U.S. patent application number 09/739240 was filed with the patent office on 2001-05-03 for semiconductor device with flexible redundancy system.
Invention is credited to Takase, Satoru.
Application Number | 20010000690 09/739240 |
Document ID | / |
Family ID | 14600038 |
Filed Date | 2001-05-03 |
United States Patent
Application |
20010000690 |
Kind Code |
A1 |
Takase, Satoru |
May 3, 2001 |
Semiconductor device with flexible redundancy system
Abstract
A memory cell array includes spare elements for saving a
defective cell. Fuse sets each contain a defective address and
mapping information indicative of the relationship between the fuse
sets and the spare elements. When the defective address matches an
input address, each fuse set outputs a signal for activating a
corresponding spare element. The number of the fuse sets within a
chip is smaller than the number of the spare elements.
Inventors: |
Takase, Satoru;
(Yokohama-shi, JP) |
Correspondence
Address: |
BANNER & WITCOFF
1001 G STREET N W
SUITE 1100
WASHINGTON
DC
20001
US
|
Family ID: |
14600038 |
Appl. No.: |
09/739240 |
Filed: |
December 19, 2000 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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09739240 |
Dec 19, 2000 |
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09296269 |
Apr 22, 1999 |
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6188618 |
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Current U.S.
Class: |
365/200 |
Current CPC
Class: |
G11C 29/808 20130101;
G11C 29/812 20130101 |
Class at
Publication: |
365/200 |
International
Class: |
G11C 007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 23, 1998 |
JP |
10-112967 |
Apr 15, 1999 |
JP |
11-108096 |
Claims
1. A semiconductor storage device comprising: a memory cell array
having memory cells arranged in columns and rows, the memory cell
array being divided into a plurality of sub cell arrays; redundancy
cell arrays each located adjacent to a corresponding one of the sub
cell arrays; row decoders for each selecting a corresponding one of
the rows of the memory cell array in accordance with an input
address; column decoders for each selecting a corresponding one of
the columns of the memory cell array in accordance with an input
address; a plurality of storage circuits for storing addresses
assigned to defective memory cells included in the memory cell
array, and also storing mapping information indicative of the
relationship between the storage circuits and the redundancy cell
arrays, the storage circuits outputting, when an address assigned
to one of the defective memory cells stored therein matches an
input address, a replacement control signal for the defective
memory cell on the basis of the result of matching, and the mapping
information; and spare decoders each to be activated by the
replacement control signal supplied from the storage circuits to
thereby select a corresponding one of the redundancy cell
arrays.
2. A device according to claim 1, wherein the sub cell arrays are
arranged in a number M of rows and a number N of columns, and the
number of the storage circuits is equal to or less than M X N.
3. A device according to claim 1, wherein each of the storage
circuits has a plurality of output terminals for outputting the
replacement control signal, the output terminals of each of the
storage circuits being connected to each other by a plurality of
replacement control signal lines, and constituting a wired OR
circuit.
4. A device according to claim 3, wherein each of the spare
decoders is connected to a corresponding one of the replacement
control signal lines, and each of the column decoders corresponding
to said each of the spare decoder is connected to said
corresponding one of the replacement control signal lines via an
inverter circuit.
5. A device according to claim 1, wherein the sub cell arrays are
arranged in a number M of rows and a number N of columns, each of
the redundancy cell arrays is located corresponding to each of the
sub cell arrays, and the storage circuits include mapping
information indicative of the relationship between the storage
circuits and the number M of rows of redundancy cell arrays, the
number of the storage circuits being N.
6. A device according to claim 5, wherein the number of the storage
circuits is M, each of the M storage circuits having a number N of
output terminals for selecting a corresponding one of the M rows of
redundancy cell arrays.
7. A device according to claim 1, wherein the storage circuits each
include: an address designating fuse circuit for storing an address
assigned to a defective memory cell; a mapping fuse circuit for
storing mapping information indicative of the relationship between
the storage circuits and the redundancy cell arrays; an address
match detecting circuit for detecting whether the address stored in
the address designating fuse circuit matches an input address; and
a decoder for decoding the output signal of the mapping fuse
circuit when the address match detecting circuit has output a
signal indicating that those addresses match each other, thereby
creating the replacement control signal.
8. A device according to claim 1, wherein the sub cell arrays are
arranged in a number M of rows and a number N of columns, and those
of the sub cell arrays which are arranged in each row constitute a
bank.
9. A device according to claim 8, wherein the storage circuits each
include: an address designating fuse circuit for storing an address
assigned to a defective memory cell; a mapping fuse circuit for
storing mapping information indicative of the relationship between
the storage circuits and the redundancy cell arrays; a bank address
designating fuse circuit for storing an address assigned to a
corresponding bank; an enable fuse circuit indicating whether or
not said each storage circuit should be used; a first address match
detecting circuit for detecting whether the address stored in the
address designating fuse circuit matches an input address; a second
address match detecting circuit for detecting whether the address
stored in the bank address designating fuse circuit matches an
input address; a first AND circuit for receiving a signal output
from the first address match detecting circuit and indicating that
the addresses match each other; a OR circuit for receiving the
output signal of the first AND circuit and the output signal of the
enable fuse circuit; a second AND circuit for receiving a signal
output from the second address match detecting circuit and
indicating that the addresses match each other, and for also
receiving the output signal of the OR circuit; and a decoder for
decoding the output signal of the mapping fuse circuit in response
to the output signal of the second AND circuit, thereby creating
the replacement control signal.
