operating on the power supply voltage VDD supplied
through the external terminal. A write signal input through an
external terminal Din is fetched through an input buffer 63 and is
supplied to the main input/output lines MIO and MIOB through a
write amplifier to be described later which is included in the main
amplifier 61 in FIG. 11. In an input portion of the output buffer,
there is provided a level shift circuit and a logic portion for
outputting an output signal thereof in synchronism with a timing
signal associated with the clock signal.
104. Although not limiting the invention, the power supply voltage
VDD supplied through the external terminal is 3.3 V; the low
voltage VDL supplied to internal circuits is set at 2.0 V; and the
selection signal (boosted voltage) for the word lines is 3.8 V. The
bit line precharge voltage VBLR is 1.0 V which corresponds to
VDL/2, and the plate voltage VPLT is also 1.0 V. The substrate
voltage VBB is -1.0 V.
105. FIG. 12 illustrates a schematic layout of another embodiment
of a dynamic RAM according to the present invention. In the present
embodiment, memory arrays as a whole are divided into four parts.
Divided memory arrays are provided such that they are viewed as two
each upper and lower arrays and two each left and right arrays in
the longitudinal direction of a semiconductor chip. As previously
described, there is provided circuits such as an address input
circuit, a data input/output circuit and an input/output interface
circuit (Peripheral) comprising an array of bonding pads in the
central region in the longitudinal direction of the chip. Main
amplifiers MA are provided in the middle of the memory arrays.
106. A predecoder circuit ROWPDC and a relief circuit ROWRED for
the X-system and a predecoder circuit COLPDC and a relief circuit
COLRED for the Y-system are provided in a group in the intermediate
portion of the horizontal direction with respect to the
longitudinal direction in each of the four memory arrays in total
which are divided such that they are viewed as two each upper and
lower arrays and two each left and right arrays in the longitudinal
direction of a semiconductor chip as described above. That is, two
sets of the predecoder circuit ROWPDC and relief circuit ROWRED for
the X-system and the predecoder circuit COLPDC and relief circuit
COLRED for the Y-system are provided respectively for the four
memory arrays which are provided as two each left and right
arrays.
107. Main word driver regions MWD are similarly formed along the
middle portions of the memory arrays such that each of them drives
main word lines provided to extend above and under each memory
array. In this configuration, when the same subarrays as described
above are used, the main word lines extend through 16 subarrays. In
the memory arrays, Y-decoders YDC are provided on the chip
periphery opposite to the central portion of the chip. In this
embodiment, again, each of the four divided memory arrays is
sandwiched by the main amplifier MA provided in the middle and the
Y-decoder YDC provided on the periphery.
108. FIG. 13 shows a circuit diagram of an embodiment of a
capacitor used in the present invention. In the present embodiment,
a MOSFET is used as a capacitive element by using the gate
electrode as one electrode, the gate insulation film as a
dielectric material and the commonly connected source and drain as
another electrode. In this case, a MOSFET having a thick gate
insulation film is used to provide smoothed capacitance or
phase-compensated capacitance by applying a high voltage like VPP
or VDD between the capacitor electrodes, whereas a MOSFET having a
thin gate insulation film is used to provide smoothed capacitance
or phase-compensated capacitance by applying only a low voltage
like VSL between the capacitor electrodes. This makes it possible
to prevent voltage breakdown of the gate insulation film used as a
dielectric material and to provide high capacitance with a small
area by reducing the thickness of the gate insulation film where
only a low voltage VDL is applied.
109. FIGS. 14A and 14B illustrate a configuration of an embodiment
of a voltage detection circuit provided in a substrate voltage
generation circuit. As shown in the circuit diagram in FIG. 14A, a
constant current source is provided at the drain of a MOSFET Q40
having a thin gate insulation film, and the ground potential of the
circuit is supplied to the gate. Series-connected MOSFETs Q37, Q38
and Q39 are provided between the source of the MOSFET Q40 and a
substrate voltage VBB, and the gate of each MOSFETs is connected to
the source of the MOSFET Q40. Each MOSFET is shorted by providing a
fuse between the drain and source thereof.
