Yue; Hongyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yue; Hongyu.The latest application filed is for "method and device for controlling pattern and structure formation by an electric field".

Company Profile

0.27.33

Yue; Hongyu - Plano TX US
YUE; Hongyu - Austin TX
Yue, Hongyu - Texas TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for integrating low-k dielectrics Grant 9,017,933 - Liu , et al. April 28, 2	2015-04-28
Method and device for controlling pattern and structure formation by an electric field Grant 8,916,055 - Brcka , et al. December 23, 2	2014-12-23
Dielectric treatment module using scanning IR radiation source Grant 8,895,942 - Liu , et al. November 25, 2	2014-11-25
Control of implant pattern critical dimensions using STI step height offset Grant 8,530,247 - Reid , et al. September 10, 2	2013-09-10
Method And Device For Controlling Pattern And Structure Formation By An Electric Field App 20130217210 - Brcka; Jozef ; et al.	2013-08-22
Annealing Method And Annealing Apparatus App 20120225568 - IZAWA; Yusaku ; et al.	2012-09-06
Ultraviolet treatment apparatus Grant 8,242,460 - Yue , et al. August 14, 2	2012-08-14
Method and apparatus for determining an etch property using an endpoint signal Grant 8,048,326 - Yue , et al. November 1, 2	2011-11-01
Method for integrating low-k dielectrics App 20110237080 - LIU; Junjun ; et al.	2011-09-29
Ultraviolet treatment apparatus App 20110233430 - YUE; Hongyu ; et al.	2011-09-29
Method for cleaning low-k dielectrics App 20110232677 - LIU; Junjun ; et al.	2011-09-29
Method of fault detection for material process system Grant 7,972,483 - Donohue , et al. July 5, 2	2011-07-05
Method and system for predicting process performance using material processing tool and sensor data Grant 7,844,559 - Lam , et al. November 30, 2	2010-11-30
Process system health index and method of using the same Grant 7,713,760 - Yue , et al. May 11, 2	2010-05-11
Dielectric Treatment Platform For Dielectric Film Deposition And Curing App 20100068897 - Liu; Junjun ; et al.	2010-03-18
Ir Laser Optics System For Dielectric Treatment Module App 20100067886 - Liu; Junjun ; et al.	2010-03-18
Dielectric Material Treatment System And Method Of Operating App 20100065758 - Liu; Junjun ; et al.	2010-03-18
Dielectric Treatment Module Using Scanning Ir Radiation Source App 20100065759 - Liu; Junjun ; et al.	2010-03-18
Method Of Double Patterning Using Sacrificial Structure App 20090311634 - Yue; Hongyu ; et al.	2009-12-17
Control Of Implant Critical Dimensions Using An Sti Step Height Based Dose Offset App 20090170222 - Reid; Brian Douglas ; et al.	2009-07-02
Method And System For Predicting Process Performance Using Material Processing Tool And Sensor Data App 20090099991 - LAM; Hieu A. ; et al.	2009-04-16
Supervisory Etch Cd Control App 20080248412 - Stuber; John Douglas ; et al.	2008-10-09
Method and apparatus for using a pressure control system to monitor a plasma processing system Grant 7,430,496 - Yue , et al. September 30, 2	2008-09-30
Method and apparatus for detecting endpoint Grant 7,297,560 - Yue November 20, 2	2007-11-20
Method and apparatus for endpoint detection using partial least squares Grant 7,297,287 - Fatke , et al. November 20, 2	2007-11-20
Method of controlling trimming of a gate electrode structure App 20070111338 - Yue; Hongyu ; et al.	2007-05-17
Method for automatic configuration of processing system Grant 7,213,478 - Harada , et al. May 8, 2	2007-05-08
Method and system of discriminating substrate type Grant 7,211,196 - Lam , et al. May 1, 2	2007-05-01
Controlling a material processing tool and performance data Grant 7,167,766 - Lam , et al. January 23, 2	2007-01-23
Method and system for run-to-run control Grant 7,127,358 - Yue , et al. October 24, 2	2006-10-24
Method and apparatus for determining an etch property using an endpoint signal App 20060048891 - Yue; Hongyu ; et al.	2006-03-09
Method and apparatus for detecting endpoint App 20060037938 - Yue; Hongyu	2006-02-23
Method and apparatus for using a pressure control system to monitor a plasma processing system App 20050283321 - Yue, Hongyu ; et al.	2005-12-22
Method and system for predicting process performance using material processing tool and sensor data App 20050252884 - Lam, Hieu A. ; et al.	2005-11-17
Controlling a material processing tool and performance data App 20050234574 - Lam, Hieu A. ; et al.	2005-10-20
Processing system and method for treating a substrate App 20050227494 - Higuchi, Fumihiko ; et al.	2005-10-13
Method and system for run-to-run control App 20050222781 - Yue, Hongyu ; et al.	2005-10-06
Method and system for adjusting a chemical oxide removal process using partial pressure App 20050218113 - Yue, Hongyu	2005-10-06
Method and system for performing a chemical oxide removal process App 20050218114 - Yue, Hongyu ; et al.	2005-10-06
Method of controlling trimming of a gate electrode structure App 20050221513 - Yue, Hongyu ; et al.	2005-10-06
System and method for etching a mask App 20050221619 - Yue, Hongyu ; et al.	2005-10-06
Method and system of discriminating substrate type App 20050211669 - Lam, Hieu A. ; et al.	2005-09-29
Method of fault detection for material process system App 20050115824 - Donohue, John ; et al.	2005-06-02
Method of detecting, identifying and correcting process performance App 20050118812 - Donohue, John ; et al.	2005-06-02
System and method for etching a mask Grant 6,893,975 - Yue , et al. May 17, 2	2005-05-17
Method of trimming a gate electrode structure Grant 6,852,584 - Chen , et al. February 8, 2	2005-02-08
Method and apparatus for endpoint detection using partial least squares App 20050016947 - Fatke, David ; et al.	2005-01-27
Method for automatic configuration of processing system App 20050015176 - Harada, Satoshi ; et al.	2005-01-20
Process system health index and method of using the same App 20040259276 - Yue, Hongyu ; et al.	2004-12-23
Method and system of determining chamber seasoning condition by optical emission Grant 6,825,920 - Lam , et al. November 30, 2	2004-11-30
Method and system of determining chamber seasoning condition by optical emission App 20040008336 - Lam, Hieu A. ; et al.	2004-01-15
Method of data compression using principal components analysis Grant 6,675,137 - Toprac , et al. January 6, 2	2004-01-06
Method of determining etch endpoint using principal components analysis of optical emission spectra Grant 6,582,618 - Toprac , et al. June 24, 2	2003-06-24
Determining endpoint in etching processes using real-time principal components analysis of optical emission spectra Grant 6,564,114 - Toprac , et al. May 13, 2	2003-05-13
Determining endpoint in etching processes using principal components analysis of optical emission spectra with thresholding Grant 6,238,937 - Toprac , et al. May 29, 2	2001-05-29

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