10. A device according to claim 1, wherein each of the redundancy
cell arrays is located adjacent to the sub cell arrays of a
corresponding row.
11. A device according to claim 1, wherein each of the redundancy
cell arrays is located adjacent to the sub cell arrays of a
corresponding column, and is commonly used between the sub cell
arrays of the corresponding column.
12. A device according to claim 1, wherein each of the redundancy
cell arrays is interposed between the sub cell arrays of a
corresponding row and a corresponding one of the row decoders.
13. A device according to claim 1, wherein each of the row decoders
is interposed between a corresponding one of the redundancy cell
arrays and a corresponding one of the sub cell arrays.
14. A device according to claim 1, wherein each of the redundancy
cell arrays is located in the middle of the sub cell array of a
corresponding row.
15. A device according to claim 1, wherein the redundancy cell
arrays are located adjacent to that one of the sub cell arrays
which is situated at an end of the memory cell array.
16. A device according to claim 1, wherein the memory cell array
has a first sub cell array of a large capacitance, and a second sub
cell array of a smaller capacitance than the first sub cell array,
the redundancy cell arrays being located adjacent to the first sub
cell array, and one of the redundancy cell arrays being located
adjacent to the second sub cell array.
17. A semiconductor storage device comprising: a memory cell array
having memory cells arranged in columns and rows, the memory cell
array being divided into a plurality of sub cell arrays; redundancy
cell arrays each located adjacent to a corresponding one of the sub
cell arrays; row decoders for each selecting a corresponding one of
the rows of the memory cell array in accordance with an input
address; column decoders for each selecting a corresponding one of
the columns of the memory cell array in accordance with an input
address; a plurality of storage circuits each including: a
plurality of first storage elements for storing addresses assigned
to defective memory cells included in the memory cell array; a
plurality of second storage elements for storing mapping
information which indicates the relationship between the redundancy
cell arrays and the storage circuits; a plurality of comparators
each for comparing the address of a corresponding one of the
defective memory cells stored in a corresponding one of the first
storage elements with an input address, and outputting, when the
stored address matches the input address, a signal indicating that
those addresses match each other; and a decoder for decoding the
mapping information stored in the second storage elements when each
of the comparators output the signal indicating that the addresses
match each other; and spare decoders each to be activated by the
output signal of the decoder to thereby select a corresponding one
of the redundancy cell arrays.
18. A device according to claim 17, wherein each of the storage
circuits has a plurality of output terminals for outputting the
output signal of the decoder, the output terminals of each of the
storage circuits being connected to each other by a plurality of
replacement control signal lines, and constituting a wired OR
circuit.
19. A device according to claim 18, wherein each of the spare
decoders is connected to a corresponding one of the replacement
control signal lines, and each of the column decoders corresponding
to said each of the spare decoder is connected to said
corresponding one of the replacement control signal lines via an
inverter circuit.
20. A device according to claim 17, wherein the memory cell array
has a first sub cell array of a large capacitance, and a second sub
cell array of a smaller capacitance than the first sub cell
array,.two or more of the redundancy cell arrays being located
adjacent to the first sub cell array, and one of the redundancy
cell arrays being located adjacent to the second sub cell
array.
21. A semiconductor storage device comprising: a memory cell array
having memory cells arranged in columns and rows; a plurality of
redundancy cell arrays provided in the memory cell array; and a
plurality of storage circuits each for storing an address assigned
to a defective memory cell included in the memory cell array, and
also storing mapping information indicative of the relationship
between the storage circuits and the redundancy cell arrays, the
storage circuits outputting, when an address assigned to one of the
defective memory cells stored therein matches an input address, a
replacement control signal for the defective memory cell on the
basis of the mapping information.
22. A device according to claim 21, wherein the number of the
storage circuits is smaller than the number of the redundancy cell
arrays.
23. A device according to claim 21, further comprising spare
decoders each to be activated by the replacement control signal
supplied from a corresponding one of the storage circuits, thereby
selecting a corresponding one of the redundancy cell arrays.
24. A device according to claim 21, wherein each of the storage
circuits has a plurality of output terminals for outputting the
replacement control signal, the output terminals of each of the
storage circuits being connected to each other by a plurality of
replacement control signal lines, and constituting a wired OR
circuit.
25. A device according to claim 24, wherein each of the spare
decoders is connected to a corresponding one of the replacement
control signal lines, and each of the column decoders corresponding
to said each of the spare decoder is connected to said
corresponding one of the replacement control signal lines via an
inverter circuit.
26. A device according to claim 21, wherein the storage circuits
each include: an address designating fuse circuit for storing an
address assigned to a defective memory cell; a mapping fuse circuit
for storing mapping information which indicates the relationship
between the redundancy cell arrays and the storage circuits; an
address match detecting circuit for detecting whether the address
stored in the address designating fuse circuit matches an input
address; and a decoder for decoding the output signal of the
mapping fuse circuit when the address match detecting circuit has
output a signal indicating that those addresses match each other,
thereby creating the replacement control signal.