110. Among the MOSFETs Q37 through Q39, the MOSFETs Q37 and Q38
have a thick gate insulation film and the MOSFET Q39 has a thin
gate insulation film. As apparent from the characteristics diagram
in FIG. 14B showing the relationship between the gate length and
threshold voltage VTH, the threshold voltage VTH is set in three
ways, i.e., the gate length LG is made relatively large to use a
region where the variation of the threshold voltage VTH is small; a
small gate length LG=a is formed for the MOSFETs Q38 and Q39 is
made at a small value "a"; or a large gate length LG= c is formed
for the MOSFET Q37.
111. The fuses are selectively cut off to select a combination of
the MOSFETS Q37 through Q39 such that the drain voltage of the
MOSFET Q40 becomes equal to or lower than a logic threshold voltage
of an inverter circuit when the substrate voltage VBB becomes -1 V
in relation to the threshold voltage of the MOSFET Q40. The use of
such a detection voltage adjusting portion makes it possible to set
the substrate voltage VBB with process-related variation of the
MOSFETs compensated. Specifically, when a reduction in the drain
voltage of the MOSFET Q40 puts a signal output through the inverter
circuit at a high level, the operation of a charge pump circuit for
generating the substrate voltage VBB is stopped. When the absolute
value of the substrate voltage VBB is reduced by a leak current or
the like to reduce back bias, the drain voltage of the MOSFET Q40
increases to put the signal output through the inverter circuit at
a low level, which causes the operation of the charge pump circuit
for generating the substrate voltage VBB to be resumed. Such an
intermittent operation of the charge pump circuit makes it possible
to keep the substrate voltage VBB at a constant voltage such as -1
V.
112. According to the present invention, contradictory technical
objects, i.e., maintaining the information retention
characteristics of memory cells as described above and the
withstand voltage of MOSFETs during burn-in, reduction of an
internal voltage to reduce power consumption and maintaining an
operating speed, are achieved by configuring circuits utilizing two
kinds of gate insulation films adapted to respective operating
voltages, providing three threshold voltages through combinations
of the two kinds of MOSFET gate insulation film thickness and gate
lengths Lg, expanding the adjusting range of a voltage detection
circuit, i.e., expanding the range of compensation of
process-related variation of the substrate voltage and by allowing
accurate voltage setting.
113. FIG. 15 shows a block diagram of an embodiment of an internal
voltage generation circuit. The voltage generation circuit of the
present embodiment forms a boosted voltage VPP or a negative
voltage VBB using a charge pump circuit. The voltage generation
circuit comprises a detection circuit for comparing the voltage VPP
or VBB with a desired set voltage, a control circuit for forming a
control signal in response to a detection signal therefrom, an
oscillation circuit whose operation is controlled by the control
circuit, and a generation circuit constituted by a charge pump
circuit for generating the boosted voltage VPP or substrate voltage
VBB in response to an oscillation signal from the oscillation
circuit.
114. Among the above-described circuit blocks, the detection
circuit and generation circuit with oblique lines are constituted
by a thick film MOSFET, and the control circuit and oscillation
circuit operating on a low voltage VDL are constituted by a thin
film MOSFET. Although a thin film MOSFET is to be essentially used
for the detection circuit whose operating voltage is the low
voltage VDL, a thick film MOSFET is used instead in order to
provide a wide or accurate adjusting range as described above. A
thick film MOSFET is inevitably used for the detection circuit for
the voltage VPP.
115. FIGS. 16A and 16B show circuit diagrams of an embodiment of a
level shift circuit used in the present invention. Referring to
FIG. 16A, an input signal Din having a low amplitude associated
with the low voltage VDL is connected to the gate of an N-channel
type MOSFET Q44 and the source of an N-channel type MOSFET Q42. The
low voltage VDL is supplied to the gate of the MOSFET Q42.
P-channel type MOSFETs Q41 and Q43 whose gates and drains are
cross-connected to each other are provided between the drains of
the pair of MOSFETs Q42 and Q44 and the power supply voltage VDD
(or VPP).
