Zeng; Zhao-Chong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zeng; Zhao-Chong.The latest application filed is for "fabrication method of packaging substrate having embedded passive component".

Company Profile

0.17.21

Zeng; Zhao-Chong - Taoyuan TW
Zeng; Zhao-Chong - Taoyuan City TW
Zeng; Zhao-Chong - Hsin-Chu N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication method of packaging substrate having embedded passive component Grant 10,219,390 - Hsu , et al. Feb	2019-02-26
Method for fabricating packaging substrate with embedded semiconductor component Grant 9,295,159 - Zeng March 22, 2	2016-03-22
Fabrication Method Of Packaging Substrate Having Embedded Passive Component App 20160007483 - Hsu; Shih-Pin ; et al.	2016-01-07
Method of fabricating packaging substrate having a passive element embedded therein Grant 9,232,665 - Hsu , et al. January 5, 2	2016-01-05
Packaging substrate having embedded passive component and fabrication method thereof Grant 9,179,549 - Hsu , et al. November 3, 2	2015-11-03
Package structure having embedded electronic component Grant 9,129,870 - Zeng September 8, 2	2015-09-08
Method Of Fabricating Packaging Substrate Having A Passive Element Embedded Therein App 20140345126 - Hsu; Shih-Ping ; et al.	2014-11-27
Method Of Fabricating Packaging Substrate Having A Passive Element Embedded Therein App 20140345125 - Hsu; Shih-Ping ; et al.	2014-11-27
Packaging Substrate Having A Passive Element Embedded Therein App 20140345930 - Hsu; Shih-Ping ; et al.	2014-11-27
Package structure having embedded electronic component and fabrication method thereof Grant 8,884,429 - Zeng November 11, 2	2014-11-11
Package Structure Having Embedded Electronic Component App 20140306340 - Zeng; Zhao-Chong	2014-10-16
Packaging substrate having a passive element embedded therein and method of fabricating the same Grant 8,829,356 - Hsu , et al. September 9, 2	2014-09-09
Package Structure Having Embedded Electronic Element And Fabrication Method Thereof App 20130258623 - Zeng; Zhao-Chong	2013-10-03
Package structure Grant 8,421,213 - Hsu , et al. April 16, 2	2013-04-16
Method For Fabricating Packaging Substrate With Embedded Semiconductor Component App 20120302012 - Zeng; Zhao Chong	2012-11-29
Package Structure Having Embedded Electronic Component And Fabrication Method Thereof App 20120273941 - Zeng; Zhao-Chong	2012-11-01
Packaging substrate with embedded semiconductor component and method for fabricating the same Grant 8,242,383 - Zeng August 14, 2	2012-08-14
Package Structure Having Through-silicon-via (tsv) Chip Embedded Therein And Fabrication Method Thereof App 20120049366 - Zeng; Zhao-Chong	2012-03-01
Packaging Substrate Having A Passive Element Embedded Therein And Method Of Fabricating The Same App 20120037404 - Hsu; Shih- Ping ; et al.	2012-02-16
Packaging Substrate Having Embedded Passive Component And Fabrication Method Thereof App 20120037411 - Hsu; Shih-Ping ; et al.	2012-02-16
Circuit board structure Grant 7,948,085 - Shih , et al. May 24, 2	2011-05-24
Package Structure App 20110042800 - Hsu; Shin-Ping ; et al.	2011-02-24
Structure with semiconductor chips embeded therein Grant 7,763,969 - Zeng , et al. July 27, 2	2010-07-27
Packaging Substrate With Embedded Semiconductor Component And Method For Fabricating The Same App 20100053920 - Zeng; Zhao Chong	2010-03-04
Chip embedded package structure and fabrication method thereof Grant 7,554,131 - Zeng June 30, 2	2009-06-30
Circuit Board Structure And Fabrication Method Of The Same App 20080176035 - Shih; Chao-Wen ; et al.	2008-07-24
Carrier Board Structure Embedded with Semiconductor Component and Method for Fabricating the Carrier Board Structure App 20080048310 - Zeng; Zhao Chong	2008-02-28
Carrier Board Structure With Chip Embedded Therein And Method For Fabricating The Same App 20070241444 - HSU; Shih-Ping ; et al.	2007-10-18
Structure with semiconductor chips embeded therein and method of fabricating same App 20070145577 - Zeng; Zhao-Chong ; et al.	2007-06-28
Semiconductor device with electroless plating metal connecting layer and method for fabricating the same App 20070085205 - Chen; Shang-Wei ; et al.	2007-04-19
Wafer structure with electroless plating metal connecting layer and method for fabricating the same App 20070087547 - Chen; Shang Wei ; et al.	2007-04-19
Chip embedded package structure and fabrication method thereof App 20060220222 - Zeng; Zhao-Chong	2006-10-05

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