Description
BACKGROUND OF THE INVENTION
1. This invention relates to a semiconductor device with a flexible
redundancy system for saving a defective memory cell.
2. Semiconductor devices have a redundancy system. To enhance the
yield of products, the redundancy system saves a defective memory
cell, if any, by replacing it with a redundancy cell. The
redundancy system that is most generally used at the present stage
performs such replacement in units of a cell array, more
specifically in units of a plurality of rows or columns (there is a
case where it is done in units of one row or column). If in this
system, a defective memory cell is found after a test, a cell array
including the defective cell is replaced with a redundancy cell
array (spare element) of the same size.
3. Address information on a cell array including the defective cell
is stored in a non-volatile storage element. A fuse is generally
used as the storage element at the present stage. Since the address
information is usually formed of several bits, a fuse set which
includes a plurality of fuses corresponding to the address
information is a unit of redundancy. Further, usually, one spare
element corresponds to one fuse set, and the same number of fuse
sets as the spare elements are employed in a chip. When using a
spare element, a fuse included in a fuse set corresponding thereto
is cut. Since this system is of a simple structure, it is widely
used now.
4. On the other hand, the redundancy system requires a spare
element and a fuse set in addition to a usual circuit, and hence
requires a large chip area. In light of the fact that the area of a
redundancy circuit and the number of defective cells which the
redundancy circuit can save have a trade-off relationship, various
types of redundancy systems are now proposed for enhancing the area
efficiency. For example, Kirihata et al. propose a flexible
redundancy system (see "Fault-Tolerant Designs for 256 Mb DRAM"
(IEEE JOURNAL of SOLID-STATE CIRCUITS, VOL. 31, NO. 4, April
1996)). Since in this system, a single spare element covers a wide
cell array area, even when defective cells exist in only a part of
a chip, they can be saved in a similar manner to a case where
defective cells are uniformly dispersed within a cell array.
Accordingly, the number of spare elements can be reduced, thereby
increasing the area efficiency of the redundancy circuit.
5. As described above, where the number of defective cells per one
chip is detected or can be estimated, to save them using a small
number of spare elements can increase the area efficiency and hence
be more effective. In particular, where a single spare element can
cover a wide cell array area, the above system is effective.
6. However, memory chips in which a memory cell array is divided
into portions have been developed. For example, there is a memory
chip provided with a plurality of banks which are simultaneously
activated. This type of memory chip cannot have a spare element for
saving a defective cell which is included in any other bank. The
larger the number of banks, the larger the number of divisions of a
memory cell array, and the narrower the cell array area that each
spare element can cover. Although this is mainly a problem of a row
spare element, a similar problem will occur at a column spare
element. Moreover, if in memory devices operable at high speed, the
distance between a memory cell and another replaced by a spare
element becomes longer than before the replacement, transmission
delay of a signal or data becomes greater, thereby degrading the
high speed operability. On the other hand, to maintain the high
speed operability, replacement must be performed between memory
cells located close to each other. This means that the column spare
element cannot cover a wide cell array area.
7. When the spare element can cover only a narrow range from the
limitations such as the number of banks, the high speed
operability, etc., a spare element must be provided in units of one
narrow cell array area to save even defective cells located at only
a part of a memory cell. This means that a great number of spare
elements, which significantly exceeds the average number of
defective cells, must be incorporated in one chip, thereby
degrading the area efficiency. Moreover, in the conventional system
in which one spare element corresponds to one fuse set, the number
of fuse sets inevitably increases with an increase in the number of
spare elements. Since, in general, fuses require a larger area than
spare elements, the system in which one spare element corresponds
to one fuse set results in a large decrease in the area efficiency
of the redundancy circuit.
BRIEF SUMMARY OF THE INVENTION
8. This invention has been developed to solve the above-described
problems, and has its object to provide a semiconductor device that
employs a redundancy circuit of a high saving efficiency and a high
area efficiency on a chip, in which the redundancy circuit requires
only a small number of non-volatile storage elements to save a
defective memory cell.
9. The object is realized by a device as below.
10. A semiconductor storage device comprising: a memory cell array
having memory cells arranged in columns and rows, the memory cell
array being divided into a plurality of sub cell arrays; redundancy
cell arrays each located adjacent to a corresponding one of the sub
cell arrays; row decoders for each selecting a corresponding one of
the rows of the memory cell array in accordance with an input
address; column decoders for each selecting a corresponding one of
the columns of the memory cell array in accordance with an input
address; a plurality of storage circuits for storing addresses
assigned to defective memory cells included in the memory cell
array, and also storing mapping information indicative of the
relationship between the storage circuits and the redundancy cell
arrays, the storage circuits outputting, when an address assigned
to one of the defective memory cells stored therein matches an
input address, a replacement control signal for the defective
memory cell on the basis of the result of matching, and the mapping
information; and spare decoders each to be activated by the
replacement control signal supplied from the storage circuits to
thereby select a corresponding one of the redundancy cell
arrays.
11. Furthermore, the object of the invention is realized by a
device as below.