116. This circuit operates as follows. When the input signal Din is
at a high level (VDL), the N-channel type MOSFET Q 42 is turned
off, and the N-channel type MOSFET Q44 is turned on. When the
MOSFET Q44 is turned on, an output signal Dout changes to a low
level to turn on the MOSFET Q41. When the MOSFET Q41 is turned on,
the MOSFET Q43 is turned off because the gate of the MOSFET Q43 is
at the voltage VDD (or VPP). When the input signal Din is at a low
level (0 V), the N-channel type MOSFET Q42 is turned on, and the
N-channel type MOSFET Q44 is turned off. When the MOSFET Q42 is
turned on, the low level of the input signal Din is transmitted to
the gate of the P-channel type MOSFET Q43 to turn on the same. When
the MOSFET Q4 is turned on, the MOSFET Q41 is turned off because
the voltage VDD (or VPP) is developed at the gate thereof, and the
output signal Dout is changed to a high level such as the voltage
VDD (or VPP).
117. Referring to FIG. 16B, an input signal D1 associated with the
low voltage VDL is connected to the gate of the N-channel type
MOSFET Q44 and the source of the N-channel type MOSFET Q42 as
described above. The low voltage VDL is supplied to the gate of the
MOSFET Q42. P-channel type MOSFETs Q41 and Q43 whose gates and
drains are cross-connected to each other are provided between the
drains of the pair of MOSFETs Q42 and Q44 and the power supply
voltage VDD (or VPP).
118. For example, in order to provide nor (NOR) logic, an N-channel
type MOSFET Q46 is provided in parallel with the N-channel type
MOSFET Q44 whose drain is connected to an output terminal Dout, and
a P-channel type MOSFET Q45 is provided in series with the
P-channel type MOSFET Q43 whose drain is connected to the output
terminal Dout. A timing signal D2 in accordance with the power
supply voltage VDD (or VPP) is supplied to the gates of the
N-channel type MOSFET Q46 and P-channel type MOSFET Q45. The
MOSFETs Q45 and Q43 may be connected in inverted positions.
119. This circuit operates as follows. When the low-amplitude
signal D1 is at a low level (0 V), the N-channel type MOSFET Q42
and the N-channel type MOSFET Q44 are on and off, respectively.
Therefore, when the timing signal D2 is at a high level, the
N-channel type MOSFET Q46 which is turned on by the high level of
the timing signal D2 puts the output terminal Dout at a low level
such as the ground potential VSS of the circuit regardless of a
latching operation of the P-channel type MOSFETs Q41 and Q43.
120. A transition of the timing signal D2 from the high level to
the low level turns the P-channel type MOSFET Q45 and the N-channel
type MOSFET Q46 on and off, respectively. Therefore, when the
signal D1 is at the low level, the N-channel type MOSFET Q42 is
turned on to supply the low level of the signal D1 to the gate of
the P-channel type MOSFET Q43, thereby turning on the same. As a
result, the output terminal Dout is changed from the low level to
the high level by the MOSFETs Q45 and Q43 which have been turned
on. When the signal D1 is at the high level, since the N-channel
type MOSFET Q42 and the N-channel type MOSFET Q44 are turned off
and on respectively, the output terminal Dout continues to output a
low level such as the ground potential VSS. Thus, the circuit shown
in FIG. 16B can carry out both of a logical operation on the
low-amplitude signal D1 and the high-amplitude signal D2 and a
level converting operation thereon.
121. FIGS. 17A and 17B show diagrams for voltage characteristics of
the internal voltage circuit. Each of the low voltage circuit and
boosting circuit forms a substantially constant voltage within an
allowable range of variation of the external voltage VDD.
Specifically, the voltages VPP and VDL are respectively stabilized
at 3.6 V and 2.0 V in the 3.3 V version. The voltages VPP and VDL
are respectively stabilized at 3.6 V and 2 V also in the 2.5 V
version, although this is not limiting the present invention. The
voltage VDL may be reduced further to a lower voltage such as 1.8
V.
122. In the 3.3 V version, a circuit for detecting the power supply
voltage VDD is provided; the operation of boosting the voltage VPP
is stopped at a power supply voltage equal to or higher than 4.2 V
to output the power supply voltage VDD as it is; the low voltage
VDL changes to follow up the voltage VDD to reduce the voltage VDD
to -2.3 V; and the voltage VPP is increased to 5.5 V in accordance
with the voltage VDD during a burn-in test in which the power
supply voltage VDD is set at 5.5 V. However, since the low voltage
VDL stays at a low value such as 3.2 V, no insulation breakdown
occurs even on a gate insulation film as thin as about 4 nm as
described above.
