Zohni; Wael

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zohni; Wael.The latest application filed is for "wire bond wires for interference shielding".

Company Profile

13.169.161

Zohni; Wael - Campbell CA
Zohni; Wael - San Jose CA
Zohni; Wael - Newark CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pressing of wire bond wire tips to provide bent-over tips Grant 10,806,036 - Co , et al. October 13, 2	2020-10-13
Bonding of laminates with electrical interconnects Grant 10,790,222 - Delacruz , et al. September 29, 2	2020-09-29
Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows Grant 10,692,842 - Crisp , et al.	2020-06-23
Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows Grant 10,643,977 - Crisp , et al.	2020-05-05
Wire Bond Wires For Interference Shielding App 20200118939 - Awujoola; Abiola ; et al.	2020-04-16
Stacked chip-on-board module with edge connector Grant 10,622,289 - Zohni , et al.	2020-04-14
Wire bond wires for interference shielding Grant 10,559,537 - Awujoola , et al. Feb	2020-02-11
Embedded wire bond wires Grant 10,490,528 - Prabhu , et al. Nov	2019-11-26
Bonding Of Laminates With Electrical Interconnects App 20190221510 - Delacruz; Javier A. ; et al.	2019-07-18
Dies-on-package devices and methods therefor Grant 10,354,976 - Tao , et al. July 16, 2	2019-07-16
Bonding of laminates with electrical interconnects Grant 10,283,445 - Delacruz , et al.	2019-05-07
Microelectronic assembly with redistribution structure formed on carrier Grant 10,211,160 - Haba , et al. Feb	2019-02-19
Microelectronic Package Including Microelectronic Elements Having Stub Minimization For Wirebond Assemblies Without Windows App 20190035769 - Crisp; Richard Dewitt ; et al.	2019-01-31
Wire Bond Wires For Interference Shielding App 20190027444 - Awujoola; Abiola ; et al.	2019-01-24
Microelectronic Package Having Stub Minimization Using Symmetrically-Positioned Duplicate Sets of Terminals for Wirebond Assemblies Without Windows App 20180331074 - Crisp; Richard Dewitt ; et al.	2018-11-15
Wire bond wires for interference shielding Grant 10,115,678 - Awujoola , et al. October 30, 2	2018-10-30
Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows Grant 10,090,280 - Crisp , et al. October 2, 2	2018-10-02
Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows Grant 10,032,752 - Crisp , et al. July 24, 2	2018-07-24
Microelectronic element with bond elements to encapsulation surface Grant 10,008,477 - Haba , et al. June 26, 2	2018-06-26
Package-on-package devices with same level WLP components and methods therefor Grant 9,991,233 - Tao , et al. June 5, 2	2018-06-05
Package on-package devices with upper RDL of WLPS and methods therefor Grant 9,991,235 - Tao , et al. June 5, 2	2018-06-05
Package on-package devices with multiple levels and methods therefor Grant 9,985,007 - Tao , et al. May 29, 2	2018-05-29
Pressing of Wire Bond Wire Tips to Provide Bent-Over Tips App 20180146557 - Co; Reynaldo ; et al.	2018-05-24
Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor Grant 9,972,609 - Tao , et al. May 15, 2	2018-05-15
Wafer-level packaged components and methods therefor Grant 9,972,573 - Tao , et al. May 15, 2	2018-05-15
Bonding of Laminates with Electrical Interconnects App 20180114747 - Delacruz; Javier A. ; et al.	2018-04-26
Wire bond support structure and microelectronic package including wire bonds therefrom Grant 9,947,641 - Co , et al. April 17, 2	2018-04-17
TFD I/O partition for high-speed, high-density applications Grant 9,928,883 - Sun , et al. March 27, 2	2018-03-27
Wire Bond Wires for Interference Shielding App 20180061774 - Awujoola; Abiola ; et al.	2018-03-01
Sintered conductive matrix material on wire bond Grant 9,905,502 - Zohni February 27, 2	2018-02-27
Off substrate kinking of bond wire Grant 9,893,033 - Haba , et al. February 13, 2	2018-02-13