12. A semiconductor storage device comprising: a memory cell array
having memory cells arranged in columns and rows, the memory cell
array being divided into a plurality of sub cell arrays; redundancy
cell arrays each located adjacent to a corresponding one of the sub
cell arrays; row decoders for each selecting a corresponding one of
the rows of the memory cell array in accordance with an input
address; column decoders for each selecting a corresponding one of
the columns of the memory cell array in accordance with an input
address; a plurality of storage circuits each including: a
plurality of first storage elements for storing addresses assigned
to defective memory cells included in the memory cell array; a
plurality of second storage elements for storing mapping
information which indicates the relationship between the redundancy
cell arrays and the storage circuits; a plurality of comparators
each for comparing the address of a corresponding one of the
defective memory cells stored in a corresponding one of the first
storage elements with an input address, and outputting, when the
stored address matches the input address, a signal indicating that
those addresses match each other; and a decoder for decoding the
mapping information stored in the second storage elements when each
of the comparators has output the signal indicating that the
addresses match each other; and spare decoders each to be activated
by the output signal of the decoder to thereby select a
corresponding one of the redundancy cell arrays.
13. In the invention, defective cell can be saved in a reliable
manner even when they are located at only one area of the memory
cell array, by virtue of the structure in which the redundancy cell
arrays and mapping information indicative of the relationship
between circuits for storing defective cells are stored in the
circuits. Moreover, in the invention, the area efficiency of the
redundancy circuit can be enhanced by reducing the number of
redundancy cell arrays necessary to save defective cells.
14. Additional objects and advantages of the invention will be set
forth in the description which follows, and in part will be obvious
from the description, or may be learned by practice of the
invention. The objects and advantages of the invention may be
realized and obtained by means of the instrumentalities and
combinations particularly pointed out hereinafter.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
15. The accompanying drawings, which are incorporated in and
constitute a part of the specification, illustrate presently
preferred embodiments of the invention, and together with the
general description given above and the detailed description of the
preferred embodiments given below, serve to explain the principles
of the invention.
16. FIG. 1 is a block diagram illustrating an essential part of a
DRAM according to the embodiment of the invention;
17. FIG. 2 is a block diagram illustrating a specific structure of
a sub cell array incorporated in FIG. 1;
18. FIG. 3 is a circuit diagram showing a sub cell array and its
peripheral circuit incorporated in FIG. 1;
19. FIG. 4 is a circuit diagram showing a fuse set incorporated in
FIG. 1;
20. FIG. 5 is a circuit diagram illustrating the structure of a
decoder incorporated in FIG. 4;
21. FIG. 6 is a block diagram illustrating a modification of the
fuse set;
22. FIG. 7 is a block diagram illustrating an arrangement of sub
cell arrays and spare elements;
23. FIG. 8 is a block diagram showing a modification of the
arrangement of the sub cell arrays and the spare elements;
24. FIG. 9 is a block diagram showing another modification of the
arrangement of the sub cell arrays and the spare elements;
25. FIG. 10 is a block diagram showing a further modification of
the arrangement of the sub cell arrays and the spare elements;
26. FIG. 11 is a block diagram showing yet another modification of
the arrangement of the sub cell arrays and the spare elements;
27. FIG. 12 is a block diagram showing another modification of the
arrangement of the sub cell arrays and the spare elements;
28. FIG. 13 is a block diagram showing a furthermore modification
of the arrangement of the sub cell arrays and the spare
elements;
29. FIG. 14 is a block diagram illustrating an example of a
conventional redundancy system; and
30. FIG. 15 is a block diagram illustrating another example of a
conventional redundancy system.
DETAILED DESCRIPTION OF THE INVENTION
31. The embodiment of the invention will be described with
reference to the accompanying drawings.
32. FIG. 1 shows an essential structure of a DRAM according to the
embodiment of the invention. A memory cell array 1 is divided into
sub cell arrays (SCA) 11 (m, n) arranged in a matrix of M (rows) X
N (columns). Specifically, the memory cell array 1 is divided into
128 sub cell arrays 11 (m, n) (m: 0-7, n: 0-15) which are obtained
by arranging 8 sub cell arrays in each row (M=8) and 16 sub cell
arrays in each column (N=16). The division unit of the sub cell
arrays 11 is determined on the basis of, for example, the number of
columns which can simultaneously transmit data to a data line, and
the number of rows (the number of word lines) which are connected
to a single sense amplifier array and included in continuous bit
lines. In this embodiment, the division unit is also a saving unit
in which defective memory cells are saved by a single spare element
(redundancy cell array). However, it is possible to save a
plurality of defective sub cell arrays using one spare element.
33. The 8 sub cell arrays 11 arranged in each row constitute a
single bank, and in total, 16 banks Bn (n: 0-15) are provided in
this embodiment. Further, 16 sub arrays arranged in each column
constitute a sub array column, and in the FIG. 1 case, 8 sub cell
array columns Cm (m: 0-7) are arranged. A row decoder circuit 3 for
decoding a row address RA supplied from the outside of the cell
array 1 is located at each row-directional end of the cell array 1,
while a column decoder circuit 2m for decoding a column address CA
supplied from the outside of the array 1 is located at each sub
cell array column Cm. The memory cells are selected using these row
decoder circuits 3 and the column decoder circuits 2m.