123. In the 2.5 V version, a circuit for detecting the power supply
voltage VDD is provided like the above; at a high power supply
voltage of 3.2 V or more, the voltage VPP causes the voltage VDD to
be output at +0.8 V; the low voltage VDL changes to follow up the
voltage VDD to reduce the voltage VDD to -0.8 V; and the voltage
VPP is increased to 4.8 V in accordance with the voltage VDD during
a burn-in test in which the power supply voltage VDD is set at 4.0
V. However, since the low voltage VDL again stays at a low value
such as 3.2 V, no insulation breakdown occurs even on a gate
insulation film as thin as about 4 nm as described above.
124. Actions and advantages achieved by the above-described
embodiments are as follows.
125. (1) In a semiconductor integrated circuit in which an internal
voltage generation circuit operating on a power supply voltage
supplied through an external terminal forms a low voltage and a
boosted voltage as needed to operate internal circuits, a first
internal circuit operating on the power supply voltage supplied
through the external terminal or the boosted voltage formed by the
internal voltage generation circuit is constituted by a first
MOSFET with a gate insulation film having a large thickness adapted
to the power supply voltage or boosted voltage, and a second
internal circuit operating on the low voltage is constituted by a
second MOSFET with a gate insulation film having a small thickness
adapted to the low voltage. As a result, an advantage is provided
in that a device can be made finer, faster and less power-consuming
without reducing reliability.
126. (2) The boosted voltage increases depending on a power supply
voltage when the power supply voltage is equal to or higher than a
predetermined voltage and comprises a power supply voltage and a
boosted voltage during a burn-in test which is set at a power
supply voltage equal to or higher than a predetermined voltage or
at a boosted voltage. The low voltage increases depending on a
power supply voltage when the power supply voltage is equal to or
higher than a predetermined voltage and comprises a low voltage
during a burn-in test which is set at the power supply voltage
equal to or higher than the predetermined voltage. This provides an
advantage in that a semiconductor integrated circuit device having
high reliability can be provided.
127. (3) MOSFETs having a thick gate insulation film are used for
an input circuit for receiving an input signal supplied through an
external terminal, an output circuit for transmitting an output
signal to the external terminal, the internal voltage generation
circuit and an internal circuit operating on a boosted voltage
formed by the internal voltage generation circuit. This is
advantageous in that the withstand voltage of a device in
environments including a burn-in test can be maintained while
achieving interface with the outside.
128. (4) A delay circuit in which a MOSFET having a thick gate
insulation film as described above plays a dominant roll is used
for forming a timing signal for the operation of an internal
circuit operating on the low voltage which is operated by a low
voltage in association with the operation timing signal for an
internal circuit operating on the power supply voltage or boosted
voltage. This makes it possible to set timing which accommodate
process-related variations of MOSFETs having a thick gate
insulation film, thereby allowing a time margin to be set at the
minimum. This results in an advantage in that a high speed can be
maintained using two MOSFETs having two kinds of gate insulation
films.
129. (5) A boosted voltage is used to operate a dynamic memory cell
comprising an address selection MOSFET constituting a dynamic RAM
and a storage capacitor and a word driver for forming a selection
signal for word lines to which such a dynamic memory cell is
connected, and a power supply voltage is used to operate an input
circuit for inputting control input signals including an address
signal and a clock signal provided as needed and inputting a write
input signal and an output circuit for outputting a readout signal
read out from the memory cell. This is advantageous in that an
input/output interface with external devices can be provided while
maintaining the information retention time of the memory cell.
130. (6) A negative back bias voltage is supplied to a
semiconductor region where the address selection MOSFET of the
memory cell is formed, and such a back bias voltage is formed by
the internal voltage generation circuit. This is advantageous in
that the threshold voltage of the address selection MOSFET can be
increased further and in that information retention characteristics
can be improved.