Vertical Memory Module Enabled by Fan-Out Redistribution Layer App 20180040587 - Tao; Min ; et al.	2018-02-08
Pressing of wire bond wire tips to provide bent-over tips Grant 9,888,579 - Co , et al. February 6, 2	2018-02-06
Package-on-Package Devices with WLP Components with Dual RDLS for Surface Mount Dies and Methods Therefor App 20180026019 - Tao; Min ; et al.	2018-01-25
Wafer-Level Packaged Components and Methods Therefor App 20180025987 - Tao; Min ; et al.	2018-01-25
Dies-on-Package Devices and Methods Therefor App 20180026017 - Tao; Min ; et al.	2018-01-25
Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor App 20180026016 - Tao; Min ; et al.	2018-01-25
Flip-chip, Face-up And Face-down Centerbond Memory Wirebond Assemblies App 20180025967 - Haba; Belgacem ; et al.	2018-01-25
Package-on-Package Devices with Multiple Levels and Methods Therefor App 20180026018 - Tao; Min ; et al.	2018-01-25
Package-on-Package Devices with Same Level WLP Components and Methods Therefor App 20180026011 - Tao; Min ; et al.	2018-01-25
TFD I/O Partition for High-Speed, High-Density Applications App 20170323667 - Sun; Zhuowen ; et al.	2017-11-09
Wire bond wires for interference shielding Grant 9,812,402 - Awujoola , et al. November 7, 2	2017-11-07
Flip-chip, face-up and face-down centerbond memory wirebond assemblies Grant 9,806,017 - Haba , et al. October 31, 2	2017-10-31
Stacked Chip-on-board Module With Edge Connector App 20170263540 - Zohni; Wael ; et al.	2017-09-14
Ball bonding metal wire bond wires to metal pads Grant 9,761,554 - Subido , et al. September 12, 2	2017-09-12
Stub Minimization For Wirebond Assemblies Without Windows App 20170256519 - Crisp; Richard Dewitt ; et al.	2017-09-07
Bond via array for thermal conductivity Grant 9,735,084 - Katkar , et al. August 15, 2	2017-08-15
Stacked chip-on-board module with edge connector Grant 9,735,093 - Zohni , et al. August 15, 2	2017-08-15
Enhanced density assembly having microelectronic packages mounted at substantial angle to board Grant 9,728,524 - Tao , et al. August 8, 2	2017-08-08
Reconfigurable PoP Grant 9,728,495 - Haba , et al. August 8, 2	2017-08-08
TFD I/O partition for high-speed, high-density applications Grant 9,679,613 - Sun , et al. June 13, 2	2017-06-13
Stub minimization for assemblies without wirebonds to package substrate Grant 9,679,838 - Crisp , et al. June 13, 2	2017-06-13
Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other Grant 9,679,876 - Crisp , et al. June 13, 2	2017-06-13
Multiple die stacking for two or more die Grant 9,640,515 - Zohni , et al. May 2, 2	2017-05-02
Wire Bond Wires For Interference Shielding App 20170117231 - Awujoola; Abiola ; et al.	2017-04-27
Multi-die wirebond packages with elongated windows Grant 9,633,975 - Haba , et al. April 25, 2	2017-04-25
Microelectronic packages having cavities for receiving microelectronic elements Grant 9,633,968 - Mohammed , et al. April 25, 2	2017-04-25
Embedded wire bond wires App 20170103968 - PRABHU; Ashok S. ; et al.	2017-04-13
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20170084584 - Crisp; Richard Dewitt ; et al.	2017-03-23
Microelectronic Assembly With Redistribution Structure Formed On Carrier App 20170069575 - Haba; Belgacem ; et al.	2017-03-09
Flip chip assembly and process with sintering material on metal bumps App 20170062318 - ZOHNI; Wael	2017-03-02
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20170062389 - Crisp; Richard Dewitt ; et al.	2017-03-02
Microelectronic Element With Bond Elements To Encapsulation Surface App 20170025390 - Haba; Belgacem ; et al.	2017-01-26
Coupling of side surface contacts to a circuit platform Grant 9,530,749 - Co , et al. December 27, 2	2016-12-27
Stub minimization using duplicate sets of signal terminals Grant 9,530,458 - Crisp , et al. December 27, 2	2016-12-27
Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis Grant 9,515,053 - Crisp , et al. December 6, 2	2016-12-06