34. Each sub cell array 11 includes a plurality of word lines WL,
dummy word lines DWL, and a plurality of column selecting lines CSL
perpendicular to the word lines, as is shown in FIG. 2. Although
the capacitance of each sub cell array 11 is optional, in this
embodiment, 16 column selecting lines CSL are included in each sub
cell array 11. Further, as shown in FIG. 2, sense amplifier arrays
6 are arranged on the opposite sides of each sub cell array 11 for
reading data from bit lines selected by the column selecting lines
CSL. These sense amplifier arrays 6 are of a so-called shared sense
amplifier system which is commonly used by adjacent sub cell
arrays. However, they are not limited to the shared sense amplifier
system, but may have a structure in which a sense amplifier array
is provided for each sub cell array.
35. A spare element 12 (m, n) as a redundancy cell array is located
at a row-directional end of each sub cell array 11, and a spare
column selecting line SCSLm (m: 0-7) is located parallel to the
column selecting lines CSL for selecting the spare element 12.
36. FIG. 3 specifically illustrates the structure shown in FIG. 2.
In FIG. 3, the spare element 12 has a pair of redundancy bit lines
BL and bBL (hereinafter, "b" indicates an inverted signal).
However, the spare element is not limited to this structure, but
may have a plurality of pairs of redundancy bit lines. Memory cells
MC and dummy memory cells DMC similar to those of each sub cell
array 11 are connected to the redundancy bit lines BL and bBL which
constitute the spare element 12. These memory cells MC and dummy
cells DMC are respectively selected by the word lines WL and the
dummy word line DWL which extend from the sub cell array 11.
37. As is shown in FIG. 1, the column selecting lines CSL and the
spare column selecting lines SCSL extend through the 16 (=N) sub
cell arrays 11 and spare elements 12. The column decoder circuits
(CD) 2 for selecting the column selecting lines CSL are commonly
provided for the 16 (=N) sub cell arrays 11 arranged in each
column. A spare column decoder (SCD) 9m is located adjacent to each
column decoder circuit 2. The spare column decoders (SCD) 9m drive
the spare column selecting lines SCSL commonly connected to the 16
(=N) spare elements 12.
38. As is shown in FIG. 3, the pair of bit lines BL and bBL of the
sub cell arrays 11 and the spare elements 12 are connected to sense
amplifiers (SA) which constitute the sense amplifier arrays 6. A
column selecting switch circuit (SW) 7 is connected between a
corresponding sense amplifier 6 and a corresponding pair of data
lines DQ and bDQ. The column selecting switch circuits (SW) 7 are
connected to the column selecting lines CSL and spare column
selecting lines SCSL and selectively on/off controlled by signals
therefrom. When reading data, data transmitted through the bit
lines BL and bBL are amplified by the sense amplifier (SA), and
output to the data lines DQ and bDQ when the switch circuit 7 is
turned on.
39. As is shown in FIG. 1, this embodiment employs 16 (=N) fuse
sets 5n (n: 0-15) whose number is identical to the number of the
row-directional sub cell arrays 11 (i.e. the number of banks). Each
fuse set 5.sub.0-5.sub.15 stores an address assigned to a defective
memory cell (which will be referred to as a "defective address"),
and compares an address supplied from the outside. If the
comparison result indicates that they are identical to each other,
a corresponding spare element 12 outputs a signal for instructing
replacement of a corresponding defective column. This signal is
supplied to the spare column decoder of a corresponding sub cell
array, and an inverted signal of the signal is supplied to the
column decoder of the corresponding sub cell array. Further, each
fuse set 5.sub.0-5.sub.15 stores information (mapping information)
on the relationship between themselves and the 8 spare column
selecting lines SCSL.sub.0-SCSL.sub.7. Particulars will be
described later.
40. This embodiment employs the same number (M X N) of spare
elements 12 as the number (M X N) of sub cell arrays 11, and the
same number of fuse sets 5 as the number of the column-directional
sub cell arrays 11. However, the invention is not limited to this.
In other words, the present invention differs from the conventional
case in that the former uses mapping information indicative of the
relationship between the fuse sets and the spare elements. In the
conventional case, one fuse set is prepared for one spare element.
On the other hand, in this embodiment, each fuse set is made to
correspond to an optional spare element by the mapping information.
As a result, the number of required fuse sets can be set smaller
than the number of spare elements. Moreover, even where defective
cells uniformly disperse or locally gather, they can be saved. The
relationship between the number N.sub.fs of fuse sets and the
number of spare elements in the present invention is expressed
by
N.sub.fs.ltoreq.M.times.N
41. Each fuse set 5.sub.0-5.sub.15 has 8 output lines
8.sub.0-8.sub.7. When rewriting a defective column selecting line,
one of the output lines 8.sub.0-8.sub.7 is activated. The output
lines 8.sub.0-8.sub.7 of each fuse set 5.sub.0-5.sub.15 are
connected to 8 replacement control signal lines 4.sub.0-4.sub.7,
respectively, thereby constituting a wired OR circuit. When
replacing a defective cell, one of the 8 replacement control signal
lines 4.sub.0-4.sub.7 is set at high level in accordance with a
high level signal output from one of the fuse sets
5.sub.0-5.sub.15. When one of the replacement control signal lines
4.sub.0-4.sub.7 is at high level, one of the spare column selecting
lines SCSL is selected by one of the spare column decoders (SCD) to
which the high level signal is supplied. At the same time, those of
the column decoders (CD) to which the high level signal is supplied
via an inverter circuit 22 cause the column selecting lines CSL of
a corresponding sub cell array 11 to be non-selected. Thus, the 8
replacement control signal lines 4.sub.0-4.sub.7 control the 8
column decoder circuits 2.sub.0-2.sub.7 and the spare column
decoders 9.sub.0-9.sub.7 adjacent to the column decoder
circuits.