131. (7) An operation timing signal delayed by the delay circuit in
which a MOSFET having a thick gate insulation film plays a dominant
roll is used as the operation timing signal of the word driver.
This makes it possible to set the operation timing of a sense
amplifier in accordance with a readout signal read out on to bit
lines from a memory cell, thereby providing an advantage in that
high speed memory access can be achieved.
132. (8) The operation timing signal of the sense amplifier is
delayed by a delay signal from a delay circuit constituted by a
second MOSFET having a thin gate insulation film adapted to the
sense amplifier to set an operating time of an N-channel type
MOSFET for overdriving for supplying the power supply voltage to
the source of a P-channel type MOSFET that constitutes a sense
amplifier adapted to the power supply voltage or boosted voltage,
and a driving N-channel type MOSFET is driven to supply the low
voltage to the source of the P-channel type MOSFET that constitutes
the sense amplifier after such an operating time. This is
advantageous in that the overdriving can be carries out for a
period of time in accordance with the operation of the sense
amplifier.
133. (9) The delay circuit in which a MOSFET having a thick gate
insulation film plays a dominant roll comprises an inverter circuit
constituted by the MOSFET having a thick gate insulation film to
which an input signal to be delayed is supplied at an input
terminal, resistive means for transmitting an output signal from
the inverter circuit, a capacitor to which the signal is
transmitted through the resistive means and which is formed
utilizing the gate capacitance of the second MOSFET and one or two
inverter circuits which are constituted by the second MOSFET and to
which an output signal from a time constant circuit formed by the
resistor and capacitor is supplied at an input terminal thereof to
form the delay signal. This is advantageous in that a relatively
long delay time can be defined with a small number of elements and
low power consumption.
134. (10) An internal circuit operating on the power supply voltage
or the boosted voltage formed by the internal voltage generation
circuit includes a smoothing MOS capacitance and a capacitance for
phase compensation to which such a voltage is applied at the gate
thereof, and a second internal circuit operating on the low voltage
formed by the internal voltage generation circuit includes a
smoothing MOS capacitance and a capacitance for phase compensation
to which such a voltage is applied to the gate thereof. Selective
use of them provides an advantage in that the withstand voltage can
be maintained and in that a large capacitance can be achieved with
a small size.
135. (11) The internal voltage generation circuit includes a
substrate voltage generation circuit having a fourth N-channel type
MOSFET constituted by a MOSFET with a thin gate insulation film as
described above in which a constant current source is provided at
the drain thereof; the gate is connected to the ground potential of
the circuit; and a detection voltage adjusting portion is provided
between the source and a substrate voltage and having a voltage
detection circuit constituted by an inverter circuit for forming a
detection signal in response to an output from the drain of the
fourth MOSFET for setting the substrate voltage at a desired
voltage. The detection voltage adjusting portion is formed by
fifth, sixth and seventh N-channel type MOSFETs whose gates are
connected to the source of the fourth N-channel type MOSFET and
whose drain and source paths are series-connected and fuse means
for shorting the drains and sources of them. The fifth and sixth
N-channel type MOSFETs are formed with a thick gate insulation
film, and the seventh N-channel type MOSFET is formed with a thin
gate insulation film. The gate lengths of the MOSFETs are set to
provide different threshold voltages within a range of gate length
in which the variation of the threshold voltages is small taking
the relationship between the gate length and threshold voltage of
each MOSFET into consideration. The fuses are selectively cut off
to adjust the detection voltage. This makes it possible to provide
an advantage in that the range for compensation of process-related
variation of the MOSFETs can be expanded and in that the VBB
voltage can be set with high accuracy.
136. (12) There is provided a dynamic RAM comprising subarrays
having sub word lines whose length is divided in the direction in
which the main word lines extend, which are arranged in plurality
in the direction of the bit lines crossing the main word lines and
to which address selection terminals of a plurality of dynamic
memory cells are connected and having a plurality of complementary
bit lines which are provided perpendicular to the plurality of sub
word lines and to which input/output terminals of the dynamic
memory cells are connected, a plurality of sub word line driving
circuits for forming a selection signal for the sub word lines in
response to a selection signal for the main word lines and a
selection signal transmitted through the sub word selection lines,
and a main word line driving circuit for forming a selection signal
for the main word lines. There is an advantage in that a large
storage capacity and a high speed can be achieved.
