Zheng; Tieyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zheng; Tieyu.The latest application filed is for "test, validation, and debug architecture".

Company Profile

2.24.26

Zheng; Tieyu - Sammamish WA US
Zheng; Tieyu - Redmond WA
Zheng; Tieyu - Chandler AZ
Zheng; Tieyu - Fremont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Test, validation, and debug architecture Grant 10,198,333 - Trobough , et al. Fe	2019-02-05
Integrated circuit package with spatially varied solder resist opening dimension Grant 9,312,237 - Zheng , et al. April 12, 2	2016-04-12
Test, Validation, And Debug Architecture App 20150127983 - Trobough; Mark B. ; et al.	2015-05-07
Integrated Circuit Package With Spatially Varied Solder Resist Opening Dimension App 20150108204 - Zheng; Tieyu ; et al.	2015-04-23
Integrated circuit package with spatially varied solder resist opening dimension Grant 8,952,532 - Zheng , et al. February 10, 2	2015-02-10
Integrated Circuit Package With Spatially Varied Solder Resist Opening Dimension App 20140332956 - ZHENG; Tieyu ; et al.	2014-11-13
Gapped Attachment Structures App 20140168909 - Zheng; Tieyu ; et al.	2014-06-19
Method of making a self-balanced dual L-shaped socket Grant 8,074,354 - Zheng December 13, 2	2011-12-13
Land grid array (LGA) socket with cells and method of fabrication and assembly Grant 7,695,288 - Ma , et al. April 13, 2	2010-04-13
Extended package substrate Grant 7,677,902 - Irvine , et al. March 16, 2	2010-03-16
Land grid array (LGA) socket with cells and method of fabrication and assembly App 20090325398 - Ma; Xiaoqing ; et al.	2009-12-31
Lateral force countering load mechanism for LGA sockets Grant 7,604,486 - Martinson , et al. October 20, 2	2009-10-20
Pick-and-place cap for socket assembly Grant 7,524,199 - Zheng , et al. April 28, 2	2009-04-28
Pick-and-place Cap For Socket Assembly App 20090088015 - Zheng; Tieyu ; et al.	2009-04-02
Socket for land grid array package Grant 7,497,696 - Martinson , et al. March 3, 2	2009-03-03
Socket assembly that includes improved contact arrangement Grant 7,479,015 - Ruttan , et al. January 20, 2	2009-01-20
Self-balanced Dual L-shaped Socket App 20080268670 - Zheng; Tieyu	2008-10-30
Socket for land grid array package App 20080242123 - Martinson; Robert ; et al.	2008-10-02
Socket assembly for securing socket body Grant 7,429,182 - Zheng , et al. September 30, 2	2008-09-30
Self-balanced dual L-shaped socket Grant 7,419,383 - Zheng September 2, 2	2008-09-02
Lateral Force Countering Load Mechanism For Lga Sockets App 20080151511 - Martinson; Robert R. ; et al.	2008-06-26
Extended Package Substrate App 20080055825 - Irvine; James A. ; et al.	2008-03-06
Socket Assembly That Includes Improved Contact Arrangement App 20080003843 - Ruttan; Thomas G. ; et al.	2008-01-03
Extended package substrate Grant 7,278,859 - Irvine , et al. October 9, 2	2007-10-09
Self-balanced land grid array socket Grant 7,261,572 - Zheng August 28, 2	2007-08-28
Package for housing an optoelectronic assembly Grant 7,255,496 - Narayan , et al. August 14, 2	2007-08-14
Low-profile package for housing an optoelectronic assembly Grant 7,255,494 - Zheng August 14, 2	2007-08-14
Stacked land grid array package Grant 7,227,248 - Zheng June 5, 2	2007-06-05
Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header Grant 7,223,629 - Zheng , et al. May 29, 2	2007-05-29
Self-balanced dual L-shaped socket App 20070082513 - Zheng; Tieyu	2007-04-12
Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header Grant 7,201,521 - Zheng April 10, 2	2007-04-10
Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header Grant 7,176,436 - Zheng , et al. February 13, 2	2007-02-13
Self-balanced land grid array socket App 20060094265 - Zheng; Tieyu	2006-05-04
Stacked land grid array package App 20060060950 - Zheng; Tieyu	2006-03-23
Stacked land grid array package Grant 6,992,373 - Zheng January 31, 2	2006-01-31
Stacked land grid array package App 20050253246 - Zheng, Tieyu	2005-11-17
Optoelectronic module with integrated cooler App 20050207458 - Zheng, Tieyu	2005-09-22
Package for housing an optoelectronic assembly App 20050141828 - Narayan, Raghuram ; et al.	2005-06-30
Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header App 20050127281 - Zheng, Tieyu ; et al.	2005-06-16
Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header App 20050129373 - Zheng, Tieyu	2005-06-16
Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header App 20050129372 - Zheng, Tieyu	2005-06-16
Method and apparatus for manufacturing a transistor -outline (TO) can having a ceramic header App 20050130342 - Zheng, Tieyu ; et al.	2005-06-16
Package for housing an optoelectronic assembly Grant 6,860,652 - Narayan , et al. March 1, 2	2005-03-01
Package for housing an optoelectronic assembly App 20040234213 - Narayan, Raghuram ; et al.	2004-11-25
Low-profile package for housing an optoelectronic assembly App 20040234214 - Zheng, Tieyu	2004-11-25

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