42. The operation of the replacement control signal lines 4 will be
described in more detail. The first replacement control signal line
4.sub.0 selectively activates the column decoder circuit 2.sub.0
and the spare column decoder 9.sub.0 adjacent thereto. To this end,
the input terminal of each column decoder (CD) included in the
column decoder circuit 2.sub.0 is connected to the replacement
control signal line 4.sub.0 via the inverter 22, while the input
terminal of the spare column decoder (SCD) 9.sub.0 is directly
connected to the replacement control signal line 4.sub.0.
Accordingly, when the replacement control signal line 4.sub.0 is at
high level, the spare column decoder 9.sub.0 is activated, whereas
the column decoder circuit 2.sub.0 is inactivated. As a result, the
spare column selecting line SCSL.sub.0 is selected in place of the
column selecting line CSL selected by the column decoder circuit
2.sub.0, thereby reading data from the spare elements 12 connected
to the line SCSL.sub.0.
43. Similarly, the second et seq. replacement control signal lines
4.sub.1, 4.sub.2, . . . selectively activate the column decoder
circuits 2.sub.1, 2.sub.2, . . . and the spare column decoders
9.sub.1, 9.sub.2, . . . adjacent thereto. When in this structure,
the spare column selecting line SCSL has been selected in an
optional sub cell array, the column selecting line SCL is
inactivated, thereby replacing a defective cell with a spare
cell.
44. FIG. 4 shows one of the fuse sets 5.sub.0-5.sub.15 of FIG. 1 in
detail. A-description will be given of the one fuse set since they
have the same structure. The fuse set 5 comprises an address
designating fuse circuit 501 for storing a defective address in the
memory cell array 1, an enable fuse circuit 502 for storing whether
or not the fuse set 5 is used, and a mapping fuse circuit 503 which
pre-stores the address of one of the 8 spare column selecting lines
SCSL corresponding to the fuse set 5.
45. The address designating fuse circuit 501 has 11 fuses FS. Seven
(1)-(7), for example, of the fuses FS are used to designate a
minimum unit of the column address. The remaining 4 fuses FS
(8)-(11) are used to select 16 spare elements 12 using a single
spare column selecting line SCSL. More specifically, the address
designating fuse circuit 501 includes address information for
designating a defective memory cell in a corresponding sub cell
array 11, and address information for selecting 16 banks Bn (n:
0-15). The mapping fuse circuit 503 has three fuses FS (13)-(15)
necessary to select the 8 spare column selecting lines SCSLm. In
other words, the mapping fuse circuit 503 stores address
information for selecting one of the 8 sub cell array columns Cm
(m: 0-7) arranged in the row direction.
46. Each fuse FS included in the fuse circuits 501-503 is connected
in series to a pre-charging PMOS transistor Qp and a selecting NMOS
transistor Qn between a power voltage Vcc and a ground potential
Vss. A connection node N between the PMOS transistor Qp and the
NMOS transistor Qn is an output node. After the PMOS transistor Qp
is turned on to pre-charge the output node N with the power voltage
Vcc, the PMOS transistor Qp is turned off and the NMOS transistor
Qn is turned on, thereby reading fuse data. If the fuse FS is cut
as indicated by the broken line, a high-level voltage (Vcc) is
output from the output node N, whereas if the fuse FS is not cut, a
low-level voltage (Vss) is output from the output node N.
47. A signal output from the fuse circuit 501 is supplied to an
address match detecting circuit 504 formed of a plurality of
comparators CMP, together with column addresses a0-a6 and addresses
b0-b3. The addresses b0-b3 are necessary to select 16 spare
elements 12 using a single spare column selecting line SCSL. The
address match detecting circuit 504 detects whether or not data
contained in the output signal of the fuse circuit 501 matches the
column addresses a0-a6 and addresses b0-b3. The output signals of
the address match detecting circuit 504 and the enable fuse circuit
502 are supplied to an AND gate 505. The output terminal of the AND
gate 505 outputs a Match signal 507 (i.e. an enable signal for
replacing a defective cell) indicating that an address supplied
from the outside matches fuse information.
48. The Match signal 507 is supplied to a decoder 506. The decoder
506 is connected to three output signal lines 508.sub.1, 508.sub.2
and 508.sub.3 of the mapping fuse circuit 503. When the Match
signal 507 has been activated, the decoder 506 decodes the output
signal of the mapping fuse circuit 503. As a result, one of the 8
output lines 8 of the decoder 506 is activated and serves as a
replacement control signal for activating one of the replacement
control signal lines 4.
