YUMI; Hideo
Patent Applications and Registrations
Patent applications and USPTO patent grants for YUMI; Hideo.The latest application filed is for "thermally conductive liquid pack".
- YUMI; Hideo - Kasugai-shi JP
- Yumi; Hideo - Aichi JP
- Yumi; Hideo - Kasugai JP
- Yumi; Hideo - Nagoya N/A JP
- Yumi; Hideo - Inazawa JP
- YUMI; Hideo - Inazawa-shi JP
- Yumi; Hideo - Nagoya-shi JP
- Yumi; Hideo - Aichi-ken JP
| Patent | Date |
|---|---|
| Thermally Conductive Liquid Pack App 20190003787 - TANAKA; Ken ; et al. | 2019-01-03 |
| Heat conduction member, production method for heat conduction member, and heat conduction structure Grant 10,132,575 - Mizuno , et al. November 20, 2 | 2018-11-20 |
| Conductive contact including an elastic contact piece with protruding portions Grant 10,014,610 - Kurita , et al. July 3, 2 | 2018-07-03 |
| Contact App 20170288329 - KURITA; Tomohisa ; et al. | 2017-10-05 |
| Heat Conduction Member, Production Method For Heat Conduction Member, And Heat Conduction Structure App 20170276442 - MIZUNO; Takashi ; et al. | 2017-09-28 |
| Contact member Grant 9,570,827 - Kurita , et al. February 14, 2 | 2017-02-14 |
| Electromagnetic shielding member and electromagnetic shielding structure Grant 9,510,452 - Yumi November 29, 2 | 2016-11-29 |
| Thermoelectric conversion element, manufacturing method for the thermoelectric conversion element, and thermoelectric conversion module Grant 9,455,389 - Kawaguchi , et al. September 27, 2 | 2016-09-27 |
| Contact Member App 20160126653 - KURITA; TOMOHISA ; et al. | 2016-05-05 |
| Surface mount clip Grant 9,167,698 - Konda , et al. October 20, 2 | 2015-10-20 |
| Electromagnetic Shielding Member And Electromagnetic Shielding Structure App 20150282394 - YUMI; HIDEO | 2015-10-01 |
| Screw Grant 8,974,165 - Yumi , et al. March 10, 2 | 2015-03-10 |
| Thermoelectric Conversion Module App 20140261605 - KITANO; HIROKI ; et al. | 2014-09-18 |
| Contact and bonding structure of the contact Grant 8,808,011 - Kitano , et al. August 19, 2 | 2014-08-19 |
| Screw App 20140133936 - YUMI; Hideo ; et al. | 2014-05-15 |
| Contact Grant 8,569,626 - Kurita , et al. October 29, 2 | 2013-10-29 |
| Contact And Bonding Structure Of The Contact App 20130264098 - Kitano; Hiroki ; et al. | 2013-10-10 |
| Surface Mount Clip App 20130206457 - Konda; Kenji ; et al. | 2013-08-15 |
| Conductive component Grant 8,475,180 - Yumi July 2, 2 | 2013-07-02 |
| Thermoelectric Conversion Element, Manufacturing Method For The Thermoelectric Conversion Element, And Thermoelectric Conversion Module App 20130125948 - KAWAGUCHI; Yasuhiro ; et al. | 2013-05-23 |
| Contact App 20120217050 - Kurita; Tomohisa ; et al. | 2012-08-30 |
| Conductive Component App 20110284263 - Yumi; Hideo | 2011-11-24 |
| Surface Mount Contact App 20100068901 - YUMI; Hideo | 2010-03-18 |
| Surface mount contact member Grant 7,503,774 - Yumi , et al. March 17, 2 | 2009-03-17 |
| Surface Mount Contact Member App 20090011662 - YUMI; Hideo ; et al. | 2009-01-08 |
| Grounding terminal and mounting structure of the same on a printed circuit board Grant 6,674,018 - Yumi January 6, 2 | 2004-01-06 |
| Grounding terminal and mounting structure of the same on a printed circuit board App 20020062989 - Yumi, Hideo | 2002-05-30 |
| Grounding terminal and mounting structure of the same on a printed circuit board App 20020053468 - Yumi, Hideo | 2002-05-09 |
| Conductive element and manufacturing method thereof App 20010027991 - Yumi, Hideo ; et al. | 2001-10-11 |
| Electromagnetic-shielding gasket Grant 5,142,101 - Matsuzaki , et al. August 25, 1 | 1992-08-25 |
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