Memory module in a package Grant 9,508,629 - Haba , et al. November 29, 2	2016-11-29
Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis Grant 9,496,243 - Crisp , et al. November 15, 2	2016-11-15
Wire Bond Support Structure And Microelectronic Package Including Wire Bonds Therefrom App 20160329308 - Co; Reynaldo ; et al.	2016-11-10
Ball Bonding Metal Wire Bond Wires To Metal Pads App 20160329294 - SUBIDO; Willmar ; et al.	2016-11-10
Wire bond wires for interference shielding Grant 9,490,222 - Awujoola , et al. November 8, 2	2016-11-08
Coupling Of Side Surface Contacts To A Circuit Platform App 20160322325 - CO; Reynaldo ; et al.	2016-11-03
Enhanced stacked microelectronic assemblies with central contacts Grant 9,461,015 - Haba , et al. October 4, 2	2016-10-04
Single package dual channel memory with co-support Grant 9,460,758 - Crisp , et al. October 4, 2	2016-10-04
Stub Minimization For Wirebond Assemblies Without Windows App 20160276316 - Crisp; Richard Dewitt ; et al.	2016-09-22
Stub Minimization For Assemblies Without Wirebonds To Package Substrate App 20160268187 - Crisp; Richard Dewitt ; et al.	2016-09-15
Flip chip assembly and process with sintering material on metal bumps Grant 9,443,822 - Zohni September 13, 2	2016-09-13
Microelectronic Package With Consolidated Chip Structures App 20160260671 - Haba; Belgacem ; et al.	2016-09-08
Pressing Of Wire Bond Wire Tips To Provide Bent-over Tips App 20160262268 - CO; Reynaldo ; et al.	2016-09-08
Multiple die face-down stacking for two or more die Grant 9,437,579 - Haba , et al. September 6, 2	2016-09-06
Stub minimization for multi-die wirebond assemblies with parallel windows Grant 9,423,824 - Crisp , et al. August 23, 2	2016-08-23
Multi-die Wirebond Packages With Elongated Windows App 20160233193 - Haba; Belgacem ; et al.	2016-08-11
Wire bond support structure and microelectronic package including wire bonds therefrom Grant 9,412,714 - Co , et al. August 9, 2	2016-08-09
Multiple Die Stacking For Two Or More Die App 20160225746 - Zohni; Wael ; et al.	2016-08-04
Off Substrate Kinking Of Bond Wire App 20160225739 - Haba; Belgacem ; et al.	2016-08-04
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20160197058 - Crisp; Richard Dewitt ; et al.	2016-07-07
Stacked Chip-on-board Module With Edge Connector App 20160190048 - Zohni; Wael ; et al.	2016-06-30
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20160190100 - Crisp; Richard Dewitt ; et al.	2016-06-30
Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows Grant 9,377,824 - Crisp , et al. June 28, 2	2016-06-28
Stub minimization for assemblies without wirebonds to package substrate Grant 9,373,565 - Crisp , et al. June 21, 2	2016-06-21
Memory Module In A Package App 20160172332 - Haba; Belgacem ; et al.	2016-06-16
Bond Via Array for Thermal Conductivity App 20160172268 - KATKAR; Rajesh ; et al.	2016-06-16
Microelectronic package and method of manufacture thereof Grant 9,368,478 - Zohni , et al. June 14, 2	2016-06-14
Co-support circuit panel and microelectronic packages Grant 9,368,477 - Crisp , et al. June 14, 2	2016-06-14
Microelectronic package with consolidated chip structures Grant 9,355,996 - Haba , et al. May 31, 2	2016-05-31
Multi-die wirebond packages with elongated windows Grant 9,318,467 - Haba , et al. April 19, 2	2016-04-19
Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics Grant 9,312,239 - Haba , et al. April 12, 2	2016-04-12
Multiple die stacking for two or more die Grant 9,312,244 - Zohni , et al. April 12, 2	2016-04-12
Stub Minimization Using Duplicate Sets Of Signal Terminals App 20160093339 - Crisp; Richard Dewitt ; et al.	2016-03-31
Co-support for XFD packaging Grant 9,293,444 - Crisp , et al. March 22, 2	2016-03-22
Memory module in a package Grant 9,287,216 - Haba , et al. March 15, 2	2016-03-15
Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows Grant 9,287,195 - Crisp , et al. March 15, 2	2016-03-15
Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate Grant 9,281,271 - Crisp , et al. March 8, 2	2016-03-08
Stacked chip-on-board module with edge connector Grant 9,281,266 - Zohni , et al. March 8, 2	2016-03-08
Embedded heat spreader for package with multiple microelectronic elements and face-down connection Grant 9,281,295 - Zohni March 8, 2	2016-03-08
RECONFIGURABLE PoP App 20160035656 - Haba; Belgacem ; et al.	2016-02-04
In-package fly-by signaling Grant 9,241,420 - Crisp , et al. January 19, 2	2016-01-19
Stub minimization using duplicate sets of signal terminals Grant 9,224,431 - Crisp , et al. December 29, 2	2015-12-29
Microelectronic Package With Consolidated Chip Structures App 20150371968 - Haba; Belgacem ; et al.	2015-12-24
Microelectronic unit and package with positional reversal Grant 9,219,050 - Crisp , et al. December 22, 2	2015-12-22
Co-support For Xfd Packaging App 20150364450 - Crisp; Richard Dewitt ; et al.	2015-12-17
Stub minimization with terminal grids offset from center of package Grant 9,214,455 - Crisp , et al. December 15, 2	2015-12-15
Flip Chip Assembly And Process With Sintering Material On Metal Bumps App 20150357304 - Zohni; Wael	2015-12-10
Wire Bond Support Structure And Microelectronic Package Including Wire Bonds Therefrom App 20150348928 - Co; Reynaldo ; et al.	2015-12-03
Microelectronic Packages Having Cavities For Receiving Microelectronic Elements App 20150340336 - Mohammed; Ilyas ; et al.	2015-11-26
Single Package Dual Channel Memory With Co-support App 20150302901 - Crisp; Richard Dewitt ; et al.	2015-10-22
Impedence controlled packages with metal sheet or 2-layer RDL Grant 9,136,197 - Haba , et al. September 15, 2	2015-09-15
Co-support for XFD packaging Grant 9,123,555 - Crisp , et al. September 1, 2	2015-09-01
Lead structures with vertical offsets Grant 9,123,713 - Crisp , et al. September 1, 2	2015-09-01
Microelectronic package with consolidated chip structures Grant 9,123,600 - Haba , et al. September 1, 2	2015-09-01
Multiple Die In A Face Down Package App 20150243631 - Haba; Belgacem ; et al.	2015-08-27
Flip chip assembly and process with sintering material on metal bumps Grant 9,117,811 - Zohni August 25, 2	2015-08-25
Microelectronic packages having cavities for receiving microelectronic elements Grant 9,105,612 - Mohammed , et al. August 11, 2	2015-08-11
Multiple Die Face-down Stacking For Two Or More Die App 20150221617 - Haba; Belgacem ; et al.	2015-08-06
Microelectronic Unit And Package With Positional Reversal App 20150214178 - Crisp; Richard Dewitt ; et al.	2015-07-30
Flip-chip, face-up and face-down wirebond combination package Grant 9,093,291 - Haba , et al. July 28, 2	2015-07-28
Off substrate kinking of bond wire Grant 9,087,815 - Haba , et al. July 21, 2	2015-07-21
Stub minimization for multi-die wirebond assemblies with parallel windows App 20150198971 - Crisp; Richard Dewitt ; et al.	2015-07-16
Severing bond wire by kinking and twisting Grant 9,082,753 - Haba , et al. July 14, 2	2015-07-14
Single package dual channel memory with co-support Grant 9,070,423 - Crisp , et al. June 30, 2	2015-06-30
Stub Minimization With Terminal Grids Offset From Center Of Package App 20150179619 - Crisp; Richard Dewitt ; et al.	2015-06-25
Multiple Die Stacking For Two Or More Die App 20150155269 - Zohni; Wael ; et al.	2015-06-04
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Thermal Characteristics App 20150145117 - Haba; Belgacem ; et al.	2015-05-28
Off Substrate Kinking Of Bond Wire App 20150129646 - Haba; Belgacem ; et al.	2015-05-14
Severing Bond Wire By Kinking And Twisting App 20150129647 - Haba; Belgacem ; et al.	2015-05-14
Microelectronic Package And Method Of Manufacture Thereof App 20150123293 - Zohni; Wael ; et al.	2015-05-07