49. The address designating fuse circuit 501 has 11 fuses, the
enable fuse circuit 502 has one fuse, and the mapping fuse circuit
has three fuses. This is, however, merely an example. The number of
fuses of the address designating fuse circuit 501 is increased or
decreased in accordance with the capacitance of the sub cell array
11 and the capacitance of the bank, while the number of fuses of
the mapping fuse circuit 503 is increased or decreased in
accordance with the number of sub cell array columns. The enable
fuse circuit 502 can have a plurality of fuses.
50. FIG. 5 shows an example of the decoder 506. The decoder 506 is
formed of 8 AND gates G1-G8 for receiving three signals output from
the fuse circuit 503, their inverted signals, and the Match signal
507. The replacement control signal is output from the AND gates
G1-G8.
51. In the above-described embodiment, one spare element 12 is
provided for each of the 128 sub cell arrays 11, and 16 fuse sets
are provided for the entire array 1 to enable saving of 16 sub cell
arrays 11. Furthermore, each fuse set 5 has the address designating
fuse circuit 501 for storing a defective address, and the mapping
fuse circuit 503 for storing mapping information indicating how to
make the 16 fuse sets 5 correspond to the 8 sub cell array columns
Cm. One of the 8 replacement control signal lines 4 is selected
from the mapping information so that each fuse set 5 will be
assigned to an optional sub cell array column Cm. Accordingly, even
when defective portions disperse in the memory cell array or gather
in a certain area thereof, the 16 fuse sets 15 can be used
effectively.
52. Specifically, suppose that the memory cell array 1 shown in
FIG. 1 has 16 defective cells along one column selecting line CSL
of the sub cell array column C.sub.0. In this case, all the 16 fuse
sets 5.sub.0-5.sub.15 store mapping information for activating the
replacement control signal line 40, and the 16 defective cells
along the one column selecting line can be saved by the 16 fuse
sets 5.sub.0-5.sub.15.
53. The advantage of the redundancy system of this embodiment will
be described in detail, referring to FIGS. 14 and 15 which show the
conventional redundancy systems. In FIGS. 14 and 15, elements
similar to those in FIG. 1 are denoted by corresponding reference
numerals.
54. In the conventional system shown in FIG. 14, a spare element 12
(m, n) is provided for each of 128 sub cell arrays 11 (m, n). This
structure is similar to the present invention. However, in the FIG.
14 case, a fuse set group 601 (601.sub.0-601.sub.7) is provided for
each spare column selecting line SCSL. Each fuse set group 601 has
16 fuse sets 602 (602.sub.0-602.sub.15) which correspond to 16
spare elements 12 arranged along the spare column selecting line
SCSL. For example, the fuse set 602.sub.0 corresponds to the spare
element 12 (1, 0), while the fuse set 602.sub.15 corresponds to the
spare element 12 (1, 15). Thus, one spare element 12 is made to
correspond to one fuse set 602. Supposing that the number of
addresses in this case is the same as in the embodiment, the number
of fuses is 1024 (={7 (for addresses)+1 (for
enable)}.times.16.times.8). This number is 4.3 times greater the
number of fuses used in the embodiment.
55. Since in the FIG. 14 conventional case, the 128 spare elements
12 can be replaced with defective cells, the degree of saving is
high as in the embodiment. However, where the average number of
defective cells which will occur in one chip is supposed to be
about 10, the number of fuse sets actually used is about 10. Thus,
a large number of fuse sets are not used to save defective cells.
The defective cell saving efficiency is very low for the area
occupied by the redundancy circuit on the chip.
56. In the other conventional case shown in FIG. 15, a single spare
element 12 is commonly provided for a plurality of sub cell arrays
11 arranged in each column. Fuse sets 701.sub.0-701.sub.7 are
provided for sub cell array columns C.sub.0-C.sub.7, respectively.
In this case, the number of fuses is as small as 64 (={7 (for
addresses) +1 (for enable)}.times.8). However, supposing that the
average number of defective cells which will occur in one chip is
about 10 as stated above, the 8 spare elements 12 is too few to
obtain a sufficient saving efficiency and a sufficient yield of
chips.
57. On the other hand, in the case of the embodiment of the present
invention, the number of spare elements 12 is 128 in the memory
cell array 1, while the number of fuses is 240 (={7 (for
addresses)+4 (for spare element selection)+1 (for enable)+3 (for
mapping)}.times.16). Thus, the number of fuses in the embodiment is
much smaller than in the FIG. 14 case. Moreover, rewriting of a
defective cell can be performed by selecting any one of the 128
spare elements. This means that the saving efficiency is high.
58. FIG. 6 shows a modification of the fuse set. When there are a
plurality of defective cells along a certain column selecting line
in the above-described embodiment, address information on each
defective cell is supplied to the mapping fuse circuit 503 so as to
program the circuit to deal with the defective cells using a
plurality of fuse sets. On the other hand, where all memory cells
along a single column selecting line are defective, they can be
saved by a single fuse set if the structure of the fuse set shown
in FIG. 4 is modified as shown in FIG. 6. In FIG. 6, a fuse circuit
511, an AND gate 513 and an OR gate 514 are added to the fuse set
shown in FIG. 4. The fuse circuit 511 is an enable fuse circuit
which has a single fuse and is adapted to indicate whether or not
the fuse set is being used. The AND gate 513 receives that one of
the output signals of the match detecting circuit 504, which
corresponds to a bank address designating circuit section 501b. The
output signals of the AND gate 513 and the fuse circuit 511 are
supplied to the OR gate 514, which in turn supplies its output to
the AND gate 505.
