Yow; Kai Yun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yow; Kai Yun.The latest application filed is for "substrate interconnections for packaged semiconductor device".
- Yow; Kai Yun - Petaling Jaya MY
| Patent | Date |
|---|---|
| Substrate interconnections for packaged semiconductor device Grant 9,997,445 - Yow , et al. June 12, 2 | 2018-06-12 |
| Substrate Interconnections For Packaged Semiconductor Device App 20180114748 - Yow; Kai Yun ; et al. | 2018-04-26 |
| Universal BGA substrate Grant 9,698,093 - Foong , et al. July 4, 2 | 2017-07-04 |
| IC device having patterned, non-conductive substrate Grant 9,646,853 - Yow , et al. May 9, 2 | 2017-05-09 |
| Ic Device Having Patterned, Non-conductive Substrate App 20170110339 - YOW; KAI YUN ; et al. | 2017-04-20 |
| Universal Bga Substrate App 20170062320 - FOONG; CHEE SENG ; et al. | 2017-03-02 |
| Substrate for alternative semiconductor die configurations Grant 9,437,492 - Yow , et al. September 6, 2 | 2016-09-06 |
| Substrate For Alternative Semiconductor Die Configurations App 20160093533 - Yow; Kai Yun ; et al. | 2016-03-31 |
| Semiconductor package with stress relief and heat spreader Grant 9,196,576 - Yow , et al. November 24, 2 | 2015-11-24 |
| Semiconductor device with die attached heat spreader Grant 9,165,855 - Yow , et al. October 20, 2 | 2015-10-20 |
| Semiconductor Wafer Dicing Blade App 20150183131 - Foong; Chee Seng ; et al. | 2015-07-02 |
| Mold cap for semiconductor device Grant 9,030,000 - Eu , et al. May 12, 2 | 2015-05-12 |
| Semiconductor Package With Stress Relief And Heat Spreader App 20150084169 - Yow; Kai Yun ; et al. | 2015-03-26 |
| Pressure Sensor Device And Assembly Method App 20150054099 - Yow; Kai Yun ; et al. | 2015-02-26 |
| Pressure Sensor Having Down-set Flag App 20150014793 - Yow; Kai Yun ; et al. | 2015-01-15 |
| Mold Cap For Semiconductor Device App 20140367840 - Eu; Poh Leng ; et al. | 2014-12-18 |
| Lead Frame For Semiconductor Package With Enhanced Stress Relief App 20140264793 - Yow; Kai Yun ; et al. | 2014-09-18 |
| Lead frame for semiconductor package with enhanced stress relief Grant 8,836,091 - Yow , et al. September 16, 2 | 2014-09-16 |
| Semiconductor sensor device with over-molded lid Grant 8,643,169 - Yow , et al. February 4, 2 | 2014-02-04 |
| Method of assembling pressure sensor device Grant 8,501,517 - Yow , et al. August 6, 2 | 2013-08-06 |
| Semiconductor Sensor Device And Method Of Packaging Same App 20130113054 - Yow; Kai Yun ; et al. | 2013-05-09 |
| Lead frame for semiconductor package Grant 8,415,779 - Wong , et al. April 9, 2 | 2013-04-09 |
| Semiconductor Device With Exposed Pad App 20120074549 - YOW; Kai Yun ; et al. | 2012-03-29 |
| Self monitoring braking system for vehicles Grant 8,078,353 - Yow , et al. December 13, 2 | 2011-12-13 |
| Lead Frame For Semiconductor Package App 20110248390 - WONG; Tzu Ling ; et al. | 2011-10-13 |
| Semiconductor Device Package With Integrated Stand-off App 20110084375 - Eu; Poh Leng ; et al. | 2011-04-14 |
| Semiconductor Package With Pre-formed Ball Bonds App 20110068469 - Yow; Kai Yun ; et al. | 2011-03-24 |
| Self Monitoring Braking System For Vehicles App 20110066347 - YOW; Kai Yun ; et al. | 2011-03-17 |
| Semiconductor Device Package With Down-set Leads App 20110062569 - Yow; Kai Yun ; et al. | 2011-03-17 |
| Heat Spreader For Semiconductor Package App 20110012257 - EU; Poh Leng ; et al. | 2011-01-20 |
| Semiconductor substrate and method of connecting semiconductor die to substrate Grant 7,868,449 - Yow , et al. January 11, 2 | 2011-01-11 |
| Semiconductor Substrate And Method Of Connecting Semiconductor Die To Substrate App 20100295169 - YOW; Kai Yun ; et al. | 2010-11-25 |
| Integrated circuit die, integrated circuit package, and packaging method Grant 7,759,753 - Eu , et al. July 20, 2 | 2010-07-20 |
| Method Of Forming Ball Bond App 20100059883 - Yow; Kai Yun ; et al. | 2010-03-11 |
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