Co-support For Xfd Packaging App 20150115472 - Crisp; Richard Dewitt ; et al.	2015-04-30
Embedded Heat Spreader For Package With Multiple Microelectronic Elements And Face-down Connection App 20150115434 - Zohni; Wael	2015-04-30
Flip-chip, Face-up And Face-down Centerbond Memory Wirebond Assemblies App 20150115477 - Haba; Belgacem ; et al.	2015-04-30
Multiple die face-down stacking for two or more die Grant 9,013,033 - Haba , et al. April 21, 2	2015-04-21
Multiple die in a face down package Grant 9,000,583 - Haba , et al. April 7, 2	2015-04-07
Multi-die Wirebond Packages With Elongated Windows App 20150091194 - Haba; Belgacem ; et al.	2015-04-02
Microelectronic unit and package with positional reversal Grant 8,994,170 - Crisp , et al. March 31, 2	2015-03-31
Microelectronic Element With Bond Elements To Encapsulation Surface App 20150076714 - Haba; Belgacem ; et al.	2015-03-19
Stub minimization for multi-die wirebond assemblies with parallel windows Grant 8,981,547 - Crisp , et al. March 17, 2	2015-03-17
Impedance controlled packages with metal sheet or 2-layer rdl Grant 8,981,579 - Haba , et al. March 17, 2	2015-03-17
Embedded heat spreader for package with multiple microelectronic elements and face-down connection Grant 8,970,028 - Zohni March 3, 2	2015-03-03
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Ground Or Power Distribution App 20150043181 - Haba; Belgacem ; et al.	2015-02-12
Multiple die stacking for two or more die Grant 8,952,516 - Zohni , et al. February 10, 2	2015-02-10
Microelectronic package and method of manufacture thereof Grant 8,946,901 - Zohni , et al. February 3, 2	2015-02-03
Manufacture of face-down microelectronic packages Grant 8,945,987 - Crisp , et al. February 3, 2	2015-02-03
Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics Grant 8,941,999 - Haba , et al. January 27, 2	2015-01-27
Flip-chip, face-up and face-down centerbond memory wirebond assemblies Grant 8,928,153 - Haba , et al. January 6, 2	2015-01-06
Stub minimization with terminal grids offset from center of package Grant 8,917,532 - Crisp , et al. December 23, 2	2014-12-23
Memory Module In A Package App 20140367866 - Haba; Belgacem ; et al.	2014-12-18
Single Package Dual Channel Memory With Co-support App 20140362629 - Crisp; Richard Dewitt ; et al.	2014-12-11
Multi-die wirebond packages with elongated windows Grant 8,907,500 - Haba , et al. December 9, 2	2014-12-09
Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution Grant 8,885,356 - Haba , et al. November 11, 2	2014-11-11
Stub Minimization For Wirebond Assemblies Without Windows App 20140328015 - Crisp; Richard Dewitt ; et al.	2014-11-06
Stub Minimization For Multi-die Wirebond Assemblies With Parallel Windows App 20140328016 - Crisp; Richard Dewitt ; et al.	2014-11-06
Through interposer wire bond using low CTE interposer with coarse slot apertures Grant 8,872,318 - McElrea , et al. October 28, 2	2014-10-28
Impedance Controlled Packages With Metal Sheet Or 2-layer Rdl App 20140291871 - Haba; Belgacem ; et al.	2014-10-02
Co-support component and microelectronic assembly Grant 8,848,391 - Crisp , et al. September 30, 2	2014-09-30
Co-support module and microelectronic assembly Grant 8,848,392 - Crisp , et al. September 30, 2	2014-09-30
In-package Fly-by Signaling App 20140268537 - Crisp; Richard Dewitt ; et al.	2014-09-18
Manufacture Of Face-down Microelectronic Packages App 20140273346 - Crisp; Richard Dewitt ; et al.	2014-09-18
Memory module in a package Grant 8,823,165 - Haba , et al. September 2, 2	2014-09-02
Microelectronic Package With Consolidated Chip Structures App 20140239514 - Haba; Belgacem ; et al.	2014-08-28
Microelectronic Unit And Package With Positional Reversal App 20140239491 - Crisp; Richard Dewitt ; et al.	2014-08-28
Enhanced Stacked Microelectronic Assemblies With Central Contacts App 20140239513 - Haba; Belgacem ; et al.	2014-08-28