137. (13) In the dynamic RAM, separate sub word line driving
circuits as described above are provided on both sides of the array
of a plurality of sub word lines associated with the subarrays;
separate sense amplifiers are provided on both sides of the array
of a plurality of complementary bit lines; and one of the subarrays
is formed such that it is surrounded by the row of a plurality of
sub word line driving circuits and the row of a plurality of sense
amplifiers. This is advantageous in that a large storage capacity
and a high speed can be achieved.
138. (14) The sense amplifiers are based on a shared sense system
and are provided in association with the bit lines of subarrays
adjacent thereto to select the sub word lines of the subarrays
adjacent to the sub word line driving circuit. This is advantageous
in that a large storage capacity and a high speed can be
achieved.
139. (15) The low voltage is set at a voltage which is
substantially equal to or lower than 2 V and which is higher than
the lower limit of the operating voltage of a CMOS circuit
constituted by a MOSFET having a thin gate insulation film. This
provides an advantage in that the operating speed can be maintained
with reduced power consumption.
140. (16) There is provided a low voltage circuit for receiving a
power supply voltage supplied by an external terminal and for
generating a low voltage obtained by decreasing the same, a first
internal circuit operating on a voltage higher than the low voltage
and a second internal circuit operating on the low voltage. The
first internal circuit is basically constituted by a first MOSFET
with a gate insulation film having a first thickness, and the
second internal circuit is basically constituted by a second MOSFET
with a gate insulation film having a second thickness which is
smaller than the first thickness. In the second internal circuit, a
delay circuit for forming a timing signal for the first internal
circuit is configured using the first MOSFET. This is advantageous
in that a time margin determined taking process-related variation
into consideration can be set at a minimum value.
141. Although the present invention made by the inventors has been
specifically described with reference to embodiments thereof, the
present invention is not limited to the above-described embodiments
and may obviously be modified within the range of the principle
thereof. For example, the configuration of the subarrays in a
dynamic RAM and the arrangement of a plurality of memory arrays
loaded on a semiconductor chip may be embodied in various modes
depending on the storage capacity thereof and the like. Various
modes of implementation are possible for the configuration of the
sub word driver. The area of the input/output interface may be a
synchronous or run bus type dynamic RAM in which read and write
operations are performed in accordance with a clock signal. The
dynamic RAM may be combined with a logic circuit such as a CMOS
circuit into a single semiconductor integrated circuit device. Any
circuit other than the memory cells and selection circuits therefor
may be operated by the boosted voltage.
142. The present invention may be widely applied to semiconductor
integrated circuit devices including internal circuits operating on
a power supply voltage supplied through an external terminal or a
voltage obtained by boosting the same and internal circuits
operating on a voltage obtained by reducing the power supply
voltage. In this case, the thickness of a gate insulation film may
be determined by a withstanding voltage which takes the voltage of
a burn-in test as described above into account and specific
requirements on the circuit depending on the operating voltage of
the same.
143. Advantages achieved by typical aspects of the invention
disclosed in this specification can be briefly described as
follows. In a semiconductor integrated circuit device in which an
internal voltage generation circuit operating on a power supply
voltage supplied through an external terminal forms a low voltage
and a boosted voltage as needed to operate internal circuits, a
first internal circuit operating on the power supply voltage
supplied through the external terminal or the boosted voltage
formed by the internal voltage generation circuit is constituted by
a first MOSFET with a gate insulation film having a large thickness
adapted to the power supply voltage or boosted voltage, and a
second internal circuit operating on the low voltage is constituted
by a second MOSFET with a gate insulation film having a small
thickness adapted to the low voltage. As a result, an advantage is
provided in that a device can be made finer, faster and less
power-consuming without reducing reliability.
144. When the second internal circuit is operated in association
with the operation of the first internal circuit, a timing signal
for the operation of the second internal circuit is formed by a
delay circuit in which the first MOSFET forming the first internal
circuit plays a dominant roll with the state of operation of the
first internal circuit monitored. This is advantageous in that a
time margin determined taking process-related variation into
consideration can be set at a minimum value.
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