59. If all memory cells along a certain column selecting line are
defective in the above structure, the fuse of the fuse circuit 511
of a corresponding fuse set is cut. In the structure, it is not
necessary to program the bank address designating circuit 501b of
the address designating fuse circuit 501.
60. When in this structure, a defective column address is input,
the Match signal 507 is made high by the output signal of the fuse
circuit 511 irrespective of the bank address. In other words, when
all cells along a single column selecting line are defective, they
can be saved using a single fuse set. Accordingly, defective cells
can be saved depending on the circumstances such as the number of
them or their places.
61. Although one spare element 12 is provided for each sub cell
array 11 in the embodiment, the invention is not limited to this.
The arrangement or the number of spare elements 12 can be modified
in various manners as shown in FIGS. 7-12.
62. FIG. 7 shows an example in which one spare element 12 is
provided for a plurality of sub cell arrays 11 arranged in each
row. In this case, a single spare element 12 is used to save any
defective cell included in the sub cell arrays 11 arranged in each
row. The number of spare elements 12 is obtained by dividing the
number (M X N) of sub cell arrays 11 by N.
63. Since the FIG. 7 structure employs a small number of spare
elements, it is effective when the density of defective cells is
low. This structure can reduce the area of the redundancy system
without degrading its saving efficiency.
64. FIG. 8 shows an example in which one spare element 12 is
commonly provided for a plurality of sub cell arrays 11 arranged in
each column. In this case, defective cells included in sub cell
arrays 11 arranged along a certain column selecting line CSL can be
replaced with a spare element 12 at a time. Further, this structure
enables reduction of the number of fuses included in one fuse set,
the number of comparator circuits, and the number of AND gates,
thereby reducing the required chip area and enabling a high speed
operation.
65. FIG. 9 shows an example in which a spare element 12 is
interposed between each sub cell array 11 and a corresponding row
decoder 3. If in this structure, an input/output circuit is
provided in the vicinity of the row decoders, data can be
transferred at high speed between the input/output circuit and a
selected spare element.
66. FIG. 10 shows an example in which a row decoder is interposed
between each sub cell array 11 and a corresponding spare element
12. This structure can provide the same advantage as the FIG. 9
structure.
67. FIG. 11 shows an example in which a spare element 12 is
provided in a middle portion of sub cell arrays 11 arranged in each
row. This structure can also provide the same advantage as the FIG.
9 structure.
68. In FIGS. 9-11, each spare elements 12 can be provided for sub
cell arrays 11 arranged in a corresponding column, as in the FIG. 8
case.
69. FIG. 12 shows a case where the number of spare elements 12
differs between portions of the memory cell array 1. Specifically,
two spare elements 12 are provided for a certain sub cell array 11,
while one spare element 12 is provided for another sub cell array
11. In general, a defective portion is liable to occur in an area,
where the continuity of a pattern is interrupted, such as an end
portion of the chip or of the memory cell array. A plurality of
defective portions can be saved by arranging a plurality of spare
elements adjacent to a sub cell array located in an area, where the
continuity of a pattern is interrupted, such as an end of the chip
or of the memory cell array as shown in FIG. 12.
70. FIG. 13 shows a case where the number of spare elements differs
in accordance with the capacitance of a sub cell array. For
example, there is a memory device, such as a memory with a parity
bit or a DRAM conformable to a Rambus, in which a memory cell array
is divided into sub cell arrays of different capacitances. In such
a memory cell array, the density of defective cells differs in
accordance with the capacitance of each sub cell array. In a memory
cell array 11 shown in FIG. 13, a sub cell array 11a has a
capacitance of 160 K bits, while a sub cell array 11b has a
capacitance of 128 K bits. In this case, the degree of occurrence
of defective cells is higher in the sub cell array 11a than in the
sub cell array 11b. Accordingly, two spare elements are provided
for the sub cell array 11a, and one spare element is for the sub
cell array 11b.
71. Since in the above structure, plural spare elements are
provided only for a sub cell array in which defective cells of a
high density will occur, the number of required spare elements can
be minimized, thereby enhancing the saving efficiency of defective
cells.
72. The invention can be modified in various manners. For example,
although in the embodiment, a description has been given to a case
where a defective column selecting line, i.e. a defective bit line,
is replaced with a spare element, the invention is also applicable
to a case where a defective word line is replaced with a spare
element.
73. Furthermore, although the embodiment uses a fuse as a
non-volatile storage element that constitutes a defective address
storage circuit, any other non-volatile semiconductor storage
element such as a ROM, EPROM, EEPROM, etc. can be used.
74. In addition, the invention is applicable not only to a
semiconductor storage device as one unit, but also to a storage
device merged with a logic circuit, etc.
75. Additional advantages and modifications will readily occur to
those skilled in the art. Therefore, the invention in its broader
aspects is not limited to the specific details and representative
embodiments shown and described herein. Accordingly, various
modifications may be made without departing from the spirit or
scope of the general inventive concept as defined by the appended
claims and their equivalents.
* * * * *