Multi-die Wirebond Packages With Elongated Windows App 20140217617 - Haba; Belgacem ; et al.	2014-08-07
Microelectronic Package And Method Of Manufacture Thereof App 20140203440 - Zohni; Wael ; et al.	2014-07-24
Impedance controlled packages with metal sheet or 2-layer RDL Grant 8,786,083 - Haba , et al. July 22, 2	2014-07-22
Co-support system and microelectronic assembly Grant 8,787,034 - Crisp , et al. July 22, 2	2014-07-22
Reconfigurable pop Grant 8,786,069 - Haba , et al. July 22, 2	2014-07-22
Enhanced stacked microelectronic assemblies with central contacts Grant 8,787,032 - Haba , et al. July 22, 2	2014-07-22
Stub Minimization Using Duplicate Sets Of Signal Terminals App 20140185354 - Crisp; Richard Dewitt ; et al.	2014-07-03
Deskewed multi-die packages Grant 8,759,982 - Crisp , et al. June 24, 2	2014-06-24
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20140167278 - Crisp; Richard Dewitt ; et al.	2014-06-19
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20140167279 - Crisp; Richard Dewitt ; et al.	2014-06-19
Stacked Chip-on-board Module With Edge Connector App 20140131849 - Zohni; Wael ; et al.	2014-05-15
In-package fly-by signaling Grant 8,723,329 - Crisp , et al. May 13, 2	2014-05-13
Multiple Die In A Face Down Package App 20140117516 - Haba; Belgacem ; et al.	2014-05-01
Co-support Circuit Panel And Microelectronic Packages App 20140110832 - Crisp; Richard Dewitt ; et al.	2014-04-24
Stub Minimization For Assemblies Without Wirebonds To Package Substrate App 20140103535 - Crisp; Richard Dewitt ; et al.	2014-04-17
Stub minimization using duplicate sets of signal terminals Grant 8,670,261 - Crisp , et al. March 11, 2	2014-03-11
Co-support Component And Microelectronic Assembly App 20140055970 - Crisp; Richard Dewitt ; et al.	2014-02-27
Co-support System And Microelectronic Assembly App 20140055941 - Crisp; Richard Dewitt ; et al.	2014-02-27
Co-support Module And Microelectronic Assembly App 20140055942 - Crisp; Richard Dewitt ; et al.	2014-02-27
Stub minimization for wirebond assemblies without windows Grant 8,659,142 - Crisp , et al. February 25, 2	2014-02-25
Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Grant 8,659,140 - Crisp , et al. February 25, 2	2014-02-25
Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Grant 8,659,141 - Crisp , et al. February 25, 2	2014-02-25
Stub minimization for wirebond assemblies without windows Grant 8,659,143 - Crisp , et al. February 25, 2	2014-02-25
Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Grant 8,659,139 - Crisp , et al. February 25, 2	2014-02-25
Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Grant 8,653,646 - Crisp , et al. February 18, 2	2014-02-18
Flip-chip, Face-up And Face-down Wirebond Combination Package App 20140042644 - Haba; Belgacem ; et al.	2014-02-13
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Thermal Characteristics App 20140035121 - Haba; Belgacem ; et al.	2014-02-06
Microelectronic Packages Having Cavities For Receiving Microelectronic Elements App 20140021641 - Mohammed; Ilyas ; et al.	2014-01-23
Stacked chip-on-board module with edge connector Grant 8,633,576 - Zohni , et al. January 21, 2	2014-01-21
Stub minimization for assemblies without wirebonds to package substrate Grant 8,629,545 - Crisp , et al. January 14, 2	2014-01-14
Stub minimization for assemblies without wirebonds to package substrate Grant 8,610,260 - Crisp , et al. December 17, 2	2013-12-17
Deskewed Multi-die Packages App 20130307138 - Crisp; Richard Dewitt ; et al.	2013-11-21
Lead Structures With Vertical Offsets App 20130299958 - Crisp; Richard Dewitt ; et al.	2013-11-14
Stub Minimization Using Duplicate Sets Of Signal Terminals App 20130286707 - Crisp; Richard Dewitt ; et al.	2013-10-31
Multiple die in a face down package Grant 8,569,884 - Haba , et al. October 29, 2	2013-10-29
Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics Grant 8,553,420 - Haba , et al. October 8, 2	2013-10-08
Microelectronic packages having cavities for receiving microelectronic elements Grant 8,541,873 - Mohammed , et al. September 24, 2	2013-09-24
Stub minimization for assemblies without wirebonds to package substrate Grant 8,525,327 - Crisp , et al. September 3, 2	2013-09-03
Memory module in a package Grant 8,513,817 - Haba , et al. August 20, 2	2013-08-20
Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Grant 8,513,813 - Crisp , et al. August 20, 2	2013-08-20
De-skewed multi-die packages Grant 8,502,390 - Crisp , et al. August 6, 2	2013-08-06
Embedded Heat Spreader For Package With Multiple Microelectronic Elements And Face-down Connection App 20130168843 - Zohni; Wael	2013-07-04
Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution Grant 8,466,564 - Haba , et al. June 18, 2	2013-06-18
Multiple Die Face-down Stacking For Two Or More Die App 20130127062 - Haba; Belgacem ; et al.	2013-05-23
Stub minimization for multi-die wirebond assemblies with parallel windows Grant 8,441,111 - Crisp , et al. May 14, 2	2013-05-14
Stub minimization for multi-die wirebond assemblies with parallel windows Grant 8,436,457 - Crisp , et al. May 7, 2	2013-05-07
Flip-chip, face-up and face-down wirebond combination package Grant 8,436,458 - Haba , et al. May 7, 2	2013-05-07
Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Grant 8,436,477 - Crisp , et al. May 7, 2	2013-05-07
Multiple Die Stacking For Two Or More Die App 20130100616 - Zohni; Wael ; et al.	2013-04-25
Stub Minimization For Assemblies Without Wirebonds To Package Substrate App 20130082389 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Wirebond Assemblies Without Windows App 20130082391 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization With Terminal Grids Offset From Center Of Package App 20130083584 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Assemblies Without Wirebonds To Package Substrate App 20130082375 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20130082396 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Wirebond Assemblies Without Windows App 20130082397 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Wirebond Assemblies Without Windows App 20130082398 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20130082395 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20130082381 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20130082374 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate App 20130082380 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Multi-die Wirebond Assemblies With Parallel Windows App 20130082394 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows App 20130082390 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Assemblies Without Wirebonds To Package Substrate App 20130083582 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub Minimization For Multi-die Wirebond Assemblies With Parallel Windows App 20130083583 - Crisp; Richard Dewitt ; et al.	2013-04-04
Stub minimization for wirebond assemblies without windows Grant 8,405,207 - Crisp , et al. March 26, 2	2013-03-26
Flip-chip, Face-up And Face-down Wirebond Combination Package App 20130056870 - Haba; Belgacem ; et al.	2013-03-07
Through Interposer Wire Bond Using Low Cte Interposer With Coarse Slot Apertures App 20130049196 - McElrea; Simon ; et al.	2013-02-28
Multiple Die In A Face Down Package App 20130043582 - Haba; Belgacem ; et al.	2013-02-21
Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts Grant 8,378,478 - Desai , et al. February 19, 2	2013-02-19
De-skewed Multi-die Packages App 20130015586 - Crisp; Richard Dewitt ; et al.	2013-01-17
Memory Module In A Package App 20130015590 - Haba; Belgacem ; et al.	2013-01-17
Memory Module In A Package App 20130015591 - Haba; Belgacem ; et al.	2013-01-17
Stub minimization for multi-die wirebond assemblies with parallel windows Grant 8,345,441 - Crisp , et al. January 1, 2	2013-01-01
Multiple die face-down stacking for two or more die Grant 8,338,963 - Haba , et al. December 25, 2	2012-12-25
Impedence Controlled Packages With Metal Sheet Or 2-layer Rdl App 20120313228 - Haba; Belgacem ; et al.	2012-12-13
Flip Chip Assembly And Process With Sintering Material On Metal Bumps App 20120313239 - Zohni; Wael	2012-12-13
Flip-chip, face-up and face-down wirebond combination package Grant 8,304,881 - Haba , et al. November 6, 2	2012-11-06
Flip-chip, Face-up And Face-down Centerbond Memory Wirebond Assemblies App 20120267796 - Haba; Belgacem ; et al.	2012-10-25
Multiple Die Face-down Stacking For Two Or More Die App 20120267798 - Haba; Belgacem ; et al.	2012-10-25
Flip-chip, Face-up And Face-down Wirebond Combination Package App 20120267797 - Haba; Belgacem ; et al.	2012-10-25
Stacked Chip-on-board Module With Edge Connector App 20120267771 - Zohni; Wael ; et al.	2012-10-25
Stub minimization for multi-die wirebond assemblies with orthogonal windows Grant 8,278,764 - Crisp , et al. October 2, 2	2012-10-02
Stub minimization for multi-die wirebond assemblies with orthogonal windows Grant 8,254,155 - Crisp , et al. August 28, 2	2012-08-28
Metal can impedance control structure Grant 8,222,725 - Haba , et al. July 17, 2	2012-07-17
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Ground Or Power Distribution App 20120153435 - Haba; Belgacem ; et al.	2012-06-21
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Ground Or Power Distribution App 20120155042 - Haba; Belgacem ; et al.	2012-06-21
Enhanced Stacked Microelectronic Assemblies With Central Contacts App 20120155049 - Haba; Belgacem ; et al.	2012-06-21
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Vias Connected To The Central Contacts App 20120126389 - Desai; Kishor ; et al.	2012-05-24
Enhanced Stacked Microelectronic Assemblies With Central Contacts And Improved Thermal Characteristics App 20120092832 - Haba; Belgacem ; et al.	2012-04-19
Metal Can Impedance Control Structure App 20120068365 - Haba; Belgacem ; et al.	2012-03-22
Impedance Controlled Packages With Metal Sheet Or 2-layer Rdl App 20120068338 - Haba; Belgacem ; et al.	2012-03-22
Microelectronic Packages Having Cavities For Receiving Microelectronic Elements App 20110291297 - Mohammed; Ilyas ; et al.	2011-12-01
Microelectronic packages having cavities for receiving microelectric elements Grant 7,994,622 - Mohammed , et al. August 9, 2	2011-08-09
Microelectronic packages and methods therefor Grant 7,554,206 - Haba , et al. June 30, 2	2009-06-30
Semiconductor chip packages having cavities App 20080303132 - Mohammed; Ilyas ; et al.	2008-12-11
Microelectronic assembly having array including passive elements and interconnects Grant 7,335,995 - Pflughaupt , et al. February 26, 2	2008-02-26
Die protection process App 20070246820 - Zohni; Wael ; et al.	2007-10-25
Reworkable stacked chip assembly App 20070176297 - Zohni; Wael	2007-08-02
Microelectronic packages and methods therefor App 20070077677 - Haba; Belgacem ; et al.	2007-04-05
Microelectronic packages and methods therefor Grant 7,176,043 - Haba , et al. February 13, 2	2007-02-13
Stacked packages App 20060033216 - Pflughaupt; L. Elliott ; et al.	2006-02-16
Stacked packages Grant 6,977,440 - Pflughaupt , et al. December 20, 2	2005-12-20
Microelectronic packages and methods therefor App 20050181544 - Haba, Belgacem ; et al.	2005-08-18
Microelectronic assembly having array including passive elements and interconnects App 20050173796 - Pflughaupt, L. Elliott ; et al.	2005-08-11
Off-center solder ball attach assembly Grant 6,870,267 - Zohni March 22, 2	2005-03-22
Stacked packages App 20040031972 - Pflughaupt, L. Elliott ; et al.	2004-02-19
Off-center solder ball attach assembly App 20020117761 - Zohni, Wael	2002-08-29